201121758 υ^υυδ-ι v^-CIP 33198-OP-twf.doc/j 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種包含嵌入於其表面的功能性元件 之物體、其製造方法、轉印製程及經此轉印製程加工的物 .體。 【先前技術】 目前，針對於一種具有功能性元件之物體，該物體與 功能性元件係分開製造且二個構件係接著為組裝在一起。 該種物體之組件係通常需要機械整合或疊合’且因此其為 逐批而實施。換言之，該種物體係無法為由一種連續方法 所製造。此外，機械整合或疊合方法係典型造成於物體與 -功能性7L件之間的大間隙、以及於物體之總厚度或體積的 增大。結果，目前的方法係不僅為耗時且亦為勞力密集。 此外，為了符合期望規格，諸如：風格、小巧性、耐久性、 手持式裝置為重要之其他特徵，目前的方法係可能 為極南成本。 _ 程是將承載層上的圖文利用壓力轉移至所欲 至物體上的圖文，傳統的作法是於 =形成-保護膜。然而’喷塗作業不僅會=成= 、巧木，且浪費大量的食塗材料，增加 。由 於傳統轉印製程具有上述缺 ^所而成本由201121758 υ^υυδ-ι v^-CIP 33198-OP-twf.doc/j VI. Description of the Invention: [Technical Field] The present invention relates to an object comprising a functional element embedded in a surface thereof, and a manufacturing thereof The method, the transfer process, and the object processed by the transfer process. [Prior Art] Currently, for an object having a functional element, the object is manufactured separately from the functional element and the two members are then assembled. The components of such objects typically require mechanical integration or stacking' and thus are implemented batch by batch. In other words, the system cannot be made by a continuous process. In addition, mechanical integration or lamination methods typically result in large gaps between the object and the functional 7L piece, as well as an increase in the total thickness or volume of the object. As a result, current methods are not only time consuming but also labor intensive. In addition, current methods may be extremely costly in order to meet desired specifications such as style, compactness, durability, and other features that are important for handheld devices. The process is to transfer the image on the carrier layer to the desired image on the object. The traditional method is to form a protective film. However, the spraying operation will not only be ===, Qiaomu, but also waste a lot of food coating materials, increase. Since the conventional transfer process has the above disadvantages, the cost is
Decoration IMDmm 失模内裝飾技術(In_M〇ld ，丄MD)遂成為形成物體表面的 擇技術。對於且有非单士曰本^ A衣囟的圖文的另一種選 “有非千坦表面的物體而言，紐甩傳統的 201121758 uyuU8-TW-CIP 33198-OP-twf.doc/j 模内轉印技術，在物體的大彎角處容易 裂、轉印膜產生皺褶轉印膜與物體卩，圖文龜 題。此外，傳統的模_印技術例如在乳泡等問 .法、壓縮成型法、吹喷成型型' 熱壓成f 方式將塑膠材質的物體與轉印膜結合。、—带播壓成型等 壓的製程條件下進行，可能會造成 t在高溫及高 性元件受損或影響其可靠度。置於轉印膜内的功能 【發明内容】 本發明之第一個觀點係針對—種I成 面的至少-個功能性元件之物體。該‘二=項表 物體之上的-裝飾性設計(例如：文 傻:有出現於 或二者。 八于4圖像）、顯示面板、 或箱本發明之第二個觀點係針對一種模内(in,ld)轉移膜 本發明之第三個娜係騎—種_插人膜或箱。 本發明之第四個觀點係針對用於製 個觀點的物體之方法。 ^ 當-功能性元件雜人於-物體之表m人 係產生極具吸引力的外觀。功能性元件係可順;於物體: =/卩使該表面為彎曲。結果，魏性元聽可顯現為 該物體之一整體部分V、 本發明還提出一種轉㈣程，包括：放置-物體於一 製程平台上；放置-轉印膜於物體上；以一工具加熱加壓 於轉印膜’使得轉印膜受工具加熱加壓的部份貼附於物 201121758 uyuu»-iW-CIP 33198-OP-twf.doc/j 體，將轉印膜與物體放置於一反應室；以及抽氣以使反應 至呈真空狀態，並使轉印膜未受工具加熱加壓的部份貼附 於物體。Decoration IMDmm In-Module Interior Technology (In_M〇ld, 丄MD) is the technology of choice for forming the surface of an object. For the other kind of image that has a non-single 曰 ^ ^ A 囟 “ “ 有 有 有 有 有 有 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 The internal transfer technology is easy to crack at the large corners of the object, and the transfer film produces a wrinkle transfer film and an object 卩, and a graphic turtle. In addition, the conventional die-printing technique is, for example, in the case of a milk bubble. Compression molding method, blow molding type 'hot pressing into f method to combine the plastic material with the transfer film. - With the process of pressure molding under pressure, it may cause high temperature and high component Loss or influence its reliability. Function of being placed in a transfer film [Summary of the Invention] The first aspect of the present invention is directed to an object of at least one functional element that is I-faced. Above - decorative design (eg: silly: there are either or both. eight to 4 images), display panel, or box The second aspect of the invention is directed to an in-mold (in, ld) transfer Membrane The third aspect of the present invention is a seed or a box. The fourth aspect of the present invention is directed to a system. The method of the object of opinion. ^ When - the functional component is in the surface of the object, the m-person system produces an attractive appearance. The functional component is compliant; the object: = / 卩 makes the surface curved. The Wei character can be seen as an integral part of the object V. The invention also proposes a turn (four) process, comprising: placing the object on a processing platform; placing the transfer film on the object; heating and pressing with a tool The transfer film 'make the portion of the transfer film heated and pressurized by the tool attached to the object 201121758 uyuu»-iW-CIP 33198-OP-twf.doc/j body, and place the transfer film and the object in a reaction chamber; And evacuating to bring the reaction to a vacuum state, and attaching the portion of the transfer film that is not heated and pressurized by the tool to the object.
在本發明的轉印製程的一實施例中，轉印膜包括一暫 時承載層、一釋放層、一功能性元件以及一接著層。釋放 層配置於暫時承載層上。功能性元件配置於釋放層上。接 者層配置於釋放層上。轉印膜被放置於物體上時，功能性 疋件及接著層位於物體與暫時承載層之間。此外，轉印膜 可更包括一财久層。耐久層配置於釋放層上，而功能性元 件及接著層配置於耐久層上。另外，在使轉印膜未受工具 加聲加壓的部份貼附於物體後，轉印製程可更包括將暫時 承載層與職層雜’並詞久層、功能性元件與接著層 保留於物體上。轉顿可更包括-油墨層，油墨配置於釋 放層並覆蓋功祕元件，而接著層置於油墨層上。 在本^明的轉印製程的一實施例中，在放置轉印膜於 體上，前，轉印製程更包括放置一功能性元件於物體 。功旎性元件位於轉印膜與物體之間。 在本發明的轉印製程的一實施例中，功能性元件為一 猶體電路。 本發明的轉印製程的一實施例中，以工具加熱加壓 ;P膜的步驟是以一滾輪定向滚壓並加熱轉印膜。 於轉卩製㈣—實關H具加熱加壓 、的步驟疋於80°C至250°C進行。 在本發明的轉印製程的一實施例中，抽氣以使反應室 201121758 09008-TW-CIP 33198-OP-tvvf.^ 呈真空狀態時，反應线溫度為赃至3⑻。C。 在本發明的轉印製程的一實施例中，.製程平台具有一 用以在放置轉印膜於物體上之後，將轉印^固定於 物體上。 ，本發明的轉印製㈣一實施例中，轉印膜受工具加 ‘，、、加壓的部份S貼附於物體的一平坦表面，而轉印膜未受 工具加熱加壓的部份貼附於物體的一非平坦表面。平坦表 面與非平坦表面的連接處的夾角介於1〇度至卯度。 在本發明的轉印製程的一實施例中，製程平=具有一 真空管道’域以使反應室呈真空狀態的步驟是^真空 管道進行抽氣。 本發明還提出一種物體，經過前述轉印製程加工。此 外’此物體與轉印膜接觸的部分的材質例如是選自於聚碳 酸醋、聚丙烯、塵克力、苯乙烯曱基丙烯酸 綮物 丙烯晴丁二•苯乙稀 '聚苯乙稀、聚對笨:;曰酸3醇 酯、聚縮荃或這些材質的組合。 由本發明所產生的物體係具有廣泛種類的應用。舉例 而言，此物體可為觸碰式或按壓式面板、濾色片、背光板、. 哨叭、麥克風、時鐘、手錶、收音機面板、行動電話、數 位相機殼體、個人資料助理殼體、筆記型電腦殼體、桌上 型電腦殼體、.觸碰式面板殼體、電視殼體、全球定位系統 殼體、車用顯示。器殼體、航空用顯示器殼體、數位相框殼. 體、DVD播放‘殼體、化妝盒、.玩具、汽車儀表板、收^ 機殼體、信用卡或智慧卡與其他的電子裝置殼體。此列出 201121758 υνυυβ-1 \V-CIP 33198-OP-twf.doc/j 者明顯非毫無遺漏。其他的應用係胁以下的說明而將為 熟悉此技藝人顿明自，且因此其為·蓋於本發明之範 鳴内。 【實施方式】 於此申請案所提及的術語“功能性元件，，係廣義包 括能夠實行-魏之任何錢或機械元件。該等功能性元 件之實例係可包括（而不受，）：絲構件、絲裝置、 波導、電子設計(諸如：導紐解導·的魏）、電子 構件(諸如：積體電路、印刷電路、電晶體、二極體、電阻 器、電感器、電容H、天線、咖）收發器、電池、太陽 能電池、發光二極體(LED)、與不限於⑽之其他二極體、 有機發光三極體(OLED))、顯示構件、#光構件、制π八、 麥克風、按钮、觸碰式面板、觸碰式塾、連接器與類似者。 於本發月之If况，術語“嵌入(embedded)於頂表面” 係意圖指iii :當物體正麵成時而非在物體形成之後，功 能性元件係整合至物體之頂表面；功祕元件係非安裝於 物體之内。 第1圖係顯示一種包含嵌入於其表面的-功能性元件 (11)之物體⑽。如圖所示’該物體係可自功能性元件側而 觀看。或者是，該物體係可自相反侧喊看，且於該種 形，功能性元件係將對於觀看者而言為不可見。 亦可能存在出現於物體之上的一裝飾性元件（12)、一 顯示元件(未顯示）、或二者。 存在多種不同方法可運用以篏入一功能性元件於一 201121758 WWS-l W-C1P 33198-OP-twf.doc/j 物體之表面。二個實例係提供於後。雖然係運用術語 内，瞭解的是：本發明係可延伸至下列的方法，諸： 印、疊合、加熱成形、注入模製、壓縮模製、吹 或是壓印或疊合與模製方法之一組合。 、、表、 (I)模内韓移膜戒箔 於-個方式，-種包含一功能性元件之模移或 箔係首先.備製。 勝4 第2a圖係該種模内轉移膜或箔(2〇)的橫截面圖 轉移膜或箔(20)係包含一承載層(21)、一釋放層(22)、一'乃 用式耐久層(23)、一功能性元件(24)、與一黏著或繫緊被= 釋放層(22)、耐久層(23)(若存在）、與黏著層(2 序披覆或疊合於承載層(21)，且此等不同層係為了容易依 明而於此申請案集體稱作“模内轉移膜或箔”。各說 當並無耐久層存在，功能性元件(24)係存在於釋 (22)與黏著層(25)之間。此係可藉由在諸層依序坡覆以带層 一模内轉移膜或箔之前而施加讀功能性元件至釋敎居成 黏著層所達成。 《或至 當一耐久層存在，功能性元件係可施加至一耐 覆膜。功能性元件係可存在於釋放層與耐久層之間 θ坡 耐久層與黏著層之間。：疋於 替代而言，係可運用具有夾設於二個黏著層之間的— 功能性元件之一種複合膜，以疊合於釋放層或一耐久、釋— 披覆膜。係需要該二個黏著層，此因二個無著層之—玫 ' —者係 201121758 ^UU5-IV^-CIP 33198-0P-twf.d〇c/j ί = Ϊ合膜與釋放層或敵釋放膜之間的黏著性，而另 於複合膜與注入模製樹脂之間的黏著性。後者 際為於第2a圖之黏著層(25)。如所描述的複合膜 實際作為杈内轉移膜或箔之一支撐層。 功月b 14元件至釋放、耐久_釋放膜、黏著或繫緊披覆層 =加係、可藉由諸如印刷、披覆、濺鑛、蒸氣沉積、喷麗、 電鍍:黏貼、钱刻、疊合或類似者之方法而達成，亦可藉 屬由此等方法之任-者的組合而達成。於—個實施例，功能 !·生元件係可先形成且接著轉移至該層。於另一個實施例， 功能性元件係可直接形成至該層。但是於任一情形，物體 之表面的平坦度與平滑度係不應歸因於功能性元件之存在 而受到影響。 於模内轉移方法，模内轉移膜或箔係饋送至一模具， 而使承載層（21)接觸於模具表面，如於第3a圖所示。承載 層(21)通常為具有厚度自約3·5微米至約2〇〇微米之薄的塑 膠膜。聚對苯二曱酸乙醋(PET，P〇lyethylene terephthalate)、 聚萘二曱酸乙酯(PEN，p〇1yethylene⑽沖仇也⑹與聚碳酸 酯(PC，P〇iycarb〇nate)膜因.為其低成本、高透明度^熱機械 穩定度而為較佳。 釋放層(22)係允許功能性元件(24)以對於功能性元件 的損壞為最小之方式而釋放自該承載層，且能於模製期間 採一完全自動捲轉移過程。 曰 釋放展通常備製自諸如蠟、石蠟或聚矽氧之一材料 一低表面張力覆層、或是備製自諸如輻射可固化的多官能 201121758 υ^υυο-1 \V-CIP 33198-OP-twf.doc/j 基丙烯酸酯、聚矽氧丙烯酸酯、環氧化物、乙烯基酯、烯 丙基與乙稀化物、不飽和的聚醋或其混合物的一材料做的 高度平滑不滲透的覆層。釋放層係可包含選自環氧化物、 聚胺酯、聚醯亞胺、聚醯胺、三聚氰胺甲醛、脲甲醛、與 酚甲醛所組成的群組之一種縮合聚合物、共聚合物、混合 物或複合物。 另一種適合的釋放層組成物係揭示於美國事利公開 案第2005-0255314號，其内容係以參照方式而整體納入於 本文。簡言之，該種釋放層係包含一共聚合物或穿插網路 (IPN，interpenetration network)，其由包含一胺醛縮合物與 一自由基抑制物或猝媳物(quencher)之一組成物所形成。 耐久層（23)(若存在）係作為對於功能性元件(24)之一 保護層。適用於耐久層之原料係可包括而.不限於：輻射可 固化的多官能基丙烯酸酯，其包括環氧丙烯酸酯、聚胺酯 丙稀酸自B、聚酯丙烯酸酯、聚石夕氧丙蛛酸酯、縮水甘油基 丙烯酸酯，環氧化物；乙烯基酯；二烯丙基鄰苯二曱酸； 乙稀醚；及其齡物。耐久層係可包含―縮合聚合物或共 聚合，諸如：環氧化物、聚胺醋、聚酿胺、聚酿亞胺、 三聚氰胺甲IT、脲甲搭、或盼甲搭。耐久層係可包含一漆 膠·凝膠(sol-gel)石夕酸鹽或鈦醋。 财久層係可部分或完全固化。若為部分固化，一個後 固化步驟係將運用在模製及/或轉移步驟之後，以增強财久 性，特別是：硬度、抗刮力與抗油牲。 9 欲改良釋放性質’補(_是耐久層之低分子量成分) 201121758 uyuus-1W-CIP 33198-OP-twf.doc/j f圭滲透至釋放層。在披覆及固化或部分固化耐久 層之後’麵輕強相容或不姆於騎層。黏合劑及諸 如增稍^表面活化劑、分散劑、uv安^劑或抗氧化劑 之添加物係可運用，以控制流變性m披覆㈣ 風化性能、與老化性質。諸如氧化發、Al2〇3、呢、cac〇3、 微晶體躐或聚⑽、Teflon或其侧難子之填充劑亦可 添加，以改良例如該耐久層之抗刮力與硬度。耐久層之厚 度通常為約2微米至約2G微米，且較佳為約3微^至約 12微米。耐久層（若存在)較佳於一窗區域為透明。 除了上述的㈣之外’針對於細柄久層之其他適 合的組成物係揭示於美國專利公開案第2〇〇5_〇1812〇4、 2005-0Π1292與2006-0093813號，其内容係以參照方式而 整體納入於本文。舉例而言，美國專利公開案第 2005-0181204號係揭示一種耐久層組成物，其包含：一可 熱交聯及光化學或可接自由基的聚合物、一熱交聯劑及一 輻射可固化的多官能基單體或低聚物；美國專利公開案第 2005- 0171292號係揭示一種耐久層組成物，其包含：具有 用於熱交聯的至少一個羰酸或酸酐官能基與至少一個uv 交聯官能基之一聚合物或共聚合物；且美國專利公開案第 2006- 0093813號係揭示一種耐久層組成物，其包含：一胺 .基交聯劑、具有反應+於胺基交聯劑的至少一個官能基之一 可UV固化單體或低聚物、一酸催化劑、及一光引發劑。 黏著層（25)係納入至該模内轉移膜或箔以提供功能性 元件(24)至模製物體表面之最佳化的黏著性。黏著層係可 201121758 ν/^υυ〇-ι iV-CIP 33198-OP-twf.doc/j 由諸如聚丙烯酸酯、.聚甲基丙烯酸酯、聚苯乙烯、聚碳免 酯、聚胺酯、聚酯、聚醯胺、環氧樹脂、乙烯乙酸乙 共聚合物(EVA，ethylene vinyl acetate)、熱塑性彈性體或曰 似者、或是其共聚合物、混合物或複合物之一材料所形£_ 諸如聚胺酯與聚醯胺之熱熔合或熱活化的黏著劑係特別。 佳。除了以上指出的材料之外，適用於黏著層之一種組= 物係揭示於美國專利公開案第2〇〇6_〇〇19〇88號其内容係 以參照方式而整體納入於本文。簡言之，黏著層組成ς係 可包含一黏著性的黏合劑與一聚合微粒材料。 黏著層之厚度係可為於約]微米至約2().微米之範 圍，較佳為於約2微米至約6微米之範圍。 (II)模内插入腹或$ * J 係’模内插人膜或荡的示意橫截面圖。於 :载層(21a)將在壓印、疊合或一模製方法之後而 料。魏性元件(24)係可藉著選用式的 H曰(未，㈣而施加至承载層(2U)，且於功能性元件之 承合或熱活化的黏著劑(25)所覆蓋。施加至 身而黏著至承载膜。f『由其本 入膜片之(=)=膜=落或段落(π)之模内插 OimA^Mji )之喊或為-捲_)之形式。 12 201121758 uyuu»-i W-CIP 33198-OP-twf.doc/j —種典賴_轉移方法係朗於第3a圖 =法’模内轉移膜或純於連續饋送至—模製機器之= 或網(web)上。模具(30)可為祕物體⑽)之—種 縮模具。於模製朗，模具係閉合且詩形成 $ 的^猶過注人喷嘴與流·注人域㈣部(36a)= 模製之後’功祕元件與敎層(若存在)储移於模 =之上。模製的物體係移除自該模具。承載層(3D盥S 放層(32)係同時移除，留下耐久層(33)(若存在)於物體 _ =最頂層’且功能性科⑽嵌人其下面 體^ 整體部分。層（35)係、-黏著f ^ t耐久層係不存在’功能性元件將為暴露且盆可為直 接連接至-電源或其他的電子構件。料久層係存在，於 耐久層之上可能具有孔’功能性元件係透過諸孔而可接線 至一電源或其他的電子構件。 _於轉移膜或_之群至模具，娜或網可事先印 • 記號且連續饋送至模具，及藉由例如—光學感測器 =如第3b圖所示之—種模内插人方法—模内插入 膜或落首先切割為-適當的尺寸與形狀且接著插入至一模 具(30)。模内插入膜或箱係如圖所示為置放於模具壁部， 可選用於真空下。膜或箱係可為手動置放且可運用靜電以 利於其插入’或是插入係可機械化。機械化的插入係特別 有利於大量生產。 插入膜或箔之承载層（31a)係接觸於該模具之内壁表 13 201121758 WW6-1 ^-CIP 33 J 98-OP-twf.doc/j 面。模具係摻著閉合，且用於形成物體(36b)之熔化的塑膠 係透過注入喷嘴與流道而注入至模具腔部(36a)。於此情形 之承載層(3la)可成為完成產品之整體部分。選用而言，插 入膜或箱係可在插入至模具之前而加熱形成某個形狀及以 模具切割(die cut)。 適用於形成物體於壓印、疊合或模製方法之塑膠材料 的實例可包括而不限於：熱塑性材料，諸如聚苯乙稀、聚 氯乙烯、丙烯酸、聚颯、聚芳基酯、聚丙烯氧化物、聚埽 烴、丙烯腈-丁二烯-苯乙烯共聚合物（ABS， acrylonitrile-butadiene-styrene)、甲基丙烯酸g旨-丙烯腈 丁 二稀-苯乙稀共聚合物（MABS， methacrylate-acrylonitrile-butadiene-styrene)、聚碳酸醋、聚 對苯二甲酶丁酯(PBT, polybutylene terephthalate)、聚對苯 二.曱酸乙酯(PET)、聚胺酯、與其他的熱塑性彈性體或其混 合物；及熱固性材料，諸如反應注入模製等級的聚胺酯、 環氧樹脂、减和聚醋、乙烯基醋、.或其複合物、預浸物 (prepreg)、與混合物。. .運用於該二種型式的製造方法之任―者的模具係必 須設計可使功能性元件插入或轉移。閘位置係必須允許功 能性το件上壓於模具腔部以確保適當的熱轉移。再者， 具係必須设计以使得模製後之功能性元件可容易連接至一 .電源。此外’模級量與賴分析係應在模歸料切 前而實行。—模具冷卻分析亦騎慮，以使得於模呈i中 的熱點為最少。最後，模具溫度龍力設定係必須考量該 201121758 , wwo-1 W-CIP 33198-〇p-twf.doc/j 功能性元件之存在。 $ 4a圖係具有嵌入於其表面的功能性^件之一 態物體的橫截面圖。物體(40)係可具有連接腔部，其形 為如圖所*於本體_孔或槽(41)，以允許功能性元件^ 連接至-電源。功能性元件至電源之連接係透過諸孔 而安排路線。 9 m線(44)、或其他型式之可撓曲的連接配件係 可藉由導電性的黏著劑(45)或機械式夾持而附接至功能性 元件’導電性的黏著劑(45)係諸如：異向性的導電膜(ACF an1S〇tr〇piC conductive film)、導電性的壓力靈敏黏著劑 (PSA, pressure sensitive adhesive)或銀塗料。 第4b圖係說明一種紐扣式(snap_in)插卵6)，其可 :插入以_結合面，且加功紐元件與電源之 連接可靠度。 口藉由吹噴模製或加熱成形以形成本發明之物體亦為 建ί 一容納電路的内腔。針對於藉由吹喷模製或 二成川H物體，轉移或插人膜*獅先置放至一 二模具中’且藉由例如真空或張力*保持於定位，然後 模具。祕形成物體之塑膠材料係加熱成形或吹噴 入於模製的㈣表面。 祕讀係嵌 表柯具有抗喊、抗反射或無光澤、光 之i面…㈠：。舉例而言，表面特徵係可透過模具本身 料處理而達成。替代而言，表面特徵可透過實. 15 201121758 uyuue-1 ^V-CIP 33198-OP-twf.doc/j 行於承載基板德賴㈣噴糾賴，此騎釋放層為: 不存在，此錢該承餘板轉作為·物體之頂表面。 於注入模製期間，表面特徵係轉移至模製的物體。 在注入模製之後而施加表面特徵至模製的物體亦 可月b舉例1 ’具有粗糖與光澤面之—轉移層係可最二 於模製的物體之上，以傳遞表面紋理至_體之表面^ 此情形’轉移層係可具有由砂紙、非編織式織品或類似者 或藉由喷砂或化學蝕刻所形成的粗糙面，以及具有藉由印 刷了樹脂層於其上所形成的光澤面。替代而言，轉^層之 粗链面係可藉由印刷—油墨於光澤的塑膠膜之上而形成。 進-步替代而言，模製物體之表面特徵係可藉由被覆 糖度轉移麟其上赠立祕區域，馈後部分披覆一透明 轉移膜於該祕輯以建立綺區_達成。粗 膜係可具有—薄金制層以提供雛敝理。首先藉著一 披覆整個表面、隨後形成-抗心於該 f膜要保留處之區域、藉著酸級而糊該表面、且最 該抗崎’亦可以達成期㈣祕度於—模製物體 QY)功能性开.件. 所時’物體係可保持於該功能性元件為由使用者 厅看見或看不見之方式。 管述’翻於本發明之功能性元件係可包括能夠 貫仃二功此之任何的電氣或機械元件。 藉由諸如逢合、電鍍、錢鍍、蒸氣沉積、真空沉積或 16 201121758 yjywo-1 W-CIP 33198-OP-twf.doc/j 其組合之種種的方法，諸如莫雷丨 ί 係於模内轉移膜或落之 載^黏錢繫緊披襲或是施加至模内插入膜 於-個實_’於基板層之導電性或半導電性的圖案 η:種Γ印方法之運用。此亦可藉由直接印刷而達 成，諸如·絲網、凹版或橡皮版或平版印刷。 & 導紐解導電性賴案之軸係可藉由 於美國專利公告公開案第2003-0203101與US 2004=1779號所揭示的任—種方法而軸，該二件公告 之内容係以參照方式而整體納入於本文。 舉例而言’導電性或半導電性的圖案之形成係可藉由 /種正像印刷方法而實施。於此種方法，一“正像” 於㈣__或箱之财久層(若存在)或於黏著或 繫緊披覆層或是於-模_人膜錢之承載層，此乃藉著 用難以剝除自該層之材料印刷在對應於—期望圖案之區 域。任何油墨或可印刷材料係可運用，其具有特徵在於： 後續沉積之導電性或半導電㈣膜係相較於其附著至該層 而更為強力附著至該油墨或印刷材料。印刷係可藉由任何 的印刷技術而實施，諸如：橡皮版、乾膠印_嗯aphic)、 電子知、相、或平版印刷，其他的印刷技術亦可適用，諸如： 壓，印、，絲網印刷、凹版印刷、喷墨印刷或加熱印刷。在“正 像形成後’ -導電性或半導電性的材料係沉積於該層之 .圖案化的表面。在導電性或半導電性的材料之沉積後，在 201121758 uyuue-i^CIP 33198-OP-twf.doc/j 未由油墨或可印刷材料所覆蓋區域之導電性道 材料係以一種剝除方法而移除以顯露圖案。性的 .種f除溶劑(其可為-水性或有機溶 的材厂代而言，該剝除係可藉由機:=Ϊ —導電性或半導電性的圖案之形成於—模内轉移 層或黏著或繫緊披覆層或是於—模_人臈或ί =層，由-種“負像印刷”方法而實施。“ 案之ί ’“Γί，罩覆層或油墨首先印刷於該層以建立期望圖 ς 負像。換言之，遮罩覆層或油墨係印刷於該 :生或半導電性材料將不存在之區域。本質而言，油墨^ 案係作為針對後續沉積導電性或半導電性材料的一遮罩。 任何適合的印刷技術係可運用以印刷負像於該層，諸如： 橡皮版、乾膠印、電子照相、或平版印刷。於某些應用， 其他的印刷技術可適用，諸如：壓印、絲網印刷、凹版印 刷，j噴墨印刷或加熱印刷，視所期望的解析度而定。在“負 像形成後，一導電性或半導電性的材料係沉積於該層之 圖案化的表面。於一個實施例，係運用蒸氣沉積以沉積導 ，性或半導電性的材料於該層之圖案化側。於一個替代實 施例，導電性或半導電性的材料沉積是藉由濺鍍彼覆導電 ，或半導電性的材料於該層之圖案化侧。遮罩覆層或油墨 最後剝除自該導電性或半導電性的材料已沉積之該層的圖 案化侧。覆層/油墨之剝除具有效應為：剝除所形成的印刷 負像，以及剝除)冗積於該層有覆層/油墨的區域之導電性或 201121758 u屬” vZ-CIP 33I98-0P-twf.d〇c/j 導電性的材料，即使頂表面之導電性或半 性的材料沉積後。 係貫行在該導電性或半導電 導電性或半導電性的圖案係可運 ,,、一 個功紐元件之_互連件 丨；至>一 件的連接線路。導電性或半導= ===功能性元 瞻電磁屏蔽的功能。 _案亦可貫行天線或 可^雜元件本㈣可為祕，_聽佳為可撓性/ 設計像設計亦可出現於物體之表面。最常見的 用^括.廠牌名稱、標諸或符號或其他袭飾性設計。 打印===統方法係包括：絲網印刷、 業’其需要額外的處理步驟。 巧絲後的作 掇向ί年來，已經運用替代的裝飾方法，諸如以上所述之 性元是模内插入蝴。裝飾性設計與功能 可印2 中。舉例而言’裝飾性設計係 設計之二:ίΐΐί職之—適當層。用於裝飾性 丨4適口的材枓可包括：油墨、金屬、金 裝飾性設計可在功能性元件附加至該^ 白之刖或之後而形成/印刷。 裳飾性設計亦可藉由加熱成形而形成。於此情形，通 2〇n21Ziip 33i9— 常加熱成形自-ABS、聚苯乙婦、或Pvc片於 替代而言，裝飾性層可藉由高壓成形而形成 及:軍用 ==生ίΓ設計於一膜。裝飾性層亦== 其中’一液峨_㈣(而非空 個設計’裝雜設計縣與功紐重物 體之表面。替代而言，裝恤設計可與功紐元件^= 或部分重疊。舉例而言，功能性 二且 性圖案之下方或部分於乂::二裝飾 係可見，而在裝飾性圖案之下方的功能‘元件 或效應而定。.郷了運用’視所期望的應用 亦為可能的是1飾性圖案與 個 t:的臟。具有裝錄圖案之膜或箱= ^層，輯對於具有魏性辑之膜妓，耐久層係選用 式番^人翁之前，裝飾與功能性 係置放於模具之不同位置。 、 (VI)顯示面杯 -顯示面板亦可存在為顯現於物體之上。_本發明 :盖：有的顯示器、型式’有利的為逮用基於塑膠的顯;面 板，諸如：聚合物分散式液晶顯示器(PDLC，polymer liquid CIystal display)、膽固醇液晶顯示器(chLCD， cholesteric liquid crystal display) . 20 201121758 υ^υυβ-ι \V-CIP 33198-〇P-twf.doc/j organic light emitting device)、電泳顯示器（EpD， electrophoretic display)、基於塑膠的lCD、或是基於其他 粒子的顯示器。 顯示面板可疊合於物體表面之頂部。替代而言，顯示 可嵌人於物體表面。用於達成顯示面板於一 體表面之方法係揭示於美國專利公開案第薦撕雙 號’其内容仙參财式而整體納人於本文。 第/圖為本發明一實施例之轉印製程的流程圖，而第 圖至第9圖繪示帛5圖之轉印製程的部分步，驟。請參照 於5，與，6圖’本實施例之轉印製程是先放置-物體50 於製程平台60上，步驟sl〇。物體5〇的材質例如是選 聚奴sits旨、聚丙烯、壓克力、苯乙婦甲基丙烯酸甲醋 共聚物、丙稀晴叮二稀·苯乙稀、聚苯乙稀、聚對笨二甲 酸乙二醇g旨、聚祕或這些材質的組合，亦歧其它材質。 另物體5 0也可以是只有後續將與轉印膜接觸的部分的 材貝疋選自於聚碳_旨、聚丙稀、壓克力、苯乙烯甲基丙 婦^甲酯共聚物、丙婦晴_ 丁二婦_苯乙婦、聚苯乙烯、聚 對=一曱酸乙二醇酯、聚縮荃或這些材質的組合。當物體 f是以射出成型方式製成時，可選擇將物體50與部分的 模具70 一同放置於製程平台60上。 接著參照第5圖與第7圖，放置一轉印膜100於物體 上’步驟S20。選擇性地，製程平台60可具有一夾具 62 ’用以在轉印膜1〇〇被放置於物體5〇上之後，將轉印膜 100固定於物體5〇上。 201121758 uyuue-1 >V-CIP 33198-Op.twf.doc/j 接著參照第5圖與第8圖，以一工具8〇加熱加壓於 轉印膜1〇〇,使得轉印膜1〇〇受工具8〇加熱加壓的部份貼 附於物體50，步驟S40。本實施例的工具80是以一滚輪 為例’工具80是以定向方式在轉印膜100上滾壓並加熱轉 印膜100。然而，工具也可以是其他適當的工具而不限 定為滚輪。本實施例中以工具8〇加熱加壓於轉印膜1〇〇 的步驟是於8(TC至25〇t進行。此外，轉印膜1〇〇受工具 8 0加熱加壓的部份例如是貼附於物體5 0的一平垣表面5 2。 接著參照第5圖與第9圖，將轉印膜1〇〇與物體5〇 放置於一反應室90，步驟S50。然後，抽氣以使反應室90 呈真空狀態，並使轉印膜1〇〇未受工具8〇 (繪示於圖8) 加熱加壓的部份貼附於物體.5〇，步驟S6(^至此大致完 成本實施例的轉印製程。在抽氣以使反應室90呈真空時， 反應室90的溫度例如是坑至3〇〇t>此製程溫度低於習 知模内裝飾技術的製程溫度，可降低元件損毀的可能性。 此外，轉印膜100未受工具80 (繪示於® 8)加熱加壓的 部份例如是貼附於物體5〇的一非平坦表面M。平坦表面 52 /、非平:t一表面54的連接處的夾角可介於度至9〇度。 換。之本貫施例的轉印製程不僅可將轉印膜綱轉印至 =50的平坦表面52 ’更可將轉印膜⑽轉印至物體％ 、导平坦表面54。同時’還不易出現轉印的圖文龜裂、轉 =100產生=及轉印膜⑽與物體5〇之間存在氣泡等 hj衣桎平台6〇例如具有一真空管道64，以通 過真空管道64進行抽氣而使反應室9〇呈真空。製程平台 22 201121758 ^w6-iW-CTP 33198-OP-twf.doc/j 60與反應室90可以是屬於同一機台。 在第5圖所示的轉印製程中，轉印膜1〇〇 (標示於第 6圖）可以是第2a圖或第2b圖的實施例所說明的模内轉 移膜或箔。或者’轉印膜100也可以不包含第2&圖中的功 月έ性元件(24)。又或者，轉印膜1〇〇也可以如第圖所示。 第10圖的轉印膜1〇〇包括一暫時承載層11〇、一釋放 層120、一功能性元件13〇以及一接著層14〇。選擇性地， 鲁 轉印膜10〇還可包括一耐久層160與一油墨層no。暫時 承載層110、釋放層12〇、功能性元件130、耐久層ι6〇及 接著層140的材質都可以與第2a圖的實施例相同。功能性 元件130可為一積體電路或其它功能性元件。釋放層12〇 配置於暫時承載層110上。耐久層160配置於釋放層12〇 上’功能性元件13〇與油墨層170配置於耐久層160上， 且功此性元件130可内叙於油墨層170。轉印膜1〇〇被放 置於物體50 (標示於第6圖）上時，暫時承載層no可位 於最外侧。 _ 請參照第5圖、第9圖與第10圖，在使轉印膜100 未受工具80加熱加壓的部份貼附於物體50後，可將暫時 承載層110與釋放層120移除，並將耐久層160、油墨層 17〇功3b性元件130與接著層140保留於物體50上，步 驟 S70 〇 第11圖為本發明另一實施例之轉印製程的流程圖， 而第12圖繪示第11圖之轉印製程的部分步驟。請參照第 11圖與第12圖，本實施例的轉印製程與第5圖的轉印製 23 201121758 iV-CIP 33198-〇p7twf.doc/j 程相似，.差異在於本實施例的轉印製程中，在放置轉印膜 100於物體50上之前，更包括放豈一功能性元件132於物 體50上。功能性元件132位於轉印膜1 〇〇與物體5〇之間。 換言之，功能性元件132並非嵌置於轉印膜1〇〇内，功能 性元件132與轉印膜1〇〇是個別獨立的構件。 相較於傳統模内裝飾技術，以第5圖與第u圖之轉 印製程加工過的本發明的一實施例的物體，具有較佳的可 靠度與外觀。 、θ儘管本發明係已經關於其特定實施例而描述，要瞭解 $ :種種的變化係可作成且等效者係可代㈣未脫離本 ς二之，正精神與_。❹卜，諸多修改係可作成以適用 ^特疋情況。所有該等修改係意圖為於本發明之範疇内。 L圖式簡單說明】 第1圖係顯示本發明之一種物體的俯視圖。 橫戴^圖2n種包含功能性元件之模轉移膜或羯的 橫戴^圖⑪圖係—種包含功能性元件之㈣插人膜或落的 i生典 丁、裡攻及模内轉移膜或箔之注入： 懷哉面圖。 一 横截係―種涉及翻m狀注入模製方 第4a與4b圖係說明本發明之一 種物體’其具有内腔 24 201121758 υ^υυδ-1 W-CIV 33198-OP-twf.doc/j 第5圖為本發明一實施例之轉印製程的流程圖。 第6圖至第9圖繪示第5圖之轉印製程的部分步驟。 第10圖為本發明另一實施例之轉印膜。 第11圖為本發明另一實施例之轉印製程的流程圖。 第12圖繪示第11圖之轉印製程的部分步驟。 【主要元件符號說明】In an embodiment of the transfer process of the present invention, the transfer film comprises a temporary carrier layer, a release layer, a functional component and an adhesive layer. The release layer is disposed on the temporary carrier layer. The functional element is disposed on the release layer. The connector layer is disposed on the release layer. When the transfer film is placed on the object, the functional element and the adhesive layer are located between the object and the temporary carrier layer. Further, the transfer film may further include a long layer. The durable layer is disposed on the release layer, and the functional element and the adhesive layer are disposed on the durable layer. In addition, after the portion of the transfer film that is not subjected to the sound pressure application of the tool is attached to the object, the transfer process may further include retaining the temporary carrier layer and the layer of the layer, retaining the functional layer and the adhesive layer. On the object. The transfer may further comprise an ink layer, the ink being disposed on the release layer and covering the functional component, and the subsequent layer being placed on the ink layer. In an embodiment of the transfer process of the present invention, before the transfer film is placed on the body, the transfer process further includes placing a functional component on the object. The power element is located between the transfer film and the object. In an embodiment of the transfer process of the present invention, the functional component is a cascading circuit. In an embodiment of the transfer process of the present invention, the tool is heated and pressurized; the step of the P film is to roll and heat the transfer film by a roller. In the conversion system (4) - the process of heating and pressing H is carried out at 80 ° C to 250 ° C. In an embodiment of the transfer process of the present invention, the gas is evacuated so that the reaction chamber temperature is 赃 to 3 (8) when the reaction chamber 201121758 09008-TW-CIP 33198-OP-tvvf. C. In an embodiment of the transfer process of the present invention, the process platform has a means for attaching the transfer to the object after the transfer film is placed on the object. In the embodiment of the transfer system of the present invention, the transfer film is attached to the tool, and the pressed portion S is attached to a flat surface of the object, and the transfer film is not heated by the tool. A part attached to a non-flat surface of the object. The angle between the flat surface and the non-flat surface is between 1 degree and 1 degree. In an embodiment of the transfer process of the present invention, the process is as follows: the step of having a vacuum tube' field to bring the reaction chamber to a vacuum is to evacuate the vacuum line. The invention also proposes an object which is processed through the aforementioned transfer process. Further, the material of the portion where the object is in contact with the transfer film is, for example, selected from the group consisting of polycarbonate, polypropylene, dust, styrene-based acrylonitrile, acrylonitrile, styrene, and styrene. Poly pairs: stearic acid 3-alcohol esters, polycondensation or a combination of these materials. The system produced by the present invention has a wide variety of applications. For example, the object can be a touch or push panel, a color filter, a backlight, a whistle, a microphone, a clock, a watch, a radio panel, a mobile phone, a digital camera housing, a profile assistant housing , notebook computer case, desktop computer case, touch panel housing, TV housing, global positioning system housing, vehicle display. Housing, aerospace display housing, digital photo frame housing, body, DVD playback ‘housing, cosmetic case, toy, car dashboard, receiver housing, credit card or smart card and other electronic device housing. This list of 201121758 υνυυβ-1 \V-CIP 33198-OP-twf.doc/j is obviously not exhaustive. Other applications are intended to be familiar to those skilled in the art and are therefore within the scope of the present invention. [Embodiment] The term "functional element" as used in this application is broadly meant to include any money or mechanical element that can be implemented. Examples of such functional elements may include (and are not), Wire components, wire devices, waveguides, electronic design (such as: guide wire decoupling), electronic components (such as: integrated circuits, printed circuits, transistors, diodes, resistors, inductors, capacitors H, Antenna, coffee transceiver, battery, solar cell, light emitting diode (LED), and other diodes not limited to (10), organic light emitting diode (OLED), display member, #光部件, π八, microphone, button, touch panel, touch cymbal, connector and the like. In the case of this month, the term "embedded on the top surface" is intended to mean iii: when the object is front Rather than after the object is formed, the functional element is integrated into the top surface of the object; the functional element is not mounted within the object. Figure 1 shows an object containing a functional element (11) embedded in its surface. (10) as shown in the figure Viewed from the side of the functional element. Alternatively, the system can be shouted from the opposite side, and in this form, the functional element will be invisible to the viewer. There may also be an object appearing on the object. A decorative element (12), a display element (not shown), or both. There are a number of different methods that can be applied to break into a functional element in a 201121758 WWS-l W-C1P 33198-OP-twf.doc/ j The surface of the object. Two examples are provided later. Although within the terminology, it is understood that the invention extends to the following methods: printing, lamination, thermoforming, injection molding, compression molding , blowing or embossing or laminating in combination with one of the molding methods.,, table, (I) in-mold Han film or foil in one way, - a mold shift or foil system containing a functional element Preparation 4 Win 2 Figure 2a is a cross-sectional view of the in-mold transfer film or foil (2〇). The transfer film or foil (20) comprises a carrier layer (21), a release layer (22), a 'Use a durable layer (23), a functional element (24), with an adhesive or tie-down = release layer (22), durable layer (23) (if In the case of the adhesive layer (2), it is superimposed or superimposed on the carrier layer (21), and these different layers are collectively referred to as "in-mold transfer film or foil" for ease of explanation. When no durable layer is present, the functional element (24) is present between the release (22) and the adhesive layer (25). This can be achieved by sequentially coating the layers with a layer of in-mold transfer film or The application of the read functional element to the release of the adhesive layer is achieved before the foil. Or until a durable layer is present, the functional element can be applied to a resistant film. The functional element can be present in the release layer and durable. Between the layer θ slope between the durable layer and the adhesive layer: In the alternative, a composite film having a functional element sandwiched between two adhesive layers may be used to superimpose on the release layer or A durable, release - drape. The two adhesive layers are required, because the two have no layers - the same as - 201121758 ^UU5-IV^-CIP 33198-0P-twf.d〇c/j ί = the film and release layer or The adhesion between the enemy release film and the adhesion between the composite film and the injection molded resin. The latter is the adhesive layer of Figure 2a (25). The composite film as described is actually a support layer for one of the intra-turn transfer films or foils.功月 b 14 components to release, durable _ release film, adhesive or tie coating = addition, can be by printing, drape, splashing, vapor deposition, spray, plating: paste, money engraved, stacked This can be achieved by a combination of methods or the like, or by a combination of such methods. In one embodiment, the function! The raw component can be formed first and then transferred to the layer. In another embodiment, a functional component can be formed directly into the layer. However, in either case, the flatness and smoothness of the surface of the object should not be affected by the presence of functional components. In the in-mold transfer method, the in-mold transfer film or foil system is fed to a mold, and the carrier layer (21) is brought into contact with the mold surface as shown in Fig. 3a. The carrier layer (21) is typically a thin plastic film having a thickness from about 3.5 microns to about 2 microns. Polyethylene terephthalate (PET, P〇lyethylene terephthalate), polyethylene naphthalate (PEN, p〇1yethylene (10) venge (6) and polycarbonate (PC, P〇iycarb〇nate) film. It is preferred for its low cost, high transparency, thermomechanical stability. The release layer (22) allows the functional element (24) to be released from the carrier layer in a manner that minimizes damage to the functional element and can A fully automatic roll transfer process is used during molding. The release exhibition is usually prepared from a low surface tension coating such as wax, paraffin or polyoxyxene, or prepared from a radiation-curable multi-functional 201121758. υ^υυο-1 \V-CIP 33198-OP-twf.doc/j based acrylate, polyoxy acrylate, epoxide, vinyl ester, allyl and ethylene, unsaturated polyester or a highly smooth, impermeable coating of a material of the mixture. The release layer may comprise a group selected from the group consisting of epoxides, polyurethanes, polyimines, polyamines, melamine formaldehyde, urea formaldehyde, and phenol formaldehyde. a condensation polymer, copolymer, mixture or composite Another suitable release layer composition is disclosed in U.S. Patent Publication No. 2005-0255314, the disclosure of which is incorporated herein in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety. An interpenetration network (IPN) formed by a composition comprising an amine aldehyde condensate and a free radical inhibitor or quencher. The durable layer (23), if present, is used as A protective layer of one of the functional elements (24). The raw material suitable for the durable layer may include, but is not limited to, a radiation curable polyfunctional acrylate comprising epoxy acrylate, polyurethane acrylic acid from B, poly Ester acrylate, polyoxopropionate, glycidyl acrylate, epoxide; vinyl ester; diallyl phthalic acid; ethylene ether; and its age. Durable layer system Contains a "condensation polymer or copolymerization, such as: epoxide, polyamine vinegar, polyamin, polystyrene, melamine, IT, urea, or pirate. The durable layer can contain a paint. Sol-gel or vinegar The long-lasting layer can be partially or completely cured. For partial curing, a post-cure step will be applied after the molding and/or transfer step to enhance the durability, in particular: hardness, scratch resistance and oil resistance. 9 To improve the release properties of 'complement (_ is the low molecular weight component of the durable layer) 201121758 uyuus-1W-CIP 33198-OP-twf.doc/jf to penetrate into the release layer. In the coating and curing or partially cured durable layer Afterwards, the surface is lightly compatible or not suitable for riding layers. Adhesives and additives such as surfactants, dispersants, uvs or antioxidants can be used to control rheological m coating (4) Weathering performance, and aging properties. Fillers such as oxidized hair, Al2〇3, yttrium, cac〇3, microcrystalline yttrium or poly(10), Teflon or its side hardener may also be added to improve, for example, the scratch resistance and hardness of the durable layer. The thickness of the durable layer is typically from about 2 microns to about 2 G microns, and preferably from about 3 micrometers to about 12 microns. The durable layer, if present, is preferably transparent to a window region. In addition to the above (4), other suitable compositions for the fine-layered layer are disclosed in U.S. Patent Publication Nos. 2, 5, 1812, 4, 2005-0, 1292, and 2006-0093813, the contents of which are The reference is incorporated into this document as a whole. For example, U.S. Patent Publication No. 2005-0181204 discloses a durable layer composition comprising: a thermally crosslinkable and photochemically or freely polymerizable polymer, a thermal crosslinking agent and a radiation. a cured polyfunctional monomer or oligomer; U.S. Patent Publication No. 2005- 0171292 discloses a durable layer composition comprising: at least one carboxylic acid or anhydride functional group for thermal crosslinking and at least one A polymer or a copolymer of a uv cross-linking functional group; and a durable layer composition comprising: an amine-based cross-linking agent, having a reaction + an amine cross-linking, is disclosed in US Patent Publication No. 2006- 0093813 One of the at least one functional group of the crosslinking agent is a UV curable monomer or oligomer, an acid catalyst, and a photoinitiator. An adhesive layer (25) is incorporated into the in-mold transfer film or foil to provide optimum adhesion of the functional component (24) to the surface of the molded article. Adhesive layer can be 201121758 ν/^υυ〇-ι iV-CIP 33198-OP-twf.doc/j from such as polyacrylate, polymethacrylate, polystyrene, polycarboester, polyurethane, polyester Polyamide, epoxy resin, ethylene vinyl acetate (EVA), thermoplastic elastomer or similar, or a material of a copolymer, mixture or composite thereof. Adhesives which are thermally or thermally activated by polyurethanes and polyamides are particularly preferred. good. In addition to the materials indicated above, a group of materials suitable for use in the adhesive layer is disclosed in U.S. Patent Application Serial No. 2, the entire disclosure of which is incorporated herein by reference. In short, the adhesive layer composition can comprise an adhesive binder and a polymeric particulate material. The thickness of the adhesive layer can range from about 5 microns to about 2 microns., preferably from about 2 microns to about 6 microns. (II) A schematic cross-sectional view of an in-mold insertion of the abdomen or a $*J system. The carrier layer (21a) will be processed after embossing, lamination or a molding process. The elastomeric component (24) can be applied to the carrier layer (2U) by an optional H曰 (not, (iv)) and covered by a functional component or a thermally activated adhesive (25). Adhered to the carrier film. f "The pattern of the (=) = film = drop or paragraph (π) mold interpolated OimA ^ Mji) or the form of - volume_). 12 201121758 uyuu»-i W-CIP 33198-OP-twf.doc/j — The method of transfer _ transfer method is based on the 3a figure = method 'in-mold transfer film or pure continuous feeding to - molding machine = Or on the web. The mold (30) can be a shrink mold for the secret object (10). In the case of molding, the mold system is closed and the poem is formed by the ^ nozzle and the flow and injection field (4) (36a) = after molding, the functional element and the layer (if any) are stored in the mold = Above. The molded system was removed from the mold. The carrier layer (3D盥S release layer (32) is simultaneously removed, leaving the durable layer (33) (if present) at the object _ = topmost layer and the functional section (10) embedded in the lower body ^ integral part. 35) tie, - adhesive f ^ t durable layer is not present 'functional element will be exposed and the basin can be directly connected to - power supply or other electronic components. The long layer exists, there may be holes above the durable layer 'Functional components can be wired through a hole to a power source or other electronic component. _In the transfer film or group of _ to the mold, Na or net can be pre-printed and continuously fed to the mold, and by, for example, Optical sensor = as shown in Figure 3b - the method of inserting the mold - the in-mold insert film or drop is first cut into the appropriate size and shape and then inserted into a mold (30). The box is placed on the wall of the mold as shown in the figure, and can be used under vacuum. The membrane or box can be manually placed and can be electrostatically used to facilitate its insertion or the insertion system can be mechanized. The mechanized insertion system is special. Conducive to mass production. The carrier layer (31a) inserted into the film or foil is in contact with the The inner wall surface 13 201121758 WW6-1 ^-CIP 33 J 98-OP-twf.doc/j. The mold is mixed with the closed plastic, and the molten plastic used to form the object (36b) passes through the injection nozzle and the flow path. And injected into the mold cavity (36a). The carrier layer (3la) in this case can be an integral part of the finished product. Alternatively, the insert film or the box can be heated to form a shape and inserted before being inserted into the mold. Die cut. Examples of plastic materials suitable for forming an object in an imprinting, laminating or molding process may include, without limitation: thermoplastic materials such as polystyrene, polyvinyl chloride, acrylic, polyfluorene, Polyaryl ester, polypropylene oxide, polyanthracene, acrylonitrile-butadiene-styrene, methacrylic acid, acrylonitrile-butadiene-styrene Methacrylate (acrylic acid-acrylonitrile-butadiene-styrene), polycarbonate, polybutylene terephthalate (PBT), poly(p-phenylene terephthalate), polyurethane, And other thermoplastic elastomers or mixtures thereof; A solid material, such as a reaction injection molding grade of polyurethane, epoxy resin, reduced polyacetate, vinyl vinegar, or a composite thereof, a prepreg, and a mixture, are used in the two types. The mold of the manufacturing method must be designed to allow the functional components to be inserted or transferred. The gate position must allow the functional τ to be pressed against the mold cavity to ensure proper heat transfer. Furthermore, the system must be designed So that the functional components after molding can be easily connected to a power source. In addition, the 'model level and the Lai analysis system should be implemented before the mold is cut. - The mold cooling analysis is also designed to minimize the hot spots in the mold. Finally, the mold temperature setting must consider the existence of the 201121758, wwo-1 W-CIP 33198-〇p-twf.doc/j functional components. The $4a diagram is a cross-sectional view of a functional object embedded in its surface. The object (40) may have a connection cavity that is shaped as shown in the body_hole or slot (41) to allow the functional component to be connected to a power source. The connection of the functional components to the power source is routed through the holes. 9 m wire (44), or other types of flexible connecting fittings can be attached to the functional component 'conductive adhesive (45) by a conductive adhesive (45) or mechanical clamping For example, an anisotropic conductive film (ACF an1S〇tr〇piC conductive film), a conductive pressure sensitive adhesive (PSA) or a silver coating. Fig. 4b illustrates a snap-in type of insert 6) which can be inserted into the _ joint surface and the connection reliability of the power button component and the power source. The mouth is formed by blow molding or heat forming to form the object of the present invention. For the purpose of spraying or molding a H-object, transferring or inserting a human lion* into a mold, and holding it in position by, for example, vacuum or tension*, then the mold. The plastic material forming the object is heat formed or blown onto the molded (four) surface. The secret reading system has a surface that resists shouting, anti-reflection or dullness, and light... (1): For example, surface features can be achieved by processing the mold itself. Alternatively, the surface features can be passed through. 15 201121758 uyuue-1 ^V-CIP 33198-OP-twf.doc/j On the carrier substrate De Lai (four) spray correction, this ride release layer is: does not exist, this money The bearing plate is turned into the top surface of the object. During injection molding, surface features are transferred to the molded object. After the injection molding, the application of the surface features to the molded object may also be exemplified by 1 'having a rough sugar and a glossy surface - the transfer layer may be on top of the molded object to transfer the surface texture to the body Surface ^ In this case, the transfer layer may have a rough surface formed of sandpaper, a non-woven fabric or the like or by sand blasting or chemical etching, and a glossy surface formed by printing a resin layer thereon. . Alternatively, the thick chain surface of the transfer layer can be formed by printing-ink on a glossy plastic film. In the case of the step-and-step alternative, the surface features of the molded object can be transferred to the secret area by the sugar transfer, and the transparent part of the feed is coated with the transparent transfer film in the secret to establish the area. The coarse film system may have a thin gold layer to provide seedling care. First, by covering the entire surface, and then forming - anti-heart area of the f film to be preserved, paste the surface by acid grade, and the most anti-saki' can also reach the period (four) secretness - molding The object QY) is functionally open. The object system can be maintained in such a way that the functional element is seen or invisible by the user's office. The functional elements that are referred to in the present invention may include any electrical or mechanical component that is capable of any of the following. By various methods such as merging, plating, money plating, vapor deposition, vacuum deposition or 16 201121758 yjywo-1 W-CIP 33198-OP-twf.doc/j, such as Morey丨ί in the mold The film or the transfer film is applied to the in-mold insert film or the conductive or semi-conductive pattern η of the substrate layer: the use of the seed printing method. This can also be achieved by direct printing, such as screen, gravure or rubber or lithography. The axis of the <<>><'>>'''''''''''''' And the whole is included in this article. For example, the formation of a pattern of conductivity or semi-conductivity can be carried out by a positive-image printing method. In this way, a "positive image" is used in (4) __ or the box of the rich layer (if present) or in the adhesive layer or the tie layer or the carrier layer of the - model _ human film money. It is difficult to strip the material from the layer printed in the area corresponding to the desired pattern. Any ink or printable material can be utilized which is characterized by: Subsequent deposition of a conductive or semi-conductive (tetra) film system that adheres more strongly to the ink or printed material than it is attached to the layer. Printing can be carried out by any printing technique, such as: rubber plate, dry offset _ aphic, electronic know, phase, or lithography, other printing techniques can also be applied, such as: press, print, screen Printing, gravure, inkjet or heat printing. After "positive image formation" - a conductive or semi-conductive material is deposited on the patterned surface of the layer. After deposition of the conductive or semi-conductive material, at 201121758 uyuue-i^CIP 33198- OP-twf.doc/j Conductive track material that is not covered by ink or printable material is removed by a stripping method to reveal the pattern. The type f removes the solvent (which can be - aqueous or organic) In the case of a dissolved material factory, the stripping system can be formed by a machine:=Ϊ-conductive or semi-conductive pattern formed in the in-mold transfer layer or the adhesive or tie-coat layer or the mold_ The human or ί = layer is implemented by a "negative image printing" method. "The case ί '" Γ, the cover layer or ink is first printed on the layer to create the desired image negative image. In other words, the mask overlay The layer or ink is printed on the area where the green or semi-conductive material will not be present. Essentially, the ink system acts as a mask for subsequent deposition of conductive or semi-conductive materials. Any suitable printing technology Can be used to print negative images on this layer, such as: rubber plate, dry offset, electrophotography, Lithographic printing. For some applications, other printing techniques are applicable, such as: embossing, screen printing, gravure printing, j inkjet printing or thermal printing, depending on the desired resolution. A conductive or semi-conductive material is deposited on the patterned surface of the layer. In one embodiment, vapor deposition is employed to deposit a conductive or semi-conductive material on the patterned side of the layer. In an alternative embodiment, the conductive or semi-conductive material is deposited by sputtering with a conductive or semi-conductive material on the patterned side of the layer. The mask or ink is finally stripped from the conductivity. Or the semi-conductive material has been deposited on the patterned side of the layer. The coating/ink stripping has the effect of: stripping the formed negative image, and stripping) the layered coating/ink The conductivity of the region or 201121758 u is a "vZ-CIP 33I98-0P-twf.d〇c/j conductive material, even after the top surface of the conductive or semi-material is deposited. Or semi-conductive or semi-conductive pattern运,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The components can be secret, and the design can also appear on the surface of the object. The most common use is the name, label or symbol or other design. Printing === system method includes: screen printing, industry 'it needs extra processing steps. 巧 后 ί ί ί , , , , , , , , , , , , , , , , , , , , , , , , , Insert the butterfly. The decorative design and function can be printed in 2. For example, 'Decorative design is the second design: ΐΐ ΐΐ 职 职 ——. Materials for decorative 丨4 palatable can include: ink, metal, gold. The decorative design can be formed/printed after the functional component is attached to or after the stencil. The skirting design can also be formed by heat forming. In this case, through 2〇n21Ziip 33i9—normally heated from -ABS, polystyrene, or Pvc sheet, the decorative layer can be formed by high pressure forming and: military == raw Γ design membrane. The decorative layer is also == where 'one liquid 峨 _ (four) (rather than the empty design 'packaged design county and the surface of the heavy object. Alternatively, the design of the tie can be overlapped with the power component ^= or partially. For example, the lower or part of the functional two-in-one pattern is visible in the 乂:: two decorative system, and the function 'component or effect below the decorative pattern. 郷 运用 运用 ' ' ' ' ' ' ' ' It is possible to have 1 decorative pattern and a t: dirty. The film or box with the recording pattern = ^ layer, for the film with the Wei-series, the durable layer is selected before the decoration, and the decoration The functional system is placed in different positions of the mold. (VI) Display cup - display panel can also exist to appear on the object. _ The present invention: cover: some displays, type 'favorable for catching plastic based Panels, such as: polymer liquid crystal display (PDLC), chLCD, cholesteric liquid crystal display. 20 201121758 υ^υυβ-ι \V-CIP 33198-〇P- Twf.doc/j organic light emitting device), Swimming display (EpD, electrophoretic display), based lCD plastic, or other particle based displays. The display panel can be superimposed on top of the surface of the object. Alternatively, the display can be embedded in the surface of the object. The method for achieving the display panel on a single surface is disclosed in the U.S. Patent Publication No. Fig. 1 is a flow chart showing a transfer process according to an embodiment of the present invention, and Figs. 9 to 9 show a part of the steps of the transfer process of Fig. 5. Please refer to Fig. 5, and Fig. 6'. The transfer process of this embodiment is to place the object 50 on the process platform 60, step sl1. The material of the object 5〇 is, for example, a selection of slaves, polypropylene, acrylic, styrene, methacrylate, acetophenone, styrene, styrene, polystyrene, polypyrene Ethylene glycol diformate, poly-collection or a combination of these materials, also differs from other materials. The other object 50 may also be a part of the material which is only to be in contact with the transfer film, and is selected from the group consisting of polycarbene, polypropylene, acrylic, styrene methyl propyl methyl ester copolymer, and propylene. Qing _ Ding Erfu _ Benzene, polystyrene, polypair = ethylene glycol citrate, polycondensation or a combination of these materials. When the object f is made by injection molding, the object 50 can be optionally placed on the process platform 60 together with a portion of the mold 70. Next, referring to Figs. 5 and 7, a transfer film 100 is placed on the object' in step S20. Alternatively, the process platform 60 may have a jig 62' for fixing the transfer film 100 to the object 5 after the transfer film 1 is placed on the object 5''. 201121758 uyuue-1 >V-CIP 33198-Op.twf.doc/j Next, referring to Figs. 5 and 8, a tool 8 〇 heats and presses the transfer film 1〇〇 to make the transfer film 1〇 The portion which is heated and pressurized by the tool 8 is attached to the object 50, step S40. The tool 80 of the present embodiment is an example of a roller. The tool 80 rolls and heats the transfer film 100 on the transfer film 100 in an oriented manner. However, the tool can also be other suitable tools and is not limited to a scroll wheel. In the present embodiment, the step of heating and pressurizing the transfer film 1A with the tool 8 is performed at 8 (TC to 25 Torr). Further, the transfer film 1 is heated and pressurized by the tool 80, for example. It is a flat surface 5 2 attached to the object 50. Next, referring to Figures 5 and 9, the transfer film 1 and the object 5 are placed in a reaction chamber 90, step S50. Then, the air is pumped. The reaction chamber 90 is brought into a vacuum state, and the portion of the transfer film 1 that is not heated and pressurized by the tool 8 (shown in FIG. 8) is attached to the object. 5〇, step S6 (^) The transfer process of the embodiment. When the gas is evacuated to bring the reaction chamber 90 to a vacuum, the temperature of the reaction chamber 90 is, for example, a pit to 3 〇〇t>; the process temperature is lower than the process temperature of the conventional in-mold decoration technology, and the component damage can be reduced. Further, the portion of the transfer film 100 that is not heated and pressurized by the tool 80 (shown in Fig. 8) is, for example, a non-flat surface M attached to the object 5〇. The flat surface 52 /, non-flat: The angle of the junction of the t-surface 54 can be between 9 and 1. The transfer process of the present embodiment can not only transfer the transfer film to =50. The canal surface 52' can transfer the transfer film (10) to the object % and the flat surface 54. At the same time, it is not easy to have the transferred graphic crack, the rotation = 100 generation = and the transfer film (10) and the object 5 There is a bubble, etc., such as a vacuum tube 64, for vacuuming the vacuum chamber 64 to evacuate the reaction chamber 9 。. Process platform 22 201121758 ^w6-iW-CTP 33198-OP-twf. The doc/j 60 and the reaction chamber 90 may belong to the same machine. In the transfer process shown in Fig. 5, the transfer film 1 (labeled in Fig. 6) may be the 2a or 2b The in-mold transfer film or foil described in the embodiment. Or the 'transfer film 100 may not include the power-inducing element (24) in the second & figure. Alternatively, the transfer film 1 may also be as The transfer film 1A of Fig. 10 includes a temporary carrier layer 11〇, a release layer 120, a functional element 13〇, and an adhesive layer 14〇. Optionally, the transfer film 10〇 A durable layer 160 and an ink layer no may also be included. The temporary carrier layer 110, the release layer 12, the functional component 130, the durable layer ι6, and the adhesive layer 14 The material of 0 can be the same as the embodiment of Figure 2a. The functional component 130 can be an integrated circuit or other functional component. The release layer 12A is disposed on the temporary carrier layer 110. The durable layer 160 is disposed on the release layer 12. The functional element 13A and the ink layer 170 are disposed on the durable layer 160, and the functional element 130 can be described in the ink layer 170. The transfer film 1 is placed on the object 50 (labeled in Figure 6). When the upper layer is present, the temporary carrier layer no may be located at the outermost side. _ Referring to FIG. 5, FIG. 9 and FIG. 10, after the portion of the transfer film 100 that is not heated and pressurized by the tool 80 is attached to the object 50, The temporary carrier layer 110 and the release layer 120 may be removed, and the durable layer 160, the ink layer 17 and the adhesive layer 130 and the adhesive layer 140 are retained on the object 50, and step S70 is another embodiment of the present invention. A flowchart of the transfer process of the embodiment, and FIG. 12 shows a part of the steps of the transfer process of FIG. Referring to FIGS. 11 and 12, the transfer process of this embodiment is similar to the transfer process of FIG. 5, 201121758 iV-CIP 33198-〇p7twf.doc/j. The difference lies in the transfer of this embodiment. In the process, before placing the transfer film 100 on the object 50, a functional element 132 is placed on the object 50. The functional element 132 is located between the transfer film 1 〇〇 and the object 5 。. In other words, the functional element 132 is not embedded in the transfer film 1 , and the functional element 132 and the transfer film 1 are individually separate members. Compared with the conventional in-mold decoration technique, the object of an embodiment of the present invention processed by the transfer process of Figs. 5 and u has better reliability and appearance. , θ Although the present invention has been described with respect to its specific embodiments, it is to be understood that: a variety of variations can be made and equivalents can be substituted (4) without departing from the second, positive spirit and _. A lot of modifications can be made to apply to the special circumstances. All such modifications are intended to be within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an object of the present invention. Cross-wearing Figure 2n cross-dressing of a mold transfer film or crucible containing functional components. Figure 11 is a diagram containing a functional component (4) inserting a film or falling i-coded, inner and inner-mode transfer film Or the injection of foil: a faceted picture. A cross-sectional system - a type of m-injection molding is shown in Figures 4a and 4b to illustrate an object of the present invention having an internal cavity 24 201121758 υ^υυδ-1 W-CIV 33198-OP-twf.doc/j Fig. 5 is a flow chart showing a transfer process according to an embodiment of the present invention. 6 to 9 illustrate a part of the steps of the transfer process of Fig. 5. Figure 10 is a transfer film of another embodiment of the present invention. Figure 11 is a flow chart showing a transfer process according to another embodiment of the present invention. Fig. 12 is a view showing a part of the steps of the transfer process of Fig. 11. [Main component symbol description]
10 物體 11 功能性元件 12 裝飾性元件 20 模内轉移膜或箔 21 > 21a 承載層 22 釋放層 23 .财久層 24 功能性元件 25 黏著或繫緊彼覆層 30 模具 31、31a 承載層 32 釋放層 33 财久層 34 功能性元件 35 黏著層 36a 模具腔部 36b 物體 40 物體 25 201121758 1 ^V-CIP 33198-OP-twf.doc/j 41 開孔或槽 42 功能性元件 44 撓曲纜線 45 導電性黏著 46 紐扣式插頭 S10〜 <S70步驟 50 物體 52 平坦表面 54 非平坦表面 60 製程平台 62 夾具 64 真空管道 70 模具 80 工具 90 反應室 100 轉印膜 110 暫時承載層 120 釋放層 130、 132功能性元件 140 接著層 160 财久層 170 油墨層10 Object 11 Functional element 12 Decorative element 20 In-mold transfer film or foil 21 > 21a Carrier layer 22 Release layer 23. Financial layer 24 Functional element 25 Adhesive or fastened to the cover 30 Mold 31, 31a Carrier layer 32 release layer 33 financial layer 34 functional element 35 adhesive layer 36a mold cavity 36b object 40 object 25 201121758 1 ^V-CIP 33198-OP-twf.doc/j 41 opening or slot 42 functional element 44 flexing Cable 45 Conductive Adhesive 46 Button Plug S10~ <S70 Step 50 Object 52 Flat Surface 54 Non-flat Surface 60 Process Platform 62 Clamp 64 Vacuum Pipe 70 Mold 80 Tool 90 Reaction Chamber 100 Transfer Film 110 Temporary Bearing Layer 120 Release Layer 130, 132 functional element 140 followed by layer 160 financial layer 170 ink layer