201118973 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種鄰接於對半導體晶圓等被處理 體實施特定處理之處理室而與處理室之間處進行處理 ^後之被處理體之傳遞用的裝載室’更詳細地，關於_ 種能於短時間内切換被處理體之非自動搬送（由操作員 所進行之承載匣（cassette)的搬送）與自動搬送的敦載 室。 【先前技術】 半導體製造工場會於無塵室内設置各種的處理裝 置。處理裝置係具備有相互鄰接的裝載室及處理室，而 從裝載室將被處理體搬送至處理室，於處理室内對被處 理體實施特定處理後，再將處理後之被處理體從處理室 搬回裝載室的結構。以下’作為處理裝置，舉出—種進 行被處理體（以下稱作「半導體晶圓」以進行說明）之電 氣特性檢查用的檢查裝置為範例來進行說明。 檢查裝置例如圖7(a)所示，係具備有相互鄰接的裝 載室1與檢測室2 ’從裝載室1將半導體晶圓w搬送至檢 測室2’於檢測室2内對半導體晶圓冒實施電氣特性檢查 後’再將半導體晶圓W搬回裝載室1的結構。該裝载室工 具備有能載置收納有複數個半導體晶圓1之承載匣c的 載置部3、搬送半導體晶圓w用的晶圓搬送機構4、以及 進行半導體晶圓W之預校準用的預校準機構（圖中未顯 201118973 職财錢有_鮮叙半導體晶圓 w & 、γ、z方向及㊀方向進行移動的載置台5、載 上方的探針卡6、以及針對探針卡6之複數 個抓針6錢半㈣晶，卿成之魏個電極接觸塾 (pad)進行校準用的校準機構7。 進行檢查之情況，係將收納有複數個半導體晶圓w 的承載匣載置於裝載室丨的載置部3上。於裝载室丨中， 晶圓搬送機構4會將承載匣C内之半導體晶圓…一片片 的搬出’且在藉由預校準機構進行半導體晶_之預校 準後，晶圓搬送機構4便會將該半導體晶圓…載置於檢 測至2内之載置台5上。接下來，於載置台5沿乂、γ、ζ 方向及Θ方向移動之期間，藉由校準機構7來進行半導體 晶圓w之複油電極制墊錢針卡6之複數個探針6a 的校準後，驅動載置台5以使得半導體晶㈣之複數個 電極接觸㈣探針卡6之複數個探針_成電氣接觸， 以進行特定檢查。檢查後，抑晶圓搬送機構4來接取 载置台5上之半導體晶i|W以搬回至承載£(：内原本的 位置。 依情況，可無需以承載匣單位來將半導體晶圓w搬 送至裝載室1，而係例如專利文獻丨、2所記載般，使用 自動搬送裝置(Rail Guided Vehicle)(以下稱作「RGV」） 來將半導體晶圓W自動地搬送至裝載室内。此時，如圖 7(b)所示般，於裝载室1之載置部3處設置有調節單元8 以取代承載匣c，而從RGV9將半導體晶圓w一片片地、 201118973 抑或母次複數片般地搬入調節單元8内。 調節單元8如圖7(b)所示，係具備有單元本體8A、 於該單元本體8A内可針對半導體晶圓w之中心部進行 支樓般地沿上下方向所設置的複數個支樓組件8B、以及 在從該等支撐組件8 B朝檢測室2搬送半導體晶圓W時補 正晶圓搬送機構4處之位置偏移用的置中對齊機構（圖 中未顯不）’且為能自由安裝/脫離至載置部3的結構。支 樓組件8B為能真空吸著半導體晶圓w之結構。又，rGV9 則例如具備有：可載置收納有複數個半導體晶圓W之承 載匣C的載置部9A、以及於承載匣c與調節單元8之間處 搬送半導體晶圓W用的晶圓搬送機構9B。 然後’在進行半導體晶圓W檢查之情況，如圖7(b) 所不’藉由RGV9來將半導體晶圓w搬送至檢查裝置之 裝載室1之側邊後’經由R G V 9之晶圓搬送機構9 B來依次 將特定片數的半導體晶圓W收納至調節單元8内時，則 半導體晶圓W便會受到支撐組件8B之真空吸著。於調節 單元8與檢測室2之間處搬送半導體晶圓…時，於解除支 撐組件8B之真空吸著後’晶圓搬送機構4會從支撐組件 8B將半導體晶圓w搬出，經預校準機構進行預校準之 後，搬送至檢測室2 ’於該處進行半導體晶圓之電氣特 性檢查後，再將處理後之半導體晶圓w從檢測室2搬送 至承載匣C内。 專利文獻1 :日本專利特開2007-042994號公報。 專利文獻2 :日本專利特開2007-088286號公報。 201118973 然而，習知之裝載室1可讓載置部3於承載匣c與調 節單元8之間進行切換，但在晶圓搬送自動化之情況 下，操作員必須如往檢查裝置處，由操作員將載置部3 之承載匣載釁機構重新設置於調節單元8處，且同時由 操作員來切換調節單元用程式而重新進行各種初始設 定，故承載度C與調節單元8之切換作業會有需耗費長時 間之問題。又’由於調節單元8為可真空吸著半導體晶 圓W的構造’故會有發生半導體晶圓W之吸著錯誤(err〇r) 之虞，且該檢查亦需耗費時間。 本發明之目的係為了解決前述課題，而提供一種益 二進二承载E等之容器與調節單元之切換; 調節單元型裝载室。非動搬达及自動搬送的内設 【發明内容】 係具備能tt 載的⑽_單元型裝載室 部、以及於該载置部所m處理=之容器的載置 搬送機 動搬送裳置及喊 且保財独個於該自 理體。 間處各自進行搬送的該被處 又 本發明之請切2所記_内設調 節單元型裝 201118973 載室係如請求項1所記載之發明，其中該載置部之其他 部位處係指設置有暫存台的部位，該調節單元可兼作為 該暫存台。 又，本發明之請求項3所記載的内設調節單元型裝 載室係如請求項1或請求項2所記載之發明，其中該調節 單元具有單元本體、以及於該單元本體内沿著上下方向 以複數層般地設置且至少能支撐該被處理體之外周緣 部處三點位置的支撐組件；且該單元本體具有讓該搬送 機構搬入·搬出該被處理體的第1開口部、以及讓該自 動搬送裝置搬入·搬出該被處理體的第2開口部。 又，本發明之請求項4所記載的内設調節單元型裝 載室係如請求項3所記載之發明，其中至少三點位置處 的該支撐組件具有沿該被處理體中心方向延伸的第1支 撐組件、以及相對於該被處理體而沿切線方向延伸的第 2支撐組件。 又，本發明之請求項5所記載的内設調節單元型裝 載室係如請求項3或請求項4所記載之發明，其中該調節 單元具有能檢測該支撐組件中是否存在有該被處理體 的感測器。 又，本發明之請求項6所記載之内設調節單元型裝 載室係如請求項1〜請求項5中任一項所記載的發明，其 中於該調節單元下方處設置有能與該搬送機構協調作 動以進行該被處理體之置中對齊的置中對齊機構。 又，本發明之請求項7所記載之内設調節單元型裝 201118973 載室係如請求項1〜請求項6中任一項所記載之發明，其-中使用了對s亥被處理體進行電氣特性檢查的檢查裝置。. ，本發明’可提供—種無需如習知般進行承載匣等 之容1§與調節單元之切換作業，而能對應於被檢查體之 非自動搬送及自動搬送的内設調節單元型裝載室。 【實施方式】 以下’根據圖1〜圖6所示實施形態來說明本發明之 内設调iP單疋型裝載室。本實施形態係針對適用於被處 UJ )之電氣躲檢查餘查裝置中之 内設調節單元型裂載室（以下僅稱作「裝載室」）來進行 說明。 本只施形態之裝載室10係例如圖1(a)所示般而鄰接 設置於，查裳置100之處理室(檢測室)2〇處。該裝載室1〇 具備有成載置收納有複數個半導體晶®W之承載匡c的 承載匿載置部11、於承餘載置部11所載置之承載 與檢測室2G之間處搬送半導體晶圓w用的第1晶圓搬送 機構12、設置有暫存台（圖中未顯示）的暫存台配置部 13、以及設置於暫存台配置部13下方的預校準部14(參 考圖1(b))，其中第丨晶圓搬送機構I)係位在承載匣載置 部11與暫存台配置部13之間處。另夕卜，暫存台係用以收 納例如針龍針卡之探針 探針研磨用 晶圓(圖中未顯示)的收納體。 承载E載置部1丨係㈣承賴相之載置部，暫存 8 201118973 台载置部13則取代暫存台而用作後述調節單元30之專 用空間。調節單元30雖係用以收納半導體晶圓w，但亦 可為例如使其下部形成有收納探針研磨用晶圓（圖中未 顯示）用空間，以兼用作習知之暫存台。對應於針對檢 查裝置100自動搬送半導體晶圓W用的RGV40而設置有 該調節單元3〇。於是，在說明調節單元3〇之前，先簡單 地說明裝載室10内所設置之第1晶圓搬送機構丨2及 RGV40。 第1晶圓搬送機構12如圖1(a)所示，係具備有保持半 導體晶圓W的手臂12A、以及設置有能讓該手臂12A沿 單一方向前進後退之直進驅動機構的迴轉體12B。手臂 12A係連接至真空排氣裝置（圖中未顯示）以對半導體晶 圓W進行真空吸著的結構，如圖1 (a)所示，係可藉由直 進驅動機構而在迴轉體12上進行直進的結構。迴轉體 12B具有迴轉驅動機構及昇降驅動機構，如圖1 (幻所 不，係可在正/反轉之同時進行上下方向移動的結構。 因此，手臂12A會藉由直進驅動機構於迴轉體12B上進 行直進且藉由迴轉體12B進行正/反轉，而於承載匣c/ 調節單元30、與探針室20之間搬送半導體晶圓w。 又’預校準部14之略中央如圖1(b)及圖5所示，係設 ^有預校準機構15。該驗準機構15具備有將半導體晶 0W真空吸著用的迴轉體15Α、以及在由迴轉體ΐ5Α來 迴轉半導體晶圓w之期間内檢測凹口（nGteh)等標誌、用 的光學感測器15B，其中係在使用第！晶圓搬送機構η 201118973 來將半導體晶圓W從承載匣C或調節單元30搬送至檢測 室20之期間内讓迴轉體15A迴轉，以藉由光學感測器 15B來對半導體晶圓冒進行預校準。又，如圖1(b)及圖5 所不，在預校準機構15之深處(從第丨晶圓搬送機構12側 所見深處)則設置有置中對齊機構16。 又’ RGV40如圖1⑷所示’係具備有：RGV本體41 ; 緩衝承載匣42，係設置於RGV本體41上之端部（圖中左 侧端部）處且可收納複數片（例如25片）晶圓w ;迴旋機構 (圖中未顯示），係鄰接於緩衝承載匣42;第2晶圓搬送機 構43，係具有設置於該迴旋機構處之可自由伸縮的手臂 (圖中未顯示）；半導體晶圓w測繪感測器（圖中未顯 示），係女裝於該晶圓搬送機構43處；以及防止飛出組 件（圖中未顯示）’係可防止半導體晶圓w從緩衝承載匣 42處飛出。手臂之前端部則例如安裝有上下複數層（例 如上下二層）所形成的手持部43A。該等手持部43A係連 接至真空排氣裝置（圖中未顯示）而能真空吸著半導體晶 圓W的結構。又，手臂係例如可藉由滚珠螺桿機構而與 迴方疋機構一體地進〃亍升降的結構。緩衝承載匣42具有與 搬送半導體晶圓W用FOBS承載匣之槽孔相同構造的槽 孔’上下二層之手臂43A會以對應於FOBS承載匣之槽孔 的間距而安裝在手臂之先端部處。F〇BS承載匣之槽孔 間距係例如設定為l〇mm。 其次’說明有關本實施形態之裝載室10所使用之調 即早元30。本實施形態中的調節單元30係對應於前述自 201118973 動搬送半導體晶圓W的RGV40而設置。該調節單元30如 圖1 (a)及圖2所示，係具有：單元本體31，係由暫存台配 置部13上所設置之矩形框體所組成；以及支撐組件32， 係可於單元本體31内沿上下方向各自針對複數片半導 體晶圓W及複數片探針研磨用半導體晶圓（圖中未顯示) 的外周緣部以三點支撐呈水平狀態。 單元本體31具有：第1開口部31A，係能讓真空吸著 有半導體晶圓W的第1晶圓搬送機構12之手臂12A來進 行搬入•搬出；以及第2開口部31B，係能讓真空吸著有 半導體晶圓W的R G V 4 0之第2晶圓搬送機構4 3之手持部 43A來進行搬入•搬出。因此，調節單元3〇係可藉由第1 晶圓搬送機構12及第2晶圓搬送機構43而從相互垂直方 向來進行半導體晶圓W之搬出入的結構。 設置於三處位置的支撐組件32如圖l(a)、圖2所示， 係由設置在單元本體31之第2開口部31B左右兩側之一 對第1支撐組件32A、以及設置在面向第2開口部3ib之 面附近處的第2支撐組件32B所組成。一對第1支撐組件 32A如圖2、圖3(a)所示，係具有：一對支柱32A1，係站 立5又置於單元本體31之底面處；以及複數片（例如μ片） 細長形狀的支樓板32A2，係從該等支柱32A1各自沿上 下方向間隔特定間距而形成有槽孔，並朝向單元本體31 之中心呈水平狀延伸。其中，各支撐板32A2皆相對於支 柱32A1形成櫛齒狀。一對支撐組件32A如圖丨所示，係 與半導體晶圓W外周緣部交叉且朝向中心部呈放射狀 201118973 設置。 第2支撐組件32B如圖2、圖3(b)所示，係具有：矩 形板組件32B1，係於單元本體31底面處與第2開口部 31B之對向面呈平行般站立設置；以及複數片（例如25 片）矩形支撐板32B2，係從板組件32B1沿上下方向間隔 特定間距而朝向單元本體31内側呈水平狀延伸。其中， 該等支撐板32B2係設置於半導體晶圓W之切線方向。該 等之矩形支撐板32B2係相對應於第1支撐組件32A之複 數個支撐板32A2而設置，可藉由第1、第2支撐組件 32A ’ 32B沿上下方向間隔特定間距而呈水平狀地支樓 半導體晶圓W。 又’如圖4所示，於第2支撐組件32B之各支撐板 32B2之間處各自形成有能讓第2晶圓搬送機構43之手持 部43A所搬送的半導體晶圓w進入之槽孔s。各槽孔S則 各自設置有光學感測器34 ’以各自檢測該處是否存在有 半導體晶圓W或探針研磨用晶圓等，並可藉由該等光學 感測器34來個別地確認收納至各槽孔s的半導體晶圓w 等。光學感測器34係由發光元件34A與感光元件34B所 組成’且經由各自之配線34C而安裝於配線基板35。槽 孔S之下側的支撐板32B2形成有收納發光元件34A的空 間32C ’於槽孔S之上側的支撐板32B2則形成有收納感 光元件34B的空間32D。各槽孔S之光學感測器34係每隔 一個地各自沿槽孔S之前後方向相互錯開般設置，以使 付相鄰之上下光學感測益3 4不會相互重疊。發光元件 12 201118973 之光線會通過空間32C上方面所具有的穿透孔32E 而由感光元件34B所檢出。 ^。藉此，於一個槽孔s處是否存在有半導體晶圓w等 系T藉由„亥層之光學感測器％來進行檢出，而不會針對 其上層槽孔S是否存在有半導體晶圓w等而進行檢出。 即上下之光學感測器34的光線不會相互干涉。藉由前 述般於各槽孔s處所設置的光學感測器34便可確實地檢 出各槽孔S之半導體晶圓貿等，亦可特定出該槽孔§所保 持之晶圓的種類。 又’單元本體31設置有檢測半導體晶圓w飛出的光 學感測器（圖中未顯示）。&RGV4〇將半導體晶圓w搬送 至5周節單元3〇内時，當搬送位置有偏差之情況，光學感 測器便會檢測出飛出的半導體晶圓w，並發出警告。 如圖1(b)所示，暫存台配置部13下側設置有預校準 部14。該預校準部14例如圖1(b)及圖5所示，係具有：預 权準機構15 ;以及置中對齊機構16，係由設置於預校準 機構15附近之一對棒狀置中對齊組件16A所組成。另 外，圖5中，箭頭係顯示半導體晶圓w相對於預校準部 14的進入方向。 一對置中對齊組件16A如圖1(b)及圖5所示，從第1 晶圓搬送機構12側觀之’係位於置中對齊機構15之迴轉 體15A的深處側，且以通過手臂12A中心與迴轉體15A 中心的延長線為基準而呈左右對稱地設置。該等置中對 齊組件16A亦可是能配合半導體晶圓w之大小而以迴轉 13 201118973 體15A之中心為基準沿半徑方向移動的結構，又，亦可 為固定設置。置t對齊組件16A受到固定之情況，則係 配合最大之半導體晶圓w而設置，當半導體晶圓w較小 之情況，藉由延長第1晶圓搬送機構12之移動距離則亦 可針對較小之半導體晶圓W進行置中對齊。該置中對齊 會在半導體晶圓W預校準之前一個步驟中進行。 其次’針對使用RGV40來將半導體晶圓w自動搬送 至本實施形態之裝載室10内並檢查之情況來進行說明。 直到次一動作開始前，檢查裝置100會對承載匣c 内之半導體晶圓W進行檢查，接著’便可切換至調節單 元30而直接進行半導體晶圓w之檢查。使用調節單元3〇 來進行檢查之情況，首先在當RGV40如圖1(a)所示般進 入至裝載室10之調節單元30中的某個位置處之後，再驅 動RGV40之第2晶圓搬送機構43。第2晶圓搬送機構43 會在藉由迴旋機構將手持部43A前端朝向緩衝承載 且將手臂對齊至較半導體晶圓W高度稍低位置處之 後，伸長手臂並將手臂上昇少許以使得緩衝承載匣42 内的2片半導體晶圓W各自載置於上下手持部43 A處，再 縮回手臂以將半導體晶圓W搬出至緩衝承載匣42外側。 接著’藉由第2晶圓搬送機構43之迴旋機構來讓手 臂朝逆時針方向迴轉90。以朝向裝載室10之調節單元3〇 方向之後’伸長手臂’讓手持部43A對齊至調節單元3〇 之左右一對第1支撐組件32中各上下支撐板32A2、32A2 之間的槽孔高度之後，讓手持部43A進入該槽孔内以將 201118973 半導體晶圓W搬入單元本體31内，使得手持部43A稍微 降下以將半導體晶圓W載置在左右一對之支撐板32A2 及深處之第2支撐組件32B之支撐板32B2上，並將半導 體晶圓W以三點支撐呈水平狀態後，縮回手臂以使得手 持部43A從單元本體31退出。於第2支撐組件32B處之光 學感測器34會作動而檢出半導體晶圓w。此時，當半導 體晶圓W之搬送有偏差時，飛出感測器便會檢測出位置 偏移的半導體晶圓W，並回報異常狀態。 一第2晶圓搬送機構43會重覆前述動作直到於調節單 元處擺滿半導體晶圓W為止，於調節單元3〇内擺滿半 導體晶圓W之後，RGV40便準備進行下一個動作。 將半導體晶圓W收納至調節單元30内時，便驅動檢 查裝置100以開始檢查半導體晶圓…。即，於裝載室ι〇 内驅動第1晶圓搬送機構12，以從調節單元3〇將半導體 晶圓W搬出。制第1晶圓搬送機構12而從調節單元30 將半導體晶圓W搬出。 於調節單元30處係藉由第1、第2支樓組件32A、32B 來支樓半導體晶圓w。驅動第i晶圓搬送機構12時，將 手臂12A前端轉向調節單元3()側之後，讓手臂i2A之高 ^對齊至目標半導體晶，之高度處。即，讓手臂12A 二度對背至，支擇有目標半導體晶圓w之支撐板 冋度猶低之呵度位置處之後，讓手臂DA進入單元本體 31内並以手。臂12Α來吸著保持半導體晶圓w 。其次，讓 手ΠΑ從單冗本體31内後退，並下將至對齊預校準部 15 201118973 14處之後’進入/退出預校準部14A内且藉由如圖6 (a) 〜(c)所示步驟來進行半導體晶圓…之預校準。另外，圖 6中省略了光學感測器15B。 如圖6(a)所示，當手臂12A將半導體晶圓W朝預校 準部14内搬送’使得半導體晶圓W到達預校準機構^之 迴轉體15A上方時，手臂12A會暫時停止，並解除爭導 體晶圓W之真空吸著。於該狀態下，手臂12A上之半導 體晶圓W中心〇1會相較於迴轉體15A中心02各自於X方 向及Y方向偏移、Ay。於是，在解除半導體晶圓W之 吸著的狀態下’讓手臂12A以較進入時更低的速度朝雨 置中對齊機構16前進以使得半導體晶圓w抵接至ϊ中 對齊機構16之一對置中對齊組件16A、16A，更進〆梦· 讓手臂12A前進，則半導體晶圓W便會於手臂12A上滑 動以進行Y方向之置中對齊，以補正Ay的位置偏移。此 時，如圖6(b)所示般，手臂12A所保持之半導體晶圓W 中心與半導體晶圓W中心〇1會僅偏移預先設定好之尺 寸Δχ’。於此’讓手臂12A再度真空吸著半導體晶圓W ’ 以低速僅後退Δχ’之距離，降下同時解除真空吸著，另 一方面’迴轉體12Α則將半導體晶圓w吸著固定。此時， 半導體晶圓中心01與迴轉體15 Α中心〇2便會形成 致。在此狀態下於迴轉體15A迴轉一圈之期間内藉由光 學感測器15B來完成半導體晶圓w之預校準。 然後，於手臂12A上昇之期間内解除迴轉體15A之 真空吸著，同時由手臂12A來真空吸著半導體晶圓W， 201118973 以從迴轉體15A接收半導體晶圓W。接著’手臂12A便 會在真空吸著有半導體晶圓W之狀態下從預校準部14 將半導體晶圓W搬出，藉由迴轉體12B朝逆時針方向迴 轉90°，以將手臂12A前端轉向檢測室20側之後，由手臂 12 A將半導體晶圓W傳遞給檢測室2 0内的載置台21。 於檢測室20内如習知般相同地進行半導體晶圓W 之電氣特性檢查，於半導體晶圓W檢查後，驅動第1晶 圓搬送機構12以由手臂12A從載置台21處接收半導體晶 圓W。然後，讓手臂12A藉由迴轉體12B朝順時針方向 迴轉90°，經由與搬出半導體晶圓W時之相反路徑而從 手臂12A將半導體晶圓W放回調節單元30内原本的槽孔 處。關於後續之半導體晶圓W’係重覆前述一連串之動 作來進行半導體晶圓W之電氣特性檢查。 當調節單元30内之全部半導體晶圓W之檢查完成 時，驅動RGV40以從調節單元30將半導體晶圓w搬出， 並搬回至緩衝承載匣42内。 依以上說明之本實施形態，於承載匣載置部u外之 其他暫存台配置部13處對應於自動搬送半導體晶圓w 之RGV40而没置有能保持複數個在各自與奶糊及檢 測室2〇之間進行搬送之半導體晶靠的調節單元，因 此無而如省知&地進行承載㈣與調節單元π之切換 作業❿可對應於半導體晶㈣之非自驗送及自動搬 送二’由於調節單元3〇係設置於暫存台 故無需擴建裝載室10。 17 201118973 又，依本實施形態，調節單元30係具有：單元本體 31 ;以及第1 '第2支撐組件32A、32B，係於單元本體 31内沿上下方向複數層般設置且能以三點支撐半導體 晶圓W之外周緣部。單元本體31則具有讓第丨晶圓搬送 機構將半導體晶圓W搬入•搬出用的第1開口部31 a、以 及讓RGV40將半導體晶圓W搬入.搬出用的第2開口部 31B，因此，在支撙半導體晶圓w時無需真空吸著，而 可使構造簡單化’並可減少設置成本及保養成本。 又，依本實施形態，由於調節單元3〇具有可檢出於 第2支樓組件32B處是否存在有半導體晶圓w的光學感 測器34，因此，可確實掌握調節單元3〇内之半導體晶圓 W的收納狀況。 又，依本實施形態，於調節單元3〇下方設置有預校 準機構15,而於該預校準機構15附近設置有置中對齊機 構16,因此，可在進行半導體晶圓貿之預校準之前一個 步驟，藉由置中對齊機構16來進行半導體晶圓w之置中 對齊，故可防止因預校準機構12c之吸著誤差（e證)及 位置偏移而導致半導體晶圓，傷，並可縮校 間。 另外’該實施形態中’係針對於調節單·處將半 導體晶圓\\^三點切之情絲進行朗，但亦可藉由 來ΓΓ持。又，置中對齊單元亦不制限於該 貫施开讀。本發明之裝载室所設置之 離本發明宗旨’錢包含於树明。 201118973 本發明係可廣泛地適用於半導體製造工場之無塵 室内所設置的各種處理裝置上。 【圖式簡單說明】 圖1(a)、（b)係各自顯示本發明裝載室之一實施形態 的結構圖，（a)係顯示裝載室之晶圓搬送機構及調節單元 與檢測室之關係的平面圖，（b)係顯示設置於(a)所示調 節單元下方之預校準機構與晶圓搬送機構之間的關係 之平面圖。 圖2係圖1所示裝載室所使用之調節單元的透視立 體圖。 圖3(a)、（b)皆係圖2所示調節單元之主要部位的側 面圖。 圖4係圖2所示調節單元所適用之光學感測器的說 明圖。 圖5係圖1(b)所示預校準部的立體圖。 圖6(a)〜⑷各自係顯示圖5所示預校準部處於預校 準之前所實施之半導體晶圓之置中對齊步驟的步驟圖。 圖7(a)、（b)係習知檢查裝置的平面圖，（a)顯示使用 了承載匣之狀態，（b)則顯示使用了習知調節單元之狀 態。 19 201118973 【主要元件符號說明】 1 裝載室 2 檢測室 3 載置部 4 晶圓搬送機構 5 載置台 6 探針卡 6A 探針 7 校準機構 8 調節單元 8A 單元本體 8B 支撐組件 9 RGV 9A 載置部 9B 晶圓搬送機構 10 裝載室 11 承載匣載置部 12 第1晶圓搬送機構 12A 手臂 12B 迴轉體 13 暫存台配置部 14 預校準部 15 預校準機構 15A 迴轉體 15B 光學感測器 16 置中對齊機構 16A 置中對齊組件 20 檢測室 21 載置台 30 調節單元 31 單元本體 31A 第1開口部 31B 第2開口部 32 支撐組件 32A 第1支撐組件 32A1 支柱 32A2 支撐板 32B 第2支撐組件 32B1 板組件 32B2 支稽板 32C > 32D 空間 32E 穿透孔 34 光學感測器 34A 發光元件 34B 感光元件 34C 配線 35 配線基板 201118973 40 RGV 41 RGV本體 42 緩衝承載匣 43 第2晶圓搬送機構 43A 手持部 100 檢查裝置 C 承載匣 W 半導體晶圓 21BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processed object which is processed between a processing chamber which is subjected to a specific processing for a semiconductor wafer or the like and a processing chamber. In the transfer chamber for transfer, in more detail, it is possible to switch between the non-automatic conveyance of the object to be processed (the conveyance of the cassette by the operator) and the automatic transfer of the load compartment in a short time. [Prior Art] A semiconductor manufacturing factory places various processing devices in a clean room. The processing apparatus includes a loading chamber and a processing chamber adjacent to each other, and the object to be processed is transported from the loading chamber to the processing chamber, and the processed object is subjected to a specific treatment in the processing chamber, and then the processed object is processed from the processing chamber. Move back to the structure of the loading room. In the following, as an example of the processing apparatus, an inspection apparatus for inspecting electrical characteristics of a target object (hereinafter referred to as "semiconductor wafer" for description) will be described as an example. For example, as shown in FIG. 7( a ), the inspection device includes a loading chamber 1 and a detection chamber 2 ′ that are adjacent to each other. The semiconductor wafer w is transported from the loading chamber 1 to the detection chamber 2 ′ in the detection chamber 2 to the semiconductor wafer. After the electrical characteristic inspection is performed, the semiconductor wafer W is moved back to the loading chamber 1. The load cell tool includes a mounting portion 3 on which a plurality of semiconductor wafers 1 are housed, a wafer transfer mechanism 4 for transporting a semiconductor wafer w, and pre-calibration of the semiconductor wafer W. Pre-calibrated mechanism for quasi-use (there is no 201118973 in the picture, there are _ fresh semiconductor wafer w & gamma, z direction and one direction to move the mounting table 5, the probe card 6 above the load, and the probe The needle card 6 has a plurality of needles 6 and a half (four) crystal, and the Wei electrode is contacted with a pad to perform a calibration mechanism for calibration 7. In the case of inspection, a plurality of semiconductor wafers w are accommodated. The crucible is placed on the mounting portion 3 of the loading chamber. In the loading chamber, the wafer transfer mechanism 4 carries out the semiconductor wafers in the cassette C, and is carried out by a pre-calibration mechanism. After pre-calibration of the semiconductor crystal, the wafer transfer mechanism 4 mounts the semiconductor wafer ... on the mounting table 5 detected in 2. Next, the mounting table 5 is along the 乂, γ, ζ directions and Θ During the direction of movement, the recalibrating mechanism of the semiconductor wafer w is performed by the calibration mechanism 7 After the calibration of the plurality of probes 6a of the money needle card 6, the mounting table 5 is driven such that a plurality of electrodes of the semiconductor crystal (4) are in contact with the plurality of probes of the probe card 6 to make electrical contact for specific inspection. After the inspection, the wafer transfer mechanism 4 picks up the semiconductor crystal i|W on the mounting table 5 to carry it back to the original position of the carrier (in the case of the original position. In the case of the transfer to the loading chamber 1, the semiconductor wafer W is automatically transferred to the loading chamber by using a Rail Guided Vehicle (hereinafter referred to as "RGV") as described in the patent documents 丨 and 2. As shown in FIG. 7(b), the adjustment unit 8 is disposed at the mounting portion 3 of the loading chamber 1 instead of the carrier 匣c, and the semiconductor wafer w is sliced from the RGV9, 201118973 or the mother and the second The adjustment unit 8 is housed in the adjustment unit 8. The adjustment unit 8 includes a unit body 8A as shown in Fig. 7(b), and the unit body 8A can be connected to the center of the semiconductor wafer w. a plurality of branch assemblies 8B set in the direction, and When the semiconductor module W is transported to the detection chamber 2, the support unit 8B corrects the center alignment mechanism (not shown) for shifting the position of the wafer transfer mechanism 4, and is freely attachable/detachable to the mounting portion. The structure of the slab 3 is a structure in which the semiconductor wafer w can be vacuum-sucked, and the rGV 9 includes, for example, a mounting portion 9A on which the carrier C of the plurality of semiconductor wafers W can be placed, and The wafer transfer mechanism 9B for transporting the semiconductor wafer W is carried between the carrier 匣c and the adjustment unit 8. Then, when the semiconductor wafer W is inspected, as shown in Fig. 7(b), the RGV9 is used. After the semiconductor wafer w is transported to the side of the loading chamber 1 of the inspection device, the semiconductor wafer W of the RGV 9 is sequentially stored in the adjustment unit 8 by the wafer transfer mechanism 9 B of the RGV 9 W is then vacuumed by the support assembly 8B. When the semiconductor wafer is transferred between the adjustment unit 8 and the detection chamber 2, after the vacuum suction of the support unit 8B is released, the wafer transfer mechanism 4 carries out the semiconductor wafer w from the support unit 8B, and the pre-calibration mechanism After the pre-calibration, the semiconductor wafer w is transferred from the detection chamber 2 to the carrier 匣C after being transported to the inspection chamber 2' where the electrical characteristics of the semiconductor wafer are inspected. Patent Document 1: Japanese Patent Laid-Open Publication No. 2007-042994. Patent Document 2: Japanese Patent Laid-Open Publication No. 2007-088286. 201118973 However, the conventional loading chamber 1 allows the mounting portion 3 to switch between the carrier 匣c and the adjustment unit 8, but in the case of wafer transfer automation, the operator must go to the inspection device as the operator will The load carrying mechanism of the placing portion 3 is reset at the adjusting unit 8, and at the same time, the operator switches the adjusting unit program to perform various initial settings, so the switching operation of the carrying capacity C and the adjusting unit 8 is required. It takes a long time. Further, since the adjustment unit 8 has a structure in which the semiconductor wafer W can be vacuum-absorbed, there is a possibility that a semiconductor wafer W is caught (err〇r), and this inspection takes time. SUMMARY OF THE INVENTION An object of the present invention is to provide a switching between a container and an adjustment unit of E and the like, and to adjust a unit type loading chamber. In the case of the non-moving movement and the automatic transfer, the invention provides a (10)_unit type loading chamber unit that can be loaded on the unit, and a container that is handled by the mounting unit. And the insurance is unique to the self-care body. According to the invention described in claim 1, the other parts of the mounting portion are set in the other parts of the mounting portion. There is a portion of the temporary storage station, and the adjustment unit can also serve as the temporary storage station. Further, the internal adjustment unit type loading chamber according to claim 3 of the present invention is the invention of claim 1 or claim 2, wherein the adjustment unit has a unit body and is vertically oriented in the unit body a support assembly provided in a plurality of layers and capable of supporting at least three points at a peripheral portion of the outer surface of the object to be processed; and the unit body has a first opening for allowing the transport mechanism to carry in and out of the object to be processed, and The automatic transfer device carries in and out the second opening of the object to be processed. Further, the internal adjustment unit type loading chamber according to claim 4 is the invention according to claim 3, wherein the support unit at at least three points has the first one extending in the center direction of the object to be processed. a support assembly and a second support assembly extending in a tangential direction with respect to the object to be processed. Further, the internal adjustment unit type loading chamber according to claim 5 of the present invention is the invention according to claim 3 or claim 4, wherein the adjustment unit has a capability of detecting whether the object to be processed exists in the support unit Sensor. Further, the adjustment unit type loading chamber according to any one of claims 1 to 5, wherein the adjustment unit is provided with the transport mechanism below the adjustment unit. The centering alignment mechanism is coordinated to perform centering alignment of the object to be processed. Further, the present invention is the invention described in claim 7 of the present invention, which is the invention described in any one of claims 1 to 6, which is used for the processing of the object to be processed. Inspection device for electrical property inspection. The present invention can provide a built-in adjustment unit type load that can be used for the non-automatic transfer and automatic transfer of the object to be inspected without the need to perform the switching operation of the load and the like. room. [Embodiment] Hereinafter, an internal iP single-type loading chamber of the present invention will be described based on the embodiments shown in Figs. 1 to 6 . This embodiment is described with reference to an adjustment unit type split carrier (hereinafter simply referred to as "loading chamber") which is applied to the electrical hiding inspection and inspection device of the UJ. The loading chamber 10 of the present embodiment is disposed adjacent to the processing room (detection chamber) of the Jams 100, for example, as shown in Fig. 1(a). The load chamber 1A is provided with a load-bearing portion 11 on which a load 匡c of a plurality of semiconductor crystals W is placed, and is carried between the load placed on the load-bearing portion 11 and the detection chamber 2G. The first wafer transfer mechanism 12 for the semiconductor wafer w, the temporary stage arrangement unit 13 provided with a temporary stage (not shown), and the pre-calibration unit 14 provided below the temporary stage arrangement unit 13 (refer to FIG. 1(b)), in which the second wafer transfer mechanism I) is positioned between the carrier load portion 11 and the temporary storage portion arrangement portion 13. In addition, the temporary storage unit is a storage body for receiving a probe probe polishing wafer (not shown) such as a needle card. The mounting portion of the E-mounting unit 1 (4) supporting phase is temporarily stored. The 2011 18973 mounting portion 13 serves as a dedicated space for the adjusting unit 30 to be described later instead of the temporary storage unit. Although the adjustment unit 30 is for accommodating the semiconductor wafer w, for example, a space for accommodating a probe polishing wafer (not shown) may be formed in the lower portion thereof, and may be used as a conventional temporary storage station. The adjustment unit 3 is provided corresponding to the RGV 40 for automatically transporting the semiconductor wafer W to the inspection apparatus 100. Therefore, before describing the adjustment unit 3, the first wafer transfer mechanism 丨2 and RGV40 provided in the load chamber 10 will be briefly described. As shown in Fig. 1(a), the first wafer transfer mechanism 12 includes an arm 12A that holds the semiconductor wafer W, and a revolving body 12B that is provided with a linear drive mechanism that allows the arm 12A to advance and retreat in a single direction. The arm 12A is connected to a vacuum exhaust device (not shown) for vacuum absorbing the semiconductor wafer W, as shown in FIG. 1(a), which can be on the rotary body 12 by a linear drive mechanism. Make a straight forward structure. The slewing body 12B has a slewing drive mechanism and a hoisting drive mechanism, as shown in Fig. 1 (the illusion is a structure that can move up and down while being positive/reverse. Therefore, the arm 12A is driven by the straight drive mechanism to the slewing body 12B. The semiconductor wafer w is transported between the carrier 匣c/adjustment unit 30 and the probe chamber 20 by performing straight forward rotation and forward/reverse rotation by the rotary body 12B. Further, the center of the pre-calibration portion 14 is as shown in FIG. (b) and Fig. 5, there is provided a pre-calibration mechanism 15. The alignment mechanism 15 includes a revolving body 15A for vacuum-sucking the semiconductor crystal OV, and a semiconductor wafer w-turned by the revolving body Α5Α. In the period of time, the optical sensor 15B for detecting a mark such as a notch (nGteh) is used, and the semiconductor wafer W is transported from the carrier C or the adjustment unit 30 to the detection chamber by using the wafer transfer mechanism η 201118973. The revolving body 15A is rotated during the period of 20 to pre-calibrate the semiconductor wafer by the optical sensor 15B. Again, as shown in Figs. 1(b) and 5, in the depth of the pre-calibration mechanism 15 (Deep from the side of the second wafer transfer mechanism 12) As shown in Fig. 1 (4), the RGV 40 is provided with an RGV body 41 and a buffer carrier 42 which is disposed at an end portion (left end portion in the drawing) of the RGV body 41 and can accommodate a plurality of pieces. (for example, 25) wafer w; a turning mechanism (not shown) adjacent to the buffer carrier 42; and a second wafer transfer mechanism 43 having a freely extendable arm disposed at the swing mechanism (Fig. Not shown in the middle; a semiconductor wafer w mapping sensor (not shown), which is worn by the wafer transfer mechanism 43; and a fly-proof component (not shown) to prevent semiconductor wafers w flies out from the buffer carrier 42. The front end of the arm is, for example, a hand-held portion 43A formed by a plurality of upper and lower layers (for example, upper and lower layers). The hand-held portions 43A are connected to a vacuum exhaust device (not shown) The structure of the semiconductor wafer W can be vacuum-absorbed. Further, the arm can be lifted and lowered integrally with the returning mechanism by a ball screw mechanism. The buffer carrier 42 has a semiconductor wafer to be transported. W uses FOBS to carry the same slot The upper and lower two-layer arm 43A of the slotted hole is mounted at the tip end of the arm at a pitch corresponding to the slot of the FOBS carrier. The slot pitch of the F〇BS carrier is set to, for example, l〇mm. The adjustment unit 30 used in the present embodiment is provided in the early stage 30. The adjustment unit 30 in the present embodiment is provided corresponding to the RGV 40 that transports the semiconductor wafer W from 201118973. The adjustment unit 30 is as shown in the figure. 1(a) and FIG. 2, the unit body 31 is composed of a rectangular frame provided on the temporary storage unit arrangement portion 13; and the support assembly 32 is vertically movable in the unit body 31. The outer peripheral edge portions of the plurality of semiconductor wafers W and the plurality of probe polishing semiconductor wafers (not shown) are horizontally supported at three points. The unit main body 31 has a first opening 31A for carrying in and carrying out the arm 12A of the first wafer transfer mechanism 12 in which the semiconductor wafer W is vacuum-sucked, and a second opening 31B for vacuuming The hand-held portion 43A of the second wafer transfer mechanism 43 of the RGV 40 having the semiconductor wafer W is sucked in and out. Therefore, the adjustment unit 3 can carry out the loading and unloading of the semiconductor wafer W from the mutually perpendicular directions by the first wafer transfer mechanism 12 and the second wafer transfer mechanism 43. As shown in FIG. 1(a) and FIG. 2, the support unit 32 provided at three positions is provided on the left and right sides of the second opening portion 31B of the unit main body 31 to the first support unit 32A, and is disposed in the surface. The second support unit 32B is located near the surface of the second opening 3ib. As shown in Fig. 2 and Fig. 3(a), the pair of first support members 32A have a pair of struts 32A1, which are placed at the bottom surface of the unit body 31, and a plurality of sheets (e.g., μ sheets) elongated shapes. The slab 32A2 is formed with a slot from each of the struts 32A1 at a predetermined interval in the vertical direction, and extends horizontally toward the center of the unit body 31. Each of the support plates 32A2 is formed in a denture shape with respect to the support 32A1. As shown in FIG. 2A, the pair of support members 32A are arranged to intersect the outer peripheral edge portion of the semiconductor wafer W and are radially arranged toward the center portion. As shown in FIGS. 2 and 3(b), the second support unit 32B has a rectangular plate assembly 32B1 which is disposed in parallel with the opposing surface of the second opening portion 31B on the bottom surface of the unit main body 31; The sheet (for example, 25 sheets) of rectangular support plates 32B2 extends horizontally from the plate assembly 32B1 at a predetermined interval in the vertical direction toward the inside of the unit body 31. The support plates 32B2 are disposed in a tangential direction of the semiconductor wafer W. The rectangular support plates 32B2 are provided corresponding to the plurality of support plates 32A2 of the first support assembly 32A, and can be horizontally branched by the first and second support members 32A' 32B at a predetermined interval in the up and down direction. Semiconductor wafer W. Further, as shown in FIG. 4, a slot s into which the semiconductor wafer w conveyed by the hand portion 43A of the second wafer transfer mechanism 43 enters is formed between the support plates 32B2 of the second support unit 32B. . Each of the slots S is provided with an optical sensor 34' to detect whether a semiconductor wafer W or a probe polishing wafer or the like exists therein, and can be individually confirmed by the optical sensors 34. The semiconductor wafer w and the like housed in each of the slots s. The optical sensor 34 is composed of the light-emitting element 34A and the light-receiving element 34B and is mounted on the wiring substrate 35 via the respective wiring 34C. The support plate 32B2 on the lower side of the slot S is formed with a space 32C' for housing the light-emitting element 34A. The support plate 32B2 on the upper side of the slot S is formed with a space 32D for accommodating the light-sensing element 34B. The optical sensors 34 of the respective slots S are disposed alternately with each other in the front and rear directions of the slot S so that the adjacent upper and lower optical sensing benefits do not overlap each other. The light of the light-emitting element 12 201118973 is detected by the photosensitive element 34B through the penetration hole 32E of the space 32C. ^. Therefore, whether or not the semiconductor wafer w or the like is detected at one of the slots s is detected by the optical sensor % of the layer, and the semiconductor wafer is not present for the upper slot S thereof. The light rays of the upper and lower optical sensors 34 do not interfere with each other. The optical sensors 34 provided at the respective slots s can positively detect the slots S. The semiconductor wafer trade can also specify the type of wafer held by the slot. The unit body 31 is provided with an optical sensor (not shown) for detecting the flying out of the semiconductor wafer w. When RGV4 transfers the semiconductor wafer w to the 5-week unit 3, when the transfer position is deviated, the optical sensor detects the flying semiconductor wafer w and issues a warning. b), the pre-calibration unit 14 is provided on the lower side of the temporary storage unit arrangement unit 13. The pre-calibration unit 14 has a pre-authority mechanism 15 as shown in Figs. 1(b) and 5; The mechanism 16 is composed of a pair of rod-shaped center alignment components 16A disposed in the vicinity of the pre-calibration mechanism 15. In Fig. 5, the arrow indicates the direction in which the semiconductor wafer w enters with respect to the pre-alignment portion 14. The pair of center-aligned components 16A are viewed from the side of the first wafer transfer mechanism 12 as shown in Figs. 1(b) and 5 It is located on the deep side of the revolving body 15A of the centering alignment mechanism 15, and is disposed symmetrically with respect to the extension line passing through the center of the arm 12A and the center of the revolving body 15A. The centering alignment component 16A may also be The structure which can move in the radial direction with reference to the center of the revolving 13 201118973 body 15A in accordance with the size of the semiconductor wafer w, or a fixed arrangement. When the t alignment component 16A is fixed, the largest semiconductor is used. The wafer w is provided. When the semiconductor wafer w is small, the semiconductor wafer W can be centered and aligned by extending the moving distance of the first wafer transfer mechanism 12. This is performed in one step before the semiconductor wafer W is pre-calibrated. Next, the description will be made on the case where the semiconductor wafer w is automatically transferred to the loading chamber 10 of the present embodiment and inspected using the RGV 40. Before, the inspection apparatus 100 inspects the semiconductor wafer W in the carrier 匣c, and then can switch to the adjustment unit 30 to directly perform inspection of the semiconductor wafer w. The inspection unit 3 进行 is used for inspection, first After the RGV 40 enters a certain position in the adjustment unit 30 of the loading chamber 10 as shown in Fig. 1(a), the second wafer transfer mechanism 43 of the RGV 40 is driven. The second wafer transfer mechanism 43 will After the front end of the hand-held portion 43A is directed toward the buffer bearing by the swing mechanism and the arm is aligned to a position slightly lower than the height of the semiconductor wafer W, the arm is extended and the arm is raised a little to make the two semiconductor wafers W in the buffer carrier 42 Each of them is placed at the upper and lower hand-held portions 43 A, and the arms are retracted to carry the semiconductor wafer W out of the buffer carrier 42. Then, the arm is rotated 90 by the counterclockwise direction by the turning mechanism of the second wafer transfer mechanism 43. After the direction of the adjustment unit 3 toward the loading chamber 10, the 'elongating arm' allows the hand portion 43A to be aligned to the height of the slot between the upper and lower support plates 32A2, 32A2 of the pair of left and right first support members 32 of the adjustment unit 3 The hand-held portion 43A enters the slot to carry the 201118973 semiconductor wafer W into the unit body 31, so that the hand-held portion 43A is slightly lowered to mount the semiconductor wafer W on the pair of left and right support plates 32A2 and the depth After the support wafer 32B of the support member 32B is supported and the semiconductor wafer W is horizontally supported at three points, the arm is retracted to cause the hand portion 43A to be withdrawn from the unit body 31. The optical sensor 34 at the second support unit 32B operates to detect the semiconductor wafer w. At this time, when there is a deviation in the transport of the semiconductor wafer W, the flying out sensor detects the semiconductor wafer W which is displaced, and returns an abnormal state. The second wafer transfer mechanism 43 repeats the above operation until the semiconductor wafer W is placed on the adjustment unit, and after the semiconductor wafer W is placed in the adjustment unit 3, the RGV 40 is ready for the next operation. When the semiconductor wafer W is housed in the adjustment unit 30, the inspection device 100 is driven to start inspection of the semiconductor wafer. That is, the first wafer transfer mechanism 12 is driven in the load chamber ι to carry out the semiconductor wafer W from the adjustment unit 3A. The first wafer transfer mechanism 12 is manufactured, and the semiconductor wafer W is carried out from the adjustment unit 30. At the adjustment unit 30, the semiconductor wafer w is supported by the first and second branch assemblies 32A, 32B. When the i-th wafer transfer mechanism 12 is driven, the front end of the arm 12A is turned to the adjustment unit 3 () side, and then the height i of the arm i2A is aligned to the height of the target semiconductor crystal. That is, after the arm 12A is second-to-back to the position where the support plate of the target semiconductor wafer w is at a low degree, the arm DA is allowed to enter the unit body 31 and the hand is used. The arm 12 is sucked to hold the semiconductor wafer w. Next, the handcuff is retracted from the single redundant body 31, and is then placed in the pre-calibration portion 14A after the alignment pre-calibration portion 15 201118973 14 and as shown in FIGS. 6(a) to (c). The steps are to perform pre-calibration of the semiconductor wafer. In addition, the optical sensor 15B is omitted in FIG. As shown in FIG. 6(a), when the arm 12A transports the semiconductor wafer W toward the pre-alignment portion 14 so that the semiconductor wafer W reaches above the revolving body 15A of the pre-calibration mechanism, the arm 12A is temporarily stopped and released. Strike the vacuum of the conductor wafer W. In this state, the center 〇1 of the semiconductor wafer W on the arm 12A is shifted from the center 02 of the revolving body 15A in the X direction and the Y direction, respectively, and Ay. Thus, in a state where the smear of the semiconductor wafer W is released, the arm 12A is advanced toward the rain center alignment mechanism 16 at a lower speed than when entering, so that the semiconductor wafer w abuts against one of the center alignment mechanisms 16. Opposing the center alignment components 16A, 16A, and further into the nightmare, the arm 12A is advanced, and the semiconductor wafer W is slid over the arm 12A to perform centering alignment in the Y direction to correct the positional shift of Ay. At this time, as shown in Fig. 6(b), the center of the semiconductor wafer W held by the arm 12A and the center 〇1 of the semiconductor wafer W are shifted by only a predetermined size Δχ'. Here, the arm 12A is again vacuum-absorbed to the semiconductor wafer W' by a distance of only Δχ at a low speed, and the vacuum suction is released while the rotary body 12 is slid and fixed. At this time, the center of the semiconductor wafer 01 and the center of the rotor 15 are formed. In this state, the pre-alignment of the semiconductor wafer w is completed by the optical sensor 15B during one revolution of the rotary body 15A. Then, the vacuum suction of the slewing body 15A is released while the arm 12A is raised, and the semiconductor wafer W is vacuum-absorbed by the arm 12A, and the semiconductor wafer W is received from the slewing body 15A at 201118973. Then, the arm 12A carries out the semiconductor wafer W from the pre-alignment unit 14 while the semiconductor wafer W is vacuum-absorbed, and rotates the counter-clockwise direction by 90° by the revolving body 12B to turn the front end of the arm 12A. After the chamber 20 side, the semiconductor wafer W is transferred by the arm 12 A to the mounting table 21 in the detection chamber 20 . The electrical characteristics of the semiconductor wafer W are inspected in the same manner as in the detection chamber 20, and after the inspection of the semiconductor wafer W, the first wafer transfer mechanism 12 is driven to receive the semiconductor wafer from the mounting table 21 by the arm 12A. W. Then, the arm 12A is rotated 90° clockwise by the turning body 12B, and the semiconductor wafer W is returned from the arm 12A to the original slot in the adjusting unit 30 via the opposite path from when the semiconductor wafer W is carried out. The subsequent semiconductor wafer W' repeats the above-described series of operations to perform electrical characteristic inspection of the semiconductor wafer W. When the inspection of all the semiconductor wafers W in the adjustment unit 30 is completed, the RGV 40 is driven to carry out the semiconductor wafer w from the adjustment unit 30 and is carried back into the buffer carrier 42. According to the embodiment described above, the RGV 40 that automatically transports the semiconductor wafer w is not placed in the other temporary storage unit arrangement portion 13 other than the load-carrying portion u, and is not able to hold a plurality of each of them and the milk paste and the detection. The adjustment unit of the semiconductor crystal that is transported between the chambers 2〇 is therefore not required to be carried and/or carried out. (4) The switching operation of the adjustment unit π can correspond to the non-self-test and automatic transfer of the semiconductor crystal (4). 'Because the adjustment unit 3 is installed in the temporary storage station, it is not necessary to expand the loading chamber 10. Further, according to the present embodiment, the adjustment unit 30 includes the unit main body 31 and the first 'second support members 32A and 32B, which are provided in the unit main body 31 in a plurality of layers in the up and down direction and can be supported at three points. The outer peripheral portion of the semiconductor wafer W. The unit main body 31 has a first opening 31a for allowing the second wafer transfer mechanism to carry in and out of the semiconductor wafer W, and a second opening 31B for allowing the RGV 40 to carry the semiconductor wafer W into and out. When the semiconductor wafer w is supported, vacuum suction is not required, and the structure can be simplified', and installation cost and maintenance cost can be reduced. Further, according to the present embodiment, since the adjustment unit 3A has the optical sensor 34 capable of detecting whether or not the semiconductor wafer w is present at the second branch unit 32B, the semiconductor in the adjustment unit 3 can be surely grasped. The storage state of the wafer W. Moreover, according to the embodiment, the pre-alignment mechanism 15 is disposed under the adjustment unit 3A, and the center alignment mechanism 16 is disposed in the vicinity of the pre-calibration mechanism 15, so that one pre-calibration of the semiconductor wafer trade can be performed. In the step of centering the semiconductor wafer w by the centering alignment mechanism 16, the semiconductor wafer can be prevented from being damaged due to the suction error (e) and the positional deviation of the pre-calibration mechanism 12c. Shrink the school room. Further, in this embodiment, the semiconductor wafer is cut at three points for the adjustment of the semiconductor wafer, but it can also be held by. Also, the centering alignment unit is not limited to the continuous reading. The loading chamber of the present invention is provided in the context of the present invention. 201118973 The present invention is widely applicable to various processing devices provided in a clean room of a semiconductor manufacturing factory. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) and (b) are each a structural view showing an embodiment of a loading chamber of the present invention, and (a) shows a relationship between a wafer transfer mechanism of a loading chamber and an adjustment unit and a detection chamber. The plan view, (b) is a plan view showing the relationship between the pre-alignment mechanism and the wafer transfer mechanism disposed under the adjustment unit shown in (a). Figure 2 is a perspective perspective view of the adjustment unit used in the loading chamber of Figure 1. 3(a) and 3(b) are side views of the main part of the adjusting unit shown in Fig. 2. Fig. 4 is an explanatory view showing an optical sensor to which the adjusting unit shown in Fig. 2 is applied. Fig. 5 is a perspective view of the pre-alignment portion shown in Fig. 1(b). 6(a) to (4) are each a step view showing a step of aligning the semiconductor wafers performed before the pre-calibration portion shown in Fig. 5 is pre-calibrated. Fig. 7 (a) and Fig. 7(b) are plan views of a conventional inspection apparatus, (a) showing a state in which a load bearing is used, and (b) showing a state in which a conventional adjustment unit is used. 19 201118973 [Description of main components] 1 Loading chamber 2 Detection chamber 3 Mounting unit 4 Wafer transfer mechanism 5 Mounting table 6 Probe card 6A Probe 7 Calibration mechanism 8 Adjustment unit 8A Unit body 8B Support unit 9 RGV 9A Mounting Part 9B Wafer transfer mechanism 10 Load chamber 11 Load carrying unit 12 First wafer transfer mechanism 12A Arm 12B Swing body 13 Temporary stage arrangement unit 14 Pre-calibration unit 15 Pre-calibration mechanism 15A Swing body 15B Optical sensor 16 Centering alignment mechanism 16A Centering alignment unit 20 Detection chamber 21 Mounting table 30 Adjustment unit 31 Unit body 31A First opening portion 31B Second opening portion 32 Supporting assembly 32A First supporting member 32A1 Pillar 32A2 Supporting plate 32B Second supporting member 32B1 Plate assembly 32B2 slab 32C > 32D space 32E penetration hole 34 optical sensor 34A illuminating element 34B photosensitive element 34C wiring 35 wiring substrate 201118973 40 RGV 41 RGV body 42 buffer carrier 第 43 second wafer transfer mechanism 43A handheld Part 100 inspection device C carrying 匣W semiconductor wafer 21