201119089 六、發明說明： 【發明所屬之技術領域】 本發明有關一種發光元件(light emitting component)封裝殼體及 封裝結構’特別是有關一種侧光式發光元件封裝殼體及封裝結構。 【先前技術】 發光二極體(light emitting diode，LED)已用於照明裝置’例如應 用於手電筒、汽車頭燈、燈泡、燈管’另外，也可做為裝置的背光， 例如應用於電視、監視器、手機的液晶顯示器的背光模組(baddight module)中。背光模組的分類，依基底上LED晶片的出光方向的不 同’可區分有直下式(direct type)與側光式(edge type)的設計，不同類 型產品各有其需求。 習知的側光式LED背光模組一般具有一杯形基底，led晶片 置於該基底上’ LED發光後，有的光線由杯口直接射出至外界，有 的光線射至杯壁再反射至外界。如第丨圖所示的杯形基底結構的截 面示意圖，習知的杯深Dl 一般為0.6mm，杯殼1〇傾斜角度心一般 為90度至110度。然而，這樣的設置，使得由LED晶片12射出的 部分光線14需要經過側壁11反射及繞射後才由出光面16射出至收 光器18，由於光的路徑較長，容易損失而影響出光效率。 201119089 美國專利申請案公開第2009/0114936 A1號揭示一種發光裝 置，其封裝結構具有一凹槽，發光元件置於此凹槽内，凹槽為狹長 形，在狹長方向的二相對侧壁呈現斜面狀，此二斜面的夾角為9〇 度或大於90度。在一實施例中，此二斜面的夾角可為135至165 度’在另-實施例巾，狹長方向關口長度可為凹槽底部長度的2 至4倍，及在又另—實施财，凹槽深度可為凹槽底部長度的〇2 至0.4倍’使得發光元件發出的光線在凹槽的狹長方向充分分散， 以製造帶狀光束(band-shapedbeam)。在有多個發光元件置於此凹槽 内的情形時，這樣的封裝結構可抑制不均勻照光。 然而’對於—種新穎_光式贱元件縣結構仍持續有需 求’以期能具有充分的出光效率。 【發明内容】 本發明的-目的是要提供-種側光式發光元件封裝結構，經由 杯殼形狀_特設計，能紐A部分的光線直接出光，因此且 料的出来.杜座。 依據本發明的一具體實施例，提供一種側光式發光元件封褒結 構’其包括下列··-底座；至少一發光元件，位於底座上·及一^ 殼，與底隸合而環繞此發光元件，杯殼面向發光元件的—側壁具 201119089 有反射性。杯殼向外傾斜而使側壁與底座形成一 140度至15〇度的 夾角’杯殼具有一垂直於底座的深度，也就是杯深，此深度為025 mm至0.3 mm’及杯殼的杯口為一出光面，出光面的面積為底座的 面積的1.5至2倍。 依據本發明的另一具體實施例，提供一種側光式表面黏著型 (surface mount device ’ SMD) LED封裝結構，包括下列：一杯形基 底，包括一杯殼及一底座而形成一容置空間，杯殼面向容置空間的 側壁具有反射性；一引線架(leadframe)位於底座上；至少一 LED 晶片位於引線架上而於容置空間内；及一封膠層，覆蓋此LED晶 片。杯殼向外傾斜而使侧壁與底座形成一 14〇度至15〇度的夾角， 杯殼具有一垂直於底座的深度，此深度為0.25 mm至0.3 mm，及杯 破的杯口為―出光面，出光面的面積為底座的面積的1.5至2倍。 依據本發明的又另一具體實施例，提供一種侧光式發光元件封 裝设體’包括下列：—底座及一杯殼。杯殼與底座結合而形成-杯 狀的谷置空間，杯殼面向杯内的一侧壁具有反射性，杯殼向外傾斜 而使側壁與底座形成—14G度至15Q度的夾角杯殼的杯口為一出 光面’出光面的面積為底座的面積的1.5至2倍。 於本發明中，因為杯殼相對於習知技術而言較淺，使得發光元 件距離封裝結構的出絲較近，並且增加杯殼傾斜角度，使得出光 面的面積與發絲件所在的功能區面積形成-比例，出光角度大， 201119089 可儘量讓光線-次於出光面㈣，或是歷經—次全反射即於出光面 出光’如此也可減少折射、繞射、散射生，因此能表現應有的 出光性能’提尚出光率，可良好的使用於背光模組或是照明裝置中。 【實施方式】 本發明的側光式發光元件域結翻發光元件位於—杯形基底 中，其中’杯形基底的杯殼向外傾斜而使侧壁與底座形成—14〇度 至150度的夾角，杯殼具有一垂直於底座的深度此深度為〇 25咖 至0.3 mm，及杯殼的杯口為一出光面，出光面的面積為底座的面積 的1.5至2倍。 如第2圖所示的-具體實施例的戴面示意圖，側光式發光元件 封裝殼體20包括下列：-底座22。底座22上可承載發光元件。發 光元件可為例如發光二極H、有機發光二極體、共振腔發光二極體 或雷射半導體的晶片…杯殼26 ’與底座22結合而形成一杯形容 置空間。杯殼26面向杯内的侧壁27具有反射性。杯殼％向外傾斜 而使側壁27與底座22形成-140度至15()度的央角&。杯殼％ 具有-垂直於底座22的深度D2，D2為奶_至Q 3麵。杯殼的 杯口為-出光面28，出光面28的面積Αι為杯殼％所環繞的底座 的面積A2W.5至2倍’也就是說，Al(出光面面積）：A2(底座面積） =L5 :丨至2 :丨。杯口及底座可分別為例如一扁長的橢圓形狀，但 也可為長形或不規則形。 201119089 底座與杯喊可以是陶瓷材料(例如：Ah。3、A1N)或塑膠材料互 相接合或是一體成形。亦可使用引線架取代，引線架的材質可以是 鋁、銅、鋁表面鍍銀或銅表面鍍銀、鋁矽合金、鋁鎂合金、鋁鎂矽 合金、鋁銅合金等。杯殼面向發光元件的側壁具有反射性，此可利 用在杯殼侧壁表面上附著反射率較高的物質，或利用白色陶紐料 作為反射物而達成。 • 帛3 ’-步齡本發_發光耕雖殼體承載著發光元件 的出光的截面示意圖，可與第！圖的習知的發光元件封裝結構比 較。可見本發明的杯殼的财d2較淺，發光元件24的出光距離l 較短或是與出光面28較近，並因增加杯殼傾斜角度，出光面28的 面積為底座22面積的1.5至2倍，使得較習知的結構為多的光線5〇 直接於出光面28出光，較少的光線52才經由杯壁27反射出光，以 及減少光折射或繞射的損失，因此收光器％接收到的 •知的封裝結構大。 自 ^如第4 H賴面示意騎示’依據本發明賴光式發光元件 /裝。構3〇，其底座32與杯殼34形成一杯形基底，底座32斑杯 Γ μ It體柄或是互相結合以環繞—發歧件，而為一容置空 .杯4面向容置空間(也就是面向發光元件)的-侧壁％具有反射 光一底座32具有一引線架36，其包括二部件361及362 ;至少-發 …牛例如LED晶片38位於引線架36的部件362上而於容置空間 201119089 内。LED晶片可包含有—正電極與—負電極，並經由導線％電氣 性連接至引線架36的部件36卜引線架％由杯形基底内延伸至杯 形基底的外部，用以做為後續背光或照龍組製程的接點。可進一 步包括-封膠層40，覆蓋此LED晶片38。側壁％向外傾斜而與底 座32形成-HG度至I%度的夾料，杯殼％具有—垂直於底座 32的深度D3，此财為㈣_至α3 _，及杯殼％的杯口為一 出光面42，出光面42的面積為底座32的面積的u至2倍。 封膠層覆蓋發光元件。封膠層可包括環氧樹脂或石夕膠，用於保 護及固紐光元件例如LED ^與金屬導線。並可另於封膠層中包 括一螢光材料，以進行混光或改變出光顏色。 第5圖顯示第4圖的侧光式發光元件封裝結構％的頂視示意 圖。其中出光面42的面積A3為底座32的面積〜的15至2件。 圖中顯示杯π及底座分別具有—扁長__狀，但不限於此。 第6 __H_知的LED封騎構_誠座形成9( 又及神_絲式SMDLED封裝結雜杯殼側壁與底座形成 .)^,,]#^^^1(Ιι1ιηίη〇ι18 flux) f (早位為軸)作_結果。由财可知，在—樣的杯殼深度下比 ^本發明的封裝結構的紐量較f知的_結構的光通量為大， 再者’當本發明的杯殼深度由〇.6 mm減為〇 3 _時光通量可高 出將近1 lm ’也就是大約高出鳩。可見增進出光率的功效。 201119089 第7圖顯7F本翻軸光式Smdled封裝結翻—具體實施 例”習知的LED封裝結構兩者的光通量對發光強度的作圖比較。本 ==封裝結構使用杯殼的側壁與底座形成⑽度的夾角及杯殼 w j mm S知的封|結構使用杯殼與底座形成奶度的夾角， 杯双冰度為G.6 mm。橫坐標為發光強度⑼，單位為燭光㈣縱 坐標為光通量，單鱗流⑽）。_巾可知，在大_丨.46燭光 •時，相同的發光強度下，本發明的封裝結構具有較習知的封裝結構 咼的光通量，而具有較佳的出光率。 、上所述縣本^明之較佳實施例凡依本發明㈣專利範圍 所做之均㈣聽修飾，皆闕本發明之涵蓋範圍。 【圖式簡單說明】 籲第1圖顯示-習知的封裝結構及出光的截面示意圖。 第2圖顯卜娜树_發枝件塊題的賭實關的截面 示意圖。 第3圖顯示本發明的發光元件封裝_承載著發光元件的出光的戴 面示意圖。 第4圖顯示-依據本發明的側光式發光元件封裝結構的具體實施例 的截面示意圖。 —第5圖顯示如第4圖的側光式發光元件封裝結構的頂視示意圖。 201119089 第6圖顯示分別使用習知的 的光強度對減深度糊崎果、。。構及本㈣的封裝結構’以測得 第7圖顯示本發明的域結構 光強度的侧崎。 ’魄結構岭的光通量對發 【主要元件符號說明】 11 侧壁 14 光線 18 收光器 22 底座 26 杯殼 28 出光面 32. 底座 35 側壁 361 引線架部件 38 LED晶片 40 封膠層 50 光線 54 收光器 10 杯殼 12 LED晶片 16 出光面 20 側光式發光元件封裝殼體 24 發光元件 27 側壁 30 側光式發光元件封裝結構 34 杯殼 36 引線架 362 引線架部件 39 導線 ' 42 出光面 52 光線BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting component package housing and package structure, and more particularly to an edge-lit light-emitting device package housing and package structure. [Prior Art] Light emitting diodes (LEDs) have been used in lighting devices such as flashlights, automotive headlights, bulbs, and lamps. Alternatively, they can be used as backlights for devices, such as televisions. In the backlight module of the liquid crystal display of the monitor and mobile phone. The classification of the backlight module can be distinguished from the direct type and the edge type according to the different light directions of the LED chips on the substrate, and different types of products have their own needs. The conventional edge-lit LED backlight module generally has a cup-shaped substrate on which the LED chip is placed. After the LED is illuminated, some light is directly emitted from the cup to the outside, and some light is emitted to the wall and reflected to the outside. . As shown in the cross-sectional view of the cup-shaped base structure shown in the figure, the conventional cup depth Dl is generally 0.6 mm, and the cup 1〇 tilt angle is generally 90 to 110 degrees. However, such an arrangement is such that a portion of the light 14 emitted from the LED chip 12 needs to be reflected and diffracted through the sidewall 11 to be emitted from the light exit surface 16 to the light receiver 18. Since the path of the light is long, the light loss is easily affected and the light output efficiency is affected. . A light-emitting device has a package structure having a recess in which a light-emitting element is placed, the groove is elongated, and two opposite side walls in a narrow direction exhibit a slope. The angle between the two slopes is 9 degrees or more than 90 degrees. In an embodiment, the angles of the two inclined faces may be 135 to 165 degrees. In another embodiment, the length of the slit in the narrow direction may be 2 to 4 times the length of the bottom of the groove, and in another implementation, the concave The groove depth may be 〇2 to 0.4 times the length of the bottom of the groove' such that the light emitted from the light-emitting element is sufficiently dispersed in the narrow direction of the groove to produce a band-shaped beam. Such a package structure can suppress uneven illumination when a plurality of light-emitting elements are placed in the recess. However, there is still a need for a novel _ optical 贱 element county structure in order to have sufficient light extraction efficiency. SUMMARY OF THE INVENTION The object of the present invention is to provide a side-light type light-emitting element package structure, which is designed to emit light directly from the light of the portion A of the cup, so that the material is released. According to an embodiment of the present invention, an edge-lit light-emitting element sealing structure is provided, which includes the following: a base; at least one light-emitting element is disposed on the base and a shell, which is engaged with the bottom to surround the light. The component, the cup facing the illuminating element - the side wall has a reflectivity of 201119089. The cup is inclined outwardly so that the side wall forms an angle of 140 to 15 degrees with the base. The cup has a depth perpendicular to the base, that is, the depth of the cup, which is 025 mm to 0.3 mm' and the cup of the cup. The mouth is a shiny surface, and the area of the light-emitting surface is 1.5 to 2 times the area of the base. According to another embodiment of the present invention, a surface mount device (SMD) LED package structure is provided, including the following: a cup-shaped substrate comprising a cup and a base to form an accommodation space, the cup The side wall of the shell facing the accommodating space is reflective; a lead frame is located on the base; at least one LED chip is located on the lead frame in the accommodating space; and a glue layer covers the LED chip. The cup is inclined outwardly so that the side wall forms an angle of 14 to 15 degrees with the base, the cup has a depth perpendicular to the base, the depth is 0.25 mm to 0.3 mm, and the cup opening is - The light-emitting surface has an area of 1.5 to 2 times the area of the light-emitting surface. According to still another embodiment of the present invention, there is provided an edge-lit light-emitting device package body' comprising the following: a base and a cup. The cup shell is combined with the base to form a cup-shaped valley space, the side of the cup shell facing the cup is reflective, and the cup shell is inclined outwardly so that the side wall and the base form an angled cup shell of 14G to 15Q degrees. The cup mouth is a glossy surface. The area of the light exit surface is 1.5 to 2 times the area of the base. In the present invention, since the cup shell is shallower than the prior art, the light-emitting element is closer to the wire of the package structure, and the tilt angle of the cup shell is increased, so that the area of the light-emitting surface and the functional area where the hair-emitting member is located Area formation-proportion, large angle of light emission, 201119089 can try to let the light - next to the light-emitting surface (four), or through the total reflection of the light-emitting surface, so as to reduce the refraction, diffraction, and scattering, so it can be expressed Some light-emitting performances provide a good light-emitting rate and can be used well in backlight modules or lighting devices. [Embodiment] The edge-lit light-emitting element domain of the present invention is in a cup-shaped substrate, wherein the cup of the cup-shaped substrate is inclined outwardly so that the side wall and the base form - 14 to 150 degrees. The angle of the cup has a depth perpendicular to the base, the depth is 〇25 coffee to 0.3 mm, and the cup mouth of the cup is a light-emitting surface, and the area of the light-emitting surface is 1.5 to 2 times the area of the base. As shown in Fig. 2, a front view of a specific embodiment, the edge-lit light-emitting element package housing 20 includes the following: - a base 22. A light emitting element can be carried on the base 22. The light-emitting element may be a wafer such as a light-emitting diode H, an organic light-emitting diode, a resonant cavity light-emitting diode or a laser semiconductor. The cup shell 26' is combined with the base 22 to form a cup-shaped accommodation space. The cup shell 26 is reflective toward the side wall 27 in the cup. The cup shell % is inclined outwardly so that the side wall 27 and the base 22 form a central angle & -140 degrees to 15 (degrees). The cup shell % has a depth D2 perpendicular to the base 22, and D2 is a milk_to Q3 face. The cup mouth of the cup shell is the light exit surface 28, and the area of the light exit surface 28 is the area A2W.5 to 2 times the base surrounded by the cup shell %. That is, Al (light exit surface area): A2 (base area) =L5 : 丨 to 2: 丨. The cup mouth and the base may each be, for example, an oblong elliptical shape, but may also be elongated or irregular. 201119089 The base and the cup can be made of ceramic materials (for example: Ah. 3, A1N) or plastic materials joined together or integrally formed. It can also be replaced by a lead frame. The material of the lead frame can be silver plated on aluminum, copper or aluminum surface, silver plated on copper surface, aluminum-bismuth alloy, aluminum-magnesium alloy, aluminum-magnesium-bismuth alloy, aluminum-copper alloy, and the like. The side wall of the cup facing the light-emitting element is reflective, which can be achieved by attaching a substance having a high reflectance to the surface of the side wall of the cup or using a white ceramic material as a reflector. • 帛3 ′-step-age hair _ illuminating ploughing Although the shell carries the cross-section of the light-emitting elements, it can be compared with the first! The conventional light-emitting element package structure of the figure is compared. It can be seen that the cup d2 of the present invention has a shallower d2, the light-emitting distance l of the light-emitting element 24 is shorter or closer to the light-emitting surface 28, and the area of the light-emitting surface 28 is 1.5 to the area of the base 22 due to the increase of the tilt angle of the cup. 2 times, so that more light rays 5 出 are directly emitted from the light exit surface 28, less light 52 reflects light through the cup wall 27, and the loss of light refraction or diffraction is reduced, so the light collector% The received package structure is large. From the 4th aspect of the present invention, the illuminating light-emitting element/assembly according to the present invention is shown. 3, the base 32 and the cup 34 form a cup-shaped base, the base 32 is a cup Γ μ It body handle or combined with each other to surround the hair-distributing piece, and is a space for the accommodation. The cup 4 faces the accommodating space ( That is, facing the light-emitting element - the side wall % has reflected light - the base 32 has a lead frame 36 comprising two parts 361 and 362; at least the hair, such as the LED chip 38, is located on the part 362 of the lead frame 36 Set the space in 201119089. The LED chip may include a positive electrode and a negative electrode, and is electrically connected to the component 36 of the lead frame 36 via a wire %. The lead frame % extends from the cup-shaped substrate to the outside of the cup-shaped substrate for use as a backlight. Or the contact of the Dragon Group process. A further encapsulation layer 40 can be included to cover the LED wafer 38. The side wall % is inclined outwardly to form a clamp of -HG degree to I% with the base 32, and the cup case % has a depth D3 perpendicular to the base 32, which is (4) _ to α3 _, and the cup of the cup is % For a light exit surface 42, the area of the light exit surface 42 is u to 2 times the area of the base 32. The sealant layer covers the light emitting element. The sealant layer may comprise an epoxy or a stone gum for protecting and securing the light-emitting elements such as LEDs and metal wires. A phosphor material may be included in the sealant layer to mix or change the color of the light. Fig. 5 is a top plan view showing the % of the edge-light type light-emitting element package structure of Fig. 4. The area A3 of the light-emitting surface 42 is 15 to 2 pieces of the area of the base 32. The figure shows that the cup π and the base have a flattened __ shape, respectively, but are not limited thereto. The 6th __H_ knowing the LED seal riding structure _ Chengzu formation 9 (also and God _ silk SMDLED package junction cup shell side wall and the base formed.) ^,,] #^^^1(Ιι1ιηίη〇ι18 flux) f (early position for the axis) _ results. It can be seen from the financial situation that the luminous flux of the package structure of the present invention is larger than that of the package structure of the present invention, and the thickness of the cup of the present invention is reduced from 〇.6 mm to 〇3 _ Time flux can be nearly 1 lm higher than the height. Can be seen to enhance the efficacy of light output. 201119089 Figure 7 shows the flip-axis optical Smdled package junction - a specific embodiment of the conventional LED package structure of the luminous flux of the luminous intensity of the drawing comparison. This == package structure using the shell side wall and base Forming the angle of (10) degrees and the sealing of the cup wj mm S. The structure uses the cup to form the angle of the milk with the base. The double ice of the cup is G.6 mm. The abscissa is the luminous intensity (9), and the unit is the candle (four) ordinate. For the luminous flux, the single-scale flow (10)), it can be seen that, at the same luminous intensity, the package structure of the present invention has a light flux of a conventional package structure, and has a better luminous intensity. The light-emitting rate. The preferred embodiment of the above-mentioned county is in accordance with the scope of the invention (4), and the modifications are included in the scope of the present invention. [Simplified description of the drawing] A schematic diagram of a conventional package structure and a light-emitting cross section. Fig. 2 is a schematic cross-sectional view showing the gambling of the buddy block. Figure 3 is a view showing the light-emitting device package of the present invention. Schematic diagram of wearing a face. Figure 4 shows - A schematic cross-sectional view of a specific embodiment of the edge-lit light-emitting device package structure of the present invention. Fig. 5 is a top plan view showing the edge-light type light-emitting device package structure as shown in Fig. 4. 201119089 Fig. 6 shows the use of conventional The light intensity is reduced to the depth of the paste, and the package structure of the present invention is shown in Fig. 7. The measured light intensity of the domain structure of the present invention is shown in Fig. 7. 'The luminous flux of the structure ridge is opposite to the main component symbol Description] 11 Side wall 14 Light 18 Light collector 22 Base 26 Cup shell 28 Light exit surface 32. Base 35 Side wall 361 Lead frame part 38 LED wafer 40 Sealing layer 50 Light 54 Light collector 10 Cup shell 12 LED wafer 16 Light surface 20 side-lighting light-emitting element package housing 24 light-emitting element 27 side wall 30 side-lighting light-emitting element package structure 34 cup 36 lead frame 362 lead frame part 39 wire ' 42 light-emitting surface 52 light