201117960 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路板，尤其是具有球形填充物之 多層電路板。 【先前技術】 以往印刷電路板絕緣層材料在重視電性絕緣的要求 下，皆使用熱傳導性小的材料，來達到絕緣效果。由於熱 • 傳導性小，使得板材在後續表面黏著技術（SMT)高溫組 裝製程時聚集大量的熱能，無法有效散熱排出，而產生耐 熱不良甚至材料劣化的問題。 近年來，印刷電路板下游組裝製程在環保的前提考量 下，已由有鉛進展到無鉛製程，SMT組裝溫度也由245°C 提高到260°C，使得板材的散熱及耐熱問題面臨更大的考 驗。 請參閱第一圖及第二圖，藉由技術的提升，印刷電路 ^ 板由傳統的層合板提升至多層層合板’多層層合板係藉由 多層導電層110’與多層絕緣層120’交互疊構並壓合而成， 多層導電層之間具有中空之埋孔結構150’，該埋孔結構 150’之一側壁設置有導電柱15Γ使得導電層110’與其鄰近 之另一導電層做電性連接，以增加電路設計，使得與印刷 電路板做電性連結之電子元件具有多功能之電路控制性。 該埋孔結構150’係由鑽孔技術製作，一般埋孔結構150’於 導電層110’與絕緣層120’之壓合製程中，絕緣層120’之樹 201117960 脂組成物流入該中空之導電柱151’中並填滿之。此外，該 多層層合板亦可具有通孔結構160’，該通孔結構160’係可 電性連接多層導電層110’。 然而多層層合板之層數增加、組裝溫度的提高、板厚 對孔徑縱橫比的增加、及埋孔密度增加等因素，使得多層 板之埋孔容易在組裝製程時聚集大量的熱能，在絕緣層材 料熱傳導性小的因素下，無法有效地將熱量排出板材，造 φ 成埋孔密集區域板溫迅速上升，導致材料因高溫產生分層 裂化的現象，使得電路板層數設計受到限制。 然而先前技術中使用非規則型之填充物（如滑石粉）填 充於電路板之絕緣層中以增加導熱性，請參閱第三圖，然 非規則形狀之填充物於絕緣層與導電層熱壓板壓合時，絕 緣層中不規則形狀之填充物不易流動至埋孔結構中，使得 埋孔結構中之樹脂材質於上述受熱環境下易造成熱能聚集 而無法有效排出熱能，造成該部位材料因受熱膨脹造成擠 ® 壓並產生分層裂化。 【發明内容】 為了改善上述習知技術之缺失，本發明之目的在於提 供一種具有球形填充物之多層層合板，該多層層合板之絕緣 層係包含填充有球型填充物之樹脂組成物，以利於多層層 合板之導電層與絕緣層疊合並壓合時，球型填充物可均勻 填入多層層合板間之埋孔内，藉以提高該絕緣層之熱傳導 201117960 效率。 基於本發明之上述目的，本發明係提供—多層層合 板其係包含複數個導電層以及複數個絕緣層。該複數個 、巴.、彖層係與4導電層彼此交錯疊置。該絕緣層係、包含 強材與一樹脂組成物。該補強材係由玻璃纖維布所 該樹脂組成物係附著於該補強材，其中該樹脂組成物係包含 至少一種樹脂與球型填充物。 成物ί二之戶型填充物之重量百分比可為所述樹脂組 以該絕緣層之熱膨脹性為考量，該球 i真充物之較仏重量百分比為20〜70%。 P所η電f可為金屬或金屬合金層’-般較佳為金屬 V白層’如銅浴層。該銅箱層表 亦可為:面光滑另-面粗糙之銅荡層/面或疋4面’ =述=緣層之樹脂組成物可包含環氣樹脂 所述導電層與絕緣層交錯疊m中” 可為其體積細小之顆粒粉末，其尺寸 丁及不水羊級，其較佳為奈米 ==為:t狀之下列材料如·： 氮化觸乳化鎮、風乳化鎮、碳酸躬、氮化銘、 氧化鋅化抑、碳㈣、<_、三氧化鈦、 、乳化鉛、石英、鑽石粉、類鑽石粉、石墨、或锻燒 201117960 向崩土之至少-種成份所組成。該球型填充物於高黏度之樹 脂組成物具有較低之摩擦力，使得導電層與絕緣層壓合過程 中’球型填充物可有效於㈣組成射流魅流人至埋孔結 構中：所述球型填充物之表面形狀越完整、無缺陷凹洞，則 其於高黏度樹脂巾之表㈣擦力越低’於高黏度樹脂中流動 性越佳’且則均勾分佈於埋孔結構+。相較㈣知技藝使 用非規·之填充物於導電層與絕緣層壓合過程中不易流動 鲁 土里孔、、’°構中且不易均勻分佈，本發明戶斤述之球型填充物可 有效改善上述缺失。 、 ，此外，_高導熱率之麵填充物可有效改善絕緣層中 之導熱率，選用適當之熱膨脹係數之球型填充物可有效改善 H緣層之熱膨脹性。因此，本發明之導熱黏著材質於熱壓 板壓合程序巾’球型填充物利於埋孔巾流動並均勻分佈於 其中’使得多層層合板之埋孔結構中之球型填充物均勻分 佈，進而改善多層層合板之整體熱傳導率及調變熱膨脹 % 11，使得本發明所述之多層層合板壓合之多層電路板在電 路板：游高溫組裝製程時能有效地散熱，不致造成板材裂 化，藉此提高板材的耐熱性及製程良率。 綜上所述，本發明藉由電路板t之絕緣層中添加高散 熱性之球型填充物，可有效填充於電路板之埋孔結構中，使 絕緣層整體熱阻值比習知技術下降約丨〇 %〜2 〇 %，散熱效率變 高，聚熱現象獲得纾解，耐熱性亦同步顯著提升。此外，本 發明所述之多層層合板，其疊合之絕緣層與導電層之數目 可相較於習知技術大幅提昇，並且克服習知技術.中層合板因 201117960 高溫產生分層裂化的現象。 關於本發明之優點與精神可以藉由以下的實施例及所 附圖式得到進一步的瞭解。 【實施方式】201117960 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a circuit board, particularly a multilayer circuit board having a spherical filler. [Prior Art] In the past, the insulating layer material of the printed circuit board was made of a material having low thermal conductivity to achieve an insulating effect under the requirement of electrical insulation. Due to the low heat conductivity, the plate collects a large amount of heat energy in the subsequent surface mount technology (SMT) high-temperature assembly process, which cannot effectively dissipate heat, resulting in problems of poor heat resistance and even material deterioration. In recent years, the downstream assembly process of printed circuit boards has progressed from lead to lead-free process under the premise of environmental protection. The assembly temperature of SMT has also increased from 245 ° C to 260 ° C, making the heat dissipation and heat resistance of the board more facing. test. Referring to the first and second figures, the printed circuit board is upgraded from the conventional laminate to the multi-layer laminate by the technical improvement. The multi-layer laminate is overlapped with the multi-layer insulation layer 120' by the multi-layer conductive layer 110'. Constructed and laminated, the multilayer conductive layer has a hollow buried hole structure 150'. One side wall of the buried hole structure 150' is provided with a conductive pillar 15 such that the conductive layer 110' is electrically connected to another conductive layer adjacent thereto. The connection is added to increase the circuit design so that the electronic components electrically connected to the printed circuit board have multifunctional circuit controllability. The buried via structure 150' is fabricated by a drilling technique. In general, the buried via structure 150' is in a process of bonding the conductive layer 110' and the insulating layer 120'. The insulating layer 120's tree 201117960 is composed of a lipid composition flowing into the hollow conductive layer. The column 151' is filled and filled. In addition, the multilayer laminate may also have a via structure 160' electrically connected to the plurality of conductive layers 110'. However, the increase of the number of layers of the multi-layer laminate, the increase of the assembly temperature, the increase of the plate thickness to the aspect ratio of the aperture, and the increase of the buried hole density make the buried hole of the multilayer board easy to gather a large amount of heat energy during the assembly process, in the insulating layer. Under the condition of small thermal conductivity of the material, the heat can not be effectively discharged out of the plate, and the temperature of the plate is increased rapidly in the dense region of the buried hole, which causes the layer to crack due to high temperature, which limits the design of the number of layers of the circuit board. However, in the prior art, irregular fillers (such as talc) are used to fill the insulating layer of the circuit board to increase thermal conductivity. Please refer to the third figure, but the irregularly shaped filler is hot pressed between the insulating layer and the conductive layer. When the plate is pressed, the irregular shape filler in the insulating layer does not easily flow into the buried hole structure, so that the resin material in the buried hole structure is likely to cause thermal energy to accumulate in the above-mentioned heated environment, and the heat energy cannot be effectively discharged, resulting in the material of the part. Thermal expansion causes crushing and delamination. SUMMARY OF THE INVENTION In order to improve the above-mentioned deficiencies of the prior art, it is an object of the present invention to provide a multilayer laminate having a spherical filler, the insulating layer of the multilayer laminate comprising a resin composition filled with a spherical filler, When the conductive layer of the multi-layer laminate is combined with the insulating laminate, the spherical filler can be uniformly filled into the buried holes between the multilayer laminates, thereby improving the heat conduction of the insulating layer 201117960. In view of the above objects of the present invention, the present invention provides a multilayer laminate comprising a plurality of conductive layers and a plurality of insulating layers. The plurality of Ba, 彖, and 4 conductive layers are alternately stacked one on another. The insulating layer is composed of a strong material and a resin composition. The reinforcing material is adhered to the reinforcing material by a glass fiber cloth, wherein the resin composition contains at least one resin and a spherical filler. The weight percentage of the filler of the product may be that the resin group is considered to have a thermal expansion property of the insulating layer, and the weight percentage of the spherical filler is 20 to 70%. The η electric f of P may be a metal or metal alloy layer ', preferably a metal V white layer' such as a copper bath layer. The copper box layer table may also be: a smooth surface and a rough surface of the copper layer/face or a 疋4 surface' = the resin composition of the edge layer may comprise a ring-shaped resin. The conductive layer and the insulating layer are interdigitated. Medium" can be a small-sized granular powder, the size of which is small and non-water-grade, preferably nano-==: t-like materials such as: nitriding emulsified town, wind emulsified town, strontium carbonate , nitriding, zinc oxide, carbon (four), < _, titanium dioxide, emulsified lead, quartz, diamond powder, diamond powder, graphite, or calcined 201117960 to at least the composition of the collapse of the soil The spherical filler has a low friction force in the high-viscosity resin composition, so that the spherical filler can be effectively used in the process of laminating the conductive layer and the insulating layer to form a jet flow to the buried hole structure: The more complete the surface shape of the spherical filler, the defect-free cavity, the lower the rubbing force of the high-viscosity resin towel (4), the better the fluidity in the high-viscosity resin, and the hook is distributed in the buried hole. Structure +. Compared with (4) knowing the art, the use of non-standard fillers in the conductive layer and insulation lamination process It is not easy to flow the hole in the soil, and it is not easy to evenly distribute in the '° structure. The spherical filler of the present invention can effectively improve the above-mentioned defects. Moreover, the surface filler of high thermal conductivity can effectively improve the insulation layer. In the thermal conductivity, the ball-shaped filler with appropriate thermal expansion coefficient can effectively improve the thermal expansion of the H-edge layer. Therefore, the heat-conductive adhesive material of the present invention is applied to the hot-pressing plate pressing program towel. Flowing and evenly distributing therein, so that the spherical filler in the buried structure of the multilayer laminate is uniformly distributed, thereby improving the overall thermal conductivity of the multilayer laminate and the % thermal expansion of the multilayer laminate, so that the multilayer laminate of the present invention is pressed The multi-layer circuit board can effectively dissipate heat during the high-temperature assembly process of the circuit board, and does not cause cracking of the board, thereby improving the heat resistance and the process yield of the board. In summary, the present invention is insulated by the circuit board t A high-efficiency spherical filler is added to the layer, which can be effectively filled in the buried hole structure of the circuit board, so that the overall thermal resistance value of the insulating layer is reduced by about 丨〇% compared with the prior art. 2 〇%, the heat dissipation efficiency becomes high, the heat collecting phenomenon is obtained, and the heat resistance is also significantly improved. In addition, the multilayer laminate of the present invention has a number of laminated insulating layers and conductive layers comparable to those of the conductive layer. The technology is greatly improved, and the conventional technology is overcome. The phenomenon that the middle laminate is layered and cracked due to the high temperature of 201117960. The advantages and spirit of the present invention can be further understood by the following embodiments and the drawings. 】
請參閱第四圖與第五圖，第四圖係本發明多層層合板 之剖視示意圖，第五圖係本發明之具有球形填充物之多層屛 合板之半固化膠片（絕緣層之先期材料）之製作流程示惫 圖。本發明之具有球形填充物之多層層合板1〇〇係包含複 數個導電層丨10及複數個絕緣層12〇，所述導電層可為金 屬或金屬合金層，一般較佳為金屬箔層，如銅箔層。該銅 箔層表面可為光滑面或是粗糙面，亦可為/面光滑另一面 粗糙之銅箔層。所述之絕緣層12〇係與所述導電層11〇彼此 交錯疊置，該絕緣層120係包含補強材與樹脂組成物，該樹 脂組成物係包含至少-種樹脂與球型填充物。本發明之多 '層 層合板可經㈣多層層合板上之導電層以微影#刻等方工; 形成電路，以使本發明之多層層合板製成電路板。X :衣作本發明之多層層合板1〇〇前，首先，先準伟 ㈣充物13〇(請參閱第六圖），該球型填充物13〇係可这 ::匕矽、熔融態二氧化矽、氧化鋁、氧化鎂、氫氧化鎂、 :弓、氮她、IU㈣、氫氧化銘、碳化財、碳化石夕、 -夂納、一氧化鈦、氧化鋅、氡化碎 — φ ^ 千軋化鉛石央、鑽石粉、類驾 私、石墨、或煅燒高嶺土 插Λ、\ 員之至乂一種成分所構成。該球驾 充物130可依據粒徑大，丨 穴小區刀成至少—粒徑等級，使名 201117960 等及：具有相近之粒徑尺寸’於本發明中可採用小於 啡粒徑之球型填充物，較佳為〇之球型填充Please refer to the fourth and fifth figures. The fourth figure is a schematic cross-sectional view of the multi-layer laminate of the present invention, and the fifth figure is the semi-cured film of the multi-layer plywood with spherical filler of the present invention (previous material of the insulating layer) The production process is shown in the figure. The multi-layer laminate 1 having a spherical filler of the present invention comprises a plurality of conductive layers 10 and a plurality of insulating layers 12, wherein the conductive layer may be a metal or metal alloy layer, generally preferably a metal foil layer. Such as a copper foil layer. The surface of the copper foil layer may be a smooth surface or a rough surface, and may be a copper foil layer having a smooth surface and a rough surface. The insulating layer 12 and the conductive layer 11 are interleaved with each other. The insulating layer 120 comprises a reinforcing material and a resin composition, and the resin composition comprises at least one kind of resin and a spherical filler. The multi-layer laminate of the present invention can be patterned by lithography of the conductive layer on the (IV) multilayer laminate; the circuit is formed to form the multilayer laminate of the present invention into a circuit board. X: Before the coating of the multi-layer laminate of the present invention, first, first, the first (4) filling 13 〇 (see the sixth figure), the spherical filler 13 can be:: 匕矽, molten state Cerium Oxide, Alumina, Magnesium Oxide, Magnesium Hydroxide, : Bow, Nitrogen Her, IU (IV), Hydroxide, Carbonization, Carbonized Fossil, Cannes, Titanium Dioxide, Zinc Oxide, Antimony - φ ^ It consists of a thousand-rolled lead stone, diamond powder, class-driven, graphite, or calcined kaolin, and a member of the genus. The ball driving charge 130 can be made according to a large particle size, and the acupoint zone is cut into at least a particle size class, so that the name 201117960 and the like: having a similar particle size size can be used in the present invention. Object, preferably ball type filling
以下奈米尺寸之球型填充物。此外，該球型 具有—平滑球型表面，較佳可選用表面光 '月t之球型填充物、高導熱率之球型填充物或是較佳 熱賴率之麵填充物’最佳可制表面光滑無缺陷、高 導熱係數及較佳_脹率之球型填充物。其中該球型填充 物130之V熱率係wW/mK，該球型填充物之熱膨脹率 係可用以調變該絕緣層之熱膨脹係數。 另準備一樹脂組成物，該樹脂組成物係由至少一種樹 脂所組成，該樹脂係可包含環氧樹脂（Ep〇xy)、硬化劑 (Hardener)、催化劑（Catalyst)、與溶劑（s〇lvem)等成份所組 成。该環氧樹脂係可為雙酚A(bisphen〇1_A)環氧樹脂、雙酚 F(bisphenol_F)i^氧樹脂、雙酚s(bisphen〇1_s)環氧樹脂酚醛⑽⑽! 110¥0以）環氧樹脂、雙盼八紛酸(13如11611〇1-八110¥0以）環氧樹脂、 鄰曱酚(0-cres〇l novolac)環氧樹月旨、三官能基(trifimcti〇nal)環氧樹 脂、四官能基(tetraflmctional)環氧樹脂、多官能基(muitiflmctional) 環氧樹脂、Dicyclopendiene(DCPD) epoxy resin、P-xylene epoxy resin、含石粦環氧樹脂、Naphthalene epoxy resin、苯并e比喃型環氧 樹脂之至少其一者。該硬化劑係可為雙氰二醯胺、二氨基二苯 項酸(DDS)、4,4’-methylenedianiline(MDA)、紛駿樹脂、氰酸酯 (cyanate ester)、苯弁号秦（Benzoxazine)、Polyphenyl ether、 Polyphenylene oxide 、 9,10-duhydro-9-oxa-10 -phosphaphenanthrene-10-oxide(DOPO)或酸酐所構成。該催化劑 [Γ% 1 9 201117960 係由。米吐(imidazole)、三氟化棚胺複合物、氣化乙基三紛基石粦 (ethyltriphenyl phosphonium chloride)、二曱基咪 〇坐 (2-methylimidazole ； 2MI) 、2-乙基-4-曱基 口米 σ坐 (2-ethyl-4-methylimidazole ； 2E4MZ)、三苯基石粦 (triphenylphosphine ； TPP)與 4-二甲基胺基吡 0定 (4-dimethylaminopyridine ; DMAP)中之至少一者所構成。該溶劑 係可為曱苯(toluene)、丙酮(acetone)、丁酮(MEK)、環己酮、丙 二醇曱醚(propylene glycol monomethyl ether)以及二甲基甲醯胺 鲁中之至少一者。The following nano-sized spherical fillers. In addition, the ball type has a smooth spherical surface, preferably a surface light 'moon t ball type filler, a high thermal conductivity ball type filler or a better thermal rate surface filler' is optimally made. A spherical filler having a smooth surface without defects, a high thermal conductivity, and a preferred expansion ratio. The V-heat rate of the spherical filler 130 is wW/mK, and the thermal expansion coefficient of the spherical filler can be used to modulate the thermal expansion coefficient of the insulating layer. Further, a resin composition is prepared which is composed of at least one resin which may include an epoxy resin (Ep〇xy), a hardener (Hardener), a catalyst (Catalyst), and a solvent (s〇lvem). ) consists of components. The epoxy resin may be bisphenol A (bisphen〇1_A) epoxy resin, bisphenol F (bisphenol_F) ioxy resin, bisphenol s (bisphen〇1_s) epoxy resin phenolic (10) (10)! 110¥0)) ring Oxygen resin, double-hopping acid (13 such as 11611〇1-eight 110¥0) epoxy resin, o-nonylphenol (0-cres〇l novolac) epoxy tree, trifunctional (trifimcti〇nal) Epoxy resin, tetraflMctional epoxy resin, polyfunctional (muitiflmctional) epoxy resin, Dicyclopendiene (DCPD) epoxy resin, P-xylene epoxy resin, antimony-containing epoxy resin, Naphthalene epoxy resin, benzo-e ratio At least one of the epoxy resins. The hardener may be dicyandiamide, diaminodiphenyl acid (DDS), 4,4'-methylenedianiline (MDA), rhodium resin, cyanate ester, Benzoxazine ), Polyphenyl ether, Polyphenylene oxide, 9,10-duhydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) or anhydride. The catalyst [Γ% 1 9 201117960 is based on. Imidazole, trifluoroaluminum sulphate complex, ethyltriphenyl phosphonium chloride, 2-methylimidazole (2MI), 2-ethyl-4-anthracene At least one of 2-ethyl-4-methylimidazole; 2E4MZ, triphenylphosphine (TPP) and 4-dimethylaminopyridine (DMAP) Composition. The solvent may be at least one of toluene, acetone, methyl ethyl ketone (MEK), cyclohexanone, propylene glycol monomethyl ether, and dimethylformamide.
將該球型填充物130與至少一種樹脂置於一攪拌機2〇( 中攪拌混合以形成一樹脂溶液。該攪拌機可進一步包含均質 機、多滾輪研磨機及球磨機以均勻攪拌該球型填充物及至 少一種樹脂並使該球型填充物均勻分散於樹脂溶液中。該 樹脂組成物中該環氧樹脂之較佳重量百分比為2〇〜45%、該 硬化劑之較佳重量百分比為2〜6〇%、該催化劑之較佳重量^ 分比為0.01〜0.03%、該球型填充物之重量百分比可為$〜规 (車乂仏之重里百分比為2〇〜7〇%)、該溶劑之較佳重量百分比 為30/。上述之该環氧樹脂、該硬化劑、該催化胃彳、^ 球型填充物、該溶狀重量百分比之總和係小 :/。。其中該球型填充物於該樹脂組成物中之重量百分f匕為 且耗氧樹脂、該硬化劑、該催化劑、該球型 m 劑之重量百分比之總和係小於或等於1嶋，並 不起出本發明之範圍。 所述球型填充物πο與至少一種樹脂混合形成之樹脂溶 201117960 液通入漫泡槽300並靜置於該浸泡槽3〇〇中。一補強材ι21 係可為由玻墙纖維所構成之玻璃纖維布，其重量可為21〇 g/m2 ’可將該補強材121可捲收為一布捲狀，並設置於一 捲收機400中。 該補強材121可經由滾輪等傳輸機構500，從該捲收 機400傳輸於該浸泡槽3〇〇以浸泡該樹脂溶液。於本實施例 中，该補強材121經由浸泡後，該樹脂溶液附著於該補強 材121之纖維内及該補強材121之表面。 於s亥補強材121經過浸泡樹脂溶液過後，可經由該傳輸 機構500輸送至一烘乾機6〇〇加以烘乾，以形成一半固化膠 片（形成絕緣層之先期材料）12〇a，其中該溶劑可於該烘乾過 程中蒸發，因此可不存在或微量存在於該半固化膠片12如 中。最後該半固化膠片12〇a於傳輸之過程中冷卻，並經由一 回收機700捲收成一布捲狀。 另請一併參考第七圖，上述之半固化膠片12〇a可經由 一裁切機800裁切成適當之大小，並將多個裁切後之半固化 膠片⑽加以疊置。之後，如第八圖所示，疊合二金屬薄層 (導電層）110a於該疊置之半固化膠片之上下表面’並經由二 壓合機（圖未示）於尚溫高壓下壓合該二金屬薄層丨1如與該 半固化膠片，該半固化膠片經高溫及高壓作用下固化形成」 絕緣層120。 ’ 該金屬薄層ll〇a係可為由銅箔所構成，銅箔之規格為^ 盎司/平方英呎（oz/ft2)。於另一實施例中，可僅由—片金屬 薄層110a貼合於一片半固化膠片12加之上表面，均未超出 201117960 本發明之精神。 金屬薄層110a貼附完畢後，可經由曝光、顯影、與兹刻 等習知之印刷電路板製作技術，將該金屬薄層丨丨如形成一導 電層110，如第九圖所示。該導電層11〇係可為印刷杂= 之電路線路。 ％ 請參閱第十圖，其將上述複數個設有導電層11〇之絕緣 層120彼此交錯疊置，並於兩相鄰之導電層11〇間設置一半 固化膠片12〇a’、經一壓合機（圖未示）將上述之元件再次壓 合，該壓合機之壓合力可為25〜32 kg/cmA2，壓合溫度 .l〇〇°C ’最高可至溫度21(rc，硬化溫度速率可=⑽ °C/ 60mm。該半固化膠片12〇a係經由該壓合機之壓合與增 溫軟化後，可填充於導電層110之空隙14〇 (如圖十八），此 時半固化膠片120a中之球型填充物13G可有效流入空隙 140中。該半固化膠片i2〇a經由高溫及高壓作用下固化形成 絕緣層，該絕緣層與兩相鄰導電層11〇結合，重複上述步驟 可形成多層層合板100。上述本發明之絕緣層12〇與導電層 110之數目並不加以限制。 曰 此外，一導電層與其相鄰之另一導電層間，係可包含一 埋孔結構。本發明之第二實施例，請參閱第十一圖至第十 四圖。與第一實施例不同的是，如第十一圖所示，疊合於一 絕緣層120上下表面之導電層n〇之空隙14〇間，貫穿一穿 洞141，該穿洞141可由習知技術之鑽孔技術即可達成，在 此不多做資述。 之後可進一步於該穿洞141製作一埋孔結構15〇，如第 12 201117960 作方、ΙΐΓ。所述埋孔結構15Q可進—步包含以化學電鍍f 12〇上方/作之導電柱151，以達電性連接之功能。絕緣層 ,, 下方之導電層U0係藉由該導電柱151做電性聛 =該導奸丨Μ射為化學電料方切職結構^ *二面上形成之一導電金屬箔層。將半固化膠片120a再次 豐a於上述複數個導％層11Q與絕緣層12 ，間。如第十三圖與第十三圖A所示，該多個層合=The ball filler 130 and the at least one resin are placed in a mixer 2 (mixed and mixed to form a resin solution. The mixer may further comprise a homogenizer, a multi-roll mill and a ball mill to uniformly stir the ball filler and At least one resin and uniformly dispersing the spherical filler in the resin solution. The preferred weight percentage of the epoxy resin in the resin composition is 2 〇 to 45%, and the preferred weight percentage of the hardener is 2 to 6 〇%, the preferred weight ratio of the catalyst is 0.01~0.03%, and the weight percentage of the spherical filler can be $~ gauge (the percentage of the weight of the rut is 2〇~7〇%), the solvent Preferably, the weight percentage is 30/. The above epoxy resin, the hardener, the catalytic stomach cavity, the spherical filler, and the total weight percentage of the solution are small: /. wherein the spherical filler is The weight percentage of the resin composition is such that the sum of the weight percentages of the oxygen-consuming resin, the hardener, the catalyst, and the spherical type m agent is less than or equal to 1 Å, and does not fall within the scope of the present invention. The spherical filler πο and to A resin-mixed resin solution 201117960 liquid is introduced into the diffuser tank 300 and placed in the immersion tank 3〇〇. A reinforcing material ι21 can be a glass fiber cloth composed of glass fiber, and its weight can be 21 〇g/m2' can be wound into a roll shape and placed in a roll-up machine 400. The reinforcing material 121 can be transported from the winder 400 via a transport mechanism 500 such as a roller. The immersion tank 3 is immersed in the resin solution. In the embodiment, after the immersion material 121 is immersed, the resin solution adheres to the fiber of the reinforcing material 121 and the surface of the reinforcing material 121. After being immersed in the resin solution, the material 121 can be sent to a dryer 6 via the transport mechanism 500 and dried to form a semi-cured film (previous material forming the insulating layer) 12〇a, wherein the solvent can be Evaporation during the drying process, so it may be absent or traced in the prepreg film 12. Finally, the prepreg film 12〇a is cooled during the transfer and is wound into a roll through a recovery machine 700. Please refer to the seventh picture together. The above-mentioned prepreg 12 〇a can be cut to an appropriate size by a cutter 800, and a plurality of the cut prepreg films (10) are stacked. Thereafter, as shown in the eighth figure, the overlap is performed. a thin layer of two metal (conductive layer) 110a on the lower surface of the stacked semi-cured film and press-bonded to the second thin metal layer 1 via a second press (not shown) under high temperature and pressure Curing film, the semi-cured film is cured by high temperature and high pressure to form "insulation layer 120." The metal thin layer ll〇a can be composed of copper foil, and the specification of copper foil is ^ oz / square inch (oz / ft2) In another embodiment, only a sheet of metal thin layer 110a may be applied to a portion of the prepreg 12 plus the upper surface without exceeding the spirit of the present invention. After the metal thin layer 110a is attached, the thin metal layer can be formed into a conductive layer 110 by exposure, development, and conventional printed circuit board fabrication techniques, as shown in FIG. The conductive layer 11 can be a printed circuit. % Referring to the tenth figure, the plurality of insulating layers 120 provided with the conductive layer 11〇 are alternately stacked with each other, and a half-cured film 12〇a' is disposed between the two adjacent conductive layers 11〇. The above-mentioned components are pressed again by the machine (not shown). The pressing force of the press machine can be 25~32 kg/cmA2, and the pressing temperature can be up to the temperature of 21 (rc, hardened). The temperature rate can be (10) ° C / 60 mm. The prepreg 12 〇 a can be filled in the gap 14 导电 of the conductive layer 110 after being pressed and softened by the press (see FIG. 18). The ball-shaped filler 13G in the prepreg film 120a can effectively flow into the gap 140. The prepreg film i2〇a is cured by high temperature and high pressure to form an insulating layer, and the insulating layer is combined with two adjacent conductive layers 11〇. The above steps may be repeated to form the multilayer laminate 100. The number of the insulating layer 12A and the conductive layer 110 of the present invention is not limited. Further, a conductive layer and a conductive layer adjacent thereto may include a buried hole. Structure. For the second embodiment of the present invention, please refer to the eleventh to tenth In the fourth embodiment, as shown in the eleventh embodiment, a gap 14 is formed between the gaps 14 of the conductive layer n on the upper and lower surfaces of an insulating layer 120, and a through hole 141 is penetrated through the hole 141. It can be achieved by the drilling technique of the prior art, and no further information is provided here. Then, a buried hole structure 15〇 can be further formed in the through hole 141, such as the 12th 201117960 square, the buried hole structure. The 15Q step-by-step includes electroless plating of the conductive pillars 151 on the upper side of the f 12 以 to electrically connect the functions. The insulating layer, the lower conductive layer U0 is electrically connected by the conductive pillars 151= The conductive film is formed into a chemical electric material. The conductive metal foil layer is formed on both sides. The semi-cured film 120a is again abundance between the plurality of conductive layers 11Q and the insulating layer 12. Thirteenth and Thirteenth A, the plurality of laminations=
固半口化膠片12Qa藉由高溫與高壓之熱壓板製程再次麗 5，同理地，半固化膠片12如中之球型填充物13〇可於壓 合製程中流人該導電柱151中間所環燒之中空結構中並填 滿之並進一步固化。 、 —如第十四圖所示，經由壓合機壓合後’係形成本發明第 二實施例所述之多層層合板l〇〇a。 經由實驗測試本發明與習知技術之比較，本發明所述 之球型填充物相較於習知技術使用之非規則型填充物使得絕 緣層之熱阻值比習知技術下降約10%〜20%，特別是絕緣層之 埋孔結構中’球型填充物可有效填入並均勻分佈，熱傳導效 率變高，聚熱現象獲得纾解，耐熱性亦顯著提升。本發明之 多層層合板之層數可相較於習知技術大幅提昇至二十二声 以上，舉例而言，該等絕緣層可提昇至十層以上，該等 導電層110可挺昇至一十一層以上，若加入該外部導電層 lio，可使該專外部導電層no與遠等導電層11〇之層數為 二十四層以上。並且不會如習知技術因高溫使得絕緣層產生 分層裂化的現象。 13 201117960 藉由以上較佳具體實施例之詳述，係希望能更加清楚 描述本發明之特徵與精神，而並非以上述所揭露的較佳具 體實施例來對本發明之範疇加以限制。相反地，其目的是 希望能涵蓋各種改變及具相等性的安排於本發明所欲申請 之專利範圍的範壽内。 【圖式簡單說明】 第一圖係習知技術之多層層合板側面剖視示意圖； • 第二圖係習知技術中具有埋孔及導電柱之多層層合板側 面剖視示意圖； 第三圖係顯示於顯微鏡下所拍攝習知技術之非規則型填 充物之影像； 第四圖係本發明具有球形填充物之第一實施例之多層層 合板之剖視不意圖， 第五圖係本發明具有球形填充物之第一實施例之多層層 合板之半固化膠片之製作流程示意圖； ® 第六圖係顯示於顯微鏡下所拍攝之球型填充物之影像； 第七圖係本發明之半固化膠片經由裁切機裁切之示意 圖； 第八圖係本發明之絕緣層與金屬薄層疊合層合板之剖視 不意圖， 第九圖係本發明之第八圖之導電層經由微影製成製作線 路之層合板剖視示意圖； 第十圖係本發明之多層層合板經由壓合機壓合之示意 14 201117960 圖， 第十A圖係半固化膠片增溫軟化後，填充於導電層間之空 隙之示意圖； 第十一圖係本發明第二實施例所述具有埋孔結構之層合 板之剖視不意圖， 第十二圖係本發明之多層層合板之第二實施例於壓合前 之分解示意圖； 第十三圖係本發明之多層層合板之第二實施例於壓合前 鲁 之剖視不意圖， 第十三A圖係於第二實施中半固化膠片增溫軟化後，填 充於導電層間之埋孔結構之不意圖，以及 第十四圖係本發明之多層層合板之第二實施例之剖視示 意圖。 【主要元件符號說明】 [習知技術] ® 導電層110’ 絕緣層120’ 埋孔結構150’ 導電柱151’ 通孔結構160’ [本發明] 多層層合板100、100a 導電層110、110a、 15 201117960 絕緣層120 半固化膠片120a 補強材121 球型填充物130 空隙140 穿洞141 埋孔結構150 導電柱151 攪拌機200 輸送設備210 浸泡槽300 捲收機400 傳輸機構500 烘乾機600 回收機700 裁切機800The solid half-film 12Qa is again made by the hot plate process of high temperature and high pressure. Similarly, the semi-cured film 12 such as the ball type filler 13 can be flown in the middle of the conductive column 151 in the pressing process. The hollow structure of the ring is filled and further cured. - As shown in Fig. 14, after lamination by a press machine, the multilayer laminate 10a according to the second embodiment of the present invention is formed. Through experimental comparison of the present invention with the prior art, the spherical filler of the present invention reduces the thermal resistance of the insulating layer by about 10% compared to the conventional technique using the irregular filler used in the prior art. 20%, especially in the buried hole structure of the insulating layer, the spherical filler can be effectively filled and evenly distributed, the heat conduction efficiency becomes high, the heat collecting phenomenon is obtained, and the heat resistance is also remarkably improved. The number of layers of the multi-layer laminate of the present invention can be greatly increased to more than 22 sounds compared to the prior art. For example, the insulating layers can be raised to more than ten layers, and the conductive layers 110 can be raised to one. Eleven or more layers, if the external conductive layer lio is added, the number of layers of the outer conductive layer no and the far conductive layer 11 may be twenty-four or more. And it does not cause stratified cracking of the insulating layer due to high temperature as in the prior art. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the patent scope of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a side cross-sectional view of a multilayer laminate of the prior art; • The second figure is a side cross-sectional view of a multilayer laminate having buried holes and conductive columns in the prior art; An image showing an irregular filler of a conventional technique taken under a microscope; the fourth drawing is a cross-sectional view of the multilayer laminate of the first embodiment having a spherical filler of the present invention, and the fifth drawing is a Schematic diagram of the manufacturing process of the semi-cured film of the multilayer laminate of the first embodiment; the sixth figure shows the image of the spherical filler taken under the microscope; the seventh figure is the semi-cured film of the present invention The figure is cut through a cutting machine; the eighth figure is a cross-sectional view of the insulating layer and the metal thin laminated ply of the present invention, and the ninth drawing is made of the electroconductive layer of the eighth figure of the present invention. A cross-sectional view of the laminate of the circuit; the tenth is a schematic diagram of the multi-layer laminate of the present invention pressed by a press machine 14 201117960, and the tenth A is a semi-cured film which is softened and softened, and then filled in BRIEF DESCRIPTION OF THE DRAWINGS FIG. 11 is a cross-sectional view of a laminate having a buried hole structure according to a second embodiment of the present invention, and a twelfth embodiment is a second embodiment of the multilayer laminate of the present invention. FIG. 13 is a cross-sectional view of the second embodiment of the multi-layer laminate of the present invention before pressing, and FIG. 13A is a second embodiment of the semi-cured film for warming. The softened, unintentional structure of the buried via structure filled between the conductive layers, and the fourteenth embodiment is a schematic cross-sectional view of the second embodiment of the multilayered laminate of the present invention. [Main component symbol description] [Prior Art] ® conductive layer 110' insulating layer 120' buried via structure 150' conductive pillar 151' via structure 160' [invention] multilayer laminate 100, 100a conductive layer 110, 110a, 15 201117960 Insulation layer 120 Semi-cured film 120a Reinforcing material 121 Spherical filler 130 Void 140 Hole 141 Buried hole structure 150 Conductive column 151 Mixer 200 Conveying equipment 210 Soaking tank 300 Retractor 400 Transmission mechanism 500 Dryer 600 Recycling machine 700 cutting machine 800