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TW201129861A - Photosensitive composition, partition wall, color filter and organic el element - Google Patents

Photosensitive composition, partition wall, color filter and organic el element

Info

Publication number
TW201129861A
TW201129861A TW099146289A TW99146289A TW201129861A TW 201129861 A TW201129861 A TW 201129861A TW 099146289 A TW099146289 A TW 099146289A TW 99146289 A TW99146289 A TW 99146289A TW 201129861 A TW201129861 A TW 201129861A
Authority
TW
Taiwan
Prior art keywords
ink
photosensitive composition
side chain
group
partition wall
Prior art date
Application number
TW099146289A
Other languages
Chinese (zh)
Other versions
TWI483068B (en
Inventor
Hideyuki Takahashi
Kenji Ishizeki
Masayuki Kawashima
Kotaro Yamada
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201129861A publication Critical patent/TW201129861A/en
Application granted granted Critical
Publication of TWI483068B publication Critical patent/TWI483068B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)

Abstract

Disclosed is a photosensitive composition containing an ink-repellent component, which is capable of imparting a partition wall obtained therefrom with good ink repellency at the upper part thereof, developer resistance sufficient for preventing corrosion by a liquid developer, properties of preventing the occurrence of film remaining, and good wettability and spreadability of an ink over an opening portion between partition walls, although the ink-repellent component does not have an ethylenic double bond. Specifically disclosed is a photosensitive composition which contains: a polymer that has a mass average molecular weight (Mw) of 2.6 104 4 and contains a side chain having a group represented by general formula (1) and a side chain having a polyoxyalkylene group but no side chain having an ethylenic double bond; a photocuring initiator; and a binder resin. -CFXRf (1) (In the formula, X represents a hydrogen atom, a fluorine atom or a trifluoromethyl group; and Rf represents a fluorine atom or a fluoroalkyl group having 1-20 carbon atoms and optionally having an ether oxygen atom.)
TW099146289A 2009-12-28 2010-12-28 Photosensitive composition, partition, color filter and organic EL element (3) TWI483068B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009298961 2009-12-28

Publications (2)

Publication Number Publication Date
TW201129861A true TW201129861A (en) 2011-09-01
TWI483068B TWI483068B (en) 2015-05-01

Family

ID=44226556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099146289A TWI483068B (en) 2009-12-28 2010-12-28 Photosensitive composition, partition, color filter and organic EL element (3)

Country Status (5)

Country Link
JP (1) JP5682573B2 (en)
KR (1) KR101810702B1 (en)
CN (1) CN102656517B (en)
TW (1) TWI483068B (en)
WO (1) WO2011081151A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629561B (en) * 2012-02-07 2018-07-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, method for producing patterned cured film, and electronic component

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KR102156003B1 (en) 2012-09-24 2020-09-15 에이지씨 가부시키가이샤 Ink-repellent composition, negative photosensitive resin composition, hardened film, partition wall, and optical element
KR102107962B1 (en) * 2012-11-28 2020-05-07 에이지씨 가부시키가이샤 Negative photosensitive resin composition, cured resin film, partition wall and optical element
KR102306612B1 (en) 2014-01-31 2021-09-29 램 리써치 코포레이션 Vacuum-integrated hardmask processes and apparatus
US10796912B2 (en) 2017-05-16 2020-10-06 Lam Research Corporation Eliminating yield impact of stochastics in lithography
JP7230508B2 (en) * 2017-09-29 2023-03-01 東レ株式会社 Photosensitive resin composition, cured film, organic EL display provided with cured film, and method for manufacturing organic EL display
US11264437B2 (en) * 2018-05-14 2022-03-01 Samsung Display Co., Ltd. Display devices
KR102678588B1 (en) * 2018-11-14 2024-06-27 램 리써치 코포레이션 Methods for manufacturing useful hard masks in next-generation lithography
KR102731166B1 (en) 2018-12-20 2024-11-18 램 리써치 코포레이션 Dry development of resists
TW202514246A (en) 2019-03-18 2025-04-01 美商蘭姆研究公司 Method and apparatus for processing substrates
KR20210149893A (en) 2019-04-30 2021-12-09 램 리써치 코포레이션 Atomic Layer Etching and Selective Deposition Processes for Extreme Ultraviolet Lithography Resist Improvements
TWI869221B (en) 2019-06-26 2025-01-01 美商蘭姆研究公司 Photoresist development with halide chemistries
US11314168B2 (en) 2020-01-15 2022-04-26 Lam Research Corporation Underlayer for photoresist adhesion and dose reduction
WO2021173557A1 (en) 2020-02-28 2021-09-02 Lam Research Corporation Multi-layer hardmask for defect reduction in euv patterning
CN115004110A (en) 2020-07-07 2022-09-02 朗姆研究公司 Integrated drying process for patterning radiation photoresist
KR20250057101A (en) 2020-11-13 2025-04-28 램 리써치 코포레이션 Process tool for dry removal of photoresist
KR102725782B1 (en) 2022-07-01 2024-11-05 램 리써치 코포레이션 Cyclic phenomenon of metal oxide-based photoresists for etch stop deterrence
JP7769144B2 (en) 2023-03-17 2025-11-12 ラム リサーチ コーポレーション Integration of dry development and etching processes into a single process chamber for EUV patterning
CN119081444A (en) * 2024-08-30 2024-12-06 武汉柔显科技股份有限公司 Colorant dispersion, photosensitive resin composition and cured product

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JPH10142779A (en) * 1996-11-05 1998-05-29 Fuji Photo Film Co Ltd Photosensitive resin composition and photosensitive multilayer sheet
JP3856298B2 (en) * 2001-02-08 2006-12-13 富士フイルムホールディングス株式会社 Planographic printing plate precursor
JP4141120B2 (en) * 2001-08-16 2008-08-27 富士フイルム株式会社 Master for lithographic printing plate
JP2003228164A (en) * 2002-02-06 2003-08-15 Fuji Photo Film Co Ltd Original plate for planographic printing plate
JP4098550B2 (en) * 2002-04-15 2008-06-11 富士フイルム株式会社 Photosensitive resin composition and photosensitive transfer sheet
JP4068892B2 (en) * 2002-05-20 2008-03-26 富士フイルム株式会社 Image forming material
WO2004079454A1 (en) * 2003-03-07 2004-09-16 Asahi Glass Company Limited Photosensitive resin composition and cured coating film
CN100524021C (en) * 2003-03-07 2009-08-05 旭硝子株式会社 Photosensitive resin composition and coating film cured product thereof
JP4543886B2 (en) * 2003-11-14 2010-09-15 旭硝子株式会社 Method for forming partition of image display element
JP4513399B2 (en) * 2004-04-27 2010-07-28 旭硝子株式会社 Photosensitive resin composition and cured film thereof
US20060263720A1 (en) * 2005-05-11 2006-11-23 Fuji Photo Film Co., Ltd. Photosensitive lithographic printing plate
JP4725220B2 (en) * 2005-07-20 2011-07-13 凸版印刷株式会社 Ink-discharge printed matter and method for producing the same
JP2008202006A (en) * 2007-02-22 2008-09-04 Fujifilm Corp Fluorine-containing compound, resin composition, photosensitive transfer material, separation wall and formation method thereof, color filter and production method thereof, and display device
JP2008242273A (en) * 2007-03-28 2008-10-09 Fujifilm Corp Colored curable resin composition, colored pattern forming method, colored pattern, method for producing color filter, color filter, and liquid crystal display element
JP2008249867A (en) * 2007-03-29 2008-10-16 Fujifilm Corp Photosensitive resin composition, photosensitive transfer material, separation wall and method for forming the same, color filter and method for manufacturing the same, and display device
JP2009069589A (en) * 2007-09-14 2009-04-02 Fujifilm Corp Image forming method
JP5085342B2 (en) * 2008-01-11 2012-11-28 東京応化工業株式会社 Colored photosensitive resin composition
KR20100053476A (en) * 2008-11-12 2010-05-20 스미또모 가가꾸 가부시끼가이샤 Photosensitive black-colored resin composition, black matrix substrate, and manufacturing method of color filter
JP5574088B2 (en) * 2009-01-28 2014-08-20 Ｊｓｒ株式会社 Radiation sensitive resin composition, spacer for liquid crystal display element and method for forming the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629561B (en) * 2012-02-07 2018-07-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, method for producing patterned cured film, and electronic component
US10175577B2 (en) 2012-02-07 2019-01-08 Hitachi Chemical Company, Ltd. Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

Also Published As

Publication number Publication date
KR101810702B1 (en) 2017-12-19
WO2011081151A1 (en) 2011-07-07
KR20120124392A (en) 2012-11-13
CN102656517A (en) 2012-09-05
JPWO2011081151A1 (en) 2013-05-13
TWI483068B (en) 2015-05-01
JP5682573B2 (en) 2015-03-11
CN102656517B (en) 2014-05-14

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