201125828 六、發明說明： 【與本案相關之對應案】 申請的美國專利臨 本發明主張2009年11月24曰提出 時申請案61/264017號之優先權。 【發明所屬之技術領域】 本發明大體上關於用於形成玻璃片的方法與設備。更 詳言之，本發明關於一種用於控制從熔融玻璃^成的玻 璃片之厚度的方法與設備。 【先前技術】 美國專利號3,682,6G9(S. M.DGekeny)中描述一種用 於控制從熔融玻璃形成的玻璃片之厚度的系統。在美國 專利號3,682,6G9的系統中，溶融玻璃在形成構件的相對 側向下流動’並且在形成構件的楔形根部會合而形成玻 璃片。玻璃片通過一對相對殼體之間，該殼體具有面向 破璃片的前壁。前壁是由星右古 疋田具有问導熱性、低延展性及低 發射率的材料（諸如碳化矽） 7 )所製成。流體導管排置於 设體内’流體導管的喷嘴以間隔關係定位在前壁的背側 :::-流體導管具有相關聯的流量計，其設有控制閥 亚且連接歧管。每一流體道& 1、 導S傳遞冷卻流體或加执流體 至鄰接的前壁之背側區域… ‘、、1體 扣卜 叙而δ ，所傳遞的流體是 工乳。透過純射的熱交換發生在玻璃片與前壁之間， 201125828 以控制玻璃片厚度。倘若玻璃片的厚度紀錄曲線—) 指不橫跨麵片寬度的特^區域比期望厚1透過冷卻 玻璃片鄰接較厚區域的地帶（即冷卻較薄的區域）以修 正厚度紀錄曲線。對應鄰接地帶的流體導管受到啟動而 冷卻鄰接地帶（即㈣的區域）。該專利亦建制加熱的 流體傳遞至前壁的背側以做為傳遞冷卻流體取代之道。 在此實例中’加熱的流體是透過對應較厚區域的流體導 管傳遞。此舉會減少較厚區域的黏性然後薄化該區域。 加熱的流體可由與流體導管相關聯的電繞線提供。 子；上述的S又備而S，使用對流冷卻居中的壁體（隨 /藉由,、、、傳導擴散§亥效應）限制了該設備的視野的解析 度。故需要更高解析度的形成期間之玻璃帶控制。 本發明滿足了此需求以及其他需求。 【發明内容】 在此揭露本發明的數種態樣。應瞭解到，這些態樣可 (或可不）與另一者重疊。因此，一個態樣的一部分可 落入另一態樣的範疇中，反之亦然。除非在文中有相反 才B示’否則應將不同的態樣視為彼此在範缚中重疊。 每一態樣是由許多實施例說明，其進而能包括一個或 夕個特定實施例。應瞭解到實施例可（或不可）彼此重 4 °因此，一個實施例（或其特定實施例）的一部分可 (或不可）落入另一實施例（或其特定實施例）的範圍， 201125828 反之亦然。除非在文中有相反指示，否則應將不同的實 施例視為彼此在範嘴中重疊。 因此，根據本發明的第一態樣，製作玻璃片的方法包 3以下步驟.（A)在一第一溫度下提供一玻璃帶，其中 至少一部分的該玻璃帶顯現黏性表現；（B)在一第二溫卢 下將一吸熱裝置（heat sink)設於鄰接該玻璃帶之至少一 部分處’（C)將複數個加熱元件設於一位置，其中可操作 該等加熱元件以塑形該吸熱裝置的一熱力曲線（thermai pro file)，以及（d)將熱量從該玻璃帶的至少一部分傳送至 該吸熱裝置，並且將至少一部分的該熱量吸收進該吸熱 裝置。 在本發明第一態樣的某些實施例中，在步驟（B)中，該 第一溫度低於該第一溫度，因而至少部份的該玻璃帶透 過該吸熱裝置冷卻。 在本發明第一態樣的某些實施例中，在步驟（B)中，該 第一溫度高於該第一溫度’因而至少部份的該玻璃帶傾 向由該吸熱裝置加熱。 在本發明第一態樣的某些實施例中，在步驟（c)中，該 等加熱元件嵌在該吸熱襞置中。 在本發明第一態樣的某些實施例中，該方法進一步包 含以下步驟：（E)選擇性調整該等加熱元件每一者的一輸 出’以塑形該吸熱裝置的該熱力曲線，使得步驟中熱 量以有差異的方式吸收進該吸熱裝置。 在本發明第一態樣的某些實施例中，在步驟（E)中，選 201125828 擇性調整該等加熱元件每一者的該輪 玻璃帶的該至少一部分上的複數區域出中的^熱量從該 值傳送，該量值與該等區域的每—者厂母者以量 , _ 〈厚度呈反比。 在本發明第一態樣的某些實施例 τ 在步驟（E)中，選 擇性調整該等加熱元件每一者的該輪出，使得從該玻璃 帶的該至少-部分上的較薄區域中的每—者傳送的熱量 多於從該玻璃帶的該至少一部分上的較厚區域中的每一 者傳送的熱量。 在本發明第-態樣的某些實施例中，在步驟⑻中，選 擇性調整該等加熱元件每一者的該輸出，使得熱量從該 玻璃帶㈣至少一部分上的複數區_中的每一者以一量 值傳送，該量值與該等區域的每一者之溫度呈正比。 在本發月第怨樣的某些實施例中，在步驟（Ε)中，選 擇f生調整β亥等加熱元件每一者的該輸出’使得從該玻璃 帶的·»亥至>、α卩分上的較熱區域中的每一者傳送的熱量 多於從該玻璃帶的該至少一部分上的較冷區域中的每一 者傳送的熱量。 在本發明第—態樣的某些實施例中，該方法進一步包 3以下步驟.（F)監視該吸熱裝置的該熱力曲線，並且使 用該％視的結果選擇性調整步驟中的該等加熱元件 之每一者的該輸出。 在本發明第一態樣的某些實施例中，該方法進一步包 3以下步驟·（〇)傳遞冷卻流體至該吸熱裝置上所選擇的 點以修改該吸熱裝置的該熱力曲線的該形狀》 201125828 在本發明第一態樣的某些實施例中，該方法進一步包 含以下步驟：（H)相對該吸熱裝置移動該玻璃帶。 在本發明第一態樣的某些實施例中，步驟（D)與步驟（H) 同時進行。 在本發明第一態樣的某些實施例中，步驟（A)包含以下 步驟：（A1)提供熔融玻璃的個別玻璃流，並且透過在— 形成構件的一楔形根部處將該熔融玻璃的個別玻璃流重 合，而形成該玻璃帶。 在本發明第一態樣的某些實施例中，在步驟（D)中，該 玻璃帶的該至少一部分是在該楔形根部的附近。 在本發明第一態樣的某些實施例中，在步驟中，該 玻璃帶的該至少一部分是在該楔形根部的下方。 根據本發明的第二態樣，提供一種用於製作一玻璃片 的設備，其包含：⑴一形成構件，其用於形成一玻璃帶， 。玄形成構件包含一楔形部，該楔形部具有一楔形根部， 在該楔形根部處熔融玻璃的個別玻璃流重合而形成該玻 璃帶，（11)吸熱裝置，其定位於該楔形根部的附近，使 杈省吸熱裝置能從該玻璃帶的該至少一部分吸收熱量； 以及（iii)複數個加熱元件 並且可操作該等加熱元件以 線。該吸熱裝置具有一表面 的一表面的至少一部分的 view) ° 其接觸或鄰接該吸熱裝置， 塑形該吸熱裝置的一熱力曲 ’該表面具有涵蓋該玻璃帶 熱力視野（thermal field of 在本發明的第 態樣的某些實施例中 該設備進一步 201125828 匕3複數個f路’該等管路用於傳遞冷卻流體至該吸熱 裝置上所選擇的點。有利的是，該等管路是在該吸熱裝 置後方，且不在該玻璃帶的該熱力視野中。 在本發明的第二態樣的某些實施例中，該吸熱裝置是 置於Θ模形根部下方的_位置。在某些實施例中，該板 具有面向該玻璃帶的一平坦表面。 在本發明的第二態樣的某些實施例中，該吸熱裝置包 含一板，該板包含一陶瓷材料，在該吸熱裝置的該操作 溫度下該陶瓷材料的熱導率（thermal c〇nductivhy)是碳 化石夕的至少1/3。 在本發明的第二態樣的某些實施例中，該設備包含一 板’該板包含碳化矽及/或氮化矽。 在本發明的第二態樣的某些實施例中，該等加熱元件 嵌於該吸熱裝置中。 在本發明的第二態樣的某些實施例中，該等加熱元件 疋在°亥吸熱裝置後方’且不在該玻璃帶的該熱力視野中。 在本發明的第二態樣的某些實施例中，該等加熱元件 為電阻式加熱元件。 在本發明的第二態樣的某些實施例中，該設備進一步 包含複數個溫度感測器，該等溫度感測器耦接該吸熱裝 置以監視該吸熱裝置的該熱力曲線。 在本發明的第二態樣的某些實施例中’該等溫度感剩 器是熱偶。 在本發明的第二態樣的某些實施例中，該設備進一步 201125828 包含-控制器’該控制器用於根據該等溫度感測器的每 一者之一輸出而選擇性調整該等加熱元件之每一者的一 輸出。 在本發明的第二態樣的某些實施例中，該設備進—步 包含-感測器，該感測器用於在該玻璃帶進入該吸熱裝 置的該熱力視野前收集該破璃帶的一厚度分佈資訊，'並 且該厚度分佈資訊饋送至該控制器，以選擇性調整該等 加熱元件及/或該等冷卻管路的每一者的輸出。 / 本發明的該等及其他態樣將在下文中更詳細地描述。 【實施方式】 現在將參閱伴隨的圖式而詳細描述本發明。在此詳述 的說明書中’可能提出多種特定細節以透徹地瞭解本發 明。然而’對熟習此技藝者而言，顯然可無須一些或全 部該等特定細節而操作本發明。在其他例 'J T 丁 ，巳知的 特徵及/或製程步驟可不詳細描述，以不至於非必要性地 混清本發明。此外，類似的或獨一元件符號可用於標注 共通元件或類似元件。 在此所用的「吸熱裝置(heat sink)」一詞是指用於藉由 從環境吸收熱量及發射熱量至環境而調節設備或系統溫 度的裝置。 第1圖繪示設備100,其用於形成具有寬度w與厚度 T的玻璃帶113。設備1〇〇包括向下東弓丨形成構件'ι〇ιΤ 10 201125828 该構件包含楔形部，該楔形部具有終結於楔形根部丄们 的匯抓側1G3 1G5 °玻璃帶113起始於溶融玻璃的兩股 玻璃抓109 111 ’其沿形成構件1 〇 1的匯流側1 〇3、105 向下机動，並且在楔形根部1〇7重合以形成玻璃片。藉 由將溶融玻璃傳遞進入形成構# 1〇1 ^通道並且以已 知方式（諸如描述於美國專利號及 者）使溶融玻璃得以充溢（〇Verfl〇w)通道，而形成炫融玻 璃流 109、111。祐 趙 11。、· 璃帶13以片形式曳引遠離楔形根部 107’如箭號108所示。當玻璃^ 113髮引遠離楔形根部 107時，玻璃帶113冷卻，並且玻璃從黏性的必須環境 (叫㈣轉變彈性的必須環境。在黏性必須環境中的玻璃 帶之冷卻模式影響彈性必須環境中玻璃帶i i 3的厚 度曲線因此’為了達成彈性必須環境中期望的厚度曲 線，控制黏性必須環境中玻璃的冷卻是重要的。 設備⑽包括冷卻設備115，其由吸㈣42qi、複數 個用於加熱吸熱裝置2〇1 、 热70仵2〇7、複數個用於 皿視吸’’’'凌置20 1内溫度分佈的溫度感测器⑽以及複 數個用於傳遞冷卻流體喷射流至吸熱裝置2〇1的管路 120所製成。在操作中，埶 …裒置201疋位於鄰接玻璃 ▼ 113的一部份121。吸埶 *'、、、置201維持在比玻璃帶部 份121更低的溫度，使得熱量從玻璃帶部份⑵傳送到 吸熱裝置201並且吸收進吸轨 .、、、衮置201。加熱元件207 用於塑形吸熱裝置2〇1的埶 .，、、刀曲線。如何塑形吸熱裝置 、、力曲線是取決於玻璃帶部份121的溫度曲線（或 201125828 厚度曲線）。 • 考量第5圖中所示的假想範例，其中玻璃帶部份121 具有區域5〇1、503、505與506,該等區域個別具有溫 • 度 T5〇l、T5〇3、T505 與 T506。T5〇1、T5〇3、T5〇5 與 TS06可沿三個維度變化，但為了簡明起見，Τ5(Η、τ5〇3、 Τ505與Τ506將視為單一數值。現在，假設 Τ501>Τ503>Τ505>Τ506,即玻璃帶部份121内的溫度分 佈非均勻，且假設該問題是使玻璃帶部份丨2 1内的溫度 分佈均勻。在此實例中，可塑形吸熱設備20丨的熱力曲 線’使得吸熱設備20 1以有差異的方式從玻璃帶部份i 2 i 吸收熱量直到T501=T503=T505 = T506。隨後，假設吸熱 裝置201具有區域507、509、511與513，該等區域個 別具有溫度Τ507、Τ509、Τ511與Τ513。該等吸熱裝置 區域507、509、5 11、513之每一者具有一個以上的相關 連的加熱元件207以及一個以上相關連的溫度感測器 209。進一步言之，假設吸熱裝置足夠接近玻璃帶ι21而 因此區域507吸收來自玻璃帶區域501的熱量、吸熱裝 置區域509吸收來自玻璃帶區域503的熱量、吸熱裝置 區域511吸收來自玻璃帶區域505的熱量，而吸熱裝置 . 區域513吸收來自玻璃帶區域506的熱量，其各別如箭 • 號515、517、519與5 20所指。為了達成在玻璃帶部份 121 中 Τ501=Τ503=Τ505二Τ506 ， Τ501 、 Τ503 、 Τ505 與 Τ5 06必須個別減少一些量a、b、c及d，其中a>b>c>d。 可調整吸熱裝置區域507、509、511、513中的加熱元件 12 201125828 207之輸出，使得T507、T509、T511與T513在適當的 設定處以個別從玻璃帶區域501、503、5〇5與5〇6吸收 期望的熱量。一般而言，以下關係為真： Τ507<Τ5〇9<Τ511<Τ513。調整橫跨吸熱裝置2〇1的溫度 分佈使得吸熱裝置20〗能夠以有差異的方式從玻璃帶部 份121吸收熱量是指「塑形吸熱裝置2〇1的熱力曲線」。 另一個考慮玻璃帶部份12ι的途徑是玻璃帶部份121 具有熱區與冷區。為了平均化玻璃帶部份121的熱力曲 線，相較於冷區，更多熱量必須從熱區傳送出去。吸熱 裝置201可用於控制此熱傳。透過在吸熱裝置2〇ι上提 供相對冷及熱的區域，吸熱裝置2〇1能夠以有差異的方 式從玻璃帶部份121吸收熱量，使得破璃帶部份12丨内 的溫度分佈變得更加平均。或者，可考慮玻璃帶部份ΐ2ι 具有厚區與薄區。& 了平均化玻璃帶部份121的厚度曲 線’較多熱量從薄區傳送’而較少熱量從厚區傳送。吸 熱裝置201能夠再度設計成以有差異的方式從玻璃帶部 份121吸收熱4 ’使得橫跨玻璃帶部份ΐ2ΐ的厚度變得 更加均勻。 吸熱裝置201能夠以有差異的方式從玻璃帶部份121 吸收熱量是因為其具有經過塑形的熱力曲線。玻璃帶的 熱力曲線能夠透過控制加熱元件2〇7主動塑形。例如， 某些加熱70件207能夠受到控制，以使某些吸熱裝置2〇1 的區域相對熱，同時某些某些加熱元# 207能夠受到控 制’以使某些吸熱裝置2〇1的區域相對冷。管路12〇(= 13 201125828 嗔射流至吸熱裴置2 0 1上 熱力曲線形狀。然而，可 為的塑形解析度不會如加 度般優良。 1圖）亦能用於傳遞冷卻流體 的點’以影響吸熱裝置20 1的 能單獨透過冷卻流體喷射流所 熱元件2 0 7所助益的塑形解析 吸熱裴置201是具有高熱容量及低熱膨脹的材料塊 體。吸熱裝置加與玻璃帶部份⑵呈相對關係的表面 是連續的。這使得吸熱裝置2〇1生成用於玻璃帶部份⑵ 的吸熱體（heat dump)。在某些實施例中，吸熱裝置加 是板型式（其可如所示般平坦），或可具有其他形狀，將 於下文中進一步描述。在某些實施例中，吸熱裝置201 的材料是陶瓷材料’例如包括但不限於氮化矽與碳化 石夕。碳化石夕是優良的熱散佈體（spreade〇e氣切具有良 好的高溫度強度、潛變抗性（creep resisUnce)以及抗氧化 性。相較於包括碳化矽的多數陶瓷材料，氮化矽亦具有 良好的熱衝擊抗性。氮切的熱導率少於碳切熱導率 的一半。因此，氮化矽可潛在地提供比碳化矽更細微的 溫度曲線。其他並非基於陶瓷的吸熱裝置材料亦可用於 吸熱裝置20 1，例如基於合金或奈米材料之吸熱裝置材 料。 第2圖，‘、、員示及熱裝置2〇1的剖面。力口熱元件207如圖 所示嵌於吸熱裝置201中。可透過例如在吸熱裝置2〇1 中形成孔洞並且將加熱元件207插在孔洞中，而使加熱 元件207嵌於吸熱裝置2〇〖中。在替代性實施例中，加 熱元件207可鄰接且非常接近吸熱裝置2〇1的表面，而 14 201125828 )ι中。此替代性實施例能夠易於置換 在某些實施例中’加熱元件2 〇 7是由 兩溫材料製成的電阻式加熱元件。高溫材料可為惰性材201125828 VI. INSTRUCTIONS: [Corresponding Cases Related to the Case] US Patent Application No. 61/264,017, filed on Nov. 24, 2009. TECHNICAL FIELD OF THE INVENTION The present invention generally relates to a method and apparatus for forming a glass sheet. More particularly, the invention relates to a method and apparatus for controlling the thickness of a glass sheet formed from molten glass. [Prior Art] A system for controlling the thickness of a glass sheet formed from molten glass is described in U.S. Patent No. 3,682,6G9 (S. M. D Gekeny). In the system of U.S. Patent No. 3,682,6G9, the molten glass flows downward on the opposite side of the forming member and joins at the wedge-shaped root of the forming member to form a glass sheet. The glass sheet passes between a pair of opposed housings having a front wall facing the glazing. The front wall is made of a material that has thermal conductivity, low ductility, and low emissivity (such as niobium carbide) 7 in Xingyou Ancient Putian. The fluid conduit is placed in the body. The nozzles of the fluid conduit are positioned in a spaced relationship on the back side of the front wall. ::: The fluid conduit has an associated flow meter that is provided with a control valve and a connection manifold. Each fluid channel & 1, the S delivers a cooling fluid or an additive fluid to the dorsal region of the adjacent front wall... ‘, 1 is deducted and δ, and the fluid delivered is a working emulsion. Heat exchange through pure shot occurs between the glass sheet and the front wall, 201125828 to control the thickness of the glass sheet. If the thickness of the glass sheet is recorded as a curve -), the area that does not span the width of the sheet is thicker than the desired thickness 1 through the area where the cooling glass is adjacent to the thicker area (i.e., the area where the cooling is thin) to correct the thickness recording curve. The fluid conduit corresponding to the adjacent zone is activated to cool the adjacent zone (i.e., the zone of (d)). The patent also creates a heated fluid that is passed to the back side of the front wall to be used as a conduit for the transfer of cooling fluid. In this example, the heated fluid is delivered through a fluid conduit corresponding to a thicker region. This will reduce the stickiness of the thicker areas and then thin the area. The heated fluid may be provided by an electrical winding associated with the fluid conduit. The above S is prepared and S, using the convection cooling centered wall (with / by, , , , conduction diffusion § hai effect) limits the resolution of the field of view of the device. Therefore, glass ribbon control during formation of higher resolution is required. The present invention satisfies this and other needs. SUMMARY OF THE INVENTION Several aspects of the invention are disclosed herein. It should be understood that these aspects may or may not overlap with the other. Therefore, part of one aspect can fall into the category of another, and vice versa. Unless there is a contradiction in the text, B indicates that different aspects should be considered as overlapping each other in the norm. Each aspect is illustrated by a number of embodiments, which in turn can include one or a particular embodiment. It will be appreciated that the embodiments may (or may not) weigh 4[deg.] each other. Thus, a portion of one embodiment (or a particular embodiment thereof) may (or may not) fall within the scope of another embodiment (or a particular embodiment thereof), 201125828 vice versa. Unless otherwise indicated in the text, the different embodiments should be considered as overlapping each other. Therefore, according to the first aspect of the present invention, the method of making a glass sheet is as follows: (A) providing a glass ribbon at a first temperature, wherein at least a portion of the glass ribbon exhibits a viscous performance; (B) Providing a heat sink at a second temperature adjacent to at least a portion of the glass ribbon '(C) locating the plurality of heating elements in a position, wherein the heating elements are operable to shape the heat sink a heatmai pro file of the heat sink, and (d) transferring heat from the at least a portion of the glass ribbon to the heat sink, and absorbing at least a portion of the heat into the heat sink. In some embodiments of the first aspect of the invention, in step (B), the first temperature is lower than the first temperature such that at least a portion of the glass ribbon is cooled by the heat sink. In some embodiments of the first aspect of the invention, in step (B), the first temperature is higher than the first temperature' such that at least a portion of the glass ribbon is tilted by the heat sink. In some embodiments of the first aspect of the invention, in step (c), the heating elements are embedded in the heat absorbing device. In some embodiments of the first aspect of the invention, the method further comprises the steps of: (E) selectively adjusting an output of each of the heating elements to shape the thermal profile of the heat sink, such that The heat is absorbed into the heat sink in a different manner during the step. In some embodiments of the first aspect of the present invention, in step (E), 201125828 is selected to selectively adjust a plurality of regions on the at least a portion of the glass ribbon of each of the heating elements. The heat is transferred from this value, which is inversely proportional to the amount of each of the plants in the area, _ < thickness. In certain embodiments τ of the first aspect of the invention, in step (E), the rounding of each of the heating elements is selectively adjusted such that a thinner region from the at least portion of the glass ribbon Each of the heat transferred is more than the heat transferred from each of the thicker regions on the at least a portion of the glass ribbon. In some embodiments of the first aspect of the invention, in step (8), the output of each of the heating elements is selectively adjusted such that heat is from each of the plurality of regions on at least a portion of the glass ribbon (four) One is transmitted in an amount that is proportional to the temperature of each of the regions. In some embodiments of the first month of the present month, in step (Ε), the output of each of the heating elements such as the adjustment of β is selected such that the light from the glass ribbon is > Each of the hotter regions on the alpha component transmits more heat transferred from each of the cooler regions on the at least a portion of the glass ribbon. In some embodiments of the first aspect of the invention, the method further comprises the following steps: (F) monitoring the thermodynamic curve of the heat sink and using the % view results in the selective adjustment step of the heating This output for each of the components. In some embodiments of the first aspect of the present invention, the method further includes the following steps: (〇) transferring a cooling fluid to the selected point on the heat sink to modify the shape of the thermodynamic curve of the heat sink. 201125828 In some embodiments of the first aspect of the invention, the method further comprises the step of: (H) moving the glass ribbon relative to the heat sink. In certain embodiments of the first aspect of the invention, step (D) is performed simultaneously with step (H). In certain embodiments of the first aspect of the invention, step (A) comprises the steps of: (A1) providing a separate glass stream of molten glass and passing the individual of the molten glass at a wedge-shaped root of the forming member The glass streams coincide to form the glass ribbon. In some embodiments of the first aspect of the invention, in step (D), the at least a portion of the glass ribbon is adjacent the wedge-shaped root. In some embodiments of the first aspect of the invention, in the step, the at least a portion of the glass ribbon is below the wedge-shaped root. According to a second aspect of the present invention, there is provided an apparatus for making a glass sheet comprising: (1) a forming member for forming a glass ribbon. The sinuous forming member includes a wedge portion having a wedge-shaped root portion at which individual glass flows of molten glass are superposed to form the glass ribbon, and (11) a heat absorbing device positioned adjacent to the wedge-shaped root portion The heat sink device can absorb heat from the at least a portion of the glass ribbon; and (iii) a plurality of heating elements and can operate the heating elements in a line. The heat absorbing device has a view of at least a portion of a surface of a surface thereof. The contact or abutment of the heat absorbing device shapes a thermal force of the heat absorbing device. The surface has a thermal field of view covering the glass ribbon. In some embodiments of the first aspect of the apparatus, the apparatus further 201125828 匕 3 plurality of paths "the lines are used to transfer cooling fluid to selected points on the heat sink. Advantageously, the lines are The heat sink is behind and not in the thermal field of view of the glass ribbon. In some embodiments of the second aspect of the invention, the heat sink is placed at a position below the base of the ram. In some implementations In one embodiment, the plate has a flat surface facing the glass ribbon. In some embodiments of the second aspect of the invention, the heat sink comprises a plate comprising a ceramic material, the heat sink in the heat sink The thermal conductivity of the ceramic material at the operating temperature is at least 1/3 of the carbon carbide day. In certain embodiments of the second aspect of the invention, the device comprises a plate Carbide-containing and/or tantalum nitride. In certain embodiments of the second aspect of the invention, the heating elements are embedded in the heat sink. In certain embodiments of the second aspect of the invention The heating elements are behind the heat sink and are not in the thermal field of view of the glass ribbon. In certain embodiments of the second aspect of the invention, the heating elements are resistive heating elements. In some embodiments of the second aspect of the present invention, the apparatus further includes a plurality of temperature sensors coupled to the heat sink to monitor the thermal curve of the heat sink. In some embodiments of the second aspect, the temperature sensing residuals are thermocouples. In certain embodiments of the second aspect of the invention, the apparatus further includes 201120828 including a controller for One of each of the temperature sensors outputs and selectively adjusts an output of each of the heating elements. In some embodiments of the second aspect of the invention, the apparatus further includes a sensor for the Collecting a thickness distribution information of the glass ribbon before entering the thermal field of the heat absorbing device, and feeding the thickness distribution information to the controller to selectively adjust the heating elements and/or the cooling lines The output of each of the present invention will be described in more detail below. [Embodiment] The present invention will now be described in detail with reference to the accompanying drawings. A variety of specific details are set forth to provide a thorough understanding of the invention. However, it is obvious to those skilled in the art that the invention may be practiced without some or all of the specific details. The process steps may not be described in detail so as not to unnecessarily obscure the invention. In addition, similar or unique component symbols can be used to identify common components or the like. As used herein, the term "heat sink" means a device for regulating the temperature of a device or system by absorbing heat from the environment and emitting heat to the environment. Figure 1 shows an apparatus 100 for forming a glass ribbon 113 having a width w and a thickness T. The device 1 includes a downwardly arched member forming member 'ι〇ιΤ 10 201125828. The member comprises a wedge portion having a gripping side 1G3 1G5 at the gripping root of the wedge root. The glass ribbon 113 starts from the molten glass. The two strands of glass grip 109 111' are maneuvered down along the confluence sides 1 〇 3, 105 of the forming member 1 〇 1 and coincide at the wedge roots 1 〇 7 to form a glass sheet. The glazed glass stream 109 is formed by passing the molten glass into a forming channel and forming the molten glass in a known manner (such as described in U.S. Patent No.). 111. Yu Zhao 11. The ribbon 13 is drawn in a sheet form away from the wedge-shaped root 107' as indicated by arrow 108. When the glass is directed away from the wedge-shaped root 107, the glass ribbon 113 cools, and the glass changes from the viscous environment (called (4) to the necessary environment of elasticity. The cooling mode of the glass ribbon in the viscous environment must affect the elastic environment. The thickness curve of the middle glass ribbon ii 3 is therefore 'in order to achieve the desired thickness curve in the environment, it is important to control the viscosity. The cooling of the glass in the environment is important. The device (10) comprises a cooling device 115, which is used by suction (four) 42qi, plural Heating heat sink 2〇1, heat 70仵2〇7, a plurality of temperature sensors (10) for temperature distribution in the dish, and a plurality of cooling fluid jets to absorb heat The tube 120 of the device 2〇1 is made. In operation, the device 201 is located at a portion 121 adjacent to the glass ▼ 113. The suction *', , and 201 are maintained at the specific glass portion 121. The lower temperature causes heat to be transferred from the glass ribbon portion (2) to the heat absorbing device 201 and absorbed into the suction rail.,, and the sill 201. The heating element 207 is used to shape the heat absorbing device 2〇1, 、, 刀Curve. How to mold The heat absorbing device, the force curve depends on the temperature curve of the glass ribbon portion 121 (or the 201125828 thickness curve). • Consider the imaginary example shown in Fig. 5, in which the glass ribbon portion 121 has the regions 5〇1, 503 , 505 and 506, these areas have temperature T5〇l, T5〇3, T505 and T506. T5〇1, T5〇3, T5〇5 and TS06 can vary in three dimensions, but for the sake of simplicity , Τ 5 (Η, τ 5 〇 3, Τ 505 and Τ 506 will be regarded as a single value. Now, suppose Τ 501 > Τ 503 > Τ 505 > Τ 506, that is, the temperature distribution in the glass ribbon portion 121 is non-uniform, and it is assumed that the problem is to make the glass ribbon The temperature distribution in the partial 丨2 1 is uniform. In this example, the thermal curve of the shapeable heat absorbing device 20 使得 causes the heat absorbing device 20 1 to absorb heat from the glass ribbon portion i 2 i in a different manner until T501=T503 = T505 = T506. Subsequently, it is assumed that the heat absorbing device 201 has regions 507, 509, 511 and 513 which individually have temperatures Τ 507, Τ 509, Τ 511 and Τ 513. Each of the heat absorbing device regions 507, 509, 5 11 and 513 One has more than one related plus Thermal element 207 and more than one associated temperature sensor 209. Further, assuming that the heat sink is sufficiently close to glass ribbon ι 21 that region 507 absorbs heat from glass ribbon region 501, heat sink region 509 absorbs from ribbon region 503. The heat, heat sink region 511 absorbs heat from the ribbon region 505, while the heat sink. region 513 absorbs heat from the ribbon region 506, as indicated by arrows 515, 517, 519, and 520. In order to achieve Τ501=Τ503=Τ5052Τ506 in the glass ribbon portion 121, Τ501, Τ503, Τ505, and Τ5 06 must be individually reduced by some quantities a, b, c, and d, where a>b>c>d. The output of the heating element 12 201125828 207 in the heat sink region 507, 509, 511, 513 can be adjusted such that T507, T509, T511 and T513 are individually from the glass ribbon regions 501, 503, 5〇5 and 5〇 at appropriate settings. 6 absorb the desired heat. In general, the following relationship is true: Τ 507 < Τ 5 〇 9 < Τ 511 < Τ 513. Adjusting the temperature distribution across the heat absorbing device 2〇1 so that the heat absorbing device 20 can absorb heat from the glass ribbon portion 121 in a different manner means “the thermal curve of the shaped heat absorbing device 2〇1”. Another way to consider the glass ribbon portion 12 is that the glass ribbon portion 121 has a hot zone and a cold zone. In order to average the thermal curve of the ribbon portion 121, more heat must be transferred from the hot zone than in the cold zone. Heat sink 201 can be used to control this heat transfer. By providing a relatively cold and hot region on the heat absorbing device 2, the heat absorbing device 2〇1 can absorb heat from the glass ribbon portion 121 in a different manner, so that the temperature distribution in the 12-inch portion of the ribbon portion becomes More evenly. Alternatively, it is considered that the glass ribbon portion ΐ2ι has a thick region and a thin region. & The thickness curve of the averaging glass ribbon portion 121 'more heat is transferred from the thin region' and less heat is transferred from the thick region. The heat absorbing device 201 can be redesigned to absorb heat 4' from the glass ribbon portion 121 in a different manner so that the thickness across the glass ribbon portion ΐ2ΐ becomes more uniform. The heat sink 201 is capable of absorbing heat from the glass ribbon portion 121 in a differential manner because it has a shaped heat profile. The thermodynamic curve of the glass ribbon can be actively shaped by controlling the heating element 2〇7. For example, some of the heating 70 207 can be controlled so that the areas of some of the heat absorbing devices 2 〇 1 are relatively hot, while some of the heating elements # 207 can be controlled 'to make certain heat absorbing devices 2 〇 1 Relatively cold. Pipeline 12 〇 (= 13 201125828 嗔 jet to the heat absorbing device 2 0 1 on the shape of the thermal curve. However, the shape resolution can not be as good as the degree of addition. 1) can also be used to transfer cooling fluid The shape-resolving heat-absorbing device 201, which is beneficial to the heat-absorbing device 20 1 and which is capable of transmitting the heat-receiving element by the cooling fluid jet alone, is a block of material having a high heat capacity and low thermal expansion. The surface of the heat absorbing device which is opposite to the glass ribbon portion (2) is continuous. This causes the heat sink 2〇1 to generate a heat dump for the glass ribbon portion (2). In some embodiments, the heat sink is a plate type (which may be flat as shown) or may have other shapes as will be further described below. In some embodiments, the material of the heat sink 201 is a ceramic material' such as, but not limited to, tantalum nitride and carbon carbide. Carbonized stone is an excellent heat spreader (spreade〇e gas cut has good high temperature strength, creep resisUnce and oxidation resistance. Compared with most ceramic materials including tantalum carbide, tantalum nitride It has good thermal shock resistance. The thermal conductivity of nitrogen cutting is less than half of the thermal conductivity of carbon cutting. Therefore, tantalum nitride can potentially provide a finer temperature curve than tantalum carbide. Other ceramic-based heat sink materials It can also be used for the heat absorbing device 20 1, for example, a material of a heat absorbing device based on an alloy or a nano material. Fig. 2, ', and the cross section of the heat device 2 〇 1. The heat sensor 207 is embedded in the heat absorbing as shown in the figure. In the device 201, the heating element 207 can be embedded in the heat sink 2 by, for example, forming a hole in the heat sink 2〇1 and inserting the heating element 207 into the hole. In an alternative embodiment, the heating element 207 It can be adjacent and very close to the surface of the heat sink 2〇1, and 14 201125828). This alternative embodiment can be easily replaced. In some embodiments the heating element 2 〇 7 is a resistive heating element made of a two-temperature material. High temperature materials can be inert materials
非敗於吸熱裝置 故障的加熱元件 料’即抗氧化的材料 鉑合金以及貴重金屬1 元件207是由高溫材ί 、·友丨加熱元件或非線性加熱元件。倘若加熱元件為線性 加熱70件，可透過在相鄰加熱元件207之間的微小間隔 而達成細微地控制橫跨吸熱裝置2 0 1的溫度曲線。 加熱元件207可嵌於具有或不具有鞘套的吸熱裝置 2〇1中，其取決於吸熱裝置201的材料。例如，倘若吸 熱裝置201的材料是電絕緣體（諸如氮化矽），則加熱元 件無須加上鞘套。另一方面，倘若吸熱裝置2〇1的材料 是導電體（諸如碳化矽），則加熱元件須加上鞘套。第3 圖顯示具鞘套的加熱元# 2G7之範例，其包括由高溫絕 緣體3G2環繞的高溫導體（或導線）300,而高溫絕緣體 3〇2被高溫鞠套304所環繞。例如，高溫導體3⑼可由 鉑、鉑合金與責重金屬合金等製成。高溫絕緣體3〇2可 由氧化鎂、氧化鋁、氧化鈐及氧化鈹等製成。高溫鞘套 304可由鉑合金或其他高溫金屬或合金製成。可使用其 他適合用作高溫導體、高溫絕緣體與高溫勒套的材料。 溫度感測器209至少部份嵌於第2圖的吸熱裝置2〇1 中。可透過例如在吸熱裝£ 201巾开）成孔洞並且將溫度 感測器209至少部份插入該等孔洞，而將溫度感測器2〇9 15 201125828 嵌於吸埶贺罟？ n,丄 ·’、 01中。在替代性實施例中，溫度感測器 可錢在吸熱農置加表面上。溫度感㈣209可 例如為熱偶或熱敏電阻器（thermis叫。—般而言，期望 :度感測益是由在氧化大氣中惰性並且能夠耐受高溫的 料製成。當溫度感測器209為高溫熱偶時，該熱偶可 由始、翻合金或貴重金屬合金製成。如在加熱元件207 的實例中，溫度感測器209 (例如熱偶）與吸熱裝置2〇ι 之間可需要或不需要電隔離，其視吸熱裝置2〇1的材料 而定。在需要電隔離時（諸如若吸熱裝置2〇ι的材料是 碳化石夕時）’將加熱元件2G7加上稍套的類似解決途徑可 用於溫度感測器209。 加熱兀件207是設計成生成熱量。例如，倘若加熱元 件207是電阻式加熱元件，電功率可傳遞至加熱元件… 以引發加熱元件207生成熱量。由加熱元件2〇7生成的 熱量散逸至吸熱裝置201。第4圖顯示溫度感測器2〇9 與加熱7G # 207耗接控制器彻。控制器彻具有三個 功能：讀取溫度、指示功率、與輸出功率。控制器彻 接收來自溫度感測H 209的輸出訊號。輸出訊號用於生 成電流熱力曲線以供吸熱裝置2〇1所用。用於吸熱裝置 201的電流熱力曲線與期望的吸熱裝置2〇ι的熱力曲線 相較。隨後，㈣器400據此調控對加熱元件2〇7的輸 出功率。透過訊號輸出控制反饋迴圈，控制器彻調整 電流熱力曲線以使之匹配期望的熱力曲線。期望的吸熱 裝置2〇1之熱力曲線由玻璃帶部份121 (第i圖）的溫 16 201125828 其如前文所解釋。 度曲線或厚度曲線所指示 吸熱裝置加如第2圖所示為平坦的矩形板。在替代 性實施例中’吸熱裝置201或吸熱裝置2〇1與玻璃帶部 伤121 (第1圖）呈相對關係的表面可具有非平坦形狀 (例如彎曲形狀）’以使吸熱裝置2〇1與玻璃帶部份⑵ U 1圆）之間的輕射視角因子 最大化。幸昌射視角因子是離開玻璃帶部份ΐ2ι (第⑷ 的表面之熱能與抵達吸熱裝i 2〇1的表面之熱能的比 值，其整體而言是由吸熱裝置2〇1與玻璃帶部份⑵（第 1圖）的幾何計算而決定。吸熱裝置2〇1的厚度取決於 吸熱裝置材料的傳導性。大體而言，吸熱裝置材料的熱Non-destructive heating element Faulty heating element Material 'that is, anti-oxidation material Platinum alloy and precious metal 1 element 207 are made of high temperature material, 丨, heating element or non-linear heating element. If the heating element is linearly heated by 70 pieces, the temperature profile across the heat sink 200 can be finely controlled by the small spacing between adjacent heating elements 207. The heating element 207 can be embedded in the heat sink 2?1 with or without a sheath depending on the material of the heat sink 201. For example, if the material of the heat sink 201 is an electrical insulator such as tantalum nitride, the heating element need not be sheathed. On the other hand, if the material of the heat absorbing device 2〇1 is an electrical conductor such as tantalum carbide, the heating element must be sheathed. Figure 3 shows an example of a sheathed heating element #2G7 comprising a high temperature conductor (or wire) 300 surrounded by a high temperature insulator 3G2 surrounded by a high temperature jacket 304. For example, the high temperature conductor 3 (9) may be made of platinum, a platinum alloy, a heavy metal alloy or the like. The high temperature insulator 3〇2 can be made of magnesium oxide, aluminum oxide, cerium oxide, cerium oxide or the like. The high temperature sheath 304 can be made of a platinum alloy or other high temperature metal or alloy. Other materials suitable for use as high temperature conductors, high temperature insulators and high temperature jackets can be used. The temperature sensor 209 is at least partially embedded in the heat sink 2〇1 of Fig. 2. The temperature sensor 2〇9 15 201125828 can be embedded in the suction 埶 by inserting a hole into the hole, for example, by inserting a temperature sensor 209 into the hole. n, 丄 · ', 01. In an alternative embodiment, the temperature sensor can be used on an endothermic surface. Temperature sensation (4) 209 can be, for example, a thermocouple or a thermistor (thermis called. - Generally, it is desirable that the sensibility measurement is made of a material that is inert in the oxidizing atmosphere and can withstand high temperatures. When the temperature sensor When 209 is a high temperature thermocouple, the thermocouple can be made of a starting, overturning alloy or a precious metal alloy. As in the example of heating element 207, between temperature sensor 209 (e.g., thermocouple) and heat sink 2〇 Electrical isolation may or may not be required depending on the material of the heat sink 2〇1. When electrical isolation is required (such as if the material of the heat sink 2〇 is carbonized stone), the heating element 2G7 is slightly covered. A similar solution can be used for the temperature sensor 209. The heating element 207 is designed to generate heat. For example, if the heating element 207 is a resistive heating element, electrical power can be transferred to the heating element... to induce the heating element 207 to generate heat. The heat generated by the heating element 2〇7 is dissipated to the heat sink 201. The fourth figure shows that the temperature sensor 2〇9 and the heating 7G#207 are exhausted to the controller. The controller has three functions: reading temperature, indicating power And lose Output power: The controller receives the output signal from the temperature sensing H 209. The output signal is used to generate a current thermodynamic curve for use by the heat absorbing device 2 〇 1. The current thermal curve for the heat absorbing device 201 and the desired heat absorbing device 2 The thermal curve of ι is compared. Subsequently, the (four) device 400 adjusts the output power to the heating element 2〇7. The signal is output through the control feedback loop, and the controller adjusts the current thermodynamic curve to match the desired thermal curve. The thermal curve of the heat absorbing device 2〇1 is determined by the temperature of the glass ribbon portion 121 (Fig. i), which is as explained above. The heat sink is indicated by the degree curve or the thickness curve as shown in Fig. 2 as a flat rectangle. In an alternative embodiment, the surface of the heat absorbing device 201 or the heat absorbing device 201 and the glass ribbon portion 121 (Fig. 1) may have a non-flat shape (e.g., a curved shape) to allow the heat absorbing device 2 The light-angle viewing angle factor between 〇1 and the glass ribbon portion (2) U 1 circle is maximized. The Xingchang shot angle factor is the ratio of the thermal energy leaving the surface of the glass ribbon ΐ2ι (the surface of the (4) to the surface of the heat sink i 2〇1, which is generally the heat sink 2〇1 and the glass ribbon part (2) The geometric calculation of (Fig. 1) is determined. The thickness of the heat sink 2〇1 depends on the conductivity of the material of the heat sink. In general, the heat of the material of the heat sink
導率愈低，則所需的吸熱裝置之厚度愈薄。例如H 化矽製成的吸熱裝置的厚度可為碳化矽所製成的吸熱裝 置的一半，並且傳遞與碳化矽相當的熱通量，其中q = ΚΔΤ/Χ，其中K是熱導率’ Δτ是溫度差而X是基材厚 度。例如’倘若寸（2 54㈣)厚的碳切傳遞特 定的q ’則欲傳遞相同的q需要G.5英州.27⑽)厚的氣 化矽。 回到第1圖，製做玻璃片的方法涉及形成玻璃帶113， 如前文所述。在形成玻璃帶113的同時，吸熱裝置201 定位在鄰接玻璃帶113的„部份121處，使得熱量透過 輻射從玻璃帶部份121傳送到吸熱裝置2G1。吸熱襄置 201基本上是做為玻璃帶部份121的吸熱體。玻填帶部 伤121瓜疋處於玻璃顯現黏性表現的溫度，同時吸熱 17 201125828 裝置2(H所處的溫度低於玻璃帶部份i2i溫度。玻璃帶 P伤121的位置-般是在接近楔形根部【冑（在楔形 根部1G7上方或下方），其中玻璃仍可能是在黏性的必須 衣士兄中。吸熱裝置201的寬度決定玻璃帶部份121的寬 度’因吸熱裝i 201是做為玻璃帶部份121的吸熱體。 一般而言，吸熱裝置201的寬度類似玻璃帶ιΐ3的寬度， 但在其他範例中可比玻璃帶113的寬度更短或更長Γ 吸熱裝i 201卩有差異的方式„及收來自玻璃帶部份 121的熱里。s玄差異式吸收是由吸熱裝置的熱力曲 線所決定，訪由加熱元件207以及視情況任選地由來 自管路120的冷卻流體喷射流所控制，其如前文所解 釋。在某些實施例中，吸熱裝置2〇1的熱力曲線是使得 熱3：從玻璃帶121的不同區域以一量值傳送到吸熱裝置 20卜該量值反比於在該些區域中的玻璃厚度。在某些實 施例中，吸熱裝置2〇 1的熱力曲線使得從玻璃帶部份^ 2 ^ 的較薄區域傳送至吸熱裝置2〇1的熱量多於從玻璃帶部 伤121的較厚區域傳送至吸熱裝置2〇1的熱量。最終結 果可為吸熱裝置201有以差異的方式從玻璃帶部份121 吸收熱量，使得玻璃帶部份121的溫度曲線或厚度曲線 更加均勻。 當玻璃帶113移動遠離形成構件1〇1的楔形根部1〇7 時，具有修改過的溫度曲線或厚度曲線的玻璃帶部份^ 2 ^ 會與玻璃帶113移動。新的玻璃帶部份將會取代舊的玻 璃帶部份121。吸熱裝置可從新的玻璃帶部份以有差異The lower the conductivity, the thinner the thickness of the desired heat sink. For example, a heat sink made of H bismuth can be half the thickness of a heat sink made of tantalum carbide and deliver a heat flux equivalent to that of tantalum carbide, where q = ΚΔΤ/Χ, where K is the thermal conductivity 'Δτ It is the temperature difference and X is the thickness of the substrate. For example, if the inch (2 54 (four)) thick carbon cut passes a specific q ′, then the same q is required to require G.5 Yingzhou.27(10)) thick gasification enthalpy. Returning to Figure 1, the method of making a glass sheet involves forming a glass ribbon 113 as previously described. While forming the glass ribbon 113, the heat absorbing device 201 is positioned adjacent to the portion 121 of the glass ribbon 113 such that heat is transmitted from the glass ribbon portion 121 to the heat absorbing device 2G1 through the radiation. The heat absorbing device 201 is basically used as a glass. The endothermic body with part 121. The glass-filled part of the wound is 121 in the temperature at which the glass shows viscous performance, and the endothermic heat is 17 201125828 device 2 (H is at a temperature lower than the temperature of the glass ribbon portion i2i. The position of 121 is generally near the wedge root [胄 (above or below the wedge root 1G7), where the glass may still be in the viscous must-have. The width of the heat sink 201 determines the width of the glass strip portion 121. 'Because the heat absorbing i 201 is a heat absorbing body as the glass ribbon portion 121. In general, the heat absorbing device 201 has a width similar to that of the glass ribbon ι 3, but in other examples may be shorter or longer than the width of the glass ribbon 113.吸 The heat sink i 201 has a different way „ and receives the heat from the glass ribbon part 121. The sin differential absorption is determined by the thermal curve of the heat sink, accessing the heating element 207 and optionally optionally The cooling fluid jet from line 120 is controlled as previously explained. In some embodiments, the thermal profile of heat sink 2〇1 is such that heat 3: is transmitted from a different region of glass ribbon 121 by a magnitude The amount to the endothermic device 20 is inversely proportional to the thickness of the glass in the regions. In some embodiments, the thermal profile of the heat sink 2〇1 is such that it is transferred from the thinner region of the glass ribbon portion to the endothermic portion The heat of the device 2〇1 is more than the heat transferred from the thicker region of the glass ribbon portion 121 to the heat absorbing device 2〇1. The end result is that the heat absorbing device 201 absorbs heat from the glass ribbon portion 121 in a different manner, so that The temperature profile or thickness curve of the glass ribbon portion 121 is more uniform. When the glass ribbon 113 moves away from the wedge-shaped root portion 1〇7 of the forming member 1〇1, the glass ribbon portion having the modified temperature profile or thickness curve ^ 2 ^ Will move with the glass ribbon 113. The new glass ribbon portion will replace the old glass ribbon portion 121. The heat sink can be different from the new glass ribbon portion.
18 S 201125828 的方式吸收熱量，該方式如前文 ^ + 又計對售的破螭帶部份】2 j 所述。由於玻璃帶丨13持續移 & 動逑離楔形根部1〇7,故 此1程可重複用於每一批鄰接 帶部份。在某些實施例中，安置201的新的玻璃 器以^ 文袁—感測器或複數個感測 裝置上方玻璃帶的厚度，…跨::力二野之•及熱 杈跨玻璃帶寬度的厚廋分佑 ::饋送至加熱元件及/或冷卻流體管路的控制系統，以 :地調整吸熱裝置的溫度分佈，因而有效調整破璃帶 通過吸熱裝置的熱力視野時的玻璃帶溫度及/或厚f 具有經塑形的熱力曲線的吸埶 制玻璃帶部份121的、” 1可用於單獨控 的/皿度。或者，具有經塑形的熱力曲 熱裝置2G1可與來自管路120的冷卻流體噴射流 一起使用’以控制玻璃帶部份121的厚度。如先前所解 /部机體噴射流可具有對吸熱裂置2〇ι的熱力曲線 之形狀的效應（儘管此類效應可為全面性），同時仰賴加 二_牛207以細微地控制熱力曲線的形狀。管路1 可 員似於美國專利號3’682,6〇9中所述的流體導管，且可透 過流量計（H1 φ -、 μ IS!中未不）與控制閥（圖中未示）連接歧管 圖中未不h由官路120所傳遞的流體可為空氣。吸熱 ，置2〇1可用於代替美國專利號3,682,609中所述的居中 ^ ♦應主思到，塑形吸熱裝置201的熱力曲線以達成玻 ▼ 15伤12 1的厚度控制需要一些玻璃帶部份12 1的溫 I刀佈或厚度曲線的認知。此可涉及主動測量玻璃帶部 1或可基於使用特定製程設定與參數組而獲得的歷 201125828 史資料。 :熱裝置組件201可為單-單元，其寬度足以覆蓋玻 璃了部份121的寬度，其中玻璃帶部份121 %寬度可與 玻璃帶⑴的寬度W相同或不同。或者，吸熱 可具有模組式結構’其中複數個模組能夠一個接一個排 列，以形成期望寬度的吸熱裝£ 2〇1。或者，複數個模 組可個別排列在需要厚度控制的玻璃帶113的部份中。、 在某些實施例中，亦可能控制吸熱裝置的溫度而使得 至少部份面對玻璃帶的吸熱裝置表面具有高於吸熱裝置 熱力視野内玻璃帶相對應區域的溫度。在這些實施例 中，熱量從吸熱裝置傳送到玻璃帶，有效地升高暴露區 域的溫度與玻璃黏性，因而減少在玻璃帶良引時的厚度。 已就有限數目的實施例描述本發明，熟習此技藝者在 閱讀此說明書後將瞭解可設計其他不背離在此所揭露的 本發明範疇的實施例。據此，本發明之範疇僅受限於隨 後的申請專利範圍。 【圖式簡單說明】 隨後是圖式的敘述。為了清楚簡明起見，該等圖式無 須按比例繪製，且該等圖式的某些特徵與某些視角可在 比例上誇張化或概略繪示。 第1圖概略繪示本發明一個實施例中用於製作具有受 控制之厚度的玻螭片的設備。 20 201125828 第2圖概略繪示本發明一個實施例中吸熱裝置的叫 . 面’該吸熱裝置用於以有差異的方式從破璃帶的_部分 吸收熱量。 第3圖概略繪示本發明一個實施例中具鞘套的加熱元 件之剖面，該加熱元件用於第2圖中的吸熱裝置。 第4圖是本發明一個實施例中一設備的方塊圖，該設 備用於控制第2圖之吸熱裝置的熱力曲線。 第5圖概略繪示第2圖的吸熱裝置如何能用於以有差 異的方式從玻璃帶的一部分吸收熱量。 【主要元件符號說明】 100 設備 2〇9溫度感測器 101 形成構件 3〇〇高溫導體 103 、1 0 5 側 3 0 2 向溫絕緣體 107 楔形根部 304 南溫鞘套 108 箭號 400控制器 109 、U1坡璃流 501、503、505、 506 區 113 玻璃帶 域 115 冷卻裝置 515、517、519、 520 箭 120 管路 號 121 破璃帶部份 507、509、511、 513 區 201 吸熱裝置 域 207 加熱元件 515、517、519、 520 箭 21 201125828The way of 18 S 201125828 absorbs heat, as described in the previous section ^ + also for the part of the broken belt sold] 2 j. Since the glass ribbon 13 continues to move away from the wedge root 1〇7, the one pass can be repeated for each batch of adjacent strip portions. In some embodiments, the new glass of the 201 is placed in the thickness of the glass ribbon above the sensor or the plurality of sensing devices, ... span:: force two wilderness • and hot cross spanning glass ribbon width Thickness:: a control system that feeds the heating element and/or the cooling fluid line to adjust the temperature distribution of the heat absorbing device, thereby effectively adjusting the temperature of the glass ribbon when the glass ribbon passes through the thermal field of the heat absorbing device and / or thick f has a shaped thermodynamic curve of the suction glass ribbon portion 121, "1 can be used for individual control / dish. Or, with a shaped heat koji 2G1 can be with the pipeline The cooling fluid jets of 120 are used together to control the thickness of the glass ribbon portion 121. As previously explained, the partial body jets may have the effect of the shape of the thermal curve of the endothermic cracking 2 ( (although such effects It can be comprehensive), while relying on the addition of the second _ 207 to finely control the shape of the thermodynamic curve. The pipe 1 can be similar to the fluid conduit described in U.S. Patent No. 3'682,6,9, and the flow rate is permeable. Count (H1 φ -, μ IS! not in) and control (not shown) The fluid in the connection manifold diagram that is not transferred by the official road 120 may be air. The heat absorption, set 2〇1, may be used instead of the centering described in U.S. Patent No. 3,682,609. The thermal curve of the shaped heat absorbing device 201 to achieve the thickness control of the glass 12 15 1 requires the knowledge of the temperature I knife cloth or the thickness curve of some of the glass ribbon portions 12 1 . This may involve actively measuring the glass ribbon portion 1 or Based on the history of 201125828 obtained using a specific process setting and parameter set: The thermal device assembly 201 can be a single-unit having a width sufficient to cover the width of the glass portion 121, wherein the glass ribbon portion is 121% wide and glass The width W of the belt (1) is the same or different. Alternatively, the heat absorption may have a modular structure in which a plurality of modules can be arranged one after another to form a heat absorbing package of a desired width. Alternatively, the plurality of modules may be individually Arranged in a portion of the glass ribbon 113 that requires thickness control. In some embodiments, it is also possible to control the temperature of the heat sink such that at least a portion of the surface of the heat sink facing the glass ribbon has a higher heat absorption The temperature of the corresponding zone of the glass ribbon in the thermal field of view of the device. In these embodiments, heat is transferred from the heat sink to the glass ribbon, effectively increasing the temperature of the exposed area and the viscosity of the glass, thereby reducing the thickness of the glass ribbon. The invention has been described in terms of a limited number of embodiments, and it will be understood by those skilled in the art of this disclosure that the invention can be devised without departing from the scope of the invention disclosed herein. The scope of the following patent application. [Simplified description of the drawings] The following is a description of the drawings. For the sake of clarity and conciseness, the drawings are not necessarily drawn to scale, and certain features of the drawings may be Scaled exaggerated or schematic. Figure 1 schematically depicts an apparatus for making a glass sheet having a controlled thickness in one embodiment of the invention. 20 201125828 Fig. 2 is a schematic view showing the heat absorbing device of the embodiment of the present invention. The heat absorbing device is for absorbing heat from the _ portion of the broken glass ribbon in a different manner. Fig. 3 is a schematic cross-sectional view showing a cross section of a heating element having a sheath in an embodiment of the present invention, the heating element being used in the heat absorbing device of Fig. 2. Figure 4 is a block diagram of an apparatus for controlling the thermal profile of the heat sink of Figure 2 in an embodiment of the present invention. Figure 5 is a schematic representation of how the heat sink of Figure 2 can be used to absorb heat from a portion of the ribbon in a differential manner. [Main component symbol description] 100 Device 2〇9 temperature sensor 101 Forming member 3〇〇 High temperature conductor 103, 1 0 5 Side 3 0 2 Temperature insulator 107 Wedge root 304 South temperature sheath 108 Arrow 400 controller 109 , U1 glaze flow 501, 503, 505, 506 area 113 glass band 115 cooling device 515, 517, 519, 520 arrow 120 pipe number 121 broken glass part 507, 509, 511, 513 area 201 heat sink domain 207 heating elements 515, 517, 519, 520 arrows 21 201125828