201115220 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種電容式多點觸控面板的結構，以及一 種電容式多點觸控面板的製作方法。 【先前技術】 參閱第-圖，習用技術電容式多點觸控面板結構的 剖面不意目。如第-圖所示’制技術多._控面板i 結構包含外層鏡片10以及觸控感應片20兩部分，且以 一透明的光學膠30結合成一體。外層鏡面1〇包含上基 板11*以及油墨圖案15，而由觸控感應片2〇包含下基板 2卜第-矩陣電極23、第二矩陣電極25、金屬線 上基Γ1及下基板21為玻璃或透明塑 膠，油墨圖# 15，形成於上基板u上，係為至少一 二以案’用以遮蓋下方的線路以及增:設 陣電極23及第二矩陣電極25為透明導 =表面’金屬層形成於矩陣電極外側 ^ ;處’以金屬線的方式形成，用以降低第二矩 ίΐ明軟性電路板；保護層通常為二氧化石夕 的透明保濩層，用以保護金屬層。 作為多點觸控面板結構中，下基板21 公厘，ί觸見用的玻璃厚度通常為0.4〜〇·7 太大，以致手指分別對第一矩陣電極紘矩 成的電容訊號其水準相差太大，矩陣电極形 差太大而不易辨識，需以較精 .201115220 密的解碼频電路(ic)另外做婦。料， ，鑛上各-層氧化銦錫’與目前習用上 保護金屬線路27 ’使得生產效率低、製二成 ㈣，f用技術另—種電容式多點觸控面板 41、第一矩陣』=片矩:電=严板 =广將金屬電路47=:電= 是以TFT—且ί第一矩陣電極45連接，其中介電層49 ^ 了1程中的薄膜來取代第—種f知技 ，(玻璃)介電層。龍結構軸 ^ 導致I絲Γ程其介電層的厚度又太薄了， 極矩陣43及45 喊太過微弱，而須以縮小兩個電 要部分線路寬度來解決，其副作用就是需 數過作此細線寬電極矩陣，且層 品可靠度# ’而使用金屬線路更造成產 之連，習用技術矩陣電極及金屬線路 圖及第二圖全:=7。:7第三/所示，另參閱第- 以，===== 度b 的4便:通常以導電線路寬度a等於間隔寬 b，因為&=，'=^=度3侧隔寬度 201115220 【發明内容】 本發明的目的主要是提供—種電容式 的結構包含外層鏡片以及觸控感應片兩忿 ίϊί學膠結合成—體。外層鏡片包含上基板、第-2 上包含下基板以及第二矩陣電極。 饮應片由下而 本發明的另一個目的主要提供一種電 含第一矩陣電極成型步驟、油墨‘201115220 VI. Description of the Invention: [Technical Field] The present invention relates to a structure of a capacitive multi-touch panel and a method of fabricating a capacitive multi-touch panel. [Prior Art] Referring to Fig. 1, the cross section of the conventional capacitive multi-touch panel structure is not intended. As shown in the figure, the control panel i structure includes two parts of the outer layer lens 10 and the touch sensor sheet 20, and is integrally combined by a transparent optical glue 30. The outer mirror surface 1 includes an upper substrate 11* and an ink pattern 15, and the touch sensing sheet 2 includes a lower substrate 2, a first matrix electrode 23, a second matrix electrode 25, a metal substrate 1 and a lower substrate 21, or The transparent plastic, the ink pattern #15 is formed on the upper substrate u, which is at least one for the case of 'covering the underlying line and increasing: the array electrode 23 and the second matrix electrode 25 are transparent conduction=surface' metal layer Formed on the outside of the matrix electrode; at 'where a metal wire is formed to reduce the second moment, the flexible circuit board; the protective layer is usually a transparent protective layer of dioxide on the eve to protect the metal layer. As a multi-touch panel structure, the lower substrate is 21 mm, and the thickness of the glass for the touch is usually 0.4 to 〇·7 is too large, so that the capacitance signals of the fingers of the first matrix electrode are different from each other. Large, matrix electrode shape is too large to be easily identified, it is necessary to use a more sophisticated. 201115220 dense decoding frequency circuit (ic) to do another woman. Material, ,,,,,,,,,,, = chip moment: electric = strict plate = wide metal circuit 47 =: electricity = is TFT - and ί first matrix electrode 45 is connected, wherein the dielectric layer 49 ^ 1 film in the process to replace the first species Technology, (glass) dielectric layer. The dragon structure axis ^ causes the thickness of the dielectric layer of the I wire process to be too thin, and the polar matrix 43 and 45 are too weak, but must be solved by narrowing the width of the two electrical parts. The side effect is to count the number of times. Thin line wide electrode matrix, and layer reliability # ' and the use of metal lines to make the connection, the conventional technology matrix electrode and metal circuit diagram and the second picture: = 7. :7 third / shown, see also - -, ===== degree b of 4: usually with the conductive line width a equal to the interval width b, because &=, '=^= degree 3 side gap width 201115220 SUMMARY OF THE INVENTION The object of the present invention is to provide a capacitive structure comprising an outer layer lens and a touch sensor sheet. The outer lens includes an upper substrate, the second substrate includes a lower substrate, and the second matrix electrode. The present invention aims to provide a first matrix electrode forming step, ink ‘
驟、貼合步驟、分财驟以及封裝及峨步驟， -矩陣電極成型步驟、油墨圖案成型步驟、導電^ ΐ步？if二矩轉查成型步驟、貼合步驟及分割步驟 疋以大基板投料的製程進行。封裝及測試步 板投料的製轉行。 w & 本發明的電谷式多點觸控面板的結構，將第一矩 電極及導電線路形成於外層鏡#巾，導電線路使用化學 f性低的導電膠材料不易受到氧化及化學腐蝕，使得可 罪度增加，且可以不必以半導體或TFT製程方法沉積保 護層。而α光學膠同時作為黏合暨介電材料而減少結構 的層數。此外，以印刷加姓刻方式形成電極矩陣及電路， 成本退比使用半導體或TFT的微影加姓刻製程來得低。 另外本發明電谷式多點觸控面板的製作方法，可運用現 有的印刷電路板製程設備完成，技術成熟，且具有更高 的生產效率。 【實施方式】 以下配合圖式及元件符號對本創作之實施方式做更 詳細的說明，俾使熟習該項技藝者在研讀本說明書後能 據以實施。 201115220 土基板6卜第一矩陣電極63墨兄 ==應片7。由下而上包含下== 透明與Z基板71係透明材料，為透明玻璃、Steps, bonding steps, sub-details, and packaging and enthalpy steps, - matrix electrode forming step, ink pattern forming step, conductive ^ step? The if two-moment transfer forming step, the laminating step, and the dividing step are carried out in a process of feeding a large substrate. Package and test the step-by-step conversion of the board. w & The structure of the electric valley type multi-touch panel of the invention has the first moment electrode and the conductive line formed on the outer layer mirror #, and the conductive line using the conductive rubber material with low chemical property is not susceptible to oxidation and chemical corrosion. The degree of sin is increased, and it is not necessary to deposit the protective layer in a semiconductor or TFT process. The alpha optical adhesive also serves as a bonding and dielectric material to reduce the number of layers of the structure. In addition, the electrode matrix and the circuit are formed by printing plus the surname, and the cost is lower than the micro-image plus the surname process using the semiconductor or TFT. In addition, the manufacturing method of the electric valley type multi-touch panel of the invention can be completed by using the existing printed circuit board processing equipment, the technology is mature, and the production efficiency is higher. [Embodiment] The embodiments of the present invention will be described in more detail below with reference to the drawings and the component symbols, so that those skilled in the art can implement the present invention after studying the present specification. 201115220 soil substrate 6 first matrix electrode 63 ink brother == should be sheet 7. From bottom to top, including == transparent and Z substrate 71-based transparent material, which is transparent glass,
2 、翻塑料或可撓性的透明材料的Ϊ- ^外層鏡片60的形成已由下到上的方向， 矩= ==，：= 至少層油墨所印製的設計圖案，用 以及增加設計美感，油墨圖案65的位置 i二ϊϊ 導電膠體材料，用以降低第-矩陣 電的包阻，更進-步連接外部的軟性電路板 二），將來自控制晶片（IC)的信號傳送至第一矩陣‘ =，形成於非透光處、油墨圖案65之上，並部份I ’矩陣電極63 ’若油墨圖案與第_矩陣 ^ 分隔，則部份形成於上_61上，射 ^ 為銀膠、金勝、碳膠或石墨膠中的任一 化及2學腐儀，使導電線路具有較高的可靠度肖沭 第二矩陣電極75，具有-第二矩陣電極^案 ΐϋΓ之上’用以與第一矩陣電極63產^電^效 應，為一透明導電材料，係氧化銦錫(ΙΤ〇)、氧 (ΑΖΟ)、氧化銦鋅_)、或奈米等級的金屬層的任 201115220 光學膠80，且有离，秀afl由、 矩陣電桎63~的表面*觸層鏡片6G具有第- 75的表面，將第一拓眭二感應片70具有第二矩陣電極 以形成電容a电極63和第二矩陣電極75黏結 J，，作為一介電暨黏結材料。 。 應片發明電容式多點觸控面板之觸控感 的觸控感應片%〇特°別面^下:如第五圖所示，本發^ 透明材料時，可進—牛=j71的材質為可撓性的 於下基板7丨的下方包含，77以及—背膠保護膜 係形成於油墨圖案65上3略如長第於油圖^ 幻 導的_部分疊合。於本發明直接將 於視覺的^贿65結合’可贿導躲路67對 度g比it 佳實施例的導電線路寬度e對間隔寬 k α <比為7:3 ’但不限與此。 法的3 ί七f @本發明電容式多點觸控面板之製作方 圖所示，本發明電容式多點觸控面 方法包含第—矩陣電極成型步驟S12、油墨圖案 乂驟SU、導電線路成型步驟训、第二 ^ ^驟S20、貼合步驟S3〇、分割步驟_以及封裝及= 试步，S50 ’其中步驟S12〜I6與步驟S2〇同時進行。 弟矩陣電極成型步驟S12係將透明導電的電極圖 案形成於透明的大型上基板上，形成的方式可透過濺 鍍、蒸鍍、電鍍或無電鍍等方法將透明導電材料沈積於 大型上基板之上，接著，再直接雷射加工分離出電極圖 案’或利用微影方法’塗佈光阻後以光罩曝光再顯影的 方式印製出電極圖案，再錄刻方式形成電極圖案；或 201115220 方法直接將似彳膏印刷在透明導電々上，異以 蝕刻。油墨圖案成型步驟s、第為2蝕刻或乾 大型上基板後，以印刷矩陣電極於 大型上基板上，該油^層油墨圖案印製於 隔隔開或部份疊合。導第—矩陣電極以一間 ~式:;寫以喷塗印 一rin㈣方式將；體=: ‘二^圖案之上，且與矩陣電極連接，‘‘ 碳膠或石墨膠等。中#電膠體可為_、金膠、 第二矩陣電極成型步驟S2G係 ，於透明的大型下基板上，用以 =電容效應’形成的方式可透過雜、蒸鍍、電以或 古等方法將電極材料沈積於大型下基板之上广i 接雷射加工分離㈣極圖案；或利用微影方法 風布ί阻後以光罩曝光再顯影的方式印製出電極圖案， ί 透明,電層上，再⑽刻方式形成電： ::八中ϋ刻方式可為濕儀刻或乾姓刻。貼 明的光學_分別具有Μ的大型上基板及大型 ζϋ伴後貼合’再將光學膠固化。分割步驟s3〇係 將貼a完朗大型上下基板蝴成複數個電容式多點觸 控面板。封裝及測$步驟⑽係將導電線路與軟性電路 板接合，另可進—步於下基板的下方(相）^上背膠及 背膠保護膜。然後經過各種測試以雜電容式多點觸控 面板的品質。 以上所述者僅為用以解釋本發明之較佳實施例，並 非企圖擄以對本發明做任何形式上之限制，是以，凡有 201115220 在相同之發明精神下所作有關本發 更，皆仍應包括在本發明意圖保護之範_ ° >飾或變 【圖式簡單說明】 面示意 ^了圖為習用技術電容式多點觸控面板結構的剖2, turned plastic or flexible transparent material Ϊ - ^ outer lens 60 has been formed from the bottom to the top direction, moment = ==,: = at least layer of ink printed design, use and increase the design aesthetic The position of the ink pattern 65 is a conductive gel material for reducing the resistance of the first-matrix, and further connecting the external flexible circuit board (2) to transmit the signal from the control chip (IC) to the first The matrix ' = is formed on the non-transmissive portion, above the ink pattern 65, and the portion I 'matrix electrode 63 ' is separated from the first _matrix ^, and the portion is formed on the upper _61, and the shot is silver. Any one of the glue, Jinsheng, carbon glue or graphite glue and the 2 sulphur meter make the conductive circuit have higher reliability. The second matrix electrode 75 has a second matrix electrode. For use with the first matrix electrode 63, the electrical effect is a transparent conductive material, which is a metal layer of indium tin oxide (yttrium), oxygen (yttrium), indium zinc oxide, or nanometer grade 201115220 Optical adhesive 80, and there is off, show afl by, matrix electric 桎 63 ~ surface * contact lens 6G has the first - The surface of 75 has a first matrix electrode 70 having a second matrix electrode to form a capacitor a electrode 63 and a second matrix electrode 75 bonded J as a dielectric bonding material. . The invention should be invented into a capacitive multi-touch panel with a touch-sensitive touch sensor. 〇特特°面面^下: As shown in the fifth figure, when the hair is transparent material, it can enter the material of the cow=j71 In order to be flexible, the underside of the lower substrate 7A, 77 and the adhesive protective film are formed on the ink pattern 65 and are slightly overlapped with the _ portion of the oil image. In the present invention, it will directly be combined with the visual bribe 65. The bridging guide can be used to avoid the road 67 g to the ratio of the conductive line width e to the interval width k α < ratio is 7:3 'but not limited to this . The method of the capacitive multi-touch panel of the present invention is shown in the following figure. The capacitive multi-touch surface method of the present invention comprises a first-matrix electrode forming step S12, an ink pattern step SU, and a conductive line. The molding step training, the second step S20, the bonding step S3, the dividing step _, and the packaging and the = step, S50', wherein the steps S12 to I6 are performed simultaneously with the step S2. The matrix electrode forming step S12 is formed by forming a transparent conductive electrode pattern on a transparent large upper substrate by depositing a transparent conductive material on a large upper substrate by sputtering, evaporation, electroplating or electroless plating. Then, the electrode pattern is separated by direct laser processing or the photoresist pattern is printed by using a lithography method, and then the electrode pattern is printed by photomask exposure and development, and then the electrode pattern is formed by recording; or the 201115220 method is directly The paste-like paste is printed on a transparent conductive paste, and is etched. After the ink pattern forming step s, the second etching or the drying of the upper substrate, the matrix electrode is printed on the large upper substrate, and the ink pattern is printed on the partition or partially overlapped. The first-matrix electrode is written in a pattern of rin (four); the body =: ‘over the pattern, and connected to the matrix electrode, ‘“carbon glue or graphite glue. The #electrocolloid can be _, gold colloid, and the second matrix electrode forming step S2G system, on the transparent large lower substrate, the method for forming the 'capacitance effect' can pass the method of impurity, evaporation, electricity or ancient The electrode material is deposited on the large lower substrate and is widely connected to the laser processing separation (four) pattern; or the lithography method is used to print the electrode pattern by reticle exposure and development, ί transparent, electric layer On, and then (10) engraved form of electricity: :: Eight-inch engraving can be wet or engraved. The opticals are _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The segmentation step s3 is to affix a large-scale upper and lower substrate to a plurality of capacitive multi-touch panels. The package and test step (10) is to bond the conductive circuit to the flexible circuit board, and further to the back (phase) of the lower substrate and the backing protective film. Then through various tests to the quality of the capacitive multi-touch panel. The above is only a preferred embodiment for explaining the present invention, and is not intended to impose any form of limitation on the present invention, so that all of the present inventions in the spirit of the same invention of 201115220 are still It should be included in the intention of the present invention to protect the _ ° > decoration or change [schematic description] surface diagram ^ Figure is a conventional technology capacitive multi-touch panel structure
習用技術另一種電容式多點觸控面板結構的剖 習用技術矩陣電極及金屬線路之連接方式的上 ^四圖為本發明電容式多點觸控面板之結構的剖面示意 圖容式多點觸控面板之觸控她^ 發明第-矩陣電極及導電線路之連接方式的 ^圖為本發明電容式多點觸控面板製作方法的流程 【主要元件符號說明】 1 f容式多點觸控面板 2電容式多點觸控面板 3電容式多點觸控面板 10 外層鏡片 11 上基板 15 油墨圖案 20 觸控感應片 21 下基板 23 第一矩陣電極 201115220The utility model relates to another capacitive multi-touch panel structure. The top view of the connection mode of the matrix electrode and the metal circuit is a cross-sectional view of the structure of the capacitive multi-touch panel of the present invention. The touch panel of the panel is invented. The diagram of the connection method of the first matrix electrode and the conductive line is the flow of the method for manufacturing the capacitive multi-touch panel of the present invention. [Main component symbol description] 1 f capacitive multi-touch panel 2 Capacitive multi-touch panel 3 Capacitive multi-touch panel 10 Outer lens 11 Upper substrate 15 Ink pattern 20 Touch sensor 21 Lower substrate 23 First matrix electrode 201115220
25 第二矩陣電極 27 金屬線路 29 保護層 30 光學膠 41 下基板 43 第一矩陣電極 45 第二矩陣電極 47 金屬線路 49 介電層 60 外層鏡片 61 上基板 63 第一矩陣電極 65 油墨圖案 67 導電線路 70 觸控感應片 71 下基板 75 第二矩陣電極 77 背膠 79 背膠保護膜 80 光學膠 a 導電線路寬度 b 間隔寬度 c 導電線路寬度 d 間隔寬度 S12 第一矩陣電極成型步驟 S14 油墨圖案成型步驟 S16 導電線路成型步驟 S20 第二矩陣電極成型步驟 S30 貼合步驟 10 201115220 S40 分割步驟 S50 封裝及測試步驟25 second matrix electrode 27 metal line 29 protective layer 30 optical glue 41 lower substrate 43 first matrix electrode 45 second matrix electrode 47 metal line 49 dielectric layer 60 outer layer lens 61 upper substrate 63 first matrix electrode 65 ink pattern 67 conductive Line 70 touch sensor 71 lower substrate 75 second matrix electrode 77 backing 79 backing protective film 80 optical adhesive a conductive line width b spacing width c conductive line width d spacing width S12 first matrix electrode forming step S14 ink patterning Step S16 Conductive line forming step S20 Second matrix electrode forming step S30 Bonding step 10 201115220 S40 Division step S50 Packaging and testing steps