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TW201127864A - Semiconductor-sealing epoxy resin composition and semiconductor device - Google Patents

Semiconductor-sealing epoxy resin composition and semiconductor device Download PDF

Info

Publication number
TW201127864A
TW201127864A TW099141489A TW99141489A TW201127864A TW 201127864 A TW201127864 A TW 201127864A TW 099141489 A TW099141489 A TW 099141489A TW 99141489 A TW99141489 A TW 99141489A TW 201127864 A TW201127864 A TW 201127864A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
group
semiconductor
semiconductor encapsulation
Prior art date
Application number
TW099141489A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroki Homma
Kanako Yanai
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of TW201127864A publication Critical patent/TW201127864A/zh

Links

Classifications

    • H10W74/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/3281—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W74/114—
    • H10W74/473—
    • H10W74/476—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW099141489A 2009-11-30 2010-11-30 Semiconductor-sealing epoxy resin composition and semiconductor device TW201127864A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009272513 2009-11-30

Publications (1)

Publication Number Publication Date
TW201127864A true TW201127864A (en) 2011-08-16

Family

ID=44066470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099141489A TW201127864A (en) 2009-11-30 2010-11-30 Semiconductor-sealing epoxy resin composition and semiconductor device

Country Status (2)

Country Link
TW (1) TW201127864A (ja)
WO (1) WO2011065365A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015188408A1 (zh) * 2014-06-12 2015-12-17 深圳市华星光电技术有限公司 一种覆晶薄膜基板及其制作方法和显示面板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5647012B2 (ja) * 2011-01-14 2014-12-24 株式会社Adeka ケイ素含有硬化性樹脂組成物
JP5762876B2 (ja) * 2011-08-03 2015-08-12 株式会社Adeka エポキシ樹脂用硬化剤、及び該エポキシ樹脂用硬化剤を含有するエポキシ樹脂組成物
EP2910588B1 (en) * 2012-10-19 2022-11-02 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, laminate and printed-wiring board
JP2018536064A (ja) * 2015-11-19 2018-12-06 ミリケン・アンド・カンパニーＭｉｌｌｉｋｅｎ ＆ Ｃｏｍｐａｎｙ アミンと環状シロキサン化合物との付加物
JP6829462B2 (ja) * 2017-02-21 2021-02-10 ナミックス株式会社 液状エポキシ樹脂封止材
EP4686727A1 (en) * 2024-08-02 2026-02-04 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2867471B2 (ja) * 1989-10-02 1999-03-08 東レ株式会社 樹脂組成物
US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
JP4365772B2 (ja) * 2004-11-26 2009-11-18 東亞合成株式会社 硬化性組成物
JP4831992B2 (ja) * 2005-04-08 2011-12-07 ヘンケルエイブルスティックジャパン株式会社 透光性樹脂組成物
TWI406879B (zh) * 2006-05-15 2013-09-01 納美仕有限公司 Ｃｏｆ安裝用密封劑、及使用該密封劑密封之半導體零件
JP5228426B2 (ja) * 2006-10-06 2013-07-03 日立化成株式会社 電子部品封止用液状樹脂組成物及びこれを用いた電子部品装置
JP5022755B2 (ja) * 2007-04-03 2012-09-12 ナミックス株式会社 半導体封止用エポキシ樹脂組成物、半導体装置およびその製造方法
JP5193685B2 (ja) * 2008-05-30 2013-05-08 ナミックス株式会社 Ｌｅｄ用導電性ダイボンディング剤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015188408A1 (zh) * 2014-06-12 2015-12-17 深圳市华星光电技术有限公司 一种覆晶薄膜基板及其制作方法和显示面板

Also Published As

Publication number Publication date
WO2011065365A1 (ja) 2011-06-03

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