201110179 KU-iUl-i'W 31905twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種應用於電子裝置中的保護元 件，且特另')是看關於一種f防丄遥電盔及過電壓的保鳟 件。 、° 【先前技術】 近年來’資訊科技突飛猛進，舉凡手機、電腦及個人 行動助理等資訊產品隨處可見，藉由它們的幫助，提供了 人們在生活上食、衣、住、行、育、樂各方面的需求也 使人們對資訊產品之依賴性與日俱增。然而，近來時常有 關於手機等可攜式電子產品的電池在充放電的過程中爆炸 的新聞。因此，業界開始加強電池在充放電的過程中的保 護措施，以防止電池在充放電的過程中因過電壓或過電流 而爆炸。 習知技術提出的防護元件的防護方式是使防護元件中 的溫度保險絲與電池的電路串聯，且使防護元件中的溫度 保險絲與加熱器電性連接至場效電晶體（FET)與積體電 路(1C)等控制單元。如此一來，當積體電路量測到在過電 壓時會驅動場效電晶體，使電流通過保護元件中的加熱器 加熱以熔斷溫度保險絲，進而使電池的電路呈斷路的狀態 而達到過電壓保護。此外，當過電流時，大量的電流流經 溫度保險絲會使溫度保險絲加熱而熔斷，進而使電池的電 路主辦路的狀態而達到過電流保護。 201110179 ivoj- i V i -TW 31905twf.doc/n f為習知之-種溫度保險絲封賴的剖面示意圖。 味參考圖1，習知之溫度保險絲封裝豸_ 110、一加熱器120、一絕緣層13〇、—金屬们40以1 二加熱器120配置於基板U0上，絕緣層⑽ 佤盍口…态120。金屬層140配置於絕緣層13〇上，且 焊劑150覆蓋於金屬層14〇。如此一來，加熱器12〇加敎 可直麟融金屬層140，以使金屬層U0熔融而向加熱器、 120兩侧的電極屬160流動。 然而，由於絕緣層130的表面近乎平坦，電極層16〇 之相對於基板110的最大高度H1與絕緣屬13〇之相 基板110的最大高度H2差異不大，且熔融的金屬層14〇 依然具有-定的黏度。因此，熔融的金屬層140不易 以致於加齡12〇紐有效騎金屬層14G，a法 過電壓保護的要求。 【發明内容】 本發明提供-種保護元件’可有效防止過電流與過電 壓〇 本發明提出-種保護元件，其包含—基板、一上電 極、-下電極、-端電極、—加熱元件、―祕劑以及— 金屬塊。基板具有彼此相對的―第—表面與一第二表面。 上電極配置於基板的第—表面上，且具有—第—子電極以 及彼此相對的-第三子電極與—第四子電極。第—子電極 具有-第-延伸部。第-延伸部位於第三子電極與第四子 201110179 rxj- nn - fW 31905twf,d〇c/n 電極之間，且 出部。下電極配置於:板電極之::有「第-突 極與下電極。加熱元件配置於:板:上立:J極連接土電 兀’劑配置於基板的第-上 連接第三子電極、第，:==:表面上，且 極、出—種倾元件，其包含-基板、-上電 一焊料層以及-第1狀2 —金屬塊、一第 ίΓ;:;面。上電極配置於基板的第-表面上，且 ΐί極及彼此相對的-第三子電極與-第四 於第m命極具有—第一延伸部，且第一延伸部位 第四子電極之間。下電極配置於基板的第 土板〃中弟—延伸部延伸至加熱元件的上方。金屬塊 第—表面上’且連接第三子電極、第-延伸部 間。第一焊二ί置置於金屬塊與第—延伸部之 二C 屬塊與第三子電極之間以及配置 料声的炫子電極之間。金屬塊的固相點大於第二焊 的^裝溫度^ 4第二焊料層的轉溫度大於保護元件 極=1提出—觀護元件，其包括—基板、一上電 一下電極、-端電極、—加熱元件、—金屬塊以及一 201110179 KD-1UJ-TW 3l905twf.doc/n 焊料層。基板具有彼此相對的一第-一表面與一第二表面。 上電極配置於基板的第一表面上，且具有一第一 及彼此相對的一第三子電極與一第四子電極。第一子電極 具有一第一延伸部且第一延伸部位於第三子電極與第四 子電極之間。下電極配置於基板的第二表面上。端^極連 接上電極與下電極。加熱元件配置於基板上，且第一延伸 部延伸至加熱元件的上方。金屬塊配置於基板的第一表面 φ 上，且連接第三子電極、第一延伸部與第四子電極。焊料 層配置於金屬塊與第一延伸部之間、配置於金屬塊與第三 子電極之間以及配置於金屬塊與第四子電極之間。金屬塊 的體積與焊料層的面積之比值小於。 基於上述，本發明之保護元件的助熔劑位於上電極的 子包極與延伸部之間，且保護元件的上電極具有突出部。 ^此’當加熱元件加熱時，炼融的助炼劑可有效地幫助金 ^塊溶融’而熔融的金屬會因表面張力的緣故而往突出部 流動，意即突出部可增加溶融的金屬的流動空間與吸附面 籲冑’可避躲融的金屬導通延伸部與？電極而產生短 題。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 立圖2A為本發明之一實施例之一種保護元件的俯視示 思圖。圖2B綠示為圖2A之保護元件的仰視示意圖。圖 201110179 1 v 1 - TW 31905twf.doc/n 2C繪示為圖2A之保護元件沿線Ι-Γ的剖面示意圖·。請同 時參考圖2A、圖2B以及圖2C，在本實施例中，保護元 件200a包括一基板210、一上電極220、一下電極230、 一端電極240、一加熱无件250、一助熔劑260以及一金屬-塊 270。 詳細而言，基板210具有彼此相對的一第一表面212 與一第二表面214以及連接第一表面212與第二表面214 的一側表面216。上電極220配置於基板210的第一表面 212上’且具有彼此相對的一第一子電極222與一第二子 電極224以及彼此相對的一第三子電極226與一第四子電 極228。需注意的是’於其他實施例中，上電極220也可 不包含第二子電極224 ’且不影響過電流及過電壓保護效 果。第一子電極222具有一第一延伸部222a，且第一延伸 部222a位於第三子電極226與第四子電極228之間。特別 是，第一延伸部222a之寬度與基板210之寬度的比值小於 0.8。 第二子電極226具有一第一突出部226a，第四子電極 228具有一第二突出部228a。第一突出部226a與第二突出 部228a皆位於第一延伸部222a與第二子電極224之間， 且第一突出部226a與第二突出部228a之間隔有一間距 D。在本實施例中，間距d較佳地是介於〇·ι公愛至〇 4 公爱之間，可以避免第三子電極226與第四子電極228產 生短路。下電極230配置於基板210的第二表面214上。 端電極240連接上電極220與下電極230,且覆蓋基板210 201110179 Λ^-ιυι-TW 31905twf.doc/n 的側表面216 〇 加熱元件250配置於基板210的第二表面214上，且 連接下電極230。在本實施例中，下電極23〇具有彼此相 對的一第五子電極· 232與一第六子電極234以及彼此相對 的一第七子電極230與一第八子電極238。第五子電極 32第’、子電極234、苐七子電極236、第八子電極238 依序對應第一子電極222、第二子電極224、第三子電極 226以及第四子電極228配置。第五子電極Β2具有一第 ，延伸部232a，第六子電極234具有一第三延伸部234a。 第=延伸部232a與第三延伸部234a位於第七子電極236 與第八子電極238之間並彼此平行且不重疊，而加熱元件 250連接於第一延伸部232a與第三延伸部234a之間。然 而，於其他實施例中，加熱元件250也可直接連接於第五 子電極232和第六子電極234之間，而不需有第二延伸部 232a與第三延伸部234a。 基板210的材質包括陶瓷（例如氧化鋁）、玻璃環氧 樹脂、二氧化錯（Zr02)、氮化石夕（Si3N4 )、氣化銘（A1N)、 氮化硼（BN)或是其他無機材料。上電極22〇與下電極 230的材質例如為銀膠、銀鉑合金、鎳、鎳合金銅、金 等導電性質良好的材料。端電極24〇的材質例如是鎳、金、 銅及其，合科電性質良好的材料。加熱元件，的材質 匕括一氧化釕（Ru〇2)、％黑（可摻雜於水玻璃等無機系 黏著劑中或是熱硬化樹脂等有機系黏著劑中）、銅、鎳鉻 合金、鈦與鎳銅合金等。此外，為保護加熱元件25〇不^ 201110179 ^υ-ιυι-rw 31905twf.doc/n 外界環境的污染或氧化，可在加熱元件25〇上覆蓋一絕緣 層285，其材質包括玻璃膠或環氧樹脂（ep〇Xy resin) 〇 助熔劑260配置於基板210的第一表面212上，並位 於第一延伸部222a與第三-子電極226、之間，以及位於第，一、 延伸部222a與第四子電極228之間。具體而言，助熔劑 260是填充於由第三子電極226、第一延伸部222a以及基 板210所構成的一第一凹槽R1中，以及填充於由第四子 電極228、第一延伸部222a以及基板210所構成的一第二 凹槽R2中。此外’本實施例之助熔劑260是由松脂（ rosin) (約佔50%〜80%)、軟化劑（約佔5%〜20%)、活性劑 (active agent)(約佔 0.5%〜4%)以及合成橡膠（synthetic rubber)(約佔5°/。〜20%)所組成。 金屬塊270配置於基板210的第一表面212上，且連 接第三子電極226、第一延伸部222a與第四子電極228。 具體來說，金屬塊270覆蓋部分第三子電極226、助熔劑 260、第一延伸部222a與第四子電極228。在本實施例中， 由於助溶劑260與第一延伸部222a皆位於加熱元件25〇 與金屬塊270之間，因此當加熱元件250加熱時，助溶劑 260可有效地幫助其上方的金屬塊270熔斷，而達成有效 防止過電壓或過電流。 當加熱元件250加熱而使助熔劑260與金屬塊270皆 處於炫融狀態時，因助溶劑260可避免金屬塊270受熱炫 融開始流動之表面產生氧化薄膜，因此可以確保金屬塊 270溶斷的效果。由於本實施例之上電極220的第三子電 201110179 κυ-ιυι-TW 31905twf.doc/n 極226與第四子電極228分別具有第二突出部226a與第二 突出部228a’因此熔融的金屬會因表面張力的影響而往第 一突出部226a與第二突出部228a流動。也就是說，第— ……·突出部226a與第二突也部228b可增加熔融的金屬的流動 空間與吸附面積。如此一來，熔融的金屬不會堆積或滯留 於弟二子電極226與第一延伸部222a之間以及第四子電極 228與第一延伸部222a之間，可以避免產生短路的現象。 此外’金屬塊270的材質包括錫鉛合金（錫2.5%，鉛97.5 鲁 ％)、錫銀錯合金（錫5%，銀2.5%，鉛92.5%)、錫錮 银錯合金、錫錄合金、錫銀銅合金等低溶點合金。 值得一提的是’本實施例之第一延伸部222a之寬度 與基板210之寬度選用特定範圍之比值，意即第一延伸部 222a之寬度與基板210之寬度的比值小於〇·8。因此，當 保護元件200a為了搭配小尺寸之電子產品而縮小其元件 體積時，上電極220之第一子電極222、第二子電極224、 第三子電極226以及第四子電極228亦能提供相應的電極 • 面積或彼此間的間距’來確保金屬塊270能迅速溶斷。如 此一來’除了可增加保護元件2〇〇a的應用範圍外，亦可提 高保護元件200a的可靠度。 此外’在此須說明的是，本發明並不限定第三子電極 226與第四子電極228的型態，雖然此處所提及的第三子 電極226與第四子電極228具體化為分別具有第一突出部 226a與苐二突出部228a ’但於其他未繪示的實施例中，第 二子電極226與第四子電極228中亦可僅有一突出部或多 201110179 RD-101 -TW 31905twf.doc/n 個大小不一的突出部，仍屬於本發明可採用的技術方案， 不脫離本發明所欲保護的範圍。 〃 一圖3A為本發明之另一實施例之一種保護元件的俯視 :示意圖。圖3B繪示為圖..从文保護元件的仰視示意圖。圖 3C繪示為圖3A之保護元件沿線1141，的剖面示意圖。請同 時參考圖3A、圖SB以及圖冗，在本實施例中，圖3a〜 圖3C之保護元件200b與圖2A〜圖2C之保護元件加㈨ 相似，惟二者主要差異之處在於：圖3A〜圖3C之保護元 件200b更包括一焊料層280於第三子電極226、第四^電 極228與第一延伸部222a之上。 一詳細而言，部分的焊料層280配置於金屬塊27〇與第 三子電極226之間、配置於金屬塊27〇與第四子電極228 之間以及配置於金屬塊270與第一延伸部222a之間。如此 一來，當加熱元件25〇加熱而使助熔劑26〇、金屬塊27〇 以及焊料層28G皆處於炼融狀態時，祕的金屬會因炼融 狀態之焊料層280與助溶劑26〇具有潤濕效果，且同時藉 由表面張力的影響而往第一突出部226a與第二突出部 228a流動。也就是說’熔融狀態的焊料層28〇與助溶劑26〇 可更進一步使得熔融的金屬不會堆積或滯留於第三子電極 226與第一延伸部222a之間以及第四子電極228與第一延 伸部222a之間，可以避免產生短路的現象。換言/之，可更 進一步提南保護兀件200b的可靠度。此外，焊料層28〇 的材質包括錫銀合金（錫96.5%，銀3.5%)、金、銀、 錫、錯、Μ、銦、鎵、纪、錄、鋼等金屬材料，且焊料層 12 201110179 RD-101-TW 31905twf.doc/n 280可更包含助熔劑。 此外，為了更進一步確保金屬塊270可有效熔斷，因 此本實施例針對金屬塊270的體積與焊料層28〇的面積之 ‘間的關係做實驗…由来一可得知:奮金屬塊27〇的體積與 焊料層280的面積之比值小於〇.16時，功率於7瓦特的^ 熱兀件25〇可確實炼斷金屬塊27〇。另外，由於溶融 料層280其潤澄性較佳，因此當金屬塊27〇熔斷時， 集於溶融的焊上，可以確保熔賴金屬不會^第 2^ ^ ·與第三子電極226或第四子電極228產生短 _ ^如此—來’可進—步確保金屬塊27G可有效地被 而達成有效防止過電壓或過電流。射之，當金屬 的體積與焊料層28()的面積之比值小於q 16，可提 尚金屬塊27〇有效熔斷的可靠度。201110179 KU-iUl-i'W 31905twf.doc/n VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a protection element applied to an electronic device, and particularly to see a type of f Anti-small helmet and overvoltage protection. °[Previous technology] In recent years, 'information technology has advanced by leaps and bounds. Information products such as mobile phones, computers and personal mobile assistants can be seen everywhere. With their help, people provide food, clothing, housing, travel, education and music in their lives. The demand for all aspects also makes people's dependence on information products increasingly increasing. However, there has been a recent news about the explosion of batteries in portable electronic products such as mobile phones during charging and discharging. Therefore, the industry began to strengthen the protection measures of the battery during charging and discharging to prevent the battery from exploding due to overvoltage or overcurrent during charging and discharging. The protective element proposed by the prior art is protected by connecting a thermal fuse in the protective component to the circuit of the battery, and electrically connecting the thermal fuse and the heater in the protective component to the field effect transistor (FET) and the integrated circuit. (1C) and other control units. In this way, when the integrated circuit measures that the field effect transistor is driven when the voltage is overvoltage, the current is heated by the heater in the protection element to melt the temperature fuse, thereby causing the circuit of the battery to be in an open state to reach an overvoltage. protection. In addition, when an overcurrent occurs, a large amount of current flows through the temperature fuse, which causes the thermal fuse to be heated and blown, thereby causing the state of the battery circuit to achieve overcurrent protection. 201110179 ivoj- i V i -TW 31905twf.doc/n f is a schematic cross-sectional view of a conventional temperature fuse. Referring to FIG. 1, a conventional thermal fuse package 豸 110, a heater 120, an insulating layer 13 〇, a metal 40 is disposed on the substrate U0 by a heater 120, and the insulating layer (10) is in a state of 120. . The metal layer 140 is disposed on the insulating layer 13A, and the flux 150 covers the metal layer 14A. In this manner, the heater 12 is twisted and twisted to melt the metal layer 140 so that the metal layer U0 is melted and flows toward the electrode genus 160 on both sides of the heater 120. However, since the surface of the insulating layer 130 is nearly flat, the maximum height H1 of the electrode layer 16 with respect to the substrate 110 and the maximum height H2 of the phase substrate 110 of the insulating layer 13 are not much different, and the molten metal layer 14 has - Fixed viscosity. Therefore, the molten metal layer 140 is not so easy to be used for the ageing 12 〇 骑 effective riding metal layer 14G, a method of overvoltage protection. SUMMARY OF THE INVENTION The present invention provides a protective element that can effectively prevent overcurrent and overvoltage. The present invention provides a protective element comprising a substrate, an upper electrode, a lower electrode, a terminal electrode, a heating element, - Secret agents and - metal blocks. The substrate has a "first surface" and a second surface opposite to each other. The upper electrode is disposed on the first surface of the substrate, and has a first sub-electrode and a third sub-electrode and a fourth sub-electrode opposite to each other. The first sub-electrode has a -th extension. The first extension is located between the third sub-electrode and the fourth sub-201110179 rxj-nn-fW 31905twf, d〇c/n electrode, and is out. The lower electrode is disposed on: the plate electrode:: "the first-bump and the lower electrode. The heating element is disposed on: the plate: the upper: the J-connected earth-electric" agent is disposed on the first-upper connection of the third sub-electrode of the substrate , the first::==: on the surface, and the pole-out-type tilting element, which comprises a substrate, a power-on-solder layer, and a -1st 2 - metal block, a Γ Γ; Disposed on the first surface of the substrate, and the third sub-electrode and the fourth to the mth dipole have a first extension portion, and the first extension portion is between the fourth sub-electrode. The electrode is disposed on the first plate of the substrate, and the extension extends above the heating element. The metal block is on the first surface and is connected between the third sub-electrode and the first extension. The first solder is placed on the metal block. Between the two C-blocks of the first extension and the third sub-electrode and the shattering electrode of the arrangement sound. The solid phase point of the metal block is greater than the soldering temperature of the second solder ^ 4 the rotation of the second solder layer The temperature is greater than the protection element pole=1. The protection element comprises a substrate, a power-on electrode, a terminal electrode, and a heating element. a metal block and a 201110179 KD-1UJ-TW 3l905twf.doc/n solder layer. The substrate has a first surface and a second surface opposite to each other. The upper electrode is disposed on the first surface of the substrate and has a a first sub-electrode and a fourth sub-electrode opposite to each other. The first sub-electrode has a first extension and the first extension is located between the third sub-electrode and the fourth sub-electrode. The second surface of the substrate is connected to the upper electrode and the lower electrode. The heating element is disposed on the substrate, and the first extending portion extends above the heating element. The metal block is disposed on the first surface φ of the substrate, and is connected a third sub-electrode, a first extension portion and a fourth sub-electrode. The solder layer is disposed between the metal block and the first extension portion, disposed between the metal block and the third sub-electrode, and disposed on the metal block and the fourth sub-electrode Between the volume of the metal block and the area of the solder layer is less than. Based on the above, the flux of the protective element of the present invention is located between the sub-package and the extension of the upper electrode, and the upper electrode of the protection element has a protrusion ^This 'When the heating element is heated, the refining flux can effectively help the gold block to melt' and the molten metal will flow to the protrusion due to surface tension, meaning that the protrusion can increase the molten metal The flow space and the adsorption surface are ambiguous to avoid the entangled metal conduction extension and the electrode to create short problems. In order to make the above features and advantages of the present invention more obvious, the following embodiments are described and cooperated with The drawings are described in detail below. [Embodiment] Figure 2A is a top view of a protective element according to an embodiment of the present invention. Figure 2B is a green bottom view of the protective element of Figure 2A. Figure 201110179 1 v 1 - TW 31905twf.doc/n 2C is a cross-sectional view of the protective element of Fig. 2A along the line Ι-Γ. Referring to FIG. 2A, FIG. 2B and FIG. 2C, in the embodiment, the protection component 200a includes a substrate 210, an upper electrode 220, a lower electrode 230, an end electrode 240, a heating element 250, a flux 260, and a Metal - block 270. In detail, the substrate 210 has a first surface 212 and a second surface 214 opposite to each other and a side surface 216 connecting the first surface 212 and the second surface 214. The upper electrode 220 is disposed on the first surface 212 of the substrate 210 and has a first sub-electrode 222 and a second sub-electrode 224 opposite to each other and a third sub-electrode 226 and a fourth sub-electrode 228 opposite to each other. It should be noted that in other embodiments, the upper electrode 220 may not include the second sub-electrode 224' and does not affect the overcurrent and overvoltage protection effects. The first sub-electrode 222 has a first extension 222a, and the first extension 222a is located between the third sub-electrode 226 and the fourth sub-electrode 228. In particular, the ratio of the width of the first extension 222a to the width of the substrate 210 is less than 0.8. The second sub-electrode 226 has a first protrusion 226a and the fourth sub-electrode 228 has a second protrusion 228a. The first protrusion 226a and the second protrusion 228a are located between the first extension 222a and the second sub-electrode 224, and the first protrusion 226a and the second protrusion 228a are spaced apart by a distance D. In the present embodiment, the pitch d is preferably between 〇·ι 公爱至〇4 公爱, and the third sub-electrode 226 and the fourth sub-electrode 228 can be prevented from being short-circuited. The lower electrode 230 is disposed on the second surface 214 of the substrate 210. The end electrode 240 is connected to the upper electrode 220 and the lower electrode 230, and covers the side surface 216 of the substrate 210 201110179 Λ^-ιυι-TW 31905twf.doc/n. The heating element 250 is disposed on the second surface 214 of the substrate 210, and is connected under Electrode 230. In the present embodiment, the lower electrode 23A has a fifth sub-electrode 232 and a sixth sub-electrode 234 opposite to each other and a seventh sub-electrode 230 and an eighth sub-electrode 238 opposite to each other. The fifth sub-electrode 32, the sub-electrode 234, the seven-sub-electrode 236, and the eighth sub-electrode 238 are sequentially disposed corresponding to the first sub-electrode 222, the second sub-electrode 224, the third sub-electrode 226, and the fourth sub-electrode 228. The fifth sub-electrode Β 2 has a first extending portion 232a, and the sixth sub-electrode 234 has a third extending portion 234a. The first extension portion 232a and the third extension portion 234a are located between the seventh sub-electrode 236 and the eighth sub-electrode 238 and are parallel to each other and do not overlap, and the heating element 250 is connected to the first extension portion 232a and the third extension portion 234a. between. However, in other embodiments, the heating element 250 can also be directly connected between the fifth sub-electrode 232 and the sixth sub-electrode 234 without the second extension 232a and the third extension 234a. The material of the substrate 210 includes ceramic (for example, alumina), glass epoxy resin, dioxin (Zr02), nitriding (Si3N4), gasification (A1N), boron nitride (BN) or other inorganic materials. The material of the upper electrode 22A and the lower electrode 230 is, for example, a material having good electrical conductivity such as silver paste, silver platinum alloy, nickel, nickel alloy copper or gold. The material of the terminal electrode 24A is, for example, nickel, gold, or copper, and a material having good electrical properties. The material of the heating element includes ruthenium oxide (Ru〇2), % black (which can be doped in an inorganic adhesive such as water glass or an organic adhesive such as a thermosetting resin), copper, nickel-chromium alloy, Titanium and nickel copper alloys, etc. In addition, in order to protect the heating element 25 from 201110179 ^υ-ιυι-rw 31905twf.doc/n environmental pollution or oxidation, the heating element 25 can be covered with an insulating layer 285, the material of which includes glass glue or epoxy The epoxide flux 260 is disposed on the first surface 212 of the substrate 210 and located between the first extension portion 222a and the third-sub-electrode 226, and at the first, extension portion 222a and Between the fourth sub-electrodes 228. Specifically, the flux 260 is filled in a first recess R1 composed of the third sub-electrode 226, the first extension portion 222a, and the substrate 210, and is filled in the fourth sub-electrode 228 and the first extension portion. 222a and a second recess R2 formed by the substrate 210. In addition, the flux 260 of the present embodiment is composed of rosin (about 50% to 80%), softener (about 5% to 20%), and active agent (about 0.5% to 4%). %) and synthetic rubber (about 5 ° /. ~ 20%). The metal block 270 is disposed on the first surface 212 of the substrate 210 and is connected to the third sub-electrode 226, the first extension portion 222a and the fourth sub-electrode 228. Specifically, the metal block 270 covers a portion of the third sub-electrode 226, the flux 260, the first extension portion 222a, and the fourth sub-electrode 228. In the present embodiment, since the co-solvent 260 and the first extension 222a are both located between the heating element 25A and the metal block 270, the co-solvent 260 can effectively assist the metal block 270 above it when the heating element 250 is heated. Fuse, and achieve effective prevention of overvoltage or overcurrent. When the heating element 250 is heated to cause the flux 260 and the metal block 270 to be in a state of being glazed, the auxiliary solvent 260 can prevent the metal block 270 from being oxidized by the surface on which the hot metal begins to flow, thereby ensuring that the metal block 270 is dissolved. effect. Since the third sub-electrode 201110179 κυ-ιυι-TW 31905 twf.doc/n pole 226 and the fourth sub-electrode 228 of the upper electrode 220 of the present embodiment have the second protruding portion 226a and the second protruding portion 228a', respectively, the molten metal The first protrusion 226a and the second protrusion 228a flow due to the influence of the surface tension. That is, the first ... - the protrusion 226a and the second protrusion 228b can increase the flow space and the adsorption area of the molten metal. As a result, the molten metal does not accumulate or stay between the second sub-electrode 226 and the first extending portion 222a and between the fourth sub-electrode 228 and the first extending portion 222a, so that a short circuit can be avoided. In addition, the material of the metal block 270 includes tin-lead alloy (tin 2.5%, lead 97.5 5%), tin-silver alloy (tin 5%, silver 2.5%, lead 92.5%), tin-silver alloy, tin-recorded alloy, Low melting point alloy such as tin-silver-copper alloy. It is worth mentioning that the ratio of the width of the first extension portion 222a of the present embodiment to the width of the substrate 210 is a specific range, that is, the ratio of the width of the first extension portion 222a to the width of the substrate 210 is less than 〇·8. Therefore, when the protection element 200a reduces its component volume in order to match the small-sized electronic product, the first sub-electrode 222, the second sub-electrode 224, the third sub-electrode 226, and the fourth sub-electrode 228 of the upper electrode 220 can also provide Corresponding electrodes • area or spacing between each other 'to ensure that the metal block 270 can be quickly dissolved. As a result, in addition to the application range of the protective element 2〇〇a, the reliability of the protective element 200a can be improved. In addition, it should be noted that the present invention does not limit the types of the third sub-electrode 226 and the fourth sub-electrode 228, although the third sub-electrode 226 and the fourth sub-electrode 228 mentioned herein are embodied as The first protruding portion 226a and the second protruding portion 228a' are respectively provided. However, in other embodiments not shown, the second sub-electrode 226 and the fourth sub-electrode 228 may also have only one protruding portion or more 201110179 RD-101 - TW 31905 twf.doc/n protrusions of different sizes are still within the technical solution of the invention, without departing from the scope of the invention. Figure 3A is a top plan view of a protective element in accordance with another embodiment of the present invention. FIG. 3B is a schematic bottom view of the protection element of the text. 3C is a cross-sectional view of the protection element of FIG. 3A along line 1141. 3A, FIG. 3B and FIG. The protection element 200b of 3A to 3C further includes a solder layer 280 over the third sub-electrode 226, the fourth electrode 228 and the first extension 222a. In detail, a portion of the solder layer 280 is disposed between the metal block 27A and the third sub-electrode 226, between the metal block 27A and the fourth sub-electrode 228, and disposed between the metal block 270 and the first extension portion. Between 222a. In this way, when the heating element 25 is heated to cause the flux 26 〇, the metal block 27 〇, and the solder layer 28G to be in a smelting state, the secret metal may have a molten layer 280 and a co-solvent 26 炼 in the fused state. The wetting effect, and at the same time, flows to the first protrusion 226a and the second protrusion 228a by the influence of the surface tension. That is, the 'solder layer of solder layer 28 〇 and the co-solvent 26 〇 can further make the molten metal not accumulate or remain between the third sub-electrode 226 and the first extension 222a and the fourth sub-electrode 228 and Between one extension portion 222a, a phenomenon of short circuit can be avoided. In other words, the reliability of the south protection member 200b can be further improved. In addition, the material of the solder layer 28〇 includes a tin-silver alloy (tin 96.5%, silver 3.5%), gold, silver, tin, erbium, antimony, indium, gallium, ki, recording, steel and other metal materials, and the solder layer 12 201110179 RD-101-TW 31905twf.doc/n 280 may further contain a flux. In addition, in order to further ensure that the metal block 270 can be effectively blown, the present embodiment conducts an experiment on the relationship between the volume of the metal block 270 and the area of the solder layer 28A. From the above, it can be known that the metal block 27 is When the ratio of the volume to the area of the solder layer 280 is less than 〇.16, the power of the 7 watts of the heat sink 25 〇 can surely smelt the metal block 27 〇. In addition, since the molten material layer 280 is more sturdy, when the metal block 27 is melted, it is collected on the molten solder to ensure that the molten metal does not be the second sub-electrode 226 or The fourth sub-electrode 228 generates a short _ ^ such - to enable the step - by step to ensure that the metal block 27G can be effectively achieved to effectively prevent overvoltage or overcurrent. Shot, when the ratio of the volume of the metal to the area of the solder layer 28() is less than q 16, the reliability of the effective melting of the metal block 27 can be improved.
表一 2.89 2.85 3.00 金屬塊體積與焊料 7瓦特耐壓熔 層面積的比值 斷測試結構 0.059 OK 0.100 OK 0.104 OK 0.121 OK 0.157 OK 一 ~ · 0.136 OK — 1 · 0.174 NG --------— - 0.200 -------------- NG 4 6 201110179Table 1.2.89 2.85 3.00 The ratio of the volume of the metal block to the area of the 7 watt pressure-resistant melted layer of the solder. Test structure 0.059 OK 0.100 OK 0.104 OK 0.121 OK 0.157 OK one ~ · 0.136 OK — 1 · 0.174 NG -------- — - 0.200 -------------- NG 4 6 201110179
RD-101 -TW 31905twf,doc/n 9 0.684 4.35 0.157 OK 10 0.684 3.56 0.192 NG 圖4為本發明之另一實施例之一種保護元件的剖面示 意谓。請參考圖'4 ’在本實施例中，圖4之保護元件2〇〇c· 與圖3A〜圖3C之保護元件200b相似，惟二者主要差異 之處在於：圖4之保護元件200c包括一第一焊料層282 於弟一延伸部222a上’以及一第二焊料層284於第三子電 極226與第四子電極228上。 詳細而言’部分的第一焊料層282配置於金屬塊270 與第一延伸部222a之間。部份的第二焊料層284配置於金 屬塊270與第三子電極226之間以及配置於金屬塊27〇與 第四子電極228之間。特別是，在本實施例中，金屬塊27〇 的固相點大於第二焊料層284的熔接溫度，且第二焊料層 284的熔接溫度大於組裝保護元件200c於一電路板（未^ 示）上時的溫度（即組裝溫度）^此外，金屬塊27〇的固 相點大於第二焊料層284的熔接溫度，且第二焊料層284 的熔接溫度大於第一焊料層282的熔接溫度。金屬塊27〇 的液相點亦大於組裝保護元件2〇〇c於電路板(未顯示）上 的溫度（即組裝溫度）。 ’ 在本實施例中，第一焊料層282的熔點相較於第二 =層284的熔點低。如此一來，當加熱元件25〇加熱 第-焊料層282會先與其上方的金屬塊—、溶融接: 而降低金屬塊270的熔點，可減少金屬塊27〇熔斷的 進一步而言’當第-焊料層282⑽點更小於崎保護^ 201110179 RD-101 -TW 31905twf.doc/n 件200C於電路板（未顯示）上時的溫度時，第一焊料層 加於保敍件組裝時會先和上方的金屬塊27()溶融^ 合，進而降低金屬塊270的熔點，可進一步減少金屬塊27〇 熔斯的時間-。此外..，第、三子電極必26與第四子電極2烈上 塗佈熔點較高的第二焊料層284,可以避免組裝保護元件 200a於電路板（未顯示）時，造成第二焊料層284熔融而 產生金屬塊270移位的情形，且組裝後亦不影響阻值。 此外，為了更進一步確保金屬塊270可有效熔斷，金 屬塊270的體積與焊料層的面積（即第一焊料層282的面 積加上第二焊料層284的面積）之比值亦可採用小於0.16 的範圍，可提高金屬塊270有效熔斷的可靠度。換言之， 本實施例之保護元件200c的設計具有較佳的可靠度。 圖5A為本發明之另一實施例之一種保護元件的俯視 示意圖。圖5B緣示為圖5A之保護元件的仰視示意圖。圖 5C繪示為圖5A之保護元件沿線πΐ-ΙΙΓ的剖面示意圖。請 同時參考圖5A、圖5B以及圖5C，在本實施例中，圖5A 〜圖5C之保護元件200d與圖2A〜圖2C之保護元件200a 相似，惟二者主要差異之處在於：圖5A〜圖5c之保護元 件200d的加熱元件250、第二延伸部322b、第三延伸部 324a皆配置於基板210的第一表面212上。 詳細而言’在本實施例中，上電極320的第一子電極 322更具有一第二延伸部322b，第二子電極324具有一第 三延伸部324a。第二延伸部322b與第三延伸部324a配置 於第三子電極326與第四子電極328之間，而加熱元件250 201110179 RD-101-TW 31905twf.doc/n 位於基板210 $第一表面212 ±且連接第二延伸部32处 與第三延伸部324a。絕緣層285配置於第一延伸部徽 與第二延伸部322b及第三延伸部324a之間，奇即第一延 伸部· 322技位於絕豫層渺的二表面上，而第二^伸部 及第三延伸部324a位於絕緣層285的另—相對的表面上。 特別是，第一延伸部322a、第二延伸部322b、第三延伸部 324a於絕緣層285上的正投影彼此不重疊。 此外，助熔劑260配置於絕緣層28f上，且位於第一 延伸部322a與第三子電極326之間，以及位於第一延伸部 322a與第四子電極328之間。金屬塊27〇 a蓋部分的第三 子電極326、助溶劑260、第一延伸部3瓜與第四子電極 228,以使助熔劑260位於金屬層27〇與絕緣層285之間。 如此一來，當加熱元件250加熱時，熱可透過絕緣層2幻 傳導到助炼劑細與金屬塊270,以炼融金屬塊—此時， 直接接觸金屬塊27G的贿劑2H可有助於金屬塊27〇 溶融。 值知注意的是，在本實施例中，保護元件2〇〇d之 電極330具有依序對應第一子電極322、第二子電極324、 第三子電極326卩及第四子電極328配置的一第五子電極 332、一第六子電極334、一第七子電極336與一第八子電 極338。然於另-實施例中，下電極MO亦可依設計需求 而沒有第五子電極332 ’以在基板21〇之第二表面214上 形成工腳位δ又计，提尚保護元件組裝於電路板（未顯示 之擺放方向正確度。 201110179 RD-101-TW 31905twf.doc/nRD-101 - TW 31905 twf, doc / n 9 0.684 4.35 0.157 OK 10 0.684 3.56 0.192 NG Figure 4 is a cross-sectional view showing a protective element of another embodiment of the present invention. Please refer to the figure '4'. In this embodiment, the protection component 2〇〇c· of FIG. 4 is similar to the protection component 200b of FIG. 3A to FIG. 3C, but the main difference is that the protection component 200c of FIG. 4 includes A first solder layer 282 is disposed on the extension portion 222a and a second solder layer 284 is disposed on the third sub-electrode 226 and the fourth sub-electrode 228. In detail, the portion of the first solder layer 282 is disposed between the metal block 270 and the first extension portion 222a. A portion of the second solder layer 284 is disposed between the metal block 270 and the third sub-electrode 226 and between the metal block 27A and the fourth sub-electrode 228. In particular, in this embodiment, the solid phase point of the metal block 27〇 is greater than the soldering temperature of the second solder layer 284, and the soldering temperature of the second solder layer 284 is greater than the assembled protective component 200c on a circuit board (not shown). The upper temperature (ie, the assembly temperature) is furthermore, the solid phase point of the metal block 27〇 is greater than the soldering temperature of the second solder layer 284, and the soldering temperature of the second solder layer 284 is greater than the soldering temperature of the first solder layer 282. The liquidus point of the metal block 27A is also greater than the temperature at which the protective element 2c is assembled on the circuit board (not shown) (i.e., the assembly temperature). In the present embodiment, the melting point of the first solder layer 282 is lower than the melting point of the second = layer 284. In this way, when the heating element 25 〇 heats the first solder layer 282, it is first melted with the metal block above it, and the melting point of the metal block 270 is lowered, thereby reducing the melting of the metal block 27 进一步 further. The solder layer 282 (10) point is smaller than the resistance of the chip protection 201110179 RD-101-TW 31905twf.doc/n when the temperature of the device 200C is on the circuit board (not shown), the first solder layer is added to the upper part of the specification when it is assembled. The metal block 27() is melted, thereby lowering the melting point of the metal block 270, and further reducing the time for the metal block 27 to melt. In addition, the third and third sub-electrodes 26 and the fourth sub-electrode 2 are coated with the second solder layer 284 having a higher melting point, so that the second solder can be prevented when the protective component 200a is assembled on the circuit board (not shown). Layer 284 melts to create a displacement of metal block 270 and does not affect the resistance after assembly. In addition, in order to further ensure that the metal block 270 can be effectively blown, the ratio of the volume of the metal block 270 to the area of the solder layer (ie, the area of the first solder layer 282 plus the area of the second solder layer 284) may also be less than 0.16. The range can improve the reliability of the effective melting of the metal block 270. In other words, the design of the protection element 200c of the present embodiment has better reliability. Figure 5A is a top plan view of a protective element in accordance with another embodiment of the present invention. Figure 5B is a schematic bottom view of the protective element of Figure 5A. FIG. 5C is a cross-sectional view of the protection element of FIG. 5A along the line πΐ-ΙΙΓ. Referring to FIG. 5A, FIG. 5B and FIG. 5C simultaneously, in the present embodiment, the protection element 200d of FIG. 5A to FIG. 5C is similar to the protection element 200a of FIG. 2A to FIG. 2C, but the main difference is that: FIG. 5A The heating element 250, the second extending portion 322b, and the third extending portion 324a of the protective element 200d of FIG. 5c are disposed on the first surface 212 of the substrate 210. In detail, in the present embodiment, the first sub-electrode 322 of the upper electrode 320 further has a second extension portion 322b, and the second sub-electrode 324 has a third extension portion 324a. The second extension portion 322b and the third extension portion 324a are disposed between the third sub-electrode 326 and the fourth sub-electrode 328, and the heating element 250 201110179 RD-101-TW 31905twf.doc/n is located on the first surface 212 of the substrate 210 $ And connecting the second extension 32 to the third extension 324a. The insulating layer 285 is disposed between the first extension portion and the second extension portion 322b and the third extension portion 324a, and the first extension portion 322 is located on the two surfaces of the heel layer, and the second extension portion And the third extension portion 324a is located on another opposite surface of the insulating layer 285. In particular, the orthographic projections of the first extension portion 322a, the second extension portion 322b, and the third extension portion 324a on the insulating layer 285 do not overlap each other. In addition, the flux 260 is disposed on the insulating layer 28f and between the first extending portion 322a and the third sub-electrode 326, and between the first extending portion 322a and the fourth sub-electrode 328. The metal block 27A covers a portion of the third sub-electrode 326, the co-solvent 260, the first extension 3 and the fourth sub-electrode 228 such that the flux 260 is located between the metal layer 27A and the insulating layer 285. In this way, when the heating element 250 is heated, the heat permeable insulating layer 2 is magically transmitted to the refining agent fine and the metal block 270 to smelt the metal block - at this time, the bribe 2H directly contacting the metal block 27G can help Melt in the metal block 27〇. It should be noted that in the present embodiment, the electrode 330 of the protection element 2 〇〇d has a configuration corresponding to the first sub-electrode 322, the second sub-electrode 324, the third sub-electrode 326 卩, and the fourth sub-electrode 328. A fifth sub-electrode 332, a sixth sub-electrode 334, a seventh sub-electrode 336 and an eighth sub-electrode 338. However, in another embodiment, the lower electrode MO may also have no fifth sub-electrode 332 ′ according to design requirements to form a working pin δ on the second surface 214 of the substrate 21 , and the protective component is assembled in the circuit. Board (not shown in the correct orientation. 201110179 RD-101-TW 31905twf.doc/n
圖6為本發明之另一實施例之一種保護元件的剖面示 意圖。請參考圖6 ’在本實施例中’圖6之保護元件200e 與圖3A〜圖3C之保護元件200b相似，惟二者主要差異 之處在於：圖-6-之保護元件200e包-括一殼體· 290。詳細而 言’殼體290配置於基板210的第一表面212上，且覆蓋 金屬塊270,用以保護金屬塊270,且可避免熔融態的金 屬、助溶劑260以及焊料層280流漏出來而發生電路干擾 等問題。此外，殼體290的材質包括氧化鋁、聚二醚酮 (PEEK)、尼龍(nylon)、熱塑性樹脂、紫外光硬化樹脂或 酚甲醛樹脂等材料。 值得一提的是，上述之實施例僅為舉例說明，於其他 未’曰、示的Λ施中，本領域的技術人員當可參照前述實施例 的說月依據a際需求而選用前述構件或加以組合，以達 到所需的技術效果。 紅上所述，本發明至少具有下列功效： 極與㈣祕”肢錄上電極的子電 間。因Γί 劑是配置於金屬塊與加熱元件之 之下 w加熱70件加熱時’溶融的助溶劑可在金屬塊 下，而有效地幫助金屬塊熔融。 熱上電極具有突㈣，因此當加 吸附面積，“溶融態之金屬的流動空間與 生短路問題。的金屬導通延伸部與子電極而產 .本發明之賴轉㈣—延伸部的寬度與基板之 17 201110179Figure 6 is a cross-sectional view of a protective element in accordance with another embodiment of the present invention. Please refer to FIG. 6 'in the present embodiment, the protection element 200e of FIG. 6 is similar to the protection element 200b of FIG. 3A to FIG. 3C, but the main difference between the two is that the protection element 200e of FIG. 6- includes one Housing · 290. In detail, the housing 290 is disposed on the first surface 212 of the substrate 210 and covers the metal block 270 for protecting the metal block 270, and can prevent the molten metal, the auxiliary solvent 260, and the solder layer 280 from leaking out. Problems such as circuit interference occur. Further, the material of the casing 290 includes materials such as alumina, polyether ether ketone (PEEK), nylon (nylon), thermoplastic resin, ultraviolet curable resin or phenol formaldehyde resin. It should be noted that the foregoing embodiments are merely illustrative. In other implementations, those skilled in the art may refer to the foregoing embodiments to select the foregoing components or Combine to achieve the desired technical effect. In the red, the present invention has at least the following effects: The pole and the (4) secret are recorded on the electrode of the electrode. Because the Γ agent is disposed under the metal block and the heating element, when heating 70 pieces of heat, 'melting assistance The solvent can be used under the metal block to effectively help the metal block to melt. The hot upper electrode has a protrusion (4), so when the adsorption area is added, the flow space of the metal in the molten state is a problem with the short circuit. The metal conduction extension and the sub-electrode are produced. The width of the extension of the invention (four) - the width of the extension and the substrate 17 201110179
Ku-iui-i W 31905twf.doc/n 寬度的比值小於〇.8，因此當保護元件為了搭配小—尺寸之 電子產品而縮小其元件體積時，其亦能提供相應的電極面 積或彼此間的間距，可以確保金屬塊能迅速熔斷，具有較 佳的可靠度。？…- _、.，，. 4.本發明之保護元件的金屬塊的體積與焊料層的面 積之比值小於0.16，可確保金屬塊有效熔斷的可靠度。 β 5.本發明之保護元件的金屬塊之的固相點大於第二 焊料層的熔接溫度，且第二焊料層的熔接溫度大於組裝保 濩兀件於電路板上時的溫度（即組裝溫度因此可以避 免組裝保護元件時產生金屬塊移位的情形，且組裝後亦不 影響阻值。 6·本發明之保護元件的金屬塊的固相點大於第二焊 料層的溶接溫度，且第二焊料層的炫接溫度大於第一悍料 層的溶接咖度。因此，當力口熱元件加熱時，第一焊料層會 先與其上方的金屬塊溶融接合，進而降低金屬塊的炫點， 可減少金屬塊熔斷的時間。 雖然本發明已以實施例揭露如上，然其並非用以限定 f發明’任何所屬技術領域巾具有財知識者，在不脫離 t發明之精神和範_，當可作些許之魏錢飾，故本 X明之保護範圍當視後附之中請專利範圍所界定者為準。 【圖式簡單說明】 圖1緣示習知的—種防護元件的剖面示意圖。 圖2A為本發明之一實施例之一種保護元件的俯視示 201110179 RD-101-TW 31905twf.doc/n 意圖。 圖2B繪示為圖2A之保護元件的仰視示意圖。 圖2 C繪示為圖2 A之保護元件沿線I - Γ的剖面示意圖。 -圖為本發谓之另一實施例之一種保護元件的俯視--示意圖。 圖3B繪示為圖3A之保護元件的仰視示意圖。 圖3C繪示為圖3A之保護元件沿線ΙΙ-ΙΓ的剖面示意 圖。 圖4為本發明之另一實施例之一種保護元件的剖面示 意圖。 圖5A為本發明之另一實施例之一種保護元件的俯視 示意圖。 圖5B繪示為圖5A之保護元件的仰視示意圖。 圖5C繪示為圖5A之保護元件沿線ΙΙΙ-ΙΙΓ的剖面示意 圖。 圖6為本發明之另一實施例之一種保護元件的剖面示 意圖。 【主要元件符號說明】 100 :溫度保險絲封裝體 110 :基板 120 :加熱器 130 :絕緣層 140 :金屬層 19 201110179 RD-101-TW 31905twf.doc/n 150 :助焊劑 160 :電極層 200a〜200e :保護元件 '210:基板… 〜 212 :第一表面 214 :第二表面 220、320 :上電極 222、322 :第一子電極 222a、322a :第一延伸部 224、324 :第二子電極 226、326 :第三子電極 226a、326a :第一突出部 228、328 :第四子電極 228a、328a :第二突出部 230、330 :下電極 232、332 :第五子電極 232a、322b :第二延伸部 234、334 :第六子電極 234a、324a :第三延伸部 236、336 :第七子電極 238、338 :第八子電極 240 :端電極 250 :加熱元件 260 :助溶劑 201110179 RD-101-TW 31905twf.doc/n 270 :金屬塊 280 :焊料層 282 :第一焊料層 -284 :嘌二焊料層· 285 :絕緣層 290 :殼體 D .間距 m、H2 :最大高度 R1 :第一凹槽 R2 :第二凹槽The ratio of the width of Ku-iui-i W 31905twf.doc/n is less than 〇.8, so when the protective component is reduced in size to match the small-sized electronic product, it can also provide the corresponding electrode area or between each other. The spacing ensures that the metal block can be quickly blown for better reliability. ? ...- _,.,,. 4. The ratio of the volume of the metal block of the protective element of the present invention to the area of the solder layer is less than 0.16, which ensures the reliability of the effective melting of the metal block. β 5. The solid phase point of the metal block of the protective element of the present invention is greater than the soldering temperature of the second solder layer, and the soldering temperature of the second solder layer is greater than the temperature of the assembled soldering member on the circuit board (ie, the assembly temperature) Therefore, it is possible to avoid the situation in which the metal block is displaced when the protective element is assembled, and the resistance is not affected after the assembly. 6. The solid phase point of the metal block of the protective element of the present invention is greater than the soldering temperature of the second solder layer, and the second The soldering temperature of the solder layer is greater than the melting temperature of the first layer. Therefore, when the heat element is heated, the first solder layer is first melted and joined with the metal block above it, thereby reducing the dazzling point of the metal block. The time for the metal block to be blown is reduced. Although the present invention has been disclosed above by way of example, it is not intended to limit the invention of any of the technical fields of the invention, without departing from the spirit and scope of the invention. The Wei Wei decoration, the scope of protection of this X Ming is subject to the scope defined by the scope of patents. [Simplified illustration of the diagram] Figure 1 shows a schematic cross-section of a protective element Figure 2A is a top plan view of a protective element of the embodiment of the present invention, 201110179 RD-101-TW 31905 twf.doc/n. Figure 2B is a bottom view of the protective element of Figure 2A. Figure 2C is shown as 2 is a schematic cross-sectional view of a protective element of another embodiment of the present invention. FIG. 3B is a bottom view of the protective element of FIG. 3A. 3C is a cross-sectional view of the protective element of FIG. 3A along the line ΙΓ-ΙΓ. FIG. 4 is a cross-sectional view of a protective element according to another embodiment of the present invention. FIG. 5A is a protective element of another embodiment of the present invention. Figure 5B is a bottom view of the protective element of Figure 5A. Figure 5C is a cross-sectional view of the protective element of Figure 5A along the line ΙΙΓ-ΙΙΓ. Figure 6 is a protective element of another embodiment of the present invention. Schematic diagram of the cross section. [Main component symbol description] 100: Thermal fuse package 110: Substrate 120: Heater 130: Insulation layer 140: Metal layer 19 201110179 RD-101-TW 31905twf.doc/n 150: Flux 160: Electrode layer 200a~200e: protection element '210: substrate...~212: first surface 214: second surface 220, 320: upper electrode 222, 322: first sub-electrode 222a, 322a: first extension 224, 324: second Sub-electrodes 226, 326: third sub-electrodes 226a, 326a: first protrusions 228, 328: fourth sub-electrodes 228a, 328a: second protrusions 230, 330: lower electrodes 232, 332: fifth sub-electrodes 232a, 322b: second extensions 234, 334: sixth sub-electrodes 234a, 324a: third extensions 236, 336: seventh sub-electrodes 238, 338: eighth sub-electrode 240: terminal electrode 250: heating element 260: co-solvent 201110179 RD-101-TW 31905twf.doc/n 270: metal block 280: solder layer 282: first solder layer - 284: second solder layer · 285: insulating layer 290: case D. pitch m, H2: maximum height R1: first groove R2: second groove