201103416 六、發明說明： 【發明所屬之技術領域】 尤其是一種可供同時 本發明係關於一種散熱模組 連接數種熱源的散熱模組。 【先前技術】 現今各式電子產品於實際運作過程中，容易產生各 種熱源，因此，為使電子產品可正常運作，通常會於熱源 之預定部位結合散熱模組，以避免電子產品因過熱而損' «° 、、 ' 請參照第1圖所示，如中華民國第M358217號「風 扇固定架」專利案，係揭示第一種習知散熱模組7，該散 熱模組7包含一散熱鰭片組71、數個熱導管72及一風扇 73。該散熱鰭片組71具有複數散熱鰭片711;該數個熱 導管72插設於該複數散熱鰭片711，以加速熱傳導效 果；該風扇73結合於該散熱鰭片組71之一端。藉此，該 散熱鰭片祖71可結合於電子產品之一熱源（如中央處瑝 單元、主機板、各種電子晶片或發光模組等），以利用該 散熱鰭片組71及該熱導管72傳導該熱源所產生的高熱， 並配合該風扇73導引氣流對該散熱鰭片組71強制進行散 熱，使該電子產品可正常運作。 然而，前述第一種習知散熱模組7在實際使用時， 仍具有如下所述之諸多問題： 1、不易安裝於電子產品：由於該散熱鰭片組71係 結合於該風扇73之一侧端，因此，兩者相互結合後所構 201103416 成的該散熱模組7之_及軸向高度並不細減；當電子 產品之熱源周遭可供該散熱模組7組裝空間相當耆限時， 則容易造成該散^^模組7在組裝上受到限制，甚裏無法順 利完成安裝作業。 2、 使用上容易受限：該習知散熱模組7必須透過 冑__纽71正確地結合於絲狀縣彡卩位，方 可提供預疋之政熱效果，故造成目前市面上常見之相同類 型的散熱模組7，基本上皆僅適用於結合單一熱游，而較 # +適用於同時結合各種不同熱源，因此，t知散熱模組7 在實際使用上亦受到相當大的限制。 3、 組裝便利性不佳：該習知散減組.7欲進行散 熱時，仍必須先將該散熱鰭片組71與該風扇73相互組裝 結合後’方可針對該電子產品之熱源進行散熱，因此，在 組裝使用上相當不便。 4、 結構複雜：該習知散熱模組7之構件繁多且結 # 構組成亦相當複雜，導致製造成本偏高，並相對造成該習 知散熱模組7不易設計成更為輕薄短小化，因此，無法應 用於微型化之電子產品。 ,5、散熱效果不佳：該習知散熱模组7之風扇73在 導引氣流進人該散熱則組71的各散熱鰭片 7Π之間 時，氣流容易立即自該散熱韓片組71之相對兩侧散發至 外界空間’故熱傳導效果相當有限，且亦容易形成擾流現 象，因此，習知散熱模組7之散熱效果不佳。 請參照第2圖所示’如中華民國第應皿3號「運 用於散熱器的散熱風扇」專利案，係揭示第二種習知散熱 201103416 模組8，該散熱模組8包含一中空匣座81，該中空匣座 81内部形成一風道811，並設有連通該風道811的一進風 口 812及一出風口 813 ;另外，該中空匣座81之風道811 内設有一扇輪82，該扇輪82對位該進風口 812 ;再者， 該中空E座81内部及外部分別形成數個散熱鰭# 83，其 中形成於該中空g座81内部的數個散熱鰭片83係位於該 出風口 813。藉此，該中空£座81可結合於電子產品之 一熱源’且利用該扇輪82自該進風口 812導入氣流通過 該中空ϋ座81内部的數個散熱則83，並經由該出風口 813將該熱源所產生的高熱排散至外界空間，以提供一散 熱作用。 然而，前述第二種習知散熱模組8係省略如第一種 習知散熱模組7之散熱鰭片組71，並直接於該中空^座 81之預定部位成型數個散熱鰭片83。惟該第二種習知散 讎組8之中空匡座81外部仍具有散熱則83，導致體 積仍無法有效縮小且結構較為·，#電子產品之熱源周 遭可供組裝該散熱模組8的空財限時，亦會造成該散熱 模組8在組裝上受到限制；再者，該習知散熱模組8仍車交 不適用於同時結合各種不同熱源，且該f知散熱模組 組裝便利性亦不佳。 另外’該第二種習知散熱模組8之中空£座81内部 所形成之數個散熱鰭片83係位於該出風口 813位置，^ 該扇輪82導引氣流進入該風道811後，氣流容易立即^ 過該中空ϋ座81内部所形成之散熱鰭片83而散發至外界 空間’其熱傳導效果相當有限，因此，習知散熱模組8之 201103416 散熱效果仍有待改善。201103416 VI. Description of the Invention: [Technical Field of the Invention] In particular, the present invention relates to a heat dissipation module in which a heat dissipation module is connected to several heat sources. [Prior Art] Nowadays, various electronic products are prone to generate various heat sources in the actual operation process. Therefore, in order to make the electronic products operate normally, the heat dissipation module is usually combined with the heat source to prevent the electronic products from being damaged due to overheating. '°,, ' Please refer to Figure 1, for example, the "Fixed Mount" patent case of the Republic of China No. M358217, which discloses a first conventional heat dissipation module 7, which includes a heat sink fin Group 71, a plurality of heat pipes 72 and a fan 73. The heat dissipation fin group 71 has a plurality of heat dissipation fins 711; the plurality of heat dissipation tubes 72 are inserted into the plurality of heat dissipation fins 711 to accelerate the heat conduction effect; and the fan 73 is coupled to one end of the heat dissipation fin group 71. Therefore, the heat sink fins 71 can be combined with a heat source of the electronic product (such as a central unit, a motherboard, various electronic chips or a light emitting module, etc.) to utilize the heat sink fin set 71 and the heat pipe 72. The high heat generated by the heat source is conducted, and the fan 73 is guided to guide the airflow to forcibly dissipate heat from the heat dissipation fin group 71, so that the electronic product can operate normally. However, the first conventional heat dissipation module 7 still has the following problems in practical use: 1. It is not easy to be mounted on an electronic product: since the heat dissipation fin group 71 is coupled to one side of the fan 73 Therefore, the _ and the axial height of the heat dissipation module 7 formed by the combination of the two are not reduced; when the heat source of the electronic product is available for the assembly space of the heat dissipation module 7 is limited, It is easy to cause the disassembly module 7 to be limited in assembly, and the installation work cannot be completed smoothly. 2, the use is easy to be limited: the conventional heat-dissipation module 7 must be correctly integrated into the silky county by the 胄__ New 71, in order to provide the pre-warming political effect, which is currently common in the market The same type of heat dissipation module 7 is basically only suitable for combining a single hot tour, and #+ is suitable for combining various heat sources at the same time. Therefore, the heat dissipation module 7 is also considerably limited in practical use. 3. Poor assembly convenience: The conventional dust reduction group. 7 In order to dissipate heat, the heat dissipation fin group 71 and the fan 73 must be assembled and combined with each other before the heat source of the electronic product can be dissipated. Therefore, it is quite inconvenient in assembly and use. 4, the structure is complicated: the conventional heat dissipating module 7 has a large number of components and the composition of the structure is also quite complicated, resulting in high manufacturing cost, and relatively disadvantageously, the conventional heat dissipating module 7 is not designed to be lighter, thinner and shorter. Cannot be applied to miniaturized electronic products. 5, the heat dissipation effect is not good: the fan 73 of the conventional heat dissipation module 7 is easy to immediately flow from the heat dissipation fin group 71 when the airflow enters the heat dissipation between the heat dissipation fins 7 of the group 71. The opposite sides are radiated to the external space. Therefore, the heat conduction effect is quite limited, and the phenomenon of the spoiler is also easily formed. Therefore, the heat dissipation effect of the conventional heat dissipation module 7 is not good. Please refer to the patent case of "Relay Fan for Radiator in the Republic of China", as shown in Figure 2, which discloses a second known heat dissipation 201103416 module 8, which contains a hollow 匣a seat 81, a hollow duct 811 is formed in the hollow sill 81, and an air inlet 812 and an air outlet 813 are connected to the air duct 811. In addition, a fan wheel is disposed in the air duct 811 of the hollow sill 81. 82. The fan wheel 82 is aligned with the air inlet 812. Further, a plurality of heat dissipation fins #83 are formed inside and outside the hollow E-seat 81, and a plurality of heat dissipation fins 83 formed inside the hollow g-seat 81 are formed. Located at the air outlet 813. Thereby, the hollow seat 81 can be coupled to one of the heat sources of the electronic product, and the fan wheel 82 is used to introduce airflow from the air inlet 812 through the plurality of heat dissipation portions 83 inside the hollow socket 81, and through the air outlet 813. The high heat generated by the heat source is discharged to the outside space to provide a heat dissipation effect. However, the second conventional heat dissipation module 8 omits the heat dissipation fin set 71 of the first conventional heat dissipation module 7, and forms a plurality of heat dissipation fins 83 directly at predetermined portions of the hollow socket 81. However, the outer portion of the hollow sill 81 of the second conventional sputum group 8 still has a heat dissipation of 83, so that the volume cannot be effectively reduced and the structure is relatively large, and the heat source of the electronic product can be used to assemble the heat dissipation module 8 In the case of the financial limit, the heat dissipation module 8 is also limited in assembly. Moreover, the conventional heat dissipation module 8 is still not suitable for combining various heat sources at the same time, and the assembly of the heat dissipation module is also convenient. Not good. In addition, a plurality of heat dissipation fins 83 formed inside the hollow seat 81 of the second conventional heat dissipation module 8 are located at the air outlet 813, and the fan wheel 82 guides the airflow into the air passage 811. The airflow is easily passed through the heat dissipation fins 83 formed inside the hollow socket 81 and is radiated to the external space. The heat conduction effect is rather limited. Therefore, the heat dissipation effect of the conventional heat dissipation module 8 of 201103416 still needs to be improved.
5月參照第3圖所示，如中華民國第M335723號「可 防塵之風扇散熱|置」專利案，係揭示第三種習知散熱模 組9 ’該政熱核組9包含〜風扇裝置％、―防塵滤網92 及一導流殼體93。賴扇91設置於該導流殼體93 内’該導流殼體93包含-空氣導人口 931及氣導出 =932 ’該風扇裝置91之―進風卩（並標示）對位該空 氣導入口 931 ’該風扇裝置91之〆出風口（並標示）對 位該空氣導出π 932 ’並於料流殼體93之空氣導出口 932没有=熱‘鰭片94，該防塵細92結合於該空氣導入 口 931。藉此’該導流殼體％可結合於電子產品之一熱 源’且利用該風扇裝置91導引氣流依序通過該空氣導入 口 931進風口、出風口、敷熱籍片％及空氣導出口 932，以提供一散熱作用。 然而，前述第三種習知散熱模組9係省略如第一種 習知散熱模組7之散71，並僅於該 内部成型散熱鰭片94。惟該第^成筱 ^ ^ ^ ^ , 卑一種S知散熱模組9係將 該風扇裝置91另伽錄轉祕體93 _，因此，仍 具有體積不易縮小、結構_及組袭不便等諸多缺點，五 該習知散熱模組9同樣較不適祕同時結合各種不同勒 源。再者，該第三種習知散熱模組9與前述第二種習知影 熱模組8相類似，亦即該導流殼體93内部所形成之散索 縛片94係位於該空氣導出口 932位置，因此，習知散索 模組9所能提供的散熱效果仍相當有限。 * 201103416 【發明内容】 本發明目的乃改良上述各種習知散熱模組之缺點， 以提供一種散熱模組，使該散熱模組無須佔據電子產品過 多空間即可完成組裝者。 扣 、本發明次一目的係提供一種散熱模組，該散熱模組 可適用於同時結合各種不同熱源者。 本發明再一目的係提供一種散熱模組，該散熱模組 具有更佳之組裝便利性者。 本發明又-目的係提供一種散熱模組，該散熱模組 可有效降低結構複雜度者。 本發明另一目的係提供一種散熱模組.，該散熱模組 可提供較佳之散熱效果者。 根據本發明散熱模組，係包含一扇框、一定子、一 ^輪及數排散熱則。該扇框具有—底板，該底板周緣結 :::鳩：該侧牆設有至少一導熱部，且該側牆圍繞形成 谷至’並設有連通該容室的—人風σ及—出風口 ；該定 子結合於該扇框之容室内；該扇輪結合該定子；該數排散 熱鰭片設於該㈣之至少-導熱部且位於該容室内。 根據本發明散熱模組，係包含一扇框、一定子、一 扇輪、-上蓋及數排散熱鰭片。該扇框具有—底板，該底 =周緣結合—側牆，該侧牆圍繞形成—容室，且該侧踏設 有連，該容室的-人風σ及—出風口；該定子結合於該扇 匡之今至内，該扇輪結合該定子；虹蓋結合於該扇框之 j口’該上蓋設有與該入風口相對的一進風孔，且該上 盖設有至少—導熱部；該數排散熱鳍片設於該上蓋之至少 201103416 一導熱部且位於該容室内。 根據本發明散熱模組，係包含一扇框、一定子、一 扇輪及數排散熱鰭片。該扇框具有一底板，該底板周緣結 合一側牆’該側牆圍繞形成一容室，且該侧牆設有連通該 容室的一入風口及一出風口，另於該底板設有至少一導熱 部；該定子結合於該扇框之容室内；該扇輪結合該定子； 該數個散熱鰭片設於該底板之至少一導熱部且位於該容室 内。 【實施方式】 為讓本發明之上述及其他目的、特徵及優點能更明 顯易懂，下文特舉本發明之較佳實施例’並配合所附圖 式，作詳細說明如下： 請參照第4圖所示，本發明第一實施例之散熱模組1 係包含一扇框11、一定子12、一扇輪13及數排散熱鰭片 14。該扇框11較佳可為鼓風式扇框；該定子12結合於該 扇框11内部；該扇輪13可旋轉地結合該定子12 ;該數 排散熱鰭片14設於該扇框u之内侧面的預定導熱位置。 藉此，該扇框11與該數排散熱鰭片14相對之外側面可供 結合各種不同熱源，以供應用於各式電子產品，並提供 佳之散熱功能。 八 該扇框11具有一底板ηι，該底板ηι周緣結合一 側牆112，該侧牆112設有至少—導熱部113，其中該至 少一導熱部113係指該側牆112具有熱傳導功能之部^， 可集中於該側牆112之某-特定區域，亦可分散於該側牆 201103416 112之數個不同區域；該侧牆112另圍繞形成一容室114 且該側牆112設有連通該容室114的一入風口 115及一 ^風口 116。另外，本實施例之扇框u較佳可依據該側 月回U2之結構空間型態、導熱部113之數量及分佈區域的 不同，而大致區分為如下所述之數種實施方式： 其―、如第4及5圖所示，該侧牆112係由數片侧板 U2a、112b、112c所構成，該數片側板112a、mb、mc 可為一體成型設計或為可拆裝之設計；如圖所示之實施例 ，係揭示其中相對之二侧板㈣、mc自該底板⑴周 緣體延伸所形成，另一侧板U2a則可以卡接、焊接或 黏合等方式與該二侧板112b、n2C及底板m相互固定 。另外，該數片侧板112a、112b、112c圍繞形成該容室 114 ’其中一侧板i12a設有該導熱部113。 其二、如第6圖所示，該侧牆112係由數片側板 112d、112e、112f所構成；如圖所示之實施例，係揭示該 數片侧板112d、112e、112f皆自該底板in周緣一體延 伸所形成（亦可依實際需求為可拆裝之設計），而該數片 侧板112d、112e、112彼此相互連接。另外，該數片侧板 112d、112e、112f圍繞形成該容室114，且該數片侧板 112d、112e、112f各設有該導熱部us。 其三、如第7圖所示，該侧牆112係為一半環片 112g，該半環片112g自該底板lu周緣一體延伸所形成 (亦可依實際需求為可拆農之設計）。另外，該半環片 11¾圍繞職該容室1M ’且料環# 112g設有該導熱 部 113。 201103416 更詳《之’上述僅揭示數個實施方式，其他 之實化方式，如為相同概念且為該技術領域巾具有通 識者可=期者，仍應涵蓋於本發明散__範圍内。。 該疋子12結合於該扇框u之容室114，該定子 較佳可包含如線圈組、驅動電路或軸座等構件（未押示 其中該軸座亦可選擇結合該扇框11);藉此，該定^ 可供該扇輪13可旋轉地結合，並能夠控伽扇輪丨 作動。 轉In May, as shown in Figure 3, for example, the Republic of China No. M335723 "Dust-proof fan cooling | set" patent case, reveals the third conventional heat-dissipation module 9 'The political thermonuclear group 9 contains ~ fan device% , a dust filter 92 and a flow guiding housing 93. The fan 91 is disposed in the flow guiding housing 93. The guiding housing 93 includes an air guiding population 931 and a gas outlet 932. The air inlet (and indicating) of the fan device 91 is aligned with the air inlet. 931 'The air outlet of the fan unit 91 (and marked) aligns the air with π 932 ' and the air outlet 932 of the stream housing 93 has no = hot 'fin 94, which is bonded to the air Guide 931. Therefore, the 'flow guide housing % can be combined with one of the heat sources of the electronic product' and the airflow through the air inlet 931 through the air inlet 931, the air outlet, the heat pack, and the air outlet are sequentially guided by the fan unit 91. 932 to provide a heat dissipation effect. However, the third conventional heat dissipation module 9 omits the dispersion 71 of the first conventional heat dissipation module 7, and only the heat dissipation fins 94 are formed inside. However, the first ^ 筱 ^ ^ ^ ^, a kind of S-known heat-dissipation module 9 is to add the fan device 91 to the secret body 93 _, therefore, still has the volume is not easy to shrink, structure _ and group inconvenience and many others Disadvantages, the conventional heat dissipation module 9 is also uncomfortable and combines various sources. Furthermore, the third conventional heat dissipation module 9 is similar to the second conventional thermal imaging module 8 described above, that is, the loose coupling tab 94 formed inside the flow guiding housing 93 is located in the air guide. The exit 932 position, therefore, the heat dissipation effect that the conventional loose cable module 9 can provide is still quite limited. * 201103416 SUMMARY OF THE INVENTION The object of the present invention is to improve the shortcomings of the above various conventional heat dissipation modules, so as to provide a heat dissipation module, so that the heat dissipation module can complete the assembler without occupying too much space of the electronic product. The second object of the present invention is to provide a heat dissipation module, which can be applied to combine various heat sources at the same time. Still another object of the present invention is to provide a heat dissipation module which has better assembly convenience. The present invention is also directed to providing a heat dissipation module that can effectively reduce structural complexity. Another object of the present invention is to provide a heat dissipation module that can provide better heat dissipation. According to the heat dissipation module of the present invention, a frame, a stator, a wheel and a plurality of rows of heat are included. The sash has a bottom plate, and the bottom edge of the bottom plate is::: 侧: the side wall is provided with at least one heat conducting portion, and the side wall surrounds and forms a valley to 'and is connected with the space σ a tuyere; the stator is coupled to the chamber of the fan frame; the fan wheel is coupled to the stator; and the plurality of rows of fins are disposed at least the heat conducting portion of the (four) and located in the chamber. The heat dissipation module according to the present invention comprises a frame, a stator, a fan wheel, an upper cover and a plurality of rows of heat dissipation fins. The fan frame has a bottom plate, the bottom=peripheral joint-side wall, the side wall surrounds the forming chamber, and the side step is provided with a connection, and the chamber has a human wind σ and an air outlet; the stator is coupled to the stator The fan wheel is coupled to the stator, and the rainbow cover is coupled to the j-port of the fan frame. The upper cover is provided with an air inlet hole opposite to the air inlet, and the upper cover is provided with at least a heat conducting portion. The plurality of rows of fins are disposed on at least 201103416 of the upper cover and are located in the chamber. The heat dissipation module according to the present invention comprises a frame, a stator, a fan wheel and a plurality of rows of fins. The fan frame has a bottom plate, and the periphery of the bottom plate is combined with a side wall. The side wall surrounds and forms a chamber, and the side wall is provided with an air inlet and an air outlet connecting the chamber, and the bottom wall is provided with at least a heat conducting portion; the stator is coupled to the chamber of the fan frame; the fan wheel is coupled to the stator; and the plurality of heat dissipating fins are disposed on the at least one heat conducting portion of the bottom plate and located in the housing. The above and other objects, features, and advantages of the present invention will become more apparent and understood. As shown in the figure, the heat dissipation module 1 of the first embodiment of the present invention comprises a frame 11, a stator 12, a fan wheel 13, and a plurality of rows of fins 14. The fan frame 11 is preferably an air blower fan frame; the stator 12 is coupled to the inside of the fan frame 11; the fan wheel 13 is rotatably coupled to the stator 12; and the plurality of rows of heat dissipation fins 14 are disposed in the fan frame The predetermined thermal conduction position of the inner side. Thereby, the outer side of the fan frame 11 and the plurality of rows of fins 14 can be combined with various heat sources to supply various electronic products and provide good heat dissipation. The fan frame 11 has a bottom plate η1, and the bottom plate η1 is joined to the side wall 112. The side wall 112 is provided with at least a heat conducting portion 113, wherein the at least one heat conducting portion 113 refers to a portion of the side wall 112 having a heat conducting function. ^, may be concentrated in a certain area of the side wall 112, or may be dispersed in a plurality of different areas of the side wall 201103416 112; the side wall 112 is further formed around a chamber 114 and the side wall 112 is provided with the connection An air inlet 115 and a tuyer 116 of the chamber 114. In addition, the fan frame u of the present embodiment is preferably divided into several embodiments as follows according to the structural space type of the side moon return U2, the number of heat conducting portions 113, and the distribution area: As shown in Figures 4 and 5, the side wall 112 is composed of a plurality of side panels U2a, 112b, 112c, which may be integrally formed or detachable; In the embodiment shown in the figure, the opposite side plates (4) and mc are formed from the peripheral body of the bottom plate (1), and the other side plate U2a can be snapped, welded or bonded to the two side plates 112b. The n2C and the bottom plate m are fixed to each other. Further, the plurality of side plates 112a, 112b, and 112c are formed around the chamber 114', and the one side plate i12a is provided with the heat transfer portion 113. Secondly, as shown in FIG. 6, the side wall 112 is composed of a plurality of side plates 112d, 112e, 112f; as shown in the embodiment, the plurality of side plates 112d, 112e, 112f are The bottom plate is formed by integrally extending the periphery (or a removable design according to actual needs), and the plurality of side plates 112d, 112e, 112 are connected to each other. Further, the plurality of side plates 112d, 112e, 112f surround the chamber 114, and the plurality of side plates 112d, 112e, 112f are each provided with the heat conducting portion us. Thirdly, as shown in Fig. 7, the side wall 112 is a half ring piece 112g, and the half ring piece 112g is formed by integrally extending from the periphery of the bottom plate lu (also can be designed according to actual needs). Further, the half ring piece 113a surrounds the chamber 1M' and the material ring #112g is provided with the heat transfer portion 113. 201103416 More detailed description of the above, only a few embodiments are disclosed, and other implementations, such as the same concept and the general knowledge of the technical field can be included in the scope of the present invention. . . The scorpion 12 is coupled to the chamber 114 of the fan frame u. The stator preferably includes a member such as a coil assembly, a driving circuit or a shaft base (the shaft frame 11 may also be selectively coupled to the shaft frame 11; Thereby, the fixed wheel 13 can be rotatably coupled to the fan wheel 13 and can control the gantry wheel rim action. turn
該扇輪13可旋轉地結合該定子12，其中該扇輪 具有一輪轂131及數個葉片132 ^如第8圖所示，該輪轂 131用以結合該定子12，且該輪轂131之外周面與該扇框 Π之側牆112的内周面之間形成一蓄壓風道I% ;該數個 葉片132为別結合於該輪穀131之外周面，且該數個葉片 132位於該蓄壓風道133内；藉此，使該扇輪13自該扇 框11之入風口 115導入氣流後，該數個葉片132可利用 該蓄壓風道133蓄集氣流’以便增加氣流之風壓，並將氣 流推向該扇框11之出風口 116方向，令氣流可經由該出 風口 116排至外界空間。 該數排散熱鰭片14設於該側牆112之至少一導熱部 113，且該數排散熱鰭片14位於該容室114内；另外，該 數排散熱鰭片14之間可分別形成環繞該輪轂131且垂直 於該扇輪13之軸向的徑向流道141，其中，該徑向流道 141較佳係位於該蓄壓風道133之範圍内；藉此，當該扇 輪13之寥:個葉片132經由該蓄壓風道133將氣流推向該 出風口 116的過程中，該氣流能夠不受阻礙地經由該徑向 201103416 流道141自該出風口 116散發至外界空間，以提升熱傳導 效果及減少擾流現象。 更詳&之，如第4及5圖所揭示之實施例中，每— 排散熱鰭片14皆形成於該側板U2a之内周面，並分別由 數個凸柱所構成；如第6圖所揭示之實施例中，係於該數 片侧板112d、U2e、U2f之内周面分別形成數排散熱鯖 片14,且每一片侧板UM'me'lUf所屬之數排散熱 鰭片14彼此之間呈未連接狀態，另外，每一排散熱鰭片 14分別為一凸條狀設計；如第7圖所揭示之實施例中， 係於該半環片ll2g之内周面形成數排散熱鰭片14，且每 一排散熱鰭片14分別為連續狀之一凸條。再者，上述僅 揭示散熱籍片14的數個實施方式，其他未揭示之實施方 式，如為相同概念且為該技術領域中具有通常知識者可預 期者，仍應涵蓋於本發明散熱模組的範圍内。 凊參照第9及1〇圖所示，本發明第二實施例之散熱 模組2係包含一扇框21、一定子22、一扇輪23、一上蓋 24及數排散熱鰭片25。 該扇框21具有一底板211，該底板211周緣結合一 側牆212，該侧牆212圍繞形成一容室213，且該側牆 212設有連通該容室213的一入風口 214及一出風口 215 〇 該定子22結合於該扇框21之容室213，該定子22 較佳可包含如線圈組、驅動電路或軸座等構件；藉此，該 定子22可供該扇輪23可旋轉地結合，並能夠控制該扇輪 23旋轉作動。 —12 — 201103416 該扇輪23可旋轉地結合該定子22，其中該扇輪23 具有-輪轂231及數個葉片232，該輪穀231之外周面與 該扇框2!之侧牆212的内周面之間形成一蓄壓風道说 (該蓄壓風道233之作用與第—實施例所揭示之蓄壓風道 133相同，容不贅述）；該數個葉片232分別結合於該輪 穀231之外周面’且該數個葉片232位於該蓄壓風道233 内。 該上蓋24結合於該肩框21之入風口 214，且該上蓋 24設有與該入風口 214相對的—進風孔241;另外，該上 蓋24 5又有數個導熱部242 (亦可為單一導熱部242)，該 數個導熱部242係指該上蓋24具有熱傳導功能之部位。 猎此，g該扇框21結合有該上蓋24時，可藉由該上蓋 24提供如導流、增壓及散熱等作用。 該數排政熱韓片25分別設於該上蓋24之數個導熱 部242，且該數排散熱鰭片25位於該容室213内；另外 ，該數排散熱鰭片25之間可分別形成環繞該扇輪23之輪 轂231且垂直於該扇輪23之軸向的徑向流道251，該徑 向流道251較佳係位於該蓄壓風道233之範圍内，其中該 控向流道251之作用與第一實施例所揭示之徑向流道mi 相同，容不贅述。 s青參照第11及12圖所不’本發明第二實施例之散熱 模組3係包含一扇框31、一定子32、一扇輪33及數排散 熱鰭片34。 該扇框31具有一底板311，該底板311周緣結合一 側牆312，該側牆312圍繞形成一容室313，且該侧牆 —13 一 201103416 312設有連通該容室313的一入風口 314及一出風口 315 ，其中該出風口 315較佳設有數個輔助導流片316，以便 更為順利地導引氣流通過該出風口 315。另外，該底板 311設有一導熱部317 (亦可為數個導熱部317)，該導熱 部317係指該底板311具有熱傳導功能之部位。 該定子32結合於該扇框31之容室313，該定子32 較佳可包含如線圈組、驅動電路或軸座等構件；藉此，該 定子32可供該扇輪33可旋轉地結合，並能夠控制該扇輪 33旋轉作動。 5亥扇輪33可旋轉地結合該定子32，其中該扇輪33 具有一輪轂331及數個葉片332，該輪轂331之外周面與 該扇框31之侧牆312的内周面之間形成一蓄壓風道333 (該蓄壓風道333之作用與第一實施例所揭示之蓄壓風道 133相同’容不贅述）；該數個葉片332分別結合於該輪 轂331之外周面，且該數個葉片332位於該蓄壓風道333 内。 該數排散熱鰭片34設於該底板311之導熱部317， 且該數排散熱鰭片34位於該容室313内；另外，該數排 散熱鰭片34之間可分別形成環繞該扇輪33之輪轂331且 垂直於該扇輪33之轴向的徑向流道341，該徑向流道341 較佳係位於該蓄壓風道333之範圍内，其中該徑向流道 341之作用與第一實施例所揭示之徑向流道141相同，容 不贅述。 本發明第三實施例之散熱模組3較隹另包含一上蓋 35 ’該上蓋35結合於該扇框31之入風口 314 ’且該上蓋 201103416 35設有與該入風口 314相對的一進風孔351。另外，該上 蓋35相鄰於該出風口 315之一側形成一導流板352，該 導流板352朝向該底板311方向傾斜延伸；藉此，當該扇 輪33之數個葉片332經由該蓄壓風道333將氣流推向該 出風口 315後，該導流板352可進一步導引氣流順利地經 由該出風口 315排放至外界空間，並提供一增壓效果。The fan wheel 13 is rotatably coupled to the stator 12, wherein the fan wheel has a hub 131 and a plurality of blades 132. As shown in FIG. 8, the hub 131 is used to join the stator 12, and the outer circumference of the hub 131 A pressure accumulating air passage I% is formed between the inner circumferential surface of the side wall 112 of the frame frame; the plurality of blades 132 are combined with the outer circumferential surface of the wheel valley 131, and the plurality of blades 132 are located at the storage After the fan wheel 13 is introduced into the air flow from the air inlet 115 of the fan frame 11, the plurality of blades 132 can accumulate the air flow by the pressure accumulating air passage 133 to increase the air pressure of the air flow. And pushing the airflow toward the air outlet 116 of the fan frame 11, so that the airflow can be discharged to the external space through the air outlet 116. The plurality of rows of fins 14 are disposed in the heat conducting portion 113 of the sidewall 112, and the rows of fins 14 are located in the chamber 114. In addition, the rows of fins 14 can be separately formed. The hub 131 is perpendicular to the radial flow passage 141 of the axial direction of the fan wheel 13, wherein the radial flow passage 141 is preferably located within the range of the pressure accumulation air passage 133; thereby, when the fan wheel 13 is After that, the blades 132 push the airflow toward the air outlet 116 via the pressure accumulating air passage 133, and the airflow can be unimpeded from the air outlet 116 to the external space via the radial 201103416 flow passage 141. To improve heat transfer and reduce spoilage. More specifically, in the embodiment disclosed in FIGS. 4 and 5, each of the rows of fins 14 is formed on the inner peripheral surface of the side plate U2a, and is composed of a plurality of studs; In the embodiment disclosed in the figure, a plurality of rows of heat dissipation fins 14 are formed on the inner circumferential surfaces of the plurality of side panels 112d, U2e, and U2f, and a plurality of rows of heat dissipation fins of each of the side panels UM'me'lUf belong to 14 is unconnected with each other. In addition, each row of fins 14 has a convex strip design; as in the embodiment disclosed in FIG. 7, the inner peripheral surface of the half ring 11b is formed. The fins 14 are arranged, and each row of fins 14 is a continuous strip. Furthermore, the above description only discloses several embodiments of the heat-dissipating film 14. Other undisclosed embodiments, such as the same concept and those of ordinary skill in the art, are still contemplated to be included in the heat-dissipating module of the present invention. In the range. Referring to Figures 9 and 1, the heat dissipation module 2 of the second embodiment of the present invention comprises a frame 21, a stator 22, a fan wheel 23, an upper cover 24 and a plurality of rows of fins 25. The fan frame 21 has a bottom plate 211, and the bottom plate 211 is combined with a side wall 212. The side wall 212 surrounds a cavity 213, and the side wall 212 is provided with an air inlet 214 and an air outlet connecting the chamber 213. The tuyere 22 is coupled to the chamber 213 of the frame 21, and the stator 22 preferably includes a member such as a coil assembly, a drive circuit or a shaft base; whereby the stator 22 is rotatable for the fan wheel 23 The ground is combined and the rotation of the fan wheel 23 can be controlled. -12 - 201103416 The fan wheel 23 rotatably couples the stator 22, wherein the fan wheel 23 has a hub 231 and a plurality of blades 232, and the outer circumferential surface of the wheel valley 231 and the side wall 212 of the fan frame 2! A pressure accumulating air passage is formed between the circumferential surfaces (the function of the pressure accumulating air passage 233 is the same as that of the pressure accumulating air passage 133 disclosed in the first embodiment), and the plurality of blades 232 are respectively coupled to the wheel. The outer surface of the valley 231 is 'and the plurality of blades 232 are located in the pressure accumulation duct 233. The upper cover 24 is coupled to the air inlet 214 of the shoulder frame 21, and the upper cover 24 is provided with an air inlet hole 241 opposite to the air inlet 214. In addition, the upper cover 24 5 has a plurality of heat conducting portions 242 (also can be a single The heat transfer portion 242) refers to a portion where the upper cover 24 has a heat conduction function. When the upper cover 24 is combined with the upper cover 24, the upper cover 24 can provide functions such as diversion, supercharging, and heat dissipation. The plurality of heat-dissipating fins 25 are respectively disposed on the plurality of heat-conducting portions 242 of the upper cover 24, and the plurality of rows of heat-dissipating fins 25 are located in the chamber 213; a radial flow passage 251 surrounding the hub 231 of the fan wheel 23 and perpendicular to the axial direction of the fan wheel 23, the radial flow passage 251 preferably being located within the range of the pressure accumulation air passage 233, wherein the control flow The function of the track 251 is the same as that of the radial flow path mi disclosed in the first embodiment, and will not be described again. Referring to Figures 11 and 12, the heat dissipation module 3 of the second embodiment of the present invention comprises a frame 31, a stator 32, a fan wheel 33 and a plurality of rows of heat dissipation fins 34. The fan frame 31 has a bottom plate 311, and the bottom plate 311 is combined with a side wall 312. The side wall 312 surrounds a cavity 313, and the side wall 13-13104314 312 is provided with an air inlet connecting the chamber 313. 314 and an air outlet 315, wherein the air outlet 315 is preferably provided with a plurality of auxiliary baffles 316 for more smoothly guiding the airflow through the air outlet 315. In addition, the bottom plate 311 is provided with a heat conducting portion 317 (may also be a plurality of heat conducting portions 317), and the heat conducting portion 317 refers to a portion of the bottom plate 311 having a heat conducting function. The stator 32 is coupled to the chamber 313 of the fan frame 31. The stator 32 preferably includes components such as a coil assembly, a drive circuit or a shaft base; whereby the stator 32 is rotatably coupled to the fan wheel 33. And the rotation of the fan wheel 33 can be controlled. The fifth fan wheel 33 is rotatably coupled to the stator 32. The fan wheel 33 has a hub 331 and a plurality of blades 332. The outer circumferential surface of the hub 331 and the inner circumferential surface of the side wall 312 of the frame 31 are formed. a pressure accumulating duct 333 (the function of the accumulating duct 333 is the same as that of the accumulating duct 133 disclosed in the first embodiment); the plurality of vanes 332 are respectively coupled to the outer peripheral surface of the hub 331. And the plurality of blades 332 are located in the pressure accumulation duct 333. The plurality of rows of fins 34 are disposed in the heat conducting portion 317 of the bottom plate 311, and the rows of fins 34 are located in the chamber 313. In addition, the rows of fins 34 may be respectively formed around the fan wheel. a hub 331 of 33 and a radial flow passage 341 perpendicular to the axial direction of the fan wheel 33. The radial flow passage 341 is preferably located within the range of the pressure accumulating duct 333, wherein the radial flow passage 341 functions. The same as the radial flow path 141 disclosed in the first embodiment, it will not be described. The heat dissipation module 3 of the third embodiment of the present invention further includes an upper cover 35 ′, the upper cover 35 is coupled to the air inlet 314 ′ of the fan frame 31 , and the upper cover 201103416 35 is provided with an air inlet opposite to the air inlet 314 . Hole 351. In addition, the upper cover 35 defines a deflector 352 adjacent to one side of the air outlet 315, and the deflector 352 extends obliquely toward the bottom plate 311; thereby, when the plurality of blades 332 of the fan wheel 33 pass through the After the accumulating air duct 333 pushes the airflow toward the air outlet 315, the deflector 352 can further guide the airflow to be smoothly discharged to the external space via the air outlet 315, and provide a supercharging effect.
本發明散熱模組1、2、3於實際使用時，可供用於 結合各種不同熱源，並藉由單一散熱模組1、2、3同時對 數個熱源提供散熱作用。舉例而言，以本發明第一實施例 之第6圖所示的散熱模組1為例，請配合參照第13圖所 示’該散熱模組1之侧牆112的各側板ll2d、112e、112f 所分別形成的導熱部113之外侧面各可結合一導熱管4， 該數個導熱管4可連接如中央處理單元、主機板、各種電 子晶片或發光模組等各種不同熱源；或以本發明第一實施 例之第7圖所示的散熱模組1為例，請配合參照第14圖 所不，該散熱模組1之侧牆112的導熱部113之外側面亦 可直接結合熱源（如圖所示係為數個發光模組5);另外 其他如本發明第5圖所示之導熱部ι13、如第9及1〇 圖所示之上盍24戶斤具有的導熱部242、如g η及12圖 所不之底板311所具有的導熱部317，同樣可結合數個不 f的熱源（未綠不）。因此，上述各種不同_所產生的 门’’、、可、”由該導熱部113、242、317傳導至該散熱錯片 34 ’ t配合該扇輪13、23、33導引氣流繞行通 P 片 14、25、34，並經由該出風口 116、215、 同時將該數個熱源所產生的高熱排散至外界空間。另 —15 — 201103416 你杜本發月政熱模組卜2、3在同時結合數個熱源的前提 二下’為不影響散熱效果，亦可選用散熱效率較高的散 …、模組1、2、3進行散熱作業。 藉由上述本發明各實施例所揭示之散熱模組卜2、3 可知’本發明散熱模組卜2、3可選擇於扇框、 31之預定部位設有至少一導熱部113、242、317，例如： 側膽112、上蓋24 (可歸類為屬於扇框的一部分）及底板 311等部位；並於該至少一導熱部113、如、317的内側 ，對應設有數排散熱則14、25、34，而該至少一導熱 部113、242、317的外侧面則可供結合數個不同熱源，藉 此，以達卿用單—散難組卜2、3 _對數個熱源提 供散熱作用之功能。更詳言之，雖然本發明各實施例僅分 別揭示該側牆112、上蓋24及底板311各設有至少一導 熱部113、242、317，惟本發明散熱模組卜2、3之扇框 U、2卜31亦可同時於該側牆m、上蓋24及底板祀 設有駐少-導熱部113、242、317。例如：該扇框之側 牆及上盍皆設有該至少一導熱部；該扇框之側牆及底板皆 設有該至少一導熱部；或該扇框之側牆、上蓋及底板皆設 有該至少一導熱部，以此類推。 藉由前揭各實施例之散熱模組丨'2'3 ’本發明散熱模組卜2、3可達到如下所述之諸多'=徵 1、易於安裝在電子產品：該散熱模組i、2、3係 將該散熱鰭片14、25、34整合於該扇框U、2卜31内 部’亦即該散熱模組卜2、3之體積及軸向高度即為該扇 框U、21、31本身之體積及軸向高度；相較於習知散熱 —16 — 201103416 、9，本發明散熱模組1、2、3可更有效縮減體 檟及釉向高度’以便安裴於組裝空間相當有限之電子產 並可順繼合該電子產品之熱源，因此，使該散熱模 、、且1 2、3無須佔據電子產品過多空間即可完成組裝，以 達到不佔空間之功效。 2、使用上較不受限制：藉由該散熱模組1、2、3 之扇框11、2卜31的至少一導熱部113、242、317對應 數排散熱鰭片14、25、34的結構設計，該至少一導熱部 113 ^ ' 317的外側面則可供結合數個不同熱源，而並 非僅限疋結合單—熱源；因此，該散熱模組1、2、3可適 用於同時結合各種不同熱源，以達到提升使用便利性之功 效。 3組裝便利性佳··相較於習知散熱模、组7、8、9 具有組料鮮缺點；本發日錄鍵組卜2、3已將該散 熱籍片14、25、34整合於該扇框^、21、31内部，因 實際祕電子產品時，無紐過複賴組裝作業， P Μ用該散熱模組卜2、3,故具有組裝性佳之功 效。 4、結構精簡：本發明散熱 量及結構組成相當精簡，因此 3之構^ 了有效降低結構複雜度， m 設計成更為輕薄短小化等功效。 不丄當該散熱模組2、3結合各種 熱源所產生的高熱 13、^ %敎合料錢、、繞行 —17 — 201103416 14、25 34 μ之_ H可相對延長氣流流動於該散熱鰭片 之時間’以^升熱傳導效果，且可 具有可提升散熱效果之功效。 w象，故 u tit本發明散熱模組卜2、3確實具有易於 、在電子產…使用上較不受_、組裝便利性佳、結 構精簡及散熱效果佳等特點，gj# 守付點因此，適合應用於各式電子 產品，以提供較佳之散熱品質。 雖然本發明6利用上述較佳實闕揭示，然其並非 用以限林發明，任何翻此技齡在不脫離本發明之精 神和範H相對上述實關餅各種絲解改仍屬 本發明所賴之技雜，，因此本發明之倾範圍當視後 附之申請專利範圍所界定者為準。 【圓式簡單說明】 第1圖：習知第一種散熱模組的立體外觀圖。 第2圖：習知第二種散熱模組的立體外觀圖。 第3圖：習知第三種散熱模組的立體外觀圖。 第4圖：本發明第一實施例散熱模組的立體分解圖。 第5圖.本發明第一實施例散熱模組的立體外觀圖。 第6圖.本發明第一實施例散熱模組之扇框另一實施 方式的立體分解圖。 第7圖.本發明第一實施例散熱模組之扇框再一實施 方式的立體分解圖。 第8圖：本發明第一實施例散熱模組的俯視圖。 第9圖：本發明第二實施例散熱模組的立體分解圖。 201103416 ，10圖.本發明第二實施例散熱模組的&合剖視圖。 第11圖：本發明第三實施例散熱模組的立體分解圖。 第12圖：本發明第三實施例散熱模組的組合剖視圖。 第13圖：本發明散熱模組供散熱管結合之使用狀態參 考圖。 第14圖.本發明散熱模組供發光模組結合之使用狀態 參考圖。 【主要元件符號說明】 〔本發明〕 1 散熱模組 11 扇框 111 底板 112 侧牆 112g半環片 112a、112b、112c、 112d、112e、 112f侧板 113 導熱部 114 容室i 115 入風口 116 出風口 12 定子 13 扇輪 131 輪轂 132 葉片 133 蓄壓風道 14 散熱籍片 141 徑向流道 2 散熱模組 21 扇框 211 底板 212 侧牆 213 容室 214 入風口 215 出風口 201103416 22 定子 23 扇輪 231 輪轂 232 葉片 233 蓄壓風道 24 上蓋 241 進風孔 242 導熱部 25 散熱鰭片 251 徑向流道 3 散熱模組 31 扇框 311 底板 312 侧牆 313 容室 314 入風口 315 出風口 316 輔助導流片 317 導熱部 32 定子 33 扇輪 331 輪穀 332 葉片 333 蓄壓風道 34 散熱鰭片 341 徑向流道 35 上蓋 351 進風孔 352 導流板 4 導熱管 5 發光模組 〔習知〕 7 散熱模組 71 散熱鰭片組 711 散熱鰭片 72 熱導管 73 風扇 8 散熱模組 81 中空匣座 811 風道 812 進風口 813 出風口 82 扇輪 83 散熱鰭片 9 散熱模組 201103416 91 風扇裝置 92 93 導流殼體 931 932 空氣導出口 94 防塵濾網 空氣導入口 散熱鰭片The heat dissipating modules 1, 2, and 3 of the present invention can be used to combine various heat sources in actual use, and provide heat dissipation to a plurality of heat sources by a single heat dissipating module 1, 2, and 3. For example, the heat dissipation module 1 shown in FIG. 6 of the first embodiment of the present invention is taken as an example, and the side plates ll2d and 112e of the side wall 112 of the heat dissipation module 1 are referred to in FIG. Each of the outer sides of the heat conducting portion 113 formed by 112f may be combined with a heat conducting tube 4, and the plurality of heat conducting tubes 4 may be connected to various heat sources such as a central processing unit, a motherboard, various electronic chips or a light emitting module; or For example, the heat dissipation module 1 shown in FIG. 7 of the first embodiment of the present invention can be directly combined with the heat source (the outer side of the heat conducting portion 113 of the side wall 112 of the heat dissipation module 1 can be used as shown in FIG. As shown in the figure, there are a plurality of light-emitting modules 5); and other heat-transfer portions 134 as shown in FIG. 5 of the present invention, as shown in FIGS. 9 and 1 are heat-conducting portions 242 having 24 jins, such as The heat transfer portion 317 of the bottom plate 311, which is not included in the figures η and 12, can also be combined with a plurality of heat sources (not green). Therefore, the above-mentioned various different generated gates '', can be," are conducted by the heat conducting portions 113, 242, 317 to the heat dissipating chip 34' t, and the fan wheels 13, 23, 33 are guided to guide the airflow. P pieces 14, 25, 34, and through the air outlets 116, 215, at the same time, the high heat generated by the several heat sources is discharged to the external space. Another 15 - 201103416 You Duben issued a monthly political thermal module Bu 2, 3 At the same time, in combination with the premise of several heat sources, in order to not affect the heat dissipation effect, the heat dissipation operation can be selected, and the heat dissipation operation can be performed by the modules 1, 2, and 3. The heat dissipation disclosed by the above embodiments of the present invention is disclosed. Modules 2, 3 can be seen that the heat dissipation module 2, 3 of the present invention can be selected from the fan frame, and the predetermined portion of the 31 is provided with at least one heat conducting portion 113, 242, 317, for example: the side shell 112, the upper cover 24 (returnable And a portion of the heat conducting portion 113, such as 317, corresponding to the plurality of heat dissipation portions 14, 25, 34, and the at least one heat conducting portion 113, 242 The outer side of the 317 can be used to combine several different heat sources. The function of providing heat dissipation for the heat dissipation group 2, 3 _ a plurality of heat sources. More specifically, although the embodiments of the present invention respectively disclose that the side wall 112, the upper cover 24 and the bottom plate 311 are each provided with at least one heat conducting portion 113 242, 317, but the fan frame U, 2, 31 of the heat dissipation module 2, 3 of the present invention can also be provided with the small-heat-conducting portions 113, 242, and 317 at the side wall m, the upper cover 24, and the bottom plate. For example, the side wall and the upper sill of the fan frame are provided with the at least one heat conducting portion; the side wall and the bottom plate of the fan frame are all provided with the at least one heat conducting portion; or the side wall, the upper cover and the bottom plate of the fan frame are provided There is at least one heat conducting portion, and so on. By the heat dissipating module 丨 '2'3 of the foregoing embodiments, the heat dissipating module of the present invention 2, 3 can achieve many of the following as follows: Installed in the electronic product: the heat dissipation modules i, 2, 3 are integrated into the fan frame U, 2, 31 inside the fan frame U, 2, 3, that is, the volume of the heat dissipation module 2, 3 and The axial height is the volume and axial height of the fan frame U, 21, 31 itself; compared with the conventional heat dissipation -16 - 201103416, 9, the heat dissipation module 1 of the present invention 2, 3 can more effectively reduce the body and glaze height 'in order to install a relatively limited electronic production space and can continue to heat the electronic product, so that the heat dissipation mode, and 1, 2, 3 are not required It takes up too much space in the electronic product to complete the assembly, so as to achieve the effect of not occupying space. 2. The use is not limited: at least one heat conduction of the fan frame 11, 2, 31 of the heat dissipation module 1, 2, 3 The portions 113, 242, and 317 correspond to the structural design of the rows of fins 14, 25, and 34. The outer side of the at least one heat conducting portion 113^' 317 can be combined with a plurality of different heat sources, and is not limited to the single unit. The heat source; therefore, the heat dissipation modules 1, 2, and 3 can be applied to combine various heat sources at the same time, so as to improve the convenience of use. 3 The assembly convenience is better than that of the conventional heat-dissipating molds, and the groups 7, 8, and 9 have the shortcomings of the group; the Japanese-made key group groups 2 and 3 have integrated the heat-dissipating sheets 14, 25, and 34. Inside the fan frame ^, 21, 31, due to the actual secret electronic products, there is no need to rely on the assembly work, P uses the heat dissipation module 2, 3, so it has the effect of good assembly. 4. Structure simplification: The heat dissipation and structural composition of the invention are quite simple, so the structure of 3 is effective to reduce the complexity of the structure, and m is designed to be lighter, thinner and shorter. It is not necessary that the heat-dissipating modules 2, 3 combined with the high heat generated by various heat sources 13, the amount of money, and the bypass - 17 - 201103416 14, 25 34 μ _ H can relatively extend the airflow to the heat sink fin The time of the film 'has a heat transfer effect, and can have the effect of improving the heat dissipation effect. w icon, so u tit the heat dissipation module of the invention, 2, 3 does have the characteristics of being easy to use, not suitable for use in electronic production, good assembly convenience, compact structure and good heat dissipation effect, and therefore gj# Suitable for all kinds of electronic products to provide better heat dissipation quality. Although the present invention 6 is disclosed by the above-described preferred embodiments, it is not intended to limit the invention of the invention, and any technical solution of the present invention is not deviated from the spirit and scope of the present invention. The scope of the present invention is defined by the scope of the appended claims. [Circular Simple Description] Figure 1: The stereoscopic appearance of the first heat dissipation module. Figure 2: The stereoscopic appearance of the second heat dissipation module. Figure 3: The stereoscopic appearance of the third heat dissipation module. Fig. 4 is an exploded perspective view showing the heat dissipation module of the first embodiment of the present invention. Fig. 5 is a perspective view showing the heat dissipation module of the first embodiment of the present invention. Fig. 6 is an exploded perspective view showing another embodiment of the fan frame of the heat dissipation module according to the first embodiment of the present invention. Fig. 7 is a perspective exploded view showing still another embodiment of the heat dissipation module of the first embodiment of the present invention. Figure 8 is a plan view of a heat dissipation module according to a first embodiment of the present invention. Figure 9 is a perspective exploded view of a heat dissipation module according to a second embodiment of the present invention. 201103416, FIG. 10 is a cross-sectional view of a heat dissipation module according to a second embodiment of the present invention. Figure 11 is a perspective exploded view of a heat dissipation module according to a third embodiment of the present invention. Figure 12 is a cross-sectional view showing the combination of the heat dissipation module of the third embodiment of the present invention. Fig. 13 is a reference view showing the state of use of the heat dissipating module of the present invention for the combination of the heat dissipating tubes. Fig. 14 is a diagram showing the use state of the heat-dissipating module of the present invention for combining the light-emitting modules. [Main component symbol description] [Invention] 1 heat dissipation module 11 fan frame 111 bottom plate 112 side wall 112g half ring piece 112a, 112b, 112c, 112d, 112e, 112f side plate 113 heat transfer portion 114 chamber i 115 air inlet 116 Air outlet 12 stator 13 fan wheel 131 hub 132 blade 133 accumulator air duct 14 heat sink 141 radial flow path 2 heat dissipation module 21 fan frame 211 bottom plate 212 side wall 213 chamber 214 air inlet 215 air outlet 201103416 22 stator 23 Fan wheel 231 Hub 232 Blade 233 Accumulator air duct 24 Upper cover 241 Air inlet 242 Heat transfer part 25 Heat sink fin 251 Radial flow path 3 Heat dissipation module 31 Fan frame 311 Base plate 312 Side wall 313 Room 314 Air inlet 315 Air outlet 316 Auxiliary baffle 317 Heat transfer part 32 Stator 33 Fan wheel 331 Valley 332 Blade 333 Accumulator air duct 34 Heat sink fin 341 Radial flow path 35 Upper cover 351 Air inlet 352 Guide plate 4 Heat pipe 5 Light-emitting module Conventional] 7 Heat Dissipation Module 71 Heat Sink Set 711 Heat Sink 72 Heat Pipe 73 Fan 8 Heat Dissipation Module 81 Hollow Seat 811 Air Duct 812 Air Inlet 813 Wheel 83 outlet 82 heat dissipation module heat radiation fins 9 201 103 416 91 931 932 94 air outlet 9293 of air deflector dust filter housing inlet means for introducing heat-dissipating fins of the fan
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