TW201118458A - Conductive structure and method of manufacturing same - Google Patents

Abstract

The present invention relates to a conductive structure. The conductive structure includes a first conductive layer, a conductive unit, a circuit board and a conductive material. The conductive unit is disposed on the first conductive layer. The circuit board has a first through hole. The circuit board is disposed on the first conductive layer and the conductive unit is exposed in the first through hole. The first through hole is filled with the conductive material, such that the conductive material is electrically connected to the conductive unit. Since the invention can be applied to a touch lens without thermal compression bonding, a smooth surface can be obtained accordingly.

Description

201118458 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a conductive structure and a method of fabricating the same, and more particularly to a conductive structure applicable to a touch panel and a method of fabricating the same. [Previous Technology] [0002] Portable electronic products, such as Persona 1 Digital Assistant (PDA), Smart Phone, digital camera, game console, etc., are increasingly used and are becoming thinner. And intelligent development, most of its display devices use liquid crystal display (Liquid Crystal Display, LCD) plus touch panel (Touch Panel) structure. Traditional touch panels cannot be planarized, and current full-touch touch panels (Touch Lens or Touch Window) products are gradually replacing traditional touch panels. Please refer to FIG. 1, which is a schematic diagram of the structure of a full-plane touch panel 1 of the prior art. The full-plane touch panel 1 mainly comprises a decorative film 10, an upper indium tin oxide (ITO) conductive layer 12, a lower IT0 q conductive layer 14, a plastic substrate 16 and a flexible circuit board (Flexible

Printed Circuit, FPC) 18. The upper IT0 conductive layer 12 and the lower IT0 conductive layer 14 have silver electrodes 20 disposed thereon, respectively. One end of the flexible circuit board 18 is sandwiched between the upper and lower silver electrodes 20. Since the electrical connection between the flexible circuit board 18 and the silver electrode 20 needs to be joined by means of hot pressing, the surface of the full-plane touch panel 1 is uneven. In other words, there is an unevenness in the surface of the lead-out position of the flexible circuit board 18, so that the appearance effect of the electronic device is deteriorated. SUMMARY OF THE INVENTION 098140507 Form No. A0101 Page 3 of 14 0982069533-0 201118458 [0004] In view of the above, it is necessary to provide a conductive structure capable of flattening the surface of a full-plane touch panel. In view of the above, it is necessary to provide a method of manufacturing a conductive structure capable of flattening the surface of a full-plane touch panel. [0006] A conductive structure comprising a first conductive layer, a conductive unit, a circuit board, and a conductive material. The conductive unit is disposed on the first conductive layer. The circuit board has a first through hole, the circuit board is disposed on the first conductive layer, and the conductive unit is exposed in the first through hole. A conductive material is filled in the first via and electrically connected to the conductive unit. [0007] In addition, a manufacturing method of a conductive structure includes the steps of: providing a first conductive layer; disposing a conductive unit on the first conductive layer; disposing a circuit board on the first conductive layer, and making the conductive unit Formed in one of the first vias on the circuit board; and filled with a conductive material in the first via to electrically connect the conductive material to the conductive unit. In summary, the present invention firstly perforates a circuit board, and the circuit board is directly disposed on the surface of the conductive layer during assembly, and the conductive unit is exposed in the through hole on the circuit board. Thereafter, a conductive material is filled in the vias and cured such that the circuit board is electrically connected to the conductive elements on the conductive layer via the conductive material. Since the present invention does not require a thermocompression bonding process, good surface flatness can be maintained when applied to a touch panel. The advantages and spirit of the present invention will be further understood from the following detailed description of the invention. [Embodiment] [0010] Please refer to FIG. 2, which is a diagram of a conductive structure 3 according to an embodiment of the present invention. 098140507 Form No. A0101 Page 4 / Total 14 Page 0992069533-0 201118458 Thinking about the electrical structure 3 includes a gathering The material of the first conductive layer 32, the first conductive layer 32, the first conductive layer 32, the first conductive layer 36, the substrate (10), and the second conductive layer 36 may be oxidized. Indium tin oxide (Tin 〇xide, Sn〇2), zinc oxide (ζ-〇xide,

Zn〇) or its conductive material. The adhesive layer 34 can be a double-sided tape. The substrate 38 can be a glass substrate or a plastic substrate. Circuit board 40 can be a flexible circuit board. The decorative film 30 can be a transparent or non-transparent film or substrate. The conductive structure 3 is suitable for use in a panel, a touch panel or other electronic device. _ _] In this embodiment, two conductive units 42 are disposed on the first conductive layer 32. Conductive unit 42 can be an electrode, a conductive trace, or the like, and the material can be silver or other conductive material. It should be noted that the number of the conductive units 42 can be determined according to the actual application, and is not limited to the two shown in FIG. 2 . The second conductive layer is placed on the substrate 38 and is attached to the first conductive layer 32 by an adhesive layer. When the second conductive layer 36 is disposed on the substrate 38 by the adhesive layer 34, an opening 44 between the first conductive layer 32 and the first conductive layer 36 is reserved at one end adjacent to the conductive unit 42. In addition, the second conductive layer 36 further has a second through hole 46. The substrate 38 has a third through hole 48, and the second through hole 46 communicates with the third through hole 48. In this embodiment, the circuit board 4 has two first through holes, such that conductive steel wires (not shown) in the circuit board 40 are exposed in the first through holes 50. It should be noted that the preferred embodiment is that the number of the first through holes 50 is the same as the number of the conductive units 42, but the number of the first through holes 50 may not be the same as the number of the conductive units 42. When assembled, one end of the circuit board 4 having the first through hole 50 is inserted into the opening 44, and the conductive unit 42 is exposed in the corresponding first through hole 50 and the first through hole 50 is exposed in the second, 098140507 Form No. Α0101 Page 5 of 14 pages 0992069533-0 201118458 Three perforations 46, 48. Then, the conductive material 52 is filled in each of the first through holes 50 via the second and third through holes 46, 48, so that the conductive copper wires exposed in the first through holes 5 of the circuit board 40 can be electrically conductive The conductive unit 42 forms an electrical connection. The conductive material 52 can be a conductive silver paste or other conductive material. After the conductive material 52 is cured, the sealant 54 is filled in the second and third through holes 46, 48 to pass the first through hole. 50 is sealed with a conductive material 52 to strengthen the structure and prevent oxidation of the conductive material 52. [0013] Further, a lower metal surface and an inner surface may be formed on each of the first through holes 50 to form a metal material (not shown). For example, gold, recording, etc. The metal material is used on the one hand to increase the bondability with the conductive copper wire, and can be used to reduce the electrical conduction resistance between the conductive copper wire and the conductive material 52 and the conductive unit 42. [0014] Please refer to FIG. 3 ' which is a flow chart of the manufacturing method and method of the conductive structure 3. Please refer to FIG. 2 together with the above-mentioned conductive structure 3, the manufacturing method of the conductive structure of the present invention comprises the following steps: [0015] Step S100: For the first conductive layer 32; [0016] Step S102: disposing the conductive unit 42 on the first conductive layer 32; [0017] Step S104: disposing the second conductive layer 36 on the first conductive layer 32, wherein The glue layer 34 places the second conductive layer 36 on the first conductive layer 32. [0018] Step S106: inserting the circuit board 40 with one end of the first through hole 50 into the opening 44 between the first conductive layer 32 and the second conductive layer 36 And the conductive unit 42 is exposed in the first through hole 50 and the first through hole 50 is exposed in the second through hole 46 on the second conductive layer 36; 0982069533-0 098140507 Form No. A0101 Page 6 of 14 201118458 [0019 Step S108: filling the conductive material 52 into the first through hole 50 via the second through hole [0020] on the second conductive layer 36; Step S110: filling the second through hole of the sealant 54 on the second conductive layer 36 46, in order to seal the first through hole 50 with the conductive material 52. [0021] Compared with the prior art, the present invention firstly perforates the circuit board, directly sets the circuit board on the surface of the conductive layer during assembly, and exposes the conductive unit In the perforations on the board. After that, the conductive material is filled in The hole is cured and cured, so that the circuit board is electrically connected to the conductive unit 上 on the conductive layer via the conductive material. Since the invention does not need to be subjected to a thermocompression bonding process, good surface flatness can be maintained when applied to the touch panel. The above description is only the preferred embodiment of the present invention, and all the equivalent changes and modifications made by the scope of the present invention should be within the scope of the present invention. [0023] 1 is a schematic structural view of a conventional full-plane touch panel. 2 is a schematic view of a conductive structure according to an embodiment of the present invention. [0025] FIG. 3 is a flow chart of a method of manufacturing the conductive structure shown in FIG. [Description of main component symbols] Full-plane touch panel: 1 [0027] Conductive structure: 3 [0028] Decorative film: 10, 30 [0029] Upper ITO conductive layer · · 12 098140507 Form No. A0101 Page 7 / Total 14 pages 0982069533-0 201118458 [0030] Lower I TO conductive layer: 14 [0031] Plastic substrate: 16 [0032] Flexible circuit board: 18 [0033] Silver electrode: 20 [0034] First conductive layer: 32 [ 0035] Adhesive layer: 34 [0036] Second conductive layer: 3 6 [0037] Substrate: 38 [0038] Circuit board: 40 [0039] Conductive unit: 42 [0040] Opening: 44 [0041] Second perforation: 46 [0042] Third Perforation: 48 [0043] First Perforation: 5 0 [0044] Conductive Material: 52 [0045] Sealant: 54 [0046] Step: S100-S110 098140507 Form No. A0101 Page 8 of 14 Page 0982069533-0

Claims (1)

201118458 VII. Patent application scope: 1. A conductive structure, comprising: • a first conductive layer; a conductive unit 'on the first conductive layer; — a circuit board' having a first-perforated circuit board setting On the first conductive layer, and the conductive unit is exposed in the first through hole; and the conductive material is filled in the first through hole and electrically connected to the conductive unit Ο 098140507. As claimed in claim 1 The conductive structure, wherein the material of the first conductive layer is indium tin oxide. The conductive structure of claim 1, wherein the conductive unit is one of an electrode and a conductive line. The conductive structure of claim i, wherein the circuit board is a flexible circuit board. The electrically conductive structure of claim 1, wherein the electrically conductive material is a conductive silver paste. The electrically conductive structure of claim 1, wherein the step-by-step comprises a metal material, the upper surface of the first perforation and the inner surface. The conductive structure of claim 1, wherein the conductive structure further comprises a second conductive layer disposed on the first conductive layer and the circuit board, the second conductive layer having a The second through hole, the first through hole of the circuit board and the conductive material are exposed in the second through hole. The conductive structure of claim 7, wherein the conductive structure further comprises a sealant filled in the second through hole to perforate the form number A0101 0982069533-0 201118458 The conductive material is sealed. The conductive structure according to claim 7, wherein the material of the antimony tin oxide layer is indium oxide μ ^ ~ guide 10. As described in claim 7 of the scope of the conductive electric,,,. The conductive structure further includes a sticky knee layer disposed between the first conductive layer and the first electrical layer. a manufacturing method of a conductive structure, comprising the steps of: providing a first conductive layer; disposing a conductive unit on the first conductive layer; setting a circuit board on the [conductive layer, and making the conductive single And in the first through hole of the circuit board; and the road filling-conductive material is in the first through hole to electrically connect the conductive material to the conductive unit. The method for manufacturing a conductive structure according to the above aspect of the invention, wherein the material of the first conductive layer is indium tin oxide. 13. The manufacturing method of claim 5, wherein the element is one of an electrode and a conductive line. The method of manufacturing a conductive structure according to claim 11, wherein the circuit board is a flexible circuit board. The method of manufacturing a conductive structure according to claim 11, wherein the conductive material is a conductive silver paste. 16. A method of fabricating a conductive structure as claimed in the patent application, the method comprising the steps of: forming a metallic material on the lower surface and the inner side surface of the first perforation. 098140507 17 The method for manufacturing a conductive structure according to claim 5, wherein. Before the step of placing the circuit board on the first conductive layer, further comprising the form number surface 1 page 10 / 14 pages 0992069533-0 201118458 the following steps: setting a second conductive layer on the first conductive layer to An opening is formed between the first conductive layer and the second conductive layer, and the second conductive layer has a second through hole, and the conductive material is exposed in the second through hole. 18. The method of manufacturing a conductive structure according to claim 17, wherein the step of staking the circuit board on the first conductive layer comprises the steps of: inserting the circuit board with one end of the first through hole The opening; and exposing the conductive unit to the first through hole and the first through hole is exposed in the second through hole. 19. The method of manufacturing a conductive junction according to claim 18, wherein the step of filling the conductive material in the first through hole comprises the step of: filling the conductive material with the second through hole In the first perforation. The method of manufacturing a conductive structure according to claim 19, further comprising the step of: filling-tightly rotating the second perforated towel to seal the first perforation with the electrically conductive material. The method of manufacturing a conductive structure according to claim 17, wherein the material of the second conductive layer is indium tin oxide. The method for manufacturing a conductive structure according to claim 5, wherein the step of disposing the second conductive layer on the second electrical layer is performed by the second conductive layer on the first conductive layer On a conductive layer. 098140507 Form No. A0101 Page 11 of 1 0982069533-0