201114549 六、發明說明： 【發明所屬之技術領域】 本發明’係關於研磨除去由硬脆材料構成之多角柱形 狀之被研磨加工物之各平面(以下稱為「平面部」)與該兩平 面所交會之棱角（以下稱為「稜角部」）之表層之研磨裝置。 【先前技術】 以往，作為本發明之研磨對象之硬脆材料之多角柱狀 構件例如有用以藉由線鑛進行切片加工而製得石夕晶圓之 材料即四角柱形狀之石夕塊，該石夕塊，係由素材為單結晶或 由夕結晶構成之矽晶棒透過帶鋸或線鋸切斷而形成四角柱 形狀者，但當前述切斷後之外形尺寸之相關要求精度高 時’係對其表層面進行研削處理。 。由S結晶構成之石夕塊，係豸藉由拉晶法製造而成形為 圓柱形狀之矽晶棒之圓柱表層部於柱軸方向使用帶鋸或線 鋸以其面彼此大致成為直角之方式切斷除去而形成四平面 部，且於其兩平面部間由於殘留前述圓柱表層部之一部分 而形成圓弧面（R面）之四棱角部後，視需要實施前述四平面 部之平面研削或前述四稜角部之圓筒研削。 又，由多結晶構成之矽塊，藉由帶鋸或線鋸切斷除去 將熔融原料流入成形模而成形為立方體形狀之矽晶棒之六 面之表層部後，進而切斷成四角枉形狀，形成由四面構成 之平面部，對該兩平面所交會之四稜角部進行微幅去角（C 面）。此外，當前述切斷面之外形尺寸之相關要求精度高時， 係與前述同樣地進行研削處理。 201114549 如前所述切斷成形之單結晶矽晶棒及多結晶矽，係於 次步驟中藉由線鋸切片加工以製造矽晶圓，但由於在前者 之單結晶矽塊之四平面度及成圓弧面（R面）之四棱角部之 表層部若存在有微裂痕或或微小凹凸，在切片加工時所製 造之石夕晶圓則容易產生裂痕、缺口，因此於專利文獻1中 揭不有一種研磨方法，係使用混入有鑽石磨粒（#800)之尼龍 樹月曰刷作為研磨手段而從表面研磨除去5〇〜丨〇〇 y m以上、 200 以下之表層部，除去存在於前述四平面部及四棱角 部之微小凹凸（及微裂痕），將研磨前之表面粗度Ryl〇〜2〇 V m平坦化成3〜4 // m，以謀求矽晶圓之產品良率之提升。 又，後者之稜角部為直角形狀且施以微小c去角之多 結晶矽塊亦同樣地，由於在表層部若存在有微裂痕或微小 凹凸，在切片加工時所製造之矽晶圓則容易產生裂痕、缺 因此於專利文獻2中揭示有一種研磨方法，係設置粗 研磨用與完工研磨用之旋轉刷作為研磨手段其係使矽塊 之兩平面部支撐於朝朝上方《v字狀支揮部，能從傾斜上 方同時研磨移送來之前述料之兩平面部，研磨除去存在 於四平面部之微小凹凸而將之平坦化，以謀求石夕晶圓產品 之良率之提升。 [專利文獻] [專利文獻1]日本專利第4133935號公報 [專利文獻2]曰本專利第34〇5411號公報 【發明内容】 有時會於製程中在該平面部 如前所述所製造之石夕塊 4 201114549 與稜角部之表層部產生並存在表面粗度：Ryl〇〜2〇以 m(JISB0601: 1994)之凹凸、以及進而產生自表層面起深度 為80〜微裂痕。當以線鋸對此種狀態之矽塊進行 切片加時，如前所述，由於會製造出產生裂痕、缺口之 不良矽晶圓，因此係被要求一種製造成本廉價之研磨裝 置，其可在切片加工前，縮短研磨加工時間且具備（丨）可研 廇除去自刚述矽塊之表層部起丨〇〇 # m前後之深度以除去微 裂痕之高研磨能力、（2)可將表面粗度：Ryi〇〜2〇#m研磨 為數"m以下之微細研磨能力。 本發明之目的在於可提供一種研磨裝置與其研磨方 法，其能滿足别述要求事項，且能以一台之裝置進行被研 磨加工物即多角柱狀之矽塊（硬脆材料）之平面部及稜角部 之研磨加工。 為解決前述課題而完成之本發明之第丨發明為，一種 多角柱狀構件之研磨裝置，係研磨被研磨加工物（w)之形狀 為多角柱狀之各平面部及各稜角部，其具備：基台（4)，能 將該被研磨加工物（W)之各平面部中之一平面部或各棱角 邛中之一稜角部之任一者作為研磨之加工面（p)載置成水平 朝上，由挾持軸（12A)，（12B)構成之挾持手段（5)，將在研磨 加工前述被研磨加工物（W)時挾持其兩端面、在研磨結束後 解除前述挾持狀態之把持部（6A)，（6B)安裝於前端，並前後 動；研磨單元（1)’在研磨加工前述被研磨加工物（w)時，係 移送一邊使研磨具（10)之前端接觸旋轉於前述加工面（p)、 一邊進行研磨加工之研磨手段（2);以及高度位置檢測手段 (3) ’係在研磨加工前檢測出前述被研磨加工物（w)之加工面 201114549 並將該高度位置檢測訊號儲存於控制手段 CP)之高度位置 (13);前述控制手段（13)藉由前述高度位置檢測訊號運算處 理研磨手段⑺之研磨具⑽前端之切人量以進行研磨加 工。此外，此處所謂「水平朝上」係指以加工面為基準面(下 方向）。 刖述之it算處理」，係指自動設定在研磨開始前由 作業人員^人控制手段（丨3)之「研磨手段⑺之磨材之粒 度」、「前步驟中被研磨加工物（w)之切斷條件」、「被研 磨加工物(W)之研磨加工部位(平面部或稜角部)」之研磨加 工條件 '以及基於前述高度位置檢測手段（3)之高度位置檢 測訊號之「研磨手段（2)之研磨具（1())前端對被研磨加工物 (W)之加工面(P)之切入量」’又，係指藉由前述「被研磨加 工物（W)之研磨加工部位（平面部或棱角部）」之輸入而自動 設定「研磨單元（1)之移送速度」。 又’前述第1發明之記載中’其第2發明之多角柱狀 構件之研磨裝置，具備：旋轉手段（14A)，（14B)，係選擇將 兩端面被前述把持部（6A)，_挾持之被研磨加kw)以 前述挾持軸(12A)，（12B)之軸心為中心設定既定旋轉角度而 旋轉成被研磨加工面（W)之加工面（p)朝上之節距旋轉、或設 定旋轉速度而旋轉之連續旋轉之任一者後進行旋轉；以及 使前述基台（4)升降之升降手段；在研磨加工前選擇欲沿磨 加工之被研磨加工物（W)之多角柱形狀之角數與該被^磨 加工物(W)之前述稜角部之研磨加工條件、亦即選擇前述旋 轉手段（14A)，（14B)之節距旋轉或連續旋轉之饪一者後設定 於前述控制手段（1 3)。 6 201114549 前述挾持軸（12A)，（12B)之「節距旋轉」係指依各加工 面（p)研磨被研m(w)之錢角部及各平面部時選擇 設^之研磨形式’且係在研磨加卫開始前將旋轉手段⑽)， (14B)之挾持轴（12A)，（12B)之研磨形式選擇設定於「節距旋 轉」，並將被研磨加工物（w)之多角柱形狀之「角數」輸入 至控制手段⑴），藉此運算處理前述旋轉手段（i4A)，」 之旋轉角纟，以在每次一加工面(p)之研磨結束時被研磨加 工物（W)之次-加工面（P)朝上之方式使旋轉手段（MA) 之挾持軸（12A)，（12B)旋轉並停止之研磨形式，其係在 研磨加工該被研磨加工物(w)之形狀為如多結晶所構成之 石夕塊般、多數個平面部與該兩平面部交會之稜角部之截面 形狀為角形之多角柱狀構件之情形下所設定者。 又，前述挾持軸（12A)，（12B)之「連續旋轉」，其係在 被研磨加工物（W)之形狀為如單結晶所構成之料般、為多 面構成之平面部與該兩平面部交會之稜角部之截面形狀為 圓弧狀而研磨加卫該稜角部之情形下所選擇設定之研磨形 式’在研磨加工開始前將旋轉手段（14A)，（i4B)之挟持轴 (12A)，（12B)之旋轉形式選擇設定於「連續旋轉」，並將其 、「旋轉速度」輸人至控制手段（13)，藉此被研磨加工物（w、) 乂挾持軸（12A)，（ι2Β)之軸心為中心連續旋轉而同時研磨加 β亥各杈角邛。此外，該被研磨加工物（w)之各平面部之研 磨加工係藉由前述研磨形式之「節距旋轉」進行。 又“刀別將第1或第2發明中包含下述者作為第3及 第4發明，亦即研磨手段⑺係含有磨粒之毛材，該毛材係 於該研磨手段底部環狀植設有複數根之研磨刷。 201114549 第6:明“1將第1或第2發明中包含下述者作為第5及 ''即研磨手段(2)係將含有磨粒之複數根毛材 成之研磨具0〇)基部複數根植設於旋轉板之研磨刷。材、，，困 又刀別將第1或第2發明中包含下述者作為第7及[Technical Field] The present invention relates to a plane (hereinafter referred to as a "planar portion") for polishing and removing a workpiece of a polygonal column shape composed of a hard and brittle material, and the two planes A polishing device for the surface layer of the edge of the meeting (hereinafter referred to as "the corner portion"). [Prior Art] Conventionally, a polygonal columnar member which is a hard and brittle material to be polished according to the present invention is used, for example, in a quadrangular prism shape which is obtained by slicing a wire ore. The Shixi block is formed by a single crystal or a crystallized rod composed of a ceremonial crystal, which is cut by a band saw or a wire saw to form a quadrangular prism shape, but when the above-mentioned cutting is not required, the dimensional accuracy is high. Grinding the surface of the surface. . A stone block formed of S crystal, which is a cylindrical surface layer formed by a crystal pulling method and formed into a cylindrical shape, is cut in a column axis direction by a band saw or a wire saw so that the faces thereof are substantially at right angles to each other. After the four planar portions are formed by being cut off, and the four corner portions of the circular arc surface (R surface) are formed between the two flat portions due to the remaining portion of the cylindrical surface layer portion, the planar grinding of the four planar portions or the aforementioned The cylinder of the four corners is ground. Further, the crucible made of a polycrystal is cut by a band saw or a wire saw to remove the surface layer portion of the hexagonal crystal rod which is formed into a cubic shape by flowing the molten raw material into the molding die, and then cut into a square shape. A flat portion composed of four faces is formed, and the four corner portions intersecting the two planes are slightly chamfered (C-plane). Further, when the accuracy of the required size of the cut surface is high, the grinding process is performed in the same manner as described above. 201114549 The single crystal twin rod and the polycrystalline tantalum which are cut and formed as described above are processed by a wire saw slicing in the second step to produce a tantalum wafer, but due to the flatness of the single crystal block in the former When there are micro-cracks or micro-convexities in the surface layer portion of the quadrangular corner portion of the arc surface (R surface), the stone wafer produced during the slicing process is likely to be cracked or notched, and thus disclosed in Patent Document 1 There is no polishing method, and a surface of the surface layer of 5 〇 to 丨〇〇 ym or more and 200 or less is removed from the surface by using a nylon tree moon 曰 brush mixed with diamond abrasive grains (#800) as a polishing means. The fine irregularities (and micro-cracks) of the four flat portions and the four-cornered corners flatten the surface roughness Ryl〇~2〇V m before grinding to 3 to 4 // m, in order to improve the yield of the wafer. . Further, in the case where the corner portion of the latter is a right-angled shape and a polycrystalline crest having a small c-angular angle is applied, similarly, if a micro-crack or minute irregularities are present in the surface layer portion, it is easy to manufacture a wafer at the time of slicing. In the case of cracks and defects, Patent Document 2 discloses a polishing method in which a rotary brush for rough polishing and finishing polishing is provided as a polishing means for supporting the two flat portions of the block toward the upper "v-shaped branch". In the wand, the two flat portions of the material to be transferred can be simultaneously polished from the upper side, and the fine irregularities existing in the four flat portions are polished and removed to flatten the material to improve the yield of the Shihwa wafer product. [Patent Document 1] Japanese Patent No. 4133935 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. Shi Xi block 4 201114549 and the surface layer portion of the corner portion are produced and have surface roughness: Ryl 〇 〜 2 〇 in m (JISB0601: 1994), and the depth from the surface layer is 80 to micro crack. When the wire saw is sliced in this state, as described above, since a defective wafer which generates cracks and notches is produced, a polishing apparatus which is inexpensive to manufacture is required, which can be Before the slicing process, the grinding processing time is shortened and the surface is thickened to remove the micro-cracking ability from the surface layer of the surface of the crucible to remove the micro-cracking ability, and (2) the surface can be roughened. Degree: Ryi〇~2〇#m is ground to a number of fine grinding power below quot. An object of the present invention is to provide a polishing apparatus and a polishing method thereof, which can satisfy the requirements of the other descriptions, and can carry out the planar portion of the polygonal workpiece (hard and brittle material) which is the workpiece to be polished, and the apparatus. Grinding of the corners. According to a third aspect of the present invention, the present invention provides a polishing apparatus for a polygonal columnar member, wherein each of the planar portions and the respective corner portions in which the shape of the workpiece (w) is polished into a polygonal column shape is provided. The base (4) is capable of placing one of the flat portions of one of the flat portions of the workpiece (W) or one of the corners of each of the corners as a processed surface (p) to be polished. The holding means (5) composed of the holding shafts (12A) and (12B) is held horizontally, and the both ends of the workpiece (W) are polished, and the holding state is released after the polishing is completed. The parts (6A) and (6B) are attached to the front end and move forward and backward. When the polishing unit (1)' is polished to process the workpiece (w), the front end of the polishing tool (10) is rotated and rotated. a processing surface (p), a polishing means (2) for performing a polishing process, and a height position detecting means (3) 'detecting the processed surface 201114549 of the workpiece (w) before the polishing process and setting the height position The detection signal is stored in the control means CP) The height position (13); the control means (13) handles the cutting amount of the front end of the grinding tool (10) of the polishing means (7) by the height position detecting signal to perform the grinding process. In addition, the term "horizontal upwards" as used herein refers to a machined surface as a reference plane (downward direction). "The calculation of the calculation" means automatically setting the "grain size of the abrasive material of the polishing means (7)" by the operator's control means (丨3) before the start of the polishing, and "the workpiece to be polished in the previous step (w) "Cutting conditions", "grinding conditions" of the polished portion (planar portion or corner portion) of the workpiece (W), and "grinding means for the height position detecting signal based on the height position detecting means (3) (2) The amount of cut-in of the machined surface (P) of the workpiece (W) at the tip of the polishing tool (1) is "grinding" by the above-mentioned "machined object (W)) The "transfer speed of the polishing unit (1)" is automatically set at the input of "planar or angular portion". In the above-described first invention, the polishing apparatus for the polygonal columnar member according to the second aspect of the invention includes the rotation means (14A) and (14B), and the both end faces are selected by the gripping portion (6A), Grinding plus kw) is set to a predetermined rotation angle centering on the axis of the holding shafts (12A) and (12B), and is rotated to a pitch of the processing surface (p) of the surface to be polished (W) upward, or Rotating the rotation speed and rotating the rotation, and rotating the base (4); and selecting the polygonal column shape to be ground (W) before the grinding The number of corners and the polishing processing conditions of the edge portion of the workpiece (W), that is, the pitch rotation or continuous rotation of the rotation means (14A) and (14B) are selected. Control means (1 3). 6 201114549 The "pitch rotation" of the above-mentioned holding shafts (12A) and (12B) means that the grinding angle of the m (w) and the flat parts of each of the plane parts is polished according to each processing surface (p). The grinding method (10)), the holding pattern of the holding shaft (12A) and (12B) of (14B) are set to "pitch rotation" before the start of the grinding and the grinding, and the workpiece (w) is to be ground. The "number of corners" of the corner column shape is input to the control means (1)), whereby the rotation angle 纟 of the rotation means (i4A)" is calculated and processed to be polished at the end of the polishing of one processing surface (p) ( W) - a grinding form in which the processing surface (P) faces upward to rotate and stop the rotating shaft (12) of the rotating means (MA), which is used to grind the workpiece (w) The shape is set as in the case of a multi-angle columnar member in which the cross-sectional shape of the angular portion of the intersection of the plurality of planar portions and the two planar portions is an angular shape. Further, the "continuous rotation" of the holding shafts (12A) and (12B) is a flat portion composed of a plurality of surfaces and a plane formed by a single crystal in the shape of the workpiece (W). The cross-sectional shape of the corner portion of the intersection is an arc shape, and the grinding pattern selected in the case where the corner portion is polished and erected 'the rotation means (14A), (i4B) the holding shaft (12A) before the start of the grinding process The rotation type of (12B) is set to "continuous rotation", and the "rotation speed" is input to the control means (13), whereby the workpiece (w,) is held by the workpiece (12A), ( The axis of ι2Β) is continuously rotated at the center while grinding and adding β 杈 corners. Further, the grinding process of each of the flat portions of the workpiece (w) is performed by "pitch rotation" of the polishing method. Further, the first or second invention includes the following three or fourth inventions, that is, the polishing means (7) is a material containing abrasive grains which are ring-shaped at the bottom of the polishing means. A polishing brush having a plurality of roots. 201114549 No. 6: "1. The first or second invention includes the following as the fifth and '', that is, the polishing means (2) is a grinding of a plurality of raw materials containing abrasive grains. A grinding brush with a plurality of bases implanted on the rotating plate. Material, and, etc., the first or second invention includes the following as the seventh and
Li:,二亦即研磨手段⑺係將含有磨粒且彼此纏繞之纖 、”，體複數根植設於該研磨手段底部之研磨刷。 又將第3至第8發明十任一者令包含下述者作為第9 亦即將複數台研磨手段⑺連接成各研磨手段⑺之下Li: The second means that the polishing means (7) is a fiber which contains abrasive grains and is entangled with each other, and the plurality of bodies are implanted on the bottom of the polishing means. The third to eighth inventions are also included. As the ninth, the plurality of grinding means (7) are connected under the respective grinding means (7).
端大致成水平、亦恶上、A P配置成各研磨手段（2)之下端相對加工 面成為大致平行。 又’將第3至第8發明中任一者中包含下述者作為第 务月亦即將研磨手段（2掩置於前述多角柱狀構件之至 少2個以上之不同面。 將第3至第8發明中任一者中包含下述者作為第 11發明’亦即將複數台研磨手段（2)於前述多角柱狀構件之 至少2個以上之不同面分別配置成各研磨手段（2)之下端大 致成水平、亦即配置成各研磨 為大致平行。 风 刀別將第9或第11發明中包含下述者作為丨2及 發月亦即混合於毛材之磨粒粒度為〜#2⑻ 删:：㈣），選擇兩種類以上其粒度不同之研磨手段⑺， 並將5亥研磨手段(2)連設成從粒度「粗」至「細」之順序進 行研磨加工。 又刀別將第9或第11發明中包含下述者作為丨4及 第15發明，士 „ '、P混合於毛材之磨粒粒度為j? I 8〇〜#2〇〇〇， 8 201114549 選擇其粒度大致相同之研磨手段，並連接該研磨手段。 又’分別將前述第10、12、 13、14、15中之任一發明中包含下述者作為16、17、18、 9 20 2 1發明，亦即於基台（4)載置被研磨加工物（评）之 表接構件⑺，形成有I研磨冑述被研磨力口工物（w)之任一棱 角部時為能將該一稜角部載置成水平朝上而其下側之平面 部所接觸之缺π V⑻、以及於該缺口 v(8)形成有在研磨前 述被研磨加工物（W)之各平面部之任一平面部時為能將該 一平面部載置成水平朝上而其下側之稜角部（9)能卡止之缺 σ L。 ' 又，第22及第23發明為一種多角柱狀構件，係藉由 則述第1至第8或第16發明中之任一發明之多角柱狀之研 磨裝置，除去從被加工物表層起1〇〇Am以下存在之微裂 痕’且研磨加工面之表面粗度Ry(JIS b0601 : i994)設為3 /z m以下。 又，分別將第22或第23發明中包含下述者作為24及 第25發明，亦即多角柱狀構件係矽塊或陶瓷。 又，第26發明之多角柱狀構件之研磨方法，係於前述 第1發明之多角柱狀之研磨裝置，在對載置於基台之被 研磨加工物（W)之複數個加工面中（p)各加工面（p)之研磨結 束之時點，前述挾持手段之挾持軸（12A)(12B)後退而解 除把持部（6A)，（6B)之挾持狀態之前述被研磨加工物（w)，由 作業人員手動反轉成其次一加工面水平朝上後，使前述 挾持手段（5)之挾持軸（12A)，（12B)前進而使一把持部（6a) 到達被研磨加工物（W)之基準端面位置並停止，使另一挾持 201114549 轴（1 2B)進一步前進而使該把持部（丨2B)按壓挾持被研磨加 工物（W)之另一端面，藉以對依前述設定之次一加工面 進行研磨加工，研磨加工所有加工面（p)之程序，係以在結 束各稜角部之研磨後對各平面部研磨加工之方式進行。 又’第27發明之多角柱狀構件之研磨方法，係於前述 第2發明之多角柱狀之研磨裝置中，藉由選擇節距旋轉或 連續旋轉之任一方法結束所有稜角部之研磨加工後，使設 定有既定旋轉角度之前述旋轉手段（14A)，（14B)旋轉而對每 平面。卩研磨加工，藉以進行所有平面部之研磨加工，該 節距旋轉係在以挾持手段（5)之把持部（6A)，挾持載置 於基台（4)之被研磨加工物（w)兩端面之狀態下使前述基台 (4)下降而從被研磨加工物（w)離開’係使設定有既定旋轉角 度之月j述旋轉手& (1 4A)，（ 1 4B)旋轉而對每一稜角部以研磨 面（P)定位成朝上之方式進行研冑’藉此進行被研磨加工物 (W)之各稜角部之研磨，該連續研磨係使設定有旋轉速度之 前述旋轉手段（14A)，（14B)連續旋轉而同時研磨各稜角部。 又，第28及第29發明之多角柱狀構件之研磨方法， 係於前述第9或第11發明之多角柱狀之研磨裝置，混合於 毛材之磨粒粒度為F180〜#2000,選擇兩種類以上其粒度不 同之研磨手段⑺，並將該研磨手段⑺連設成依其粒度「粗」 至「細」之順序研磨加工。 又，第30及第31發日月之多角柱狀構件之研磨方法， 係於前述第9或第U發明之多角柱狀之研磨裝置，混合於 前述毛材之磨粒粒度為F180〜#2〇〇〇,選擇其粒度大致2同 之研磨手段（2)，並連接該研磨手段來進行研磨。 201114549 根據前述第1發明，勾在研磨開始前將「研磨加工完成 品之標準片（母工件）」載置於基台（4)上並設定開始研磨手段 2之研磨具1〇(研磨刷）前端之研磨加工之高度位置後’…卸 除前述基台（4)之研磨加工完成品之標準片，將被研磨加工 物（W)載置成其加工面（p)朝上， C)在將「研磨手段(2)之磨材之粒度」、「被研磨加工 物（W)在前步驟之切斷條件」、「被研磨加工物（w)之研磨 加工部位（平面部或稜角部）」之研磨加工條件輸入於控制手 段（13)後，開始研磨，由挾持手段⑴之把持部（6a)，（6b)挟 持被研磨加工物（W)之兩端面並固定於基台（4)上，例如即使 在被研磨加工物（W)之前步驟中於切斷後之外形尺寸產生 誤差而有不料’亦可藉由前述高度位置檢測手段⑺之高 度位置檢測訊號運算處理研磨手段⑺之研磨具（1G)前端對 「被研磨加工物(W)之加工面(P)之切入量」，而在研磨加工 刖自動設定以能進行最佳之研磨加工。在該研磨加工结束 後，由於即自動解除挾持該被研磨加工物（w)兩端面之^述 挾持手段(5)之把持部(6A)，(6B)，目此可藉由作業人員手動 將載置於基台(4)之被研磨力。工物(w)反轉成次一加工面⑺ 朝上後’使挾持手段（5)之把持部（6A)，（6B)作動以挾持固定 被研磨加工物（W)之兩端面’而進行次一加工面（p)之研磨加 工〇 前述一連串研磨步驟中之被研磨加工物(W)之加工面 W之設定雖由作業人員手動進行，但研磨手段⑺之研磨且 (10)前端對被研磨加工物（W)之切入量、或以既定旋轉速度 接觸旋轉於被研磨加工物(w)之加工面(P)而研磨加工之作 201114549 動，由於係自動控制’因此能進行最佳之研磨加工，謀求 生產性之提升。 根據第2發明，係在前述被研磨加工物（w)被挾持手段 (5)之把持部（6A)，（6B)挾持之狀態下使基台（4)下降並從被 研磨加工物（W)離開後，藉由前述旋轉手段（14a)，（ 1 4B)使該 被研磨加工物（W)以挾持軸（1 2A), (12B)為中心節距旋轉既 定角度，設定成次一研磨之加工面（P)水平朝上。在該時點， 係成為前述基台（4)上升而再次載置固定被研磨加工物（w) 之狀態，而能一邊使研磨手段（2)之研磨具（1〇)接觸旋轉一邊 將之移送’藉以進行研磨加工。 前述一連串之研磨加工，不需由作業人資手動作業， 係能以全自動依各加工面（P)依序進行被研磨加工物（w)之 各稜角部與各平面部之研磨加工。 又，當被研磨加工物（W)即素材為單結晶所構成之矽 之各稜角部之研磨加工，係如前所述使該加工面（p)朝上 止並依各面研磨之方法日夺，由於有時會有因梭角部與平 部之接合部位之截面形狀使研磨具（1〇)前端之接觸不充 而未除去#在於該接合部之微裂痕或表面粗度未成微 狀態’因此若係使前述旋轉手段(14A)，（14B)連續旋轉而 被研磨加工物（W)即矽塊旋轉於柱軸中心進行研磨加工 方法，研磨具⑽之前端即可充分接_壓於前述棱角部· 圓弧面（R面）及該棱角部與平面部之接合部位，而能均叫 研磨’進而可容易地除去存在於前述接合部位之微裂痕； 使其表面粗度微細化。 Ί 又 如前所述使被研磨加工物（w)連續旋轉並 同時研磨 12 201114549 力各奴角部時’由於係以挾持手段⑺之挾持軸（1 2 A)， )陆^為中心旋轉，為了可均一地研磨各棱角部，從 /被研磨加工物（从。之端面側觀看之挾持軸（12a)，（kb)前 端之把持。p (6A)，（<)Β)之挾持位置，係需進行對芯調整。 關於將被研磨加工物（w)以其一棱角部朝上之方式載 j方、基σ (4)’使别述挾持手段⑺之挾持轴（ία)，（ία)分別 别進而把持部（6Α), (6Β)挾持被研磨力口工物（界）兩端面時、從 被2磨加工物（W)端面側觀看之挾持位置，其水平方向雖藉 由《又於基台（4)之承接構件⑺之缺〇 v(8)進行對芯調整，但 在其上下方向’當前步驟中切斷石夕晶棒而形成之被研磨加 ，物(w:即矽塊之外形尺寸產生誤差時，由於會產生相當於 忒誤差里之1 /2之量之偏移，因此需進行對芯調整。 前述於上下方向進行對芯調整之方法，係在使前述高 度位置檢測手段（3)作動而測定朝上載置於基台⑷之被研磨 加工物（w)之稜角部之高度（H1)後，使前述基台⑷下降而從 被研磨加工物(W)離開，使旋轉手段〇4A)，（i4B)旋轉⑽ 度並使前述成為向下之被研磨加工物(W)之稜角部朝上以 測定其高度（H2)，將其測定結果儲存於控制手段（13)，將相 當於其差分之1 / 2( = (H1 — H2)/ 2)之高度作為上下方 對芯調整量進行運算處理。 其次，使基台（4)上升使被研磨加工物（w)之下面 設在承接構件⑺之缺口 v⑻，並使前述挾持手段⑺接 轴（12A)，（12B)後退而將前端之把持部（6a)，⑽）所挾 被研磨加工物(w)兩端面開㈣’使前述基台(4)移動相春 經前述運算處理之上下方向之對芯調整量之量，使前：抉 13 201114549 持手段（4)之挾持軸⑽），（12B)前進以使前端之把持部 (6A)，（6B)挾持被研磨加工物（w)之兩端面即完成上下方向 之對芯調整。 根據第3及第4發明，由於與例如研磨石等之研磨方 法相較’毛材具有柔軟性’ θ此能抑制因研磨而於被研磨 加工物產生之損傷。毛材由於含有磨粒，因此研磨力能充 分地確保。 根據第5及第6發明’藉由任意設定植設有研磨具⑽ 之紅轉板之位置（上下方向），即能調整從研磨手段⑺底部露 出之毛材之長度mi由配合毛材之磨耗使旋轉板之 位置往下方㈣’而能將常時露出之毛材之長度保持於一 定。 根據第7及第8發明，由於藉由使含有磨粒且彼此缠 口之彈性體彼此纏合，力此等集合體内部即包含有空氣， 當以植設有此等之研磨刷加工被加工物時，所包含之空氣 層係發揮緩衝材之功能。因此，能減低被研磨加工物(W)因 與該研磨刷接觸而造成之損傷。 根據第9發明，可視被研磨加工物（W)之種類或目的適 當地選擇研磨手段（2)進行加工。 根據第1 0發明，藉由將研磨手段（2)設置於被研磨加工 至乂 2個以上之不同面，而能同時進行兩面以上之 加工0 、根據第11發明，可藉由依照被研磨加工物（W)之種類 或目的，適當選擇設置於被研磨加工物（w)之至少兩個以上 不同面之各研磨手段（2)來進行加工。 14 201114549 根據第12及第13發明，藉由磨粒之粒度為「粗」之 研磨手段（2)提升研磨力而增加研磨量，藉以能容易地除去 存在於被研磨加工物（W)表層部之微裂痕，藉由磨粒之粒度 為「細」之研磨手段（2)，除去因在前述「粗」之研磨手段 (2)之研磨加工而呈粗糙之表面之凹凸，使表面粗度微細 化’而能消除在後製程中產生之裂痕或缺損、缺口。 根據第14及第15發明，在連接有複數台研磨手段（2) 時’藉由使植設於各研磨手段（2)之毛材所包含之磨粒之粒 又大致相同而I縮短被研磨加工物（W)之研磨加工時間。 根據第1 6至第2 1發明，設於基台（4)之承接構件（7)之 缺口 V(8)，（8)在研磨被研磨加工物（w)之稜角部之情形下’ 當2該被研磨加工物（w)之一棱角部載置成水平朝上時能 確實地載置固定該被研磨加工物（W)下側之平面部，設於基 口（4)之承接構件（7)之缺口 L(9)，（9)在研磨被研磨加工物（w) 之平面部之情形下，當將該被研磨加工物（W)之一平面部載 置成水平朝上時能確實地載置固定該被研磨加工物（W)下 側之稜角部。 根據第22及第23發明，藉由使用第1至第8及第16 發明中之任—者之研磨裝置，而能製得可除去自表層起之 微裂痕，且表面粗度Ry為3/zm以下之多角柱狀 構件。 根據第24及第25發明，藉由使用第1至第8及第16 發明中之紅 1 者之研磨裝置，而製得之可除去自表層起之 l〇〇"m之微裂痕，且表面粗度為以下之多角柱狀 才冓# ’係可非常合適地使用矽塊或陶瓷之類之硬脆材料。 15 201114549 根據第26發明，如同前述第i發明之效果亦有記載， 被研磨加工物（W)之加工面（p)之設定雖由作業人員手動進 行，但研磨手段（2)之切入量或其作動由於係自動控制，因 此即使作業人員交替亦可在不使加工精度與生產性降低之 It开V下研磨加工’其研磨加工之程序，係以在結束各稜角 部之研磨後對各平面部研磨加工之方式進行，藉此能將各 &角部與平面部接合之連接部位研磨A「平滑形狀」，容 易地進行存在於表層部之微裂痕與表面凹凸之除去。 根據第27發明，係設置在將被研磨加工物（w)挟持於 挾持手段（5)之挾持軸前端之把持部（6A), (6B)之狀態下，使 該被研磨加工物(W)以前述挾持軸之軸心為中心旋轉之旋 轉手段，藉以進行在前㈣丨發明中透過作f人員進行之 被研磨加工物(W)之各加工面(p)之設定，而能省去作業人員 之麻煩，藉由前述旋轉手段使被研磨加KW)連續旋轉而 從上方使研磨手段⑺下降至該被研磨加工物（w)並使研磨 具（10)前端-邊接觸旋轉—邊移送，而能將作為前述第5發 月之作用政果之各稜角部與平面部接合之連接部位之形狀 進步研磨成「平滑形狀」，能更確實地進行微裂痕 凸之除去。 根據第28及帛29發明，藉由將磨粒之粒度不同之「 之研磨手段（2)與「細」之研磨手段（2)連設兩種類以上 以磨粒之粒度為「粗」之研磨手段⑺之高研磨能力確1 除去存在於被研m(w)表層部之微裂痕，並藉由肩 之粒度為「細」之研廢车/Λ、 %微手& (2)之微細研磨能力，將因肯 研磨加工而呈粗縫之矣a 表層。卩之表面粗度研磨成微細，$ 16 201114549 在後製程中產生之缺損、缺口。又，研磨手段（2)所採用之 研磨刷’能選擇含有磨粒之毛材複數根植設於該研磨手段（2) 底部者、將複數根含有磨粒之毛材綑束而成之研磨具（丨〇) 於該研磨手段（2)之旋轉盤（1 1)植設複數根者、將含有磨粒且 彼此纏合之纖維狀彈性體於該研磨手段（2)底部植設有複數 根者。又’當將前述研磨具（10)複數根植設於前述旋轉盤（u) 時，如後述之圖2之說明所記載，當由混合磨粒之毛材構 成之研磨具（10)已消耗時，可係僅將該研磨具〇〇)更換成新 的研磨具（10)之拆裝自如於旋轉盤（11)之型式、以及以連同 未圖示旋轉盤一起更換之方式將研磨具固定安裝於旋轉盤 之槊式之任一者。 根據第30及第3 1發明，藉由將磨粒之粒度大致相同 之研磨手段（2)連接複數台，而能縮短被研磨加工物之研 磨加工時·間。X，如前所述，採用於研磨手段⑺之研磨刷， 係如後述之圖2之說明所記載，#由混合磨粒之毛材構成 之研磨具（10)已消耗時，可係僅將該研磨具⑽）交換成新的 研磨具（1G)之拆裝自如於旋轉盤（11)之型式、以及以連同未 圖示旋轉盤一起更換之古βΛ 俠之方式將研磨具固定安裝於旋轉盤之 型式之任一者。 【實施方式】The ends are substantially horizontal and disgusting, and A P is disposed such that the lower ends of the respective polishing means (2) are substantially parallel with respect to the machined surface. In addition, the third to eighth inventions include the following as the first month, that is, the polishing means (2 is placed on at least two different faces of the polygonal columnar member. In any one of the eight inventions, the first polishing apparatus (2) is disposed such that at least two or more different surfaces of the polygonal columnar member are disposed at the lower ends of the respective polishing means (2). It is substantially horizontal, that is, arranged so that each polishing is substantially parallel. The air knife does not include the following in the ninth or eleventh invention as the 丨2 and the merging, that is, the abrasive grain size mixed with the wool material is ~#2(8) ::(4)), select two or more kinds of grinding means (7) with different particle sizes, and connect the 5 hai grinding means (2) to the order of grinding from "grain" to "fine". Further, in the ninth or eleventh invention, the following is included as the 丨4 and the fifteenth invention, and the abrasive grain size of the „′, P mixed with the wool material is j? I 8〇~#2〇〇〇, 8 201114549 Selecting a polishing means having substantially the same particle size, and connecting the polishing means. Further, each of the above-mentioned 10th, 12th, 13th, 14th, and 15th includes the following as 16, 17, 18, 9 20 According to the invention, the surface member (7) of the workpiece (4) to be polished is placed on the base (4), and it is possible to form one of the corner portions of the workpiece (w) to be polished. The rib portion is placed horizontally upward, and the lower surface portion of the lower portion is contacted with π V (8), and the notch v (8) is formed with each flat portion of the workpiece (W). In any of the flat portions, the one flat portion can be placed horizontally upward and the lower corner portion (9) can be locked by the missing σ L. Further, the 22nd and 23rd inventions are a polygonal columnar shape. In the polygonal columnar polishing apparatus according to any one of the first to eighth or sixteenth aspects of the invention, the member is removed from the surface layer of the workpiece. The surface roughness Ry (JIS b0601: i994) of the surface to be polished is set to be 3 /zm or less. The 22nd or 23rd invention includes the following as the 24th and 25th inventions, respectively. In other words, the polygonal columnar member is a polishing method of the polygonal columnar member according to the first aspect of the invention, and is applied to the polishing apparatus placed on the base. (p) at the time when the polishing of each of the processing surfaces (p) is completed in the plurality of processing planes of the object (W), the holding axis (12A) (12B) of the holding means is retracted to release the gripping portions (6A), (6B) The workpiece (w) to be polished in the held state is manually reversed by the operator until the next processing surface is horizontally upward, and the holding axes (12A) and (12B) of the holding means (5) are advanced to each other. The portion (6a) reaches the reference end surface position of the workpiece (W) and stops, and the other gripping the 201114549 shaft (1 2B) is further advanced, and the grip portion (丨2B) is pressed against the workpiece (W). The other end face is used to grind the next processing surface according to the above setting. The process of grinding all the processed surfaces (p) is performed by polishing the respective flat portions after polishing the respective corner portions. The method for polishing the polygonal columnar member according to the twenty-seventh aspect is the second In the multi-corner column-shaped polishing apparatus of the present invention, after the grinding process of all the corner portions is completed by any one of the pitch rotation or the continuous rotation, the rotation means (14A), (14B) set with a predetermined rotation angle are rotated. For each plane, the grinding process is performed to perform the grinding process of all the flat portions, and the pitch rotation is performed by the holding portion (6A) of the holding means (5), and the holding device is placed on the base (4). In the state in which both ends of the object (w) are lowered, the base (4) is lowered and the workpiece (w) is separated from the workpiece (w) so that the rotation angle is set to a predetermined rotation angle (1 4A), (1) 4B) Rotating and grinding each of the corner portions so that the polishing surface (P) is positioned upward, thereby polishing the respective corner portions of the workpiece (W), the continuous grinding system setting the rotation The aforementioned rotation means of speed (14A), (14B) Continued rotation of the respective edge portion while polishing. Further, in the polishing method of the polygonal columnar member according to the ninth or eleventh aspect of the invention, the polishing apparatus of the ninth or eleventh aspect of the invention is characterized in that the abrasive grain size of the wool material is F180 to #2000, and two are selected. The polishing means (7) having different particle sizes or more are arranged, and the polishing means (7) is connected to be polished in the order of "thickness" to "fineness". Further, the method for polishing the polygonal columnar member of the 30th and 31st day is used in the polygonal columnar polishing apparatus of the ninth or the ninth invention, and the abrasive grain size of the wool material is F180 to #2 For example, the polishing means (2) having a particle size of approximately the same size is selected, and the polishing means is connected to perform the polishing. According to the first aspect of the invention, the "standard piece (master workpiece) of the finished product to be polished" is placed on the base (4) before the start of the polishing, and the polishing tool 1 (grinding brush) for starting the polishing means 2 is set. After the height position of the grinding process at the front end, the standard piece of the finished product of the abutment (4) is removed, and the workpiece (W) is placed such that the processed surface (p) faces upward, C) "The particle size of the abrasive material of the polishing means (2)", "the cutting condition of the workpiece (W) in the previous step", and the "machined portion (planar portion or corner portion) of the workpiece (w) to be polished. After the grinding processing conditions are input to the control means (13), the grinding is started, and the gripping portions (6a) and (6b) of the holding means (1) hold both end faces of the workpiece (W) and are fixed to the base (4). For example, even if there is an error in the dimensional dimension after the cutting in the previous step of the workpiece (W), the grinding tool of the grinding device (7) can be processed by the height position detecting means (7) of the height position detecting means (7). (1G) front end to "grinded material (W ) The cutting amount of the machined surface (P) is automatically set in the grinding process to enable optimum grinding. After the completion of the polishing process, the gripping portions (6A) and (6B) of the gripping means (5) on both ends of the workpiece (w) are automatically released, and the manual can be manually operated by the operator. The abrasive force placed on the abutment (4). The workpiece (w) is reversed to the next processing surface (7), and the holding portion (6A) and (6B) of the holding means (5) are actuated to hold the both end faces of the workpiece (W). Polishing of the next processed surface (p) 设定 The setting of the processed surface W of the workpiece (W) in the series of polishing steps is manually performed by the operator, but the polishing means (7) is ground and (10) the front end is The amount of cutting of the workpiece (W), or the processing of the workpiece (P) rotated by the workpiece (w) at a predetermined rotation speed, and the grinding process is 201114549, which is automatically controlled, so that it can be optimally Grinding processing to improve productivity. According to the second aspect of the invention, the base (4) is lowered and the workpiece (4) is lowered while the workpiece (w) is gripped by the gripping portions (6A) and (6B) of the gripping means (5). After leaving, by the above-mentioned rotating means (14a), (1 4B), the workpiece (W) is rotated by a predetermined angle with the holding axes (1 2A) and (12B) as the center pitch, and the grinding is set to the next grinding. The processing surface (P) is horizontally facing upwards. At this time, the base (4) is raised and the fixed workpiece (w) is placed again, and the polishing tool (2) can be transferred while being rotated by contact with the polishing tool (1). 'By grinding. In the above-described series of polishing processes, it is possible to carry out the grinding process of each of the angular portions and the flat portions of the workpiece (w) in a step-by-step manner in a fully automatic manner without any need of manual work by the operator. Further, the polishing process of each of the corner portions of the workpiece (W), that is, the material is a single crystal, is performed by grinding the processed surface (p) upward and grinding the surface according to the surface as described above. Because there is a case where the cross-sectional shape of the joint portion between the corner portion and the flat portion causes the contact of the tip end of the polishing tool (1〇) to be uncharged, the result is that the micro-crack or the surface roughness of the joint portion is not in a micro state. 'Therefore, if the rotating means (14A) and (14B) are continuously rotated and the workpiece (W) is rotated, the workpiece is rotated at the center of the column axis, and the polishing tool (10) can be sufficiently connected to the front end. The edge portion, the arc surface (R surface), and the joint portion between the corner portion and the flat portion can be called "grinding", and the micro cracks existing in the joint portion can be easily removed; and the surface roughness can be made fine. Ί As described above, the workpiece (w) is continuously rotated and simultaneously ground. 12 201114549 When the corners of the force are used, 'the shaft (12 A) is held by the holding means (7), In order to uniformly polish each of the corner portions, the holding position of the workpiece (the holding shaft (12a) viewed from the end surface side, and the gripping of the (kb) front end. p (6A), (<)Β) , the system needs to adjust the core. The workpiece (w) is loaded with the edge of the workpiece (w) with the corners facing upwards, and the base σ (4)' is held by the holding means (7) of the holding means (7), respectively (ία) 6Α), (6Β) Hold the position of the end face of the workpiece (W) when it is held by the end face of the workpiece (W), and the horizontal direction is by the "Abutment" (4) The defect v(8) of the receiving member (7) is adjusted to the core, but is formed by cutting the stone in the upper and lower directions in the current step, and the object is formed (w: the shape size outside the block is in error) In this case, since the offset corresponding to the amount of 1/2 of the error is generated, the core adjustment is required. The method of adjusting the core in the vertical direction is to activate the height position detecting means (3). After measuring the height (H1) of the edge portion of the workpiece (w) placed on the base (4), the base (4) is lowered and separated from the workpiece (W), and the rotating means 〇4A) (i4B) is rotated by (10) degrees and the edge portion of the workpiece (W) which is the downward direction is turned upward to measure the height (H2 of), the measurement result is stored in the control means (13), when its phase difference of 1/2 (= (H1 - H2) / 2) as the height of the lower core adjusting amount of arithmetic processing. Next, the base (4) is raised so that the lower surface of the workpiece (w) is placed on the notch v(8) of the receiving member (7), and the holding means (7) is connected to the shaft (12A), and (12B) is retracted to hold the front end. (6a), (10)) The surface of the workpiece (w) to be polished (4) is opened (4) 'The base (4) is moved by the amount of the core adjustment by the above-mentioned arithmetic processing, so that the front: 抉13 201114549 Holds the shaft (10)) of the means (4), and advances (12B) so that the gripping portions (6A) and (6B) of the leading end hold the opposite ends of the workpiece (w) to complete the core adjustment. According to the third and fourth inventions, the 'hair material has flexibility' θ compared to the polishing method such as grinding stone, and damage due to polishing to the workpiece can be suppressed. Since the wool material contains abrasive grains, the grinding force can be sufficiently ensured. According to the fifth and sixth inventions, by arbitrarily setting the position (up-and-down direction) of the red rotating plate in which the polishing tool (10) is implanted, the length mi of the hair material exposed from the bottom of the polishing means (7) can be adjusted by the wear of the matching hair material. Keep the position of the rotating plate downward (four)' and keep the length of the exposed material at a constant level. According to the seventh and eighth inventions, since the elastic bodies containing the abrasive grains and which are entangled with each other are entangled with each other, the inside of the aggregates contains air, and is processed by the abrasive brush having the plants. In the case of a substance, the air layer contained therein functions as a cushioning material. Therefore, the damage of the workpiece (W) due to contact with the polishing brush can be reduced. According to the ninth invention, the polishing means (2) can be appropriately selected and processed depending on the type or purpose of the workpiece (W) to be polished. According to the tenth aspect of the invention, the polishing means (2) can be simultaneously processed to two or more different surfaces, whereby two or more surfaces can be processed simultaneously. According to the eleventh invention, the polishing can be performed according to the eleventh aspect. For the type or purpose of the object (W), the polishing means (2) provided on at least two different surfaces of the workpiece (w) are appropriately selected and processed. 14 201114549 According to the twelfth and thirteenth inventions, the grinding amount is increased by the grinding means (2) in which the particle size of the abrasive grains is "thick", and the amount of polishing is increased, whereby the surface portion of the workpiece (W) can be easily removed. The micro-cracking, by the grinding means (2) of the "fine" grain size of the abrasive grains, removes the unevenness of the rough surface due to the grinding process of the "thick" grinding means (2), and makes the surface roughness fine. It can eliminate cracks or defects and gaps generated in the post-process. According to the fourteenth and fifteenth aspects of the invention, when a plurality of polishing means (2) are connected, "the particles of the abrasive grains contained in the wool material implanted in each polishing means (2) are substantially the same, and I is shortened and ground. Grinding time of the workpiece (W). According to the first to sixth inventions, the notch V(8), (8) of the receiving member (7) provided on the base (4) is in the case of grinding the corner portion of the workpiece (w). (2) When the edge portion of the workpiece (w) is placed horizontally upward, the flat portion on the lower side of the workpiece (W) can be surely placed and fixed, and the receiving member provided at the base (4) (7) The notch L (9), (9) When the flat portion of the workpiece (W) is ground, when the flat portion of the workpiece (W) is placed horizontally upward The angular portion on the lower side of the workpiece (W) can be reliably placed. According to the 22nd and 23rd inventions, by using the polishing apparatus of any of the first to eighth and sixteenth aspects, microcracks which can be removed from the surface layer can be obtained, and the surface roughness Ry is 3/. Multi-angle columnar members below zm. According to the twenty-fourth and twenty-fifthth inventions, the micro-cracks of the 〇〇"m from the surface layer are obtained by using the polishing apparatus of the red one of the first to eighth and sixteenth inventions, and The surface roughness is the following polygonal column shape. It is very suitable to use a hard and brittle material such as a block or ceramic. 15 201114549 According to the twenty-sixth invention, the effect of the first invention is also described, and the setting of the processed surface (p) of the workpiece (W) is manually performed by the operator, but the cutting amount of the polishing means (2) or Since the operation is automatically controlled, even if the workers alternate, the grinding process can be performed under the It open V without reducing the machining accuracy and productivity. The procedure of the grinding process is to finish the grinding of each of the corner portions. By performing the polishing process, it is possible to polish the "smooth shape" of the joint portion where the corner portions and the flat portion are joined, and to easily remove the micro cracks and surface irregularities existing in the surface layer portion. According to the twenty-seventh aspect of the invention, the object to be polished (W) is placed in a state in which the workpiece (w) is held by the gripping portion (6A) at the tip end of the gripping means (5), and (6B) is placed. By rotating the rotation center around the axis of the holding shaft, the processing surface (p) of the workpiece (W) to be polished by the person in the first (four) invention is set, and the operation can be omitted. In the trouble of the person, the grinding means (KW) is continuously rotated by the above-mentioned rotating means, and the polishing means (7) is lowered from above to the workpiece (w), and the front end-side contact rotation of the grinding tool (10) is transferred. In addition, the shape of the joint portion where the respective corner portions and the flat portion joined to each other as the effect of the fifth month can be progressively polished into a "smooth shape", and the removal of the micro-crack convex can be more reliably performed. According to the inventions of the 28th and 29th, the grinding means (2) having different particle sizes of the abrasive grains and the "fine" polishing means (2) are provided in two or more types of grinding with the particle size of the abrasive grains being "rough". The high grinding ability of the means (7) is 1 to remove the micro-cracks present in the surface layer of the m(w), and the fineness of the scrap car/Λ, % micro-hand & (2) The grinding ability will be roughened to the surface layer. The surface roughness of the crucible is ground to a fine, $16 201114549 Defects and gaps in the post-process. Further, the polishing brush used in the polishing means (2) can select a polishing tool in which a plurality of abrasive materials containing abrasive grains are implanted on the bottom of the polishing means (2), and a plurality of abrasive materials containing abrasive grains are bundled. (丨〇) A plurality of roots are implanted in the rotating disk (11) of the grinding means (2), and a fibrous elastomer containing abrasive grains and entangled with each other is implanted with a plurality of roots at the bottom of the grinding means (2) By. Further, when the plurality of polishing tools (10) are implanted in the rotating disk (u), as described in the description of FIG. 2 described later, when the polishing tool (10) composed of the mixed abrasive particles is consumed It is possible to replace the grinding tool only with a new one (10), to disassemble it from the type of the rotating disk (11), and to fix the grinding tool together with the rotating disk (not shown). Any of the types of rotating discs. According to the 30th and 31st inventions, the plurality of polishing means (2) having substantially the same particle size of the abrasive grains are connected to each other, whereby the polishing processing time of the workpiece to be polished can be shortened. X, as described above, the polishing brush used in the polishing means (7) is as described in the description of Fig. 2 which will be described later, and when the polishing tool (10) composed of the mixed abrasive grain material is consumed, it may be The grinding tool (10) is exchanged into a new type of grinding tool (1G), which is freely detachable from the type of the rotating disk (11), and the grinding tool is fixedly mounted on the rotating body in a manner of replacing it with an ancient β-manuscript which is replaced together with a rotating disk not shown. Any of the types of discs. [Embodiment]
使用圖說明本發明夕1 I w明之具備2連串以上（3連串）研磨粗度 不同之研磨手段之多备虹仙· 夕角柱狀構件之研磨裝置之構成内容血 詳細。 圖1係顯不研磨货番 & 裝置之則視圖，其顯示停止於圖中右 17 201114549 端之研磨開始前位置之研磨單元丨，以及在載置於基台4上 之以兩點鏈線所示之被研磨加工物w之圖中左右，藉由挾 持手段5之汽缸驅動而滑動之基準側之挾持軸i2A前端之 把持。卩6 A與從動側之挾持軸1 2 B前端之把持部6 b分別後 退而未挾持被研磨加工物W之開放狀態，在前述研磨單元 自圖中右側在左側連設有由三種類「粗研磨用」、「中 研磨用」、Γ完工研磨用」之磨粒粒度不同而選擇設定而 成之研磨刷所構成之各研磨手段2，於前述「粗研磨用」之 研磨手段2之圖中右側，設有用以在研磨開始前檢測被研 磨加工物W之加I® P之高度位置之高度位置檢測手段3。 前述3連之研磨手段2中之「粗研磨用」，係為了磨 除於表層部存在之大部分微裂痕而設置，「中研磨用」係 為了除去藉由帶鋸或線鋸切斷時所產生之表面凹凸與為了 使因前述「粗研磨」而變粗之表面微細化而設置，「完工 研磨用」係為了作表面粗度之最後調整而設置。此外，若 在引述中研磨」之階段結束表面凹凸之除去與表面粗度 之微細化調整，即研磨手段2設置兩連亦可。 如別所述，在決定研磨具1〇所含有之磨粒粒度不同之 研磨手段2與其研磨粗度（粗、巾、完工）之組合後，即將該 研磨具1 0之「即使被研磨加工物w之研磨加工部位（稜角 部或平面部)不同亦設成相同之旋轉速度」、「因研磨加工 部位為稜角部或平面部之差異而為不同之研磨移送速 度」 藉由南度位置檢測手段3測定了研磨加工完成品 之研磨開始時之I準高度」、「對被研磨 加工物W之加工面p之切入量」之各加工條件設定於控制 18 201114549 手段1 3。 在設定前述加工條件後，只要由作業人員將被研磨加 工物W之四稜角部中任一加工面p於前述挾持手段5之把 持部6A，6B間之基台4上載置成水平朝上並將「研磨加工 4位（棱角部或平面部）之設定開關」與「研磨開始開關」設 定成「ON」，前述研磨單元1即往圖中左端移動，藉由前 述挾持手段5之未圖示汽缸之啟動使基準侧之挾持軸12A 滑動，把持部6A前進至圖中「基準端面位置」而定位被研 磨加工物W之—端面後，從動側之挾持軸12B亦滑動使把 持部6B前進而接觸緊壓於被研磨加工物w之另一端面， 藉以挾持固定前述被研磨加工物W。 其次’研磨單元1往圖中右側移送，高度位置檢測手 段3作動而偵測被研磨加工物w之加工面p高度並將其訊 號發送至控制手段丨3作運算處理，在自動設定前述研磨手 段2之研磨具丨〇前端對該被研磨加工物w之加工面p之切 入直後，將藉由前述「研磨加工部位（稜角部或平面部）之設 定開關」而自動設定之前述研磨單元1進一步往圖中右側 移送，而使各研磨手段2依「粗研磨」、「中研磨」、「完 工研磨」之順序進行研磨加工。 在研磨加工結束後，係有下述兩種之第1發明之半自 動類型之研磨裝置與第2發明之全自動類型，該第1發明 之半自動類型之研磨裝置，係使挾持被研磨加工物w兩端 面之前述挾持手段5之挾持軸12A，12B後退作動而自動解 除挾持其前端之把持部6A，6B對被研磨加工物w之挾持狀 態’藉由作業人員手動將載置於基台4之前述被研磨加工 201114549The details of the composition of the polishing apparatus of the multi-prepared rainbow sinus columnar member having two or more series (three series) of grinding thicknesses are described in detail with reference to the drawings. Figure 1 is a view showing the non-abrasive cargo & device, showing the grinding unit 停止 stopped at the position before the start of the grinding at the end of the right end of the 2011 14549, and the two-point chain line placed on the base 4 In the figure of the workpiece to be polished w shown in the figure, the front end of the holding shaft i2A on the reference side which is slid by the cylinder driving of the holding means 5 is held.卩6 A and the gripping portion 6 b at the leading end of the holding shaft 1 2 B of the driven side are respectively retracted without holding the open state of the workpiece W, and the polishing unit is connected to the left side from the left side of the drawing by three types. For each of the polishing means 2 including the polishing brush which is selected and set to have different abrasive grain sizes for "grinding", "intermediate polishing" and "finished polishing", the polishing means 2 for the "rough polishing" In the middle right side, there is provided a height position detecting means 3 for detecting the height position of the workpiece W to be applied before the start of the grinding. The "grinding" used in the above-mentioned three-way polishing means 2 is provided to remove most of the micro-cracks present in the surface layer portion, and the "inter-grinding" is used to remove the cutting by a band saw or a wire saw. The surface unevenness generated and the surface which is thickened by the "rough grinding" are made fine, and "finished polishing" is provided for the final adjustment of the surface roughness. Further, the removal of the surface unevenness and the fine adjustment of the surface roughness at the end of the polishing in the reference, that is, the polishing means 2 may be provided in two. As described above, after determining the combination of the polishing means 2 having different abrasive grain sizes contained in the polishing tool 1 and the grinding roughness (roughness, towel, finishing), the grinding tool 10 is even "grinded by the workpiece." The grinding processing portion (the corner portion or the flat portion) of w is set to have the same rotation speed", and "the polishing transfer speed is different depending on the difference between the edge portion and the plane portion" by the south position detection means. (3) The processing conditions for the measurement of the "imported height at the start of polishing of the finished product" and the "cutting amount of the processed surface p of the workpiece W to be polished" are set to control 18 201114549 means 13 . After setting the processing conditions, the operator places the processing surface p of any one of the four corners of the workpiece W on the base 4 between the gripping portions 6A, 6B of the holding means 5 so as to be horizontally upward. The "setting switch of the 4th position (edge portion or plane portion) and the "grinding start switch" are set to "ON", and the polishing unit 1 is moved to the left end in the drawing, and the holding means 5 is not shown. When the cylinder is started, the gripping shaft 12A on the reference side is slid, and the grip portion 6A is advanced to the "reference end surface position" in the drawing to position the end surface of the workpiece W, and the gripping shaft 12B of the driven side is also slid to advance the grip portion 6B. The contact is pressed against the other end surface of the workpiece w, whereby the workpiece W is held by the holder. Next, the 'grinding unit 1 is transferred to the right side in the figure, and the height position detecting means 3 is activated to detect the height of the processing surface p of the workpiece w to be processed and send the signal to the control means 丨3 for arithmetic processing, and the grinding means is automatically set. 2, the polishing tool 丨〇 front end cuts the processed surface p of the workpiece w, and the polishing unit 1 is automatically set by the setting switch of the "grinding portion (edge portion or flat portion)" Transfered to the right side of the figure, the polishing means 2 is polished in the order of "rough grinding", "medium grinding", and "finish polishing". After the completion of the polishing process, there are two types of the semi-automatic type polishing apparatus according to the first aspect of the invention and the fully automatic type of the second invention. The semi-automatic type polishing apparatus according to the first aspect of the invention is configured to hold the workpiece to be polished. The holding shafts 12A, 12B of the holding means 5 of the both end faces of the holding means 5 are retracted to automatically release the gripping portions 6A, 6B holding the front end of the gripping portion 6 to the state of being held by the workpiece W by the operator manually placing the base 4 The aforementioned being ground, processing 201114549
物w，而能依序對各稜角部與各平面部之任—者之加工面p 14A，1 4B使之連續 後，自動研磨加工 之各面進行研磨加工、或藉由旋轉手段丨4 A 旋轉並同時進行該各稜角部之研磨加工後， 各平面部之加工面P之各面。 圖2(A)及圖2(B)，係顯示前述研磨手段2之研磨具1〇 所採用之研磨刷一例，將混合有磨粒之尼龍等合成樹脂所 構成之毛材綑束而作成研磨具1〇，將該研磨具1〇之基部拆 裝自如地安裝於連結於旋轉驅動源可水平旋轉之旋轉盤 U，下端接觸旋轉於被研磨加工物W之加工面p以進行研 磨，研磨具10磨耗後可將該研磨具10從旋轉盤丨丨拆卸， 並交換成新的研磨具10。此外，研磨手段2之研磨具10 所採用之研磨刷並不限於圖2所示者，亦可係將混合有未 圖示磨粒之毛材所構成之研磨具10直接安裝固定於旋轉盤 Π，並在該研磨具丨〇磨耗後連同旋轉盤u 一起更換者。 圖3係顯示基台4之一部分缺口之立體圖，該基台4 可將前述被研磨加工物W之棱角部或平面部之任一面作為 20 201114549 加工面载置成水平朝上，圖4係顯示立設於 狀承接構件7之製造過程 。之平板 不 < 說明圖，该承接構件7，拟士、士 在研磨前述被研磨加工物霉件7七成有 ,^ , 任一稜角部時以能將該—稜 角#載置成水平朝上之方彳 筏 n 方式載置其下側之平面部之缺口 (v)8、且於前述缺口（v) w . . ^ 形成有在研磨前述被研磨加工物 ., · +面邛時以能將該一平面部載置成水After the object w, the processing surfaces p 14A, 1 4B of the respective corner portions and the respective flat portions can be successively made, and then the surfaces of the automatic polishing processing are polished or rotated by means of rotation 丨 4 A After the grinding of the respective corner portions, the respective surfaces of the processed surfaces P of the flat portions are rotated. 2(A) and 2(B) show an example of a polishing brush used in the polishing tool 1 of the polishing apparatus 2, and a raw material composed of a synthetic resin such as nylon mixed with abrasive grains is bundled and ground. The base of the polishing tool is detachably attached to the rotary disk U that is horizontally rotatable by the rotary drive source, and the lower end is contacted and rotated by the machined surface p of the workpiece W to be polished. After 10 abrasion, the abrasive article 10 can be detached from the rotating disk and exchanged into a new abrasive article 10. Further, the polishing brush used in the polishing tool 10 of the polishing device 2 is not limited to that shown in Fig. 2, and the polishing tool 10 composed of a hair material mixed with abrasive grains (not shown) may be directly attached and fixed to the rotary disk. And after the grinding tool is worn, it is replaced together with the rotating disk u. 3 is a perspective view showing a part of the notch of the base 4, and the base 4 can mount any one of the corners or the flat portion of the workpiece W as a horizontally upward facing surface of the 201111549, and FIG. 4 shows It is erected in the manufacturing process of the shape receiving member 7. The flat plate is not <illustration, the receiving member 7, the sergeant, the shovel, the grinding of the workpieces 7 to 70, ^, any angular portion can be placed in the horizontal direction The upper side is placed on the notch (v) 8 of the lower surface portion, and the notch (v) w . . ^ is formed by grinding the workpiece, the surface, Can place the flat portion into water
平朝上之方式供其下側 K _ 稷角。Ρ所卡止之缺口（L)9。此外， p即菸:不之基口 4，雖顯示被研磨加工物w之加工面 八Η夂直部及平面部之兼用類型’但亦可係稜角部與平面部 分開之專用類型。 圖5(A)及圖5(B)係顯示被研磨加工物w之形狀為四角 =狀之—例之立體圖，目5(Α)係由㈣之原㈣切出作為 ^ 文用°Ρ為角形並形成微小之C面，圖5(B) 係由圓柱狀之原材料切出作為平面部之四自，且於該棱角 部留下原材料之圓柱狀-部分而形成為R面。 圖6(A)及（Β)係顯示將被研磨加工物（w)載置於基台4 上時從側面觀看之截面圖’ ® 6⑷係顯示研磨加工被研磨 加工物W之稜角部時將被研磨加工物w於基台4之承接構 件7載置成其加工面ρ朝上之狀態圖吵）係顯示研磨加 工被研磨加工物w之平面部時將被研磨加工物w於基台4 之承接構件7載置成其加工面p朝上之狀態。 以下所敘述之實施例中，被研磨加工物w為四角柱狀 之矽塊，使用本發明之研磨裝置研磨加工前述被研磨加工 物W之四平面部與四稜角部而除去存在於其表層部之微裂 痕與其表面之凹凸以將表面粗度微細化後，評估研磨效 21 201114549 果，在藉由線鑛將該石夕塊切片加工而形成矽晶圓時，能減 低該矽晶圓之裂痕、缺口等所導致之不良品之發生率。 實施例1 詳細說明作為前述被研磨加工物w之單結晶石夕塊之規 格如下，使用帶鋸或線鋸將截面為圓柱形狀所製造之單結 晶矽晶棒切斷成500mm之長度（L)，於其長度方向將圓柱壁 面之四面切斷除去而形成四平面部，且將該兩平面部所交 會之稜角部以殘留切斷前之圓柱壁面之一部分圓弧幅度（約 25mm)之方式作成R形狀之如圖5(B)所示之四角柱狀將 其大小切斷形成為（□ )125mmx 125mm、（L)500mm者。 於研磨加工刚之則述被研磨加工物W之積角部及平面 部之表層部存在有深度為8〇〜1〇〇 “ m之微裂痕且其表面粗 度為（Ry)9〜U # m，以線鋸對該矽塊進行切片加工而作成 矽晶圓時之裂痕、缺口等導致之不良品發生率為5〜6%。 關於在本實施例所用之研磨裝置使用前述第〖發明記 載之研磨裝置研磨加工作為前述被研磨加工物（w)之矽塊 並進行微裂痕及凹&之除去與表面粗度之微小化後，對該 夕鬼進行切片加工而形成矽晶圓時之裂痕、缺口等導致之 不良品發生率被減低之結果，敘述如下。 下表1係顯不為了選擇設定研磨手段2所採用之研磨 I之磨粒粒度而作成之「與研磨刷之磨粒之粒度對應之被 研磨加工物w之表面粗度（Ry)」之關係之參考資料。 22 201114549 【表1】 研磨刷之磨粒之粒度 被研磨加工物W之研磨後之 表面粗度：Ry( // m) # 240 2〜3 # 500 1〜2 # 800 0.5〜1.0 # 1,100 0.3 〜0.5 又，下表2係顯示為了設定使研磨手段2之研磨具10 前端從被研磨加工物W之加工面Ρ突出之切入量，而作成 之「與各研磨刷之磨粒粒度之切入量對應之、切斷矽晶棒 而形成矽塊之前步驟中因切斷手段之差異及切斷面之表面 完工步驟之有無而不同之被研磨加工物w之切銷量（// m)」 之關係之參考資料。 【表2】 研磨刷 因前步驟中之切斷手段差異而不同之切削t(um) 研磨之粒度 切入量 Cmm) 以帶戗切斷f+；7斷 面之表面完工/無） 以绫錤切»fto斷 面之表面完工/無） 切哳徕，以#8(10以卜. 研削切斷面 #240 0.3 30 30 30 0.5 50 50 40 0.8 70 70 50 1 100 100 80 1.2 130 130 100 #500 0.3 30 30 30 0.5 50 50 40 0.8 70 70 50 #800 0.3 30 30 30 0.5 50 50 40 0.8 70 70 50 #1100 0.5 50 50 40 0.8 70 70 50 23 201114549 作為研磨開始前之準 ^ , erL <半備事項，係如下所示：決定a)[研 磨手1又2之研磨粗度 # ^ —uw 選擇a又叱]後安裝於研磨單元1，執 仃b)[研磨手段2之各 具丨〇之基準高度之設定]並自動 輸入設定於控制手段13 便將C)〜e)之各加工條件手動輸 入設疋至控制手段丨3。 a) [研磨手段2之研磨如疮令、ge 所德粗度之選擇設定]:參考上述表1， 將研磨刷之磨粒之粒度選定 又遇疋袓研磨用：# 240'中研磨用： # 500、完工研磨用：# * 之二種類而連設作為研磨手段 2。 b) [研磨手段2之各研磨且 w保，、10之基準向度之設定]:將 研磨加工完成品之標準片 仵）載置於基台4，並以高度 位置檢測手段3測定該標m K # # & a a 铩羊片之稜角部及平面部之高度位 置’藉此將其測定結果作為研磨 熠于#又2之各研磨具1〇之研 磨開始前之基準高度自動設定於控制手段Η。 〇[研磨手段2之研磨具⑺之旋轉速度之設定]:15m/ sec d)[研磨手段2之研磨具1〇之研磨移送速度之設定]•(棱 角部之固定研磨）4麵八c、（平面部之研磨）2〇咖〆_。 、e)[研磨手段2之各研磨具1〇對加μ p之切入量之設 定]:參考上述表2,將前述選擇設定之各研磨刷對加工面： 之切入量，決定為粗研磨用（# 240): 〇 5_、中研磨用（# 50〇) ·· 〇.7_、完工研磨用（# ! 1〇〇) ·· 〇 8mm < 本發明中，在以同-研磨粗度之研磨手段2研磨種角 部與平面部之研磨加工時有種角部較平面部容易研磨之傾 24 201114549 向，其原因可知係取決於研磨部位之形狀差異。由上述可 知，係將前述設定之稜角部與平面部之C)[研磨手段2之研 磨具10之旋轉速度之設定](=15m/sec)設為同一速度，在 d)[研磨手段2之研磨具10之研磨移送速度之設定]中，將 平面部之研磨移送速度（20mm/ sec)設為正而將稜角部之 移送速度（40mm/ sec)設定為較快速，而設定成能縮短研磨 加工時間。 只要將c)[研磨手段2之研磨具10之旋轉速度之設定] 設定得較快’即能增大研磨力而縮短研磨加工時間，又， 只要將稜角部與平面部之旋轉速度設定成不同之旋轉速 度’即能進行稜角部與平面部之表面粗度調整。 只要將d)[研磨手段2之研麻 2之研麻具10之研磨移送速度The way to the upper side is for the lower side K _ corner. The gap (L) 9 that is locked. Further, p is a smoke: the base 4 is not shown, although the machined surface of the workpiece w is displayed, and the type of the straight portion and the flat portion of the machined portion is used, but it may be a special type in which the corner portion is separated from the flat portion. 5(A) and 5(B) are perspective views showing an example in which the shape of the workpiece w is a square=shape, and the head 5 (Α) is cut out from the original (4) of (4). The corner shape forms a minute C-face, and FIG. 5(B) is formed by a cylindrical material as a flat portion, and a columnar portion of the material is left at the corner portion to form an R-face. 6(A) and (Β) show a cross-sectional view of the workpiece (w) when viewed from the side when the workpiece (w) is placed on the base 4, and the arrow 6 is displayed when the edge of the workpiece W is polished. When the workpiece w is placed on the support member 7 of the base 4 so that the machined surface ρ faces upward, the workpiece is ground on the base 4 when the flat portion of the workpiece w is polished. The receiving member 7 is placed in a state in which the processing surface p faces upward. In the embodiment described below, the workpiece w is a square columnar block, and the four flat portions and the quadrangular corner portions of the workpiece W are polished by the polishing apparatus of the present invention to remove the surface portion. The micro-crack and the unevenness of the surface to refine the surface roughness, and evaluate the grinding effect 21 201114549. When the enamel wafer is sliced by wire ore to form a ruthenium wafer, the crack of the ruthenium wafer can be reduced. The incidence of defective products caused by gaps, etc. [Embodiment 1] The specification of the single crystal stone block as the workpiece to be polished w is as follows. The single crystal twin rod manufactured by cutting a cylindrical shape with a band saw or a wire saw is cut into a length of 500 mm (L). In the longitudinal direction, the four sides of the cylindrical wall surface are cut and removed to form a four-plane portion, and the edge portion where the two flat portions intersect is formed by a portion of the circular arc surface (about 25 mm) of the cylindrical wall surface before the cutting. The R shape is cut into a square shape as shown in Fig. 5(B) to form (□) 125 mm x 125 mm and (L) 500 mm. Immediately after the polishing process, the surface portion of the workpiece W and the surface portion of the flat portion have a depth of 8 〇 1 〇〇 m ” micro cracks and the surface roughness is (Ry) 9 〜 U # m, the occurrence rate of defective products caused by cracks, notches, and the like in the case of slicing the wafer by the wire saw is 5 to 6%. The polishing apparatus used in the present embodiment uses the aforementioned invention. The polishing apparatus grinds and processes the pulverized material (w), removes the micro-cracks, the concaves, and the surface roughness, and then slicing the granules to form the ruthenium wafer. The result of the reduction in the rate of occurrence of defective products due to cracks, nicks, etc. is as follows. Table 1 below shows the "grain of the abrasive brush" which is not selected for the abrasive grain size of the polishing I used for setting the polishing means 2. Reference material for the relationship between the particle size and the surface roughness (Ry) of the workpiece to be polished. 22 201114549 [Table 1] The grain size of the abrasive grains of the abrasive brush is the surface roughness after grinding of the workpiece W: Ry ( // m) # 240 2~3 # 500 1~2 # 800 0.5~1.0 # 1,100 0.3 ～0.5 Further, in Table 2 below, the amount of cut-in amount of the abrasive grain size of each polishing brush is set to set the amount of cutting of the tip end of the polishing tool 10 of the polishing device 2 from the machined surface of the workpiece W to be polished. Corresponding to the relationship between the cut sales volume (//m) of the workpiece w to be different due to the difference in the cutting means and the presence or absence of the surface finishing step of the cut surface in the step of cutting the twin rod to form the block Reference material. [Table 2] The grinding brush has different cutting t(um) due to the difference in the cutting method in the previous step. The cutting amount of the grinding is Cmm). The belt is cut by f+; the surface of the 7-section is finished/none) »Fof section surface finish / no) Cut 哳徕, to #8(10以卜. Grinding cut surface #240 0.3 30 30 30 0.5 50 50 40 0.8 70 70 50 1 100 100 80 1.2 130 130 100 #500 0.3 30 30 30 0.5 50 50 40 0.8 70 70 50 #800 0.3 30 30 30 0.5 50 50 40 0.8 70 70 50 #1100 0.5 50 50 40 0.8 70 70 50 23 201114549 As the pre-grinding start ^ , erL < half The items are as follows: Decide a) [Grinding Hand 1 and 2 Grinding Thickness # ^ - uw Select a and then 安装] and attach it to the grinding unit 1, and b) [the various means of the grinding means 2 The setting of the reference height is automatically set to the control means 13, and the machining conditions of C) to e) are manually input to the control means 丨3. a) [Grinding of grinding means 2 such as sore, ge decree selection]: Refer to Table 1 above, select the particle size of the abrasive grain of the abrasive brush and use it for grinding: #240' for grinding: #500, Finishing grinding: # * The second type is connected as the grinding means 2. b) [The polishing of each of the polishing means 2 and the setting of the reference dimension of 10]: The standard piece of the finished product of the polishing process is placed on the base 4, and the target is measured by the height position detecting means 3. m K # # & aa The height position of the edge and the flat portion of the 铩 片 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Means. 〇 [Setting of the rotation speed of the polishing tool (7) of the polishing means 2]: 15 m / sec d) [Setting of the polishing transfer speed of the polishing tool 1 of the polishing means 2] • (fixed polishing of the corner portion) 4 sides and eight c, (grinding of the plane) 2 〇 curry _. (e) [Setting of the amount of cut of each of the polishing tools 1 to the μ p of the polishing means 2]: Refer to Table 2 above, and determine the amount of cut of each of the polishing brushes to the machined surface selected as the rough grinding. (#240): 〇5_, medium grinding (# 50〇) ··〇.7_, finishing polishing (# ! 1〇〇) ··〇8mm < In the present invention, the same-grinding thickness When the polishing means 2 grinds the corner portion and the flat portion, there is a tendency that the corner portion is easier to be polished than the flat portion. The reason is that the shape of the polishing portion depends on the difference in the shape of the polishing portion. As described above, it is known that the angular portion of the setting and the plane of the plane C) [setting of the rotational speed of the polishing tool 10 of the polishing means 2] (= 15 m/sec) are the same speed, and d) [the polishing means 2 In the setting of the polishing transfer speed of the polishing tool 10, the polishing transfer speed (20 mm/sec) of the flat portion is set to be positive, and the transfer speed (40 mm/sec) of the angular portion is set to be fast, and the polishing can be shortened. Processing time. If c) [setting of the rotational speed of the polishing tool 10 of the polishing means 2 is set to be faster", the polishing force can be increased to shorten the polishing processing time, and the rotational speed of the angular portion and the planar portion can be set to be different. The rotation speed 'is able to adjust the surface roughness of the corner portion and the flat portion. As long as d) [grinding means 2 of the grinding 2
25 201114549 (平均：24分40务I、、 /)’ 一面之研磨量（=深度）為各稜角部1〇8 Am 〜I26em(平均：11〇 " 9 A m)'各平面部98 # m〜1 1 〇 # m(平 均：104 e m)、微裂痕最 之敢大冰度為表面粗度為稜 p Ry〇.7 1.G(平均：RyG 8)、平面部RyQ 8〜^ (平均：25 201114549 (Average: 24 minutes 40 I, , /)' The grinding amount (=depth) of one side is 1 〇 8 Am ~ I26em (average: 11 〇 " 9 A m) of each angular portion 98 # m~1 1 〇# m (average: 104 em), the most cracking of the micro-crack is the surface roughness as the edge p Ry〇.7 1.G (average: RyG 8), plane part RyQ 8~^ ( average:
RyO.9)，能除去微裂痕及凹凸且使表面粗度微小化，將該三 個石夕塊均以線錯進行切片加工並作成石夕晶圓後調查因其 裂痕、缺口等導^ 导致之不良品之發生率之結果顯示，可將其 發生率減低至丨.〇%。 ’、 此外’存在有前述微裂痕之最大深度（1.6// m)之部位， 係圖7所示之「稜角部與平面部之接合部位」，存在於其 他稜角部或平面部之微裂痕之深度均為0.7〜丨.〇"m。由此 可判斷，將各稜角部與各平面部之加工面 手段，係難以進行如圓7之斜線部所示之 P依各面研磨之 「稜角部與平面 部之接合部位」之研磨加工 又，在裂痕之最大深度為2.3 # m之範圍中，對切片加 成數十mm之尽度而作成石夕晶圓時之裂痕、缺口等所導致 不良品之發生率之影響較少，此點亦已查明。可知以往係 因微裂痕之深度為「3·〇# m以上」而使前述不良品之發生 率增大。 實施例2 以下說明被研磨加工物W使用與前述實施例1相同之 矽塊，研磨裝置使用前述第2發明之研磨裝置，使旋轉手 段1 4A，1 4B連續旋轉而使被研磨加工物w .—邊以挾持軸 1 2A，1 2B之軸心為中心旋轉一邊同時進行四複角部之研磨 加工後，使旋轉手段14A，14B旋轉既定角度（本實施例中為 26 201114549 「90度」）而依各面研磨加工四平面部之 裂痕之殘存狀況與表面粗度 ά塊中微RyO.9), which can remove micro-cracks and irregularities and miniaturize the surface roughness. The three stone blocks are sliced by line error and made into a Shixi wafer, which is investigated due to cracks, gaps, etc. The results of the incidence of defective products show that the incidence can be reduced to 丨.〇%. ', in addition, there is a portion where the maximum depth (1.6//m) of the micro-crack is present, and the "joining portion of the corner portion and the flat portion" shown in Fig. 7 exists in the micro-cracks of other corner portions or plane portions. The depth is 0.7~丨.〇"m. Therefore, it can be judged that it is difficult to perform the grinding process of the "joining portion of the edge portion and the flat portion" of the P surface-polished as shown by the oblique portion of the circle 7 in the processing surface means of each of the corner portions and the respective flat portions. In the range of the maximum depth of the crack of 2.3 # m, the effect of the occurrence of defective products caused by cracks, gaps, etc., which are formed when the chips are added to the thickness of tens of mm, is less. It has also been identified. In the past, it has been found that the depth of the microcracks is "3·〇# m or more", and the incidence of the defective product is increased. [Embodiment 2] Hereinafter, the same workpiece as that of the first embodiment will be used for the workpiece W, and the polishing apparatus will use the polishing apparatus according to the second aspect of the invention to continuously rotate the rotating means 14A, 14B to grind the workpiece w. - The grinding means 14A, 14B are rotated by a predetermined angle while rotating the four complex corners while rotating around the axis of the holding shafts 1 2A, 1 2B (in this embodiment, 26 201114549 "90 degrees") The residual condition and surface roughness of the cracks in the four planes of the surface are polished in each plane.
久網5亥矽塊切μ A 成矽晶圓時之裂痕、缺口等導致之不良品…作 結果。 αο务生率被減低之 作為研磨開始前之準備事項，係將a)[研磨仔 磨粗度之選擇設定;I、b)[研磨手段 又 ^ Λ <谷研磨具ίο之基準 :度之設定]、c)[研磨手段2之研磨具1〇之旋轉速度之， 乂、e)[研磨手段2之各研磨具1〇對加工面p之切入量： 設定m前述實施例i所設定條件同樣地設定後，將⑴[研磨 手段2之研磨具1〇之研磨移送速度之設定]:(棱角部 磨）旋轉研磨之2mm/ sec、（平面部之研磨）20 mm/ sec與新 的轉手段14A，14B之旋轉條件之設定]:(棱角部之研 磨）連續研磨之⑽論叫、（平面部之研磨）角度旋轉々Ο 度手動輸入設定至控制手段1 3。 如刖所述結束準備事項之設定，將被研磨加工物w之 稜角部或平面部之任一面於挾持手段5之把持部6八，⑽間 之基台4上載置成水平朝上後’即將控制手段13之研磨開 始開關切成「ON」而開始研磨加卫，夾持手段5之挟持轴 12A，12B即前進而在把持部6A，6B挾持被研磨加工物w之 兩端面之狀態下使前述基台4下降後，旋轉手段14八，ΐ4β 使則述被研磨加工物W以i 〇5min 一丨之速度連續旋轉而同 時進行四稜角部之研磨加工。在稜角部之研磨結束後，前 述旋轉手段14A，14B使被研磨加工物w旋轉9〇度，依各 平面。卩DX疋成朝上依序研磨加工，而與前述實施例1同樣 地研磨加工三個矽塊。 27 201114549 其、果，亦包含被研磨加工物w之設置時間在内之一 個矽塊之研磨加工所需研磨時間為27分46秒〜27分57秒 (平均27刀51秒），一面之研磨量（=深度）為各稜角部 # m〜134# m(平均：127々m) '各平面部爪〜夏 m(平均：1〇6㈣、微裂痕之最大深度為〇 9”、表面粗度 為稜角部Ry0.5〜〇_8(平均·· Ry〇 7)、平面部Ry〇 7〜丨叫平 均：Ry0.9) ’能除去微裂痕及凹凸且使表面粗度微小化，將 該三個钱均以線料行切片加卫並作切晶圓後，調查 因其裂痕、缺口等導致之不良品之發生率之結果顯示，可 將其發生率減低至1.8 %。 又，存在於「圖7之斜線部所示之棱角部與平面部之 接合部位」之微裂痕之最大深度’相較於在前述實施例1 為UP(最大深度），在本實施例能減少至〇8心。此係 藉由以旋轉手U4A，14B使前述被研磨加卫物^續旋轉 ::時研磨加工四稜角部’藉以研磨目7之斜 處並加以除去。 心 除此以外之實施例 將含有磨粒之 手段2底部。 2底部之外周 尼龍等之合成樹 則述毛材之植設 且大致平行地植 亦可不使用研磨具1 〇， 脂所構成之毛材植設於研磨 可為環狀，亦即沿研磨手段 設0 例如在陶曼等之研磨加工或加工時研 呈大致90。之柱狀體之角部之情形等，因研磨具妾觸於 磨加工物w之接觸產生缺口（ehlpping):具2與被研 下，亦可使含有磨粒之合成樹脂所構 隹::題之情形 减維狀彈性體彼 28 201114549 此纏合，並將該彈性體植設於研磨手段底部。此情形下， 可適當選擇該彈性體彼此纏合、且可保持接觸於被加工物 時不會折斷程度之彈力之合成樹脂種類及磨粒之含有率。 在不需要「粗」今「細」之多段加工，僅一階段之加工 即可取得所要求之表面之情形下（例如被研磨加工物w表面 之微裂痕係微小且表面粗度相較於要求值不具有大差異 時’即僅以「細」進行加工），植設於彼此連接之2個以上 研磨手段2之毛材（或彈性體）所含有之磨粒之粒度，所有研 磨手段亦可均大致相同。 例如’亦可設置複數個研磨手段2，以能同時加工如上 面及相鄰於上面之稜角部之類之不同面。又，該情形下， 亦可對為了加工各面而設置之研磨手段2連接複數個研磨 手段2。 如以上所述，本實施例係根據矽塊之研削方法作了說 明’但本發明並不限定於矽塊，亦可非常合適地用於例如 陶瓷等所有硬脆材料。 【圖式簡單說明】 圖1係顯示本發明之研磨裝置整體之前視圖。 圖2係顯示將研磨刷採用於本發明之研磨手段之研磨 具一例之圖’圖2(A)係從其正面觀看時之一部分缺口截面 圖’圖2(B)係仰視圖。 圖3係本發明之基台之一部分缺口立體圖。 圖4係顯示安裝於前述圖3之基台之承接構件之製造 過程之說明圖。 29 201114549 圖5係顯示本發明$ ^，& ^月之七狀為四角柱狀之被研磨加工 之立體® 1 5⑷係顯示稜角部為微小c&之被研磨加工 物’圖5(B)係顯示稜角部為R面之被研磨加工物。 圖6係顯示將圖R、邮_ 册圆5(B)所不之棱角部為R面之被研磨加 工物載置於本發明之其么夕处& 基σ之狀態之截面圖，圖6(A)係顯示 加工面為稜角部者，圖6(Β)係顯示加工面為平面部者。 圖7係前述圖5(B)所示之稜角部為R面之被研磨加工 物之該稜角部與平面部之接合部位之放大圖。 【主要元件符號說明】 1 研磨單元 2 研磨手段 3 高度位置檢測手段 4 基台 5 挾持手段 6A 把持部（基準位置側） 6B 把持部（從動側） 7 承接構件 8 缺口 V 9 缺口 L 10 研磨具 11 旋轉盤 12A 挾持軸（基準位置側） 12B 挾持軸（從動側） 13 控制手段 30 201114549 14A 旋轉手段（基準位置側） 14B 旋轉手段（從動側） W 被研磨加工物 P 加工面 31Jiuwang 5 矽 矽 切 μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ Αο The activity rate is reduced as a preparation before the start of the grinding, which is a) [setting of the grinding grindstone thickness; I, b) [grinding means ^ Λ < valley grindstone ίο benchmark: degree Setting], c) [Rotating speed of the polishing tool 1 of the polishing means 2, 乂, e) [Incision amount of each polishing tool 1 of the polishing means 2 to the machined surface p: setting m The condition set in the above Example i After setting in the same manner, (1) [Setting of the polishing transfer speed of the polishing tool 1): 2 mm/sec (edge grinding) 20 mm/sec and new rotation Setting of the rotation conditions of the means 14A, 14B]: (grinding of the edge portion) Continuous grinding (10) Theory, (grinding of the flat portion) The angle of rotation is manually set to the control means 13. In the setting of the finishing preparation, any one of the edge portion or the flat portion of the workpiece w is placed on the holding portion 6 of the holding means 5, and the base 4 between the (10) is placed horizontally upwards. When the polishing start switch of the control means 13 is cut "ON", the polishing is started, and the holding shafts 12A, 12B of the holding means 5 advance, and the holding portions 6A, 6B are held by the both ends of the workpiece w. After the lower stage 4 is lowered, the rotating means 14 and ΐ4β continuously rotate the workpiece W at a speed of i 〇5 min, and simultaneously perform the polishing process of the square corner portion. After the polishing of the corner portions is completed, the above-described rotating means 14A, 14B rotate the workpiece w by 9 degrees, depending on the plane. The crucible DX was subjected to sequential grinding processing, and three crucible blocks were ground in the same manner as in the above-described first embodiment. 27 201114549 The grinding time required for the grinding of a block including the setting time of the workpiece w is 27 minutes 46 seconds to 27 minutes 57 seconds (average 27 knives 51 seconds), one side of the grinding The amount (=depth) is the angular portion #m~134# m (average: 127々m) 'Each flat claws~summer m (average: 1〇6 (four), the maximum depth of micro-cracks is 〇9”, surface roughness It is an angular portion Ry0.5 to 〇8 (average Ry〇7), and a flat portion Ry〇7 to 丨 mean: Ry0.9) 'The micro cracks and irregularities can be removed and the surface roughness can be miniaturized. After the three pieces of money were sliced and lined up and cut into wafers, the results of investigation of the occurrence of defective products due to cracks and gaps showed that the incidence could be reduced to 1.8%. The maximum depth of the microcracks of the joint portion between the corner portion and the flat portion shown by the hatched portion in Fig. 7 is UP (maximum depth) as in the first embodiment, and can be reduced to 〇8 in the present embodiment. . This is done by rotating the hand of the object to be polished by rotating the hand U4A, 14B to remove the edge of the object 7 by grinding and removing it. The embodiment other than this will contain the bottom of the means 2 of the abrasive particles. 2 The synthetic tree of the outer peripheral nylon or the like is described as the planting of the hair material and the planting of the material is substantially parallel. The grinding material 1 is not used, and the hair material composed of the fat is planted in the grinding to be ring-shaped, that is, it is set along the grinding means. 0 For example, in the polishing or processing of Tauman, etc., it is approximately 90. In the case of the corner portion of the columnar body, the ehlpping is caused by the contact of the polishing tool with the abrasive workpiece w: the material 2 is ground and the synthetic resin containing the abrasive grains can be constructed: The situation of the dimension reduction elastic body 28 201114549 This entanglement, and the elastic body is planted at the bottom of the grinding means. In this case, it is possible to appropriately select the type of the synthetic resin and the content of the abrasive grains in which the elastic bodies are entangled with each other and the elastic force is not broken when they are in contact with the workpiece. In the case where the "thick" and "fine" multi-stage processing is not required, only the first stage of processing can obtain the desired surface (for example, the micro-cracks on the surface of the workpiece w are small and the surface roughness is higher than the requirements. When the value does not have a large difference, that is, it is processed only by "fine", and the particle size of the abrasive grains contained in the hair material (or elastomer) of the two or more polishing means 2 connected to each other may be used. Both are roughly the same. For example, a plurality of polishing means 2 may be provided to simultaneously process different faces such as the above-mentioned faces and adjacent corners. Further, in this case, a plurality of polishing means 2 may be connected to the polishing means 2 provided for processing each surface. As described above, the present embodiment has been described based on the grinding method of the block. However, the present invention is not limited to the block, and can be suitably used for all hard and brittle materials such as ceramics. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing the entire polishing apparatus of the present invention. Fig. 2 is a view showing an example of a polishing tool using the polishing brush in the polishing method of the present invention. Fig. 2(A) is a partially cutaway cross-sectional view taken from the front side thereof. Fig. 2(B) is a bottom view. Figure 3 is a partially broken perspective view of a base of the present invention. Fig. 4 is an explanatory view showing a manufacturing process of a receiving member attached to the base of Fig. 3; 29 201114549 Fig. 5 shows the three-dimensionally polished three-dimensional column of the invention of $ ^, & ^ month of the present invention. 1 5 (4) shows the sharp-edged portion of the sharp c& 'Fig. 5(B) A workpiece to be polished having an edge portion as an R surface is displayed. Fig. 6 is a cross-sectional view showing a state in which the object to be polished in which the edge portion of the letter R and the mark 5 (B) is the R surface is placed at the point of the present invention & 6(A) shows that the machined surface is an angular portion, and Fig. 6 (Β) shows that the machined surface is a flat portion. Fig. 7 is an enlarged view showing a joint portion between the corner portion and the flat portion of the workpiece to be polished on the R surface as shown in Fig. 5(B). [Main component symbol description] 1 Polishing unit 2 Polishing means 3 Height position detecting means 4 Base 5 Holding means 6A Holding part (reference position side) 6B Holding part (driven side) 7 Receiving member 8 Notch V 9 Notch L 10 Grinding 11 rotating disk 12A holding axis (reference position side) 12B holding axis (driven side) 13 Control means 30 201114549 14A Rotating means (reference position side) 14B Rotating means (driven side) W Grinding material P Processing surface 31