201112489 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種天線形成方法，尤指一種可於具單一曲面結 構或多重曲面結構之三維空間幾何載板之表面來實施之天線形成方 法。 【先前技術】 現今’無線通訊的發展進展日益躍進，其中無線通訊系統主仰 賴電磁波作為傳遞資訊的媒介，而負責接收及發送電磁波的關鍵部 份就是天線模組，尤其是用於手機或電腦等個人電子產品中之天線 模組。有鑑於此，天線模組品質之優劣好壞會關乎後續電磁波收發 之訊號穩定度及訊號品質。 習知天賴組製程大多運用例如是熱炫製程 '貼合製程等方式 進行，其中天線模組乃由塑膠支架和金屬片所組成，且金屬片與載 板實際上需預先經分開製作完成後，再整合成為—天線模組。不過， =線模組整合製程中常出現以下缺點。第—點，天線模組整合製移 2不均勻應力易導致金屬片與載板表面間接合不緊實，嚴重時會 產生不預_破裂職或職。第二點，習知 輕易克服將金屬片建構於具多曲面結構的三維空間 201112489 上0 無庸置疑’習知天線的射頻性能發生電磁波訊號不穩定或喪失 預期功效之導因多可歸咎於上述缺點。 【發明内容】 本發明目的之一在於提供一種天線形成方法，以於具單一曲面 *結構或多重曲面結構載板之表面來實施之天線形成方法。 為達上述目的，本發明提供一種天線形成方法。其中，天線形 成方法，包含下列步驟。提供一載板，其中載板之表面包含—平面 部與至少一曲面部。於載板之表面上覆蓋一金屬層，然後，切割金 屬層形成一獨立的天線圖案以及一獨立的外圍金屬圖案，且部份之 獨立的天線圖案係設置於曲面部之表面上。於獨立的天線圖案上形 Φ成一保護金屬圖案，且保護金屬圖案依獨立的天線圖案之表面之形 狀進行覆蓋。去除獨立的外圍金屬圖案。以及於保護金屬圖案上开^ 成一調整金屬圖案。 v 為達上述目的，本發明提供一種天線形成方法。其中，天線开 成方法，包含下列步驟。提供一載板。於載板之表面上覆蓋—金$ 層，切割金屬層形成一獨立的天線圖案與一獨立的外圍金屬圖案 於獨立的天線圖案上形成一保護金屬圖案，且保護金屬圖案依彳蜀立 201112489 的天線圖案之表面形狀進行覆蓋。去除獨立的外圍金屬圖案。去除 覆蓋於獨立的天線圖案上之保護金屬圖案。以及於獨立的天線圖案 上形成一調整金屬圖案。 為達上述目的，本發明提供一種天線形成方法。其中，天線形 成方法，包含下列步驟。提供一載板。於載板之表面上覆蓋一金屬 層，切割金屬層形成一獨立的天線圖案以及一獨立的外圍金屬圖 案。於天線_上形成i整金屬_，調整金制案依天線圖案 之表面形狀進行覆蓋。去除外圍金屬圖案4除覆蓋於調整金屬圖 案之表面上之保護金屬圖案，以保留下調整金屬圖案。 本發明之天、_成方法乃藉由保護金·案搭配使用高侧選 擇比溶劑，藉以侧獨立的外圍金屬圖案而保存獨立的天線圖案， 且於獨立的天線圖案上可依需求形成調整金屬圖案，以進一步最佳 射雛能。又，本發明賴金屬_具保護内部獨立的天 ===所強調之特點亦即是本發明天線形成方 二= 載板表面上形成天線，且提供天線與 載板間絕佳之_性以射天線射頻性能。再者 鑛製程或魏f程具有適合於A崎 月使用化干 【實施方式】 201112489 —在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特 疋的7G件。所屬領域中具有通常知識者應可理解，製造商可能會用 不的名巧來稱呼同樣的元件。在通篇說明書及後續的請求項當中 所提及的「包含」係為一開放式的用語，故應解釋成「包含但不限 定於」，在此容先敘明。 口月少考第1A圖至第5圖。第ία圖至第5圖為本發明天線形成 _方法之第-較佳實施例形成示意圖。如第lA圖所示，首先，提供 一載板1〇 ’且載板1㈣表面包含一平面部12a與至少一曲面部 12b。接著於載板1〇表面上覆蓋一金屬層（圖未示），切割金屬層形 成獨立的天線圖案14a以及一獨立的外圍金屬圖案⑽。其中獨 立的天線圖案⑷之-部份係設置於曲面部⑶之表面上，而獨立 的天線圖案14a與獨立的外圍金屬圖案⑽為兩相互隔離之圖案。 在此’為清楚敘明獨立的天線圖案14a與載板1〇間空間分佈狀況， 明併參考第2圖’第2圖繪示沿第1A圖从，剖面線之剖面圖， •相關元件可對應第1A圖而不在此贅述。 在本實施例中，載板10可以任意方式進行製作。例如射出成 型、熱壓製作猶等，域板1〇之形狀亦可依手機、個人數位助理 器(Personal Digital Assistant，PDA)、全球定位系統(G1〇bal p〇siti〇ningBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna forming method, and more particularly to an antenna forming method that can be implemented on a surface of a three-dimensional spatial geometric carrier having a single curved structure or a multi-curved surface structure. [Prior Art] Nowadays, the development of wireless communication is progressing steadily. The wireless communication system mainly relies on electromagnetic waves as the medium for transmitting information. The key part responsible for receiving and transmitting electromagnetic waves is the antenna module, especially for mobile phones or computers. Antenna module in personal electronics. In view of this, the quality of the antenna module is related to the signal stability and signal quality of subsequent electromagnetic wave transmission and reception. Most of the processes of the Xi'an Tianlai Group are carried out by means of, for example, a heat-making process, a bonding process, in which the antenna module is composed of a plastic support and a metal piece, and the metal piece and the carrier plate are actually separately prepared in advance. And then integrated into an antenna module. However, the following shortcomings often occur in the =line module integration process. The first point, the antenna module integrated system shift 2 uneven stress easily lead to the joint between the metal sheet and the surface of the carrier board is not tight, in severe cases will produce no pre-breaking job or position. Secondly, it is easy to overcome the problem of constructing a metal sheet in a three-dimensional space with a multi-curved structure on 201112489. 0 Undoubtedly, the radio frequency performance of a conventional antenna can be attributed to the above-mentioned shortcomings due to instability or loss of expected electromagnetic power. . SUMMARY OF THE INVENTION One object of the present invention is to provide an antenna forming method for implementing an antenna forming method on a surface having a single curved surface structure or a multi-curved structural carrier. To achieve the above object, the present invention provides an antenna forming method. The antenna forming method includes the following steps. A carrier is provided, wherein the surface of the carrier comprises a planar portion and at least one curved portion. A metal layer is covered on the surface of the carrier, and then the metal layer is cut to form a separate antenna pattern and a separate peripheral metal pattern, and a part of the independent antenna pattern is disposed on the surface of the curved portion. The protective antenna pattern is formed into a protective metal pattern on the independent antenna pattern, and the protective metal pattern is covered by the shape of the surface of the independent antenna pattern. Remove the separate peripheral metal pattern. And forming an adjustment metal pattern on the protective metal pattern. v In order to achieve the above object, the present invention provides an antenna forming method. Among them, the antenna opening method includes the following steps. Provide a carrier board. Covering the surface of the carrier with a gold layer, the metal layer is formed to form a separate antenna pattern and a separate peripheral metal pattern forms a protective metal pattern on the independent antenna pattern, and the protective metal pattern is based on the 201112489 The surface shape of the antenna pattern is covered. Remove the separate peripheral metal pattern. The protective metal pattern overlying the individual antenna patterns is removed. And forming an adjustment metal pattern on the independent antenna pattern. To achieve the above object, the present invention provides an antenna forming method. The antenna forming method includes the following steps. Provide a carrier board. A metal layer is overlaid on the surface of the carrier, and the metal layer is cut to form a separate antenna pattern and a separate peripheral metal pattern. The i-metal _ is formed on the antenna _, and the gold-adjusted pattern is covered by the surface shape of the antenna pattern. The peripheral metal pattern 4 is removed except for the protective metal pattern overlying the surface of the trim metal pattern to retain the lower trim metal pattern. According to the invention, the method of using the high-side selection ratio solvent is used to protect the gold case, and the independent antenna pattern is saved by the side independent peripheral metal pattern, and the adjustment metal can be formed on the independent antenna pattern according to requirements. Patterns for further optimal shootouts. Moreover, the characteristic of the present invention is that the antenna of the present invention forms the antenna 2 and forms an antenna on the surface of the carrier, and provides an excellent relationship between the antenna and the carrier. Radio antenna performance. Furthermore, the ore process or the process of the process is suitable for the use of A-Sakis. [Embodiment] 201112489 - Some terms are used in the specification and subsequent patent applications to refer to the special 7G pieces. It should be understood by those of ordinary skill in the art that the manufacturer may refer to the same component by name. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to" and is hereby stated. 1A to 5th. Fig. 5 to Fig. 5 are views showing the formation of the first preferred embodiment of the antenna formation method of the present invention. As shown in Fig. 1A, first, a carrier 1' is provided and the surface of the carrier 1 (4) includes a flat portion 12a and at least one curved portion 12b. Then, a surface of the carrier 1 is covered with a metal layer (not shown), and the cut metal layer forms a separate antenna pattern 14a and a separate peripheral metal pattern (10). The portion of the independent antenna pattern (4) is disposed on the surface of the curved portion (3), and the independent antenna pattern 14a and the independent peripheral metal pattern (10) are two mutually isolated patterns. Here, in order to clearly clarify the spatial distribution between the independent antenna pattern 14a and the carrier 1 , and refer to FIG. 2 ' FIG. 2 , a cross-sectional view taken along line 1A, the relevant components may be Corresponding to Figure 1A and not described here. In the present embodiment, the carrier 10 can be fabricated in any manner. For example, injection molding, hot pressing, etc., the shape of the domain board can also be based on mobile phones, Personal Digital Assistant (PDA), Global Positioning System (G1〇bal p〇siti〇ning)
System，GPS)等之外型設計或依配合特殊天線雜的需求而設計成 各式I狀，更可為此等攜帶式裝置的部分殼體。又，載板1〇之形成 材料包含塑膠材料，例如是丙稀睛丁二稀-苯乙稀聚合物 201112489 (acrylonitrile-butadiene-styrene, ABS)，(polycarbonate, )或丙稀睛了—烯★乙稀聚合物與聚碳_旨之複合材料 (PC/ABS)，但本實施触無特殊限制。制是，本實施例中載板 10使用之歸材料具冑較錄面硬度、抗化學性、卿^性、而愤 擊1±表面光澤、易加卫等特性。另外，載板W表面之曲面部⑶ 可為凹曲面結構或凸曲面結構，或者包含—單—曲面結構或多重曲 面結構等各式之非平面型結構。 在本實知丨种’於輪1G絲妨—_肺序（_咖土叩 process)例如月銅處理、石墨化處理、金屬漆處理或金屬化處理等 之化干或機械處理綠’賴她1G的表面性質以得到内鎖表面 〇nterbekingSUrfaee)。製再進行—金屬絲序（M— Η0·)即進行一金屬沉積製程，例如化學鍍（electrolessplating) 製程、電鍍（deCtr〇plating)製程、真空電鍍（va_ metalizing)、 陰極濺射法（eathGde sputtering)或金屬物& (_】s卿㈣）等， 乂直接於縣之载板10的表面形成金屬層，本發明使用化學鑛或電 鍍等製㈣成之金屬層具有適合於大_製作的優點。此外，本實 施例之獨立的天線_齡的外屬_金屬層可以是銅金屬、 錄金屬雜金群金屬，料加以舰，而可為其它合適於天線之 金屬材料。 本發明亦提供一於金屬層上作切割工作形成獨立的天線圖案 14a以及獨立的外圍金屬圖案14b之方法如下。如第ib圖所示，首 201112489 先’先化雜製程或電鍍製程麵行—金屬沉賴程，以 板10之全部表面沉積-金屬層13。接著 、 ‘丁制w . 於第2圖中採用-微細 从（__chining p_ss) ’例如是微能量束加工技術或是 微熱能加工技術等，用以對金屬層13沿與獨立的天線圖她外圍 邊界線平行並且有射距_軌跡進行闕，崎她1G表面上形 成-獨立的天線圖案14a以及一獨立的外圍金屬圖案14b，且使獨 立的天線圖案14a與獨立的外圍金屬圖案14b不再有金屬連接藉System, GPS, etc., or other types of housings are designed to meet the needs of special antennas. Moreover, the forming material of the carrier 1 includes a plastic material, such as acrylonitrile-butadiene-styrene (ABS), (polycarbonate, ) or acrylonitrile-ene ★ Ethylene polymer and polycarbon composite material (PC/ABS), but there is no particular limitation on this embodiment. Therefore, in the present embodiment, the material used for the carrier 10 is characterized by hardness, chemical resistance, and chemical resistance, and is characterized by anger, 1±surface gloss, and easy protection. Further, the curved surface portion (3) of the surface of the carrier W may be a concave curved surface structure or a convex curved surface structure, or a non-planar structure including a single-curved surface structure or a multiple curved surface structure. In the present knowledge, 'Yuanlun 1G Threads--Lung order (_Cai 叩 process) such as moon copper treatment, graphitization treatment, metal paint treatment or metallization treatment, etc. 1G surface properties to get the internal locking surface 〇nterbekingSUrfaee). Rework - Metal wire order (M - Η0 ·) is a metal deposition process, such as electroless plating process, electroplating (deCtr〇plating) process, vacuum plating (va_ metalizing), cathode sputtering (eathGde sputtering Or a metal object & (_)sqing (4)), etc., a metal layer is formed directly on the surface of the carrier board 10 of the county, and the metal layer of the invention is chemically or electroplated, and the metal layer is suitable for large-scale production. advantage. In addition, the independent antenna_old metal layer of the present embodiment may be a copper metal, a metal clad metal group, and may be used as a ship, but may be other metal materials suitable for the antenna. The present invention also provides a method of forming a separate antenna pattern 14a and a separate peripheral metal pattern 14b by performing a dicing operation on a metal layer as follows. As shown in the figure ib, the first 201112489 first “pre-dosed the process or the electroplating process—the metal sinking process, and deposited the metal layer 13 on the entire surface of the board 10. Then, 'different w. is used in Fig. 2 - finely from (__chining p_ss)' such as micro-energy beam processing technology or micro-thermal processing technology, etc., for the metal layer 13 along with the independent antenna pattern her periphery The boundary lines are parallel and have a range _ trajectory, and a separate antenna pattern 14a and a separate peripheral metal pattern 14b are formed on the surface of the 1G, and the independent antenna pattern 14a and the independent peripheral metal pattern 14b are no longer present. Metal connection
此後續對獨立的天線圖案14a電鑛金屬時，電鑛金屬的沉積不會因曰 為獨立的天線圖案14a與獨立的外圍金屬圖案Mb還存有金屬，引 起兩部份®I案金屬之間電流連通而使被鍍金屬制覆蓋在獨立的天 線圖案14a和獨立的外圍金屬圖案14b之上。在本實施例中，微能 里束加工技;f标較佳乃採用雷射加工（丨asermachining)，或亦可採用 電子束加工（E-beam machining) 〇又，在本實施例中，微熱能加工 技術可選用被放電加工（Micro Electrical Discharge machining, Micro EDM)。需補充說明的是，在雷射加工中，所選用於雷射加工之雷 射源包含例如是採用具波長約1 〇64奈米(nm)之雷射源物質铷-雅鉻 (Nd · YAG)或採用固態Q開關(s〇iid state Q-switch)雷射發射源，但 並未限定’而可使用任何可對金屬進行雷射加工之雷射源，藉此以 滿足更精準細密的獨立的天線圖案需求。 此外，在本實施例令，獨立的天線圖案14a可包含拋物面或矩 形圖案（square/rectangle antenna)圖案、指向性天線（square/rectangle antenna )圖案、環型天線（annular ring antenna )圖案、狹縫天線（slotted 201112489 圖案’或三角（triangleWhen the subsequent metal pattern of the independent antenna pattern 14a is electro-mineralized, the deposition of the electro-mineral metal does not exist as a separate antenna pattern 14a and a separate peripheral metal pattern Mb, causing a metal between the two parts of the metal. The current is communicated such that the metal is plated over the individual antenna patterns 14a and the individual peripheral metal patterns 14b. In this embodiment, the micro-energy beam processing technique; the f-standard is preferably laser processing (丨asermachining), or electron beam processing (E-beam machining), and in this embodiment, the micro-heat energy The processing technology can be selected by Micro Electrical Discharge machining (Micro EDM). It should be added that in laser processing, the laser source selected for laser processing includes, for example, a laser source material having a wavelength of about 1 〇 64 nm (nm), Nd · YAG. ) or use a solid-state Q-switch (S〇iid state Q-switch) laser source, but not limited to 'any laser source that can be used for laser processing to meet more precise and precise independence. Antenna pattern requirements. In addition, in this embodiment, the independent antenna pattern 14a may include a parabolic or rectangular pattern, a square/rectangle antenna pattern, an annular ring antenna pattern, and a slit. Antenna (slotted 201112489 pattern 'or triangle (triangle)
PatCh antenna)圖案、橢圓線（empse antenna) antenna)®鱗’料財·例為限。 士隨後如第3圖所示，於獨立的天線圖案…之表面上形成一保 漠&屬Μ 30 ’且倾金相案3()錢立的天線圖㈣a之表面、 之形狀進行覆蓋。其中形成㈣金屬_ 30之方法包含電鑛製程、 ^部電鍍或_任何可僅_立的天顧案…上形祕護金屬圖 ”3〇之局部製裎。值得注意，保護金屬圖㈣可包含鈦金屬、絡 ，屬或錫金屬等財之—金屬所組成，但在此強調的是若當保護金 屬圖案30係由鉻金輕成時，較佳需__天線略⑷表面 上先形成-鋼層(未顯示)後，再形成賴金屬圖案層.此舉將更 有助於以鉻金屬層作為賴金屬®案30之品質。 接者’ _保護金屬_ 3G #作_鮮，去除未覆蓋有保護 金屬圖案3G之獨立的外圍金屬圖案⑽。其中去除載板⑺表面之 ^立的相金屬_ Mb的方法可選聰侧，例如湘—第一溶 ^且第-洛劑對於獨立的外圍金屬圖案⑽及保護金屬圖案邓 ，有幸乂问之㈣選擇比^ _來說，若保護金屬醜扣係由欽金屬 成時&於包含雙氧水或者氨水之驗性侧液易使鈦金屬形成氧 =而條’故鱗第—溶龜佳可包含祕、鹽酸或硫酸等餘 ^液’並藉此第—溶劑對於獨立的外圍金屬圖案14b具有較高之餘 J速率，以選擇性触刻獨立的外圍金屬圖案⑽而保留了保護金屬 ^後’本實知例可選擇性使用去離子水（De ion water)來 201112489 ί Γ去除朗獨立的外_圖案_所殘留的 一乾燥步驟。此舉乃可大幅提升後續調整 圍=。然而，如第4圖所示’在去除讎立的外 :Ζ後’接著於保護金屬圖案30上形成-調整金屬圖 =，中罐金__可為單騎構衫層結構，而多層結 含相㈣不同之金屬材料層，且各金屬材料層可分別具相同 之厚度。在本發日种，調整金屬圖案4G之多層結構所存在不 同金屬效應亦可對天線射頻性能進行調變。最後，第5圖繪示本發 明第一較佳實施例之完成圖。 本發明天線形成方法另提供一第二較佳實施例之形成方法本 第二較佳實關滅於第-齡實_之不嗎徵粒要在於可選 擇性去除覆蓋關立的天線_14_表面之保護金屬圖案30之步 驟。本發明形成第二較佳實施例部份製程相同於第—較佳實施例， 因此’本發明第二較佳實施例部份前段製程可參考前述之第1A圖、 第1B圖、第2圖以及第3圖’ 載板1G的表面制__覆蓋有保 遵金屬圖案30之獨立的天細案14a。接著，如第6圖所示，獨立 的天線圖案14a的表面利用一對於保護金屬圖案3〇及獨立的天線圖 案14a具有較南之蝕刻選擇比的第二溶劑，以去除保護金屬圖案 30 °舉例來說，若保護金屬圖案30係由鈦金屬所組成，則第二溶劑 可包含鹼性蝕刻液，例如以氨水（NH3〇H)、過氧化氫（Η〗％以 及去離子水（DeIon water)三者較佳比例混合之蝕刻液，或者以雙 氧水（H2〇2)以及硫酸（H2S〇4)兩者較佳比例混合之蝕刻液，但 2〇1112489 不僅侷限於上述姓刻液’而可為其它具高蝕刻選擇比之溶劑配方。 其中，上述包含雙氧水以及硫酸之蝕刻液乃先利用雙氧水與鈦金屬 形成氧化鈦（Ti〇2)物質，再藉由硫酸將氧化鈦物質剝除。 值得關注的是，當去除保護金屬圖案30後，原本存在於保護金 屬圖案30與獨立的天線圖案14a的表面間的接合處會因與蝕刻液的 接觸而形成一激活層（activating layer) 60。由於激活層6〇為活性 不穩定之物質層，因此需於此先進行清除，以便使後續調整金屬圖 案40覆蓋於獨立的天線圖案14a時更加緊實。如第7圖所示，去除鲁 獨立的天線圖案14a的表面上之激活層6〇步驟包含利用一第=溶 劑，且第三溶劑對於激活層60與獨立的天線圖案14a具有較高之蝕 刻選擇比，故僅去除獨立的天線圖案14a的表面上之激活層6〇。舉 例來說，第三溶劑包含去離子水，但不以此為限。 第8圖繪示本發明第二較佳實施例之俯視圖，且第9圖綠示沿 第8圖CC，剖面線之剖視圖。如第9圖所示，第9圖為接續^ 後之製程示意圖’隨後於獨立的天線圖案14a上形成—調整金屬圖 2 40 ’其中調整金屬圖案4〇可包含單層結構或多層結構，而多層 結構包含相同或糾之金㈣料層，且各金屬材料 二曰 不同，厚度，樣地，多層結構所存在不同金屬效應亦^對== 頻性能進行調變。然而，關於本發明調整金 於第一較錄謝敘明，在此衫加魏。心如既念已 12 201112489 本發明天線形成方法另提供一第三較佳實施例之形成方法，本 第三較佳實施例相較於第一較佳實施例之不同特徵處主要在於形成 獨立的天線圖案14a與獨立的外圍金屬圖案⑽後，僅對獨立的天 線圖案Ma進行電鑛，依序於獨立的天線圖案…上形成調整金屬 圖案4〇與保護金屬_ 30。絲，先彻第-溶劑選擇性地除去 獨立的外圍金屬圖案14b，再利用第四溶劑選擇性去除保護金屬圖 =30而保留下金屬圖案4Q。本發明形成第三較佳實施例部份 =相同於第-難實施例’因此，本發明第三較佳實施例部份前 又^呈可參考前述之第1A圖、第m圖以及第2圖。如认圖、第 圖以及第2圖所示，將於載板ω的表面之金屬層切 :線圖，一獨立的外圍金屬圖請後。接著，如第ι〇 屬圖案如依天線圖案14a之表面40，調整金 圖案仰该序_-賴金相’朗整㈣ 金屬_。之表面形狀進行覆蓋案二且=屬圖案3〇依調整 ^ 设盈以後’如第11圖所示，剎用筮 -洛劑，選擇性去除獨立的外圍 圓k _第 溶劑選擇性去除保護金屬圖案3〇留、°…、、後，再利用第四 四溶劑為對於保護金屬圖幸如’、T調整金屬圖案40，且第 選擇比之溶劑，未加以鎌。値得調主^金屬圖案40具有較高之_ 之形成方法中’保護金屬圖㈣可與;發^ 相同，故傾麵_ 3G 、观金屬騎4G之外層金屬 構金屬效㈣— 索4〇 ’亦即是在本發明令，調整金僅直接形成調整金屬圖 会屬效應以對天線射伽处，#屬圖案4〇可同時具備因多層結 護金屬圖 201112489 案30的保護功能。 毛月之天線$成方初藉由保護金屬圖案搭配翻高钱刻 擇比溶劑’藉以朗獨立的外圍金屬圖案而保存獨立的天線圖案，、 並且於獨立的天線圖案上可依需求形成調整金屬_，以利於進一 步最絲天線的射頻性能，獨立的天_觸立的天賴案。附帶 -提的是。在此，本㈣_之義亦即是本發明天線形成方法可 依需求於具多曲面結構之她表面上形敍線。值棚注的是，若 本發明於獨立的天線圖案與載板表面_用電難程將可具排除獨 立的天線圖案與載板表面間存在之不預_隙之優點，藉此提供天 線與載板間較佳之固著性麵定天線射舰能。再者，本發明使用 化學鍍製程或電鍍製程具有適合於大面積製作優^從製造生產角 度思考，本發明不僅構造簡單，且具有祕工業化生產，依需求加 以控制，以及低成本之優點。 X上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍 所做之均等變倾舞，皆朗本發明U蓋範圍。 【圓式簡單說明】 第1A圖至第5圖為本發明天線形成方法之第—較佳實施例形成方 法示意圖。 第圖至第9圖為本發明天線形成方法之第二較佳實施例部份形成 201112489 方法示意圖。 - 第10圖至第11圖為本發明天線形成方法之第三較佳實施例部份形 成方法示意圖。 【主要元件符號說明】 10 載板 12a 平面部 12b 曲面部 13 金屬層 14a 獨立的天線圖案 14b 獨立的外圍金屬圖案 30 保護金屬圖案 40 調整金屬圖案 60 激活層 15PatCh antenna) pattern, empse antenna antenna)® scales are limited. As shown in Fig. 3, on the surface of the independent antenna pattern, a surface of the antenna pattern (4) a and the surface of the antenna pattern (4) a of the metallurgical case 3 () are covered. The method for forming (4) metal _ 30 includes an electric ore process, a part of the electroplating, or a singularity of the singularity of the singularity of the metal slab. It consists of titanium, metal, genus or tin metal, but it is emphasized that if the protective metal pattern 30 is made of chrome, it is better to form the surface of the antenna (4). - After the steel layer (not shown), the metal pattern layer is formed. This will be more helpful to the quality of the chrome metal layer as the Lai metal® case 30. Receiver _ protection metal _ 3G #作_鲜, remove The independent peripheral metal pattern (10) of the protective metal pattern 3G is not covered. The method for removing the phase metal _ Mb of the surface of the carrier (7) may be selected from the Cong side, for example, the first solution and the first agent are independent. The peripheral metal pattern (10) and the protective metal pattern Deng, have the privilege of asking (4) the choice is better than ^ _, if the metal ugly buckle is made of the metal, it is easy to make the titanium metal in the test side containing hydrogen peroxide or ammonia. Oxygen formation = and the strip 'the scales' - the turtle can contain secret, hydrochloric acid or sulfuric acid And the first solvent has a higher J rate for the independent peripheral metal pattern 14b to selectively engrave the independent peripheral metal pattern (10) while retaining the protective metal ^ Deion water is used to remove the separate drying step from the outer _ pattern _ 2011. This can greatly improve the subsequent adjustment. However, as shown in Figure 4 Removing the erected outer: after the ' 'and then forming on the protective metal pattern 30 - adjusting the metal map =, the middle tank gold __ can be a single riding jersey layer structure, and the multi-layered knot contains a phase (four) different metal material layer, and Each of the metal material layers may have the same thickness. In the present invention, the different metal effects of the multilayer structure of the metal pattern 4G may be used to modulate the RF performance of the antenna. Finally, FIG. 5 illustrates the first aspect of the present invention. The method for forming an antenna according to the present invention further provides a method for forming a second preferred embodiment. The second preferred method is used to selectively remove the first-old aging particles. Covering the antenna _14_ surface The process of forming the second embodiment of the present invention is the same as that of the first preferred embodiment. Therefore, the process of the first part of the second preferred embodiment of the present invention can be referred to the aforementioned FIG. 1B, 2, and 3' The surface of the carrier 1G is covered with an independent fine pattern 14a of the metal pattern 30. Next, as shown in Fig. 6, the independent antenna pattern 14a The surface utilizes a second solvent having a souther etching selectivity ratio for the protective metal pattern 3 and the individual antenna pattern 14a to remove the protective metal pattern 30. For example, if the protective metal pattern 30 is composed of titanium metal The second solvent may include an alkaline etching solution, for example, an etching solution mixed with ammonia (NH 3 〇 H), hydrogen peroxide (%), and deionized water (DeIon water) in a preferred ratio, or hydrogen peroxide ( H2〇2) and sulfuric acid (H2S〇4) are preferably mixed ratios of the etching solution, but 2〇1112489 is not limited to the above-mentioned surnames' and can be other solvent formulations with high etching selectivity. In the above etching solution containing hydrogen peroxide and sulfuric acid, titanium oxide (Ti〇2) is first formed by using hydrogen peroxide and titanium metal, and the titanium oxide material is removed by sulfuric acid. It is to be noted that, after the protective metal pattern 30 is removed, the joint originally existing between the protective metal pattern 30 and the surface of the individual antenna pattern 14a forms an activating layer 60 due to contact with the etching liquid. Since the active layer 6 is a layer of active unstable material, it needs to be removed first so as to make the subsequent adjustment metal pattern 40 more compact when it is covered by the individual antenna pattern 14a. As shown in FIG. 7, the step of removing the active layer 6 on the surface of the Lu independent antenna pattern 14a includes using a first solvent, and the third solvent has a higher etching selectivity for the active layer 60 and the individual antenna pattern 14a. Therefore, only the active layer 6〇 on the surface of the individual antenna pattern 14a is removed. For example, the third solvent contains deionized water, but is not limited thereto. Fig. 8 is a plan view showing a second preferred embodiment of the present invention, and Fig. 9 is a green cross-sectional view taken along line CC of Fig. 8. As shown in FIG. 9, FIG. 9 is a schematic diagram of the process after the connection, and then formed on the independent antenna pattern 14a-adjusting the metal pattern 2 40', wherein the adjustment metal pattern 4〇 may comprise a single layer structure or a multilayer structure, and The multi-layer structure comprises the same or rectified gold (four) material layer, and the metal materials are different, the thickness, the sample ground, and the different metal effects of the multilayer structure are also modulated by the frequency performance of the == frequency. However, with regard to the adjustment of the invention, the first is more acclaimed, and the shirt is added to Wei. The method for forming an antenna according to the present invention further provides a method for forming a third preferred embodiment. The third preferred embodiment differs from the first preferred embodiment mainly in that it is formed independently. After the antenna pattern 14a and the independent peripheral metal pattern (10), only the independent antenna pattern Ma is subjected to electric ore, and the adjustment metal pattern 4 and the protective metal _30 are formed on the independent antenna pattern. The wire, the solvent-selectively removes the independent peripheral metal pattern 14b, and selectively removes the protective metal pattern = 30 by the fourth solvent while retaining the lower metal pattern 4Q. The present invention forms part of the third preferred embodiment = the same as the first-difficult embodiment. Therefore, the third preferred embodiment of the present invention can be referred to the aforementioned 1A, m, and 2 Figure. As shown in the figure, the figure, and the second figure, the metal layer on the surface of the carrier ω is cut: a line drawing, and an independent peripheral metal drawing. Next, if the ι 属 pattern is based on the surface 40 of the antenna pattern 14a, the gold pattern is adjusted to the order of the metal _. The surface shape is covered by the second case and = the pattern 3 is adjusted according to the setting ^ after the setting of the profit, as shown in Fig. 11, the brake is used to selectively remove the independent peripheral circle k _ the solvent selective removal of the protective metal After pattern 3 is retained, °, and then, the fourth fourth solvent is used as the protective metal pattern, and the metal pattern 40 is adjusted, and the solvent of the first selection ratio is not entangled. In the method of forming the metal pattern 40, the metal pattern 40 has a higher value. The 'protective metal pattern (4) can be the same as the hair surface, so the tilting surface _ 3G, the metal riding 4G outer metal structure metal effect (4) - cable 4〇 That is, in the present invention, the adjustment gold only directly forms an adjustment effect of the metal diagram to the antenna illuminating point, and the #genus pattern 4 〇 can simultaneously have the protection function of the multi-layer metallurgy diagram 201112489. Maoyue’s antenna, Cheng Fang, originally saved the independent antenna pattern by protecting the metal pattern with the high-cost alternative to the solvent's “external peripheral metal pattern”, and the adjustable antenna pattern can be formed on the independent antenna pattern. _, in order to facilitate the RF performance of the most silky antennas, independent days _ touch the days of the case. Attached - mention is. Here, the meaning of the present invention is that the antenna forming method of the present invention can form a line on her surface having a multi-curved structure as needed. It is noted that if the present invention is used in the independent antenna pattern and the surface of the carrier plate, the use of the power failure process can eliminate the advantage of the absence of a pre-slip between the independent antenna pattern and the surface of the carrier, thereby providing an antenna and The better fixing surface between the carrier plates is the antenna launching capability. Furthermore, the present invention uses an electroless plating process or an electroplating process which is suitable for large-area fabrication and manufacturing. The present invention is not only simple in construction, but also has the advantages of industrial production, control by demand, and low cost. The above description is only a preferred embodiment of the present invention, and the uniform variation of the scope of the patent application of the present invention is the scope of the U cover of the present invention. [Circular Simple Description] Figs. 1A to 5 are schematic views showing a method of forming a preferred embodiment of the antenna forming method of the present invention. Figures 9 through 9 are schematic diagrams showing the method of forming a second preferred embodiment of the antenna forming method of the present invention. - Figures 10 through 11 are schematic views showing a part of the forming method of the third preferred embodiment of the antenna forming method of the present invention. [Main component symbol description] 10 Carrier board 12a Flat section 12b Curved section 13 Metal layer 14a Independent antenna pattern 14b Independent peripheral metal pattern 30 Protective metal pattern 40 Adjustment metal pattern 60 Activation layer 15