201122719 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種光學元件製造方法，尤其涉及一種晶圓 級（wafer 1 eve 1 )遮光元件陣列之製造方法。 【先前技術】 [0002] 隨著攝像技術之發展，鏡頭模組與各種便攜式電子裝置 如行動電話、攝像機、電腦等之結合，更是得到眾多消 費者之青睞。故，市場對小型化鏡頭模組之需求增加。 [0003] 目前小型化鏡頭模組多採用精密模具等製程製造出微型 光學元件，然後與矽晶圓製成之影像感測器電連接、封 裝，然後切割，得到相機模組。惟，隨著便攜式電子裝 置向著更加微小化發展，影像感測器與便攜式電子裝置 内之電容、電感等其他電子元器件之間之距離亦越來越 短，從而使得影像感測器工作過程中，其被電容、電感 等其他電子元器件工作時（即便攜式電子裝置接受或者 發射電子信號時）所產生之電磁波干擾之可能亦越來越 大，直接導致該相機模組之成像品質降低。 【發明内容】 [0004] 有鑒於此，有必要提供一種防電磁波干擾之遮光元件陣 列之製造方法。 [0005] 一種遮光元件陣列之製造方法，包括以下步驟： [0006] ( 1 )提供一塊透光平板； [0007] ( 2 )於該透光平板上設置遮光層； [0008] (3)於該遮光層上形成磁屏蔽層； 098144050 表單編號A0101 第4頁/共27頁 0982075391-0 201122719 [](4 )於該磁屏蔽層上塗敷光阻層，該光阻層包括複數間 隔分佈之中央區域及圍繞該複數中央區域之週邊區域.； [⑻10] (5)曝光、顯影，以去除該複數中央區域上之光阻； [〇〇11] (6)對該磁屏蔽層及遮光層進行蝕刻，以使與該複數中 央區域正對之透光平板暴露於外； [0012] (7)去除該週邊區域上之光阻，以形成一遮光元件陣列 〇201122719 VI. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing an optical component, and more particularly to a method of fabricating a wafer level (wafer 1 eve 1 ) light shielding element array. [Prior Art] [0002] With the development of camera technology, the combination of lens modules and various portable electronic devices such as mobile phones, video cameras, computers, etc., has been favored by many consumers. Therefore, the market demand for miniaturized lens modules has increased. [0003] At present, the miniaturized lens module uses a precision mold and the like to manufacture a micro optical component, and then electrically connects, encapsulates, and then cuts the image sensor made of the silicon wafer to obtain a camera module. However, as portable electronic devices are becoming more compact, the distance between the image sensor and other electronic components such as capacitors and inductors in the portable electronic device is also becoming shorter and shorter, thereby making the image sensor work. The electromagnetic wave interference generated by the operation of other electronic components such as capacitors and inductors (that is, when the portable electronic device receives or transmits an electronic signal) is also becoming more and more serious, which directly leads to a decrease in the imaging quality of the camera module. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a method of manufacturing an array of light-shielding elements that are resistant to electromagnetic interference. [0005] A method for manufacturing a light shielding element array, comprising the following steps: [0006] (1) providing a light transmissive plate; [2] providing a light shielding layer on the light transmissive plate; [0008] (3) A magnetic shielding layer is formed on the light shielding layer; 098144050 Form No. A0101 Page 4 / Total 27 pages 0982075391-0 201122719 [4] Applying a photoresist layer on the magnetic shielding layer, the photoresist layer includes a central portion of a plurality of spaced intervals a region and a peripheral region surrounding the plurality of central regions.; [(8)10] (5) exposing and developing to remove the photoresist on the central portion of the plurality; [〇〇11] (6) performing the magnetic shield layer and the light shielding layer Etching so that the transparent plate facing the plurality of central regions is exposed to the outside; [0012] (7) removing the photoresist on the peripheral region to form an array of light shielding elements
[0013] 與先前技術相比，根據本發明所提供之遮光元件陣列製 造方法所製得之遮光元件陣列不僅具有遮光功能且可以 防止外界電磁干擾，從而可以提高具有該遮光元件陣列 之鏡頭模組陣列之成像品質》 ., 【實施方式】 [0014] 請參閱圖1及圖2，其為本發明第一實摊》例所提供遮光元 件陣列100之示意圖。遮光元件陣列100包括透光平板1〇 及自透光平板10向外依次設置之濾光層20、遮光屏蔽層 30。遮光屏蔽層30%括自濾光層20向外依次設置<遮先 層301及磁屏蔽層303。遮光屏蔽層30具有複數間隔分# 之通光孔305。磁屏蔽層303包括自遮光層301依；：欠_ $ 之銅薄膜層3031及不銹鋼薄膜層3033。 [0015] [0016] 請參閱圖3，其為遮光元件陣列100之製造方法之後程圖 。該方法包括以下步驟： (1 )提供一塊透光平板； [0017] (2)於該透光平板上設置遮光層； 098144050 表單編號A0101 第5頁/共27頁 201122719 [0018] ( 3 )於該遮光層上形成磁屏蔽層； 於4磁屏蔽層上塗敷光阻層，該光阻層包括複數間 隔分佈之中央區域及該複數中央區域之週邊區域； [0020] (5)曝光、顯影，以去除該複數中央區域上之光阻； _1] (6。）對該磁屏蔽層及遮光層進行㈣，以使與該複數中 央區域正對之透光平板暴露於外； [0022] (7)去除該週邊區域上之光阻，以形成一遮光元件陣列 〇 . .... ... ：. ..:: 乂 [0023] 下面將對遮光元件陣列1〇〇之製造方法進行詳細說明。 [_]請參閱圖4 ’首先提供一塊透光平板1〇。該透光平板10具 有相對之第一表面101及第二表面102。本實施例中，透 光平板10由玻璃製成。當然，透光平板10亦可以由塑膠 .....： .· 等透光材料製成。 [0025] 請參閱圖5，於透光平板1〇之第一表面101上設置濾光層 20，以免影像感測器（圖未示）產生雜訊。濾光層20可 採用不同之設計以實現過濾不同波長之光線。本實施例 中，濾光層20為紅外截止濾光膜。當然，該濾光層20亦 可以為低通濾光膜、紫外截止濾光膜等其他類型遽光膜 或者紅外截止濾光片、紫外截止濾光片等其他類型之渡 光片。當然，亦可以將濾光層20設置於透光平板10之第 二表面102。當然，亦可以不設置濾光層20 ° [0026] 請參閱圖6，於濾光層20形成上遮光層3〇1。本實施例中 ，採用滅鑛之方法於it光層2G形錢光廣3G1 ’且遮光層 098144050 表單編號A0101 第6頁/共27頁 0982075391-0 201122719 [0027] Ο [0028] Ο [0029] =之材料鉻H亦可輯用蒸料其他鑛膜方法 成遮光層30卜當然，遮光層如之材料亦可以氮化 鈦荨其他可以吸收光線之材料。 閱圖7 ’於遮光層3Q1上形成磁屏蔽層如，從而 具有遮光層301及磁屏蔽層303之遮光屏蔽層30。磁屏蔽 ㈣3可以防止外界電磁波干擾影像感測^作。本實施 例令，採«鑛之方法於遮光層謝形成磁屏蔽層3〇3， 且磁屏蔽層303包括自遮光層3〇1依次向外形成之鋼薄膜 層3031及不錢鋼_膜層3Q33。不錄鋼薄膜層如μ不僅可 料蔽磁場，還可以防止銅薄膜層3〇31被氧化，從而提 高了磁屏蔽層303之屏蔽效能。當然，亦可以採用蒸鑛等 其他鑛臈方法來形成磁屏蔽層。當然，磁屏 之材料亦可料m賴軟磁合金或鐵銘合金 等其他可屏蔽磁場材料. 請參閱圖8及圖9 ’於磁屏蔽層_3(}3上塗敷光阻層4〇。光阻 層40包括複數間隔分佈之中央區域4〇1及圍繞複數中央區 域401之週邊區域402。本實施例中，採用旋轉塗布之方 式將光阻層40塗敷於磁屏蔽層303上，且光阻層4〇由負型 光阻構成。當然，光阻層40亦可以由正型光阻構成。 將塗敷有光阻層40之透光平板1〇放置於具有複數通光孔 501之光罩50下，以對週邊區域402上之光阻曝光，以形 成被曝光後之光阻403。優選地，為了使中央區域4〇 1上 之光阻更好地溶解於顯影液中，將有光阻4〇3之透光平板 10曝後烤。曝後烤亦可利用烤箱之熱空氣對流、紅外線 輻射或熱墊板之熱傳導來進行。本實施例中，採用熱墊 098144050 表單編號A0101 第7頁/共27頁 0982075391-0 201122719 板之熱傳導來進行，其中，烘烤溫度為70〜100攝氏度， 烘烤時間為4〜8分鐘。當然，亦可以採用鐳射直寫技術或 者電子束直寫技術等其他直寫技術對週邊區域4〇2上之光 阻進行曝光處理。 [0030]請參閱圖10，顯影，以去除複數中央區域401上之光阻， 從而留下週邊區域402上之光阻403作為後續蝕刻過程中 之保護層。優選地，為了使週邊區域4〇2上之光阻4〇3更 好之黏著於磁屏蔽層30 3、邊緣平坦、減少缺陷空隙、耐 腐蝕及將週邊區域402上之光阻4〇3中溶劑之含量降到最 低，將透光平板10硬烤。硬烤亦可利用烤箱之熱空氣對 Ο 流、紅外線輻射或熱墊板之熱傳導來進行。本實施例中 ，採用熱塾板之熱傳導來進行硬烤，其中，烘烤溫度為 70~200攝氏度’烘烤時間為15〜20分鐘。當然，上述過 程中，係係否需要曝後烤或硬烤應根據實際情況來確定 。如果需要曝後烤或硬烤，則烘續溫度及時間亦應根據 實際情況來確定。 [麵]請參閱圖11，將形成於透光平板10之磁屏蔽層303及遮光 U 層301進行蝕刻，以使與複數中央區域401正對之濾光層 20被暴露於外。即，對遮光屏蔽層30進行蝕刻，以使遮 光屏蔽層30具有複數與複數中央區域401 — 一正對之通光 孔305。 [0032] 去除週邊區域402上之光阻403，以形成遮光元件陣列 100 (參閱圖2)。當然，若製造遮光元件陣列1〇〇時，透 光平板10未設置濾光層20，或者濾光層20設置於透光平 板10之第二表面102，蝕刻後，與複數中央區域401正對 098144050 表單編號A0101 第8頁/共27頁 0982075391-0 201122719 [0033] [0034] Ο [0035] [0036]Ο [0037] 之透光平板10被暴露於外。 藉由遮光元件陣列100之製造方法獲得之遮光元件陣列 100不僅具有遮光、濾光功能且可以防止外界電磁干擾， 從而可以提高具有遮光元件陣列1〇〇之鏡頭模組陣列之成 像品質。 優選地，請參閲圖12,為了更好地將遮光元件陣列100與 鏡片陣列（圖未示）對位，以使複數通光孔305之中心轴 與鏡片陣列之複數鏡片之中心轴-Τ 一對準，本實施例中 ’磁屏蔽層303還設有兩個貫穿遮光屏蔽層30、濾光層20 及透光平板10之對位孔6〇。常然，對位孔60之個數亦可 以為三個、四個等更多個，可以根據需要來設計。 請參閱圖13，其為本發明第二實施例提供之鏡頭模組陣 列200。鏡頭模組陣列2〇〇包括一遮光元砵陣列3〇〇及一 與遮光元件陣列3 0 0疊合於一起之鏡片陣列4 〇 〇。 遮光元件陣列300與遮光元件陣列1〇〇之製作方法及結構 大體相同，不同之處於於：每兩個通光孔3〇5a之間均有 對位孔70。 ” 鏡片陣列400包括複數鏡片80及複數對位結構9〇。本實施 例中，複數對位結構9〇均為通孔，且每兩個鏡片8〇之間 均有對位結構90。當然，對位結構9G亦可以為凸起。 對位孔7G與對位結構9〇相配合，以使遮光元件陣列獅與 鏡片陣列4GG疊合時，複數通光孔3Q5a之中心軸與複數鏡 片80之中‘。轴重合’最後切割成複數鏡頭模組。 098144050 表單編號A0101 第9頁/共27頁 0982075391-0 [0038] 201122719 [0039] 當然，亦可以於遮光元件陣列300與鏡片陣列400之間設 一間隔片陣列（圖未示）。該間隔片陣列具有複數間隔 分佈之通孔，該複數通孔之中心轴與複數鏡片8 0之中心 轴及複數通光孔305a之中心轴--重合。 [0040] 當然，亦可以先將遮光元件陣列300與複數鏡片陣列疊合 於一起，然後與具有複數影像感測器之矽晶圓壓合封裝 ，最後切割成複數相機模組。 [0041] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0042] 圖1係本發明第一實施例提供之遮光元件陣列之立體示意 圖。 [0043] 圖2係圖1沿II-II線之剖視圖。 [0044] 圖3係圖2中之遮光元件陣列之製造方法之流程圖。 [0045] 圖4係提供之透光平板示意圖。 [0046] 圖5係於圖4中之透光平板上設置濾光層示意圖。 [0047] 圖6係於圖5中之濾光層上形成遮光層之示意圖。 [0048] 圖7係於圖6中之遮光層上形成磁屏蔽層之示意圖，該磁 屏蔽層包括自該遮光層依次向外設置之銅薄膜層及不銹 鋼薄膜層。 098144050 表單編號A0101 第10頁/共27頁 0982075391-0 201122719 [0049] 圖8係於圖7中之不銹鋼薄膜層上塗敷光阻層之示意圖， 該光阻層具有複數間隔分佈之中央區域及圍繞該複數中 央區域之週邊區域。 [0050] 圖9係對圖8中之週邊區域上之光阻進行曝光之示意圖。 [0051] 圖10係將顯影後之複數中央區域上之光阻去除之示意圖 [0052] 圖11係對圖10中之瓷屏蔽層及遮光層進行蝕刻，以使與 該複數中央區域正對之濾光層暴露於外之示意圖。[0013] Compared with the prior art, the shading element array prepared by the method for manufacturing the shading element array according to the present invention not only has a shading function but also can prevent external electromagnetic interference, thereby improving the lens module having the shading element array. [Image Processing Quality of Array], [Embodiment] [0014] Please refer to FIG. 1 and FIG. 2, which are schematic diagrams of a light shielding element array 100 according to a first embodiment of the present invention. The light-shielding element array 100 includes a light-transmitting flat plate 1 and a filter layer 20 and a light-shielding shielding layer 30 which are disposed outward from the light-transmitting flat plate 10 in this order. The light-shielding shielding layer 30% includes a <precuring layer 301 and a magnetic shielding layer 303 in order from the filter layer 20. The light shielding layer 30 has a light passing hole 305 of a plurality of intervals #. The magnetic shielding layer 303 includes a self-shielding layer 301; a copper thin film layer 3031 and a stainless steel thin film layer 3033. [0016] Please refer to FIG. 3, which is a back-end diagram of a manufacturing method of the light-shielding element array 100. The method comprises the following steps: (1) providing a light-transmissive plate; [0017] (2) providing a light-shielding layer on the light-transmissive plate; 098144050 Form No. A0101 Page 5 of 27 201122719 [0018] (3) Forming a magnetic shielding layer on the light shielding layer; coating a photoresist layer on the magnetic shielding layer, the photoresist layer including a central region of the plurality of spaced distributions and a peripheral region of the plurality of central regions; [0020] (5) exposure, development, To remove the photoresist on the central region of the complex number; _1] (6.) performing (4) on the magnetic shielding layer and the light shielding layer to expose the transparent flat plate facing the plurality of central regions to the outside; [0022] Removing the photoresist on the peripheral region to form an array of light-shielding elements .... . . . : . . . :: 乂 [0023] The manufacturing method of the light-shielding element array 1A will be described in detail below. . [_]Please refer to Figure 4' first to provide a light-transmissive plate 1〇. The light transmissive plate 10 has a first surface 101 and a second surface 102 opposite thereto. In this embodiment, the light transmitting plate 10 is made of glass. Of course, the light-transmitting plate 10 can also be made of a light-transmitting material such as plastic .....: . [0025] Referring to FIG. 5, a filter layer 20 is disposed on the first surface 101 of the transparent plate 1 to prevent noise from being generated by an image sensor (not shown). Filter layer 20 can be designed to achieve different wavelengths of light. In this embodiment, the filter layer 20 is an infrared cut filter film. Of course, the filter layer 20 can also be other types of light-emitting films such as a low-pass filter film and an ultraviolet cut filter film, or an infrared cut filter, an ultraviolet cut filter, and the like. Of course, the filter layer 20 can also be disposed on the second surface 102 of the light transmissive plate 10. Of course, the filter layer 20 may not be provided. [0026] Referring to FIG. 6, the upper light shielding layer 3〇1 is formed on the filter layer 20. In the present embodiment, the method of destroying the mine is used in the photo layer 2G-shaped money Guangguang 3G1 'and the light-shielding layer 098144050 Form No. A0101 Page 6 / 27 pages 0982075391-0 201122719 [0028] Ο [0029] = The material chromium H can also be used to form a light-shielding layer 30 by using other mineral film methods. Of course, the light-shielding layer can also be nitrided titanium nitride and other materials that can absorb light. Referring to Fig. 7', a magnetic shield layer such as a light shielding layer 301 and a light shielding layer 30 of the magnetic shield layer 303 is formed on the light shielding layer 3Q1. Magnetic shielding (4) 3 can prevent external electromagnetic waves from interfering with image sensing. In this embodiment, the method of mining is used to form a magnetic shielding layer 3〇3 in the light shielding layer, and the magnetic shielding layer 303 includes a steel thin film layer 3031 and a non-ferrous steel layer formed from the light shielding layer 3〇1. 3Q33. The unrecorded steel film layer such as μ not only shields the magnetic field, but also prevents the copper thin film layer 3〇31 from being oxidized, thereby improving the shielding effectiveness of the magnetic shield layer 303. Of course, it is also possible to form a magnetic shield layer by using other ore methods such as steaming. Of course, the material of the magnetic screen may also be other magnetic shielding materials such as soft magnetic alloy or iron alloy. Please refer to FIG. 8 and FIG. 9 'coating the photoresist layer 4 on the magnetic shielding layer _3 (}3. The resist layer 40 includes a plurality of spaced-apart central regions 〇1 and a peripheral region 402 surrounding the plurality of central regions 401. In this embodiment, the photoresist layer 40 is applied to the magnetic shield layer 303 by spin coating, and the light is applied. The resist layer 4 is composed of a negative photoresist. Of course, the photoresist layer 40 may also be composed of a positive photoresist. The light-transmissive flat plate 1 coated with the photoresist layer 40 is placed on the light having a plurality of light-passing holes 501. Under the cover 50, the photoresist on the peripheral region 402 is exposed to form the exposed photoresist 403. Preferably, in order to better dissolve the photoresist on the central region 4〇1 in the developer, there will be The light-transmissive plate 10 of the photoresist 4〇3 is baked after exposure. The post-exposure bake can also be carried out by using the hot air convection of the oven, infrared radiation or thermal conduction of the thermal pad. In this embodiment, the thermal pad 098144050 is used. Form No. A0101 7 pages/total 27 pages 0982075391-0 201122719 The heat conduction of the board is carried out, among them, The baking temperature is 70~100 degrees Celsius, and the baking time is 4~8 minutes. Of course, other direct writing techniques such as laser direct writing technology or electron beam direct writing technology can also be used to expose the photoresist on the peripheral area 4〇2. [0030] Referring to Figure 10, development is performed to remove the photoresist on the plurality of central regions 401, thereby leaving the photoresist 403 on the peripheral region 402 as a protective layer in the subsequent etching process. Preferably, in order to make the peripheral region 4 The photoresist 4〇3 on 〇2 is better adhered to the magnetic shield layer 30, the edge is flat, the defect void is reduced, the corrosion resistance is reduced, and the solvent content in the photoresist 4〇3 on the peripheral region 402 is minimized. The light-transmissive plate 10 is hard-baked. The hard-baked can also be performed by using the hot air of the oven for heat conduction of turbulent flow, infrared radiation or thermal pad. In this embodiment, the heat conduction of the hot plate is used for hard baking, wherein the baking is performed. The baking temperature is 70~200 degrees Celsius' baking time is 15~20 minutes. Of course, in the above process, whether the system needs to be grilled or hard baked after exposure should be determined according to the actual situation. If it needs to be baked or hard baked after exposure, then Drying temperature and time It should also be determined according to the actual situation. [Face] Referring to FIG. 11, the magnetic shielding layer 303 and the light shielding U layer 301 formed on the transparent plate 10 are etched so that the filter layer 20 facing the plurality of central regions 401 The light-shielding shield layer 30 is etched such that the light-shielding shield layer 30 has a plurality of central regions 401 - a pair of light-passing apertures 305. [0032] Removing the photoresist 403 on the peripheral region 402 To form the light-shielding element array 100 (see FIG. 2). Of course, when the light-shielding element array 1 is manufactured, the light-transmitting plate 10 is not provided with the filter layer 20, or the filter layer 20 is disposed on the second of the light-transmitting plate 10. Surface 102, after etching, is opposite to the complex central region 401. 098144050 Form No. A0101 Page 8/27 Page 0982075391-0 201122719 [0034] [0036] [0036] [0037] The transparent plate 10 of [0037] Being exposed to the outside. The light-shielding element array 100 obtained by the manufacturing method of the light-shielding element array 100 not only has a light-shielding and filtering function but also can prevent external electromagnetic interference, so that the image quality of the lens module array having the light-shielding element array 1〇〇 can be improved. Preferably, referring to FIG. 12, in order to better align the light-shielding element array 100 with the lens array (not shown), the central axis of the plurality of light-passing holes 305 and the central axis of the plurality of lenses of the lens array-Τ In one embodiment, the magnetic shield layer 303 is further provided with two alignment holes 6 through the light shielding layer 30, the filter layer 20 and the light transmitting plate 10. Of course, the number of alignment holes 60 can also be three, four, etc., and can be designed as needed. Please refer to FIG. 13, which is a lens module array 200 according to a second embodiment of the present invention. The lens module array 2 includes a light-shielding element array 3A and a lens array 4 叠 叠 laminated with the light-shielding element array 300. The light-shielding element array 300 and the light-shielding element array 1 are manufactured in substantially the same manner, and the difference is that there are alignment holes 70 between each of the two light-passing holes 3〇5a. The lens array 400 includes a plurality of lenses 80 and a plurality of alignment structures 9 〇. In this embodiment, the plurality of alignment structures 9 〇 are all through holes, and each of the two lenses 8 均有 has an alignment structure 90. Of course, The alignment structure 9G may also be a protrusion. The alignment hole 7G is matched with the alignment structure 9〇 such that when the light shielding element array lion and the lens array 4GG are overlapped, the central axis of the plurality of light transmission holes 3Q5a and the plurality of lenses 80 The 'axis coincidence' is finally cut into a plurality of lens modules. 098144050 Form No. A0101 Page 9 of 27 0982075391-0 [0038] 201122719 [0039] Of course, between the shading element array 300 and the lens array 400 An array of spacers (not shown) is disposed. The spacer array has a plurality of spaced-apart vias, and a central axis of the plurality of vias coincides with a central axis of the plurality of lenses 80 and a central axis of the plurality of light-passing holes 305a. [0040] Of course, the light-shielding element array 300 and the plurality of lens arrays may be first laminated together, and then packaged with a silicon wafer having a plurality of image sensors, and finally cut into a plurality of camera modules. [0041] In summary, this issue It has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Anyone who is familiar with the skill of the present invention can The equivalent modifications or variations of the spirit of the invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0042] FIG. 1 is a perspective view of an array of shading elements according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II-II of Fig. 1. Fig. 3 is a flow chart showing a method of manufacturing the light shielding element array of Fig. 2. [0045] Fig. 4 is a schematic view of a light transmissive plate provided. Figure 5 is a schematic view showing a filter layer disposed on the light-transmissive plate of Figure 4. Figure 6 is a schematic view showing the formation of a light-shielding layer on the filter layer of Figure 5. [0048] Figure 7 is in Figure 6. A schematic diagram of forming a magnetic shielding layer on the light shielding layer, the magnetic shielding layer comprising a copper thin film layer and a stainless steel thin film layer which are sequentially disposed outward from the light shielding layer. 098144050 Form No. A0101 Page 10 of 27 0982075391-0 201122719 [0049] Figure 8 is in Figure 7 A schematic diagram of coating a photoresist layer on a stainless steel film layer having a central region of a plurality of spaced-apart distributions and a peripheral region surrounding the plurality of central regions. [0050] FIG. 9 is a view of the photoresist on the peripheral region of FIG. [0051] FIG. 10 is a schematic view showing the removal of photoresist on a plurality of central regions after development. [0052] FIG. 11 is an etch of the porcelain shield layer and the light shielding layer of FIG. 10 to The area is facing the schematic view of the filter layer exposed to the outside.
[0053] 圖12係於圖2中之遮光片陣列形成對位孔之示意圖。 [0054] 圖1 3係本發明第二實施例提供之鏡頭模組陣列之示意圖 【主要元件符號說明】 [0055] 遮光元件陣列：100、300 [0056] 透光平板：10 [0057] 濾光層：20 [0058] 遮光屏蔽層：30 [0059] 遮光層：301 [0060] 磁屏蔽層：303 [0061] 通光孔：305、305a、501 [0062] 銅薄膜層：3031 [0063] 不銹鋼薄膜層：3033[0053] FIG. 12 is a schematic view showing the formation of alignment holes by the array of the light shielding sheets of FIG. 2. 1 is a schematic diagram of a lens module array according to a second embodiment of the present invention. [Main component symbol description] [0055] Light-shielding element array: 100, 300 [0056] Light-transmitting plate: 10 [0057] Filtering Layer: 20 [0058] Light-shielding shielding layer: 30 [0059] Light-shielding layer: 301 [0060] Magnetic shielding layer: 303 [0061] Light-passing aperture: 305, 305a, 501 [0062] Copper film layer: 3031 [0063] Stainless steel Film layer: 3033
:::?：^C.^p€^rΊrV 表單編號A0101 第11頁/共27頁 098144050 0982075391-0 201122719 [0064] 第一表面：1 01 [0065] 第二表面：102 [0066] 光阻層：40 [0067] 中央區域：401 [0068] 週邊區域：402 [0069] 光罩：50 [0070] 光阻：40 3 [0071] 鏡頭模組陣列：200 [0072] 對位孔：60、70 [0073] 鏡片陣列：400 [0074] 鏡片：80 [0075] 對位結構：90 098144050 表單編號A0101 第12頁/共27頁 0982075391-0:::?:^C.^p€^rΊrV Form No. A0101 Page 11 of 27 098144050 0982075391-0 201122719 [0064] First surface: 1 01 [0065] Second surface: 102 [0066] Photoresist Layer: 40 [0067] Central area: 401 [0068] Peripheral area: 402 [0069] Mask: 50 [0070] Photoresist: 40 3 [0071] Lens module array: 200 [0072] Registration hole: 60, 70 [0073] Lens Array: 400 [0074] Lens: 80 [0075] Alignment Structure: 90 098144050 Form No. A0101 Page 12/Total 27 Page 0982075391-0