201119913 六、發明說明： 【發明所屬之技術領域】 本發明係關於位置偏移防止裝置、具備此之基板保持 具、基板搬運裝置及基板搬運方法。 【先前技術】 在液晶顯示器（LCD )所代表之FPD之製造過程中， 在真空下對玻璃基板等之基板施予蝕刻、成膜等之各種處 理。於FPD之製造時使用具備多數基板處理室之所謂的 多腔室類型之基板處理系統。如此之基板處理系統具有配 備搬運基板之基板搬運裝置的搬運室，和被設置在該搬運 室周圍之多數製程腔室。然後，藉由搬運室內之基板搬運 裝置，基板被搬入至各製程腔室內，或是已處理完之基板 自各製程腔室被搬出。基板之搬運通常使用被稱爲叉架（ Fork)之基板保持具。叉架具有在被安裝於可進出、退避 、旋轉等之動作之搬運臂上的共同基部上梳齒狀形成多數 支撐撿取器之構造。 在大氣壓狀態下，通常藉由被設置在叉架之真空吸盤 固定基板而執行基板之搬運。另外，在真空狀態下，無法 使用真空吸盤。因此，藉由在叉架安裝由與基板之間之摩 擦係數大之橡膠等之材質所構成之小片彈性構件而將此抵 接於基板，硏究出防止基板之橫向滑動等而引起之位置偏 移的方法。但是，在真空狀態下之搬運，則有下述般之問 題。 -5- 201119913 在真空狀態下基板之保持，係如上述般，因依賴彈性 構件和基板之摩擦力，故有如無法增快基板之搬運動作速 度之問題。被安裝於基板搬運裝置之搬運臂的叉架，由於 在保持基板之狀態下，執行隨著進出、退避、旋轉等之加 減速的搬運動作，故藉由摩擦力的保持則有限度。因此， 爲了實現安全之搬運，除抑制搬運動作速度之外，降低基 板處理系統中之基板處理之處理量也成爲主要因素。 再者，當在基板上之形成電子零件之區域（裝置形成 區域）之背側，抵接彈性構件之時，由於必須擔心靜電破 壞會使電子零件之良率降低，故需要使彈性構件抵接於自 裝置形成區域偏離之區域的背面。因此，只能使用比起基 板面積爲非常小之彈性構件，而且彈性構件之配設數量、 配設位置等也受到限制，與基板接觸之接觸面積受限，無 法取得充分之摩擦力》其結果，無法取得充分之保持力， 即使降低搬運動作速度，在叉架上基板也會移動而脫落， 或保持位置過度偏移而使基板之處理或收授產生障礙。 近年來，因提高生產效率，故朝FPD等之基板的大 型化發展，依賴安裝於叉架之彈性構件和基板之摩擦力的 保持方法中，越來越難取得充分之保持力和處理量。因此 ，本發明者硏究出藉由在叉架設置限制基板之水平方向之 動作的突起，並將此抵接於基板之端部，防止橫向滑動或 位置偏移。但是，於基板之收授時，因屢次發生保持位置 改變，故於收授時有可能產生基板乘在上述突起。其結果 ，基板保持反而成爲不安定，有產生脫落等之虞。再者， -6 - 201119913 爲了避免如此之事態，因必須要有充分餘裕配設突起’故 無法避免產生該餘裕部份之位置偏移。 【發明內容】 [發明所欲解決之課題] 本發明係鑑於上述情形而所硏究出，提供即使在真空 狀態下亦可以抑制被基板保持具保持之基板的位置偏移的 位置偏移防止裝置。 [用以解決課題之手段] 本發明之位置偏移防止裝置係具備被固定於保持基板 之基板保持具之本體； 具有以第1高度從上述本體之上面突出之部分，互相 被獨立設置成基板之荷重被施加於該突出之部分的狀態下 低於上述第1高度之多數可動構件；和 將上述多數之可動構件各推彈於突出方向之推彈手段 藉由以上述第1高度突出之一個以上的可動構件之側 部抵接於被保持於上述基板保持具之基板的端部，限制基 板之移動，防止位置偏移。 再者’本發明所涉及之基板保持具具備支撐基板之基 板支撐構件，和被固定於上述基板支撐構件之上述位置偏 移防止裝置。 再者，本發明所涉及之基板搬運裝置具備有上述基板 201119913 保持具。 再者，本發明所涉及之基板搬運方法使用上述基板搬 運裝置，並將基板保持於上述基板保持具而予以搬運。 [發明效果] 若藉由本發明，不管係在真空搬運或大氣壓搬運，皆 可以防止由於基板之橫向滑動等所引起之保持位置偏移， 並確實將基板保持在基板保持具。因此，可以提高基板搬 運之信賴性。再者，可以提升基板處理系統中之基板處理 的處理量。 【實施方式】 [第1實施型態] 以下，針對本發明之實施型態，參照圖面予以詳細說 明。在此，以具備有本發明之一實施型態所涉及之基板搬 運裝置及具備有該基板搬運裝置之基板處理系統爲例進行 說明。第1圖爲槪略性表示當作基板處理系統之真空處理 系統1 00之斜視圖，第2圖爲槪略性表示各腔室之內部之 俯視圖。該真空處理系統100係構成具有多數製程腔室 la、lb、lc之多腔室構造。真空處理系統1〇〇係構成用 以對例如FPD用之玻璃基板（以下，單稱爲「基板」）S 執行電漿處理之處理系統。並且，就以FPD而言例示有 液晶顯示器（LCD)、電激發光（Electro Luminescence: EL)顯示器、電漿顯示面板（PDP )等。 201119913 在真空處理系統100中，多數大型腔室俯視觀看時連 結成十字形狀。在中央部配置搬運室3，鄰接於其三方之 側面配設有對基板S執行電漿處理之3個製程腔室1 a、 lb、lc。再者’鄰接於搬運室3之殘留之一方之側面，配 設有裝載鎖定室5。該些3個製程腔室la、lb、lc、搬運 室3及裝載鎖定室5中之任一者皆構成真空腔室。搬運室 3和各製程腔室1 a、1 b、1 c之間設置有無圖式之開口部 ，在該開口部各配設有具有開關功能之閘閥7 a。再者， 在搬運室3和裝載鎖定室5之間配設有閘閥7b。閘閥7a 、7b係在關閉狀態下氣密密封各腔室之間，並且在打開 狀態下使腔室間連通而可移送基板S。再者，在裝載鎖定 室5和外部大氣環境之間也配備有閘閥7c，使在關閉狀 態下能夠維持裝載鎖定室5之氣密性，並且在打開狀態下 能夠在裝載鎖定室5和外部之間移送基板S。 在裝載鎖定室5之外側，設置有兩個匣盒指示器9a 、9b。在各匣盒指示器9a、9b之上載置有各收容基板S 之匣盒11a、lib。在各匣盒11a、lib內於上下隔著間隔 多段配置有基板S»再者，各匣盒11a、lib藉由升降機 構部13a、13b構成各升降自如。在本實施型態中，構成 在例如卡匣11a可以收容末處理基板，在另一方之匣盒 1 1 b可以收容處理完之基板。 在該些兩個匣盒11a、lib之間設置有用以搬運基板 S之搬運裝置15。該搬運裝置15具備有被設置在上下兩 段之當作基板保持具之叉架17a及叉架17b，和可進出、 -9 - 201119913 退避及旋轉支撐該些叉架17a、叉架17b之驅動部19，和 支撐該驅動部19之支撐台21。 製程腔室1 a、1 b、1 c係被構成可以在其內部空間維 持特定減壓環境（真空狀態）。在各製程腔室la、lb、 lc內如第2圖所示般，配備有當作載置基板S之載置台 的承載器2。然後，各製程腔室la、lb' lc係在將基板S 載置在承載器2之狀態下，對基板S，執行例如真空條件 下之蝕刻處理、灰化處理、成膜處理等之電漿處理。 在本實施型態中，即使以3個製程腔室la、lb、lc 執行同種處理亦可，即使對每製程腔室執行不同種類之處 理亦可。並且，製程腔室之數量並不限定於3個，即使爲 4個以上亦可。 搬運室3係構成與真空處理室之製程腔室la、lb、 lc相同，可以保持於特定減壓環境。在搬運室3中，如 第2圖所示般配設有搬運裝置23。然後，藉由搬運裝置 23，在3個製程腔室la、lb、lc及裝載鎖定室5之間執 行基板S之搬運。 搬運裝置23具備被設置成上下兩段之搬運裝置，構 成各個獨立而可以執行基板S之搬出搬入。第3圖係表示 具有當作基板保持具之叉架101的上段搬運裝置23a之槪 略構成。搬運裝置23 a主要之構成具備有台座部113,和 被設置成對台座部113可滑動之滑動臂115，和被設置成 可在該滑動臂115上滑動，保持基板S的叉架101。叉架 1 〇 1具備有當作基部之撿取器基台1 1 7，和被連結於該撿 -10- 201119913 取器基台117之多數（例如4根）的支撐撿取器119。在 被配置在最外側之兩根支撐撿取器1 1 9，各安裝4個防止 被保持於叉架101上之基板S之位置偏移的位置偏移防止 裝置201。針對該位置偏移防止裝置201之詳細構成於後 說明。 在滑動臂1 1 5之側部，設置有用以使滑動臂1 1 5對台 座部1 1 3滑動之導件1 2 1。然後，在基部1 1 3設置有可滑 動地支撐導件121之滑動支撐部123。 再者’在滑動臂1 1 5之側部，與上述導件1 2 1平行設 置有用以使叉架101對滑動臂115滑動之導件125。然後 ’設置有沿著導件1 2 5滑動之滑動件1 2 7，在該滑動件 127安裝有叉架101。 在第3圖中，雖然針對上段之搬運裝置23a予以說明 ’但是下段之搬運裝置（省略圖示）也具有與上段之搬運 裝置23a相同之構成。然後，上下之搬運裝置藉由無圖示 之連結機構連結’成爲一體構成可以在水平方向旋轉。再 者’構成上下兩段之搬運裝置連結於執行滑動臂115及叉 架101之滑動動作’或台座部113之旋轉動作及升降動作 之無圖示之驅動單元。 裝載鎖定室5係構成與製程腔室la、ib、lc及搬運 室3相同’可以保持於特定減壓環境。裝載室5爲用以在 位於大氣環境之匣盒lla、llb和減壓環境之搬運室3之 間執行基板S之收授。裝載鎖定室5在反覆大氣環境和減 壓環境之關係上，係構成極力縮小其內容積。在裝載鎖定 -11 - 201119913 室5上下兩段設置有基板收容部27(在第2圖中僅圖示 上段），在各基板收容部27設置有支撐基板S之多數緩 衝器28。再者，在裝載鎖定室5內，設置有抵接於矩形 狀基板S之互相對向的角部附近而執行定位之定位器29 〇 如第2圖所示般，真空處理系統100之各構成部成爲 被連接於具有當作電腦之功能的控制部3 0而被控制之構 成（在第1圖中省略圖式）。控制部30具備有：具有 CPU之控制器3 1、使用者介面3 2和記憶部3 3。控制器 31係在真空處理系統100中，統籌例如製程腔室ia、lb 、lc、搬運裝置15、搬運裝置23等之各構成部而控制。 使用者介面32係由工程管理者爲了管理真空處理系統 1〇〇執行指令輸入操作之鍵盤，或使真空處理系統1〇〇之 運轉狀況可觀視而所顯示之顯示器等所構成。記憶部33 係保存有配方，該配方記錄有用以在控制器31之控制下 實現在真空處理系統1 00所實行之各種處理之控制程式（ 軟體）’或處理條件資料等。使用者介面32及記憶部33 係被連接於控制器3 1。 然後’依其所需，以來自使用者介面32之指示等自 記憶部3 3叫出任意配方，使控制器3 1實行，依此，在控 制器3 1之控制下，執行在真空處理系統1 〇〇中的所期待 處理。 上述控制程式或處理條件資料等之配方係可以利用儲 存於電腦可讀取之記憶媒體，例如CD-ROM、硬碟、軟碟 -12- 201119913 、快閃記憶體等之狀態者。或是’亦可自其他裝置經例如 專用迴線隨時傳送而在線上利用。 接著，針對構成上述般之真空處理系統1 00動作予以 說明。 首先，使搬運裝置15之兩片叉架l7a、17b驅動，自 收容未處理基板之匣盒1〗a接取基板S，各載置於裝載鎖 定室5之上下兩段基板收容部27之緩衝器28。 於使叉架17a、17b退避之後，關閉裝載鎖定室5之 大氣側之閘閥7c。之後，使裝載鎖定室5內排氣，將內 部減壓至特定真空度。接著，打開搬運室3和裝載鎖定室 5之間的閘閥7b，藉由搬運裝置23之叉架101，接取被 收容於裝載鎖定室5之基板收容部27之基板S。 接著，在藉由搬運裝置23之叉架101保持基板S之 狀態下，藉由滑動臂1 1 5及叉架1 0 1之滑動動作，或台座 部113之旋轉動作及升降動作執行基板S之搬運。該些搬 運動作因藉由位置偏移防止裝置201限制叉架101上之基 板S的移動，故在基板S被確實保持之狀態下執行。然後 ，將基板S搬入至製程腔室la、lb、lc中之任一者，收 授至承載器2。在製程腔室ia、lb、lc內對基板S實施 蝕刻等之特定處理。接著，處理完之基板S從承載器2被 收授至搬運裝置23之叉架101，自製程腔室la、lb、lc 被搬出。 然後，基板S係以與上述相反之路徑，經由裝載鎖定 室5，藉由搬運裝置15被收容在匣盒lib。並且，即使將 -13- 201119913 處理完之基板S返回至原來之匣盒lla亦可。 接著，一面參照第4圖〜第12圖，針對本發明之第 1實施型態所涉及之位置偏移防止裝置201及具備此之叉 架101又予以詳細說明。首先，針對安裝有位置偏移防止 裝置201之叉架101之構成予以說明。第4圖爲表示叉架 101之外觀的斜視圖。如上述般，叉架101具備有固定於 滑動件127之撿取器基台117，和當作被連結於該撿取器 基台117之基板支撐構件的多數（例如4根）之支撐撿取 器 1 19。 撿取器基台117確實固定被設置成梳齒狀之多數支撐 撿取器1.1 9 (在本實施型態中爲4根），若爲可以連結於 滑動臂115(滑動器127)者則不管其構成。再者，撿取 器基台117和支撐撿取器119之連結構造也爲任意。例如 ，撿取器基台117即使爲使用能夠夾持支撐撿取器119之 基端部之兩片板材的固定構造亦可，即使爲使用能夠支撐 多數支撐撿取器119之一片板材的固定構造亦可。又，撿 取器基台117和支撐撿取器119即使一體形成亦可。在本 實施型態中，撿取器基台1 1 7係藉由彎曲成例如剖面觀視 呈C字型之板材所構成。然後，在彎曲之板材之間隙插入 多數支撐撿取器Π9之各個基端部，藉由無圖示之固定手 段例如螺桿等固定。 叉架1 〇 1之支撐撿取器1 1 9係構成例如長條之板狀或 中空之角筒狀。作爲支撐撿取器119之材質，係使用具有 高剛性之材質例如CFRP (碳纖維強化塑膠）等，使得在 -14 - 201119913 載置輕量且大型基板S之狀態下盡量不會產生因荷重所造 成之彎曲。 在叉架101之各支撐撿取器119之上面，多處（在第 4圖中，在一個支撐撿取器119中有兩處）可裝卸地設置 有從其背面側支撐基板S之支撐突起200。支撐突起200 係藉由例如橡膠或PEEK (聚醚醚酮：[2011] [Technical Field] The present invention relates to a positional deviation preventing device, a substrate holder including the same, a substrate carrying device, and a substrate carrying method. [Prior Art] In the process of manufacturing an FPD represented by a liquid crystal display (LCD), various processes such as etching, film formation, and the like are applied to a substrate such as a glass substrate under vacuum. A so-called multi-chamber type substrate processing system having a plurality of substrate processing chambers is used in the manufacture of FPD. Such a substrate processing system has a transfer chamber equipped with a substrate transfer device for transporting substrates, and a plurality of process chambers provided around the transfer chamber. Then, the substrate is carried into the respective process chambers by the substrate transfer device in the transfer chamber, or the processed substrates are carried out from the respective process chambers. The substrate holder is usually a substrate holder called a Fork. The fork has a structure in which a plurality of support grippers are formed in a comb shape on a common base attached to a transfer arm that can be moved in, retracted, rotated, or the like. In the atmospheric pressure state, the substrate is usually transported by fixing the substrate to the vacuum chuck provided on the fork. In addition, the vacuum chuck cannot be used under vacuum. Therefore, by attaching a small-sized elastic member made of a material such as rubber having a large friction coefficient to the substrate to the fork, the substrate is brought into contact with the substrate, and the positional deviation caused by the lateral sliding of the substrate is prevented. The method of shifting. However, handling under vacuum conditions has the following problems. -5-201119913 The holding of the substrate in a vacuum state is dependent on the frictional force between the elastic member and the substrate as described above, so that there is a problem that the speed of the substrate can not be increased. Since the fork mounted on the transport arm of the substrate transporting apparatus performs the transport operation of acceleration and deceleration such as entry and exit, retraction, and rotation while holding the substrate, the frictional force is limited. Therefore, in order to realize safe handling, in addition to suppressing the speed of conveyance, it is also a major factor to reduce the amount of processing of the substrate processing in the substrate processing system. Further, when the back surface of the region on which the electronic component is formed on the substrate (the device forming region) abuts against the elastic member, it is necessary to worry that the electrostatic breakdown causes the yield of the electronic component to be lowered, so that the elastic member needs to be abutted. The back side of the area from which the device formation region is offset. Therefore, only an elastic member having a very small substrate area can be used, and the number of the elastic members, the arrangement position, and the like are also limited, and the contact area with the substrate is limited, and sufficient friction cannot be obtained. In addition, sufficient holding power cannot be obtained, and even if the conveyance speed is lowered, the substrate moves on the fork and falls off, or the position is excessively shifted to hinder the processing or reception of the substrate. In recent years, in order to increase the production efficiency, it has become increasingly difficult to obtain sufficient holding power and throughput depending on the development of the substrate of the FPD or the like, depending on the method of maintaining the frictional force of the elastic member and the substrate attached to the fork. Therefore, the inventors of the present invention have made it possible to prevent the lateral sliding or the positional displacement by providing a projection for restricting the movement of the substrate in the horizontal direction on the fork frame and abutting against the end portion of the substrate. However, at the time of receiving the substrate, the holding position is changed repeatedly, so that the substrate may be multiplied by the protrusion at the time of reception. As a result, the substrate remains unstable and becomes detached. Furthermore, -6 - 201119913 In order to avoid such a situation, it is necessary to have a sufficient margin to arrange the protrusions, so that the positional shift of the margin portion cannot be avoided. [Problems to be Solved by the Invention] The present invention has been made in view of the above circumstances, and provides a positional shift preventing device capable of suppressing positional displacement of a substrate held by a substrate holder even in a vacuum state. . [Means for Solving the Problem] The positional deviation preventing device of the present invention includes a main body of a substrate holder fixed to a holding substrate, and has a portion protruding from the upper surface of the main body at a first height, and is independently provided as a substrate. a plurality of movable members whose load is applied to the protruding portion is lower than the first height; and a pushing means for pushing the plurality of movable members in the protruding direction by the first height The side portion of the movable member abuts on the end portion of the substrate held by the substrate holder to restrict the movement of the substrate and prevent positional displacement. Further, the substrate holder according to the present invention includes a substrate supporting member that supports the substrate, and the positional deviation preventing device that is fixed to the substrate supporting member. Furthermore, the substrate transfer device according to the present invention includes the substrate 201119913 holder. Further, in the substrate transfer method according to the present invention, the substrate transfer device is used, and the substrate is held by the substrate holder and transported. [Effect of the Invention] According to the present invention, it is possible to prevent the positional shift due to the lateral sliding of the substrate or the like regardless of the vacuum conveyance or the atmospheric pressure conveyance, and to securely hold the substrate in the substrate holder. Therefore, the reliability of substrate transportation can be improved. Furthermore, the throughput of substrate processing in the substrate processing system can be increased. [Embodiment] [First Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, a substrate transporting apparatus according to an embodiment of the present invention and a substrate processing system including the substrate transporting apparatus will be described as an example. Fig. 1 is a perspective view schematically showing a vacuum processing system 100 as a substrate processing system, and Fig. 2 is a plan view schematically showing the inside of each chamber. The vacuum processing system 100 constitutes a multi-chamber configuration having a plurality of process chambers la, lb, lc. The vacuum processing system 1 is configured as a processing system for performing plasma processing on, for example, a glass substrate (hereinafter simply referred to as "substrate") S for FPD. Further, examples of the FPD include a liquid crystal display (LCD), an electroluminescence (EL) display, and a plasma display panel (PDP). 201119913 In the vacuum processing system 100, most of the large chambers are connected in a cross shape when viewed from above. The transfer chamber 3 is disposed at the center portion, and three process chambers 1a, 1b, 1c, which perform plasma treatment on the substrate S, are disposed adjacent to the three sides thereof. Further, the load lock chamber 5 is disposed adjacent to one side of the remaining portion of the transfer chamber 3. Any of the three process chambers la, lb, lc, the transfer chamber 3, and the load lock chamber 5 constitute a vacuum chamber. An opening portion having no pattern is provided between the transfer chamber 3 and each of the process chambers 1a, 1b, and 1c, and a gate valve 7a having a switching function is disposed in each of the openings. Further, a gate valve 7b is disposed between the transfer chamber 3 and the load lock chamber 5. The gate valves 7a, 7b hermetically seal between the chambers in the closed state, and communicate between the chambers in the open state to transfer the substrate S. Further, a gate valve 7c is also provided between the load lock chamber 5 and the external atmospheric environment so that the airtightness of the load lock chamber 5 can be maintained in the closed state, and the load lock chamber 5 and the outside can be held in the open state. The substrate S is transferred between. On the outer side of the load lock chamber 5, two cassette indicators 9a, 9b are provided. The cassettes 11a and 11b for accommodating the substrate S are placed on the cassette indicators 9a and 9b. In each of the cassettes 11a and 11b, the substrate S» is disposed in a plurality of stages at intervals, and the cassettes 11a and 11b are configured to be lifted and lowered by the elevator units 13a and 13b. In the present embodiment, for example, the cassette 11a can accommodate the final processed substrate, and the other cassette 1 1b can accommodate the processed substrate. A conveying device 15 for transporting the substrate S is provided between the two cassettes 11a and 11b. The conveying device 15 is provided with a fork frame 17a and a fork frame 17b which are provided as upper and lower stages as a substrate holder, and can be driven in and out, -9 - 201119913 to retreat and rotatably support the forks 17a and the forks 17b. The portion 19 and the support table 21 supporting the driving portion 19. The process chambers 1a, 1b, 1c are configured to maintain a specific reduced pressure environment (vacuum state) in their internal spaces. As shown in Fig. 2, in each of the process chambers la, lb, and lc, a carrier 2 serving as a mounting table on which the substrate S is placed is provided. Then, each of the process chambers la and lb' lc is placed on the substrate 2 in a state where the substrate S is placed on the carrier 2, and the substrate S is subjected to, for example, etching treatment under vacuum conditions, ashing treatment, film formation treatment, and the like. deal with. In the present embodiment, even if the same processing is performed in the three processing chambers la, lb, and lc, even different kinds of processing can be performed for each processing chamber. Further, the number of process chambers is not limited to three, and may be four or more. The transfer chamber 3 is configured to be the same as the process chambers la, lb, and lc of the vacuum processing chamber, and can be maintained in a specific reduced pressure environment. In the transport chamber 3, a transport device 23 is disposed as shown in Fig. 2. Then, the conveyance device 23 performs the conveyance of the substrate S between the three process chambers la, lb, lc and the load lock chamber 5. The conveying device 23 is provided with a conveying device that is provided in two stages, and is configured to perform the loading and unloading of the substrate S independently. Fig. 3 shows a schematic configuration of an upper conveying device 23a having a fork 101 as a substrate holder. The conveying device 23a is mainly configured to include a pedestal portion 113, a sliding arm 115 provided to slide the pedestal portion 113, and a yoke 101 which is slidable on the sliding arm 115 to hold the substrate S. The fork 1 〇 1 is provided with a picker base 117 as a base and a support picker 119 connected to a majority (for example, four) of the -10--10-201119913 picker base 117. The positional displacement preventing means 201 for preventing the position of the substrate S held by the fork 101 from being displaced is attached to each of the two support grippers 1 1 9 disposed at the outermost side. The detailed configuration of the positional deviation preventing device 201 will be described later. On the side of the slide arm 1 15 , a guide 1 21 for sliding the slide arm 1 15 to the seat portion 1 1 3 is provided. Then, a sliding support portion 123 that slidably supports the guide member 121 is provided at the base portion 113. Further, on the side of the slide arm 1 15, a guide 125 for sliding the fork 101 against the slide arm 115 is provided in parallel with the above-described guide member 1 2 1 . Then, a slider 1 2 7 which slides along the guide 1 25 is provided, and a fork 101 is attached to the slider 127. In the third embodiment, the conveying device 23a of the upper stage will be described. However, the conveying device (not shown) in the lower stage has the same configuration as the conveying device 23a of the upper stage. Then, the upper and lower conveying devices are coupled to each other by a coupling mechanism (not shown), and can be rotated in the horizontal direction. Further, the transport unit that constitutes the upper and lower stages is connected to a drive unit that performs a sliding operation of the slide arm 115 and the fork 101 or a rotation operation and a lifting operation of the base unit 113. The load lock chamber 5 is constructed in the same manner as the process chambers la, ib, lc and the transfer chamber 3, and can be held in a specific decompression environment. The loading chamber 5 is for performing the reception of the substrate S between the cassettes 11a and 11b located in the atmosphere and the transfer chamber 3 in the decompression environment. The load lock chamber 5 is configured to minimize the internal volume in the relationship between the atmospheric environment and the pressure reducing environment. In the load lock -11 - 201119913, the substrate accommodating portion 27 is provided in the upper and lower stages of the chamber 5 (only the upper portion is shown in Fig. 2), and a plurality of buffers 28 for supporting the substrate S are provided in the respective substrate accommodating portions 27. Further, in the load lock chamber 5, a positioner 29 that abuts on the opposite corner portions of the rectangular substrate S and performs positioning is provided. As shown in Fig. 2, the components of the vacuum processing system 100 are provided. The unit is configured to be connected to the control unit 30 having a function as a computer (the figure is omitted in FIG. 1). The control unit 30 is provided with a controller 3 1 having a CPU, a user interface 3 2 and a memory unit 33. The controller 31 is controlled in the vacuum processing system 100 by coordinating, for example, the respective components of the process chambers ia, lb, lc, the conveying device 15, and the conveying device 23. The user interface 32 is constituted by a display manager or the like which is displayed by the project manager in order to manage the vacuum processing system 1 or to execute a command input operation, or to display the operation state of the vacuum processing system 1 . The memory unit 33 stores a recipe for recording a control program (software) or processing condition data for realizing various processes executed by the vacuum processing system 100 under the control of the controller 31. The user interface 32 and the memory unit 33 are connected to the controller 31. Then, as required, the arbitrary module is called from the memory unit 3 by an instruction from the user interface 32, so that the controller 31 is executed, and accordingly, under the control of the controller 31, the vacuum processing system is executed. 1 The expected processing in the 。. The above-mentioned control program or processing condition data and the like can be stored in a computer-readable memory medium such as a CD-ROM, a hard disk, a floppy disk -12-201119913, a flash memory or the like. Alternatively, it may be used on-line from other devices via, for example, a dedicated return line. Next, the operation of the above-described vacuum processing system 100 will be described. First, the two forks l7a and 17b of the conveying device 15 are driven, and the substrate S is taken from the cassette 1A for accommodating the unprocessed substrate, and the buffers are placed on the lower two stages of the substrate accommodating portion 27 on the loading lock chamber 5. 28 After the forks 17a, 17b are retracted, the gate valve 7c on the atmospheric side of the load lock chamber 5 is closed. Thereafter, the inside of the load lock chamber 5 is evacuated, and the inner portion is decompressed to a specific degree of vacuum. Then, the gate valve 7b between the transfer chamber 3 and the load lock chamber 5 is opened, and the substrate S accommodated in the substrate housing portion 27 of the load lock chamber 5 is picked up by the fork 101 of the transport device 23. Then, in a state in which the substrate S is held by the fork frame 101 of the transport device 23, the sliding operation of the slide arm 1 15 and the fork frame 101, or the rotation and lifting operation of the pedestal portion 113 is performed to perform the substrate S. Handling. These movements are caused by the positional deviation preventing means 201 restricting the movement of the substrate S on the fork 101, so that the substrate S is reliably held. Then, the substrate S is carried into any one of the process chambers la, lb, and lc, and is delivered to the carrier 2. The substrate S is subjected to a specific process such as etching in the process chambers ia, lb, and lc. Then, the processed substrate S is taken from the carrier 2 to the fork frame 101 of the conveying device 23, and the self-made process chambers la, lb, and lc are carried out. Then, the substrate S is housed in the cassette lib by the transport device 15 via the load lock chamber 5 in a path opposite to the above. Further, even if the substrate S processed by -13-201119913 is returned to the original cassette 11a. Next, the positional deviation preventing device 201 according to the first embodiment of the present invention and the fork 101 having the same will be described in detail with reference to Figs. 4 to 12 . First, the configuration of the fork 101 to which the positional deviation preventing device 201 is attached will be described. Fig. 4 is a perspective view showing the appearance of the fork 101. As described above, the fork frame 101 is provided with a gripper base 117 fixed to the slider 127, and a plurality of (for example, four) support members as the substrate supporting members coupled to the picker base 117. 1 19. The picker base 117 does securely fix a plurality of support grippers 1.1 9 (in this embodiment, four) which are arranged in a comb shape, and if it is connectable to the slide arm 115 (slider 127), Its composition. Further, the connection structure of the gripper base 117 and the support gripper 119 is also arbitrary. For example, even if the picker base 117 is a fixed structure using two sheets capable of holding the base end portion of the support gripper 119, even if a fixing structure capable of supporting one of the plurality of support grippers 119 is used, Also. Further, the gripper base 117 and the support gripper 119 may be integrally formed. In the present embodiment, the picker base 1 17 is formed by bending a sheet of a C-shape, for example, in a cross-sectional view. Then, the respective base end portions of the plurality of support grippers 9 are inserted into the gaps of the bent sheets, and fixed by a fixing means (not shown) such as a screw or the like. The support gripper 1 1 9 of the fork frame 1 构成 1 is formed into, for example, a long plate shape or a hollow rectangular tube shape. As the material of the support gripper 119, a material having high rigidity such as CFRP (carbon fiber reinforced plastic) or the like is used, so that the load due to the load is not generated as much as possible in the state where the light weight and the large substrate S are placed on -14 - 201119913. Bending. On the support ejector 119 of the yoke 101, a plurality of places (in the fourth figure, two in one of the support hoppers 119) are detachably provided with support protrusions for supporting the substrate S from the back side thereof. 200. The support protrusion 200 is made of, for example, rubber or PEEK (polyetheretherketone:
Polyetheretherketone )樹脂、PTFE (聚四氟乙嫌·· Polytetrafluoroethylene)樹脂等之彈性材料所構成。不管 支撐突起200之形狀，即使例如半球狀或〇型環般之環 狀亦可。並且，支撐突起200雖然爲抵接於基板S背面而 藉由摩擦力提高叉架101上之基板S的保持力者，但是因 藉由安裝位置偏移防止裝置201，將基板S確實保持於叉 架101上，故即使不一定設置支撐突起200亦可。 在叉架1 0 1上，於任意位置以任意個數安裝位置偏移 防止裝置201。在第4圖中，表示在4根中兩端之兩根支 撐撿取器119之基部附近各安裝有左右一對位置偏移防止 裝置20 1之狀態。再者，在第4圖中，也圖示有被安裝之 前之另外一對位置偏移防止裝置201。如此一來，位置偏 移防止裝置201爲可裝卸自如地安裝於構成叉架101之支 撐撿取器1 1 9者。 針對位置偏移防止裝置20 1之詳細構成予以說明。第 5圖爲放大表示位置偏移防止裝置201之外觀構成之斜視 圖。第6圖及第7圖爲用以說明位置偏移防止裝置201之 機構的重要部位剖面圖。位置偏移防止裝置20 1之主要構 -15- 201119913 成，係具備有本體203、突出於該本體203之上面203a 而被設置之當作可動構件之多數可動銷205、和使該些可 動銷2 05各獨立朝上方向（突出之方向）推彈之當作推彈 手段之線圏彈簧207。 在本實施型態之位置偏移防止裝置201中，本體203 係如第5圖所示般，以例如鋁或合成樹脂等之材質所構成 之框體。在支撐撿取器〗19安裝位置偏移防止裝置201之 狀態下，本體203之上面203a係以與支撐撿取器119之 上面相同之高度爲佳。並且，在第5圖中，雖然爲在本體 203具備有7根的可動銷205之構成，但是可動銷205之 數量並不被限定。 如第6圖及第7圖所示般，本體203之內部係藉由隔 牆211被區隔成個別之室部213。各室部213具有底壁 213a和頂棚部213b。各室部213各收容有一組可動銷 205及線圈彈簧207。可動銷205具備有從本體203之上 面203a「突出之部分」的柱狀部分205 a，和在該柱狀部 分205a之途中形成直徑大於柱狀部分205a之凸緣205b 。該凸緣205b係當作彈簧座而發揮功能。可動銷205之 上部係被插通於各設置在各室部213之頂棚部213b之開 口部 213c 。 可動銷205之柱狀部分205a和凸緣205b及使以相同 材質形成一體亦可，即使以不同構件形成亦可。可動銷 205之材質雖然並不特別限定，但是至少可動銷205之柱 狀部分20 5a之上部因接觸於基板S之背面或端部，故例 -16- 201119913 如藉由合成樹脂或橡膠等之材料形成爲佳。當然，即使藉 由相同之材料（合成樹脂或橡膠等）形成可動銷205之全 體亦可。再者，可動銷205之柱狀部分205a之上部具有 僅能擋住基板S之端部的剛性和韌性爲佳。由上述情形可 知，作爲可動銷205之材料，以使用例如PEEK (聚醚醚 酮：Polyetheretherketone)樹脂、PTFE (聚四氟乙稀： Polytetrafluoroethylene)樹脂等之合成樹脂爲佳。 並且，在本發明中，可動構件之形狀並非藉由第6圖 及第7圖所示之可動銷205之形狀而受到任何限制者。例 如，可動構件之「突出的部分」之柱狀部份205a並不限 於圖示般之圓柱狀，即使構成橫剖面爲三角形、四角形、 五角形、六角形、八角形等之多角形狀的角柱狀亦可。再 者，可動構件之全體或突出的部分即使爲中空之圓筒狀， 或橫剖面構成三角形、四角形、五角形、六角形、八角形 等之多角形狀的中空角筒狀亦可。並且，可動構件之全體 或突出之部分，即使形成板狀（例如，角板狀、圓板狀等 )亦可。再者，從縮小與基板S之背面之接觸面積的觀點 來看，雖省略圖示，但亦可以對可動構件（可動銷205 ) 之前端施予圓潤加工。 線圈彈簧2 07係將可動銷205推彈至上方向而使柱狀 部分205a之上部從本體203之上面203 a突出之狀態的推 彈手段。可動銷205之柱狀部分205 a之下部係被插入至 該線圈彈簧207之中。線圈彈簧207之下端係使用任意方 法例如制動銷等被固定在室部2 1 3之底壁2 1 3 a。線圈彈 -17- 201119913 簧207之上端係抵接於可動銷2 05之凸緣205b，即使因 應所需而以任意方法固定亦可。 在位置偏移防止裝置201中，多數可動銷205係藉由 基板S之荷重，而被構成可以各個獨力上下移位。即是， 可動銷2 05係獨立朝與基板S之面方向正交之方向突出， 或退避。在無承受基板S之荷重之狀態下，可動銷205係 藉由與凸緣2〇5b卡合之線圈彈簧207而朝上方向推彈。 因此，被插通於設置在頂棚部213b之開口部213c之可動 銷205之柱狀部分20 5 a之上部，從本體203之上面203 a 朝向上方突出。此時，以本體203之上面203a爲基準， 將可動銷205之前端對上面203a突出之突出量設爲第1 高度H!。再者，在無承受荷重之狀態下，藉由線圈彈簧 2〇7而被推彈之可動銷205之凸緣205b被推壓至室部213 之頂棚部213b。凸緣205b係可以當作用以規定第1高度 之制動器而予以利用。藉由設爲能夠變化可動銷205 之柱狀部分205a中之凸緣205b之位置的可調整構造，容 易任意設定第1高度Hi。就以能夠使凸緣205b之位置予 以變化的可調整構造而言，雖省略圖示，但是可以舉出例 如將柱狀部分205 a設爲外部螺紋構造，將凸緣205b設爲 內部螺紋構造等。 藉由叉架101接取基板S，在任意之可動銷205施加 基板S之荷重的狀態下，由於荷重使得線圈彈簧207壓縮 ，其可動銷205則全體性被下壓。該移位狀態之時，以本 體203之上面203a爲基準，將可動銷205之前端對上面 -18- 201119913 2〇3a突出之突出量設爲第2高度H2。 如第6圖及第7圖所示般，僅在上方載置基板S之可 動銷205沉入而成爲第2高度H2，不載置基板S之可動 銷205則可以原樣地保持第1高度H,。然後，藉由以第1 高度Hi突出之狀態的可動銷205之側部，可以限制基板 S之橫方向之移動。例如，在第6圖中，面向紙張左側和 中央之兩根可動銷205由於基板S之重量而沉入成爲第2 高度H2，面向紙張右側之1根可動銷205則以第1高度 H!突出。以該第1高度H,突出之右側的可動銷205成爲 制動器而限制基板S之移動。再者，在第7圖中，面向紙 張左側之一根可動銷205由於基板S之重量而沉入成爲第 2高度H2，面向紙張右側和中央之兩根可動銷205則以第 1高度Η,突出。此時，中央之突出的可動銷2 0 5成爲制 動器而限制基板S之移動。並且》在第6圖及第7圖中， 擔任制動器之任務的以第1高度Η!突出之可動銷205和 基板S表示還未接觸之狀態。當在叉架1〇1上由於搬運時 之加速度而將發生基板S橫向滑動時，因基板S之端部抵 接於當作該制動器之可動銷205而被限制，故基板S在叉 架101上之移動量極爲少。 如此一來，藉由基板S之端部（邊緣）抵接於以第1 高度突出之可動銷205之側部，將在叉架101上基板 s之橫方向移動限制成最小，可防止於搬運時基板s在叉 架101上於水平方向產生位置偏移，還有從叉架101落下 -19" 201119913 第2高度H2係被設定成低於第1高度Hl。第 H2係零（即是，可動銷205之前端與本體203 203a相同高度）以上第1高度H,以下。尤其，將 度H2設定成大於零，使第2高度H2之時的可動銷 前端位於第1高度I和本體203之上面203a之高 間爲佳。如此一來，因可以藉由以基板S之荷重沉 位至第2高度H2而突出之狀態的可動銷205之前 基板S，故可以極力迴避對形成在基板S表面之電 造成壞影響。再者，第1高度和第2高度112之 Η ,-H2 )係以設定成基板S之厚度以上爲佳。如此 可以充分取得當作限制基板S移動的制動器的可動 之高度，可以一面藉由以第2高度H2突出之狀態 銷205之前端支撐基板S，一面藉由以第1高度 之狀態之可動銷205確實限制基板S之水平方向之 第2高度H2係可以藉由可動銷205之柱狀部 之長度或對抗基板S之荷重的線圈彈簧207之彈力 來調節。 並且，就以彈推可動銷205之彈推手段而言， 定於線圈彈簧207，例如可以使用板狀彈簧等。 在叉架101上之基板S的保持位置係藉由於收 產生之位置偏移等，每基板多少產生不同。例如， 圖所示般，基板S之邊緣之位置，有基板S之邊緣 被保持成在叉架101 (支撐撿取器119)之前端附 者，如第9圖所示般，也有基板S之邊緣之位置， 2高度 之上面 第2尚 205之 度之中 入且移 端支撐 子零件 差分（ —來， 銷205 之可動 I突出 移動。 分 205a 之大小 並非限 授時所 如第8 之位置 近。再 比起第 -20- 201119913 8圖之位置被保持成在叉架1 〇 1之基部側（以箭號表示） 。並且’也有如第10圖所示般，基板S對叉架101(支 撐撿取器119)之長邊方向持有角度而保持傾斜（如箭號 所示般朝水平方向稍爲旋轉狀態）之情形。位置偏移防止 裝置201因具備多數藉由基板S之荷重而獨立進退之可動 銷205，故可彎曲地對應於第8圖〜第10圖所例示之任 一保持位置，可以確實限制基板S之移動。即是，即使每 基板S保持位置一點點不同，位置偏移防止裝置2〇1也對 應於該不同，交代擔任作爲制動器之任務的以第1高度 Η !突出之可動銷2 0 5。因此，即使在任何保持位置亦可以 限制基板S之移動，可以將位置偏移抑制成最小。容易理 解若增加位置偏移防止裝置20 1之配置處，或增加一個位 置偏移防止裝置201中之可動銷205之數量，使可動銷 2 05之配置成爲緊密時，則可以更精密地限制基板S之移 動，防止保持位置之偏移。 如此一來，位置偏移防止裝置201爲可裝卸自如地安 裝於構成叉架101之支撐撿取器119。位置偏移防止裝置 20 1之固定方法並不特別限定。例如，可以藉由螺絲和螺 帽之締結、嵌入等之可裝卸的固定手段，在支撐撿取器 1 19固定位置偏移防止裝置201之本體203。此時，即使 因應所需，使用固定扣件等之輔助固定具亦可。並且，亦 可以不設爲將位置偏移防止位置201在支撐撿取器119裝 卸自如之構成，而以例如黏接等之方法固定於支撐撿取器 119° -21 - 201119913 安裝於一個叉架101之位置偏移防止裝置201之個數 可以考慮基板s或叉架101之大小、在搬運動作中施加大 加速度之方向等而予以適當設定。位置偏移防止裝置201 可以安裝於例如叉架101之2〜12處，最佳爲4〜8處。 位置偏移防止裝置201可以僅配設於例如叉架101之 1 1 9之前端側，或是僅基部側。但是，由確實限制基板S 之移動之觀點來看，以在中間夾入被保持於叉架1〇1之基 板S之方式，設成成爲制動器之可動銷205可以抵接於與 基板S之至少對向的兩邊的配置爲佳。再者，位置偏移防 止位置201係以配置成對基板S之中心互相成爲對稱爲佳 ，又以配置在基板S之4角落附近爲更佳。 第11圖及第12圖係表示位置偏移防止裝置201之較 佳配置例。在第11圖中，位置偏移防止裝置201係被安 裝於從下方重疊於基板S之兩個的短邊SS。依此，主要 限制支撐撿取器119之長邊方向中之基板S之移動。 在叉架101，安裝位置偏移防止裝置201之位置，係 以迴避在此形成所保持基板S上之電子零件之部分（裝置 形成區域）之正下方，較裝置形成區域外側爲佳。在第 11圖中，以虛線描畫基板S上之裝置形成區域R。位置 偏移防止裝置20 1係以位於裝置形成區域R之外側之方式 ，安裝於叉架101之8處。如此一來，藉由將位置偏移防 止裝置2 0 1配置在裝置形成區域R之外側，可以防止由於 可動銷205接觸/離開基板S之背面側之時之靜電破壞， 對形成在表面側之電子零件造成壞影響之情形。 -22- 201119913 再者，如第1 2圖所示般，以位置偏移防止裝置2 0 1 與基板S之4角落重疊之配置爲更佳。若藉由如此之配置 ，因可以從4方向規範基板S，故不僅限制基板S朝支撐 撿取器Π 9之長邊方向移動，也限制基板S朝橫斷支撐撿 取器119之方向移動，或基板S朝水平方向旋轉之移動等 ，可以更確實防止位置偏移。並且，在第12圖之例中， 針對配置在與基板S之4角落重疊之位置之4個位置偏移 防止裝置20 1，較配置在其他位置之4個位置偏移防止裝 置201，增加可動銷205之數量。具體而言，配置在與基 板S之4角落重疊之位置的4個位置偏移防止裝置20 1具 有各11根可動銷2 05。另外，以與配置在基板S之4角 落之位置偏移防止裝置201構成對之方式，各被配置在支 撐撿取器1 1 9之相反側（內側）之位置偏移防止裝置20 1 ，具有各7根之可動銷205。如此一來，可動銷2〇5之數 量可以因應配置位置偏移防止裝置201之場所或配置數量 等而改變。 並且，由第11圖和第12圖之比較，可理解即使基板 S之尺寸變化，亦可以因應基板S之尺寸，改變支撐銷 119中之位置偏移防止裝置201之安裝位置。因此，不管 基板S之大小，可以確實防止在叉架〗〇ι上之位置偏移。 位置偏移防止裝置201即使爲安裝於一個叉架101之 時，亦可以因應安裝之部位，改變可動銷205之數量或配 置間隔、第1高度H,、第2高度H2等。 再者，可動銷2 0 5之柱狀部分2 0 5 a即使如第1 3圖所 -23- 201119913 示般，構成其長邊方向（垂直方向）當作旋轉軸而水平旋 轉亦可。藉由抵接於基板S之邊緣的柱狀部分205 a轉動 ，每次改變與基板S之抵接部位。其結果，可以減輕由於 與基板S之邊緣接觸所產生之磨耗或損傷進而使可動銷 205惡化之程度，並可以使延長至交換可動銷2 05爲止之 壽命，並且也可以抑制由於柱狀部分205 a之磨損或損傷 而降低保持位置之精度。可動銷205之柱狀部分205a係 藉由將已知之機構例如柱狀部分205a之上部設成兩層構 造，則可以容易構成旋轉自如。 如上述般，藉由配設位置偏移防止裝置201，可以確 實防止由於叉架101之進出、退避、旋轉等之各種動作之 時所產生之加速度使得基板S橫向滑動而造成保持位置偏 移，或基板S落下之情形。因此，可以提高在真空處理系 統100中藉由搬運裝置23執行基板搬運之信賴性。再者 ，即使藉由配設位置偏移裝置201，增加搬運動作速度， 亦可以將基板S確實保持在叉架101上’故可以提高基板 搬運之生產率。 接著，針對利用本實施型態之位置偏移防止裝置201 之基板S之保持姿勢之補正功能予以說明。構成叉架1〇1 之支撐撿取器119係藉由自重或基板S之重量’向其長邊 方向彎曲，前端部之高度位置較基部側容易下降。隨著該 彎曲，被保持於叉架101之基板S之姿勢也容易傾斜。位 置偏移防止裝置201因也具有藉由使可動銷2〇5接觸於基 板S之背面，從下方支撐基板S之功能’故可以利用位置 -24- 201119913 偏移防止裝置201使基板S之保持狀態接近於水平。 第14圖係模式性表示藉由安裝在叉架101之支撐撿 取器1 1 9 (在此省略圖示）之前端側的位置防止裝置 2 0 1 A，和安裝於基部側之位置偏移防止裝置2 0 1 B而支撐 基板S之狀態。在此，以符號205 A表示前端側之位置偏 移防止裝置201 A之可動銷，以符號205B表示基部側之 位置偏移防止裝置20 1 B之可動銷。然後，將前端側之位 置偏移防止裝置201A之可動銷205A沉入時之第2高度 H2A，設定成大於基部側之位置偏移防止裝置201B之可 動銷205 B沉入時之第2高度H2B。例如，藉由將推彈位 置偏移防止裝置201 A之可動銷205 A的線圈彈簧2 07之 推彈力，設成大於推彈位置偏移防止裝置201B之可動銷 205B之線圈彈簧207之推彈力，或將可動銷20 5A形成長 於可動銷205B，則可以容易使第2高度H2A大於第2高 度 H2B。 如此一來，利用可動銷205A之第2高度H2A和可動 銷205B之第2高度H2B之差，使支撐撿取器119之彎曲 幅度相抵，可以緩和基板S之彎曲。因此，即使由於基板 S之重量或支撐撿取器119之自重，使得在支撐撿取器 1 1 9產生彎曲，而造成前端側之位置偏移防止裝置2 0 1 A 之位置較基部側之位置偏移防止裝置2 0 1 B之位置相對性 架 叉 持 保 性 定 安 勢 姿 之 平 水 於 近 接 極 以 邊 以 可 則 時 低 板 基 之 上 1* ο 1 作 elH^ 1IEU 運 搬 行 執 邊 裝 止 防 移 偏 置 位 之 側 端 r 將 係 中 圖 4 第 在 且 並 -25- 201119913 置201A之可動銷205A之第1高度H1A，設定成 側之位置偏移防止裝置201B之第1高度H1B。 以在前端側之位置偏移裝置201A中，充分確保: H1A和第2高度H2A之差分（H1A-H2A)。如此一 藉由支撐撿取器119之彎曲使得基板S之荷重集 1 0 1之前端側，亦可以確實將以第1高度Η, A突 銷2 05A確實當作制動器而發揮功能。並且，爲 用如此之位置偏移防止裝置201的基板S之保持 正效果，並不限於支撐撿取器119之基部側和前 使在支撐撿取器119之長邊方向之中間附近配置 防止裝置201亦可。 再者，在第4圖中，雖然舉出在1根之支 119之左右兩側，各安裝位置偏移防止裝置201 是即使僅在一根支撐撿取器1 1 9之單側，安裝位 止裝置2 0 1亦可。 再者，就以位置偏移防止裝置201之變形例 可以設置成將各配設有多數可動銷205之一對本 以連結的構成。例如，第1 5圖所示之位置偏移 201C係成爲具有兩個本體203，該些在連結部分 ，可以在一根支撐撿取器119之左右兩側配置可 之構成。此時，在左右之本體203之間，形成有 撐撿取器119之凹部203b。凹部203b係以對應 取器119之厚度和寬度之深度和寬度所形成。雖 此之連結部分209和凹部203b並不需要，但是 大於基部 依此，可 第1高度 來，即使 中於叉架 出之可動 了取得利 姿勢之補 端側，即 位置偏移 撐撿取器 之例，但 置偏移防 而言，亦 體203予 防止裝置 209連結 動銷205 可插入支 於支撐撿 然設置如 藉由設置 -26- 201119913 該些，於將位置偏移防止裝置2 0 1 C安裝於支撐撿 1 1 9之時，則容易執行固定或定位。即是，於將位置 防止裝置201C安裝於支撐撿取器119之時，連結 209係當作固定部而發揮功能，凹部203 b係當作定 而發揮功能。並且，連結部分209雖然可以藉由例如 體相同之材質的板材而形成，但若爲可以聯結兩個 203者時，則不管其型態爲何。 再者，本體203不一定要設成框體，亦可以例如 兩片板材來形成。 再者，位置偏移防止裝置201並不限於矩形之基 例如第1 6圖所示般，亦可以安裝於保持半導體晶圓 圓形基板S的叉架101A。並且，在第16圖中，針對 述說明內容相同之構成，賦予相同符號省略說明。 [第2實施型態] 接著，一面參照第17圖〜第22圖，針對本發明 2實施型態所涉及之位置偏移防止裝置3 0 1予以說明 先’第17圖爲放大表示位置偏移防止裝置301之外 成之斜視圖。第1 8圖爲用以說明位置偏移防止裝置 之機構的重要部位剖面圖。位置偏移防止裝置301之 構成’係具備有本體303、突出於該本體303之上面 而被設置之當作可動構件之多數塊形狀之可動銷305 使該些可動銷305各獨立朝上方向（突出之方向）推 當作推彈手段之線圈彈簧3 0 7。再者，本實施型態之 取器 偏移 部分 位部 與本 本體 藉由 板， 等之 與上 之第 。首 觀構 30 1 主要 3 03 a 、和 彈之 位置 -27- 201119913 偏移防止裝置301係補足可動銷3 05之制動器功能的塊體 309鄰接於可動銷305而被設置。並且，在第17圖中， 雖然爲在本體303之3處具備有各4個的可動銷305之構 成，但是可動銷3 05之配置處或配設數量之數量並不被限 定。 在本實施型態之位置偏移防止裝置301中，本體3 03 係如第1 8圖所示般，以例如合成樹脂等之材質所構成之 板材。本體303具有安裝可動銷305之貫通開口 311。各 貫通開口 3 1 1之上部係本體3 03之一部份突出於貫通開口 311之內側而形成卡合部303b。藉由該卡合部303b貫通 開口 311之開口面積變窄。並且，符號303c爲用以將本 體3 03安裝於支撐撿取器1 19之螺絲孔。 各貫通開口 3 1 1內，各配置有4組之可動銷3 0 5及線 圈彈簧3 07。可動銷3 05係構成C字形（淺盤子翻面之剖 面形狀），具備有抵接於基板S之下面或端部之部分的基 板支撐部3 05 a，和該基板支撐部3 05 a之兩端向外側彎曲 而形成之彎曲部305b。可動銷3 05之基板支撐部3 05a係 被插通於各貫通開口 311之對向的卡合部303b之間。在 可動銷305之基板支撐部305a之下面之略中央，設置有 彈簧承接用之凹部305c。再者，在各貫通開口 311之下 端搭架有台座部313。台座部313係藉由無圖示之嵌合機 構而可裝卸地固定於本體303。該台座部313設置有彈簧 承接用之凹部3 1 3 a。 可動銷305之基板支撐部3 05 a和彎曲部3 05b即使以 -28- 201119913 不同構件形成亦可’但以相同材質形成一體爲佳。可動銷 305之材質雖然並不特別限定，但是至少可動銷305之基 板支撐部3 05 a因接觸於基板s之背面或端部，故例如藉 由合成樹脂或橡膠等之材料形成爲佳。再者，可動銷305 之基板支撐部3 05a係以具有僅能擋住基板S之端部的剛 性和韌性爲佳。由上述情形可知，作爲可動銷3 0 5之材料 ，以使用例如 PEEK((聚酸醚酮：Polyetheretherketone )樹脂、PTFE (聚四氟乙稀：Polytetrafluoroethylene) 樹脂等之合成樹脂爲佳。 並且，可動銷305之形狀並非藉由第17圖及第18圖 等所例示之形狀而受到任何限制者。 線圈彈簧3 07係將可動銷3 05推彈至上方向而使可動 銷305之基板支撐部305a之上部從本體303之上面303a 突出之狀態的推彈手段。線圈彈簧3 07之上端係抵接於可 動銷305之基板支撐部3 05a之下面之彈簧承接用之凹部 305c，線圏彈簧307之下端係抵接於台座部313之彈簧承 接用之凹部3 1 3 a。線圈彈簧3 07即使因應所需以任意方 法固定亦可。並且，就以彈推可動銷3 05之彈推手段而言 ，並非限定於線圈彈簧3 07，例如可以使用板狀彈簧等。 在位置偏移防止裝置301中，多數可動銷305係藉由 基板S之荷重，而被構成可以各個獨力上下移位。即是， 可動銷305係獨立朝與基板S之面方向正交之方向突出， 或退避。朝向第1 8圖之紙張左側之可動銷3 0 5表示接受 荷重而沉入之狀態，右側之可動銷3 05係表示朝向上方而 -29- 201119913 被推彈之非荷重狀態（基板S省略圖示）。即是，在 受基板S之荷重之狀態下，可動銷3 05係藉由線圏 307而被推彈至上方向，被插通於貫通開口 311之可 305之基板支撐部305a之上部係從本體3 03之上面 朝向上方突出。此時，以本體3 03之上面3 03 a爲基 將可動銷305之前端之突出量設爲第1高度H!。再 在不承受荷重之狀態下，藉由線圈彈簧3 07而被推彈 動銷3 05之彎曲部3 05b被推壓至貫通開口 311之卡 3 03b。彎曲部3 05b係當作用以規定第1高度H,之制 而發揮功能。 藉由叉架101接取基板S，在任意之可動銷3 05. 基板S之荷重的狀態下，由於荷重使得線圈彈簧3 07 ，其可動銷3 05則全體性被下壓。該移位之狀態時， 體3 03之上面3 03 a爲基準，將可動銷3 05之前端之 量設爲第2高度H2。第1高度Hi及第2高度H2係 設定成與第1實施型態相同。 在本實施型態之位置偏移防止裝置3 0 1中，將可 3 05之基板支撐部3 05 a形成C字形，形成在其內側 線圈彈簧3 0 7之構成，依此比起第1實施型態之位置 防止裝置201，可將位置偏移防止裝置301之全體高 本體303之厚度和第1高度H!之合計）抑制成小。 ，位置偏移防止裝置301可安裝於例如支撐撿取器1 上面。再者，藉由上述構成，各可動銷3 05係被設置 朝其寬度方向（排列可動銷3 05之方向）些微傾倒。 無承 彈簧 動銷 3 03 a 準’ 者， 之可 合部 動器 施加 壓縮 以本 突出 可以 動銷 收容 偏移 度（ 因此 19之 成可 -30- 201119913 塊體3 09爲補助可動銷3 05之制動器功能之補助支撐 部。塊體3 09於基板S之邊緣抵接於可動銷3 05而施加橫 方向之力時，輔助性支撐可動銷3 0 5。即是，塊體3 09爲 當作與上述可動銷3 05合作而間接性限制基板之移動的輔 助制動器而作用者。因此，塊體3 09係與從基板S側觀看 離最遠之位置之可動銷3 05鄰接而設置。塊體3 09即使與 位置偏移防止裝置3 0 1之本體3 03 —體成形亦可，即使以 與本體3 03不同之構件來構成亦可。在本實施型態中，塊 體3 09並非可動式，爲固定式。並且，塊體3 09爲任意構 成，即使不一定設置亦可。 接著，一面參照第19圖〜第21圖，針對本實施型態 所涉及之位置偏移防止裝置3 0 1之作用予以說明。第1 9 〜21圖爲表示在支撐撿取器119之前端安裝位置偏移防 止裝置3 0 1之狀態。位置偏移防止裝置3 0 1係以例如螺絲 等之固定手段被固定在支撐撿取器119。在本實施型態之 位置偏移防止裝置301中，四個可動銷305互相接近而被 設置。在此，爲了方便說明，從支撐銷1 1 9之基部側朝前 端側依序爲可動銷 305八、3058、305(：、3050。如第19 圖所示般，在不支撐基板S之狀態下，可動銷3 05 A〜 3 05D中之任一者皆成爲第1高度H,。 第20圖爲表示在叉架101之支撐撿取器119上支撐 基板S之狀態。基板S載置於可動銷3 05A及3 05B上， 該些可動銷305 A及305 B係藉由基板S之荷重，沉入至 第2高度H2。在不載置基板S之可動銷305C、305D係直 -31 - 201119913 接保持第1高度H!。在該狀態下，當藉由叉架101搬運 基板S中，由於慣性力或離心力，使得基板S欲朝叉架 101之前端側成爲位置偏移之時，則如第21圖放大表示 般，基板S之前端側之邊緣抵接於可動銷3 05C之側部而 防止位置偏移。此時，由於可動銷3 05C和可動銷305D 之間隔窄小，被設置成可傾倒於寬度方向之可動銷3 05C 藉由鄰接之可動銷3 05D而輔助性被支撐。即是，於藉由 基板S被施加之力大之時，並非單獨可動銷305C，而係 與可動銷305C及3 05D合作而發揮當作制動器之作用。 再者，本實施型態之位置偏移防止裝置301因接近於 可動銷305D而具備有塊體309，故於藉由基板S被施加. 之力大時，可動銷305C及305D皆也與塊體309合作而 當作制動器發揮作用，可以更確實防止基板S之位置偏移 〇 如上述般，爲了使可動銷 305A、3 05B、3 05C及 305D合作而當作制動器發揮功能，以鄰接之可動銷305 之間隔接觸，或藉由橫方向之力接近至可以容易接觸之狀 態爲佳。因此，在位置偏移防止裝置3 0 1中，在貫通開口 311內，4個可動銷305A、305B、305C、305D配置成不 互相隔著間隔而相鄰爲佳。如此一來，藉由使多數可動銷 305集合配備，不僅直接抵接於基板S之可動銷305，其 他之可動銷3 05也可以間接性當作制動器而發揮功能。 再者，由同樣之觀點來看，即使針對配置在支撐撿取 器1 19之最前側的可動銷3 05D，和塊體3 09之間隔，也 -32- 201119913 以接觸，或配置成藉由橫方向之力接近至容易接觸之狀態 爲佳。 接著，針對利用本實施型態之位置偏移防止裝置3 0 1 之可動銷3 05之配置予以說明。第22圖爲表示在支撐撿 取器1 1 9之前端安裝位置偏移防止裝置3 0 1之狀態的俯視 圖。在本體303之3處，設置貫通開口 311，在各個貫通 開口 3 1 1配備有各4個的可動銷3 05。在此，爲了方便說 明，將面向第22圖之紙張左側之多數可動銷3 05從支撐 撿取器1 1 9之基部側表記成可動銷3 0 5 A 1、3 0 5 B 1、…， 將中央之多數可動銷 3 05同樣表記成可動銷 3 05A2、 3 05B2、…，將右側之多數可動銷3 05同樣表記成可動銷 305A3 、 305B3 、…。 各貫通開口 311之位置係在支撐撿取器119之長邊方 向逐漸偏移而被設置。三個塊體3 09也並非相同大小，與 可動銷305之境界之位置係以在支撐撿取器119之長邊方 向逐漸地偏移之方式，改變大小而被設置。具體而言，例 如可動銷305C1和可動銷305D1之境界，係在可動銷 3 05D2之基板支撐部3 05 a中，配置成位於其寬度方向（ 與支撐撿取器119之長邊方向相同方向）中間。再者，例 如可動銷305D2和可動銷305C2之境界，係被配置成位 於可動銷3 0 5 D 3之基板支撐部3 0 5 a之寬度方向的中間。 如此一來，藉由在支撐銷119之長邊方向依序逐漸（ 例如每次1/2螺距）使位置偏移而配置可動銷305，可以 抑制自基板S之初期之支撐位置的位置偏移量。即是，假 -33- 201119913 設在可動銷305A3上載置基板S之邊緣，< 成爲第2高度H2之時，即使在搬運中基板 移，基板S之邊緣抵接於以第1高度H! 3 05 A2之側面，限制其以上之移動。設置有 和可動銷3 05 A2之位置之差，因爲基板支g 度1 /2，故可以將基板S之位置偏差量即使 制在基板支撐部3 05a之寬度之1/2以內。 銷305A2上載置基板S之邊緣，藉由可動; 基板S之移動之時，基板S之位置偏移量， 以抑制在基板支撐部3 05a之寬度之1/2以 ，比起將可動銷3 05之配置整齊排成橫一列 取器119之長邊方向依序逐漸偏移螺距而配 如上述般，在本實施型態之位置偏移防 ，因設成一個至多數可動銷 305，又因應 309來限制基板S之移動的構成，故可以 101上之基板S的位置偏移，並且可以使基 移量成爲微量。再者，藉由在支撐撿取器1 依序逐漸使位置偏移而配置可動銷3 05’可 位置偏移量成爲極少。 本實施型態中之其他構成及效果則與第 同。並且，位置偏移防止裝置301並不限定 1 1 9之前端，亦可以安裝於側部（例如，支 之前端側之側部或基部側之側部）。 以上，雖然敘述本發明之實施型態’ 堇可動銷305A S產生位置偏 突出之可動銷 可動銷305A3 I部3 05 a之寬 最大也可以抑 同樣，在可動 瞎3 0 5 A 1限制 即使在大亦可 內。如此一來 ，以在支撐撿 置爲佳。 制裝置3 0 1中 所需加上塊體 確實防止叉架 板S之位置偏 19之長邊方向 以使基板S之 1實施型態相 於支撐撿取器 撐撿取器1 19 .是本發明並未 -34- 201119913 限定於上述實施型態’當然可作各種之變形。例如，在上 述實施型態中’雖然舉出在真空狀態下執行基板s之搬運 的搬運裝置23之例予以說明’但是位置偏移防止裝置 2 Ο 1、3 0 1，係亦可適用於在大氣壓狀態下執行基板之搬運 的搬運裝置1 5。如搬運裝置1 5般，於適用於大氣壓狀態 下之搬運時，亦可以採用使用例如被壓力調節之空氣、高 黏性之油等之流體的機構，以當作推彈位置偏移防止裝置 201、301之可動銷205、305之推彈手段。 再者’可使用本發明之基板保持具之基板搬運裝置之 構成’並不限定於配備於上下兩段之滑動臂式，即使以一 段構成或三段構成亦可’並不限於滑動式，即使爲例如多 關節臂式之基板搬運裝置亦可。 再者，位置偏移防止裝置201、301並不限定於以 FPD製造用之基板爲搬運對象之基板保持具，亦可以適用 於以例如太陽電池用之基板等之各種用途之基板做爲搬運 對象之基板保持具。 【圖式簡單說明】 第1圖爲槪略性表示真空處理系統之斜視圖。 第2圖爲第1圖之真空處理系統的俯視圖。 第3圖爲說明搬運裝置之槪略構成的斜視圖。 第4圖爲表不叉架之槪略構成之斜視圖。 第5圖爲表示本發明之第1實施型態之位置偏移防止 裝置之外觀構成的斜視圖。 -35- 201119913 第6圖爲位置偏移防止裝置之重要部位剖面圖。 第7圖爲位置偏移防止裝置之另外狀態的重要部位剖 面圖。 第8圖爲說明將基板載置於安裝有位置偏移防止裝置 之叉架上之狀態的圖面。 第9圖爲說明將基板載置於安裝有位置偏移防止裝置 之叉架上之另外狀態的圖面。 第10圖爲說明將基板載置於安裝有位置偏移防止裝 置之叉架上之又一另外狀態的圖面。 第1 1圖爲說明位置偏移防止裝置之配置例的圖面。 第12圖爲說明位置偏移防止裝置之另外配置例的圖 面。 第1 3圖爲說明可動銷之構成例的斜視圖。 第Μ圖爲說明藉由位置偏移防止裝置補正基板姿勢 之狀態的圖面。 第15圖爲表示變形例之位置偏移防止裝置之外觀構 成之斜視圖。 第1 6圖爲說明將位置偏移防止裝置適用於圓形基板 之狀態的圖面。 第17圖爲放大表示本發明之第2實施型態之位置偏 移防止裝置之外觀構成的斜視圖。 第18圖爲第17圖之位置偏移防止裝置301之重要部 位剖面圖。 第19圖爲表示在支撐撿取器之前端安裝位置偏移防 -36- 201119913 止裝置之狀態的圖面。 第20圖爲說明將基板載置於安裝有位置偏移防止裝 置之支撐撿取器上之狀態的圖面。 第21圖爲說明藉由可動銷之制動器作用的圖面。 第22圖爲表示在支撐撿取器之前端安裝位置偏移防 止裝置之狀態的俯視圖。 【主要元件符號說明】 la、lb、lc:製程腔室 3:搬運室 5 :裝載鎖定室 100: 真空處理系統 101 :叉架 117： 撿取器基台 1 1 9 :支撐撿取器 201 : 位置偏移防止裝置 203 :本體 205 ： 可動銷 2〇5a :柱狀部分 205b :凸緣 207 :線圈彈簧 2 11： 隔牆 2 1 3 :室部 2 13a :底壁 2 13b :頂棚部 2 13c :開口部 S :基板 37-Polyetheretherketone resin, PTFE (polytetrafluoroethylene) resin and other elastic materials. Regardless of the shape of the support protrusion 200, it may be a ring shape such as a hemispherical or 〇-shaped ring. Further, although the support protrusion 200 abuts against the back surface of the substrate S and the holding force of the substrate S on the yoke 101 is increased by the frictional force, the substrate S is surely held on the fork by the positional displacement preventing means 201. Since the support 101 is not necessarily provided, the support protrusion 200 is not necessarily provided. On the fork frame 101, the positional deviation preventing means 201 is mounted at an arbitrary number in an arbitrary number. In Fig. 4, a state in which a pair of right and left positional deviation preventing means 20 1 are attached to each of the base portions of the two support ejector 119 at both ends of the four ends is shown. Further, in Fig. 4, another pair of positional deviation preventing means 201 before being mounted is also illustrated. As a result, the positional deviation preventing device 201 is detachably attached to the support ejector 1 1 1 constituting the yoke 101. The detailed configuration of the positional deviation preventing device 20 1 will be described. Fig. 5 is a perspective view showing an enlarged configuration of the positional deviation preventing device 201 in an enlarged manner. 6 and 7 are cross-sectional views of important parts for explaining the mechanism of the positional deviation preventing device 201. The main structure -15-201119913 of the positional deviation preventing device 20 1 is provided with a plurality of movable pins 205 having a body 203 protruding from the upper surface 203a of the body 203 and serving as a movable member, and the movable pins 205 2 05 Each of the independent upward directions (the direction of the protrusion) pushes the bobbin 207 as a pushing means. In the positional deviation preventing device 201 of the present embodiment, the main body 203 is a frame made of a material such as aluminum or synthetic resin as shown in Fig. 5. In the state in which the position pick-up prevention device 201 is mounted by the support picker 19, the upper surface 203a of the main body 203 is preferably the same height as the upper surface of the support gripper 119. Further, in Fig. 5, the main body 203 is provided with seven movable pins 205, but the number of movable pins 205 is not limited. As shown in Figs. 6 and 7, the inside of the body 203 is partitioned into individual chamber portions 213 by partition walls 211. Each of the chamber portions 213 has a bottom wall 213a and a ceiling portion 213b. Each of the chamber portions 213 houses a set of movable pins 205 and coil springs 207. The movable pin 205 is provided with a columnar portion 205a having a portion "projecting from the upper surface 203a of the main body 203", and a flange 205b having a diameter larger than that of the columnar portion 205a on the way of the columnar portion 205a. This flange 205b functions as a spring seat. The upper portion of the movable pin 205 is inserted into the opening portion 213c of each of the ceiling portions 213b of each of the chamber portions 213. The columnar portion 205a and the flange 205b of the movable pin 205 may be integrally formed of the same material, and may be formed of different members. The material of the movable pin 205 is not particularly limited, but at least the upper portion of the columnar portion 20 5a of the movable pin 205 is in contact with the back surface or the end portion of the substrate S, and thus, for example, 16-201119913 is made of synthetic resin or rubber. Material formation is preferred. Of course, even if the same material (synthetic resin, rubber, etc.) is used to form the entirety of the movable pin 205. Further, it is preferable that the upper portion of the columnar portion 205a of the movable pin 205 has rigidity and toughness which can only block the end portion of the substrate S. As described above, as the material of the movable pin 205, a synthetic resin such as PEEK (Polyetheretherketone) resin or PTFE (polytetrafluoroethylene) resin is preferably used. Further, in the present invention, the shape of the movable member is not limited by the shape of the movable pin 205 shown in Figs. 6 and 7. For example, the columnar portion 205a of the "protruding portion" of the movable member is not limited to the cylindrical shape as shown in the figure, and even if it is a polygonal column having a polygonal cross section of a triangle, a quadrangle, a pentagon, a hexagon, an octagon or the like, can. Further, the entire or protruding portion of the movable member may have a hollow cylindrical shape or a hollow cylindrical shape having a polygonal shape such as a triangle, a quadrangle, a pentagon, a hexagon, or an octagon. Further, the entire or protruding portion of the movable member may be formed into a plate shape (for example, a gusset shape, a disk shape, or the like). Further, from the viewpoint of reducing the contact area with the back surface of the substrate S, although not shown, the front end of the movable member (the movable pin 205) may be rounded. The coil spring 207 is a pushing means for pushing the movable pin 205 upward in the upward direction to project the upper portion of the columnar portion 205a from the upper surface 203a of the body 203. The lower portion of the cylindrical portion 205a of the movable pin 205 is inserted into the coil spring 207. The lower end of the coil spring 207 is fixed to the bottom wall 2 1 3 a of the chamber portion 2 1 3 by any method such as a brake pin or the like. Coil Bomb -17- 201119913 The upper end of the spring 207 abuts against the flange 205b of the movable pin 205, and can be fixed by any method even if necessary. In the positional deviation preventing device 201, the plurality of movable pins 205 are configured to be vertically movable by the respective sole forces by the load of the substrate S. That is, the movable pin 205 is independently protruded or retracted in a direction orthogonal to the surface direction of the substrate S. In a state where the load of the substrate S is not received, the movable pin 205 is pushed upward by the coil spring 207 engaged with the flange 2〇5b. Therefore, it is inserted into the upper portion of the columnar portion 205 a of the movable pin 205 provided in the opening 213c of the ceiling portion 213b, and protrudes upward from the upper surface 203a of the body 203. At this time, the amount of protrusion in which the front end of the movable pin 205 protrudes toward the upper surface 203a is set as the first height H! with reference to the upper surface 203a of the main body 203. Further, in a state where the load is not applied, the flange 205b of the movable pin 205 which is pushed by the coil spring 2?7 is pressed to the ceiling portion 213b of the chamber portion 213. The flange 205b can be utilized as a brake for defining the first height. The first height Hi can be arbitrarily set by an adjustable structure in which the position of the flange 205b in the columnar portion 205a of the movable pin 205 can be changed. In the adjustable structure in which the position of the flange 205b can be changed, the illustration is omitted, but the columnar portion 205 a is configured as an external screw structure, and the flange 205 b is used as an internal screw structure. . When the substrate S is picked up by the fork 101, and the load of the substrate S is applied to any of the movable pins 205, the coil spring 207 is compressed by the load, and the movable pin 205 is pressed down in its entirety. In the shifted state, the amount of protrusion from the front end of the movable pin 205 to the upper surface -18-201119913 2〇3a is set to the second height H2 based on the upper surface 203a of the body 203. As shown in Fig. 6 and Fig. 7, only the movable pin 205 on which the substrate S is placed is sunk to become the second height H2, and the movable pin 205 on which the substrate S is not placed can maintain the first height H as it is. ,. Then, by the side portion of the movable pin 205 in a state in which the first height Hi is protruded, the movement of the substrate S in the lateral direction can be restricted. For example, in Fig. 6, the two movable pins 205 facing the left side and the center of the paper sink into the second height H2 due to the weight of the substrate S, and one movable pin 205 facing the right side of the paper protrudes at the first height H! . At the first height H, the movable pin 205 on the right side of the protrusion serves as a brake to restrict the movement of the substrate S. Further, in Fig. 7, one of the movable pins 205 facing the left side of the paper sinks into the second height H2 due to the weight of the substrate S, and the two movable pins 205 facing the right side and the center of the paper are at the first height Η. protruding. At this time, the projecting movable pin 220 in the center serves as a brake to restrict the movement of the substrate S. Further, in Figs. 6 and 7, the movable pin 205 and the substrate S which are the first heights of the task of the brake are not in contact with each other. When the substrate S is laterally slid on the fork frame 1〇1 due to the acceleration during transportation, since the end portion of the substrate S abuts against the movable pin 205 serving as the brake, the substrate S is on the fork 101. The amount of movement on it is extremely small. As a result, the end portion (edge) of the substrate S abuts against the side portion of the movable pin 205 protruding at the first height, thereby restricting the lateral movement of the substrate s on the yoke 101 to a minimum, thereby preventing the handling The substrate s is displaced in the horizontal direction on the yoke 101, and is dropped from the yoke 101 -19 " 201119913 The second height H2 is set lower than the first height H1. The first H2 is zero (that is, the front end of the movable pin 205 is at the same height as the main body 203 203a) and the first height H is equal to or lower than the first height H. In particular, the degree H2 is set to be larger than zero, and the front end of the movable pin at the second height H2 is preferably located between the first height I and the upper surface 203a of the body 203. As a result, since the substrate S can be moved by the movable pin 205 in a state in which the load of the substrate S is raised to the second height H2, it is possible to avoid the adverse effect on the electric power formed on the surface of the substrate S as much as possible. Further, it is preferable that the first height and the second height 112, -, -H2) are set to be equal to or greater than the thickness of the substrate S. In this way, the movable height of the brake that restricts the movement of the substrate S can be sufficiently obtained, and the substrate S can be supported by the front end of the pin 205 at the second height H2, and the movable pin 205 can be in the state of the first height. The second height H2 that reliably limits the horizontal direction of the substrate S can be adjusted by the length of the columnar portion of the movable pin 205 or the elastic force of the coil spring 207 against the load of the substrate S. Further, in the case of the spring pushing means for pushing the movable pin 205, the coil spring 207 is set, and for example, a plate spring or the like can be used. The holding position of the substrate S on the yoke 101 is somewhat different for each substrate due to the positional shift or the like due to the receipt. For example, as shown in the figure, the edge of the substrate S is positioned such that the edge of the substrate S is held at the front end of the yoke 101 (supporting the picker 119). As shown in Fig. 9, there is also a substrate S. The position of the edge, the height above the 2nd level is 205, and the moving end supports the sub-part difference (-, the movable I of the pin 205 protrudes. The size of the sub-205a is not limited to the position of the 8th. The position of the figure is maintained on the base side of the fork 1 〇1 (indicated by an arrow), and 'there is also a substrate S to the yoke 101 (as shown in Fig. 10). The longitudinal direction of the support gripper 119) is inclined while holding the angle (slightly rotated in the horizontal direction as indicated by the arrow). The positional deviation preventing device 201 has a large load due to the substrate S. The movable pin 205 is independently advanced and retracted, so that it can flexibly correspond to any of the holding positions illustrated in FIGS. 8 to 10, and the movement of the substrate S can be surely restricted. That is, even if the position of each substrate S is slightly different, the position is different. The offset prevention device 2〇1 also corresponds to the It is the first height Η ! protruding movable pin 2 0 5 as a task of the brake. Therefore, even in any holding position, the movement of the substrate S can be restricted, and the positional shift can be suppressed to a minimum. When the positional deviation preventing means 20 is disposed, or the number of the movable pins 205 in the positional deviation preventing means 201 is increased, and the arrangement of the movable pin 205 is made compact, the movement of the substrate S can be more precisely restricted. In this manner, the positional deviation preventing device 201 is detachably attached to the support gripper 119 constituting the fork 101. The fixing method of the positional shift preventing device 20 1 is not particularly limited. For example, the body 203 of the positional deviation prevention device 201 can be fixed at the position of the support gripper 1 19 by means of a detachable fixing means such as the engagement or insertion of a screw and a nut. At this time, the fixing buckle is used even if it is required. An auxiliary fixture such as a piece may be used. Further, the positional deviation preventing position 201 may not be detachably attached to the support gripper 119, and may be, for example, bonded. The method is fixed to the support picker 119°-21-201119913 The number of positional displacement preventing devices 201 mounted on one of the forks 101 can take into consideration the size of the substrate s or the yoke 101, the direction in which a large acceleration is applied during the transport operation, and the like. The positional deviation preventing device 201 can be mounted, for example, at 2 to 12 of the fork frame 101, preferably at 4 to 8. The positional deviation preventing device 201 can be disposed only on, for example, the fork 101. 9 is the front end side or only the base side. However, from the viewpoint of surely restricting the movement of the substrate S, it is set to be movable as a brake so as to sandwich the substrate S held by the fork 1〇1 in the middle. It is preferable that the pin 205 is abutted against the arrangement of the opposite sides of the substrate S. Further, the positional shift prevention position 201 is preferably arranged such that the centers of the substrates S are mutually paired, and it is more preferable to arrange them in the vicinity of the corners of the substrate S. 11 and 12 show a preferred arrangement example of the positional deviation preventing means 201. In Fig. 11, the positional deviation preventing means 201 is attached to the short side SS which is superposed on the two sides of the substrate S from below. Accordingly, the movement of the substrate S in the longitudinal direction of the support gripper 119 is mainly restricted. In the fork frame 101, the position of the positional deviation preventing means 201 is mounted so as to avoid the portion of the electronic component (the device forming region) on which the holding substrate S is formed, preferably outside the device forming region. In Fig. 11, the device forming region R on the substrate S is drawn in a broken line. The positional deviation preventing device 20 1 is attached to 8 of the forks 101 so as to be located outside the device forming region R. In this way, by disposing the positional shift preventing means 209 on the outer side of the apparatus forming region R, it is possible to prevent electrostatic damage when the movable pin 205 contacts/leaves the back side of the substrate S, and is formed on the surface side. The situation in which electronic parts cause bad effects. -22-201119913 Further, as shown in Fig. 12, the arrangement in which the positional shift preventing means 012 overlaps the four corners of the substrate S is more preferable. According to this configuration, since the substrate S can be standardized from the four directions, not only the substrate S is restricted from moving in the longitudinal direction of the support gripper Π 9, but also the substrate S is restricted from moving in the direction of the cross-supporting gripper 119. Or the movement of the substrate S in the horizontal direction or the like can more reliably prevent the positional shift. Further, in the example of Fig. 12, the four positional deviation preventing means 201, which are disposed at positions overlapping the corners of the substrate S, are more movable than the four positional deviation preventing means 201 disposed at other positions. The number of pins 205. Specifically, the four positional deviation preventing devices 20 1 disposed at positions overlapping the corners of the base plate S have 11 movable pins 205. Further, the positional deviation preventing means 20 1 is disposed on the opposite side (inside) of the support gripper 1 1 1 so as to be opposed to the positional deviation preventing means 201 disposed at the corners of the fourth side of the substrate S. Each of the seven movable pins 205. As a result, the number of movable pins 2〇5 can be changed in accordance with the place or the number of configurations of the positional deviation preventing device 201. Further, from the comparison of Fig. 11 and Fig. 12, it can be understood that the mounting position of the positional deviation preventing means 201 in the support pin 119 can be changed in accordance with the size of the substrate S even if the size of the substrate S is changed. Therefore, regardless of the size of the substrate S, it is possible to surely prevent the positional shift on the fork frame. The positional deviation preventing means 201 can change the number or arrangement interval of the movable pin 205, the first height H, the second height H2, etc., depending on the portion to be mounted, even when it is attached to one of the forks 101. Further, the columnar portion 2 0 5 a of the movable pin 2 0 5 may be horizontally rotated as a rotation axis as shown in Fig. -23-201119913. The abutting portion with the substrate S is changed each time by the rotation of the columnar portion 205a abutting on the edge of the substrate S. As a result, the degree of deterioration of the movable pin 205 due to wear or damage caused by contact with the edge of the substrate S can be reduced, and the life until the exchange of the movable pin 205 can be extended, and the columnar portion 205 can also be suppressed. a wear or damage of a reduces the accuracy of the holding position. The columnar portion 205a of the movable pin 205 can be easily rotatably constructed by forming a known mechanism such as an upper portion of the columnar portion 205a in two layers. As described above, by disposing the positional shift preventing device 201, it is possible to surely prevent the acceleration caused by the various operations such as the movement, the retraction, the rotation, and the like of the fork 101, causing the substrate S to slide laterally to cause the positional shift. Or the case where the substrate S falls. Therefore, the reliability of performing substrate transportation by the transport device 23 in the vacuum processing system 100 can be improved. Further, even if the positional displacement device 201 is disposed and the conveyance speed is increased, the substrate S can be surely held on the fork 101. Therefore, the productivity of the substrate conveyance can be improved. Next, the correction function of the holding posture of the substrate S by the positional deviation preventing device 201 of the present embodiment will be described. The support gripper 119 constituting the fork frame 1〇1 is bent in the longitudinal direction by the weight or the weight of the substrate S, and the height position of the front end portion is liable to lower than that of the base portion side. With this bending, the posture of the substrate S held by the yoke 101 is also easily inclined. The positional deviation preventing device 201 also has a function of supporting the substrate S from below by bringing the movable pin 2〇5 into contact with the back surface of the substrate S. Therefore, the substrate S can be held by the offset preventing device 201 by the position-24-201119913. The state is close to the level. Fig. 14 is a view schematically showing the position preventing means 2 0 1 A on the front end side and the positional displacement on the base side by the support gripper 1 1 9 (not shown here) attached to the fork frame 101 The state of the substrate S is supported by the device 2 0 1 B. Here, the movable pin of the positional deviation preventing means 201A on the distal end side is indicated by reference numeral 205A, and the movable pin of the positional deviation preventing means 20 1B on the base side is indicated by reference numeral 205B. Then, the second height H2A when the movable pin 205A of the positional deviation preventing device 201A on the front end side is sunk is set to be larger than the second height H2B when the movable pin 205 B of the positional deviation preventing device 201B on the base side sinks. . For example, by pushing the elastic force of the coil spring 207 of the movable pin 205 A of the push position shift preventing device 201 A, the pushing force of the coil spring 207 larger than the movable pin 205B of the push position shift preventing device 201B is set. Alternatively, if the movable pin 20 5A is formed longer than the movable pin 205B, the second height H2A can be easily made larger than the second height H2B. In this manner, by the difference between the second height H2A of the movable pin 205A and the second height H2B of the movable pin 205B, the bending width of the support gripper 119 is offset, and the bending of the substrate S can be alleviated. Therefore, even if the weight of the substrate S or the self-weight of the support gripper 119 causes the support gripper 1 19 to be bent, the positional displacement preventing means 2 0 1 A of the front end side is positioned closer to the base side than the base side. The position of the offset prevention device 2 0 1 B is relative to the position of the fork. The flat water of the fixed position is close to the pole and the upper side of the plate is 1* ο 1 for the elH^ 1IEU. The side end r of the shift prevention offset is set to the first height H1A of the positional displacement preventing means 201B on the side of the side, and the first height H1A of the movable pin 205A of Fig. 4 is set to be -25-201119913. In the position shifting device 201A on the distal end side, the difference (H1A-H2A) between H1A and the second height H2A is sufficiently ensured. Thus, by supporting the bending of the gripper 119 so that the load of the substrate S is concentrated on the front end side of the 1 0 1 , it is possible to surely function as the brake at the first height Η and the A projection 205A. Further, in order to maintain the positive effect of the substrate S of the positional displacement preventing device 201, it is not limited to the base side of the support gripper 119 and the front side is disposed adjacent to the middle of the longitudinal direction of the support gripper 119. 201 is also possible. Further, in Fig. 4, the mounting positional deviation preventing means 201 is mounted on the left and right sides of the one of the support members 119, even on only one side of one of the support grippers 1 1 9 The stop device 2 0 1 can also be used. Further, in the modification of the positional deviation preventing device 201, it is possible to provide a configuration in which one of the plurality of movable pins 205 is disposed to be connected to each other. For example, the positional offset 201C shown in Fig. 15 has two main bodies 203 which may be disposed on the left and right sides of one of the support grippers 119. At this time, a concave portion 203b of the struts 119 is formed between the left and right bodies 203. The recess 203b is formed with a depth and a width corresponding to the thickness and width of the extractor 119. Although the connecting portion 209 and the recessed portion 203b are not required, the base portion may be larger than the base portion, and the positional offset struts may be obtained even if the fork is movable to obtain the complementary side of the profit posture. For example, in the case of the offset prevention, the body 203 prevents the device 209 from being coupled to the movable pin 205 and can be inserted into the support. The setting is as shown in Fig. -26-201119913, and the positional deviation preventing device 2 0 1 When C is mounted on the support 捡1 19, it is easy to perform fixing or positioning. That is, when the position preventing device 201C is attached to the support gripper 119, the connection 209 functions as a fixed portion, and the concave portion 203b functions as a fixed portion. Further, the connecting portion 209 may be formed of, for example, a plate material of the same material, but if it is possible to couple the two 203, it is regardless of its type. Further, the body 203 does not have to be provided as a frame, and may be formed, for example, as two sheets. Further, the positional deviation preventing means 201 is not limited to a rectangular base. For example, as shown in Fig. 16, it may be attached to the fork 101A holding the semiconductor wafer circular substrate S. In the sixteenth embodiment, the same components are denoted by the same reference numerals, and the description thereof will be omitted. [Second Embodiment] Next, the positional deviation preventing device 3 0 1 according to the second embodiment of the present invention will be described with reference to FIGS. 17 to 22, and the first FIG. 17 is an enlarged view of the positional shift. The oblique view of the device 301 is prevented. Fig. 18 is a cross-sectional view showing important parts of the mechanism for explaining the positional deviation preventing device. The configuration of the positional deviation preventing device 301 is provided with a main body 303 and a movable pin 305 which is provided on the upper surface of the main body 303 and which is provided as a movable member in a plurality of block shapes so that the movable pins 305 are each independently oriented upward ( The direction of the protrusion is pushed as a coil spring of the push means 3 0 7 . Furthermore, the shifter portion of the present embodiment is offset from the body by the board, and the like. The first structure 30 1 main 3 03 a , and the position of the bullet -27- 201119913 The offset preventing device 301 is provided adjacent to the movable pin 305 by the block 309 which complements the brake function of the movable pin 305. Further, in Fig. 17, although the configuration of each of the four movable pins 305 is provided at three places of the main body 303, the number of the positions or the number of the movable pins 305 is not limited. In the positional deviation preventing device 301 of the present embodiment, the main body 303 is a plate material made of a material such as synthetic resin as shown in Fig. 18. The body 303 has a through opening 311 in which the movable pin 305 is mounted. One of the upper main bodies 303 of each of the through openings 3 1 1 protrudes from the inner side of the through opening 311 to form an engaging portion 303b. The opening area of the opening 311 through the engaging portion 303b is narrowed. Further, reference numeral 303c is a screw hole for attaching the body 303 to the support gripper 1 19. Four sets of movable pins 305 and coil springs 307 are disposed in each of the through openings 3 1 1 . The movable pin 3 05 is formed into a C-shape (a cross-sectional shape of a shallow plate turned surface), and is provided with a substrate supporting portion 305 a having a portion abutting the lower surface or the end portion of the substrate S, and two of the substrate supporting portions 305 a The bent portion 305b is formed by bending the end side outward. The substrate supporting portion 3 05a of the movable pin 3 05 is inserted between the opposing engaging portions 303b of the respective through openings 311. A recess 305c for spring receiving is provided at a slightly lower center of the lower surface of the substrate supporting portion 305a of the movable pin 305. Further, a pedestal portion 313 is placed at the lower end of each of the through openings 311. The pedestal portion 313 is detachably fixed to the main body 303 by a fitting mechanism (not shown). The pedestal portion 313 is provided with a recess 3 1 3 a for spring receiving. The substrate supporting portion 3 05 a and the curved portion 3 05b of the movable pin 305 may be formed by different members of -28-201119913, but it is preferable to form the same material integrally. The material of the movable pin 305 is not particularly limited, but at least the substrate supporting portion 305 a of the movable pin 305 is in contact with the back surface or the end portion of the substrate s. Therefore, it is preferably formed of a material such as synthetic resin or rubber. Further, the substrate supporting portion 305a of the movable pin 305 preferably has rigidity and toughness which can only block the end portion of the substrate S. From the above, it is understood that as the material of the movable pin 350, a synthetic resin such as PEEK (polyetheretherketone resin or PTFE (polytetrafluoroethylene) resin) is preferably used. The shape of the pin 305 is not limited by the shape illustrated in Figures 17 and 18. The coil spring 3 07 pushes the movable pin 3 05 upward to the substrate supporting portion 305a of the movable pin 305. The upper portion is protruded from the upper surface 303a of the main body 303. The upper end of the coil spring 307 abuts against the recess 305c for spring receiving under the substrate supporting portion 305a of the movable pin 305, and the lower end of the coil spring 307 It is abutted against the recessed portion 3 1 3 a for the spring receiving portion of the pedestal portion 313. The coil spring 3 07 can be fixed by any method even if it is required, and, in terms of the elastic pushing means of the movable push pin 3 05, The coil spring 307 is not limited to the coil spring 307. For example, a plate spring or the like can be used. In the positional deviation preventing device 301, the plurality of movable pins 305 are configured to be loaded by the substrate S. That is, the movable pin 305 is independently protruded or retracted in a direction orthogonal to the surface direction of the substrate S. The movable pin 305 toward the left side of the paper of Fig. 8 indicates a state in which the load is received and sinks, and the right side The movable pin 3 05 indicates a non-load state in which the -29-201119913 is pushed upward (the substrate S is omitted). That is, the movable pin 305 is connected by the wire in a state of being loaded by the substrate S. The upper side of the substrate supporting portion 305a of the 305 which is inserted through the through opening 311 protrudes upward from the upper surface of the main body 303. At this time, the upper surface of the main body 303 is 3 03 a. The protrusion amount of the front end of the movable pin 305 is set to the first height H!. Further, the bending portion 3 05b of the spring pin 3 05 is pushed to the through by the coil spring 3 07 without receiving the load. The card 3 03b of the opening 311. The bending portion 3 05b functions as a system for defining the first height H. The substrate S is taken up by the fork 101, and the movable substrate 3 05. In the state, due to the load, the coil spring 3 07 and its movable pin 3 05 are all In the state of the displacement, the upper surface 3 03 a of the body 303 is used as a reference, and the amount of the front end of the movable pin 3 05 is set to the second height H2. The first height Hi and the second height H2 are set to In the positional deviation preventing device 301 of the present embodiment, the substrate supporting portion 305 a of the 305 is formed into a C shape, and the inner coil spring 307 is formed. In this way, the position preventing device 201 of the first embodiment can suppress the thickness of the entire height body 303 of the positional deviation preventing device 301 from the total height H!. The positional deviation preventing means 301 can be mounted, for example, on the support gripper 1. Further, with the above configuration, each of the movable pins 305 is set to be slightly tilted in the width direction (the direction in which the movable pins 305 are arranged). Without the spring-loading pin 3 03 a quasi-', the collapsible part of the actuator can be compressed so that the protrusion can be used to accommodate the offset (so 19 can be -30- 201119913 block 3 09 is the auxiliary actuator 3 05 brake The auxiliary supporting portion of the function. When the edge of the substrate S abuts against the movable pin 305 and the force in the lateral direction is applied, the auxiliary supporting movable pin 3 0 5 is used. The movable pin 305 cooperates to indirectly restrict the movement of the auxiliary brake of the substrate. Therefore, the block 309 is disposed adjacent to the movable pin 3 05 which is the farthest position viewed from the side of the substrate S. The block 3 is provided. 09 may be formed separately from the body 3 03 of the positional deviation preventing device 301, even if it is formed of a member different from the body 303. In the present embodiment, the block 309 is not movable. In addition, the block body 3 09 has an arbitrary configuration, and it is not necessarily provided. Next, the positional deviation preventing device 3 0 1 according to the present embodiment will be described with reference to FIGS. 19 to 21 . The role is explained. Figures 19 to 21 show The position of the positional deviation preventing means 301 is attached to the front end of the support gripper 119. The positional deviation preventing means 301 is fixed to the support ejector 119 by a fixing means such as a screw. In the present embodiment In the positional deviation preventing device 301, the four movable pins 305 are disposed close to each other. Here, for convenience of explanation, the movable pins 305, 3058, and 305 are sequentially arranged from the base side to the front end side of the support pin 1 19 ( :, 3050. As shown in Fig. 19, in the state where the substrate S is not supported, any of the movable pins 3 05 A to 3 05D becomes the first height H, and Fig. 20 is a view showing the fork. The supporting picker 119 of 101 supports the state of the substrate S. The substrate S is placed on the movable pins 305A and 305B, and the movable pins 305 A and 305 B are sunk to the second by the load of the substrate S. The height H2. The movable pin 305C, 305D on which the substrate S is not placed is connected to the first height H! in this state. In this state, when the substrate S is transported by the fork 101, due to inertial force or centrifugal force When the substrate S is to be displaced toward the front end side of the yoke 101, it is enlarged as shown in FIG. The edge of the front end side of the substrate S abuts against the side of the movable pin 305C to prevent positional deviation. At this time, since the interval between the movable pin 305C and the movable pin 305D is narrow, it is set to be tiltable in the width direction. The movable pin 3 05C is auxiliaryly supported by the adjacent movable pin 3 05D. That is, when the force applied by the substrate S is large, it is not the separate movable pin 305C, but cooperates with the movable pin 305C and 3 05D. And play the role of a brake. Further, since the positional deviation preventing device 301 of the present embodiment is provided with the block body 309 close to the movable pin 305D, when the force applied by the substrate S is large, the movable pins 305C and 305D are also combined with the block. The body 309 cooperates to function as a brake, and it is possible to more reliably prevent the positional deviation of the substrate S. As described above, in order to cooperate with the movable pins 305A, 3 05B, 3 05C, and 305D, it functions as a brake, and is movable adjacently. It is preferable that the pins 305 are in contact with each other or are brought close to each other by a force in the lateral direction. Therefore, in the positional deviation preventing means 301, in the through opening 311, the four movable pins 305A, 305B, 305C, and 305D are disposed so as not to be adjacent to each other with an interval therebetween. In this way, by arranging the plurality of movable pins 305 together, not only the movable pin 305 of the substrate S but also the other movable pins 305 can function indirectly as a brake. Furthermore, from the same point of view, even for the movable pin 3 05D disposed on the foremost side of the support picker 19, and the block 3 09 are spaced apart, -32-201119913 is contacted or configured to It is preferable that the force in the lateral direction is close to the state in which it is easy to contact. Next, the arrangement of the movable pin 305 of the positional deviation preventing device 3 0 1 of the present embodiment will be described. Fig. 22 is a plan view showing a state in which the positional deviation preventing means 301 is attached to the end of the support gripper 1 1 9 . At three places of the main body 303, a through opening 311 is provided, and each of the through openings 3 1 1 is provided with four movable pins 305. Here, for convenience of explanation, the plurality of movable pins 305 on the left side of the paper facing the 22nd drawing are referred to as the movable pins 3 0 5 A 1 , 3 0 5 B 1 , ... from the base side of the support gripper 1 1 9 , The majority of the movable pins 3 05 in the center are also referred to as movable pins 3 05A2 , 3 05B2 , . . . , and the plurality of movable pins 3 05 on the right side are also referred to as movable pins 305A3 , 305B3 , . The position of each of the through openings 311 is gradually displaced in the longitudinal direction of the support gripper 119. The three blocks 3 09 are also not the same size, and the position of the boundary with the movable pin 305 is set to be changed in such a manner as to gradually shift in the longitudinal direction of the support gripper 119. Specifically, for example, the boundary between the movable pin 305C1 and the movable pin 305D1 is disposed in the substrate supporting portion 305a of the movable pin 305D2 in the width direction thereof (the same direction as the longitudinal direction of the support ejector 119) intermediate. Further, for example, the boundary between the movable pin 305D2 and the movable pin 305C2 is disposed so as to be located in the middle of the width direction of the substrate supporting portion 3 0 5 a of the movable pin 3 0 5 D 3 . In this manner, by disposing the movable pin 305 in the longitudinal direction of the support pin 119 in a stepwise manner (for example, every 1/2 pitch), the positional deviation from the initial support position of the substrate S can be suppressed. the amount. That is, the false -33- 201119913 is set on the edge of the movable substrate 305A3 on which the substrate S is placed. < When the second height H2 is reached, even if the substrate is moved during transportation, the edge of the substrate S abuts on the side surface of the first height H! 3 05 A2, and the movement of the substrate is restricted. Since the difference between the position of the movable pin 3 05 A2 and the position of the movable pin 3 05 A2 is set, the positional deviation of the substrate S can be made within 1/2 of the width of the substrate supporting portion 305a. The pin 305A2 is placed on the edge of the substrate S, and is movable; when the substrate S is moved, the position of the substrate S is shifted by 1/2 of the width of the substrate supporting portion 305a, and the movable pin 3 is compared. The arrangement of the 05 is arranged neatly in the direction of the long side of the horizontal column 119, and the pitch is gradually shifted, and the position is offset as described above. Since the configuration of the movement of the substrate S is restricted by 309, the position of the substrate S on the substrate 101 can be shifted, and the amount of radical shift can be made small. Further, by disposing the movable pin 3 05' in the order in which the support gripper 1 is gradually displaced, the positional shift amount is extremely small. Other configurations and effects in this embodiment are the same as those in the first embodiment. Further, the positional deviation preventing means 301 is not limited to the front end of the 1 19, and may be attached to the side portion (for example, the side portion on the front end side or the side portion on the base side). In the above, although the embodiment of the present invention is described, the movable pin 305A S of the movable pin 305A S is positionally protruded, and the width of the movable pin 305A3 is the largest, and the width of the movable portion 305A 3 can be the same, and the movable 瞎 3 0 5 A 1 is limited even in the Large or within. In this way, it is better to support it. The required block in the device 301 does prevent the longitudinal direction of the position of the yoke plate S from being offset 19 so that the substrate S is in the form of the support slinger 1 19 . The invention is not limited to the above-described embodiment, and of course, various modifications can be made. For example, in the above-described embodiment, the example of the conveying device 23 that performs the conveyance of the substrate s in a vacuum state will be described. However, the positional deviation preventing device 2 Ο 1, 3 0 1 may be applied to A conveying device 15 that performs conveyance of a substrate in an atmospheric pressure state. As the carrier device 5, when it is applied to an atmospheric pressure state, a mechanism using a fluid such as pressure-regulated air or highly viscous oil may be employed as the push-pull positional deviation preventing means 201. 301, the movable pin 205, 305 push means. In addition, the configuration of the substrate transfer device that can use the substrate holder of the present invention is not limited to the slide arm type provided in the upper and lower stages, and the configuration may be 'not limited to a sliding type even if it is constituted by one stage or three stages, even if For example, a multi-joint arm type substrate transfer device may be used. In addition, the positional deviation preventing devices 201 and 301 are not limited to the substrate holder for transporting the substrate for FPD manufacturing, and may be applied to substrates for various applications such as substrates for solar cells. The substrate holder. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically showing a vacuum processing system. Fig. 2 is a plan view of the vacuum processing system of Fig. 1. Fig. 3 is a perspective view showing a schematic configuration of the conveying device. Fig. 4 is a perspective view showing the schematic configuration of the forkless frame. Fig. 5 is a perspective view showing the appearance of a positional deviation preventing device according to a first embodiment of the present invention. -35- 201119913 Fig. 6 is a cross-sectional view of an important part of the positional deviation preventing device. Fig. 7 is a cross-sectional view showing an important part of another state of the positional deviation preventing means. Fig. 8 is a view for explaining a state in which a substrate is placed on a fork mounted with a positional deviation preventing device. Fig. 9 is a view for explaining another state in which the substrate is placed on the fork mounted with the positional deviation preventing means. Fig. 10 is a view showing still another state in which the substrate is placed on the fork on which the positional deviation preventing means is mounted. Fig. 1 is a view for explaining an arrangement example of the positional deviation preventing device. Fig. 12 is a view for explaining another example of the arrangement of the positional deviation preventing means. Fig. 13 is a perspective view showing a configuration example of the movable pin. The figure is a drawing for explaining a state in which the position of the substrate is corrected by the positional deviation preventing means. Fig. 15 is a perspective view showing the appearance of a positional deviation preventing device according to a modification. Fig. 16 is a view for explaining a state in which the positional deviation preventing device is applied to a circular substrate. Fig. 17 is a perspective view showing, in an enlarged manner, an external configuration of a positional deviation preventing device according to a second embodiment of the present invention. Fig. 18 is a cross-sectional view showing an important portion of the positional deviation preventing device 301 of Fig. 17. Fig. 19 is a view showing the state in which the positional displacement is prevented before the support gripper is prevented from -36 to 201119913. Fig. 20 is a view for explaining a state in which a substrate is placed on a support gripper to which a positional deviation preventing device is attached. Figure 21 is a view showing the action of the brake by the movable pin. Fig. 22 is a plan view showing a state in which the positional displacement preventing means is attached to the end before supporting the picker. [Main component symbol description] la, lb, lc: process chamber 3: transfer chamber 5: load lock chamber 100: vacuum processing system 101: fork frame 117: skimmer base 1 1 9 : support picker 201: Position offset preventing means 203: body 205: movable pin 2〇5a: columnar portion 205b: flange 207: coil spring 2 11: partition wall 2 1 3 : chamber portion 2 13a: bottom wall 2 13b: ceiling portion 2 13c : Opening S: Substrate 37-