201117915 六、發明說明： I：發明戶斤屬之技術領域3 發明領域 本發明係有關於一種包含有：用以切削被加工物之切 削刀片；及用以供給切削液至切削刀片之切削液供給裝備 之切削裝置。201117915 VI. Description of the invention: I: Technical field of inventions 3 FIELD OF THE INVENTION The present invention relates to a cutting insert comprising: a cutting insert for cutting a workpiece; and a cutting fluid supply for supplying cutting fluid to the cutting insert Equipment for cutting equipment.
L 發明背景 在半導體裝置之製造過程中，半導體晶圓表面形成有 1C、LSI、固態影像感測器等多數裝置。又，藉由以切削裝 置沿著用以區分各裝置且稱為之切割道的分割預定線切削 晶圓，而可分割成各個裝置。 切削裝置係以稱為切塊機之切削裝置為廣泛地使用， 而切塊機係具有包含有切削刀片之切削裝備者。切削刀片 具有以金屬或樹脂等凝固鑽石或CBN(立方氮化硼）等超級 磨料且厚度為數十〜數百微米左右之切刀，且該切削刀片 係一面以30000rpm左右的高速旋轉一面切入被加工物，並 藉由切削除去被加工物之一部而分割被加工物。 切塊機係一面供給切削水至加工點（切削刀片與被加 工物接觸之點）及被加工物上面一面進行切削，以冷卻因切 削而產生之加工熱，並將因切削而產生之切削屑從被加工 物上排出。 特別是在被加工物為表面形成有CCD或CMOS等影像 裝置之晶圓或表面形成有濾光器、光學讀頭裝置等光學裝 201117915 置之基板的情況下，由於切削屑附著在裝置上的話會引起 裝置的故障，因此非常地重視對於切削屑之附著的防止。 由於一旦附著於被加工物上且乾燥後之切削屑非常難 以在之後的洗滌步驟除去，因此如特開2007-69280號公報 所揭示，曾提出有一種從被加工物上吸收且排出含有在切 削中所產生之切削屑之切削液的機構。 先前技術文獻 專利文獻 【專利文獻1】特開2007-69280號公報 【發明内容】 發明概要 發明欲解決之課題 然而，即使如專利文獻1所揭示般欲使用吸收源吸收切 削液，但由於吸收源會因與切削液一同吸收之空氣而阻礙 切削液之吸收，因此具有吸收狀態不穩定的問題。 本發明係鑒於前述問題點而製成者，其目的在於提供 一種可穩定地吸收切削液且不會引起被加工物之裝置故障 的切削裝置。 用以欲解決課題之手段 本發明係提供一種切削裝置，包含有：用以固持被加 工物之夾頭台；具有用以切削固持於前述夾頭台之被加工 物的切削刀片及使前述切削刀片旋轉之心軸的切削裝備； 及用以供給切削液至前述切削刀片之切削液供給裝備。本 裝置更具有：吸收口，係配設於供給至前述切削刀片之前 201117915 述切削液隨著前述切削刀片之旋轉飛散之侧者；流入路 徑，係一端連接於前述吸收口且流動有透過前述吸收口所 吸收之前述切削液者；流體分離機構本體，係包含有：連 接前述流入路徑之另一端的第1開口部；於較前述第1開口 部上方開口之第2開口部；及形成於較前述第2開口部低之 位置且與前述第丨開口部形成相同之高度或位於較前述第1 開口部低之位置’並用以排出透過前述第1開口部流入之前 述切削液之第3開口部者；吸收源，係連接於前述流體分離 機構本體之前述第2開口部者；及排出路徑，係一端連接於 前述第3開口部且另一端具有形成於與前述第丨開口部相同 之兩度或較前述第i開口部低之位置的排出口，並使前述流 體分離機構本體内之前述切削液排出者。而前述排出路徑 具有一直以液體充滿前述排出口以防止外部氣體流入之液 體積存部。 發明效果 根據本發明，由於用以分離業經吸收之切削液與空氣 之流體分離機構設於用以吸收且排出切削液之路徑上，因 此可實現吸收狀態的穩定化。又，由於排出路徑形成有一 直積存有液體之液體積存部，因此可防止於吸收開始時從 排出口吸收到空氣，並可增強吸收口之吸收力。 圖式簡單說明 第1圖係切削裝置之外觀透視圖。 第2圖係顯示將切削刀片安裝於心軸之情況的分解透 視圖。 5 201117915 第3圖係切削刀片安裝於心軸之狀態的透視圖。 第4圖係連接於廢液回收裝備之刀片殼的透視圖。 第5圖係顯示切削時之作用的縱向截面圖。 第6 A圖係吸收源運作時第1實施形態之流體分離機構 的縱向截面圖。 第6 B圖係吸收停止時第1實施形態之流體分離機構的 縱向截面圖。 第7圖係本發明第2實施形態之流體分離機構的縱向截 面圖。 第8圖係本發明第3實施形態之流體分離機構的縱向截 面圖。 【實施方式3 用以實施發明之形態 以下，一面參照圖示一面針對本發明之實施形態進行 詳細地說明。第1圖係顯示本發明實施形態之切削裝置2的 外觀。切削裝置2之前面側設有用以輸入加工條件等操作員 對於裝置之指示的操作裝備4。裝置上部設有顯示有對於操 作員之引導畫面及後述之由攝影裝備所拍攝之影像之CRT 等的顯示裝備6。 8係晶圓盒，且晶圓盒8中收納有數片（例如25片）透過切 割膠帶由環狀框固持之半導體晶圓。晶圓盒8放置於可上下 移動之盒升降機9上。 晶圓盒8之後方配設有將切削前之晶圓W從晶圓盒8搬 出並將切削後之晶圓搬入晶圓盒8之搬出入裝備10。晶圓盒 6 201117915 8與搬出入裝備10之間設有作為暫時放置為搬出入對象之 晶圓之區域的暫置區域12，且暫置區域12配設有使晶圓W 位於一定位置之對位裝備14。 暫置區域12附近配設有吸附與晶圓W形成一體之框F 以進行運送且具有旋轉臂的運送裝備16，且搬出至暫置區 域12之晶圓W係經運送裝備16吸附而送至夾頭台18上，並 在經前述夾頭台18吸附的同時，藉由以多數固定裝備（夾 子）19固定框F而固持於夾頭台18上。 夾頭台18構成可旋轉且可來回移動於X軸方向之結 構，且夾頭台18之X軸方向之移動路徑的上方配設有用以檢 測出晶圓W之應切削之切割道的校準裝備20。 校準裝備20具有用以拍攝晶圓W表面之攝影裝備22， 且根據拍攝所取得的影像，可利用型樣匹配等處理檢測出 應切削之切割道。經攝影裝備22取得之影像係顯示於顯示 裝備6。攝影裝備22除了以可見射線進行拍攝之普通相機外 亦具有紅外線相機。 校準裝備2 0之左側配設有對固持於夾頭台18之晶圓W 進行切削加工之切削裝備24。切削裝備24與校準裝備20係 構成一體，且兩者具有聯動關係並一同移動於Y軸方向及Z 轴方向。 切削裝備24之結構如第3圖所示，在可旋轉之心軸26 的前端安裝有切削刀片28，並可移動於Y軸方向及Z軸方 向。又，切削刀片28位於攝影裝備22之X軸方向的延長線上。 在本實施型態中，切削刀片28之全體係由刀片殼58所 201117915 覆蓋。56係在晶圓等被加工物之切削中以槽液填滿被加工 物上面與刀片殼58之底部間的槽液供給裝備，且在本實施 型態中設置於刀片殼58之外部。 2 5係將切削完畢之晶圓W運送至洗淨裝置2 7之運送裝 備，而洗淨裝置係一面清洗晶圓W—面從空氣喷嘴喷出空 氣以烘乾晶圓W者。 當參照第2圖時，該圖顯示有表示刀片座36與固定於其 前端之心軸26與切削刀片28之安裝關係的分解透視圖。切 削裝備（切削設備）24之心軸殼32中收納有可旋轉之心軸26。 刀片座36係由轂部38及與轂部38形成一體之固定凸緣 40所構成。轂部38形成有外螺紋42。刀片座36係藉由將刀 片座36之安裝孔插入心軸26之未圖示之前端小徑部及錐形 部，並且將螺帽44旋入形成於心軸26之前端小徑部之外螺 紋並旋緊，而安裝於心軸26之前端部。 藉由將切削刀片28之安裝孔52插入刀片座36之轂部 38，並且將固定螺帽54旋入轂部38之外螺紋42並旋緊，便 可如第3圖所示般將切削刀片28安裝於心軸26。 切削刀片28稱為輪轂刀片，係具有於具有圓形輪轂48 之圓形基台46的外緣以鍍鎳固定有鑽石磨料之切刀50的電 鑄刀片。又，切削刀片28之切刀具有20〜30μηι的厚度。 當參照第4圖時，該圖顯示有本實施型態之刀片殼58 的透視圖。刀片殼58係由第1殼60及例如以連結螺絲等可裝 卸地固定於第1殼60之第2殼62所構成。 刀片殼58係由頂部58a;具有突出有切削刀片28之前端BACKGROUND OF THE INVENTION In the manufacturing process of a semiconductor device, a plurality of devices such as a 1C, an LSI, and a solid-state image sensor are formed on the surface of the semiconductor wafer. Further, the wafer can be divided into individual devices by cutting the wafer along the dividing line of the cutting path called the cutting track for distinguishing the respective devices. The cutting device is widely used as a cutting device called a dicer, and the dicer has a cutting device including a cutting insert. The cutting insert has a cutter having a superabrasive material such as a solidified diamond such as metal or resin or CBN (cubic boron nitride) and having a thickness of about several tens to several hundreds of micrometers, and the cutting insert is cut at a high speed of about 30,000 rpm. The workpiece is processed, and the workpiece is divided by cutting a part of the workpiece. The cutting machine supplies cutting water to the machining point (the point where the cutting insert comes into contact with the workpiece) and the upper surface of the workpiece to cut the machining heat generated by the cutting, and the chip generated by the cutting It is discharged from the workpiece. In particular, in the case where the workpiece is a wafer on which a video device such as a CCD or a CMOS is formed on the surface, or a substrate on which an optical device such as a filter or an optical pickup device is formed on the surface, the chip is attached to the device. This can cause malfunction of the device, so the prevention of the adhesion of the chips is highly valued. Since it is very difficult to remove the chips after being attached to the workpiece and dried, it is difficult to remove it in the subsequent washing step. Therefore, as disclosed in Japanese Laid-Open Patent Publication No. 2007-69280, it has been proposed to absorb from the workpiece and discharge it in the cutting. The mechanism of the cutting fluid generated by the cuttings. CITATION LIST OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION However, even if the absorption liquid is absorbed by the absorption source as disclosed in Patent Document 1, the absorption source is used. Since the absorption of the cutting fluid is inhibited by the air absorbed together with the cutting fluid, there is a problem that the absorption state is unstable. The present invention has been made in view of the above problems, and an object thereof is to provide a cutting device which can stably absorb a cutting fluid without causing failure of a device of a workpiece. Means for Solving the Problems The present invention provides a cutting apparatus including: a chuck table for holding a workpiece; a cutting insert for cutting a workpiece to be held by the chuck table, and cutting the cutter a cutting device for rotating the spindle of the blade; and a cutting fluid supply device for supplying the cutting fluid to the cutting insert. The apparatus further includes: an absorption port disposed before the supply to the cutting insert; and a flow of the cutting fluid scattered along the rotation of the cutting insert; and an inflow path connected to the absorption port at one end and flowing through the absorption The fluid separation mechanism body includes: a first opening that connects the other end of the inflow path; a second opening that opens above the first opening; and is formed in the second opening a third opening portion of the cutting fluid that flows through the first opening portion and has a height that is lower than the second opening portion or a position lower than the first opening portion The absorption source is connected to the second opening of the fluid separation mechanism main body; and the discharge path is connected to the third opening at one end and has the same two degrees as the first opening in the other end. Or a discharge port at a position lower than the first i-th opening, and discharging the cutting fluid in the body of the fluid separation mechanism. The discharge path has a liquid reservoir that always fills the discharge port with a liquid to prevent the inflow of external air. EFFECT OF THE INVENTION According to the present invention, since the fluid separating means for separating the absorbed cutting fluid and air is provided on the path for absorbing and discharging the cutting fluid, the absorption state can be stabilized. Further, since the discharge path is formed with a liquid reservoir portion in which the liquid is stored, it is possible to prevent absorption of air from the discharge port at the start of absorption and to enhance the absorption force of the absorption port. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the appearance of a cutting device. Fig. 2 is an exploded perspective view showing a state in which a cutting insert is attached to a mandrel. 5 201117915 Figure 3 is a perspective view of the state in which the cutting insert is mounted on the mandrel. Figure 4 is a perspective view of the blade shell attached to the waste liquid recovery equipment. Fig. 5 is a longitudinal sectional view showing the action at the time of cutting. Fig. 6A is a longitudinal cross-sectional view of the fluid separation mechanism of the first embodiment when the absorption source is operated. Fig. 6B is a longitudinal cross-sectional view of the fluid separation mechanism of the first embodiment at the time of absorption stop. Fig. 7 is a longitudinal cross-sectional view showing a fluid separation mechanism according to a second embodiment of the present invention. Fig. 8 is a longitudinal cross-sectional view showing a fluid separating mechanism according to a third embodiment of the present invention. [Embodiment 3] Mode for Carrying Out the Invention Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a view showing the appearance of a cutting device 2 according to an embodiment of the present invention. The front side of the cutting device 2 is provided with an operation device 4 for inputting an instruction of the operator, such as a processing condition, to the device. On the upper portion of the apparatus, display means 6 for displaying a CRT or the like for a guide screen of the operator and an image captured by the photographing equipment to be described later is provided. The 8 series wafer cassette has a plurality of (for example, 25) semiconductor wafers held by the annular frame through the cutting tape in the wafer cassette 8. The wafer cassette 8 is placed on a cassette elevator 9 which can be moved up and down. After the wafer cassette 8, a carry-in/out device 10 for carrying out the wafer W before cutting from the wafer cassette 8 and carrying the cut wafer into the wafer cassette 8 is disposed. The wafer cassette 6 201117915 8 is provided with a temporary area 12 as a region temporarily placed as a wafer for loading and unloading, and the temporary area 12 is provided with a pair of wafer W at a certain position. Position equipment 14. A transport device 16 having a frame F that is integrated with the wafer W and transported and having a rotating arm is disposed in the vicinity of the temporary region 12, and the wafer W carried out to the temporary region 12 is sucked by the transport device 16 and sent to The chuck table 18 is held by the chuck table 18 by being fixed by a plurality of fixing devices (clips) 19 while being sucked by the chuck table 18. The chuck table 18 constitutes a structure that is rotatable and movable back and forth in the X-axis direction, and a calibration device for detecting a cutting path of the wafer W to be cut is disposed above the moving path of the chuck table 18 in the X-axis direction. 20. The calibration apparatus 20 has a photographing apparatus 22 for photographing the surface of the wafer W, and based on the image taken by the photographing, the cut path to be cut can be detected by a pattern matching process or the like. The image obtained by the photographic equipment 22 is displayed on the display device 6. The photographic equipment 22 also has an infrared camera in addition to a normal camera that shoots with visible rays. The left side of the calibration equipment 20 is provided with cutting equipment 24 for cutting the wafer W held by the chuck table 18. The cutting tool 24 is integrally formed with the calibration device 20, and both have a linkage relationship and move together in the Y-axis direction and the Z-axis direction. As shown in Fig. 3, the cutting tool 24 has a cutting insert 28 attached to the front end of the rotatable mandrel 26 and is movable in the Y-axis direction and the Z-axis direction. Further, the cutting insert 28 is located on an extension line of the photographing equipment 22 in the X-axis direction. In the present embodiment, the entire system of cutting inserts 28 is covered by blade shell 58 201117915. The 56-series fills the bath supply device between the upper surface of the workpiece and the bottom of the insert case 58 with a bath in the cutting of a workpiece such as a wafer, and is provided outside the insert case 58 in the present embodiment. The 5 5 transports the cut wafer W to the transport device of the cleaning device 27, and the cleaning device cleans the wafer W while cleaning the wafer W-surface from the air nozzle. When referring to Fig. 2, the figure shows an exploded perspective view showing the mounting relationship of the insert holder 36 and the mandrel 26 fixed to the front end thereof and the cutting insert 28. A rotatable mandrel 26 is housed in the mandrel housing 32 of the cutting device (cutting device) 24. The blade holder 36 is formed by a hub portion 38 and a fixing flange 40 formed integrally with the hub portion 38. The hub 38 is formed with an external thread 42. The blade holder 36 is inserted into the front end small diameter portion and the tapered portion of the mandrel 26 by inserting the mounting hole of the insert holder 36, and the nut 44 is screwed into the small end portion formed at the front end of the mandrel 26. The threads are threaded and tightened and mounted to the front end of the mandrel 26. By inserting the mounting hole 52 of the cutting insert 28 into the hub 38 of the insert holder 36 and screwing the retaining nut 54 into the outer thread 42 of the hub 38 and tightening it, the cutting insert can be as shown in FIG. 28 is mounted to the mandrel 26. The cutting insert 28, referred to as a hub insert, is an electroformed insert having an outer edge of a circular abutment 46 having a circular hub 48 to nickel plated a diamond abrasive cutter 50. Further, the cutter of the cutting insert 28 has a thickness of 20 to 30 μm. When referring to Fig. 4, the figure shows a perspective view of the blade casing 58 of this embodiment. The blade case 58 is composed of a first case 60 and a second case 62 which is detachably fixed to the first case 60 by, for example, a fastening screw. The blade shell 58 is formed by a top portion 58a; having a front end protruding from the cutting insert 28
8 201117915 之開口 64且與頂雜相對的底部通；及連接頂部％ 部58b之側壁部58c所構成^ _ 刀片殼观劃有空間部66，且該空間部Μ中插入有切 削刀片28,並且除了料從開叫突出之加工點使用之切 削刀片28之前端部以外，切削刀“係由刀片殼顺覆蓋。 刀片殼58具有切削液供妗 1〜，。路徑68,且切削液供給路徑 6=-端連接於切削液供給源7Q，而另1形成㈣ :喷出至插入有切削刀片28之空間部之喷出口 72。切削液 : 給裝備係由切削液供給路徑的;切削液供給源 削液喷出口 72所構成。 74係廢液回收裝備，玉甘 壁邱π ^ i ^ 、〜端連接於切削刀片58之側 := 成以預定角度傾斜之流人路徑(筒 體）76 ;連接於流入路徑76 ν π 知部之流體分機·;H 7 R · 及連^碰分離機構78之心賴所構成。 ， 度二：:=:_於_8之固持面呈3。 定且連續地吸收。廢液回：：越:以W、_行穩 裴備74配6又於隨著切削刀片28 之％轉飛散有供給至切削刀片28之切削液之侧。 刀片殼58,側壁部58c形成有廢液回收裝備Μ之吸收 6a ’且透過邊吸收口 66a 路徑76之内部相連通。又，、^片殼空間部66與流入 開起於底部之,76a。^认路徑76之—端部更形成有 當參照第6 A圖時，該圖 形態之流體分離機㈣=村吸师啤物1實施 縱向截面圖。而第6B圖係吸收源 201117915 8〇停止時流體分離機構78的縱向截面圖。 流體分離機構78係由槽（流體分離機構本體)82及連接 於槽82之排出路徑84所構成。槽82包含有：連接於流入路 徑76之第1開口部82a ;位於較第1開口部82a上方且連接於 吸收源80之第2開口部82b ;及形成於較第2開口 82b部低之 位置且形成於較第1開口部82a低之位置並且將流入槽82内 之廢液(切削液)排出之第3開口部82c。第3開口部82c亦可與 第1開口部82a形成相同高度。 排出路徑84之一端84a連接於槽82之第3開口部82c，且 ’成於另一端之排出口 84b開啟於較槽82之第1開口部82a 低之位置。又’亦可使排出口 84b開啟於與第1開口部82a相 同之高度。 排出路徑84之排出口 84b附近形成有彎曲成略直角之 液體積存部86。如第6B圖所示，在吸收源8〇之運作呈停止 狀態時，液體積存部86内一直充滿有廢液。 藉此，當吸收源80開始運作進行吸收時，則可防止從 排出口84b吸收到空氣，而瞬間提升吸收口66a之吸收力， 因此可有效率地將含有切削屑之廢液吸收至流體分離機構 78内。 接著’一面參照第5圖及第6圖一面針對前述之實施型 態進行說明。作為被加工物之晶圓W係如第1圖所示以透過 切割膠帶T固持於環狀框F的狀態由夾頭台丨8吸附固持。 首先’使經夾頭台18固持之晶圓W移動於X軸方向並移 動至攝影裝備22之正下方，且以攝影裝備2拍攝晶圓w，並 10 201117915 且以校準裝備20檢測出應切削之切割道’以實行校準。 接著，根據前述校準，在欲切削之切割道與切削刀片 28業經對位之狀態下，如第5圖所示，一面使切削刀片28朝 箭頭A方向以30000rpm左右之高速旋轉一面切入晶圓W，再 藉由於箭頭B方向進行夾頭台丨8之加工移送，而切削業經對 位之切割道。 在利用切削刀片28切削切割道時’係從槽液供給裝備 56供給槽液57 ’並以槽液57充滿固持於夾頭台18之晶圓與 刀片殼之底部之間’並且一面從切削液喷出口 72朝切削刀 片28之切刀50喷出切削液，一面完成晶圓W之切割道的切 削。切削液及槽液57—般係使用純水。 之後，因切削而產生之切削屑的一部分便與切削液一 同隨著切削刀片28之旋轉而旋轉，而含有切削屑之切削液 的一部分便透過形成於刀片殼58之側壁部58c的吸收口 66a 如箭頭C所示般進入廢液回收裝備74之流入路徑76内’並藉 由吸收源80之運作由流體分離機構78吸收除去。 由於喷出口72配設於切削液流向之上流測，且供給至 切削刀片28之切削液形成對於切削刀片28之外緣喷出於切 線方向’因此不會阻礙含有隨著切削刀片28之旋轉而旋轉 之切削屑的切削液的流動，並可有效地排出含有切削屑之 切削液。 另一方面，因切削而產生且未進入切削液中之剩下的 切削液便漂浮於槽液57中。前述槽液57之一部分係透過廢 液回收裝備74之流入路徑76之開口 76a進入流入路徑76 201117915 内’並經吸收源78之運作而從晶圓W上被吸收除去。 如第6A圖所示’含有因吸收源80之運作而透過流入路 徑76°及收至流體分離機構78之槽（流體分離機構本體）82内 之切削屑的切削液(廢液)75係積存於槽82之下部部分，並透 過排出路徑84從排出口 84b排出。 在前述之本實施形態之流體分離機構78中，由於因吸 收源80之運作而吸收之空氣與廢液75互相分離，且吸收源 80僅吸收空氣並且吸收路徑之途中不會因廢液75而阻塞， 因此可進行穩定地吸收，並可將於流體分離機構78分離之 廢液75穩定地從排出口 84b排出。 根據本實施形態，由於切削液係從刀片殼58内部供給 至切削刀片28，且切削刀片28大致經刀片殼58所覆蓋，並 且切削係在刀片殼5 8之底部與晶圓W間經槽液5 7填滿之狀 態下完成，因此含有切削屑之切削液不會飛濺至晶圓W 上’並可藉由廢液回收裝備7 4積極地從晶圓W上回收切削液。 又，由於在切削加工中，一直從槽液供給裝備56供給 有槽液，因此晶圓W上面不會乾燥，並可防止切削屑固著 於晶圓W上。 當吸收源80之吸收量不足時，則無法充分地吸收除女 切削屑。相反地，當吸收量過多時，則會使相對於開口 7釦 之晶圓W上面產生局部的乾燥，而使切削屑固著於晶 上面。故’宜根據流入路徑76之傾斜角度及切削晶圓 表面狀態適當地調整吸收量及槽液供給量。 當參照第7圖時，該圖顯示有本發明第2實施形態之廢 12 201117915 液回收裝備74A的縱向截面圖。本實施形態之廢液回收裝備 74A係由與第1實施形態相同之流入路徑（筒體）76 ;連接於 流入路徑76之流體分離機構78A ;及連接於流體分離機構 78 A之吸收源80所構成。 流體分離機構78A係由與第1實施形態相同之槽82 ;連 接於槽82之第3開口 $卩82(：的排出路徑84A;及透過銷90安裝 於排出路徑84A之前端部的液體積存容器88所構成。 當吸收源80之運作停止時，廢液便一直積存於前述液 體積存容器88内，因此與第1實施形態之流體分離機構78相 同地，可防止在吸收源80之吸收開始時從排出口吸收到空 氣，並可直接確保吸收口 66a之吸收力。 當參照第8圖時，該圖顯示有本發明第3實施形態之廢 液回收裝備74B的縱向截面圖。與前述第1及第2實施形態相 同地，該廢液回收裝備78B係由流入路徑（筒體)76 ;連接於 流入路徑76之流體分離機構78B ;及連接於流體分離機構 78B之吸收源80所構成。 流體分離機構78B係由與前述第1及第2實施形態相同 之槽（流體分離機構本體）82;及連接於槽82之第3開口部82c 的排出路徑84所構成。排出路徑84之前端部形成有彎曲之 液體積存部86a。 在本實施型態中，連接於排出路徑84之槽82之第3開口 部82c與第1開口 82a部形成大略相同的高度。由於本實施形 態之作用與前述第1實施形態相同，故省略其說明。 【圖式簡單説明】 13 201117915 第1圖係切削裝置之外觀透視圖。 第2圖係顯示將切削刀片安裝於心軸之情況的分解透 視圖。 第3圖係切削刀片安裝於心軸之狀態的透視圖。 第4圖係連接於廢液回收裝備之刀片殼的透視圖。 第5圖係顯示切削時之作用的縱向截面圖。 第6 A圖係吸收源運作時第1實施形態之流體分離機構 的縱向截面圖。 第6 B圖係吸收停止時第1實施形態之流體分離機構的 縱向截面圖。 第7圖係本發明第2實施形態之流體分離機構的縱向截 面圖。 第8圖係本發明第3實施形態之流體分離機構的縱向截 面圖。 【主要元件符號說明】 2...切削裝置 18...夾頭台 4...操作裝備 19…固定裝備 6...顯示裝備 20...校準裝備 8...晶圓盒 22...攝影裝備 9...盒升降機 24...切削裝備 10...搬出入裝備 25...運送裝備 12...暫置區域 26···心軸 14...對位裝備 27...洗淨裝置 16...運送裝備 28...切削刀片 14 201117915 32.. .心轴殼 36.. .刀片座 38.. .轂部 40.. .固定凸緣 42.. .外螺紋 44…螺帽 46.. .圓形基台 48.. .圓形輪轂 50.. .切刀 52.. .安裝孔 54.. .螺帽 56.. .槽液供給裝備 57.. .槽液 58.. .刀片殼 58a...頂部 58b...底部 58c...側壁部 60…第1殼 62.. .第2殼 64.. .開口 66.. .空間部 66a...吸收口 68.. .切削液供給路徑 70.. .切削液供給源 72.. .喷出口 74,74A,74B...廢液回收裝備 75.. .廢液 76.. .流入路徑 76a...開口 78,78A，78B...流體分離機構 80.. .吸收源 82.. .槽 82a...第1開口部 82b...第2開口部 82c··.第3開口部 84,84A...排出路徑 84a... — 端 84b...排出口 86,86a...液體積存部 88.. .液體積存容器 90…銷 W...晶圓 F···框 T...切割膠帶 15The opening 64 of the 201117915 and the bottom opening opposite to the top impurity; and the side wall portion 58c connecting the top portion 58b constitute a space portion 66, and the cutting blade 28 is inserted into the space portion, and The cutting blade "is covered by the blade shell except for the front end of the cutting insert 28 used for the machining point protruding from the opening. The blade shell 58 has a cutting fluid supply 1~, path 68, and the cutting fluid supply path 6 The =-end is connected to the cutting fluid supply source 7Q, and the other is formed (4): the discharge port 72 is ejected to the space portion into which the cutting insert 28 is inserted. The cutting fluid: the supply line is supplied from the cutting fluid supply path; the cutting fluid supply source The liquid discharging outlet 72 is formed. The 74-series waste liquid recovery equipment, the Yugan wall π ^ i ^ , the end is connected to the side of the cutting insert 58: = a flow path (cylinder) 76 inclined at a predetermined angle; Connected to the fluid path of the inflow path 76 ν π knowing part; H 7 R · and the collision and separation mechanism 78. The degree 2::=:_ is _8 and the holding surface is 3. Continuous absorption. Waste liquid back:: The more: W, _ line stable preparation 74 with 6 and with the cutting blade The 28% of the fly is scattered to the side of the cutting fluid supplied to the cutting insert 28. The blade shell 58, the side wall portion 58c is formed with the absorption 6a' of the waste liquid recovery equipment and communicates with the inside of the path 76 through the side absorption port 66a. , the shell space portion 66 and the inflow opening at the bottom, 76a. The end portion of the path 76 is formed with a fluid separator (4) = village sucker beer when referring to Figure 6A. 1 is a longitudinal sectional view, and Fig. 6B is a longitudinal sectional view of the fluid separation mechanism 78 when the absorption source 201117915 is stopped. The fluid separation mechanism 78 is a groove (fluid separation mechanism body) 82 and a discharge path 84 connected to the groove 82. The groove 82 includes a first opening 82a connected to the inflow path 76, a second opening 82b connected to the absorption source 80 above the first opening 82a, and a second opening 82b. The third opening portion 82c that is formed at a position lower than the first opening portion 82a and that discharges the waste liquid (cutting fluid) flowing into the groove 82. The third opening portion 82c may be formed with the first opening portion 82a. The same height. One end 84a of the discharge path 84 is connected to the third opening of the slot 82. 82c, and the discharge port 84b formed at the other end is opened at a position lower than the first opening portion 82a of the groove 82. Further, the discharge port 84b can be opened at the same height as the first opening portion 82a. A liquid volume storage portion 86 bent at a substantially right angle is formed in the vicinity of the discharge port 84b. As shown in Fig. 6B, when the operation of the absorption source 8A is stopped, the liquid volume storage portion 86 is always filled with the waste liquid. When the absorption source 80 starts to operate for absorption, the absorption of air from the discharge port 84b can be prevented, and the absorption force of the absorption port 66a can be instantaneously increased, so that the waste liquid containing the chips can be efficiently absorbed into the fluid separation mechanism 78. . Next, the above-described embodiment will be described with reference to Figs. 5 and 6 . The wafer W as a workpiece is adsorbed and held by the chuck table 8 in a state of being held by the ring frame F by the dicing tape T as shown in Fig. 1 . First, the wafer W held by the chuck stage 18 is moved in the X-axis direction and moved directly below the photographic equipment 22, and the wafer w is photographed by the photographic equipment 2, and 10 201117915 and the calibration equipment 20 detects the cutting. The cutting lane' is used for calibration. Then, according to the above-described calibration, in the state where the cutting path to be cut and the cutting insert 28 are aligned, as shown in FIG. 5, the cutting insert 28 is cut into the wafer W while rotating at a high speed of about 30,000 rpm in the direction of the arrow A. Then, the processing of the chuck table 8 is performed by the direction of the arrow B, and the cutting is performed by the alignment cutting. When cutting the scribe line by the cutting insert 28, 'the tank liquid 57' is supplied from the bath supply device 56 and is filled with the bath 57 to be held between the wafer of the chuck table 18 and the bottom of the blade shell' and one side from the cutting fluid The discharge port 72 discharges the cutting fluid toward the cutter 50 of the cutting insert 28, and completes the cutting of the scribe line of the wafer W. The cutting fluid and the bath 57 are generally pure water. Thereafter, a part of the chips generated by the cutting rotates together with the cutting fluid as the cutting insert 28 rotates, and a part of the cutting fluid containing the chips passes through the absorption port 66a formed in the side wall portion 58c of the blade shell 58. It enters the inflow path 76 of the waste liquid recovery equipment 74 as indicated by the arrow C and is absorbed and removed by the fluid separation mechanism 78 by the operation of the absorption source 80. Since the discharge port 72 is disposed on the flow of the cutting fluid flow, and the cutting fluid supplied to the cutting insert 28 is formed in the tangential direction to the outer edge of the cutting insert 28, it does not hinder the inclusion of the rotation of the cutting insert 28. The flow of the cutting fluid of the rotating chips and the cutting fluid containing the chips can be efficiently discharged. On the other hand, the remaining cutting fluid generated by the cutting and not entering the cutting fluid floats in the bath 57. A portion of the bath 57 is passed through the opening 76a of the inflow path 76 of the waste recovery facility 74 into the inflow path 76 201117915 and is absorbed and removed from the wafer W by operation of the absorption source 78. As shown in Fig. 6A, the cutting fluid (waste liquid) 75 containing the chips passing through the inflow path 76° and the groove (the fluid separation mechanism body) 82 received in the fluid separation mechanism 78 is accumulated as shown in Fig. 6A. The lower portion of the groove 82 is discharged from the discharge port 84b through the discharge path 84. In the fluid separation mechanism 78 of the present embodiment described above, since the air absorbed by the operation of the absorption source 80 is separated from the waste liquid 75, the absorption source 80 absorbs only the air and does not pass the waste liquid 75 on the way of the absorption path. Since it is blocked, it can be stably absorbed, and the waste liquid 75 separated from the fluid separation mechanism 78 can be stably discharged from the discharge port 84b. According to the present embodiment, since the cutting fluid is supplied from the inside of the insert case 58 to the cutting insert 28, and the cutting insert 28 is substantially covered by the insert shell 58, and the cutting is carried out between the bottom of the insert shell 58 and the wafer W. 5 7 is completed in a filled state, so the cutting fluid containing the chips does not splash onto the wafer W' and the cutting fluid can be actively recovered from the wafer W by the waste liquid recovery device 7.4. Further, since the bath liquid is always supplied from the bath supply device 56 during the cutting process, the upper surface of the wafer W is not dried, and the chips are prevented from being fixed to the wafer W. When the absorption amount of the absorption source 80 is insufficient, the female chips are not sufficiently absorbed. Conversely, when the amount of absorption is excessive, local drying is caused on the wafer W with respect to the opening 7, and the chips are fixed on the crystal. Therefore, it is preferable to appropriately adjust the absorption amount and the supply amount of the bath according to the inclination angle of the inflow path 76 and the state of the surface of the cutting wafer. Referring to Fig. 7, there is shown a longitudinal cross-sectional view of waste 12 201117915 liquid recovery equipment 74A according to the second embodiment of the present invention. The waste liquid recovery equipment 74A of the present embodiment is an inflow path (cylinder) 76 similar to that of the first embodiment; a fluid separation mechanism 78A connected to the inflow path 76; and an absorption source 80 connected to the fluid separation mechanism 78 A. Composition. The fluid separation mechanism 78A is a tank 82 which is the same as that of the first embodiment, a discharge port 84A that is connected to the third opening of the groove 82, and a liquid storage container that is attached to the front end of the discharge path 84A. When the operation of the absorption source 80 is stopped, the waste liquid is always stored in the liquid storage container 88. Therefore, similarly to the fluid separation mechanism 78 of the first embodiment, the absorption of the absorption source 80 can be prevented from starting. The air is absorbed from the discharge port, and the absorption force of the absorption port 66a is directly ensured. When referring to Fig. 8, the figure shows a longitudinal cross-sectional view of the waste liquid recovery equipment 74B according to the third embodiment of the present invention. Similarly to the second embodiment, the waste liquid recovery equipment 78B is composed of an inflow path (cylinder) 76, a fluid separation mechanism 78B connected to the inflow path 76, and an absorption source 80 connected to the fluid separation mechanism 78B. The separation mechanism 78B is composed of a groove (fluid separation mechanism main body) 82 similar to the first and second embodiments, and a discharge path 84 connected to the third opening 82c of the groove 82. The discharge path 84 is formed at the front end. In the present embodiment, the third opening 82c connected to the groove 82 of the discharge path 84 has substantially the same height as the first opening 82a. The effect of the present embodiment and the foregoing 1 is the same as the embodiment, and the description thereof is omitted. [Comparative description of the drawings] 13 201117915 Fig. 1 is a perspective view showing the appearance of the cutting device. Fig. 2 is an exploded perspective view showing the state in which the cutting insert is attached to the mandrel. Fig. 4 is a perspective view showing a state in which a cutting insert is mounted on a mandrel. Fig. 4 is a perspective view showing a blade shell connected to a waste liquid recovery apparatus. Fig. 5 is a longitudinal sectional view showing the action at the time of cutting. A longitudinal cross-sectional view of the fluid separation mechanism of the first embodiment when the absorption source is operated. Fig. 6B is a longitudinal cross-sectional view of the fluid separation mechanism of the first embodiment when the absorption is stopped. Fig. 7 is a fluid of the second embodiment of the present invention. Fig. 8 is a longitudinal cross-sectional view of a fluid separation mechanism according to a third embodiment of the present invention. [Description of main component symbols] 2: Cutting device 18: Chuck table 4... Equipment 19...Fixed equipment 6...Display equipment 20...Calibration equipment 8...Fabric box 22...Photographing equipment 9...Box lift 24...Cutting equipment 10...Loading and unloading equipment 25 ...transport equipment 12...temporary area 26··mandrel 14...alignment equipment 27...washing device 16...transport equipment 28...cutting blade 14 201117915 32.. . Mandrel shell 36.. blade holder 38.. hub portion 40.. fixing flange 42.. external thread 44... nut 46.. circular abutment 48.. round hub 50.. Cutter 52.. Mounting hole 54.. Nut 56.. Tank supply equipment 57.. Tank 58.. Blade shell 58a... Top 58b... Bottom 58c... Side wall Part 60... first case 62.. second case 64.. opening 66.. space portion 66a... absorption port 68.. cutting fluid supply path 70.. cutting fluid supply source 72.. Outlet outlets 74, 74A, 74B... Waste liquid recovery equipment 75.. Waste liquid 76.. Inflow path 76a... Opening 78, 78A, 78B... Fluid separation mechanism 80.. Absorption source 82. .slot 82a...first opening 82b...second opening 82c··.third opening 84,84A...discharge path 84a...-end 84b...discharge port 86,86a ...liquid volume storage 88.. liquid volume storage W is 90 ... ... pin frame F ··· wafer dicing tape T ... 15