201110178 RD-092-TW 31739twf.doc/n 六、發明說明： 【發明所屬之技術領域】 一種應用於電子裝置中的保護元 種可防止過電流及過電壓的保護元 本發明是有關於 件’且特別是有關於— 件與其製作方法。 【先前技術】 —L年，一資汛科技突飛猛進，舉凡手機、電腦及個人 仃助理等貧訊產品隨處可見，藉由它們的幫助，提供了 生'舌上食、衣、住、行、育、樂各方面的需求，也 ，人們職訊產品之依賴性與日俱增。然而，近來時常有 $於手機等可攜式電子產^的電池在充放電的過程中爆炸 耳y，因此’業界開始加強電池在充放電的過程中的保201110178 RD-092-TW 31739twf.doc/n VI. Description of the Invention: [Technical Field of the Invention] A protection element applied to an electronic device can prevent overcurrent and overvoltage protection. The present invention relates to a component' And especially about the pieces and how to make them. [Prior technology] - In the L-year, the technology of sci-fi technology has advanced by leaps and bounds, and all the poor news products such as mobile phones, computers and personal assistants are everywhere. With their help, they provide the raw food, clothing, housing, transportation and education. The needs of all aspects of music, as well as the dependence of people's service products are increasing. However, in recent years, batteries such as mobile phones and other portable electronic products have exploded in the process of charging and discharging, so the industry began to strengthen the battery in the process of charging and discharging.
«曰施，以防止電池在充放電的過程中因過電壓 而爆炸。 一 ^ L 習知技術提出的保護元件的保護方式是使保護元件中 的低炫點金屬片與電池的電路串聯，且使賴元件中的低 =點金屬片與加熱元件電性連接至場效電晶體(fet)與積 -電路(1C)等所組成之控制單元。如此—來，當積體電路 (1C)量測到的電壓超過預設電壓值時會驅動場效電晶體 (=T)，使電流通過保護元件中的加熱元件而發熱以炫斷低 溶點金屬>1，義使電池的電路呈斷路的狀㈣達到過電 ，保護。此外，當通過娜點金屬片的電流大於預設電流 辄圍時’大量的電流雜麟點金屬片，會使健點金屬 201110178 RD-092-TW 31739twf.doc/n 片發熱而熔斷，進而使電池的電路呈斷路的狀態而達 電流保護。 圖1A繪示習知的一種防護元件的剖面示意圖，圖^ 繪示習知的另一種防護元件的剖面示意圖。請參照圖ia， 美國專利第5,712,610號揭露之習知的保護元件1〇〇a具有 一基板110、一加熱元件12〇、一絕緣層13〇、一低熔^金 屬片140以及一内封止層150,加熱元件12〇配置於基板 110上，絕緣層13G覆蓋加熱元件12〇。鱗點金屬片_ 配置於絕緣層130上，且内封止層15()覆蓋低賴金屬片 140。如此一來’加熱元件12〇發熱可直接熔融低熔點金 片140,以使低熔點金屬片14〇熔融而向加熱元件丨加 側的電極層160流動。然而由於絕緣層130的表面近乎平 坦，電極層160之相對於基板11〇的最大高度H1與絕緣 層13〇之相對於基板11〇的最大高度m差異不大，且熔 融的低溶點金屬片14()依然具有—定的黏度，因此 的=熔點金屬片14G不易流動且無有效容納空間，以致於 加…兀件120無法有效熔斷低熔點金屬片14〇。 、 八屬層的㈣高度差不大，導致溶融 主屬片不易•動且無有效容納空間的 =㈣號揭露具有懸空區域s_4元件⑽ 圖 低溶點金屬#⑷與絕緣層131之間藉由中間雷 極162 ^位置設置，使低溶點金屬片141和絕緣層131有 H’且懸空高度11和低熔點金屬片14;的截面 積的比值需切5W，當紐元件尺寸要= 201110178 RD-092-TW 31739twf.doc/n 而耐電流要求不變時’隨著低熔點金屬片M1的截面積增 加’需相對應增加懸空高度Η的設計。換句話說，即需提 高中間電極162或電極層161、163的高度，造成保護元件 高度無法同時縮小及製造成本增加。 此外，低溶點金屬片上的内封止層在生產過程中，是 先以點狀助焊膠形成於低熔點金屬片上方中央處，待保護 兀件經由回焊(reflow)製程焊接於電路板的同時，因内封止 層的熔點較低而熔融流動覆蓋低熔點金屬片，防止低熔點 金屬片表面氧化’因此若點狀助料於金屬層上方塗佈位 或回焊時之流動覆蓋不完全，將影響低^^ 金屬片之有效熔斷穩定性。 【發明内容】 歷。本發明提供-種賴元件，可纽魏流與過電 φ 本發明提供一種線路基板的製作方法，可將 埋於，與基板之間，確保金屬㈣；= 本發，-種保護元件，包含—基板斷= 配二ίΓ Γ第一助焊劑以及一金屬月。第-電極 ;土板上。第一電極配置於基 ° 於基板上並位於第一電極與第二電極之門弟入=痒劑配置 :續第二電極，其中第—助焊劑與位於:二第 在本發明之-實施例令，基板具有一中心部以及環繞 201110178 RD-092-TW 31739twf.doc/n 宁心部的一第一 及一第四周邊部’第—周邊部^對;4二，周邊部以 邊部相對第四周邊部，第一電極盘第：:^邊部，第三周 周邊=周之邊，.且第-助焊心;=第一 三周邊邻卜'第二電極配置於基板的第 層配，於基板上且連接於第三電極與第四電極之間。“、 在本發明之—實施例中，第三馳的—第 伸至發熱層上方並位於第一二 助焊劑位於第-延伸部的周^： 電極之間’且第— a ί本發明之—實施例中，第三電極更具有-第二延伸 口 ί5 ’第四電才虽具有-第三延伸冑，第二延伸部與第三延伸 部延伸至中心部上並位於第一電極與第二電極之間，且發 熱層配置於中心部上並連接於第二延伸部盥第三延伸部之 間。 在本發明之一實施例中’發熱層位於基板與金屬片之 間0 在本發明之一實施例中，保護元件更包含一絕緣層， 其覆蓋發熱層，並位於發熱層與第一延伸部之間，以及位 於發熱層與第一助焊劑之間。 在本發明之一實施例中，基板位於發熱層與金屬片之 間。 在本發明之一實施例中，基板具有相對的一第一表面 201110178 RD-092-TW 3 3 739twf.doc/n«Environmental protection to prevent the battery from exploding due to overvoltage during charging and discharging. The protection element proposed by the prior art is protected by connecting the low-spot metal piece in the protection element in series with the circuit of the battery, and electrically connecting the low-point metal piece and the heating element in the element to the field effect. A control unit composed of a transistor (fet) and a product-circuit (1C). In this way, when the voltage measured by the integrated circuit (1C) exceeds the preset voltage value, the field effect transistor (=T) is driven to cause the current to pass through the heating element in the protection element to generate heat to smear the low melting point. Metal >1, the circuit of the battery is in the form of an open circuit (4) to achieve over-current and protection. In addition, when the current passing through the nano-point metal piece is greater than the preset current range, a large amount of current mixed with the metal piece will cause the point metal 201110178 RD-092-TW 31739twf.doc/n piece to heat up and fuse, thereby making The circuit of the battery is in an open state and is protected by current. FIG. 1A is a schematic cross-sectional view showing a conventional protective element, and FIG. 1 is a cross-sectional view showing another conventional protective element. Referring to FIG. ia, a conventional protective element 1A disclosed in US Pat. No. 5,712,610 has a substrate 110, a heating element 12A, an insulating layer 13A, a low-melting metal sheet 140, and an inner seal. The layer 150, the heating element 12 is disposed on the substrate 110, and the insulating layer 13G covers the heating element 12A. The scale metal piece _ is disposed on the insulating layer 130, and the inner sealing layer 15 () covers the low-lying metal piece 140. As a result, the heating element 12 generates heat to directly melt the low-melting-point metal piece 140, so that the low-melting-point metal piece 14 is melted and flows to the electrode layer 160 on the heating element side. However, since the surface of the insulating layer 130 is nearly flat, the maximum height H1 of the electrode layer 160 relative to the substrate 11〇 and the maximum height m of the insulating layer 13〇 relative to the substrate 11〇 are not large, and the molten low-melting point metal piece 14() still has a constant viscosity, so the =melting metal sheet 14G is not easy to flow and has no effective accommodation space, so that the joining member 120 cannot effectively melt the low melting point metal sheet 14〇. The height difference of the eight layers is not large, which results in the melting of the main piece is not easy to move and there is no effective accommodation space = (4) revealing the suspended area s_4 element (10) between the low melting point metal # (4) and the insulating layer 131 The middle lightning pole 162 ^ position is set so that the low melting point metal piece 141 and the insulating layer 131 have H' and the flying height 11 and the low melting point metal piece 14; the ratio of the cross-sectional area needs to be cut 5W, and the size of the element is required to be = 201110178 RD -092-TW 31739twf.doc/n When the current resistance requirement is constant, 'as the cross-sectional area of the low-melting-point metal sheet M1 increases', the design of the suspended height Η should be increased accordingly. In other words, it is necessary to increase the height of the intermediate electrode 162 or the electrode layers 161, 163, so that the height of the protective element cannot be simultaneously reduced and the manufacturing cost is increased. In addition, in the production process, the inner sealing layer on the low-melting-point metal sheet is first formed in the center of the low-melting-point metal sheet with a dot-like flux, and the element to be protected is soldered to the board through a reflow process. At the same time, because the melting point of the inner sealing layer is low, the molten flow covers the low-melting metal sheet to prevent oxidation of the surface of the low-melting metal sheet. Therefore, if the spotted material is coated on the metal layer or reflowed, the flow coverage is not Completely, it will affect the effective fusing stability of low ^^ metal sheets. SUMMARY OF THE INVENTION The present invention provides a method for fabricating a material, a Neuville flow and an overvoltage φ. The present invention provides a method for fabricating a circuit substrate, which can be buried between the substrate and the substrate to ensure metal (4); = the present invention, a protective element, - Substrate break = with a second Γ Γ first flux and a metal month. First electrode; soil plate. The first electrode is disposed on the substrate and located at the first electrode and the second electrode; the itch setting: the second electrode, wherein the first flux is located at: the second embodiment of the present invention The substrate has a central portion and a first and a fourth peripheral portion of the ninth and fourth peripheral portions of the 201110178 RD-092-TW 31739 twf.doc/n, and a peripheral portion, a pair of peripheral portions, a side portion opposite to the first portion Four peripheral portions, the first electrode disk:: ^ edge portion, the third week periphery = the side of the circumference, and the first - the bonding core; = the first three peripheral neighbors - the second electrode is disposed on the first layer of the substrate On the substrate and connected between the third electrode and the fourth electrode. "In the embodiment of the present invention, the third is extended to the upper portion of the heat generating layer and is located between the first and second fluxes between the electrodes of the first extension portion" and the first invention is In the embodiment, the third electrode further has a second extension port ί5. The fourth extension has a third extension 胄. The second extension portion and the third extension portion extend to the central portion and are located at the first electrode and the third electrode. Between the two electrodes, and the heat generating layer is disposed on the central portion and connected between the second extending portion and the third extending portion. In one embodiment of the present invention, the 'heat generating layer is located between the substrate and the metal sheet. In one embodiment, the protective element further includes an insulating layer covering the heat generating layer between the heat generating layer and the first extending portion and between the heat generating layer and the first flux. The substrate is located between the heat generating layer and the metal sheet. In one embodiment of the invention, the substrate has a first surface 201110178 RD-092-TW 3 3 739twf.doc/n
Si表於第-表面與第 分第四電極位於第二表^表面延伸至第二表面，至少部 -在本發明之一實施 劍與第-電極、第一延”及=的截面積和第-助焊 值小於13。 σ卩及第一電極的總接觸面積的比 其配=之:第實蒦元件更包含-焊料層， 極之:以及配置於金屬片與第一延=屬片與弟-電 劑。在本發明之—實施例中，金屬片㈣有—第二助焊 本發明提出-種保護 先，提供-基板。㈣η 衣作方去如下所述。f 一第：雷似镇考’形成一第一電極、一第二電極、 於純Γ:電^^上。然後，形成-發熱層 第-助焊劑於極與第四電極。之後’形成- 屬片金屬片連接第—電：】極：間。接著，提供-金 助焊劑。 電極與第二電極，及覆蓋部份第一 在本發明之—竇 成一第一## 彳中，形成第三電極的方法包含形 f電極與第二電極之間。 形成-焊二實護元件的製綱^ 與金屬片之間。極與金屬片之間，以及於第二電極 在本發明之一實施例中，形成第—助焊劑的方法更包 201110178 RD-092-TW 3l739twfd〇c/n 助焊劑形成在第—電極與第二電極之間時，將 弟助烊劑形成在焊料層上。 从2發明之—實施例中，當焊料層的材質包含一焊料 ^爲 ' 助焊材料時’形成第一助焊劑的方'法包含加熱焊 ”、曰Τ使助焊材料軟化而流到第—f極與第二電極之間。 基於上述，由於本發明的保護元件内埋有助焊劑，且 1焊劑是位於金屬層與發熱層m當發熱層發熱 日^" ’炫融的助焊劑可有效地幫助金屬舰融。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 牛貫施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖2A繪不本發明一實施例之保護元件的俯視圖，圖 繪不圖2A之保護元件的仰視圖，圖會示圖从之保 ^元件沿1-1’線段的剖面圖’圖2D纷示圖2a之保護元件 :II-II '線段的剖面圖。圖3緣示圖2A中的金屬片的一種 ’史化結構的剖面圖。 印同時參照圖2A、圖2B、圖2C與圖2D，本實施例 之保濩元件200包括一基板21〇、一第一電極22〇、一第二 電極230、一第三電極24〇、—第四電極25〇、一發熱層26〇、 助焊劑270以及—金屬片28〇。第一電極22〇、第二電極 23〇、第三電極240與第四電極25〇皆分別配置於基板21〇 上0The Si surface extends from the first surface and the fourth electrode to the second surface to the second surface, at least in part - in one embodiment of the invention, the cross-sectional area of the sword and the first electrode, the first extension and the = - the flux value is less than 13. The ratio of the total contact area of σ卩 and the first electrode is: the actual element includes a solder layer, a pole: and is disposed on the metal piece and the first extension In the embodiment of the present invention, the metal piece (4) has a second fluxing. The present invention proposes a kind of protection first, providing a substrate. (4) η clothing is as follows: f one: lightning The town test 'forms a first electrode, a second electrode, and a pure electrode: an electric ^^. Then, a heat-generating layer-flux is formed on the pole and the fourth electrode. After that, the formation - the metal piece connection -Electrical:]Positive: between. Next, providing - gold flux. Electrode and second electrode, and covering portion first in the present invention - Dou Chengyi first ## ,, the method of forming the third electrode comprises a shape Between the f electrode and the second electrode. Forming the structure of the two soldering elements and the metal sheet. Between the pole and the metal sheet, In the second electrode, in one embodiment of the present invention, the method of forming the first flux further includes 201110178 RD-092-TW 3l739twfd〇c/n flux formed between the first electrode and the second electrode. The auxiliary agent is formed on the solder layer. From the invention of the invention, in the embodiment, when the material of the solder layer comprises a solder as a 'welding material', the method of forming the first flux includes heat welding, 曰Τ The flux material is softened and flows between the first f-pole and the second electrode. Based on the above, since the flux is embedded in the protective element of the present invention, and the flux is located on the metal layer and the heat generating layer m, the heat generating layer is heated. The flux can effectively help the metal ship melt. In order to make the above features and advantages of the present invention more comprehensible, the following detailed description is given in conjunction with the accompanying drawings. 2A is a top view of a protective element according to an embodiment of the present invention, and is not a bottom view of the protective element of FIG. 2A, and a cross-sectional view of the component along the line 1-1'. Figure 2D shows a cross-sectional view of the protective element of Figure 2a: II-II' line segment. Figure 3 is a cross-sectional view showing a 'historical structure' of the metal piece of Figure 2A. Referring to FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D, the protection element 200 of the present embodiment includes a substrate 21, a first electrode 22, a second electrode 230, and a third electrode 24, - The fourth electrode 25A, a heat generating layer 26, a flux 270, and a metal piece 28 are. The first electrode 22, the second electrode 23, the third electrode 240, and the fourth electrode 25 are respectively disposed on the substrate 21A.
詳細而言，在本實施例中，基板210具有一中心部C 201110178 RD-092-TW 31739twf,d〇c/n 以及環繞中心部c的一第一周邊部212、一第二 214、一第三周邊部216以及一第四周邊部，苴中第一 周—邊部】12相對於第二周邊部214，第三周邊部216相對 弟四周，部218。第―修22Ό.、第二電極23。、第三電極 24〇與弟四電極25〇可分別位於第一周邊部加、第二周邊 部214、第二周邊部加以及第四周邊部叫上。基板训 可具有相對的-第—表面S1與一第二表面s2，且第一電 極220帛一電極23〇、第三電極24〇與第四電極皆可 由第-表面S1延伸至第二表面S2。然並不以此為限，各 電，也可依只際料需求而決定有無或位於第—表面Μ 或第二表面S2上，於另—實施例中，第四電極25〇也可 僅位於第二表面S2上。 此外，在本實施例中，第三電極24()的—第一延伸部 242與一第二延伸部244分別酉己置於第一表面31與第二表 面S2上，並分別延伸至中心部c上。在本實施例中， -延伸部242與第二延伸部244分別位於二實質上相互平 行但不重疊的平面上。第四電極25〇的一第三延伸部攻 配置於第二表面S2上，並延伸至中心部c上。第一、第 二與第三延伸部242、244、252可分別位於第一電極22〇 與第二電極230之間。 基板210的材質包括陶£ (例如氧化紹）、玻璃環氧 樹脂、二氧化錯（Zr02)、氮化石夕（Si3N4)、氮化銘（ain)、 氮化硼（BN)或是其他無機材料。第一電極22〇、第二带 極230、第三電極240與第四電極25〇的材質例如為^ 201110178 κυ-vyz-1W 31739twf.doc/n 銅、金、鎳、銀鉑合金與鎳合金等導電性質良好的材料。 發熱層260配置於第二表面S2上並連接於第二延伸 部244與第三延伸部252之間，其中第三電極24〇的第一 ‘ ' ·延伸部242是位於發熱層260上方（如圖2C.所示）。發 熱層260的材質包括二氧化釕（Ru〇2)、碳黑（可推雜^ 水玻璃等無機系黏著劑中或是熱硬化樹脂等有機系黏著劑 中）、銅、鈦、鎳鉻合金與鎳銅合金。此外，為保護發熱 層260不受後製程及外界濕氣、酸鹼環境影響，可在發熱 層260上覆盍一絕緣層29〇，其材質包括玻璃膠或環氧樹 脂（epoxy resin )。 ^助焊劑270配置於基板210的第一表面81上並位於 第一延伸部242的周邊。詳細而言，在本實施例中，助焊 劑270是位於第一電極22〇、第二電極23〇與第一延伸部 242之間。具體而言’助焊劑27〇是填充於由第一電極22〇、 第一延伸部242以及基板2H)所構成的一第一凹槽R1中， 以及填充於由第二電極230、第一延伸部242以及基板21〇 所構成的一第二凹槽R2中。助焊劑27〇的材質包括樹脂 或松脂等。 金屬片280配置於第一電極22〇、第一延伸部242與 第一％*極230上’且覆蓋部份的助焊劑270，其中助焊劑 270與第一延伸部242皆位於發熱層26〇與金屬月28〇之 間，且助焊劑270的熔點低於金屬片28〇的熔點。如此一 來’當控制單元(未顯示)偵測到過電壓狀態’驅動發熱層 260發熱溶斷金屬片28〇時，由於助焊劑27〇被金屬片280 201110178 RD-092-TW 31739twf.d〇c/n 覆蓋且被第一電極220、第二電極230與第一延伸部242 圍繞，故助焊劑27〇可有效地幫助其上方的金屬片28〇熔 斷，使保護元件達到過電壓保護目地。換言之，由於本實 施例的助焊劑270是内埋在保護元件2〇〇.之中，可避兔金 屬片280受熱熔融開始流動之表面產生氧化薄膜，進而有 助於金屬片280熔斷。此外助焊劑27〇也可提供熔融金屬 片280和各電極間有較佳的潤溼性，且可增加熔融的金屬 片280本身的内聚力，使熔融金屬片28〇可流動且聚集於 各電極上，進而達到有效溶斷。 金屬片280的材質包括錫錯合金、錫銀錯合金、錫銦 絲合金、錫銻合纟、錫銀銅合金等低溶點合金。此外， 在其他實施例中，金屬片28〇a可内埋有—助焊劑F (如圖 3所示），以利於金屬片麟受熱而輯。需注意的是， 雖然本發明於此仙具有發熱層而可同時提供過電壓及過 電流保護之傾元件結構進行說明，然而本發明所屬技術 ^域中具有通常知識者當知，本發明具㈣關27〇於金 ^ 了方幫=斷穩定性的特徵，亦可顧在沒有發 ^層之結射，幫助金屬片28G在過電流通過 時的熔斷穩定性。 峨 在本實施例中，由於助焊劑27〇可 因此需適當地調整金屬片⑽的戴面積和助焊劑27〇 與各電極的總接觸面積的比值， f。舉例來說’金屬片28。的戴面積和助 極的總接觸面積的比值可小於13。^坪二以川Μ各電 件尺寸縮小而耐電流要求不變時，保護元 T j依照金屬片280和助 201110178 RD-092-TW 31739twf.doc/n 焊劑270與各電極的總接觸面積比值進行調 2設計。進一步舉例說明’在本實施例中，金屬？= 的截面積為與流經金屬片之電流〇 (例如_所示域面)谱焊劑韻與 J是=助焊脚於第一咖和第二凹; 220、第—延伸部242和第二電極230接觸之表 面的總表面積(如圖2Α及圖2C所示）。 ，外’為了更進-步說明金屬片28〇可有效炫斷因 只施例提供數個實施範例說明具有不同寬度或厚度之 金屬片280的截面積和助焊劑27〇與各電極的總接觸面積 之間的關係。各實施範例中所使用發熱層26〇的發熱功率 為3.5W’並以是否熔斷結果及熔斷時間12〇秒為熔&與否 (〇Κ或NG)判定依據。實施範例10為未添加助 1In detail, in the embodiment, the substrate 210 has a central portion C 201110178 RD-092-TW 31739twf, d〇c/n and a first peripheral portion 212 surrounding the central portion c, a second 214, a first The three peripheral portions 216 and a fourth peripheral portion, the first circumference of the middle portion - the side portion 12 is opposite to the second peripheral portion 214, and the third peripheral portion 216 is opposite to the circumference of the portion 218. The first - repair 22 Ό., the second electrode 23. The third electrode 24 〇 and the fourth electrode 25 〇 are respectively located at the first peripheral portion, the second peripheral portion 214, the second peripheral portion, and the fourth peripheral portion. The substrate may have a first surface s1 and a second surface s2, and the first electrode 220 帛 an electrode 23 〇, the third electrode 24 〇 and the fourth electrode may extend from the first surface S1 to the second surface S2 . However, it is not limited thereto, and each electric power may be determined to be present or not on the first surface 或 or the second surface S2 according to the inter-material requirement. In another embodiment, the fourth electrode 25 〇 may also be located only. On the second surface S2. In addition, in the embodiment, the first extension portion 242 and the second extension portion 244 of the third electrode 24 are respectively disposed on the first surface 31 and the second surface S2 and extend to the center portion respectively. c. In the present embodiment, the extension portion 242 and the second extension portion 244 are respectively located on planes that are substantially parallel to each other but do not overlap. A third extension of the fourth electrode 25A is disposed on the second surface S2 and extends to the central portion c. The first, second and third extensions 242, 244, 252 may be located between the first electrode 22A and the second electrode 230, respectively. The material of the substrate 210 includes ceramics (for example, oxidized glass), glass epoxy resin, dioxins (Zr02), nitride (Si3N4), ain, boron nitride (BN) or other inorganic materials. . The material of the first electrode 22〇, the second strip 230, the third electrode 240, and the fourth electrode 25〇 is, for example, ^201110178 κυ-vyz-1W 31739twf.doc/n copper, gold, nickel, silver platinum alloy and nickel alloy A material with good electrical conductivity. The heat generating layer 260 is disposed on the second surface S2 and connected between the second extending portion 244 and the third extending portion 252, wherein the first ''extension portion 242 of the third electrode 24' is located above the heat generating layer 260 (eg Figure 2C.). The material of the heat generating layer 260 includes ruthenium dioxide (Ru〇2), carbon black (in an inorganic adhesive such as a water-repellent glass or an organic adhesive such as a thermosetting resin), copper, titanium, and nickel-chromium alloy. With nickel copper alloy. In addition, in order to protect the heat generating layer 260 from the post-process and the external moisture and acid-base environment, an insulating layer 29〇 may be coated on the heat generating layer 260, and the material thereof includes glass glue or epoxy resin. The flux 270 is disposed on the first surface 81 of the substrate 210 and located at the periphery of the first extension portion 242. In detail, in the present embodiment, the flux 270 is located between the first electrode 22, the second electrode 23, and the first extension 242. Specifically, the flux 14 is filled in a first recess R1 composed of the first electrode 22, the first extension 242, and the substrate 2H, and is filled in the first extension by the second electrode 230. The portion 242 and the substrate 21 are formed in a second recess R2. The material of the flux 27〇 includes resin or rosin. The metal piece 280 is disposed on the first electrode 22, the first extending portion 242 and the first %* pole 230 and covers a portion of the flux 270, wherein the flux 270 and the first extending portion 242 are both located in the heat generating layer 〇 Between the metal and the metal, the melting point of the flux 270 is lower than the melting point of the metal piece 28〇. As a result, when the control unit (not shown) detects an overvoltage condition, the heating layer 260 is heated to dissolve the metal piece 28〇, since the flux 27 is replaced by a metal piece 280 201110178 RD-092-TW 31739twf.d〇 The c/n is covered and surrounded by the first electrode 220 and the second electrode 230 and the first extension portion 242, so that the flux 27 〇 can effectively help the metal piece 28 其 above it to be blown, so that the protection element reaches the overvoltage protection purpose. In other words, since the flux 270 of the present embodiment is embedded in the protective member 2, the surface of the rabbit-resistant metal sheet 280 which is heated and melted to flow starts to generate an oxide film, which in turn helps the metal sheet 280 to be blown. In addition, the flux 27 can also provide the molten metal sheet 280 and the better wettability between the electrodes, and can increase the cohesive force of the molten metal sheet 280 itself, so that the molten metal sheet 28 can flow and gather on the electrodes. In order to achieve effective dissolution. The material of the metal piece 280 includes a low melting point alloy such as a tin-alloy, a tin-silver alloy, a tin-indium wire alloy, a tin-bismuth alloy, or a tin-silver-copper alloy. In addition, in other embodiments, the metal piece 28A may be embedded with a flux F (as shown in FIG. 3) to facilitate the heat of the metal piece. It should be noted that although the present invention is described herein as a tilting element structure having a heat generating layer and capable of simultaneously providing overvoltage and overcurrent protection, it is known to those having ordinary skill in the art to which the present invention pertains, and the present invention has (4) The characteristic of the 27 〇 〇 金 金 ^ = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = =峨 In the present embodiment, it is necessary to appropriately adjust the wearing area of the metal piece (10) and the ratio of the flux 27〇 to the total contact area of each electrode due to the flux 27, f. For example 'metal sheet 28'. The ratio of the wearing area to the total contact area of the booster may be less than 13. ^ Ping 2, when the size of each electric piece of Sichuan and Chongqing is reduced and the current resistance requirement is constant, the protection element T j is in accordance with the total contact area ratio of the metal piece 280 and the help 201110178 RD-092-TW 31739twf.doc/n flux 270 and each electrode. Make a 2 design. Further exemplification 'in this embodiment, metal? The cross-sectional area of = is the current flowing through the metal sheet (for example, the domain surface shown by _), and the flux is rhythm and J is = the soldering foot is in the first coffee and the second concave; 220, the first extension 242 and the second The total surface area of the surface to which the electrode 230 contacts (as shown in Figures 2A and 2C). For the purpose of further step-by-step description, the metal piece 28〇 can be effectively smashed. Several embodiments are provided to illustrate the cross-sectional area of the metal piece 280 having different widths or thicknesses and the total contact of the flux 27〇 with each electrode. The relationship between the areas. The heat generating power of the heat generating layer 26A used in each of the examples was 3.5 W' and was determined based on whether or not the melting result and the melting time of 12 seconds were the melting & or not (〇Κ or NG). Example 10 is not added 1
之測試範例。 J 表一h 實施 範例 標號 1 --金屬片 助焊劑與各電 極的總接觸面 積(mm2) --— · A/F 結果 判定 寬度 (mm) 厚度 (mm) 截面積 (mm2) W H A F 丄 ------ 120 1 Ππ 0.075 0.090 0.24 0.38 OK 3 A -Ul) 0 f\r\ 0.15 0.150 _____〇24 0.63 OK 4 c Z_U〇 0.075 0.150 0.24 0.63 〇 Qa OK 1.50 0.15 0.225 ——-- ___0124 5 —6 2T〇〇^ —— 0.15 0.300 0.24 1.25 OK OK 1.00 0.15 0.150 ----ί!飞 7 --------- 1.341 NG 2.28 0.15 0.342 -------, 8 0.24 1.43 NG 1.50 0.15 0.225 ——— 9 〇*ll 2.01 NG 10 — 0.15 0.300 0.11 2.68 一咱， NG χτη 1.00 0.15 0.150 0.00 —--1~-1---由表一可得知：當金屬片280的戴面積和助焊劑27〇 12 201110178 RD-092-TW 31739twf.doc/nTest example. J Table 1 h Example Example 1 - Total contact area of sheet metal flux with each electrode (mm2) --- · A/F Result judgment width (mm) Thickness (mm) Cross-sectional area (mm2) WHAF 丄-- ---- 120 1 Ππ 0.075 0.090 0.24 0.38 OK 3 A -Ul) 0 f\r\ 0.15 0.150 _____〇24 0.63 OK 4 c Z_U〇0.075 0.150 0.24 0.63 〇Qa OK 1.50 0.15 0.225 ——-- ___0124 5 —6 2T〇〇^ —— 0.15 0.300 0.24 1.25 OK OK 1.00 0.15 0.150 ---- ί! Fly 7 --------- 1.341 NG 2.28 0.15 0.342 -------, 8 0.24 1.43 NG 1.50 0.15 0.225 ——— 9 〇*ll 2.01 NG 10 — 0.15 0.300 0.11 2.68 One 咱, NG χτη 1.00 0.15 0.150 0.00 —--1~-1--- It can be known from Table 1: When the metal piece 280 Wearing area and flux 27〇12 201110178 RD-092-TW 31739twf.doc/n
與各電極的總接觸面積之比值小於1,3時，發熱功率35 瓦特的發熱層260可確實熔斷金屬片28〇，而沒有助焊劑 270的設計，無法有效熔斷金屬片28〇。另外，由於助焊& 270可提高熔融金屬片28〇,和電極間的潤溼性，並增加^ 融金屬片280的内聚力，因此當金屬片28〇熔斷時，會聚 集於第一電極22〇、第一延伸部Μ與第二電極23〇 可以確保熔融的金屬不會讓第一延伸部222a與第一電極 220或第二電極230產生短路現象。如此一來，可進—步 確保金屬；1 28G可有效地被麟’而達成有效防止過電^ 或過電流。簡言之，當金屬片280的截面積和助焊劑27〇 與各電極的總接觸面積之比值小於13,可提高金屬塊細 有效熔斷的可靠度。 此外，在本實施例中，可選擇性地在金屬片28〇盥第 一電極220之間、在金屬片28〇與第二電極23〇之間^及 在金屬片280與第一延伸部242之間配置一焊料層D，以 以將金屬# 280固定在第-電極220、第二電極2曰3〇以及 第-延伸部242上。谭料層D的材質包括錫錯合金、锡銀 合金、金、銀、錫、鉛，、銦、鎵、鈀、鎳、銅及1人 金等金屬材料，且焊料層D可更包含1〇〜15%的助焊劑口， 以減少縣焊料層D和金屬片表面之張力，而助^金 屬片280之擴張，以確保熔斷效果。然而於其他實施例中， 金屬片280與第一電極220、第二電極23〇及第一延伸部 242之間也可以超音波焊接等方式固定而沒有焊料層〇。 以下將詳細介紹保護元件2〇〇的製作方法。 201110178 ΚΟ-υν/- l'W 31739twf.doc/n 圖4A〜圖4C繪示本發明一實施例之保護元件的製程 俯視圖，圖5A〜圖5C繪示圖4A〜圖4C的製程的仰視圖。 值得注意的是，在圖4A〜圖4C與圖5A〜圖5C中的元件 名稱及標號與圖-2A〜圖2D中的元件名稱及標號相同者， 其材質相同，故於此不再贅述。 首先，請同時參照圖4A與圖5A，提供一基板21〇， 並在基板210上形成—第一電極22〇、一第二電極23〇、一 第三電極240、一第四電極25〇。基板21〇可具有相對的一 第一表面si與一第二表面S2，且第一電極22〇、第二電 極230、第三電極240與第四電極25〇可由第一表面S1延 伸至第二表面S2。 斤在本實施例中，第三電極240的一第一延伸部242與 一第;^延伸部244分別配置於第一表面S1與第二表面S2 上。第四電極250的一第三延伸冑252配置於第二表面S2 亡。第-、第二與第三延伸部242、244、252可分別位於 弟一電極220與第二電極230之間。 ，著’ 4參照圖5B ’例如以印刷、雜或壓合的方 二延伸部244與第三延伸部252之間形成一發熱層 '了層260電連接第二延伸部2料與第三延伸部252。 ，後，請參照圖5C ’在發熱層26〇上覆蓋一層絕緣 ^部⑽且絕緣層290還可覆蓋第二延伸部244與第三延 ，以保，發熱層不受後製程及外界濕氣、酸 :衫響。接著，可對第—電極220、第二電極230、第 二電極240與第四電極25〇進行一表面處理製程，以於第 201110178 RD-092-TW 31739twf doc/n 一電極220、第二電極230、第三電極240與第四電極25〇 上形成-抗氧化層（未繪示），其中表面處理製程例如化 錄金或電鐘製程等。When the ratio of the total contact area of each electrode is less than 1,3, the heat generating layer 260 having a heat generation power of 35 watts can surely melt the metal piece 28 without the design of the flux 270, and the metal piece 28 can not be effectively melted. In addition, since the soldering & 270 can improve the wettability of the molten metal piece 28, and the electrode, and increase the cohesive force of the molten metal piece 280, when the metal piece 28 is blown, it will gather on the first electrode 22 The first extension portion Μ and the second electrode 23〇 ensure that the molten metal does not cause the first extension portion 222a to short-circuit with the first electrode 220 or the second electrode 230. In this way, the metal can be further ensured; 1 28G can be effectively prevented by the forest to effectively prevent over-current or over-current. In short, when the cross-sectional area of the metal piece 280 and the ratio of the flux 27 〇 to the total contact area of each electrode are less than 13, the reliability of the fine effective fuse of the metal block can be improved. In addition, in the embodiment, the metal piece 28 〇盥 the first electrode 220, the metal piece 28 〇 and the second electrode 23 ^ and the metal piece 280 and the first extending portion 242 are selectively A solder layer D is disposed therebetween to fix the metal #280 to the first electrode 220, the second electrode 2曰3〇, and the first extension portion 242. The material of the tan layer D includes tin-alloy, tin-silver alloy, gold, silver, tin, lead, indium, gallium, palladium, nickel, copper and one-person gold, and the solder layer D may further include 1〇. ~15% of the flux port to reduce the tension of the solder layer D and the surface of the metal sheet, and help the metal sheet 280 to expand to ensure the effect of the fuse. However, in other embodiments, the metal piece 280 and the first electrode 220, the second electrode 23A, and the first extending portion 242 may be fixed by ultrasonic welding or the like without a solder layer. The manufacturing method of the protective element 2A will be described in detail below. 201110178 ΚΟ-υν/- l'W 31739twf.doc/n FIG. 4A to FIG. 4C are schematic views showing the process of the protective element according to an embodiment of the present invention, and FIGS. 5A to 5C are bottom views of the process of FIGS. 4A to 4C. . It is to be noted that the component names and reference numerals in FIGS. 4A to 4C and FIGS. 5A to 5C are the same as those of the component names and reference numerals in FIGS. 2A to 2D, and the materials are the same, and thus will not be described again. First, referring to FIG. 4A and FIG. 5A, a substrate 21A is provided, and a first electrode 22A, a second electrode 23A, a third electrode 240, and a fourth electrode 25A are formed on the substrate 210. The substrate 21A may have a first surface si and a second surface S2 opposite to each other, and the first electrode 22, the second electrode 230, the third electrode 240, and the fourth electrode 25 may extend from the first surface S1 to the second surface Surface S2. In this embodiment, a first extension portion 242 and a second extension portion 244 of the third electrode 240 are disposed on the first surface S1 and the second surface S2, respectively. A third extension 252 of the fourth electrode 250 is disposed on the second surface S2. The first, second and third extensions 242, 244, 252 may be located between the first electrode 220 and the second electrode 230, respectively. Referring to FIG. 5B, for example, a heat generating layer is formed between the second extension portion 244 of the printed, miscellaneous or press-fit and the third extension portion 252. The layer 260 electrically connects the second extension portion 2 and the third extension. Part 252. After that, please refer to FIG. 5C'. The heat generating layer 26 is covered with a layer of insulating portion (10) and the insulating layer 290 can also cover the second extending portion 244 and the third extending portion to ensure that the heat generating layer is free from the post process and the external moisture. Acid: The shirt is ringing. Then, a surface treatment process may be performed on the first electrode 220, the second electrode 230, the second electrode 240, and the fourth electrode 25A, for the first electrode 220 and the second electrode of the 201110178 RD-092-TW 31739 twf doc/n 230. The third electrode 240 and the fourth electrode 25 are formed with an anti-oxidation layer (not shown), wherein the surface treatment process is, for example, a gold or electric clock process.
一…之後，請參照圖· 4B，‘例如以塗佈的方式在第一電極 220、第二電極230以及第—延伸部242上形成一谭料層 D。然後，例如以塗佈的方式在第一電極22〇、第二電極 230以及第一延伸部242之間的基板21〇上形成一助焊劑 ，。在其他實施财，當谭料層D的材f包括一焊料合 金與-助焊材料時，例如含1()_15%，形成助桿劑27〇的方 法包括加熱烊料層D (例如12叱以上），以使助焊材料 軟化而流到第-電極22G、第二電極23G以及第— 撕之間的基板2!〇上，若助焊材料的量不足時，則可選 擇性地添加一第二助焊劑(未顯示）。 罢J後帝請同時參照圖4C與圖2C，將—金屬片配 置於第-電極220、第二電極23〇以及第—延伸部242上， : 與烊料層D，以將助焊劑270夾在金屬 熱声260 2士1〇之間。如此一來，當基板210下方的發 々，基板21G上方的助焊劑27G可有助於使 其上的金屬片280熔融。 圖，:示本發明另一實施例之保護元件_的俯視 6:之V崔:曰：圖6Α之保護元件的仰視圖’圖6C繪示圖 '線段的剖面圖，圖料示圖之保 口又兀件/口 ΙΙ-Π’線段的剖面圖。 請同時參照圖6Α〜圖 6D ’本實施例之保護元件600 15 201110178 KJJ-uyz-1W 31739twf.doc/n 相似於圖2A〜圖2D的保護元件200，兩者的差異之處在 於保護元件600的發熱層260、第二延伸部244、第三延伸 部252與絕緣層290皆配置於基板21〇的第一表面S1上。 詳細而言’策二延伸部244與第三延伸部252配量於·. 第一表面si上並位於第一電極22〇與第二電極23〇之間， 發熱層260配置於第二延伸部244與第三延伸部252之 間，且絕緣層290覆蓋發熱層260、第二延伸部244與第 二延伸部252。第二電極240的第一延伸部242延伸至絕. 緣層290上，而助焊劑270配置於絕緣層29〇上且位於第 一延伸部242的周邊，金屬片28〇覆蓋第一電極22〇、助 焊劑270、第一延伸部242與第二電極230，以使助焊劑 270位於金屬片280與絕緣層29〇之間。如此一來，當發 熱層260發熱時，熱可透過絕緣層29〇傳導到助焊劑^7〇 與金屬片280，以熔融金屬片280，此時，直接接觸金屬片 280的助焊劑270可有助於金屬片280熔融。在本實施例 中，第一延伸部242與第二延伸部244分別位於二實質上 相互平行但不重疊的平面上（如圖6D所示）。 另外，保護元件600的製作方法相似於圖2八〜圖2d 的保護元件200的製作方法（圖4A〜圖4C與圖5^^〜圖 5C)，兩者的差異之處僅在於保護元件6〇〇的製作方法是 先依序將第二延伸部244、第三延伸部252、發熱層 與絕緣層290形成在基板210的第一表面si上，然後才 开>成延伸至絕緣層290上的第一延伸部242，接著，於第 一延伸部242的周邊形成助焊劑270，之後，形成覆蓋第 201110178 KD-uy2-TW 31739twf.doc/n 一電極22〇、助焊劑27〇、第一延伸部242與第二電極23〇 的金屬片280。 雖然本發明已以實施例揭露如上，然其並非用以限定 賴髓領财韻.，在不脫離 剌之範圍内，當可作些許之更動與潤飾，故本 Χ 軏圍當視後附之申請專利範圍所界定者為準。 L圖式間單說明】 緣示:二:示:知的:種防護元件的剖面示意圖，圖1] 的另—種防護元件的剖面示意圖。 ° A '纟會示本發明一實施例之# 1 % 護元件沿处線段的剖面圖，=絡圖_2,示圖2A之啦 沿Π-Π，線段的剖面圖。3 2D、、會不圖2八之保護補 圖2A中的金屬片的 圖4A〜圖4C緣示本發明—者文化、，構。 俯視圖，圖5A〜圖冗緣示圖4A二，保護元件的製卷 6B洛圖6切示本發明—實施例之;Λ製程的仰視圖£ ，圖6Α之保護元件的 保，件的俯視圖，圖 遵凡件沿14,線段的剖面圖，圖6;^6C冷示圖6Α之保 沿Π-Π’線段的剖面圖。 '、，日不圖6A之保護元件 201110178 KU-uy^- Γ W 31739twf.doc/n 【主要元件符號說明】 100a、100b :保護元件 110、210 :基板 ‘120:·力熱元件 130、131、290 :絕緣層 140、141 :低熔點金屬片 150 :内封止層 160、161、163 :電極層 162 :中間電極 200、600 :保護元件 212 :第一周邊部 • 214 :第二周邊部 216 :第三周邊部 218 :第四周邊部 220 :第一電極 230 :第二電極 240 :第三電極 242:第一延伸部 244 :第二延伸部 -250 ··第四電極 252 :第三延伸部 260 :發熱層 280、280a :金屬片 270、F:助焊劑 C :中心部 Η:懸空高度 m、Η2 :最大高度 R1 :第一凹槽 R2 :第二凹槽 S:懸空區域 51 :第一表面 52 :第二表面 18After that, referring to FIG. 4B, a tan layer D is formed on the first electrode 220, the second electrode 230, and the first extension portion 242, for example, by coating. Then, a flux is formed on the substrate 21A between the first electrode 22A, the second electrode 230, and the first extension portion 242, for example, by coating. In other implementations, when the material f of the tan layer D comprises a solder alloy and a fluxing material, for example, containing 1 (1 to 1 5%), the method of forming the coercing agent 27 包括 includes heating the crucible layer D (for example, 12 叱) The above) is such that the flux material is softened and flows onto the substrate 2! 之间 between the first electrode 22G, the second electrode 23G, and the first torn, and if the amount of the fluxing material is insufficient, one can be selectively added. Second flux (not shown). Referring to FIG. 4C and FIG. 2C simultaneously, the metal sheet is disposed on the first electrode 220, the second electrode 23〇, and the first extension portion 242, and the tantalum layer D is used to sandwich the flux 270. In the metal thermoacoustic 260 2 〇 1 。. As such, the flux 27G above the substrate 21G can help to melt the metal piece 280 thereon when the substrate is under the substrate 210. Figure: shows a protective element of another embodiment of the present invention. 6: V: C: FIG. 6A is a bottom view of the protective element. FIG. 6C is a cross-sectional view of the line segment of the figure. A cross-sectional view of the line segment of the mouth and the mouthpiece. Please refer to FIG. 6A to FIG. 6D simultaneously. The protection element 600 15 201110178 KJJ-uyz-1W 31739twf.doc/n of the present embodiment is similar to the protection element 200 of FIG. 2A to FIG. 2D, and the difference is that the protection element 600 The heat generating layer 260, the second extending portion 244, the third extending portion 252, and the insulating layer 290 are disposed on the first surface S1 of the substrate 21A. In detail, the second extension portion 244 and the third extension portion 252 are disposed on the first surface si between the first electrode 22A and the second electrode 23A, and the heat generating layer 260 is disposed on the second extension portion. Between the 244 and the third extension 252, the insulating layer 290 covers the heat generating layer 260, the second extending portion 244, and the second extending portion 252. The first extension portion 242 of the second electrode 240 extends to the edge layer 290, and the flux 270 is disposed on the insulating layer 29A and located at the periphery of the first extension portion 242, and the metal piece 28 covers the first electrode 22〇. The flux 270, the first extension portion 242 and the second electrode 230 are disposed such that the flux 270 is located between the metal piece 280 and the insulating layer 29A. As a result, when the heat generating layer 260 generates heat, the heat permeable insulating layer 29 is transferred to the flux 〇7 and the metal piece 280 to melt the metal piece 280. At this time, the flux 270 directly contacting the metal piece 280 may have Helps the metal sheet 280 to melt. In the present embodiment, the first extension portion 242 and the second extension portion 244 are respectively located on planes that are substantially parallel to each other but do not overlap (as shown in Fig. 6D). In addition, the manufacturing method of the protection element 600 is similar to the manufacturing method of the protection element 200 of FIGS. 2-8 to 2d (FIG. 4A to FIG. 4C and FIG. 5 to FIG. 5C), and the difference between the two is only the protection element 6 The germanium is formed by sequentially forming the second extending portion 244, the third extending portion 252, the heat generating layer and the insulating layer 290 on the first surface si of the substrate 210, and then extending to the insulating layer 290. The first extension portion 242 is formed thereon, and then the flux 270 is formed on the periphery of the first extension portion 242, and then, the cover is formed to cover the 201110178 KD-uy2-TW 31739twf.doc/n electrode 22〇, the flux 27〇, An extension 242 and a metal piece 280 of the second electrode 23〇. Although the present invention has been disclosed above by way of example, it is not intended to limit the financial meaning of the sacred marrow. In the scope of not departing from the shackles, when some changes and retouching can be made, the Χ 軏 当 当 当 当 附The scope defined in the scope of application for patent application shall prevail. L illustrated between the drawings] The edge: 2: Show: Known: a schematic view of the cross-section of the protective element, Figure 1] Another cross-sectional view of the protective element. ° A '纟 will show a cross-sectional view of the line segment along the #1 % protection element of an embodiment of the present invention, = diagram _2, showing a cross-sectional view of the line segment along Π-Π. 3 2D, and will not be protected by Fig. 2A. Fig. 4A to Fig. 4C of Fig. 2A show the present invention - culture, structure. FIG. 5A to FIG. 4A, the winding of the protective element 6B is shown in the embodiment of the present invention; the bottom view of the process, the top view of the protection element of FIG. Fig. 6 is a cross-sectional view of the line segment along line 14, Fig. 6; ^6C is a cross-sectional view of the line along the Π-Π' section of Fig. 6 . ',, the protection element of Fig. 6A 201110178 KU-uy^- Γ W 31739twf.doc/n [Description of main component symbols] 100a, 100b: protection element 110, 210: substrate '120: · force element 130, 131 290: insulating layer 140, 141: low-melting-point metal sheet 150: inner sealing layer 160, 161, 163: electrode layer 162: intermediate electrode 200, 600: protective element 212: first peripheral portion • 214: second peripheral portion 216: third peripheral portion 218: fourth peripheral portion 220: first electrode 230: second electrode 240: third electrode 242: first extension portion 244: second extension portion - 250 · · fourth electrode 252: third Extension portion 260: heat generating layer 280, 280a: metal piece 270, F: flux C: center portion Η: flying height m, Η 2: maximum height R1: first groove R2: second groove S: floating area 51: First surface 52: second surface 18