201119538 六、發明說明： 【發明所屬之技術領域】 本發明係關於核心基材的製造方法及使用核心基材製 造印刷電路板的方法。 【先前技術】 隨著朝向更小、更高密度及更薄之電子部件的趨勢， 已進行許多研究來發展具有更高功能性的較薄半導體封 裝基材。特定言之，為了實施多晶片封裝（MCP )技術 (其中複數個半導體晶片係堆疊在一基材上），或疊合封 裝（package on package，POP)技術（其中複數個具有晶 片嵌入其中之基材係堆疊在彼此之上），需要發展具有相 似於晶片之熱膨脹行為且在晶片埋入後具有絕佳翹曲性 質的印刷電路板。 隨著現今朝向高效能晶片的趨勢，晶片操作速率的增 加造成一加熱問題。因此，亟須尋求此問題的解決之道。 為了回應此需要’高熱傳導金屬板（例如，銅板或銘板） 係普遍地插入印刷電路板的核心以製造一核心基材。因 為金屬板具有絕佳的熱膨脹性質及熱傳導性質，金屬板 可抑制基材的熱膨脹行為並實行散熱的功能。 在此種印刷電路板中，形成用於介層連接的一介層 孔，且在核心基材中預鑽鑿一孔洞以用於連結該介層 孔。另外，因為若核心基材中之孔洞的位置與介層孔間 201119538 的間隙並未適當地匹配可能會發生缺陷性短路，形成在 核心基材中之孔洞必須大於介層孔以用於金屬板的對 準。因此，減少金屬板傳熱的表面積可能減少熱傳導性。 再者，在一典型核心基材中所採用的金屬板可能增加該 核心基材的整體厚度。 【發明内容】 本發明提供一種製造核心基材的方法及一種使用核心 基材製造印刷電路板的方法，藉此減少核心基材的厚度。 本發明亦提供一種製造核心基材的方法及一種使用核 心基材製造印刷電路板的方法，其可減少核心孔洞與介 層孔間的間隙。 本發明之一態樣提供一種製造一核心基材的方法，其 至少包括以下步驟：在一第一銅層之上表面上鍍覆一金 屬層；在該金屬層之上表面上鑛覆一第二銅層；以及餘 刻該第一銅層的下表面。 本發明之另一態樣提供一種製造印刷電路板的方法， 其至少包括以下步驟：在一第一銅層之上表面上鍍覆一 金屬層；在該金屬層之上表面上鍍覆一第二銅層；餘刻 該第一銅層的下表面；在該第一銅層及該第二鋼層上形 成一絕緣層；以及在該絕緣層上形成一電路圖案。 該方法進一步包括以下步驟：在鍍覆該第二鋼層之 後，在該第一銅層、該金屬層以及該第二銅層中形成一 [S ] 5 201119538 核心孔洞。 該方法進一步包括以下步驟：在蝕刻該第一銅層之下 表面之後，在該第一銅層及該第二銅層上形成一絕緣層。 形成該絕緣層的方法可包括以下步驟：在該第一銅層 及該第二銅層上堆疊一樹脂；以及藉由在兩個加熱滾輪 之間移動該樹脂來乾燥該樹脂。 該方法可進一步包括以下步驟：在形成該絕緣層之 後’在該絕緣層上形成一種晶層。 該樹脂可包括液態特氟隆（PTFE)、液晶聚酯（Lcp)及聚 醯亞胺（Pi)。 該金屬層可由銅、鋁或鐵及鎳的合金所製成。 本發明的其他態樣或優點將部份在下文的描述中闡 束，且部份自描述中將為顯而易見，或可藉由實施本發 明來瞭解本發明的其他態樣或優點。 【實施方式】 因為本發明允許多種變化及多種實施例，將於圖式中 例示並在實施方式中詳細地描述一特定實施例。然而， 此舉並非意欲將本發明限制於一特定實施模式，且應了 解所有不悖離本發明之精神及技術範疇之變化、等效物 及取代物皆被涵蓋在本發明之中。在本發明的描述中， 當可能不必要地混淆本發明之本質時，將省略一 二相關 技術領域的詳細描述。 201119538 雖然可能使用此等術語諸如「第一」及「第二」來描 述多種部件’但此等部件不須被限制於上述術語。該等 上述術語僅使用來與其他部件區别。 在本發明中所使用的術語僅使用來描述一特定實施 例’而非意欲限制本發明。使用單數形式的表示法將涵 蓋複數形式的表示法’除非在文中具有明確的不同意 義。在本說明書中，應了解諸如「包括（including)」「具 有（having)」等的術語僅意欲指出在本說明書中所揭示之 特徵結構、數量、步驟、動作、部件、部分、或其組合 的存在，而非意欲排除一或多個其他可能存在或被添加 的特徵結構、數量、步驟、動作、部件、部分、或其組 合0 將在下文參照伴隨圖式更詳細地描述根據本發明之特 疋實施例的一種製造一核心基材的方法及一種使用核心 基材製造印刷電路板的方法。相同或相對應的部件係使 用相同的元件符號而無論圖號為何，並省略不必要的描 述。 第1圖例示一種根據本發明實施例製造一核心基材之 方法的流程圖，以及第2至6圖例示根據本發明實施例 製造一核心基材的方法。 首先，一金屬層120經鍍覆至一第一銅層11〇的上表 面上(S 110)。在一實例中，具有3至3〇μιη之厚度的金屬 層120係藉由電鍍形成，以在該第一銅^ u〇 (例如， 具有18至25μιη之厚度的鋼箔輥）的上表面上散熱並改 201119538 良翹曲。為了描述方便，上述之第一銅層11()及金屬層 120的厚度以及第二銅層130的厚度（將在下文中描述） 僅為例示目的’且應了解明瞭本發明並不限制於所述厚 度’並取決於印刷電路板的設計規格而可有多種修改。 再者，金屬層120可由銅、鋁或鐵及鎳的合金製成。例 示於第2圖中的金屬層120係經鍍覆在該第一銅層u〇 的上表面上。 隨後’第二銅層130係經鐘覆至該金屬層丨2〇的上表 面上（S 120)。在一實例中’第二銅層13〇係在該金屬層 120之上表面上以3至ΙΟμπι的厚度來電鍍。例示於第3 圖中的第二銅層130係經鑛覆在該金屬層12〇的上表面 上。 隨後’在該第一銅層110'該金屬層12〇及該第二銅 層130中形成一核心孔洞135(S130)。在一實例中，為了 形成核心孔洞135，光敏薄膜140可先附著至該第二銅 層130’且隨後曝光並顯影該光敏薄膜ι4〇。隨後，核心 孔洞1 3 5可經由一蝕刻製程形成， 隨後’該第一銅層11 〇的下表面係經餘刻（s丨4〇)。在 一實例中’具有18至25μΓη之厚度的該第一銅層11()可 經半餘刻，以致使該第一銅層1 1 〇及該第二銅層1 3 〇具 有一相似厚度。在第4圖中，光敏薄膜14〇係附著至該 第二銅層13 0之上表面以形成該核心孔洞丨3 $，且該第 一銅層110’係經半蝕刻。 隨後，一絕緣層1 5 1係形成在該經蝕刻之第一銅層 201119538 110’與該第二銅層130上（S150)。此可藉由在該第一銅層 110’及該第二銅層130上堆疊一樹脂15〇來實現（s 151)， 且隨後在加熱滚輪160間移動樹脂丨5〇以乾燥樹脂 150(S153)。 在一實例中，藉由使該經蝕刻之第一銅層11〇,與該第 二銅層130浸潰在樹脂150 (例如液態特氟隆（PTFE)、 液晶聚酯（LCP)、或聚醯亞胺（Pi))中或藉由絲網法，可 將具有5至20μιη之厚度的樹脂15〇塗覆在該第一銅層 110’及該第二銅層130的外表面上’以及塗覆在該核心 孔洞135的内壁上。隨後，可實行使用熱風之第一乾燥 製程以乾燥樹脂1 5 0。隨後藉由使具有樹脂丨5 〇堆疊於 其上的第一銅層110,與第二鋼層13〇通過該等加熱滾輪 160 ’可將樹脂150平坦化並乾燥。在第5圖中，具有樹 脂150堆疊於其上的第一銅層11〇’及第二銅層13〇通過 該等滚輪160。 經由乾燥製程’樹脂1 5 0係經硬化以形成絕緣層丨5 J， 且種晶層1 70係形成在該絕緣層1 5 1上（s 1 60)。可藉由 在該絕緣層151之表面上實行一離子辅助反應（IAR) (例如，電漿離子束源）處理製程，使該親水種晶層可 形成在該絕緣層1 5 1的表面上。因此，增加了對之後將 形成之電路圖案210的附著強度。再者，該種晶層17〇 係藉由無電鍍覆方式形成並實行一電極的功能，使得待 被電鍵至該不導電（electrically_n〇nc〇nductive)絕緣層 151之表面上的電路圖案21〇得以形成。 201119538 在第6圖中，種晶層170係形成在絕緣層15丨上。 在經由上述製程形成的核心基材100中，減少了第一 銅層110’與第二銅層丨30間之厚度的差異，且該第一鋼 層110’係以該初始製備之第一銅層110之一半的厚度來 形成’從而減少了整體厚度。 在根據本發明先前所述之實施例所製造的核心基材 100中’若第一銅層110為銅箔輥，核心基材100可以 輥的形狀形成。因此，核心基材100可充當板材單元並 可實施於印刷電路板200的製造中，其將會在下文中敘 述。 第7圖為例示根據本發明之實施例製造一印刷電路板 之方法的流程圖，且第8至1 〇圖例示根據本發明實施 例製造一印刷電路板的方法。 在核心基材1 〇〇之絕緣層i 5 1上形成電路圖案21 〇， 其中該核心基材係根據上文描述之本發明實施例所形成 (S21 0)。可使用多種方法來形成電路圖案2丨〇，例如一遮 篷製程（tenting process)，其中一鋼薄膜（未示出）係堆疊 在该核心基材1 〇〇的表面上並經蝕刻以製造圖案，及一 喷墨製程，其中導電性油墨係藉由一喷墨頭（未示出）直 接印刷至該核心基材的表面上。在第8圖中’在該核心 基材1〇〇之表面上形成電路圖案21〇。如上所述，在絕 緣層151之表面上形成的種晶層丨7〇可增加附著至該電 路圖案210的強度並執行電極的功能，以此方式可形成 電路圖案210。再者’當電路圖案210形成時，可以 10 201119538 金屬填滿核心孔洞135，其中該金屬係表示為第8圖中 的參考元件符號137。 隨後’絕緣層部分220可堆疊在核心基材丨〇〇上。絕 緣層部分220可藉由被堆疊在該核心基材ι〇〇之表面上 實行保護電路圖案210的功能’其中該電路圖案21〇形 成在該核心基材1〇〇上。 藉由採用本發明之核心基材1 〇 〇，可減少第一銅層丨j 〇， 與第一銅層13 0間之厚度的差異，且因此可減少印刷電 路板之上層及下詹間之厚度的偏差。另外，第一鋼層 係以初始製備之第一銅層11〇之厚度的一半來形成，且 因此減少該核心基材1 〇 〇的整體厚度。此舉允許印刷電 路板200可成為一薄板。 進一步地說，熱不僅可經由金屬層丨2〇耗散，並且因 為不再需要考慮傳統的金屬對準而可減少介層孔2 5 1及 核心孔洞13 5 (參照第6圖）間之間隙。因此，當形成 核心孔洞13 5時，可減少第一銅層丨丨〇、金屬層丨2〇及 第二銅層130待被移除的表面面積，且由於可較少量地 移除該核心基材（當其表面積較寬時，該核心基材具有 較高的散熱速率）’因此增加該印刷電路板2〇〇之散熱效 率0 在一實例中，若印刷電路板200係以具有至少四層之 多層結構來製造’一外絕緣層230 (其中銅薄膜240係 堆疊於其上）可經層疊及堆疊在絕緣層部分220上。另 外’可藉由使用雷射在該外絕緣層230中形成介層孔洞 201119538BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a core substrate and a method of manufacturing a printed circuit board using the core substrate. [Prior Art] With the trend toward smaller, higher density, and thinner electronic components, many studies have been conducted to develop thinner semiconductor package substrates having higher functionality. Specifically, in order to implement a multi-chip package (MCP) technology (in which a plurality of semiconductor wafers are stacked on a substrate), or a package on package (POP) technology (in which a plurality of substrates have a chip embedded therein) The stacks are stacked on each other), and it is desirable to develop printed circuit boards having thermal expansion behavior similar to wafers and having excellent warpage properties after wafer embedding. With today's trend towards high performance wafers, the increase in wafer operating rate creates a heating problem. Therefore, there is no need to find a solution to this problem. In response to this need, 'high heat conductive metal sheets (e.g., copper or nameplates) are commonly inserted into the core of a printed circuit board to make a core substrate. Since the metal plate has excellent thermal expansion properties and heat conduction properties, the metal plate can suppress the thermal expansion behavior of the substrate and perform the function of dissipating heat. In such a printed circuit board, a via hole for via connection is formed, and a hole is pre-drilled in the core substrate for joining the via hole. In addition, if a defect in the core substrate may not be properly matched if the position of the hole in the core substrate is not properly matched, the hole formed in the core substrate must be larger than the via hole for the metal plate. Alignment. Therefore, reducing the surface area for heat transfer of the metal sheet may reduce thermal conductivity. Furthermore, the metal sheets employed in a typical core substrate may increase the overall thickness of the core substrate. SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a core substrate and a method of manufacturing a printed circuit board using a core substrate, thereby reducing the thickness of the core substrate. The present invention also provides a method of manufacturing a core substrate and a method of manufacturing a printed circuit board using a core substrate, which can reduce a gap between a core hole and a via hole. One aspect of the present invention provides a method of manufacturing a core substrate, comprising at least the steps of: plating a metal layer on a surface of a first copper layer; and depositing a surface on a surface of the metal layer a second copper layer; and a lower surface of the first copper layer. Another aspect of the present invention provides a method of manufacturing a printed circuit board, comprising at least the steps of: plating a metal layer on a surface of a first copper layer; plating a surface on a surface of the metal layer a second copper layer; a lower surface of the first copper layer; an insulating layer formed on the first copper layer and the second steel layer; and a circuit pattern formed on the insulating layer. The method further includes the step of forming a [S ] 5 201119538 core hole in the first copper layer, the metal layer, and the second copper layer after plating the second steel layer. The method further includes the step of forming an insulating layer on the first copper layer and the second copper layer after etching the lower surface of the first copper layer. The method of forming the insulating layer may include the steps of: stacking a resin on the first copper layer and the second copper layer; and drying the resin by moving the resin between the two heating rollers. The method may further comprise the step of: forming a seed layer on the insulating layer after forming the insulating layer. The resin may include liquid Teflon (PTFE), liquid crystal polyester (Lcp), and polyimine (Pi). The metal layer may be made of copper, aluminum or an alloy of iron and nickel. Other aspects and advantages of the invention will be set forth in the description in the description. DETAILED DESCRIPTION OF THE INVENTION As the present invention is susceptible to various modifications and various embodiments, a particular embodiment will be described and illustrated in the drawings. However, the present invention is not intended to be limited to a particular embodiment, and all changes, equivalents, and substitutions are intended to be included within the scope of the invention. In the description of the present invention, a detailed description of the related art will be omitted when it may unnecessarily obscure the essence of the present invention. 201119538 Although such terms such as "first" and "second" may be used to describe various components', such components are not necessarily limited to the above terms. These terms are used only to distinguish them from other components. The terminology used in the present invention is used to describe a particular embodiment and is not intended to limit the invention. The use of the singular form of the singular singular singular singular singular singular singular singular singular singularity. In the present specification, terms such as "including", "having", etc., are intended to mean that the features, quantities, steps, acts, components, parts, or combinations thereof are disclosed in the specification. The existence, not limitation, of one or more other features, quantities, steps, acts, components, parts, or combinations thereof that may be present or added will be described in more detail below with reference to the accompanying drawings. A method of manufacturing a core substrate and a method of manufacturing a printed circuit board using a core substrate. The same or corresponding components are given the same component symbols regardless of the figure number, and unnecessary description is omitted. Fig. 1 illustrates a flow chart of a method of manufacturing a core substrate according to an embodiment of the present invention, and Figs. 2 to 6 illustrate a method of manufacturing a core substrate according to an embodiment of the present invention. First, a metal layer 120 is plated onto the upper surface of a first copper layer 11 (S 110). In one example, the metal layer 120 having a thickness of 3 to 3 μm is formed by electroplating on the upper surface of the first copper (for example, a steel foil roll having a thickness of 18 to 25 μm). Heat and change the 201119538 good warpage. For convenience of description, the thicknesses of the first copper layer 11() and the metal layer 120 described above and the thickness of the second copper layer 130 (which will be described later) are for illustrative purposes only, and it should be understood that the present invention is not limited to the described The thickness 'depends on the design specifications of the printed circuit board and can be modified in many ways. Further, the metal layer 120 may be made of copper, aluminum or an alloy of iron and nickel. The metal layer 120 illustrated in Fig. 2 is plated on the upper surface of the first copper layer u. Subsequently, the second copper layer 130 is overlaid onto the upper surface of the metal layer 2 (S 120). In an example, the second copper layer 13 is plated on the upper surface of the metal layer 120 by a thickness of 3 to ΙΟμm. The second copper layer 130 illustrated in Fig. 3 is ore-coated on the upper surface of the metal layer 12A. A core hole 135 is then formed in the metal layer 12 and the second copper layer 130 in the first copper layer 110 (S130). In one example, to form the core hole 135, the photosensitive film 140 may be attached to the second copper layer 130' first and then exposed and developed. Subsequently, the core hole 135 can be formed via an etching process, and then the lower surface of the first copper layer 11 系 is etched (s丨4〇). In the present example, the first copper layer 11 (having a thickness of 18 to 25 μ?) may be left for a half time so that the first copper layer 1 1 〇 and the second copper layer 13 have a similar thickness. In Fig. 4, a photosensitive film 14 is attached to the upper surface of the second copper layer 130 to form the core hole 丨3$, and the first copper layer 110' is half etched. Subsequently, an insulating layer 115 is formed on the etched first copper layer 201119538 110' and the second copper layer 130 (S150). This can be achieved by stacking a resin 15 在 on the first copper layer 110 ′ and the second copper layer 130 (s 151 ), and then moving the resin 丨 5 在 between the heating rollers 160 to dry the resin 150 (S153 ). In one example, the etched first copper layer 11 is impregnated with the second copper layer 130 in a resin 150 (eg, liquid Teflon (PTFE), liquid crystal polyester (LCP), or poly a resin 15 having a thickness of 5 to 20 μm may be coated on the outer surface of the first copper layer 110' and the second copper layer 130 by ruthenium imine (Pi) or by a screen method. It is coated on the inner wall of the core hole 135. Subsequently, a first drying process using hot air may be performed to dry the resin 150. The resin 150 can then be planarized and dried by passing the first copper layer 110 having the resin 丨5 〇 stacked thereon and the second steel layer 13 〇 through the heating rollers 160'. In Fig. 5, the first copper layer 11'' and the second copper layer 13, on which the resin 150 is stacked, pass through the rollers 160. The resin 150 is hardened to form an insulating layer 丨5 J via a drying process, and a seed layer 170 is formed on the insulating layer 151 (s 1 60). The hydrophilic seed layer can be formed on the surface of the insulating layer 115 by performing an ion assisted reaction (IAR) (e.g., plasma ion beam source) process on the surface of the insulating layer 151. Therefore, the adhesion strength to the circuit pattern 210 to be formed later is increased. Further, the seed layer 17 is formed by electroless plating and performs an electrode function such that the circuit pattern 21 to be electrically connected to the surface of the electrically insulating layer 151 is defective. Was formed. 201119538 In Fig. 6, a seed layer 170 is formed on the insulating layer 15A. In the core substrate 100 formed through the above process, the difference in thickness between the first copper layer 110' and the second copper layer 30 is reduced, and the first steel layer 110' is the first copper prepared by the initial preparation. One half of the thickness of layer 110 is formed to 'reduced overall thickness. In the core substrate 100 manufactured according to the previously described embodiment of the present invention, if the first copper layer 110 is a copper foil roll, the core substrate 100 may be formed in the shape of a roll. Therefore, the core substrate 100 can function as a sheet unit and can be implemented in the manufacture of the printed circuit board 200, which will be described later. Fig. 7 is a flow chart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention, and Figs. 8 to 1 exemplify a method of manufacturing a printed circuit board according to an embodiment of the present invention. A circuit pattern 21 〇 is formed on the insulating layer i 5 1 of the core substrate 1 , wherein the core substrate is formed according to the embodiment of the invention described above (S21 0). A plurality of methods can be used to form the circuit pattern 2, such as a tenting process in which a steel film (not shown) is stacked on the surface of the core substrate 1 经 and etched to make a pattern. And an ink jet process in which the conductive ink is directly printed onto the surface of the core substrate by an ink jet head (not shown). In Fig. 8, 'the circuit pattern 21' is formed on the surface of the core substrate 1'. As described above, the seed layer layer 7 formed on the surface of the insulating layer 151 can increase the strength attached to the circuit pattern 210 and perform the function of the electrode, in such a manner that the circuit pattern 210 can be formed. Further, when the circuit pattern 210 is formed, the core hole 135 may be filled with a metal of 10 201119538, wherein the metal is denoted by reference numeral symbol 137 in FIG. The 'insulation layer portion 220 can then be stacked on the core substrate. The insulating layer portion 220 can perform the function of protecting the circuit pattern 210 by being stacked on the surface of the core substrate ι, wherein the circuit pattern 21 is formed on the core substrate 1''. By using the core substrate 1 本 of the present invention, the difference in thickness between the first copper layer 丨j 〇 and the first copper layer 130 can be reduced, and thus the upper layer of the printed circuit board and the lower layer can be reduced. Deviation in thickness. Further, the first steel layer is formed by half the thickness of the initially prepared first copper layer 11 ,, and thus the overall thickness of the core substrate 1 减少 减少 is reduced. This allows the printed circuit board 200 to be a thin board. Further, heat can be dissipated not only through the metal layer, but also because the gap between the via hole 2 5 1 and the core hole 13 5 (see FIG. 6) can be reduced without considering the conventional metal alignment. . Therefore, when the core hole 13 5 is formed, the surface area of the first copper layer 丨丨〇, the metal layer 丨 2 〇 and the second copper layer 130 to be removed can be reduced, and since the core can be removed in a smaller amount The substrate (the core substrate has a higher heat dissipation rate when its surface area is wider) 'thus increasing the heat dissipation efficiency of the printed circuit board 2'. In one example, if the printed circuit board 200 has at least four The multilayer structure of the layers to fabricate 'an outer insulating layer 230 (on which the copper thin film 240 is stacked) may be laminated and stacked on the insulating layer portion 220. In addition, a via hole can be formed in the outer insulating layer 230 by using a laser.
第二焊料阻劑270 zl〇的方法來形成外電路圖案260。 圖案26〇之後，可蝕刻銅薄膜240。 可經堆疊在該外絕緣層230之外側 上，使得該外電路圖案26〇可受到保護。 在貫例中，可在介層孔251上形成凸塊280。凸塊 28〇實行一接頭的功能，其將電路圖案210與外電路圖 案260連接至外部件（例如半導體晶圓或主機板）。可使 用多種方法（例如一噴墨製程，其中導電性油墨係直接 印刷至目標物體上）來形成凸塊28〇。例示於第1〇圖中 的疋經由上述製程形成的印刷電路板2 〇 〇。 儘管已參照上述多個實施例描述本發明之精神，該等 貫施例僅為例示目的而不應限制本發明。應了解熟習此 技藝者可在不背離本發明之範疇及精神下改變或修改本 發明實施例。 因此’除了上述實施例之外，可在隨附申請專利範圍 中發現許多其他實施例。 【圖式簡單說明】 12 201119538 第1圖例示一種根據本發明實施例製造一核心基材之 方法的流程圖。 第2至6圖例示根據本發明實施例製造一核心基材的 方法。 第7圖為例示根據本發明之實施例製造一印刷電路板 之方法的流程圖。 第8至1 〇圖例示根據本發明實施例製造一印刷電路板 的方法。 【主要元件符號說明】 S110步驟 130 第二銅層 S120步驟 135 核心孔洞 S 1 3 0步驟 137 金屬 S140步驟 140 光敏薄膜 S150步驟 150 樹脂 S 15 1步驟 151 絕緣層 S153步驟 160 滾輪 S160步驟 170 種晶層 S210步驟 200 印刷電路板 100核心基材 210 電路圖案 110第一銅層 220 絕緣層部分 110 ’第一銅層 230 外絕緣層 120金屬層 240 鋼薄膜 13 201119538 250 介層孔洞 270 251 介層孔 280 260 外電路圖案 焊料光阻 凸塊 14The second solder resist 270 zl is formed to form the outer circuit pattern 260. After the pattern 26 turns, the copper film 240 can be etched. The outer circuit pattern 26 can be protected by being stacked on the outer side of the outer insulating layer 230. In a conventional example, bumps 280 may be formed on the via holes 251. The bumps 28A perform a joint function that connects the circuit pattern 210 and the external circuit pattern 260 to an external component such as a semiconductor wafer or a motherboard. The bumps 28 can be formed by a variety of methods (e.g., an ink jet process in which the conductive ink is printed directly onto the target object). The printed circuit board 2 形成 formed by the above process is exemplified in the first drawing. While the spirit of the invention has been described with reference to the various embodiments thereof, the embodiments are intended to be illustrative only and not limiting. It is to be understood that those skilled in the art can change or modify the embodiments of the present invention without departing from the scope of the invention. Thus, in addition to the above-described embodiments, many other embodiments are found in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS 12 201119538 FIG. 1 illustrates a flow chart of a method of manufacturing a core substrate in accordance with an embodiment of the present invention. Figures 2 through 6 illustrate a method of making a core substrate in accordance with an embodiment of the present invention. Figure 7 is a flow chart illustrating a method of fabricating a printed circuit board in accordance with an embodiment of the present invention. 8 to 1 are diagrams illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention. [Main component symbol description] S110 step 130 second copper layer S120 step 135 core hole S 1 3 0 step 137 metal S140 step 140 photosensitive film S150 step 150 resin S 15 1 step 151 insulating layer S153 step 160 roller S160 step 170 seed crystal Layer S210 Step 200 Printed Circuit Board 100 Core Substrate 210 Circuit Pattern 110 First Copper Layer 220 Insulation Layer Portion 110 'First Copper Layer 230 Outer Insulation Layer 120 Metal Layer 240 Steel Film 13 201119538 250 Via Hole 270 251 Via Hole 280 260 external circuit pattern solder resist bump 14