201112428 - 六、發明說明： 【發明所屬之技術領域】 本發明是有關-種太陽能電池晶片之封裝結構及其封裝方 法’特別是指-種應用於聚光型的太陽能電池模組的太陽能電池 晶片之封裝結構及其封裝方法。 【先前技術】 由於地球上資源有限’現在的人類正面臨著資源不斷被消耗 鲁的情況及能源即將被用盡的奢境，據能源雜訪等相關報導，石油 預估將於數十年内開發殆盡，核能電廠又有核廢料處理的問題， 其顯示著新一代能源的開發已是目前刻不容緩的課題，在發展眾 多再生能源技術中，太陽能應用受到各界相當的重視，因其為目 剐最可靠的新能源且相對的，利用太陽能做為新能源來源的轉換 器其結構最簡易，不會有任何的再生污染，此稱為「乾淨能源」。 如圖戶斤示’係為一種習知太陽能板（Receiver plate) 1的構 ® 造’其中包括一絕緣導熱底板（sub mount)2，至少一太陽能電池 晶片3固定在絶緣導熱底板2,並於太陽能晶片表面進行封膠製 程以使太陽能電池晶片3與外界空氣形成隔離，再將單個、數個 或陣列排列之太陽能電池晶片3及絶緣導熱底板2安裝於散熱板 4上’散熱板4係以導熱金屬製成，其上設置有散熱鶴片，可藉 由氣冷方式將太陽能電地晶片3的多餘熱量傳導到大氣中，以降 低太陽能電池晶片3工作的溫度。 該種習用的太陽能電池板主要缺點在於其使用的太陽能電 201112428 池晶片3係以封膠 夕万式封裝，其主要缺點在於前述封膠長時間使 長期暴路於空氣及受紫外線(UV)的照射，而產生老化' 黃化或變質，使锃止a 史传先線穿透率下降，而致使太陽能晶片的進光量 不足及照度品質不佳。 再者引述封的外部未設有任何遮蔽材料，而直接曝曬 於工氣’進而影響太陽能電池的使用壽命。 為解決該種習用的太陽能板模組的缺點，發明人於中華民國 ^利第嶋139873號巾請案中，已提出—種「聚光型太陽能電池 片于裝、，。構及其方法」，其主要技術特徵係為該前案係以高透 ^性且吸震高分子材料包裝體（如：材料）將太陽能電池 日曰片封裝在-散熱基板上，然後再於前述高分子材料包裝體的外 表面貼附-南強度透光材料層，而將該高分子透光材料包覆在該 高強度透光材料層的下方，藉由該高強度透光材料層可㈣護該 雨分子材料包裝體，使得高分子材料包裝體不會與空氣直接接 觸’有效阻隔外界的濕氣及灰塵，以增加太陽能電池的使用壽命。 然而該前案之太陽能電池晶片由於也是採用高分子材料封 裝，因此前述高分子透明材料包裝體在長時間受陽光曝曬下，也 會產生質變，而使太陽能電池模組的發電效能降低。 有鑑於此，本發明提出一種太陽能電池晶片之封裝結構及其 封裝方法，其可解決太陽能電池模組在戶外長期曝曬時，膠合填 充材料層因受熱質變’而使模組發電效能降低的問題。 【發明内容】 201112428 -本發明之主要目的是提供一種太陽能電池晶片封裝之結構 及其封裝方法，其包括一基板；至少一太陽能電池晶片，設置於 該基板上；一高透光性之膠合填充材料層，設置於該基板的上表 面的外部周圍；一中空間隔層，設置於該太陽能電池晶片與膠合 填充材料層之間，並使太陽能電池晶片位於中空間隔層的内孔， 可阻隔該膠合填充材料層與該太陽能電池晶片的接觸，該中空間 隔層的高度大於該太陽能電池晶片的高度；及一透明遮蓋，設置 • 於該膠合填充材料層及中空間隔層的上方，並與太陽能電池晶片 之間保持有一空間（空氣層），使基板、透明遮蓋與中空間隔層 間形成有一空氣室；完成上述之組合，最後進行加壓作業，使 膠合填充材料層發生膠合作用，將該透明遮蓋與基板黏合。由於 晶片上方為空氣層，所以，不會因為膠合填充材料層受熱質變而 失效。 本發明之新穎特徵係詳述於後附之申請專利範圍中；然而本 ® 發明之目的、特徵與特點，藉由參考下列之敘述及附圖，當可更 加容易了解。 【實施方式】 請參閱圖二所示，本發明太陽能電池晶片之封裝方法，包括： 1、 提供一基板10，可選用具金屬核心的印刷電路板 (MCPCB，Metal Core PCB); 2、 提供至少一太陽能電池晶片20,裝載在該基板1〇上並 形成電性連接； 201112428 3提供—尚透光性之膠合填充材料層30,形成在基板 的上表面的外部周圍，並使該膠合填充材料層30與該太 陽％電池晶片20之間保留有一適當空間。該膠合填充材料 為乙稀酷酸乙烯醋（EVA，Ethylene Vinyl Acetate); b 2、提供—中空間隔層40設置於基板10上，且位於該 j陽此電池日日片2〇與膠合填充材料層3〇之間，可阻隔該膠 _ 、材料層與太％能電池晶片20的接觸。該中空間隔層 可選用絕緣材料來製成，例如：玻璃纖維材料（); 一 5、提供一透明遮蓋5〇設置於該膠合填充材料層及中空 1隔層40的上方，並保持太陽能電池晶片與透明遮蓋％間 具有一空間（空氣層），使基板⑺、透明遮蓋50與中空間隔層40 門开v成有二氣至，該空氣室之氣壓低於一大氣壓或真空狀態。 該透明遮蓋50可選用具有高透光性的強化玻璃；及 6進行加壓作業60，使膠合填充材料層％發生膠合作用， 將透明遮蓋50與基板1〇黏合。 請參閱圖三及圖四所示，本發明太陽能電池晶片封裝結 構’包括有-基板10;至少一太陽能電池晶片2〇裝載在基板1〇 上並形成電性連接；-具有高透光性的膠合填充材料層3〇，形 成在基板10的上表面的外部周圍；_中空間隔層4〇設置於 縣板1G上，且位於該太陽能電池晶片2()的周圍；及—透明遮 盍50设置於該太陽能電池晶片2()、中空間隔層仙及膠合填充 材料層30的上方。 該基板10可選用具金屬核心的印刷電路板(μ。·，201112428 - VI. Description of the Invention: [Technical Field] The present invention relates to a package structure of a solar cell wafer and a package method thereof, particularly to a solar cell chip applied to a concentrating solar cell module The package structure and its packaging method. [Prior Art] Due to limited resources on the earth, 'now human beings are facing the luxuriance of resources and the exhaustion of energy. According to reports from energy interviews, oil is expected to be developed within a few decades. Exhaustion, nuclear power plants have the problem of nuclear waste disposal. It shows that the development of new generation energy is an urgent task. In the development of many renewable energy technologies, solar energy applications have received considerable attention from all walks of life. Reliable new energy and relatively, the use of solar energy as a source of new energy converters is the simplest structure, there will be no regenerative pollution, this is called "clean energy." As shown in the figure, it is a structure of a conventional solar panel 1 including an insulating submount 2, at least one solar cell wafer 3 is fixed on the insulating and thermally conductive substrate 2, and The solar wafer surface is subjected to a sealing process to isolate the solar cell wafer 3 from the outside air, and then the single, several or array of solar cell wafers 3 and the insulating and thermally conductive substrate 2 are mounted on the heat dissipation plate 4 The heat conductive metal is provided with a heat dissipating fin, and the excess heat of the solar electric chip 3 can be conducted to the atmosphere by air cooling to reduce the temperature at which the solar cell wafer 3 operates. The main disadvantage of this kind of conventional solar panel is that the solar energy 201112428 pool wafer 3 used in the solar cell package is encapsulated in a kiwan-style package, and the main disadvantage is that the sealant has long-term violent passage to the air and ultraviolet (UV). Irradiation, resulting in aging 'yellowing or deterioration, so that the first line penetration rate of the a a a history, resulting in insufficient solar light into the light and poor illumination quality. In addition, the outside of the seal is not provided with any shielding material, but directly exposed to the work' and thus affect the service life of the solar cell. In order to solve the shortcomings of the conventional solar panel module, the inventor has proposed a kind of "concentrating solar cell in the packaging, the structure and the method" in the case of the Republic of China ^ Li Di 嶋 139873. The main technical feature is that the front case is a high-transparent and shock-absorbing polymer material package (such as a material), and the solar cell sundial is packaged on the heat dissipation substrate, and then the polymer material package is used. The outer surface is attached with a south-strength light-transmitting material layer, and the polymer light-transmitting material is coated under the high-strength light-transmitting material layer, and the high-strength light-transmitting material layer can (4) protect the rain molecular material The package body makes the polymer material package not directly in contact with the air 'effectively blocking the outside moisture and dust to increase the service life of the solar cell. However, since the solar cell wafer of the previous case is also packaged with a polymer material, the polymer transparent material package may undergo a qualitative change under long-term exposure to sunlight, and the power generation performance of the solar cell module is lowered. In view of the above, the present invention provides a package structure of a solar cell chip and a packaging method thereof, which can solve the problem that the power generation performance of the module is reduced due to the thermal mass change of the solar cell module during long-term outdoor exposure. SUMMARY OF THE INVENTION 201112428 - The main object of the present invention is to provide a solar cell chip package structure and a packaging method thereof, comprising a substrate; at least one solar cell wafer disposed on the substrate; a high light transmittance glue filling a material layer disposed around the outer surface of the upper surface of the substrate; a hollow spacer layer disposed between the solar cell wafer and the glue filling material layer, and the solar cell wafer being located in the inner hole of the hollow spacer layer to block the bonding Contacting the filling material layer with the solar cell wafer, the height of the hollow spacer layer being greater than the height of the solar cell wafer; and a transparent covering disposed over the glue filling material layer and the hollow spacer layer, and with the solar cell wafer A space (air layer) is maintained between the substrate, the transparent cover and the hollow spacer to form an air chamber; the combination of the above is completed, and finally the pressurization operation is performed to cause the glue filling material layer to be glued, and the transparent cover and the substrate are covered. Bonding. Since the upper layer of the wafer is an air layer, it does not fail because of the thermal change of the cemented filler material layer. The novel features of the present invention are set forth in the appended claims. [Embodiment] Please refer to FIG. 2, the packaging method of the solar cell chip of the present invention includes: 1. providing a substrate 10, optionally a metal core printed circuit board (MCPCB, Metal Core PCB); A solar cell wafer 20 is mounted on the substrate 1 and electrically connected; 201112428 3 provides a layer 30 of a transparent light-filling filler material, formed around the outer surface of the upper surface of the substrate, and the glue filling material A suitable space is left between layer 30 and the solar cell wafer 20. The glue filling material is Ethylene Vinyl Acetate (EVA); b2, providing a hollow spacer layer 40 disposed on the substrate 10, and located in the j-yang battery sheet 2〇 and the glue filling material Between the layers 3, the contact of the glue, the material layer and the solar cell wafer 20 can be blocked. The hollow spacer layer may be made of an insulating material, for example: a glass fiber material; a 5. providing a transparent cover 5 is disposed above the glue filling material layer and the hollow 1 spacer layer 40, and holding the solar cell wafer There is a space (air layer) between the transparent cover and the transparent cover 50 and the hollow spacer 40 to open the air to a gas pressure lower than one atmosphere or a vacuum state. The transparent cover 50 may be made of tempered glass having high light transmittance; and 6 is subjected to a pressurizing operation 60 to cause the glue filler layer layer to be adhesively bonded, and the transparent cover 50 is bonded to the substrate 1A. Referring to FIG. 3 and FIG. 4, the solar cell chip package structure of the present invention includes a substrate 10; at least one solar cell wafer 2 is mounted on the substrate 1 and electrically connected; and has high light transmittance. The glue filling material layer 3 is formed around the outer surface of the upper surface of the substrate 10; the hollow spacer layer 4 is disposed on the county plate 1G and located around the solar cell wafer 2 (); and - the transparent concealer 50 is disposed Above the solar cell wafer 2 (), the hollow spacer layer and the glue filling material layer 30. The substrate 10 is optionally provided with a printed circuit board of a metal core (μ.·,
Metal Core PCB)。 該膠合填充材料層30與該太陽能電池晶片Μ之間㈣ 201112428 有一適當空間。該膠合填充材料層30可為乙烯-醋酸乙烯酯 (EVA ’ Ethylene Vinyl Acetate)，由於，該膠合填充材料層 30具有尚透光性，故可接收來自左右兩側的太陽光。 該中空間隔層40可阻隔該膠合填充材料層3〇與太陽 能電池晶片20的接觸，並使太陽能電池晶片2〇位於該中 空間隔層40的内孔41中，該内孔41環繞於太陽能電池晶 片20周圍。中空間隔層4〇的厚度係大於該太陽能電池晶 片20的厚度。該中空間隔層4〇可選用絕緣材料來製成， 例如：玻璃纖維材料（FR4)。 •亥透明遮蓋50可選用具有高透光性的強化玻璃。該透 明遮蓋50設置於膠合填充材料層3〇與中空間隔層4〇的上 方，並與該太陽能電池晶片20之間保持有一空間（空氣 層）’使基板10、透明遮蓋50與中空間隔層40間形成有一 空氣室42。該空氣室42可以進一步地將其内部所含之空氣 抽出’以使得該空氣室42中的氣壓低於_大氣壓，或者是 成為真空狀態。 元成則述封裝結構可進行最後的加壓程序，使該膠合 填充材料層30發生膠合作用’將透明遮蓋5〇與基板1〇: 错由上述之、纟且合，可6 士 . 了凡成一個太陽能電池晶片的封 結構’該封裝結構的主要牲料—# a丄 要特徵在於則述太陽能電池晶片 位在空氣室42中，當掇έ日且上 才、長期在戶外曝曬時，不會因膠 填充材料層30產生老彳卜、 只化或質變，致使模組發電效 降低。 綜上所述，本發明之妯 月之技術手段解決了習用的太陽能 201112428 池封裝結構容易產生因長時間曝曬，而使晶片上的朦填充 層受紫外線的照射而產生質冑，而影響到發電效能降低的 問題’故其確實倶以符合發明專利之可專利要件。 縱使本發月已由上述之實施例詳細敛述而可由熟悉本 技藝之人士任施以而為諸般修飾，皆不脫離如下所附申 請專利範圍所欲保護者。 【圖式簡單說明】 圖一為習知太陽能板之立體圖。 之封裂方法之流程圖 之·封骏結構之立體圖 之封裝結構之斷面圖 圖二為本發明太陽能電池晶片 圖二為本發明太陽能電i也晶片 圖四為本發明太陽能電池晶片 【主要元件符號說明】 1太陽能板 3 太陽能電池晶片 基板 30膠合填充材料層 41内孔 50透明遮蓋 緣導熱底板 4散熱板 20太陽能電池晶片 40中空間隔層 42空氣室 60加壓作業Metal Core PCB). There is a suitable space between the glue filling material layer 30 and the solar cell wafer cassette (4) 201112428. The glued filling material layer 30 may be ethylene-vinyl acetate (EVA' Ethylene Vinyl Acetate). Since the glued filling material layer 30 is still light transmissive, it can receive sunlight from the left and right sides. The hollow spacer layer 40 blocks the contact of the glue filling material layer 3〇 with the solar cell wafer 20, and the solar cell wafer 2 is located in the inner hole 41 of the hollow spacer layer 40, and the inner hole 41 surrounds the solar cell wafer. Around 20. The thickness of the hollow spacer layer 4 is greater than the thickness of the solar cell wafer 20. The hollow spacer layer 4 can be made of an insulating material such as a glass fiber material (FR4). • The transparent cover 50 can be made of tempered glass with high light transmission. The transparent cover 50 is disposed above the glue filling material layer 3〇 and the hollow spacer layer 4〇, and maintains a space (air layer) between the solar cell wafer 20 and the substrate 10, the transparent cover 50 and the hollow spacer layer 40. An air chamber 42 is formed therebetween. The air chamber 42 can further extract the air contained therein to cause the air pressure in the air chamber 42 to be lower than - atmospheric pressure or to be in a vacuum state. Yuan Cheng describes the package structure for the final pressurization process, so that the glued filling material layer 30 is glued together. 'The transparent cover 5 〇 and the substrate 1 〇: wrongly combined with the above, can be 6 士. The sealing structure of a solar cell wafer, the main material of the package structure, is characterized in that the solar cell wafer is located in the air chamber 42 and is not exposed to the sun for a long time. The power generation effect of the module is reduced due to the old rubber, the only change or the qualitative change caused by the rubber filling material layer 30. In summary, the technical means of the present invention solves the problem that the conventional solar energy 201112428 pool package structure is prone to prolonged exposure, and the germanium filling layer on the wafer is exposed to ultraviolet rays, thereby affecting power generation. The problem of reduced performance 'so it is indeed in line with the patentable requirements of the invention patent. The present invention has been modified by the above-described embodiments, and may be modified by those skilled in the art without departing from the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a conventional solar panel. FIG. 2 is a perspective view of a package structure of a three-dimensional diagram of a seal structure. FIG. 2 is a solar cell wafer of the present invention. FIG. 2 is a solar cell of the present invention. FIG. DESCRIPTION OF SYMBOLS 1 Solar panel 3 Solar cell wafer substrate 30 Glue filling material layer 41 Inner hole 50 Transparent cover edge Thermal conductive bottom plate 4 Heat sink 20 Solar cell wafer 40 Hollow spacer layer 42 Air chamber 60 Pressurization operation