201126660 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種微機械加工聲學元件封裝體，特 別有關於一種微機械加工微機電系統(MEMS)麥克風封裝 體及其製造方法。 【先前技術】 微機械加工石夕麥克風已揭露於許多的專利。例如，美BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micromachined acoustic component package, and more particularly to a micromachined microelectromechanical system (MEMS) microphone package and a method of fabricating the same. [Prior Art] Micromachined Shixi microphone has been disclosed in many patents. For example, beauty
國專利 US 5,619,476、US 5,87〇,35l、US 5,894,452、及 US 6,493,288揭露一種電谷型超音波傳感器（transducer)的製造 方法。再者’美國專利 US 5,146,435、US 5,452,268、US 6,535,460、及US 6,870,937揭露一種微機械加工電容型傳 感器’其主要用於聲音的擷取。然而，於上述專利中，主 要的發明技術特徵皆專注於微機械加工麥克風晶片的設計 與製造。易言之，上述發明技術特徵皆專注於麥克風的晶 圓級製程。 對於應用於任意型式電子裝置的麥克風而言，需要提 供適當的外罩構件，使得社麥克風晶片能儲置於一適合 的封裝件中’以避免其受到環境的干擾。較佳地，此外罩 構件結構亦可賴碎克風的感測構件，隔離外部的電磁 干擾。再者’該封裝的麥克風需要接觸導腳，使得該接觸 導腳能錫焊於使闕麥克風的—電子板上。最後，將封裝 的方法應用於麥克風必須符合低成本要件並且允許大量生 產的要件。 相較於傳統的駐極體麥克風(deetm ，微 機械加工# MEMS麥克風的優點焊 forlO-OOOl/ 0958-A42494TW/fmal 201126660 (re-flow)溫度。因此，為了降低電子產品的封裝成本，該 微機械加工的MEMS麥克風的縣型式是允許將麥克風^ 面封裝於一印刷電路板(PCB)上。A method of manufacturing an electric valley type ultrasonic transducer is disclosed in U.S. Patent Nos. 5,619,476, 5,87, 35, 5,894,452, and 6,493,288. Further, U.S. Patent Nos. 5,146,435, 5,452,268, 6,535,460, and 6,870,937 disclose a micromachined capacitive sensor' which is primarily used for sound extraction. However, in the above patents, the main inventive features are focused on the design and manufacture of micromachined microphone wafers. In other words, the above technical features of the invention are all focused on the crystal-level process of the microphone. For microphones used in any type of electronic device, it is desirable to provide a suitable cover member so that the social microphone wafer can be stored in a suitable package' to avoid environmental interference. Preferably, the cover member structure can also rely on the smashing sensing member to isolate external electromagnetic interference. Furthermore, the packaged microphone needs to be in contact with the lead pin so that the contact pin can be soldered to the electronic board of the microphone. Finally, applying the method of encapsulation to the microphone must meet the requirements of low cost and allow for mass production. Compared with the traditional electret microphone (deetm, micromachined # MEMS microphone has the advantage of welding forlO-OOOl/ 0958-A42494TW/fmal 201126660 (re-flow) temperature. Therefore, in order to reduce the packaging cost of electronic products, the micro The county version of the machined MEMS microphone allows the microphone to be packaged on a printed circuit board (PCB).
許多用於MEMS麥克風的封裝方法已揭露於習知 中。美國專利US 6,781，23卜其整體内容在此引為參 料’揭露一種微機電系統⑽Ms)封裝體包括_ μεμ§麥 克風、-基板、及-封蓋。該基板具有-表面，支撐該__ 麥克風。該封蓋包括-導電層，其具有—中央部分藉由一 週邊邊緣料減。-外㈣件的構成藉由連接該封蓋的 週邊邊緣部分至該基板。贿蓋㈣央部分與該基板的表 面之間隔離-空間，以容納該MEMS麥克風。該外罩構件 包括-聲學槔（acoustic port)，允許—聲學訊號抵達該 MEMS麥克風。美國專利申請早期公開us細讎嶋， 其整體内容在此引為參考㈣，揭露式麥 裝體f —傳感器單元一基板、及—封蓋。該基板包括 二上表面’具有—凹人於其内部。該傳感器衫貼附於該 基板的上表面上，並讀該以的至少—部分重疊，盆中 該傳感II單元具有-背部體積形成於該傳感器單元與該基 板之間。該封蓋設置於該傳感器單^上方並包括一開孔。 美國專利US 7,434,305,其整體内容在此引為參考資 料2露—種㈣容式麥克風封㈣包括-傳感器單元、 二基板、及-封蓋。該基板包括—上表面，具有一凹入於 其内部。該傳感器單元貼附於該基板的上表面上，並且盘 該凹入的至少-部分重疊，其中該傳感器單元具有一背部 體積形成於該傳感器單元與該基板之間。 forlO-OOOl/ 〇95S-A42494TW/fmal 5 封蓋置於該 201126660 傳感器單元上方並包括一開孔。 美國專利7,439,616,其整體内容在此引為 揭露一種梦雷玄-V’來古丄L 亏貝料’ 冤谷式麥克風封裝體包括一傳感器單亓 ^ 板、及-封蓋。該基板包括一上表面 …基Many packaging methods for MEMS microphones have been disclosed. U.S. Patent No. 6,781,23, the entire disclosure of which is incorporated herein by reference in its entirety, the disclosure the disclosure the disclosure the disclosure the disclosure the disclosure disclosure disclosure The substrate has a surface that supports the __ microphone. The cover includes a conductive layer having a central portion that is reduced by a peripheral edge. The outer (four) member is constructed by joining the peripheral edge portion of the cover to the substrate. The bribe cover (4) is isolated from the surface of the substrate and the space to accommodate the MEMS microphone. The cover member includes an acoustic port that allows the acoustic signal to reach the MEMS microphone. U.S. Patent Application Serial No. 5, the entire disclosure of which is incorporated herein by reference. The substrate includes two upper surfaces 'having a concave person inside thereof. The sensor shirt is attached to the upper surface of the substrate and is read to at least partially overlap, the sensing II unit having a back volume formed between the sensor unit and the substrate. The cover is disposed above the sensor unit and includes an opening. U.S. Patent No. 7,434,305, the entire disclosure of which is incorporated herein by reference in its entirety in its entirety in the the the the the the the The substrate includes an upper surface having a recessed therein. The sensor unit is attached to the upper surface of the substrate, and the recesses are at least partially partially overlapped, wherein the sensor unit has a back volume formed between the sensor unit and the substrate. The forlO-OOOl/ 〇95S-A42494TW/fmal 5 cover is placed over the 201126660 sensor unit and includes an opening. U.S. Pat. The substrate includes an upper surface
於該基板的上表面上，並且與該凹人的至少附 其中該傳感器單元具有-背部_形成於該傳感器單=與 該基板之間1封蓋設置於該傳感器單元上方，並且該^ 板或該封蓋的其中之一包括一開孔。 V 上述的封裝方法提供一矽電容式麥克風封裝體，其允 許聲學能量接觸設置於外罩内的該傳感器單元。該外罩提 供一必需的壓力參考值，而在此同時，又能保護該傳感器 避免光、電磁干擾及物理性損傷。然而，所述封裝方法未 能解決該麥克風封裝體於使用上或組裝上的關鍵性觀點。 部分的觀點包括，但ji不限定於，透過該麥克風封裝體的 側壁及/或封蓋的聲學漏失’安全地將麥克風貼附於一位於 下層的PCB母板，屏蔽電磁干擾的有效性，自該麥克風封 裝體至下層的PCB母板的電子訊號傳輸失真，一封裝的麥 克風於表面封裝的可換曲性’以及大量生產的製造容易度 等。 【發明内容】 根據本發明之一實施例’一種微機電系統(MEMS)麥克 風封裝體包括：一具有一導電部件的外罩’設置於一基板 上，以構築成一空穴；一 MEMS感測元件和一 1C晶片設 置於該空穴内部；〆聲孔包括一傳聲通道連接該空六與一 外部空間；一第一接地墊，設置於該基板的背面’通過該 forl0-0001/ 0958-A42494TW/final 6 201126660 基板内的一穿孔連接該外罩的該導電部件；以及一第二接 地墊，設置於該基板的背面，通過該基板内的一内連線連 接該MEMS感測元件或該Ic晶片；其中該第一接地墊和 該第二接地墊彼此相互隔離。 根據本發明另一實施例，一種微機電系統(MEMS)麥克 風封裝體的製造方法，包括：提供一基板；形成一 meMS 感測元件和一 1C晶片於該基板上；接合一具有一導電部件 的外罩於該基板上，環繞構成一空穴以容納該MEMS感測 元件和該1C晶片；形成一聲孔包括一傳聲通道連接該空穴 與一外部空間；通過該基板内的一穿孔，連接該外罩的該 導電部件到設置於該基板背面的一第一接地墊；以及通過 該基板内的一内連線，連接該MEMS感測元件或該IC晶 片到設置於該基板背面的一第二接地墊；其中該第一接地 塾和該第二接地塾彼此相互隔離。 為使本發明能更明顯易懂，下文特舉實施例，並配合 所附圖式，作詳細說明如下： 【實施方式】 以下以各實施例詳細說明並伴隨著圖式說明之範例， 做為本發明之參考依據。在圖式或說明書描述中，相似或 相同之部分皆使用相同之圖號。且在圖式中，實施例之形 狀或是厚度可擴大，並以簡化或是方便標示。再者，圖式 中各兀件之部分將以分別描述說明之，值得注意的是，圖 中未繪示或描述之元件，為所屬技術領域中具有通常知識 者所知的形式，另外，特定之實施例僅為揭示本發明使用. 之特定方式，其並非用以限定本發明。 forlO-0001/ 0958-A42494TW/final 201126660 本發明實施例的主要技術特徵及關鍵樣態提供— MEMS麥克風封裝體具有—導電外罩，其電性連接至—支 樓=CB母板的共同類比接地導腳，以屏蔽—感測元件，隔 離環境和電磁干擾。於-實施例中，— MEMS麥克風封裝 體在-麥克風封裝體和-支撐的pCB基板之間具有很強^ 鍵結’基於導t外罩和該核的pCB基板之_連接。本 發明之實施例亦提供一 MEMS麥克關裝體，對於封裝和 組裝製程中所發生雜擾動具足_承受能力。本發明的 MEMS麥克風封裝體的其他實施例更強化聲學訊號的傳輸 至-感測器構件’該感測器構件設置於該封裝體内。On the upper surface of the substrate, and at least the sensor unit of the recessed person has a - back_ formed between the sensor unit = and the substrate 1 is disposed above the sensor unit, and the board or One of the covers includes an opening. V The above packaging method provides a tandem condenser microphone package that allows acoustic energy to contact the sensor unit disposed within the housing. The enclosure provides a necessary pressure reference while protecting the sensor from light, electromagnetic interference and physical damage. However, the packaging method does not address the critical point of view of the microphone package in use or assembly. Some of the views include, but are not limited to, the acoustic leakage through the sidewalls of the microphone package and/or the cover 'safely attach the microphone to a lower-layer PCB motherboard to shield the effectiveness of electromagnetic interference. The electronic signal transmission distortion of the microphone package to the lower PCB mother board, the switchability of a packaged microphone to the surface package, and the ease of manufacture of mass production. SUMMARY OF THE INVENTION According to one embodiment of the present invention, a microelectromechanical system (MEMS) microphone package includes: a cover having a conductive member disposed on a substrate to form a cavity; a MEMS sensing component and A 1C chip is disposed inside the cavity; the sound hole comprises a sound channel connecting the space 6 and an external space; a first ground pad is disposed on the back side of the substrate through the forl0-0001/ 0958-A42494TW/ Final 6 201126660 a through hole in the substrate is connected to the conductive member of the cover; and a second ground pad is disposed on the back surface of the substrate, and the MEMS sensing element or the Ic chip is connected through an interconnect in the substrate; The first ground pad and the second ground pad are isolated from each other. According to another embodiment of the present invention, a method of fabricating a microelectromechanical system (MEMS) microphone package includes: providing a substrate; forming a meMS sensing element and a 1C chip on the substrate; bonding a portion having a conductive member The cover is disposed on the substrate to form a cavity to receive the MEMS sensing component and the 1C wafer; forming a sound hole including a sound channel connecting the cavity and an external space; connecting the hole through a through hole in the substrate Connecting the conductive member of the cover to a first ground pad disposed on the back surface of the substrate; and connecting the MEMS sensing element or the IC chip to a second ground disposed on the back surface of the substrate through an interconnect in the substrate a pad; wherein the first grounding bar and the second grounding bar are isolated from each other. The present invention will be described in detail below with reference to the accompanying drawings, in which: FIG. Reference basis of the present invention. In the drawings or the description of the specification, the same drawing numbers are used for similar or identical parts. In the drawings, the shape or thickness of the embodiment may be expanded and simplified or conveniently indicated. In addition, the parts of the drawings will be described separately, and it is noted that elements not shown or described in the drawings are known to those of ordinary skill in the art, and The embodiments are merely illustrative of specific ways in which the invention may be used, and are not intended to limit the invention. ForlO-0001/ 0958-A42494TW/final 201126660 The main technical features and key aspects of the embodiments of the present invention provide that the MEMS microphone package has a conductive outer cover electrically connected to the common analog grounding conductor of the branch building = CB motherboard. Foot to shield-sense components, isolate the environment and electromagnetic interference. In an embodiment, the MEMS microphone package has a strong bond between the microphone package and the -supported pCB substrate based on the connection of the t-shell and the pCB substrate of the core. Embodiments of the present invention also provide a MEMS mic-attachment that is capable of withstanding the disturbances that occur in the packaging and assembly process. Other embodiments of the MEMS microphone package of the present invention further enhance the transmission of acoustic signals to the sensor member. The sensor member is disposed within the package.
本發明的目前及其他目的可藉由以下實施例達成，一 2封裝的MEMS麥克風封裝體包括一傳感器構件、- IC :二槿ίΓ;動元件藉由—基板支撐，並儲置於由該基 板所構成的一空穴中。一眩眺 基板上。侧蓋糾牆。卩件和—職部件設置於該 抿達、 聲孔以允許一聲學訊號穿透並 抵達一 MEMS感測構件的一 ^ 蓋部件堆疊魏結成為°職板、隔牆部件和頂 六最小化地改變該MEMS^以形成一空穴於其中，該空 電外星III造对也* 感測構件的聲學響應《提供一導 著挺极風封装體的隔牆部件和頂蓋部件。接 者，提供一聲學吸收;bi·射 1 ^按 風封裝體的隔’並夾置於料電外罩與該麥克 牆梅頂蓋部件之間。該導電外 於支撐该麥克風封裝體的診 位於m PCB基板上，並且電性連接至 表CB母板上的1同類比接地 該麥可風與環境干擾及電磁干擾隔離。 ^〇〇21^ ' 201126660 同的MEMS麥克風的封裝方法。本發明實施㈣mems 麥克風的封裝體兼具聲學地聲音以及可大量生產性。本發 明的Μ藝麥克風可視為一獨立的裝置以及一積體化的構 件。在完成封裝後，根據本發明部分實施例的封裝方法可 最小化地改變該麥克風的聲學響t與此同時，根據本發 明部分實_的封裝方法可提供從該封裝的麥克風至貼附 的PCB母板的最小化地傳輸電性訊號失真。才艮據本發明其 他實施例的麥克風封裝體提供—機械的屏蔽，以隔離環境 與電磁干擾。 請參閱第1A圖，根據本發明之一實施例的MEMS麥 克風封裝體l〇〇a包括一基板1〇，— MEMS聲學感測裝置 3、一 1C晶片4、及被動元件5封裝於基板1〇上。一聲學 空穴6由基板10、隔踏部件20及一頂蓋部件4〇所構成。 所述隔牆部件20和頂蓋部件40設置並貼附於基板1〇上， 藉由一膠合材料30塗佈於基板1〇與隔牆部件2〇之間，以 及隔牆部件20與頂蓋部件40之間。所述隔牆部件2〇的高 度足夠高，致使於MEMS聲學感測裝置3的頂表面與頂蓋 部件40之間具有足夠的間隔11。接著，將焊墊2形成於 基板10的底部，使所述MEMS麥克風封裝體得以表面黏 著於PCB母板70上。所述基板1〇可由FR_4材料製成， 使得基板10與PCB母板70的熱性質匹配。所述頂蓋部件 4〇具有一聲孔1A ’能允許聲學訊號傳輪穿透，以抵達 MEMS聲學感測裝置3的表面。於一實施例中，聲孔 形成於並延伸穿透該頂蓋部件40。此聲孔ία包括傳聲通 道17連接所述空穴與外部空間。可選定聲孔ιΑ的位置使 f〇rl0-〇〇〇i/ 〇958-A42494TW/fmal 9 201126660 其遠離感測裝置3，以避免其受到灰塵落入及濕氣侵入， 例如從人類口中發出，抵達感測裝置3的表面。 再請參閱第1A圖，一導電外罩50包圍且環繞所述麥 克風封裝體。於一實施例中，一額外的聲孔15形成於所述 導電外罩50中且與聲孔1A對準，.使得聲學訊號得以通過 該聲孔。一聲學吸收層60夾置於隔牆部件20及/或頂蓋部 件40與導電外罩5〇之間的位置。所述導電外罩50並非直 接連接至麥克風封裝體的類比或數位接地導腳。所述導電 外罩50而是藉由焊接墊52電性連接至一 PCB母板上的共 同類比接地導腳。 所述導電外罩50是由金層或其他導電材料所構成，而 隔牆部件20及頂蓋部件40 —般是由塑膠材料或FR-4材料 構成，以達電性絕緣的目的。所述聲學吸收層60可包括泡 棉、軟木、海綿、橡膠、或噴佈矽膠塗層。 根據本發明的另一實施例’提供一 MEMS麥克風封裝 體的製造方法。所述製造方法包括下列步驟：提供一基板， 形成一空穴，所述空穴是由一頂蓋部件、一隔牆部件、及 一基板所包圍，其中所述隔牆部件環繞且支撐頂蓋部件以 及所述基板支撐頂蓋部件和隔牆部件。將一 MEMS感測元 件和一 1C晶片形成於空穴的内部。接著，形成一聲孔包括 -傳聲通道連接所述空穴與外部空間，以及形成—導電外 罩包圍頂蓋部件和隔牆部件。將所述導電外罩錫焊於—印 刷電路板上並且電性連接至_共同類比接地導腳位於印刷 電路板上。 第1B圖係顯讀據本發明另-實施㈣MEMS麥克 forlO-OOOl/ 0958-A42494TW/fmal 201126660 風封裝體的剖面示意圖。於第1B圖中，一 MEMS麥克風 封裝體100b包括一具有一導電部件的外罩150a，設置於 一基板10 (亦通稱為一 MIC基板)上，以構築成一空穴Η。 所述外罩150a為一整體的金屬外罩，通過一導電膠30貼 附於所述基板1〇上。一 MEMS感測元件3、一 1C晶片4 及至少一被動元件5設置於所述空穴11的内部。一聲孔 包括一傳聲通道連接所述空穴11與一外部空間。一第 一接地墊130 (亦通稱為一類比接地墊)設置於基板1〇的背 面’通過基板10内部的一穿孔120 (亦通稱為一穿矽導孔 TSV)連接所述外罩150a的導電部件。一第二接地墊14〇(亦 通稱為一數位接地墊)設置於所述基板10的背面，通過基 板10内部的一内連線160或重新分佈線(RDL)連接所述 MEMS感測元件3或1C晶片4，其中所述第一接地墊130 和第二接地墊140彼此相互隔離。由於數位訊號和環境的 干擾分別藉由不同的接地墊隔離，因此可有效地降低串音 效應及電磁干擾(EMI)雜訊。有鑑於此，最終被MEMS麥 克風封裝體100b接收的是乾淨且清楚的聲音訊號。 於一實施例中’可進一步將所述基板1〇焊接於一 PCB 母板70 (亦通稱為一 pCB系統板)上，其中所述第一接地墊 130和第二接地墊14〇焊接至PCb母板70上的一共同接地 墊Π0。於另一實施例中，所述基板10焊接在PCB母板 70上，其中所述第一接地墊13〇和第二接地墊14〇分別焊 接至所述PCB母板70上不同的接地墊。基板1〇背面的其 他接觸墊135分別地焊接在所述pCB母板7〇上的對應的 接觸墊175。 forl0-0001/ 0958-A42494TW/fmal 11 201126660 第ic圖係顯示根據本發明另—實施例的mems麥克 風封裝體的剖面示意圖。於第1C圓中’- MEMS麥克風 封裝體100c包括一具有—導電部件的外罩^働，設置於 一基板1〇(亦通稱為，基板)上，以構築成一空穴"。 所述外罩15Gb為—多層外罩，通過—導電膠％貼附於所 述基板上。所述多層外罩l5Qb可包括一頂蓋部件155 和-牆部件153環繞且支樓該頂蓋部件。於另一實施例 中，所述多層外罩包括一導電層154，夹置於兩層非導電 層152和156之間。應注意的是，所述多層外罩可更包括 -聲學吸收層襯塾於該多層外I的裡層。一湖泌感測元 件3、一 1C晶片4及至少一被動元件5設置於所述空穴u 的内部。-聲孔1A包括一傳聲通道連接所述空穴u與一 外部空間。-第-接地墊13〇 (亦通稱為一類比接地塾)設 置於基板10的背面，通過基板1〇内部的一穿孔12〇 (亦通 稱為-穿石夕導孔tsv)連接所述外罩15〇b的導電部件… 第二接地墊140 (亦通稱為一數位接地墊)設置於所述基板 10的背面，通過基板1〇内部的一内連線16〇或重新分佈 線(RDL)連接所述MEMS感測元件3或1C晶片4，其中所 述第一接地墊130和第二接地墊丨4〇彼此相互隔離。 於一實施例中，可進一步將所述基板1〇焊接於一 pCB 母板70 (亦通稱為一 PCB系統板)上，其中所述第一接地墊 130和第二接地墊140焊接至pCB母板70上的一共同接地 墊170。於另一實施例中，所述基板10焊接在pCB母板 70上’其中所述第一接地墊13〇和第二接地墊14〇分別焊 接至所述PCB母板70上不同的接地墊。基板1〇背面的其 for10-0001/ 0958-A42494TW/fmal 12 201126660 他接觸墊135分別地焊接在所述 PCB母板7〇上的 接觸墊175。 '應的 一麥克風封裝體並無附加外罩50的實施範例，如 圖所示。該隔牆部件2〇係典型地與該基板1〇和頂2A 4〇以黏結勝成一體。另可替換地，例如當*用塑=件 為隔牆部件20及頂蓋部件4〇時，所述隔牆部件扣血料， 部件40可形成而成為一整合的單一封蓋4〇,如第頂蓋 φ 不。此單一封蓋40在藉由一黏結膠貼附於該基板1〇圖所 當進行製造時，該頂蓋部件4〇、隔牆部件2〇及基板上。 疊層於一體。於此實施例中，則黏結膠3〇為—疊10可 介，可將所述頂蓋部件4〇黏接至隔牆部件2〇， 的媒 接至基板10。 療、，再黏 所述頂蓋部件40與隔牆部件2〇可為一單層的材 例如塑膠，或者多層的材料，例如FR_4材料。於任和料， 情況下，都不需要失置一導電材料層於多層材料之^種 • 蓋部件40與隔牆部件20所需要的條件是由其形成 ^ 的空間足夠大，使其足以納入MEMS感測裝置 .I孔八 件5和1C晶片4。然而，較佳的是，該頂蓋部件奶與: 隔牆部件20具有咼的聲學阻抗(acoustjc impedance)。 第3圖係顯示根據本發明之一實施例的導電外罩50頂 視示意圖。一穿孔1A穿透該導電外罩50，使得一聲壓波 (acoustic pressure wave)得以傳輸穿過。該導電外罩50具有 一頂表面53和一邊緣軌51，典型地是由金屬板製程，例 如鋁板或其他導電材料。該導電外罩50亦可由多層材料所 製成。然而，無論何種情況，必須至少其中一層具有導電 forlO-OOOl/ 〇958-A42494TW/final ,, 201126660 性。第4圖係顯示根據本發明另一實施例的導電外罩50頂 視示意圖。於此，所述邊緣軌51為非連續性的，然而其仍 然是由與該導電外罩50的頂表面53相同的材料製成。 第5圖係顯示由第3圖的麥克風封裝體沿A-A’切割線 方向的剖面示意圖。該聲學吸收層60可塗佈於該導電外罩 50的内部表面。在該邊緣軌51的底部，設置一銲錫墊52 以將整個導電外罩50密封地貼附於該PCB母板70上，如 第1圖所示。該銲錫墊52為電性的導體，因此使得該導電 外罩50電性連接至一共同類比接地導腳70位於印刷電路 板上。如同先前所強調，該聲學吸收層60可包括泡棉、軟 木、海綿、橡膠、或喷佈矽膠塗層。為了組裝上的方便， 該聲學吸收層60可先貼附於該導電外罩50上，如同圖第 5圖所示。 上述麥克風封裝體所面臨的一大議題為其屏蔽不想要 的聲學雜訊的能力。這些雜訊有時會由該麥克風封裝體的 隔牆部件和頂蓋部件漏出，而抵達該感測裝置。可考慮另 一實施例的多層板以解決此問題，如第6圖所示。當一正 向平面波入射時，一穿透係數(transmission coefficient)可表 示為： T _ mum22 — mi2m2i 其中； τητ«-Γ.·το 川u mu 爪21爪22 forlO-OOOl/ 0958-A42494TW/final 14 201126660 \ 1 + eKK-k^)dn , Γ »+1 η e ,KK^+i)d„ η € w+1 1 + -^-The present and other objects of the present invention can be achieved by the following embodiments. A 2-packaged MEMS microphone package includes a sensor member, an IC component, and a movable component is supported by the substrate and stored on the substrate. In a cavity formed. A glare on the substrate. Side cover to correct the wall. The component and the component are disposed on the stencil, the sound hole to allow an acoustic signal to penetrate and reach a MEMS sensing component, and the cover component is stacked to become a target, a partition component, and a top six The MEMS is modified to form a cavity therein, and the acoustical response of the air-powered alien III to the sensing member provides a partition member and a top member that guide the wind-extinguishing package. The receiver provides an acoustic absorption; the bi-projection 1 ^ is placed between the electrical enclosure and the jacket wall cover member. The conductive externally supports the microphone package on the m PCB substrate, and is electrically connected to the same type of grounding on the motherboard of the CB. The microphone is isolated from environmental interference and electromagnetic interference. ^〇〇21^ ' 201126660 The same MEMS microphone packaging method. The present invention implements (4) the package of the mems microphone has both acoustic sound and mass productivity. The cymbal microphone of the present invention can be viewed as a separate device and as an integrated component. After the packaging is completed, the packaging method according to some embodiments of the present invention can minimize the acoustic response of the microphone. At the same time, the packaging method according to the present invention can provide a microphone from the package to the attached PCB. The motherboard minimizes the transmission of electrical signal distortion. The microphone package according to other embodiments of the present invention provides mechanical shielding to isolate the environment from electromagnetic interference. Referring to FIG. 1A, a MEMS microphone package 10a according to an embodiment of the present invention includes a substrate 1A, a MEMS acoustic sensing device 3, a 1C wafer 4, and a passive component 5 packaged on the substrate 1A. on. An acoustic cavity 6 is composed of a substrate 10, a spacer member 20, and a top cover member 4''. The partition member 20 and the top cover member 40 are disposed and attached to the substrate 1 , and are coated between the substrate 1 〇 and the partition member 2 藉 by a bonding material 30 , and the partition member 20 and the top cover Between parts 40. The height of the partition member 2 is sufficiently high that there is sufficient spacing 11 between the top surface of the MEMS acoustic sensing device 3 and the cap member 40. Next, a solder pad 2 is formed on the bottom of the substrate 10 to allow the MEMS microphone package to be surface-attached to the PCB mother board 70. The substrate 1 can be made of FR_4 material such that the substrate 10 matches the thermal properties of the PCB mother board 70. The top cover member 4 has an acoustic hole 1A' that allows the acoustic signal transmission to penetrate to reach the surface of the MEMS acoustic sensing device 3. In one embodiment, the acoustic aperture is formed in and extends through the cap member 40. This sound hole ία includes a sound transmission path 17 connecting the cavity and the external space. The position of the sound hole ιΑ can be selected such that f〇rl0-〇〇〇i/〇958-A42494TW/fmal 9 201126660 is moved away from the sensing device 3 to prevent it from being infiltrated by dust and moisture, for example, from a human mouth. The surface of the sensing device 3 is reached. Referring again to Figure 1A, a conductive outer cover 50 surrounds and surrounds the microphone package. In one embodiment, an additional acoustic aperture 15 is formed in the conductive housing 50 and aligned with the acoustic aperture 1A to allow acoustic signals to pass through the acoustic aperture. An acoustic absorbing layer 60 is interposed between the partition member 20 and/or the top cover member 40 and the conductive outer casing 5''. The conductive housing 50 is not an analog or digital grounding pin that is directly connected to the microphone package. The conductive cover 50 is electrically connected to a common grounding lead on a PCB motherboard by solder pads 52. The conductive outer cover 50 is composed of a gold layer or other conductive material, and the partition member 20 and the top cover member 40 are generally made of a plastic material or an FR-4 material for electrical insulation purposes. The acoustic absorbing layer 60 may comprise a foam, cork, sponge, rubber, or spray coating. A method of fabricating a MEMS microphone package is provided in accordance with another embodiment of the present invention. The manufacturing method includes the steps of: providing a substrate to form a cavity, the cavity being surrounded by a top cover member, a partition member, and a substrate, wherein the partition member surrounds and supports the cover member And the substrate supports the top cover member and the partition wall member. A MEMS sensing element and a 1C wafer are formed inside the cavity. Next, forming a sound hole includes - a sound path connecting the cavity and the outer space, and forming a conductive outer cover surrounding the top cover member and the partition member. The conductive cover is soldered to the printed circuit board and electrically connected to the common analog ground lead on the printed circuit board. FIG. 1B is a cross-sectional view of a wind package according to the present invention. (IV) MEMS microphone forlO-OOOl/ 0958-A42494TW/fmal 201126660. In FIG. 1B, a MEMS microphone package 100b includes a cover 150a having a conductive member disposed on a substrate 10 (also referred to as a MIC substrate) to form a cavity. The outer cover 150a is an integral metal cover attached to the substrate 1 by a conductive adhesive 30. A MEMS sensing element 3, a 1C wafer 4 and at least one passive element 5 are disposed inside the cavity 11. A sound hole includes a sound transmission channel connecting the cavity 11 and an external space. A first ground pad 130 (also commonly referred to as an analog ground pad) is disposed on the back surface of the substrate 1'. The conductive member of the outer cover 150a is connected through a through hole 120 (also referred to as a through-via via TSV) inside the substrate 10. . A second ground pad 14 (also referred to as a digital ground pad) is disposed on the back surface of the substrate 10, and the MEMS sensing element 3 is connected through an interconnect 160 or a redistribution line (RDL) inside the substrate 10. Or a 1C wafer 4, wherein the first ground pad 130 and the second ground pad 140 are isolated from each other. Since the digital signal and the environmental interference are separated by different ground pads, the crosstalk effect and electromagnetic interference (EMI) noise can be effectively reduced. In view of this, the MEMS microphone package 100b is finally received with a clean and clear sound signal. In an embodiment, the substrate 1 can be further soldered to a PCB motherboard 70 (also commonly referred to as a pCB system board), wherein the first ground pad 130 and the second ground pad 14 are soldered to the PCb. A common ground pad Π0 on the motherboard 70. In another embodiment, the substrate 10 is soldered to the PCB mother board 70, wherein the first ground pad 13A and the second ground pad 14'' are respectively soldered to different ground pads on the PCB motherboard 70. Other contact pads 135 on the back side of the substrate 1 are soldered to corresponding contact pads 175 on the pCB motherboard 7A, respectively. Forl0-0001/ 0958-A42494TW/fmal 11 201126660 The ic diagram shows a cross-sectional view of a MEMS microphone package according to another embodiment of the present invention. In the 1Cth circle, the MEMS microphone package 100c includes a cover having a conductive member disposed on a substrate 1 (also referred to as a substrate) to form a cavity. The outer cover 15Gb is a multi-layer outer cover attached to the substrate by a conductive adhesive. The multi-layer outer cover 15Qb may include a top cover member 155 and a wall member 153 surrounding and supporting the top cover member. In another embodiment, the multilayer housing includes a conductive layer 154 sandwiched between two layers of non-conductive layers 152 and 156. It should be noted that the multilayer outer cover may further comprise an acoustic absorbing layer lining the inner layer of the outer layer I. A lake sensing element 3, a 1C wafer 4 and at least one passive component 5 are disposed inside the cavity u. The sound hole 1A includes a sound transmission path connecting the cavity u with an external space. a first ground pad 13 〇 (also referred to as an analog ground 塾) is disposed on the back surface of the substrate 10, and the outer cover 15 is connected through a through hole 12 〇 (also commonly referred to as a through-hole guide hole tsv) inside the substrate 1 . Conductive member of 〇b... The second ground pad 140 (also commonly referred to as a digital ground pad) is disposed on the back surface of the substrate 10 through an interconnect 16 〇 or redistribution line (RDL) inside the substrate 1 所The MEMS sensing element 3 or the 1C wafer 4, wherein the first ground pad 130 and the second ground pad 4 are isolated from each other. In one embodiment, the substrate 1 can be further soldered to a pCB motherboard 70 (also commonly referred to as a PCB system board), wherein the first ground pad 130 and the second ground pad 140 are soldered to the pCB mother. A common ground pad 170 on board 70. In another embodiment, the substrate 10 is soldered to the pCB motherboard 70, wherein the first ground pad 13 and the second ground pad 14 are soldered to different ground pads on the PCB motherboard 70, respectively. The back surface of the substrate 1 is for10-0001/0958-A42494TW/fmal 12 201126660. The contact pads 135 are respectively soldered to the contact pads 175 on the PCB mother board 7''. A preferred embodiment of a microphone package does not have an additional cover 50, as shown. The partition member 2 is typically integrally bonded to the substrate 1A and the top 2A. Alternatively, for example, when the plastic member is the partition member 20 and the top member 4, the partition member is buckled, and the member 40 can be formed into an integrated single cover, such as The top cover φ does not. The single cover 40 is manufactured by attaching a bonding tape to the substrate 1 to be used for the top cover member 4, the partition member 2, and the substrate. Laminated in one. In this embodiment, the adhesive layer 3 is a stack of 10, and the cover member 4 is bonded to the partition member 2, and the medium is bonded to the substrate 10. The top cover member 40 and the partition member 2 can be a single layer of material such as plastic or a multilayer material such as FR_4 material. In any case, there is no need to lose a layer of conductive material to the multilayer material. • The conditions required for the cover member 40 and the partition member 20 are such that the space formed by it is large enough to be incorporated. MEMS sensing device. I hole eight pieces of 5 and 1C wafer 4. Preferably, however, the cap member milk and: the partition member 20 have an acoustic impedance. Figure 3 is a schematic top view showing a conductive outer cover 50 in accordance with an embodiment of the present invention. A perforated 1A penetrates the conductive outer cover 50 so that an acoustic pressure wave is transmitted therethrough. The conductive outer cover 50 has a top surface 53 and an edge rail 51, typically fabricated from sheet metal, such as an aluminum sheet or other electrically conductive material. The conductive outer cover 50 can also be made of multiple layers of material. However, in any case, at least one of the layers must have conductive forlO-OOOl/〇958-A42494TW/final, 201126660. Fig. 4 is a schematic top view showing a conductive outer cover 50 according to another embodiment of the present invention. Here, the edge rail 51 is discontinuous, however it is still made of the same material as the top surface 53 of the conductive outer cover 50. Fig. 5 is a schematic cross-sectional view showing the direction in which the microphone package of Fig. 3 is cut along the line A-A'. The acoustic absorbing layer 60 can be applied to the inner surface of the conductive outer cover 50. At the bottom of the edge rail 51, a solder pad 52 is provided to sealingly attach the entire conductive housing 50 to the PCB mother board 70, as shown in Fig. 1. The solder pad 52 is an electrical conductor such that the conductive housing 50 is electrically connected to a common analog ground lead 70 on the printed circuit board. As previously emphasized, the acoustic absorbing layer 60 can comprise a foam, cork, sponge, rubber, or spray coating. For ease of assembly, the acoustic absorbing layer 60 can be attached to the conductive outer cover 50 as shown in Fig. 5. One of the major issues facing the above-described microphone package is its ability to shield unwanted acoustic noise. These noises sometimes leak from the partition wall components and the top cover components of the microphone package and reach the sensing device. A multilayer board of another embodiment can be considered to solve this problem, as shown in Fig. 6. When a forward plane wave is incident, a transmission coefficient can be expressed as: T _ mum22 — mi2m2i where; τητ«-Γ.·το 川u mu claw 21 claw 22 forlO-OOOl/ 0958-A42494TW/final 14 201126660 \ 1 + eKK-k^)dn , Γ »+1 η e ,KK^+i)d„ η € w+1 1 + -^-
M+1 y ^ "»+i ； 」M+1 y ^ "»+i ; ”
界面的位置，:如抗’ t=WCw為第nth層的波數，以及A為 可表示如下.〇第6圖所示。就黏彈體材料而言，所述C c = ( 3G^(@) + 4Gc (ώ) γ2 其中，G l ^Pn —, ' 和分別表示複數的體模數和剪模數0 則’穿透損失可有以下公式及算求得： TL = 20log\T(m)\ =此頻率與穿透係數的依存關係便可明確地表示。 就一層板（玻璃_高分子_玻璃）而論，如第7圖所示，該 穿透損失為—頻率的函數，且描繪於第8 g|。在此，Λ表 示各層的厚度。用於計算的材料及幾何參數顯示如下： \ =h3 =1.5 mm; /72 =2.2 mm />o = A=1.2kg/m3 , A=A = 2461kg/m3 , p2=in5kg/m3 co =c4 = 340m/sec , c, =c3 =5770m/sec , c, = + 4(?.ς⑽、^ V 3ρΛ yThe position of the interface, such as the anti-t = WCw is the wave number of the nth layer, and A is expressed as follows. 〇 Figure 6. In the case of a viscoelastic material, the C c = ( 3G^(@) + 4Gc (ώ) γ2 where G l ^Pn —, ' and the phantom number and the modulus modulo 0 representing the complex number respectively 'wear The loss can be obtained by the following formula and calculation: TL = 20log\T(m)\ = The dependence of this frequency on the penetration coefficient can be clearly expressed. In terms of a layer (glass_polymer_glass), As shown in Fig. 7, the penetration loss is a function of frequency and is depicted in the 8th g|. Here, Λ denotes the thickness of each layer. The materials and geometric parameters used for the calculation are shown as follows: \ =h3 = 1.5 Mm; /72 =2.2 mm />o = A=1.2kg/m3 , A=A = 2461kg/m3 , p2=in5kg/m3 co =c4 = 340m/sec , c, =c3 =5770m/sec , c , = + 4(?.ς(10),^ V 3ρΛ y
GsW =/«co+(/^0-/^00) 1 + (ΐωτ0)1~α P 2vGs (ω) =4GS (ω) 1^0.4 forlO-OOOl/ 0958-A42494TW/fmal 15 1 一 2v 201126660 2.35 xl08Pa μ〇 = 4.19 x 105Pa or = 0.46 夕= -0.1946 τ〇 = 0.3979 sec 第8圖的結果顯示，藉由如第7圖 構，可以使得一微機械加工的％£撾8麥门不的三層板結 位準於1kHz時，可達到雜訊降低至 風封裝體在頻率 請參閱第91，其顯示該麥克風, 頂蓋部件剖面示意圖。該聲學吸收層6〇的隔牆部件與 5〇和隔牆部件20之間。相較於第^ _，^爽^於該外罩 三明治結構小於在第8 _圖示的三=易地指出此 典型的麥克風封裝體中，該外罩5“反;構圍=在-〇.05随至—而__ = :5=之間變化。將此數值與第8圖 ： 康生立…茲二的厚度誠小於該外罩％的厚度。 適合的聲學吸收層6〇便可能達成將 穿透袖失降低至可接受的程度。 、如同先則所#日出’用於該聲學吸收層⑻的材料可包括 泡棉—权木、海綿、橡膠、或喷佈石夕膠塗層。根據本發明 之Λ施例’該聲學吸收層6〇為一黏彈性層，具有多孔 隙，並藉由其特性可將低聲波的速度。 易言之，聲學吸收 層60具有聲學阻抗（ac〇usticimpedanee)的特性，其相較於 外罩50和隔牆部件2〇或頂蓋部件4〇的聲學阻抗特性小的 許多。 forlO-OOOi/ 〇958-A42494TW/f,nal 16 201126660 根據本發明另一實施例，請參閱第10A圖，所述Mems 麥克風封裝體100d具有一基板10。一 MEMS聲學感測f 置3、一 1C晶片4、及被動元件5封裝於基板10上。 學空穴6係由基板10、隔牆部件20及一頂蓋部件4〇所構 成。該隔牆部件20和頂蓋部件40設置並貼附於該基板ι〇 上，藉由一膠合材料30塗佈於該基板10與隔牆部件2〇之 間’以及該隔牆部件20與頂蓋部件40之間。該隔牆部件 2〇的高度足夠高，致使於該MEMS聲學感測裝置3的頂表 面與該頂蓋部件40之間具有足夠的間隔11。接著，將焊 墊2形成於該基板1〇的底部，使該MEMS麥克風封裝體 得以表面黏著於該PCB母板70上。該基板10可由Fr_4 材料製成，使得基板10與該PCB母板70的熱性質匹配。 一聲孔1B延伸穿透該基板10和該PCB母板70，並且能 允許聲學訊號傳輸穿透，以抵達該MEMS聲學感測裝置3 的表面。於一實施例中，聲孔1B形成於並延伸穿透該基板 10。該聲孔1B包括傳聲通道連接該空六6與一外部空間。 可選定該聲孔1B的位置使其遠離該感測裝置3，以避免其 受到灰塵落入及濕氣侵入，例如從人類口中發出，抵達該 感測裝置3的表面。將一聲學封止層80塗佈並環繞於該聲 孔1B的外緣，以封止該基板1〇與pcB母板70之間的間 隙。根據本發明另一實施例，該聲學封止層80可包括金屬 焊錫凸塊、環氧樹脂填充物或橡膠。 再請參閱第10A圖，一導電外罩50包園且環繞該麥克 風封裝體。一聲學吸收層60夾置於該隔膽部件20及/或該 頂蓋部件40與該導電外罩50之間的位置。該導電外罩50 forlO-OOOi/ 〇958-A42494TW/final 17 201126660 並非直接連接至該麥克風封裝體的類比或數位接地導腳。 該導電外罩50而是藉由焊接墊52電性連接至一 PCB母板 上的共同類比接地導腳。 第10B圖係顯示根據本發明另一實施例的MEMS麥克 風封裝體的剖面示意圖。於第i〇B圖十，一 MEMS麥克風 封裳體100e包括—具有一導電部件的外罩15〇a，設置於一 基板10 (亦通稱為一 MIC基板)上，以構築成一空穴11。 所述外罩150a為一整體的金屬外罩’通過一導電膠30貼 附於所述基板1()上。一 MEMS感測元件3、一 1C晶片4 及至少一被動元件5設置於所述空穴11的内部。一聲孔 1B延伸穿透基板10和PCB母板7〇,並且能允許聲學訊號 傳輸穿透’以抵達該MEMS聲學感測裝置3的表面。一第 一接地墊130 (亦通稱為一類比接地墊)設置於基板10的背 面，通過基板1〇内部的一穿孔120 (亦通稱為一穿矽導孔 TSV)連接所述外罩15〇a的導電部件。一第二接地墊14〇 (亦 通稱為一數位接地墊)設置於所述基板1〇的背面，通過基 板10内部的一内連線16〇或重新分佈線(RDL)連接所述 MEMS感測元件3或IC晶片4 ’其中所述第一接地墊ι3〇 和第二接地墊140彼此相互隔離。由於數位訊號和環境的 干擾分別藉由不同的接地墊隔離，因此可有效地降低串音 效應及電磁干擾(EMI)雜訊。有鑑於此，最終被MEMS麥 克風封裝體l〇〇e接收的是乾淨且清楚的聲音訊號。 於一實施例中，可進一步將所述基板10焊接於一;pCB 母板70 (亦通稱為一 PCB系統板)上，其中所述第一接地墊 130和第二接地墊140焊接至pcb母板70上的一共同接地 fori 0-〇〇〇!/ 0958-A42494TW/fmal 18 201126660 塾 17〇。於另 _ 70上 、 貫鈿例中，所述基板10焊接在PCB母板 ’其中所述第—接地塾13〇和第二接地塾14〇分別焊 斤述PCB母板7G上不同的接地塾。基板⑺背面的其 觸墊135分別地焊接在所述pcB母板7〇上 接觸墊175。 第1〇<：圖係顯不根據本發明另一實施例的MEMS麥克 封裝體ό纟剖面不意圖。於第1QC圖巾，—mems麥克風GsW = / «co+(/^0-/^00) 1 + (ΐωτ0)1~α P 2vGs (ω) =4GS (ω) 1^0.4 forlO-OOOl/ 0958-A42494TW/fmal 15 1 A 2v 201126660 2.35 Xl08Pa μ〇= 4.19 x 105Pa or = 0.46 夕 = -0.1946 τ〇 = 0.3979 sec The results of Fig. 8 show that by the structure of Fig. 7, it is possible to make a micromachined When the layer junction is at 1 kHz, the noise can be reduced to the wind package. See Section 91, which shows the microphone and the top cover part. The partition member of the acoustic absorbing layer 6 is interposed between the partition member and the partition member 20. Compared with the first _, ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ There is a change between - and __ = : 5 =. This value is compared with Figure 8: Kang Shengli... The thickness of the second is less than the thickness of the outer cover. The appropriate acoustic absorption layer 6 can achieve penetration. The sleeve loss is reduced to an acceptable level. The material used for the acoustic absorbing layer (8) may include foam-weight wood, sponge, rubber, or spray coating. Inventive Example [The acoustic absorbing layer 6" is a viscoelastic layer having a porosity and a low acoustic wave velocity by its characteristics. In other words, the acoustic absorbing layer 60 has an acoustic impedance (ac〇usticimpedanee) The characteristics are much smaller than the acoustic impedance characteristics of the outer cover 50 and the partition member 2〇 or the top cover member 4〇. ForlO-OOOi/〇958-A42494TW/f, nal 16 201126660 According to another embodiment of the present invention Referring to FIG. 10A, the Mems microphone package 100d has a substrate 10. A MEMS acoustic The test 3, the 1C chip 4, and the passive component 5 are packaged on the substrate 10. The learning cavity 6 is composed of the substrate 10, the partition member 20, and a top cover member 4. The partition member 20 and the top portion The cover member 40 is disposed and attached to the substrate ι, and is coated between the substrate 10 and the partition member 2' by a bonding material 30, and between the partition member 20 and the top cover member 40. The height of the partition member 2 is sufficiently high that there is sufficient spacing 11 between the top surface of the MEMS acoustic sensing device 3 and the cap member 40. Next, the pad 2 is formed at the bottom of the substrate 1 The MEMS microphone package is surface-attached to the PCB motherboard 70. The substrate 10 can be made of Fr_4 material such that the substrate 10 matches the thermal properties of the PCB motherboard 70. An acoustic hole 1B extends through the substrate. 10 and the PCB motherboard 70, and capable of allowing acoustic signal transmission to penetrate to reach the surface of the MEMS acoustic sensing device 3. In one embodiment, the acoustic aperture 1B is formed in and extends through the substrate 10. The hole 1B includes a sound passage connecting the empty six 6 and an outer space. The position of the sound hole 1B can be selected. It is placed away from the sensing device 3 to prevent it from being infiltrated by dust and moisture, for example, from a human mouth, reaching the surface of the sensing device 3. An acoustic sealing layer 80 is coated and wrapped around the surface. The outer edge of the sound hole 1B is to seal the gap between the substrate 1 and the pcB mother board 70. According to another embodiment of the present invention, the acoustic sealing layer 80 may include a metal solder bump, an epoxy filler. Or rubber. Referring again to Fig. 10A, a conductive outer cover 50 encloses and surrounds the microphone package. An acoustic absorbing layer 60 is interposed between the spacer member 20 and/or the top cover member 40 and the conductive cover 50. The location between. The conductive housing 50 forlO-OOOi/〇958-A42494TW/final 17 201126660 is not an analog or digital grounding pin that is directly connected to the microphone package. The conductive housing 50 is electrically connected to a common analog grounding pin on a PCB motherboard by solder pads 52. Figure 10B is a cross-sectional view showing a MEMS microphone package in accordance with another embodiment of the present invention. In Fig. 10, a MEMS microphone sealing body 100e includes a housing 15a having a conductive member disposed on a substrate 10 (also referred to as a MIC substrate) to form a cavity 11. The outer cover 150a is an integral metal cover 'attached to the substrate 1 () by a conductive paste 30. A MEMS sensing element 3, a 1C wafer 4 and at least one passive element 5 are disposed inside the cavity 11. A sound hole 1B extends through the substrate 10 and the PCB mother board 7B and allows acoustic signal transmission to penetrate to reach the surface of the MEMS acoustic sensing device 3. A first ground pad 130 (also referred to as an analog ground pad) is disposed on the back surface of the substrate 10, and is connected to the outer cover 15A through a through hole 120 (also referred to as a through hole TSV) inside the substrate 1 Conductive parts. A second ground pad 14 〇 (also commonly referred to as a digital ground pad) is disposed on the back surface of the substrate 1 , and the MEMS sensing is connected through an interconnect 16 〇 or a redistribution line (RDL) inside the substrate 10 . The element 3 or the IC chip 4' wherein the first ground pad 〇3 and the second ground pad 140 are isolated from each other. Since the digital signal and the environmental interference are separated by different ground pads, the crosstalk effect and electromagnetic interference (EMI) noise can be effectively reduced. In view of this, the MEMS microphone package l〇〇e finally receives a clean and clear sound signal. In one embodiment, the substrate 10 can be further soldered to a pCB motherboard 70 (also commonly referred to as a PCB system board), wherein the first ground pad 130 and the second ground pad 140 are soldered to the pcb mother. A common ground for the board 70 fori 0-〇〇〇!/ 0958-A42494TW/fmal 18 201126660 塾17〇. In another example, the substrate 10 is soldered to the PCB mother board, wherein the first grounding layer 13〇 and the second grounding layer 14〇 respectively solder different grounding layers on the PCB mother board 7G. . The contact pads 135 on the back side of the substrate (7) are soldered to the contact pads 175 on the pcB mother board 7A, respectively. The first <: diagram shows a cross-section of a MEMS mic package that is not according to another embodiment of the present invention. In the 1QC towel, -mess microphone
I褒體lGGf包括—具有—導電部件的外罩丨，設置於一 土板ίο (亦通稱為一 MIC基板)上，以構築成一空穴η。 所述外罩150b為-多層外罩，通過一導電膠3〇貼附於所 述基板10上。所述多層外罩15〇b可包括一頂蓋部件155 和一隔牆部件153環繞且支#該頂蓋料。於另一實施例 中所述多層外罩包括一導電層154，爽置於兩層非導電 層/52和156之間。應注意的是，所述多層外罩可更包括 聲學吸收層襯塾於該多層外罩的裡層。一 MEMS感測元 件3、一 1C晶片4及至少一被動元件5設置於所述空穴“ 的内部。一聲孔1B延伸穿透基板10和PCB母板70，並 且旎允許聲學訊號傳輸穿透，以抵達該MEMS聲學感測裝 ，3的表面。一第一接地墊13〇 (亦通稱為一類比接地墊） "又置於基板10的背面，通過基板10内部的一穿孔120 (亦 通稱為一穿矽導孔TSV)連接所述外罩15%的導電部件。 一第二接地墊14〇 (亦通稱為一數位接地墊)設置於所述基 板10的背面，通過基板10内部的一内連線16〇或重新分 佈線(RDL)連接所述MEMS感測元件3或IC晶片4，其中 所述第一接地墊130和第二接地墊mo彼此相互隔離。 fori 0-0001/ 0958-A42494TW/fmal 19 201126660 於一實施例中，可進一步將所述基板10焊接於一 pcB 母板70 (亦通稱為一 pCB系統板）上，其中所述第一接地墊 130和第二接地墊14〇焊接至pCB母板7〇上的一共同接地 墊170。於另一貫施例中，所述基板丨〇焊接在母板 70上其中所述第一接地墊130和第二接地塾140分別焊 接至所述PCB母板70上不同的接地墊。基板1〇背面的其 他接觸墊135分別地焊接在所述PCB母板7〇上的對應的 接觸墊Π5。 根據本發明另一實施例，請參閱第11A圖，MEMS麥 克風封裝體l〇〇g具有一基板1〇。一 MEMS聲學感測裝置 3、一 1C晶片4、及被動元件5封裝於基板1〇上。一聲學 空穴6係由基板1〇、隔牆部件2〇及一頂蓋部件4〇所構成。 該隔牆部件20和頂蓋部件40設置並貼附於該基板1〇上， 藉由一膠合材料30塗佈於該基板1〇與隔牆部件2〇之間， 以及該隔牆部件20與頂蓋部件4〇之間。該隔牆部件2〇的 高度足夠高，致使於該MEMS聲學感測裝置3的頂表面與 該頂蓋部件40之間具有足夠的間隔η。接著，將焊墊2 形成於該基板10的底部，使該MEMS麥克風封裝體得以 表面黏著於該PCB母板70上。該基板1〇可由FR_4材料 製成’使得基板10與該PCB母板70的熱性質匹配。一聲 孔1B延伸穿透該基板1〇和該PCb母板70，並且能允許 聲學訊號傳輸穿透’以抵達該MEMS聲學感測裝置3的表 面。該聲孔1B的位置可選定位於該感測裝置3的正下方。 一網罩8設置於該MEMS聲學感測裝置3和該聲孔1B之 間。該網罩8為一多孔板’其具有多個聲洞（acoustich〇les) forl0-000l/ 〇958-A42494TW/fmal 2〇 201126660 的尺寸範圍大抵介於10微米至50微米之間。根據本發明 另貝細•例，該網罩8的厚度範圍大抵介於介於1 〇微米至 100微来之間。 根據本發明又一實施例，將一聲學封止層8〇塗佈並環 繞於該聲孔1B的外緣，以封止該基板10與pcB母板7〇 之間的間隙。該聲學封止層8 〇可包括金屬焊錫凸塊、環氧 樹脂填充物或橡膠。 • 再請參閱第11A圖，一導電外罩50包圍且環繞該麥克 風封裝體。一聲學吸收層60夾置於該隔牆部件2〇及/或該 頂蓋部件40與該導電外罩5〇之間的位置。該導電外罩5〇 並非直接連接至該麥克風封裝體的類比或數位接地導腳。 該導電外罩50而是藉由焊接墊52電性連接至一 pcB母板 上的共同類比接地導腳。 上述Φι!機械加工的MEMS麥克風封裝體的實施例的優 點在於可有效地降低穿透該克風封裝體的隔牆部 • 件或頂蓋部件的聲學漏損。藉由將該導電外罩與該PCB母 板電f生連接，可強化該MEMS麥克風封裝體的黏結強度。 再者，該MEMS麥克風封裝體對在封裴和組裝的製程中所 發生的熱擾動具足夠的承受能力。再者，由於該導電外罩 電11連接至一支撐PCB母板的共同類比接地導腳，因此可 以屏蔽感測元件，以隔離環境和電磁干擾。 第11B圖係顯示根據本發明另一實施例的MEMS麥克 風封裝體的剖面示意圖。於第11B圖中，一 MEMS麥克風 封裝體io〇h包括一具有一導電部件的外罩15〇a，設置於 一基板10 (亦通稱為一 MIC基板)上，以構築成一空六u。 forlO-OOOi/ 0958-A42494TW/fmal 21 201126660 所述外罩150a為一整體的金屬外罩，通過一導電膠30貼 附於所述基板10上。一 MEMS感測元件3、一 1C晶片4 及至少一被動元件5設置於所述空穴11的内部。一聲孔 1B延伸穿透該基板10和該PCB母板70’並且能允許聲學 訊號傳輸穿透，以抵達該MEMS聲學感測裝置3的表面。 該MEMS感測元件設置於該聲孔的一端’並可選定位於該 感測裝置3的正下方。一網罩8設置於該MEMS聲學感測 裝置3和該聲孔1B之間。該網罩8為一多孔板，其具有多 個聲洞（acoustic holes)的尺寸範圍大抵介於1〇微米至5〇微 米之間。於一實施例中，可選擇一聲學封止件環繞聲孔1B 且夾置於基板10和PCB母板70之間。一第一接地塾130 (亦通稱為一類比接地墊)設置於基板1〇的背面，通過基板 10内部的一穿孔120 (亦通稱為一穿矽導孔TSV)連接所述 外罩150a的導電部件。一第二接地墊14〇 (亦通稱為一數 位接地墊）設置於所述基板1〇的背面，通過基板1〇内部的 一内連線160或重新分佈線(RDL)連接所述MEMS感測元 件3或1C晶片4，其中所述第一接地墊13〇和第二接地墊 140彼此相互隔離。由於數位訊號和環境的干擾分別藉由 不同的接地墊隔離，因此可有效地降低串音效應及電磁干 擾(EMI)雜訊。有鑑於此’最終被MEMS麥克風封裝體丨〇汕 接收的是乾淨且清楚的聲音訊號。 於一實施例中，可進一步將所述基板1〇焊接於一 pCB 母板70 (亦通稱為一 PCB系統板)上，其中所述第丄接地墊 130和第二接地墊14〇焊接至pCB母板7〇上的—共同接地 塾170 °於另—實施例中’所述基板10焊接在PCB母板 forl0-〇〇〇i/ 〇958-A42494TW/fmal „ 201126660 70上，其中所述第一接地塾13〇和第二接地墊14〇分別焊 接至所述PCB母板70上不同的接地墊。基板1〇背面的其 他接觸墊135分別地焊接在所述pCB母板70上的對應的 接觸墊175。 第1 ic圖係顯示根據本發明另一實施例的MEMS麥克 風封裝體的剖面示意圖。於第1C圖中，一 MEMS麥克風 封裝體100i包括一具有一導電部件的外罩15〇b，設置於一 φ 基板10 (亦通稱為一 MIC基板)上，以構築成一空穴11。 所述外罩150b為一多層外罩，通過一導電膠3〇貼附於所 述基板10上。所述多層外罩150b可包括一頂蓋部件155 和一隔牆部件153環繞且支撐該頂蓋部件。於另一實施例 中’所述多層外罩包括一導電層154,夾置於兩層非導電 層152和156之間。應注意的是，所述多層外罩可更包括 一聲學吸收層襯墊於該多層外罩的裡層。一 MEMS感測元 件3、一 1C晶片4及至少一被動元件5設置於所述空六11 _ 的内部。一聲孔1B延伸穿透該基板10和該pCb母板70, 並且能允許聲學訊號傳輸穿透，以抵達該MEMS聲學感測 裝置3的表面。該MEMS感測元件設置於該聲孔的一端， 並可選定位於該感測裝置3的正下方。一網罩8設置於該 MEMS聲學感測裝置3和該聲孔1B之間。該網罩8為一 多孔板’其具有多個聲洞（acoustic holes)的尺寸範圍大抵介 於10微米至50微米之間。於一實施例中，可選擇一聲學 封止件環繞聲孔1B且夾置於基板1〇和PC]B母板70之間。 一第一接地墊130 (亦通稱為一類比接地塾)設置於基板1〇 的背面’通過基板10内部的一穿孔12〇 (亦通稱為一穿矽 forlO-OOOl/ 095S-A42494TW/fmal 23 201126660 導孔TSV)連接所述外罩150b的導電部件。_第二接地墊 140 (亦通稱為一數位接地墊)設置於所述基板1〇的背面， 通過基板10内部的一内連線160或重新分佈線(RDL)連接 所述MEMS感測元件3或1C晶片4,其中所述第一接地墊 130和第二接地塾140彼此相互隔離。 於一實施例中，可進一步將所述基板10焊接於一 pcB 母板70 (亦通稱為一 PCB系統板)上，其中所述第一接地墊 130和第二接地墊140焊接至PCB母板70上的一共同接地 墊170。於另一實施例中，所述基板10焊接在pCB母板 70上’其中所述第一接地墊13〇和第二接地墊14〇分別焊 接至所述PCB母板70上不同的接地墊。基板1〇背面的其 他接觸墊135分別地焊接在所述PCb母板70上的對應的 接觸墊175。 本發明雖以各種實施例揭露如上，然其並非用以限定 本發明的範圍’任何所屬技術領域中具有通常知識者，在 不脫離本發明之精神和範圍内，當可做些許的更動與潤 飾。本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 第1A-1C圖顯示顯示根據本發明實施例之麥克風封裴 體’以表面封裝於一支撑的PCB基板的剖面示意圖。 第2A-2B圖顯示根據本發明之實施例的麥克風封裝 體’並無附加外罩，的剖面示意圖。 forlO-OOOl/ 0958-A42494TW/final 74 201126660 第3圖係顯示根據 封裝體的的導電外罩的^明之一實施例的MEMS麥克風 第4圖係顯示4=意圖° 示意圖。 本發明另一實施例的導電外罩頂視 第5圖係顯示由第 方向的剖面示意圖#麥克風封裝體沿Α·Α，切割線 第6圖顯示根據太欠 遞的示意圖。 明實施例在-多層結構中聲波傳 第7圖顯示根據太 — 遞的示意目。 冑關在二層板結構中聲波傳 第8圖顯示在第1 _ 失示意圖。 _的三層板結構巾所料的傳遞損 第9圖顯示根棣太 牆部件的剖面示意_。@之實施例的麥克風封I體的隔 第10A-10C圖顯干Β 克風封裝體，以表㈣、根據本發明另—㈣施例之麥 圖。 ❻於-支撐的PCB基板的剖面示意 ，11A-HC圖顯示顯示根據本發明又一 圖。 裴於一支撐的PCB基板的剖面示意 【主要元件符號說明】 ΙΑ、1B〜聲孔； 2〜焊墊； forlO-000!/ 〇958-A42494TW/final 25 201126660 3〜MEMS聲學感測裝置； 4〜1C晶片； 5〜被動元件； 6〜空穴； 8〜網罩； 10〜基板； 11〜間隔； 15〜額外的聲孔； 17〜傳聲通道； 20〜隔牆部件； 30〜膠合材料； 40〜頂蓋部件； 50〜導電外罩； 51〜邊緣執； 52〜焊接墊； 53〜導電外罩的頂表面； 60~聲學吸收層； 70〜PCB母板； 80〜聲學封止層； 100a-100i〜MEMS麥克風封裝體； 120〜穿孔； 130〜第一接地墊； 135〜接觸墊； 140〜第二接地墊； 150a、150b〜外罩； forl0-0001/ 0958-A42494TW/fmal 26 201126660 152和156〜非導電層； 153〜隔牆部件； 154〜導電層； 155〜頂蓋部件； 160〜内連線； 170〜共同接地墊； 175〜接觸墊。The I body lGGf includes a cover 具有 having a conductive member, and is disposed on a soil plate ίο (also referred to as a MIC substrate) to form a cavity η. The outer cover 150b is a multi-layer outer cover attached to the substrate 10 via a conductive paste 3〇. The multi-layered cover 15b may include a top cover member 155 and a partition member 153 surrounding and surrounding the top cover. In another embodiment, the multilayer housing includes a conductive layer 154 that is disposed between two layers of non-conductive layers / 52 and 156. It should be noted that the multilayer outer cover may further comprise an acoustic absorbing layer lining the inner layer of the multilayer outer cover. A MEMS sensing element 3, a 1C wafer 4 and at least one passive element 5 are disposed inside the cavity. A sound hole 1B extends through the substrate 10 and the PCB mother board 70, and allows acoustic signal transmission to penetrate. To reach the surface of the MEMS acoustic sensing device, a first ground pad 13 (also commonly referred to as an analog ground pad) " again placed on the back of the substrate 10, through a perforation 120 inside the substrate 10 (also A conductive member that is commonly referred to as a through-via via TSV) is connected to 15% of the conductive member of the housing. A second ground pad 14 (also commonly referred to as a digital ground pad) is disposed on the back surface of the substrate 10 and passes through the inside of the substrate 10. An interconnect 16 〇 or redistribution line (RDL) connects the MEMS sensing element 3 or the IC die 4, wherein the first ground pad 130 and the second ground pad mo are isolated from each other. fori 0-0001/ 0958- A42494 TW/fmal 19 201126660 In one embodiment, the substrate 10 can be further soldered to a pcB motherboard 70 (also commonly referred to as a pCB system board), wherein the first ground pad 130 and the second ground pad 14 Soldering to a common ground pad 170 on the pCB motherboard 7〇. In another example The substrate is soldered on the motherboard 70, wherein the first ground pad 130 and the second ground pad 140 are soldered to different ground pads on the PCB motherboard 70. The other contact pads 135 on the back side of the substrate 1 Corresponding contact pads 5 are respectively soldered on the PCB motherboard 7. According to another embodiment of the present invention, referring to FIG. 11A, the MEMS microphone package 100 has a substrate 1 〇. The sensing device 3, the 1C wafer 4, and the passive component 5 are packaged on the substrate 1. An acoustic cavity 6 is composed of a substrate 1 , a partition member 2 , and a top cover member 4 . The component 20 and the top cover member 40 are disposed and attached to the substrate 1 , and are coated between the substrate 1 〇 and the partition member 2 藉 by a bonding material 30, and the partition member 20 and the top cover member The height of the partition member 2 is sufficiently high that there is a sufficient spacing η between the top surface of the MEMS acoustic sensing device 3 and the cap member 40. Next, the pad 2 is formed on The bottom of the substrate 10 allows the MEMS microphone package to be surface-attached to the PCB motherboard 70. The substrate 1 can be made of FR_4 material to match the thermal properties of the substrate 10 to the PCB motherboard 70. A sound hole 1B extends through the substrate 1 and the PCb motherboard 70 and allows acoustic signal transmission to penetrate. 'to reach the surface of the MEMS acoustic sensing device 3. The position of the sound hole 1B can be selected directly below the sensing device 3. A mesh cover 8 is disposed on the MEMS acoustic sensing device 3 and the sound hole 1B The mesh cover 8 is a perforated plate having a plurality of acoustic holes for the range of 10 to 50 micrometers forl0-000l/〇958-A42494TW/fmal 2〇201126660. According to another aspect of the invention, the thickness of the mesh cover 8 is generally between 1 〇 micrometer and 100 micrometers. According to still another embodiment of the present invention, an acoustic sealing layer 8 is coated and wound around the outer edge of the sound hole 1B to seal the gap between the substrate 10 and the pcB mother substrate 7A. The acoustic sealing layer 8 can include a metal solder bump, an epoxy filler or a rubber. • Referring again to Figure 11A, a conductive outer cover 50 surrounds and surrounds the microphone package. An acoustic absorbing layer 60 is interposed between the partition member 2 and/or the cover member 40 and the conductive cover 5A. The conductive housing 5〇 is not an analog or digital grounding pin that is directly connected to the microphone package. The conductive housing 50 is electrically connected to a common analog grounding pin on a pcB motherboard by solder pads 52. An embodiment of the above-described Φι! machined MEMS microphone package is advantageous in that acoustic leakage of the partition member or the cover member penetrating the wick package can be effectively reduced. The bonding strength of the MEMS microphone package can be enhanced by electrically connecting the conductive cover to the PCB mother board. Furthermore, the MEMS microphone package is sufficiently resistant to thermal disturbances that occur during the packaging and assembly process. Moreover, since the conductive housing 11 is connected to a common analog grounding pin that supports the PCB motherboard, the sensing components can be shielded to isolate the environment and electromagnetic interference. Figure 11B is a cross-sectional view showing a MEMS microphone package in accordance with another embodiment of the present invention. In Fig. 11B, a MEMS microphone package io〇h includes a housing 15a having a conductive member disposed on a substrate 10 (also referred to as a MIC substrate) to form an empty space. ForlO-OOOi/ 0958-A42494TW/fmal 21 201126660 The outer cover 150a is an integral metal cover attached to the substrate 10 by a conductive adhesive 30. A MEMS sensing element 3, a 1C wafer 4 and at least one passive element 5 are disposed inside the cavity 11. A sound hole 1B extends through the substrate 10 and the PCB mother board 70' and allows acoustic signal transmission to penetrate to reach the surface of the MEMS acoustic sensing device 3. The MEMS sensing element is disposed at one end of the sound hole and is selectable directly below the sensing device 3. A mesh cover 8 is disposed between the MEMS acoustic sensing device 3 and the sound hole 1B. The mesh cover 8 is a perforated plate having a plurality of acoustic holes having a size ranging from 1 μm to 5 μm. In an embodiment, an acoustic sealing member may be selected to surround the sound hole 1B and sandwiched between the substrate 10 and the PCB mother board 70. A first ground 塾 130 (also referred to as an analog ground pad) is disposed on the back surface of the substrate 1 , and a conductive member of the outer cover 150 a is connected through a through hole 120 (also referred to as a through hole TSV) inside the substrate 10 . . A second ground pad 14 〇 (also commonly referred to as a digital ground pad) is disposed on the back surface of the substrate 1 , and the MEMS sensing is connected through an interconnect 160 or a redistribution line (RDL) inside the substrate 1 . The component 3 or the 1C wafer 4, wherein the first ground pad 13A and the second ground pad 140 are isolated from each other. Since the digital signal and the environmental interference are separated by different ground pads, the crosstalk effect and electromagnetic interference (EMI) noise can be effectively reduced. In view of this, the MEMS microphone package is finally receiving a clean and clear sound signal. In one embodiment, the substrate 1 can be further soldered to a pCB motherboard 70 (also commonly referred to as a PCB system board), wherein the second ground pad 130 and the second ground pad 14 are soldered to the pCB. The common ground 塾 170 ° on the motherboard 7 于 in another embodiment, the substrate 10 is soldered on the PCB motherboard forl0-〇〇〇i / 〇 958-A42494TW/fmal „ 201126660 70, wherein the A grounding pad 13 〇 and a second ground pad 14 〇 are respectively soldered to different ground pads on the PCB motherboard 70. The other contact pads 135 on the back side of the substrate 1 are respectively soldered to the corresponding ones on the pCB motherboard 70. Contact pad 175. The first embodiment shows a cross-sectional view of a MEMS microphone package according to another embodiment of the present invention. In FIG. 1C, a MEMS microphone package 100i includes a cover 15b having a conductive member. It is disposed on a φ substrate 10 (also referred to as a MIC substrate) to form a cavity 11. The outer cover 150b is a multi-layer outer cover attached to the substrate 10 via a conductive adhesive 3 . The multilayer outer cover 150b may include a top cover member 155 and a partition member 153 The top cover member is supported. In another embodiment, the multilayer cover includes a conductive layer 154 sandwiched between two non-conductive layers 152 and 156. It should be noted that the multilayer cover may further include a The acoustic absorbing layer is padded on the inner layer of the multilayer cover. A MEMS sensing element 3, a 1C wafer 4 and at least one passive component 5 are disposed inside the empty hexagram 11 . An acoustic hole 1B extends through the substrate. 10 and the pCb motherboard 70, and can allow acoustic signal transmission to penetrate to reach the surface of the MEMS acoustic sensing device 3. The MEMS sensing element is disposed at one end of the sound hole and can be selected to be located in the sensing device Directly below 3. A mesh cover 8 is disposed between the MEMS acoustic sensing device 3 and the sound hole 1B. The mesh cover 8 is a perforated plate having a plurality of acoustic holes having a large size range. Between 10 micrometers and 50 micrometers. In an embodiment, an acoustic sealing member may be selected to surround the sound hole 1B and sandwiched between the substrate 1A and the PC]B mother board 70. A first grounding pad 130 (also known as a type of grounding 塾) provided on the back side of the substrate 1 ' 'through the inside of the substrate 10 The hole 12 〇 (also commonly referred to as a through O forOO-OOOl / 095S-A42494 TW / fmal 23 201126660 guide hole TSV) is connected to the conductive member of the outer cover 150b. _ second ground pad 140 (also known as a digital ground pad) setting The MEMS sensing element 3 or the 1C wafer 4 is connected to the back surface of the substrate 1 through an interconnect 160 or a redistribution line (RDL) inside the substrate 10, wherein the first ground pad 130 and the second The grounding turns 140 are isolated from one another. In one embodiment, the substrate 10 can be further soldered to a pcB motherboard 70 (also commonly referred to as a PCB system board), wherein the first ground pad 130 and the second ground pad 140 are soldered to the PCB motherboard. A common ground pad 170 on 70. In another embodiment, the substrate 10 is soldered to the pCB motherboard 70, wherein the first ground pad 13 and the second ground pad 14 are soldered to different ground pads on the PCB motherboard 70, respectively. Other contact pads 135 on the back side of the substrate 1 are soldered to corresponding contact pads 175 on the PCb motherboard 70, respectively. The present invention has been disclosed in the above-described embodiments, and is not intended to limit the scope of the invention, which is to be construed as being limited by the scope of the invention. . The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A-1C is a cross-sectional view showing a surface of a microphone package body mounted on a support PCB substrate according to an embodiment of the present invention. 2A-2B is a cross-sectional view showing the microphone package 'with no additional cover according to an embodiment of the present invention. ForlO-OOOl/ 0958-A42494TW/final 74 201126660 Fig. 3 shows a MEMS microphone according to an embodiment of a conductive cover of a package. Fig. 4 shows a schematic view of 4 = intent °. A top view of the conductive cover of another embodiment of the present invention is a cross-sectional view taken from the first direction. The microphone package is along the Α·Α, and the cut line is shown in Fig. 6. The sound wave transmission in the - multilayer structure of the embodiment is shown in Fig. 7. The sound wave transmission in the two-layer structure is shown in Figure 8. The first figure shows the first _ loss. The transmission loss of the three-layer structural towel of _ Figure 9 shows the profile of the root wall component. The microphone package of the embodiment of the embodiment of the present invention is shown in Figs. 10A-10C, which is shown in Table (4), according to another embodiment of the present invention. A cross-sectional view of the support-supported PCB substrate, the 11A-HC diagram display shows still another diagram in accordance with the present invention. Sectional representation of a supported PCB substrate [Description of main components] ΙΑ, 1B~ sound hole; 2~ solder pad; forlO-000!/ 〇958-A42494TW/final 25 201126660 3~MEMS acoustic sensing device; 4 ~1C wafer; 5~passive component; 6~hole; 8~mesh cover; 10~substrate; 11~interval; 15~extra sound hole; 17~sound channel; 20~partition part; 30~glued material 40~ top cover part; 50~ conductive cover; 51~ edge hold; 52~ solder pad; 53~ top surface of conductive cover; 60~ acoustic absorbing layer; 70~PCB mother board; 80~ acoustic sealing layer; -100i~ MEMS microphone package; 120~perforation; 130~first ground pad; 135~ contact pad; 140~second ground pad; 150a, 150b~ cover; forl0-0001/ 0958-A42494TW/fmal 26 201126660 152 and 156~ non-conductive layer; 153~ partition member; 154~ conductive layer; 155~ top cover member; 160~ interconnect; 170~ common ground pad; 175~ contact pad.
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