201116180 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種導電線路的製備方法，特 一種在非導電基材上形成導電線路的製備方法。 a 【先前技術】 高分子材料由於可依據需求製作成各種不同的形狀， 因此，對於製作產品外殼或機構元件而言相當便利。而一 般要在高分子基材上形成導電線路的方法通常是將導電材 枓直接貼合於高分子基材表面，或是將導電材料與高分子 材料經由埋入射出成型而得’然而，以上述方式製作導線 線路，不僅會增加成品的厚度而且不易進行導線線路的設 計修改。 為了解決上述要在高分子基材形成導電線路製程的問 題’美國US2004/024M22號公開帛，揭示一種導電線路形 成方法’其係包含⑷先將-具有尖晶石結構（spinel based) 的非導電性金屬氧化物與非導電性的材料混合得到一基 材，（b)再以電磁波照射該基材破壞該非導電性金屬氧化物 的鍵結，而得到由非導電性金屬氧化物釋放出的金屬⑷ 最後再於該被電磁波照射後的區域以化學鍍膜方式形成一 層金屬層後，以製得該導電線路；另外，美國 US2007/0247822號公開案，則揭示另一種導電結構的形成 方法’其係（a)先將一氣化|g(aiuminuni nitride)分散於一非 導電性的高分子材料形成一基材，（b)以雷射燒蝕該基材表 面’經由雷射破壞氮化鋁的鍵結，得到由氮化鋁釋放出的 201116180 活性鋁粒子，而於該被雷射燒蝕後的區域形成一導電結 構。 然而，由於導電結構/線路一般是形成在基材的表面， 而上述的非導電性金屬化合物或氮化㈣是分散於整個基 材中’因此僅有位在基材表面的非導電性金屬化合物在經 過雷射照射、燒蝕會反應而釋出金屬粒子，而用以製得導 電、。構/線路，其它分散在非表面位置的非導電性金屬化合 :則無作用，而一般非導電性的金屬化合物由於成本較 Π因此亦會於無形中增加產品的成本，且在化學鍛膜的 過程中’由於是將該基材浸置於化學鑛液中，該未被雷射 活化區域之部分表面也會因為活化金屬之吸附而有溢鑛的 情形產生。 、、如何尋求一可簡化在高分子材料上製備導電線 去效減少溢鍍問題並降低成本的方法—直是本技術領 域者不斷改善的方向之一。 【發明内容] 方法 步驟 因此本發明之目的’即在提供—種導電線路的製備 〇 於疋’本發明-種導電線路的製備方法包含以下四個 鍍層 層形成步驟：在一不導電的基材表面形成 防 ;圖案化步驟：以雷射燒蝕該防鍍層至該基材，並於 。玄基材形成-由雷射燒蝕而得的預定圖案，製得一半成 201116180 品° 活化步驟.將該半成品浸置在一組成份包括第一金 屬離子的活性液中’令該第一金屬離子吸附至該基材的預 疋圖案上。 “金屬層形成步驟：再將前述該吸附有第一金屬離子 的半成ασ以無電解電鍍方式，於對應該基材之預定圖案的 位置形成一金屬層，以製得該導電線路。 本發明之功效在於：先於基材表面形成一防鍍層，再 以雷射燒蝕方式’將部分防鍍層燒蝕破壞後而於該基材形 成一預定圖案’而可精確的控制在該基材對應該預定圖案 位置形成導電線路’利用該防鍍膜不僅可有效減少溢鍍的 情形產生，且製程簡便，可有效降低成本。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例及一個具體例的詳細 說明中’將可清楚的呈現。 參閱圖1 ’本發明一種導電線路的製備方法是包含以下 五個步驟。 首先’進行防鍍層形成步驟21，在一不導電的基材表 面形成一疏水性防鍍層。 詳細的說，該基材可由玻璃、高分子材料、陶瓷等不 導電材料所構成，適用於本較佳實施例之高分子材料，是 選自聚碳酸S旨（Polycarbonate，PC)、ABS 樹脂（Acrylnitrile-butadiene-styrene，ABS)，或壓克力樹脂（Acrylate resin， 201116180 PA)’且該高分子材料可配合產品及用途的需求添加不同的 添加劑…文變高分子材料的操作性及機械性的要求，由 於β亥些问分子材料及添加劑的種類選擇非為本發明之重點 且為本技術領域者所週知，因此，在此不再多加費述。 該疏水性防鎖層可以浸塗或喷塗等方式形成在該基材 表面’其組成份是包括疏水性樹脂或是蠟為材料所構成丨 由於該㈣層的目的為保護該基材在後續製程中未反應部 分之表面’又必須*影響後續製程之雷射性能，且同時須 考罝於製程過程之耐化性及移除的便利性；耐熱性或耐化 性太低，容易在化鍍的過程中即被破壞，耐熱性太高，則 會造成後續移除的困難；因此’較佳地，該疏水性樹脂是 選自分子量介於1000〜4000的聚碳酸酯、聚矽氧烷樹酯、 聚丙稀樹S旨，或其中之—組合，該蝶是選自融點不小於60 °C的蠟。 更佳地，該疏水性樹脂是選自分子量介於15〇〇〜3〇〇〇 的聚碳酸酯、聚矽氧烷樹酯、聚丙烯樹酯，或其中之一組 合’該蠟的融點介於60〜90。(：之間。 值得一提的是，當該防鍍層的組成份為蠟時，可更包 含一無機氧化物，用以增加該防鍍層的融點、抗化性及孔 隙填補性，較佳地，該無機氧化物的含量是介於5〜4〇wt %，且疋選自二氧化矽、二氧化鈦、氧化鎂、氧化銼，或其 中之一組合。 接著進行圖案化步驟22，以雷射燒飯該防鍍層至該基 材，並於§玄基材形成一由該雷射燒姓而得的預定圖案，製 201116180 得一半成品。 詳細的說’該預定圖案是藉由輸出功率為5〜1〇w的雷 射將預定區域之防鐘層燒触破壞後再進一步燒姓至該基 材，由於該防鍍層是選用融點介於60〜90。〇之間的壤，或低 分子罝之向分子材料構成，因此被雷射燒蝕後該防鍍層即 會受到破壞揮發，而可讓雷射再進一步燒蝕該基材表面， 再藉由高分子材料吸收雷射的能量，彳高分子瞬間融熔以 及同時產生之氣體在融熔之高分子内瞬間向外界爆開的作 用下而於該基材形成-具有多孔結構的預定圖t;因此， 藉由不同的雷射功率及燒蝕時間的控制，可適當調控燒蝕 的冰度，當使用的雷射功率太大時，照射在該基材表面的 能量容易瞬間過高，會使燒㈣深度過深且不易控制；而 當雷射的功率太小時’貝需較長的照射時間以讓該基材吸 收足夠的能量’而會增加製程時間，目此，較佳地，該雷 射的脈衝頻率κ卜斯匕、輸出功率：5〜5Qw，且能量密度 是控制在 6000〜150000 mj/cm2。 接著進行活化步驟23 ’將該半成品浸置在—組成份包 括第-金屬離子的活性液中，令該第一金屬離子吸附至該 基材的預定圖案上。 °羊細的說’該第-金屬離子是選自鈀、鍺、锇、銥、 金β鎳 '鐵，或此等之一組合，該步驟23是將該步驟 22製得形成有該預定圖案之半成品浸人-組成份包括第-金屬離子的活性潘由 ^ 中’ $該第一金屬離子可擴散、吸附至 該預定圖案的多孔社 孔、，D構中，而被覆有該防鍍層之基材表面 201116180 則因為防鍍層的隔絕，而不 及附°亥第—金屬離子。 接者進行金屬層形成步驟24 屬離子的半# A ’* q吸附确第一金 的牛成以無電解電鍍方式，於 圖案的位置形成一金屬# ^ 、十應该基材之預定 一 μ金屬層’以製得該導電線路。 詳細的說，該步驟24是將 出口 β 疋柏D亥及附有第—金屬離子的半 成。口次入—化學鍍液中， ,茨預疋圖案上還原、沉積形 成—與該預定圖案對應之金屬層， 侔 μ由表無電解電鍍的製程 保件疋本技術領域業者所週 因此，在此不再多加贅 平乂往《a，於201116180 VI. Description of the Invention: [Technical Field] The present invention relates to a method for preparing a conductive circuit, and a method for preparing a conductive line on a non-conductive substrate. a [Prior Art] Since the polymer material can be manufactured into various shapes according to requirements, it is quite convenient for producing a product casing or a mechanism component. Generally, a method for forming a conductive line on a polymer substrate is generally to directly bond the conductive material to the surface of the polymer substrate, or to form a conductive material and a polymer material through burying and forming. The above-mentioned method of making a wire line not only increases the thickness of the finished product but also makes it difficult to modify the design of the wire line. In order to solve the above-mentioned problem of forming a conductive line process on a polymer substrate, US Publication No. 2004/024M22 discloses a method for forming a conductive line, which includes (4) first-non-conductive having a spinel based structure. The metal oxide is mixed with a non-conductive material to obtain a substrate, and (b) the substrate is irradiated with electromagnetic waves to break the bond of the non-conductive metal oxide, thereby obtaining a metal released from the non-conductive metal oxide. (4) Finally, after forming a metal layer by electroless plating in the region irradiated by the electromagnetic wave, the conductive line is obtained; and in addition, the disclosure of US 2007/0247822 discloses another method for forming a conductive structure. (a) first dispersing a gasified |g (aiuminuni nitride) in a non-conductive polymer material to form a substrate, and (b) ablating the surface of the substrate by laser to destroy the aluminum nitride bond via laser At the junction, 201116180 active aluminum particles released from aluminum nitride are obtained, and a conductive structure is formed in the region after the laser ablation. However, since the conductive structure/circuit is generally formed on the surface of the substrate, the above-mentioned non-conductive metal compound or nitride (4) is dispersed throughout the substrate. Therefore, only the non-conductive metal compound located on the surface of the substrate is present. After laser irradiation and ablation, the metal particles are released to produce electricity. Structure/line, other non-conductive metal compounds dispersed at non-surface positions: no effect, and generally non-conductive metal compounds will inevitably increase the cost of the product due to the lower cost, and in the chemical forged film In the process, because the substrate is immersed in the chemical mineral liquid, the surface of the portion not subjected to the laser activation region may also be overflowed due to the adsorption of the activated metal. How to find a way to simplify the preparation of conductive wires on polymer materials, reduce the problem of overflow plating and reduce the cost - is one of the directions for the continuous improvement of this technology. SUMMARY OF THE INVENTION Method steps Therefore, the object of the present invention is to provide a conductive circuit for the preparation of the present invention. The method for preparing a conductive circuit comprises the following four plating layer forming steps: a non-conductive substrate Surface formation prevention; patterning step: ablation of the anti-plating layer to the substrate by laser, and. Forming a base material - a predetermined pattern obtained by laser ablation, making a half into a 201116180 product activation step. The semi-finished product is immersed in a group of active liquids including a first metal ion - making the first metal The ions are adsorbed onto the pre-twist pattern of the substrate. "Metal layer forming step: forming the metal layer by forming a metal layer at a position corresponding to a predetermined pattern of the substrate by electroless plating of the semi-α σ adsorbed with the first metal ion to obtain the conductive line. The effect is that an anti-plating layer is formed on the surface of the substrate, and then a part of the anti-plating layer is ablated and destroyed to form a predetermined pattern on the substrate by laser ablation, and the substrate pair can be accurately controlled. The conductive pattern should be formed at a predetermined pattern position. The use of the anti-plating film not only can effectively reduce the overflow plating, but also has a simple process and can effectively reduce the cost. [Embodiment] The foregoing and other technical contents, features and effects of the present invention are The following is a clear description of a preferred embodiment and a specific example of the reference drawings, which will be clearly shown. Referring to FIG. 1 'The preparation method of a conductive circuit of the present invention comprises the following five steps. First, 'anti-plating layer Forming step 21, forming a hydrophobic anti-plating layer on the surface of the non-conductive substrate. In detail, the substrate may be made of glass or polymer. A non-conductive material such as a material or a ceramic, which is suitable for the polymer material of the preferred embodiment, is selected from the group consisting of polycarbonate (PC), ABS resin (Acrylnitrile-butadiene-styrene, ABS), or acrylic Acrylate resin (201116180 PA)' and the polymer material can be added with different additives according to the needs of products and applications... The operability and mechanical requirements of the polymer-based polymer materials, due to the molecular materials and additives The type selection is not the focus of the present invention and is well known to those skilled in the art, and therefore, the description will not be repeated here. The hydrophobic anti-locking layer may be formed on the surface of the substrate by dip coating or spraying. The composition is composed of a hydrophobic resin or a wax as a material. Since the purpose of the (four) layer is to protect the surface of the unreacted portion of the substrate in a subsequent process, it must also affect the laser performance of subsequent processes, and at the same time It is necessary to consider the chemical resistance of the process and the convenience of removal; the heat resistance or chemical resistance is too low, it is easy to be destroyed during the plating process, and the heat resistance is too high, which will cause Difficulty of continued removal; therefore, preferably, the hydrophobic resin is selected from the group consisting of polycarbonates having a molecular weight of 1000 to 4000, polyoxyalkylene resins, polypropylene trees, or a combination thereof. The butterfly is selected from the group consisting of a wax having a melting point of not less than 60 ° C. More preferably, the hydrophobic resin is selected from the group consisting of polycarbonates having a molecular weight of 15 〇〇 3 〇〇〇, polysiloxane chains, and polypropylene. The resin, or a combination thereof, has a melting point of between 60 and 90. (: between. It is worth mentioning that when the composition of the anti-plating layer is wax, it may further comprise an inorganic oxide, In order to increase the melting point, chemical resistance and pore filling property of the anti-plating layer, preferably, the content of the inorganic oxide is between 5 and 4% by weight, and the cerium is selected from the group consisting of cerium oxide, titanium dioxide and magnesium oxide. , yttrium oxide, or a combination of one of them. Next, a patterning step 22 is performed to laser-fire the anti-plating layer to the substrate, and a predetermined pattern obtained by the laser-fired surname is formed on the § substrate, and the finished product is made in 201116180. Specifically, the predetermined pattern is obtained by burning a predetermined area of the anti-clock layer by a laser having an output power of 5 to 1 〇w, and further burning the surname to the substrate, since the anti-plating layer is selected At 60~90. The soil between the crucibles, or the low molecular masses, is composed of molecular materials. Therefore, after the laser is ablated, the anti-plating layer is destroyed and volatilized, and the laser can further ablate the surface of the substrate, and then by the high The molecular material absorbs the energy of the laser, and the polymer is instantaneously melted and the gas generated at the same time is instantaneously opened to the outside in the molten polymer to form a predetermined pattern t having a porous structure; By controlling the different laser power and ablation time, the ablation ice degree can be appropriately adjusted. When the laser power used is too large, the energy irradiated on the surface of the substrate is easily too high, which will cause burning. (4) The depth is too deep and difficult to control; and when the power of the laser is too small, 'the shell needs a longer irradiation time to allow the substrate to absorb sufficient energy', the process time is increased, and therefore, preferably, the laser The pulse frequency κ Buss, output power: 5~5Qw, and the energy density is controlled at 6000~150000 mj/cm2. Next, an activation step 23' is performed to immerse the semi-finished product in the active liquid comprising the component-metal ion to adsorb the first metal ion onto a predetermined pattern of the substrate. The sheep said that the metal ion is selected from the group consisting of palladium, rhodium, ruthenium, osmium, gold beta nickel 'iron, or a combination thereof, and the step 23 is to form the step 22 to form the predetermined pattern. The semi-finished product is impregnated with a composition comprising a first metal ion capable of diffusing, adsorbing to the porous organic pores of the predetermined pattern, and being coated with the anti-plating layer. The surface of the substrate 201116180 is not covered by the anti-plating layer, but not the metal ion. The metal layer forming step 24 is a cation of the atomic #A '* q adsorption. The first gold is formed by electroless plating, forming a metal at the position of the pattern #^, ten should be a predetermined one of the substrate. The metal layer 'to make the conductive line. In detail, this step 24 is to take the exit β 疋 D D and the semi-phase with the first metal ion. In the secondary plating-electroless plating solution, the reduction and deposition on the pre-pattern are formed to form a metal layer corresponding to the predetermined pattern, and the process of the electroless plating is performed by the manufacturer of the electroless plating. This is no longer more than 赘平乂to "a, Yu
〜7 π卞取-在浸入該W 予鑛液之前可先將其m性料巾，除去包圍在該筹 :金屬離子周圍的雜質’令該第-金屬離子成為催化狀楚 後，再將其浸入該化學鍍液中’可用以提升該金屬層的用 成速率。 最後進行防㈣移除步冑25，將該防㈣自該基材表 面移除’完成該導電線路的製備方法。 詳細的說，該防鍍層移除步驟25可以溶劑或界面活性 劑將該防鍍層自該基材表面清除，例如，當該防鍍層為 蠟，則該步驟可加熱至蠟的熔點以上令蠟融解並輔以界面 活性劑，例如兩性型界面活性劑或非離子型界面活性劑， 而將殘留在該基材表面之防鍍層移除；當該防鍍層為疏水 性樹脂時，則該步驟可以適當之溶劑’例如乙醇（Ethanol)、 異丙醇（Isopropyl alcohol ’ IPA)，或甲基乙基酮（Methyl Ethyl Ketone ’ MEK)將該防錢層自該基材溶除。 201116180 有關本發明之前述及其他技術内容、特點與功效，在 以下1個具體例的詳細說明中，將可清楚的呈現，但應瞭 解的是，該具體例僅為說明之用，不應被解釋為本發明實 施之限制。 <具體例> 本發明一種導電線路的製備方法的一具體例簡單說明 如下。 將一由聚碳酸酯構成的基材，浸入一融點為6〇<>c的熔 融蠟液中，取出後烘乾於該基材表面形成一疏水性防鍍 層。 再以Nd.YAG雷射（波長：i〇64nm、輸出功率： 5〜50W、旎里岔度.6000〜15〇〇〇mj/cm2)，自該防鍍層表面 燒蝕至該基材，於該基材形成一預定圖案，製得一半成 品0 接著將該半成品浸入一溫度為5〇t：且含有鈀金屬離子 濃度為5_ppm的活性液中約5分鐘後取出，讓該些纪金 屬離子吸附在該預定圖案上，‘然後再將上述該經活性液處 理後之半成品進行無電解電鐘，於該預定㈣上形成一金 屬層。 ::體的說’ e亥無電解電鍍製程是先將該吸附鈀金屬離 半成;m放入腹度控制在5〇〜65它，並含有硫酸銅、甲醛 及氫氧化鈉的第一化學鍍液中約2 5小時，讓鈀金屬離子將 銅離子（Cu )還原成銅原子沉積吸附在纪金屬離子周圍，形 成厚度為10〜12μιη的鋼膜後，再放入一溫度控制在 201116180 75〜80°C含有硫酸鎳及磷酸鹽的第二化學鍍液中，於該鋼膜 上沉積形成一厚度為丨4〜16μηι的鎳膜，以形成該金屬層。 最後再將該形成有金屬層的半成品置入一溫度為65〜7〇 C ’且含有十四烷銨基乙磺酸鈉的溶液中將該基材上的防 錢層清除後’完成該導電線路的製備方法。 本發明該導電線路的製備方法主要為利用在不導電的 基材表面形成一防鍍層，並利用該防鍍層的材料選擇，不 僅可有效避免傳統於基材形成金屬層的化鍍過程時，於該 基材的其它部份表面會產生溢鍍的問題發生，並且不會影 I雷射的燒蝕性能，且於金屬層形成後該防鍍層可輕易的 移除而不影響該基材的表面性質，不僅製程簡便且可解決 溢鍍的問題，精確的控制該導電層的形成位置，故確實可 達到本發明之目的。 惟以上所述者，僅為本發 能以此限定本發明實施之範圍 範圍及發明說明内容所作之簡 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 明之較佳實施例而已，當不 ，即大凡依本發明申請專利 單的等效變化與修飾，皆仍 說明本發明導電線路的製備方法的 圖1是一流程圖， 較佳實施例。 10 201116180 【主要元件符號說明】 21 防鍍層形成步驟 24 金屬層形成步驟 22 圖案化步驟 25 防鍍層移除步驟 23 活化步驟~7 π - - before immersing the W pre-mineral liquid, the m-type towel can be removed, and the impurities surrounding the metal ion are removed to make the first-metal ion become a catalytic state, and then Immersion in the electroless plating bath can be used to increase the rate of use of the metal layer. Finally, the (4) removal step 25 is performed, and the prevention (4) is removed from the surface of the substrate to complete the preparation method of the conductive line. In detail, the anti-plating layer removing step 25 may remove the anti-plating layer from the surface of the substrate by a solvent or a surfactant. For example, when the anti-plating layer is a wax, the step may be heated to above the melting point of the wax to melt the wax. And a surfactant, such as an amphoteric surfactant or a nonionic surfactant, is used to remove the anti-plating layer remaining on the surface of the substrate; when the anti-plating layer is a hydrophobic resin, the step may be appropriate The solvent layer, such as Ethanol, Isopropyl alcohol 'IPA, or Methyl Ethyl Ketone 'MEK, dissolves the anti-money layer from the substrate. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the specific embodiments, but it should be understood that the specific examples are only illustrative and should not be It is to be construed as limiting the implementation of the invention. <Specific Example> A specific example of a method of producing a conductive line of the present invention will be briefly described below. A substrate made of polycarbonate is immersed in a molten wax solution having a melting point of 6 Å <> c, taken out and dried on the surface of the substrate to form a hydrophobic plating resist. Further, the surface of the anti-plating layer is ablated to the substrate by a Nd.YAG laser (wavelength: i 〇 64 nm, output power: 5 to 50 W, 旎 岔 6,000 6,000 〇〇〇 〇〇〇 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 The substrate is formed into a predetermined pattern, and half of the finished product is obtained. Then, the semi-finished product is immersed in an active liquid having a temperature of 5 〇t: and containing a palladium metal ion concentration of 5 ppm, and is taken out for about 5 minutes to adsorb the metal ions. On the predetermined pattern, 'the above-mentioned semi-finished product treated with the active liquid is then subjected to an electroless electric clock to form a metal layer on the predetermined (four). :: Body says 'ehai electroless plating process is to separate the adsorbed palladium metal into half; m is placed in the first chemistry of 5 ～~65, and contains copper sulphate, formaldehyde and sodium hydroxide. In the plating solution for about 25 hours, the palladium metal ions reduce the copper ions (Cu) to copper atoms and deposit them around the metal ions to form a steel film with a thickness of 10~12μηη, and then put a temperature control at 201116180 75. In a second electroless plating solution containing nickel sulfate and phosphate at -80 ° C, a nickel film having a thickness of 丨4 to 16 μm is deposited on the steel film to form the metal layer. Finally, the semi-finished product formed with the metal layer is placed in a solution having a temperature of 65 to 7 〇C ' and containing sodium tetradecyl ammonium sulfonate to remove the anti-money layer on the substrate. The method of preparation of the line. The preparation method of the conductive circuit of the invention mainly utilizes the formation of an anti-plating layer on the surface of the non-conductive substrate, and the material selection of the anti-plating layer is used, which can effectively avoid the traditional plating process of forming the metal layer on the substrate. The surface of other parts of the substrate may cause problems of overflow plating, and the ablation performance of the laser may not be affected, and the anti-plating layer may be easily removed after the formation of the metal layer without affecting the surface of the substrate. The nature is not only simple in process, but also solves the problem of overflow plating, and precisely controls the formation position of the conductive layer, so that the object of the present invention can be achieved. However, it is to be understood that the scope of the invention and the scope of the invention are limited to the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The preferred embodiment of the present invention, when not, that is, the equivalent variation and modification of the patent application according to the present invention, still illustrates that FIG. 1 of the method for preparing the conductive circuit of the present invention is a flow chart. A good example. 10 201116180 [Explanation of main component symbols] 21 Anti-plating layer formation step 24 Metal layer forming step 22 Patterning step 25 Anti-plating layer removal step 23 Activation step