201112911 the housing is also described. 四、指定代表圖： (一） 本案指定代表圖為：第（1 )圖。 (二） 本代表圖之元件符號簡單說明： 電子裝置殼體 10 本體 11 三維天線 13 五、 本案若有化學式時，請揭示最能顯示發明特徵之化 學式： 無 六、 發明說明： 【發明所屬之技術領域】 本發明涉及一種電子裝置殼體及其製作方法，尤其涉 • 及一種具有三維天線的電子裝置殼體及其製作方法。 【先前技術】 天線係電子裝置（如手機、電腦、PDA等）中重要的 零部件。天線的設置及品質直接決定了電子裝置通信性能 的優劣。 習知的製作電子裝置的天線的方法中較新興的有鐳射 成型（LDS，Laser Direct Structuring)技術。LDS 技術係 指使用鐳射在基材表面成型天線或導電圖案，其一般包括 三個步驟：塑件成型，即以可鐳射活化的改性塑膠為原料 201112911 製作塑件；鐳射活化，即用聚焦雷射光束投射於塑件上需 要製作天線或導電圖案的部位，使塑件原料發生某種物理 化學反應而於塑件表面析出金屬晶核；金屬化，即使被鐳 射投射過的部位沉積導電金屬層。 相較於柔性電路板天線和金屬片天線，LDS天線可製 成其實際需要的任意形狀，具備完全的三維功能；且因為 採用鐳射成型，改變天線或電路圖案無需改變模具就能實 現，技術效率極高、產品生產週期短。 • 然而，LDS天線的製備需要使用費用相對昂貴的改性 塑膠，導致產品的成本偏高，使其推廣使用受到阻礙。 【發明内容】 鑒於此，有必要提供一種電子裝置殼體，該電子裝置 殼體具有一三維天線，該三維天線可實現其所需的任意三 維結構，且製作成本低。 另外，還有必要提供一種上述電子裝置殼體的製作方 法。 • 一種電子裝置殼體，其包括一本體及一形成於本體上 的三維天線，所述本體包括--次成型體及一與一次成型 體相結合的二次成型體，該一次成型體的材質為塑膠，該 二次成型體的材質包含有可鐳射活化物，所述三維天線為 一電鍍層，其為對所述二次成型體的預選表面進行鐳射活 化後電鑛形成。 一種電子裝置殼體的製作方法，其包括如下步驟： 提供一成型模具，該成型模具具有一一次成型型腔及 一與該一次成型型腔相連通的二次成型型腔； 201112911 向所述一次成型型腔中注塑塑膠形成電子裝置殼體的 一次成型體； 向所述二次成型型腔中注塑含可鐳射活化物的塑膠形 成電子裝置殼體的二次成型體，該二次成型體結合於所述 一次成型體上； 鐳射活化所述二次成型體的預選表面； 將所述被活化的二次成型體的預選表面金屬化形成三 維天線。 • 相較於習知技術，本發明電子裝置殼體的製作方法分 兩次注塑成型殼體，所述一次成型體可使用普通的塑材， 如此可以大大降低二次成型體的可鐳射活化材料的用量， 從而降低了產品的成本。 【實施方式】 請參閱圖1所示，本發明一較佳實施方式的電子裝置 殼體10包括一本體11及一形成於本體11上的三維天線 13 ° • 請結合參閱圖2所示，所述本體11包括一一次成型體 111及一與一次成型體111相結合的二次成型體113。 所述一次成型體111以注塑成型的方式製成。注塑成 型一次成型體111的塑膠可選自為聚丙烯（PP)、聚醯胺 (PA)、聚碳酸酯（PC)、聚對苯二曱酸乙二酯（PET)及 聚甲基丙烯酸甲酯（PMMA)中的任一種。該一次成型體 111可直接成型為所述電子裝置殼體10的形狀，並占所述 電子裝置殼體10的厚度的三分之二至五分之四左右；亦可 成型為所述電子裝置殼體10的一部分。 201112911 所述二次成型體113以注塑成型的方式製成。注塑成 型二次成型體113的材質可為熱塑性塑膠、有機填充物與 可鐳射活化物的混合物。所述熱塑性塑膠可為聚對笨二甲 酸丁二醇酯（PBT)或聚醯亞胺（PI)。所述有機填充物可 為石夕酸和/或矽酸衍生物。所述可鐳射活化物可為不導電的 基於尖晶石的高階氧化物，如含銅尖晶石等。在所述注塑 成型二次成型體113的混合物中，其中熱塑性塑膠的百分 含量可在65-75%之間，有機填充物的百分含量可在22_28% _ 之間，不導電的基於尖晶石的高階氧化物的百分含量可在 3-7%之間。所述不導電的基於尖晶石的高階氧化物可被錯 射活化而析出金屬晶核覆蓋於二次成型體113的表面。 所述三維天線13為一形成於二次成型體113的預選表 面的電鍍層。該電鍍層包括依次形成於該預選表面的電鍍 銅層、電鍍鎳層及電鍍金層。所述電鍍銅層主要起天線的 作用，所述電鍵鎳層為中間過渡層，其可增強電鑛金層與 電鍍銅層的結合力；所述電鍍金層的抗氧化能力軔 較強，其可保證所述三維天線13與電子裝置的控制系統的 電性連接的穩定性。該三維天線13可為對所述二次成型體 113表面的預選區域先進行錯射活化，使該預選區域的不 導電的基於尖晶石的高階氧化物的金屬晶核析出於表面， 而後對該預選區域進行電鍍而製得。 本發明一較佳實施方式的製作所述電子裝置殼體1〇 的方法包括如下步驟： 提供一成型模具。該成型模具具有一一次成型型腔及 201112911 一與該一次成型型腔相連通的二次成型型腔。 向所述-人成型型腔中注塑塑膠形成電子裝置殼體1〇 的人成型體111。庄塑成型一次成型體ηι的塑膠可選自 為聚丙烯（pp)、聚醯胺（PA)、聚碳_ (PC)、聚對苯 二甲酸乙二醋（PET)及聚甲基丙婦酸甲醋（PMMA)中的 任一種。 ㈣=述Γ★成型型腔n塑含可射活化物的塑膠形 於所if次成型體113,該二次成型體113結合 成型體11…所述可錯射活化物可為不導電 =基於尖日日石的高階氧化物，如含鋼尖晶石。所述塑膠可 為讀苯二甲酸Τ二❸旨（ΡΒΤ)⑻。注塑 形成所述二次成型體113的塑膠中搜 酸衍生物。 膠中還可包含树酸和/或石夕 在所述二次成型體113的表 的區域，並使用鐳射照射該預選的$-任-的二維开= 雷丨、曰區域，使該區域的不導 電的基於大日日石的向階軋化物的金 化成為導體。 鴒離子析出表面，而活 將所述二次成型體113的被 得三維天線D。所述金屬化的方^的預選區域金屬化製 型體m未被鐳射活化的區域：電鍍。由於= 被活化的預選區域上可被電鍍上+ 、體’因此電鍍時 天線!3。電艘時可先電鍍一鋼層金屬4,而製得所述^ 電鍍-金層。 Μ電鍍-錄層’最後 的製作方法適用於無 的生產中。 本發明所述的電子裝置殼體 線通信產品、筆記本電腦等產品殼體 201112911 本發明較佳實施方式的電子裝置殼體的製作方法分兩 次注塑成型殼體，所述一次成型體可使用普通的塑材，如 此可以降低二次成型體的可鐳射活化材料的用量，從而大 大降低了產品的成本。同時，本發明電子裝置殼體的製作 方法可藉由鐳射照射路徑的任意設置而製得所需任意形狀 及性能要求的三維天線，技術效率極高、產品生產週期短。 【圖式簡單說明】 圖1係本發明一較佳實施方式電子裝置殼體的整體示 鲁意圖。 圖2係圖1中電子裝置殼體的分解示意圖。 【主要元件符號說明】 電子裝置殼體 10 本體 11 三維天線 13 一次成型體 111 二次成型體 113201112911 The housing is also described. 4. The designated representative map: (1) The representative representative of the case is: (1). (2) Brief description of the symbol of the representative figure: Electronic device housing 10 Main body 11 Three-dimensional antenna 13 V. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: None. 6. Description of invention: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing and a method of fabricating the same, and more particularly to an electronic device housing having a three-dimensional antenna and a method of fabricating the same. [Prior Art] Antennas are important components in electronic devices (such as mobile phones, computers, PDAs, etc.). The setting and quality of the antenna directly determine the communication performance of the electronic device. Among the conventional methods for fabricating an antenna for an electronic device, there is a laser direct structuring (LDS) technology. LDS technology refers to the use of laser to form an antenna or conductive pattern on the surface of a substrate. It generally consists of three steps: plastic molding, that is, using laser-activated modified plastic as raw material 201112911 to make plastic parts; laser activation, using focused lightning The projection of the beam onto the plastic part requires the fabrication of an antenna or a conductive pattern to cause a physical chemical reaction of the plastic material to precipitate a metal crystal nucleus on the surface of the plastic part; metallization, even if a portion projected by the laser is deposited with a conductive metal layer . Compared with flexible circuit board antennas and metal plate antennas, LDS antennas can be made into any shape that they actually need, with full three-dimensional functions; and because of laser forming, changing antennas or circuit patterns can be achieved without changing the mold, technical efficiency Extremely high and short product production cycle. • However, the preparation of LDS antennas requires the use of relatively expensive modified plastics, resulting in high product costs and impediment to their use. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an electronic device housing having a three-dimensional antenna that can realize any three-dimensional structure required thereof and that is inexpensive to manufacture. In addition, it is also necessary to provide a method of fabricating the above-described electronic device housing. An electronic device housing comprising a body and a three-dimensional antenna formed on the body, the body comprising a secondary molding body and a secondary molding body combined with the primary molding body, the material of the primary molding body In the case of a plastic, the material of the overmolded body comprises a laser activatable material, and the three-dimensional antenna is a plating layer which is formed by laser activation of a preselected surface of the secondary molded body. A manufacturing method of an electronic device housing, comprising the steps of: providing a molding die having a primary molding cavity and a secondary molding cavity communicating with the primary molding cavity; 201112911 Injection molding plastic in a molding cavity to form a primary molded body of the electronic device casing; molding the plastic containing the laser activator into the secondary molding cavity to form a secondary molded body of the electronic device casing, the secondary molded body Bonding to the primary molded body; laser activating a preselected surface of the secondary molded body; metallizing the preselected surface of the activated secondary molded body to form a three-dimensional antenna. • Compared with the prior art, the manufacturing method of the electronic device casing of the present invention is divided into two injection molding shells, and the primary molding body can use ordinary plastic materials, so that the laser activating material of the secondary molding body can be greatly reduced. The amount of use, which reduces the cost of the product. [Embodiment] Please refer to FIG. 1 , an electronic device housing 10 according to a preferred embodiment of the present invention includes a body 11 and a three-dimensional antenna 13 ° formed on the body 11 . The body 11 includes a primary molded body 111 and a secondary molded body 113 combined with the primary molded body 111. The primary molded body 111 is formed by injection molding. The plastic of the injection molded primary molded body 111 may be selected from the group consisting of polypropylene (PP), polyamine (PA), polycarbonate (PC), polyethylene terephthalate (PET), and polymethyl methacrylate. Any of the esters (PMMA). The primary molded body 111 can be directly formed into the shape of the electronic device casing 10 and occupy about two-thirds to four-fifths of the thickness of the electronic device casing 10; it can also be formed into the electronic device. A portion of the housing 10. 201112911 The overmolded body 113 is produced by injection molding. The material of the injection molded secondary molded body 113 may be a mixture of a thermoplastic plastic, an organic filler, and a laser activator. The thermoplastic plastic may be polybutylene phthalate (PBT) or polyimine (PI). The organic filler may be a linalic acid and/or a citric acid derivative. The laser activatable material can be a non-conductive, spinel-based high order oxide such as a copper-containing spinel. In the mixture of the injection molded secondary molded body 113, wherein the percentage of the thermoplastic plastic may be between 65-75%, and the percentage of the organic filler may be between 22_28% _, the non-conductive based tip The percentage of high order oxide of the spar can be between 3-7%. The non-conductive spinel-based high-order oxide may be erroneously activated to precipitate a metal crystal nucleus covering the surface of the over-molded body 113. The three-dimensional antenna 13 is a plating layer formed on a preselected surface of the overmolded body 113. The plating layer includes an electroplated copper layer, an electroplated nickel layer, and an electroplated gold layer sequentially formed on the preselected surface. The electroplated copper layer mainly functions as an antenna, and the electro-bonding nickel layer is an intermediate transition layer, which can enhance the bonding force between the electro-mineral layer and the electroplated copper layer; the electroplated gold layer has a strong anti-oxidation ability, and The stability of the electrical connection of the three-dimensional antenna 13 to the control system of the electronic device can be ensured. The three-dimensional antenna 13 may be configured to first perform a mis-active activation on a preselected region of the surface of the secondary molded body 113, so that the non-conductive spinel-based high-order oxide metal crystal nucleus of the preselected region is deposited on the surface, and then The preselected area is made by electroplating. A method of fabricating the electronic device housing 1A according to a preferred embodiment of the present invention includes the steps of: providing a molding die. The molding die has a primary molding cavity and a secondary molding cavity that communicates with the primary molding cavity. A plastic molded body 111 of the electronic device casing 1 is formed by injection molding the plastic into the human shaped cavity. The plastic forming the molded body ηι can be selected from the group consisting of polypropylene (pp), polyamine (PA), polycarbon (PC), polyethylene terephthalate (PET) and polymethyl methacrylate. Any of the acid methyl vinegar (PMMA). (4) = Γ Γ 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型 成型A high-order oxide of a sharp stone, such as a steel spinel. The plastic may be phthalocyanine (ΡΒΤ) (8). Injection molding The acid derivative of the plastic forming the overmolded body 113. The gum may further comprise a region of the surface of the overmolded body 113 and/or a radix, and irradiate the preselected two-dimensional open = thunder, 曰 region with a laser to make the region The non-conducting gold based on the large-day stone is a conductor. The cerium ions are deposited on the surface, and the three-dimensional antenna D of the overmolded body 113 is obtained. The metallized preselected area metallized body m is not laser activated: electroplating. Since the = pre-selected area that is activated can be plated with +, body ', therefore, the antenna!3. In the electric boat, a steel layer metal 4 can be first plated to obtain the electroplating-gold layer. The final production method of Μ plating-recording layer is suitable for production without production. The electronic device casing line communication product, the notebook computer and the like product housing 201112911 according to the present invention, the manufacturing method of the electronic device casing of the preferred embodiment of the present invention is divided into two injection molding shells, and the primary molded body can be used in common The plastic material can reduce the amount of laser-activated material of the secondary molded body, thereby greatly reducing the cost of the product. At the same time, the manufacturing method of the electronic device casing of the present invention can obtain a three-dimensional antenna with an arbitrary shape and performance requirement by any arrangement of the laser irradiation path, and has high technical efficiency and short product production cycle. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an overall schematic view of a housing of an electronic device in accordance with a preferred embodiment of the present invention. 2 is an exploded perspective view of the electronic device housing of FIG. 1. [Description of main component symbols] Electronic device housing 10 Main body 11 Three-dimensional antenna 13 Primary molded body 111 Secondary molded body 113