TW201125455A - Method for manufacturing printed circuit board - Google Patents

Abstract

A method for manufacturing a printed circuit board includes steps below. Firstly, an inner substrate, a first copper clad laminate, and a first adhesive layer are provided. The first copper clad laminate includes a first product region, a first non-product region, and a first blank region waited to be removed. Portion of the first removing region adjoins the first production region; other portion of the first removing region adjoins the first non-production region. Secondly, a first opening is defined along an imaginary boundary line of the first blank region and the first production region. Thirdly, a first through hole is defined in the first adhesive layer. The first through hole is corresponding to the first blank region. Fourthly, the first adhesive layer and the first copper clad laminate are stacked and laminated on the inner substrate. Fifthly, first electrically conductive circuits are formed in the first copper clad laminate. Sixthly, a second opening is defined along an imaginary boundary line of the first blank region and the first non-production region, thereby a second through hole communicating with the first through hole is defined in the first copper clad laminate and a material of the first blank region is removed.

Description

201125455 VI. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a circuit board "field" particularly to a method of producing a flat flexible circuit board. [Prior Art·] [〇〇〇2] Printed circuit boards are widely used due to their high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A. 〇〇ki N. Nagai, A. Akah〇Shi, H. Mukoh, A. Wajima M. Res. Lab., High density multilayer prin_

Ted Circuit board jjiTAC M-880 ' IEEE Ding Tans, on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 4l8-425 [0003] The need for miniaturization of electronic devices 'applies to circuit boards in electronic devices The size after packaging becomes smaller. In the circuit board, it is not necessary to provide a region for forming a line, which is used for mating or plugging the electronic components to each other, thereby reducing the space occupied by the entire circuit board package. In the production process, it is necessary to form a pair of blue-and-white woven and secret materials (4) in the circuit board, so that the area where the opening should be handled is likely to cause wrinkles in the process of manufacturing the circuit board, thereby affecting the circuit. Yield of board products. SUMMARY OF THE INVENTION [0004] It is necessary to provide a method for producing a good flatness. Circuit Board [0005] A method of fabricating a circuit board will be described below by way of embodiments. 099100459 Table·Single number A0101 Page 4 of 30 0992001007-0 201125455

[0006] - ίΦ Φ nA buried circuit board manufacturing method, comprising the steps of: providing an inner substrate, a first steel plate and a first adhesive layer, wherein the first copper clad plate comprises a first product region, a first non-product region and a first Remove the area. The first removal area # is adjacent to the first product area, and the other part of the first removal area is adjacent to the first non-product area. The first copper clad laminate has a first copper foil layer. The inner substrate has a first surface. A first opening is formed along the intersection of the first removal region and the first product region such that the first removal region and the first product region are separated from each other. A first via corresponding to the first removed region is formed in the first adhesive layer. The first adhesive layer and the first copper clad laminate are sequentially stacked on the first surface of the substrate, and the first adhesive layer, the first copper clad laminate and the inner layer substrate are pressed. Forming a first conductive line on the first foil layer of the first copper clad laminate. A second opening is formed along the intersection of the first removal region and the first non-product: region. The second opening and the first opening communicate with each other to remove the material copper clad plate of the first removal region, thereby forming a second through hole corresponding to the first removal region in the first copper clad plate. [0071] Compared with the prior art, in the circuit board manufacturing method provided in this embodiment, before the pressing and the manufacturing of the conductive binding, the removal area between the first copper clad plate and the second copper clad plate and the product area are Forming an opening, the removal area and the product area are separated from each other and communicate with the non-product area, and the removal area is removed after forming the conductive line, thereby avoiding the circuit board caused by the inconsistent expansion and contraction when pressing and manufacturing the conductive line The board product produced by the enemy is bad. [Embodiment] [8] The circuit board manufacturing method provided by the present technical solution will be further described below with reference to the accompanying drawings and embodiments. 099100459 Form No. A0101 Page 5 / Total 30 Page 0992001007-0 201125455 [0009] The circuit board manufacturing method provided by the technical solution includes the following steps: [〇〇1〇] In the first step, referring to FIG. 1, an inner substrate 110 is provided. The first copper clad laminate 12 and the first adhesive layer 130. In the embodiment, the inner substrate 110 is a copper clad laminate, and the inner substrate 11 includes an inner insulating layer 112 and an inner copper box layer 111 formed on the inner insulating layer u 2 . The inner substrate 110 has a first surface 113 opposite to the second surface 114. The inner substrate 110 may also be a double layer or a multilayer circuit substrate on which conductive lines are formed. [0012] The first copper clad layer 120 includes an insulating layer 12: a first copper layer 121 formed on the first insulating layer 122. The inner substrate and the first copper clad layer 12 are insulated from the layer of the first copper clad 12, which is commonly known in the art as polythenimine, polyethylene terephthalate, polytetrafluoroethylene, polythioamide, polymethyl methacrylate. Ester, polycarbonate or polyimine-polyethylene - made of materials such as stupid copolymer. The first adhesive layer 130 may be made of epoxy resin or acrylic. [0013] The first copper clad laminate 120 includes a first non-product region 123' first product region 124 and a first removal region 125. The first non-product area 123 is an area in which no conductive line is formed in the area, and the first product area 124 is an area in which a conductive line is to be provided. The first removal region 125 is the region to be removed in the subsequent process so that the corresponding locations of the fabricated circuit board form a recess. The first removal region 125 is partially adjacent to the first product region 丨24, and the other portions are adjacent to the first non-product region 123. In this embodiment, the first removal area 125 is a rectangle, and includes a first side 1251, a second side 1252, a third side 1253, and a fourth side 1254 which are sequentially connected, 099100459 Form No. A0101 Page 6 / Total 30 Page 0992001007 -0 201125455 [0014] [0016] [0018] [0018]

The first side 1251 is adjacent to the first non-product area 123, and the other three sides are adjacent to the first product area 124. The shape of the first removal region 125 corresponds to the shape of the cross-section of the recess in which the circuit board is to be formed. It may also be circular or polygonal in shape having at least a portion adjacent to the first product region 124. In the second step, referring to FIG. 2 and FIG. 3, a first opening 126 is formed between the first removal region 125 and the first product region 124. The first opening 126 is formed along the second side 1 252, the third side 1253 and the fourth side 1254 of the first removal region 125 by punching or cutting, such that the first removal region 125 and the first product region 124 Not connected. The first side 1251 of the first removal region 125 is still interconnected with the first non-product region 123. In the third step, a first through hole 131 corresponding to the first removal region 125 is formed in the first adhesive layer 130. A plurality of first via holes 131 corresponding to the first removal region 125 are formed in the first adhesive layer 130 by punching or cutting. Preferably, the shape of the cross section of the first through hole 131 is the same as the shape of the corresponding first removal area 125, and the area of the cross section of the first through hole 131 is slightly larger than the area of the first removal area 125. [0020] In the fourth step, referring to FIG. 4 and FIG. 5, the first adhesive layer 130 and the first copper clad 120 are sequentially stacked on the inner insulating layer 112 of the inner substrate 110, and the inner substrate is pressed. 110. The first adhesive layer 130 and the first copper clad laminate 120. The first adhesive layer 130 and the first copper clad layer 120 are sequentially stacked on the inner layer substrate 110, the inner insulating layer 1 1 2 side, that is, the first surface 1 1 3, on the inner layer 110 form number Α0101 7th/to 30 pages 0992001007-0 201125455, The first insulating layer 122 of the first copper clad layer 120 is adjacent to the first adhesive layer 130, and the first through hole 131 in the first adhesive layer 130 is perpendicular to the first removed region 125 of the first copper clad laminate 12 Corresponding to the direction in which the inner substrate 11 is located. [0025] [0025] [0025] [0026] The stacked inner substrate 110, the first adhesive layer 130 and the first copper clad 120 are heated and pressurized, because the first adhesive layer 130 has viscosity Thereby, the inner substrate 110 and the first copper clad laminate 12 are bonded and cured, and the inner layer substrate 110, the first adhesive layer 130 and the first copper clad layer 120 form a flat whole structure. ........................ When the inner substrate 110 is a two-layer or multi-layer substrate on which conductive lines are formed, the inner surface of the inner substrate 110 is opposite to the first surface Η 3 The second surface 114 can press the first adhesive layer 130 and the first copper clad laminate 2〇. In the fifth step, referring to FIG. 6, a conductive line 11 5 is formed in the inner copper foil layer of the inner substrate 11 , the first cover, the copper bead; and the first conductive layer is formed in the first copper foil layer 121 Line 127. In this embodiment, the conductive traces 115 are formed in the inner copper foil layer 111 of the inner substrate 110 by the image transfer process etch process, and the first conductive traces 127 are formed in the first copper foil layer 121 of the first copper clad laminate 120. . When the inner substrate 110 is a double-layer or multi-layer substrate in which a conductive line is formed, it is not necessary to form a conductive line in the inner substrate 110 in this step. The first step is shown in FIG. 7 'providing the second copper clad plate 160 and the second rubber layer 170 099100459 Form No. A0101 Page 8 / Total 30 pages 0992001007-0 201125455 [0027] The second copper clad plate 160 and the first copper clad plate 120 The second copper clad plate 160 is composed of a second copper foil layer 161 and a second insulating layer 162. The second copper clad plate 160 includes a second non-product region 163, a second product region 164, and a second removal region 165. The second removal region 165 is identical in shape and equal in size to the first removal region 125. The second removal region 165 is also rectangular, having a fifth edge 1651 adjacent to the second non-product region 163, and a second product region 164. Adjacent to the sixth side 1652, the seventh side 1 653 and the eighth side 1 654. The second adhesive layer 170 has the same structure as the first adhesive layer 130. ^ [0028] In the seventh step, please refer to FIG. 9 together. Up to 10, a third opening 166 is formed between the second removal region 165 and the second product region 164. [0029] By way of punching or cutting, along the sixth side 1 652 of the second removal region 165, The seven sides 1 653 and the eighth side 1 654 form a third opening 166, such that the second removal zone 165 is not connected to the second product area 164. The fifth side 1651 of the second removal area 165 is still interconnected with the second product area 164. [0030] The eighth step, the formation and the second layer The third through hole 171 corresponding to the second removal region 165 is formed in the second adhesive layer 170 by punching or cutting. Preferably, the first through hole 171 corresponding to the second removal region 165 is formed. The shape of the cross section of the three-way hole 171 is the same as that of the corresponding second removal area 165, and the area of the cross section of the third through hole 171 is slightly larger than the area of the second removal area 165. [0032] In the ninth step, please refer to the figure. 10, the second adhesive layer 170 and the second copper clad plate 160 099100459 Form No. A0101 Page 9 / Total 30 pages 0992001007-0 201125455 [0034] [0036] [0037] [0037] sequentially stacked and pressed The second conductive layer 162 of the second copper clad laminate 160 is adjacent to the second adhesive layer 127. First, the second adhesive layer 170 and the second copper clad laminate 16 are sequentially stacked and pressed. On the first 'the second insulating layer 162 of the second copper clad laminate 16 and the second adhesive layer 170 Adjacent, and the third through hole 171 and the second removal region 165 correspond to each other in a direction perpendicular to the first adhesive layer 13〇, and are coaxially disposed. Then, the second adhesive layer 17 is firstly heated and pressurized. The copper clad laminates 160 are pressed onto the first conductive line 127. « In the tenth step, referring to FIG. 11, a second conductive line 167 is formed in the second copper foil layer 161 of the second cladding steel sheet 160. A second conductive line 167 is formed in the second copper foil layer 161 in the same manner as the first conductive line 127 is formed. In the eleventh step, referring to FIG. 2, FIG. 8 and FIG. 12, the first removal area 125 and the second removal area 165 are removed, thereby obtaining a circuit board 180. Forming a fourth opening along the sixth side 1652, the seventh side 1653 and the eighth side 1 654 of the second removal region 165 by means of punching or cutting, the fourth opening and the third opening 166 and the fourth opening are mutually The communication 'disconnects the second removal region 165 from the second non-product region 163 and removes the second removal region 165. After the second removal region 165 is removed, a fourth via hole 69 is formed in the second copper clad laminate 160, and the fourth via hole 169 is interconnected with the third via hole 171. [0038] 099100459 A second opening is formed along the second side 1252, the third side 1 253 and the fourth side 1 254 of the first removal region 125, and the second opening and the first opening 126 are interconnected. Form No. A0101 Page 10 / A total of 30 pages 0992001007-0 201125455 pass, so that the first removal area 125 and the first non-product area 123 are separated from each other, and the first removal area 125 is removed. After the first removal region 125 is removed, a second via hole 129 is formed in the first copper clad layer 120. The second through hole 129 and the third through hole 171, the first through hole 131, and the fourth through hole 169 are connected to each other to form a concave shape. The groove ιοί, thereby obtaining the circuit board 18〇 having the groove 1〇1. In this step, since the first removal region 125 and the second removal region 165 correspond to each other, the second opening and the fourth opening can be simultaneously formed by one cutting or punching. It is also possible to perform a punching or cutting to form a fourth opening, and then perform a punching or cutting to form a third opening 〇. The cutting method can be mechanically cut or laser cut. [0039] The circuit board manufacturing method provided in this embodiment can press the side of the second conductive line η? to form a glue layer having a through hole before the first removal region 125 and the second removal region 165 are removed. And a copper clad plate having a removal area corresponding to the first removal W125, and the copper-clad board is made of a conductive line and then the corresponding removed regions are removed, thereby obtaining a circuit board having more layers and a larger groove depth. . 〇 _ When the inner substrate 110 is a double-layer or multi-layer circuit substrate, a county and a copper clad plate are formed on opposite surfaces thereof, and then the removed region is removed to obtain a circuit board having both sides of the groove. [0041] 099100459 only in the tail-catching method of the tail-catching method, before the pressing and fabrication of the conductive line, the first copper-clad board, the second copper-clad board is removed between the removed area and the product area. 'The removal area is separated from the product area and communicates with the non-product area'. After the conductive line is formed, the removal area is removed, thereby avoiding the circuit board caused by the silver shrinkage during the pressing and the preparation of the electric circuit. _ The resulting circuit form number Α 0101 Page 11 / Total 0 0992001007-0 201125455 Poor quality. [0046] [0046] [0049] [0050] [0099] [0099] In summary, the present invention has indeed met the requirements of the invention patent, and patented according to law. Application. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an inner layer substrate, a first adhesive layer and a first copper clad laminate provided by an embodiment of the present technical solution. FIG. 2 is a schematic view showing the first copper clad plate provided by the embodiment of the present technical solution forming a first opening. FIG. 3 is a schematic diagram of the first adhesive layer provided by the embodiment of the present technical solution after forming the first through hole. FIG. 4 is a schematic view showing the stacked and laminated substrate, the first adhesive layer and the first copper clad laminate provided by the embodiment of the present technical solution. Figure 5 is a schematic cross-sectional view taken along line V - V of Figure 4. FIG. 6 is a schematic view of the embodiment of the present invention, after the substrate is formed to form a conductive line and the first copper clad plate forms a first conductive line. FIG. 7 is a schematic diagram of a second copper clad laminate and a second adhesive layer provided by an embodiment of the present technical solution. Figure 8 is a schematic view of the second embodiment of the present invention after the second copper clad plate is formed to form a third opening. FIG. 9 is a schematic diagram showing the formation of a third via hole in the second adhesive layer according to an embodiment of the present technical solution. Form No. A0101, page 12 of 30, 0992001007-0 201125455. [0052] FIG. 10 is a schematic diagram of the embodiment of the present invention, after the second board and the second copper clad board are laminated on the circuit board. FIG. 11 is a schematic diagram of the second copper clad board after forming a second conductive line according to an embodiment of the present technical solution. [0054] FIG. 12 is a schematic diagram of a circuit board fabricated in an embodiment of the present technical solution. [Main component symbol description] [0055] Groove: 101 ❹

G

[0056] Inner substrate: 110 [0057] Inner copper foil layer: 111 [0058] Inner insulating layer: 112 [0059] First surface · 113 [0060] Second surface: 114 [0061] First copper clad: 120 First copper foil layer: 121 [0063] First insulating layer: 122 [0064] First non-product area: 1 2 3 [0065] First product area: 124 [0066] First removal area: 125 [ 0067] First side: 1 2 51 099100459 Form number A0101 Page 13 / Total 30 pages 0992001007-0 201125455 [0068] Second side: 1252 [0069] Third side: 1253 [0070] Fourth side: 1254 [0071 The first opening: 126 [0072] The first conductive line: 127 [0073] The second through hole: 129 [0074] The first adhesive layer: 130 [0075] The first through hole: 131 [0076] The second copper clad plate: [0077] Second copper foil layer: 161 [0078] Second insulating layer: 162 [0079] Second non-product area: 1 6 3 [0080] Second product area: 164 [0081] Second removal area: 165 Fifth side: 1651 [0083] Sixth side: 1652 [0084] Seventh side: 1653 [0085] Eighth side: 1654 [0086] Third opening: 166 099100459 Form number A0101 Page 14/total 30 pages 0992001007-0 167 201125455 [0087] Second conductive line: [0088] Fourth via: 169 [0089] Second adhesive layer: 170 [0090] Third via: 171 [0091] Circuit board: 180 ❹ 099100459 Form No. A0101 Page 15 / Total 30 Pages 0992001007-0

Claims (1)

201125455 VII. Patent application scope: 1. A circuit board manufacturing method, comprising the steps of: providing an inner substrate, a first copper clad plate and a first glazing layer, wherein the first copper clad plate comprises a first product area, a first non-product area and a first removal region, the first removal region portion is adjacent to the first product region, and the other portion of the first removal region is adjacent to the first non-product region, and the first copper clad plate comprises a first copper pig layer. The inner substrate has a first surface; a first opening is formed along a line of intersection of the first removal region and the first product region, such that the first removal region is separated from the first product region; and formed in the first adhesive layer a first through hole corresponding to the removal region; sequentially stacking the first adhesive layer and the first copper clad plate on the first surface of the substrate, and pressing the first adhesive layer, the first copper clad plate and the inner layer substrate; and the first copper clad plate The first copper foil layer forms a first conductive line; a second opening is formed along the intersection of the first removal region and the first non-product region, and the second opening and the first opening communicate with each other to CCL material removed in the first removal area, thereby forming a first region corresponding to the removal of the second through-hole in the first CCL. The method of manufacturing a circuit board according to claim 1, wherein the inner substrate is a copper clad plate, and the inner substrate has an inner copper layer on a side opposite to the first surface, The first copper box layer of the copper plate forms a first conductive line while forming a conductive line in the inner layer copper foil layer. 3. The method of fabricating a circuit board according to claim 1, wherein the inner substrate is a two-layer or multi-layer circuit substrate on which a conductive line is formed, and the inner substrate has a second surface opposite to the first surface. When the first adhesive layer is pressed on the first surface, the first adhesive layer is further pressed on the second surface with the first copper-clad 099100459 Form No. A0101 Page 16 / Total 30 Page 0992001007-0 201125455. The circuit board manufacturing method of claim 1, wherein the circuit board manufacturing method further comprises providing a second copper clad plate and a second adhesive layer after forming the first conductive line, the second The copper clad laminate includes a second product area and a second non-product area, the second non-product area includes a second removal area, the second removal area portion is adjacent to the second product area, and the second removal area is first removed Corresponding to the region, the second copper clad laminate has a second copper foil layer; the crucible forms a third opening along the intersection of the second removal region and the second product region, so that the second removal region and the second product region are separated from each other; Forming a third through hole corresponding to the second removal region in the second adhesive layer; sequentially stacking and pressing the second adhesive layer and the second copper clad plate on the first conductive line; Forming a second conductive line in the two copper foil layers; forming a fourth opening along the intersection of the second removal area and the second non-product area before or at the same time as forming the second opening, the fourth opening and the The openings are connected to each other to remove the material of the second copper clad plate in the second removal region, thereby forming a fourth corresponding to the first through hole, the second through hole and the third through hole in the second copper clad plate Through hole. 5. The method of fabricating a circuit board according to claim 4, wherein the first copper clad plate comprises a plurality of first removal regions. 6. The method of fabricating a circuit board according to claim 5, wherein the second copper clad plate includes a plurality of second removal regions, and the plurality of first removal regions correspond to the plurality of second removal regions. 7. The method for manufacturing a circuit board according to claim 1, wherein the method is 099100459, the form number A0101, the 17th page, the total of 30 pages, 0992001007-0, 201125455, along the first removal area and the first The intersection of the product areas forms a first opening in the first copper clad laminate. 8. The method of fabricating a circuit board according to claim 7, wherein the cutting method is laser cutting or mechanical cutting. 9. The method of manufacturing a circuit board according to claim 1, wherein the first through hole has the same shape and is coaxially disposed with the first removal region, and the cross-sectional area of the first through hole is larger than the area of the first removal region. . 10. The method of fabricating a circuit board according to claim 1, wherein the second opening is formed along the intersection of the first removal region and the first non-product region by means of punching or cutting. 099100459 Form No. A0101 Page 18 of 30 0992001007-0