201102663 . 六、發明說明： 【發明所屬之技術領域】 本發明係有關探針卡之技術領域’特別是指一種採用針狀探 針的垂直式探針卡結構。 【先前技術】201102663. VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to the field of probe cards, particularly to a vertical probe card structure using a needle probe. [Prior Art]
-般測試半導體晶狀探針卡，主要是彻各式各樣的探針 與半導體晶片相接觸組探針卡的所有構件之中，探針的數 m r採針卡大部份的成本。目前所使用的探針種 類包括有懸臂式探針(cantilever pr〇be)、彈箸式探針(s的呢 师⑹以及垂直式可撓曲探針(feticai Bending Pr〇be)等。 、由於目別半導體^愈做愈小，姆地探針的尺寸也需同步 小。縮小簡針仍必須備有適當的彈性，使探針在與晶片接觸 1不會造成晶料縣。糾聰針本身也必彡使電性訊號 2好的雜。因此愈細小的探針成本也愈編。有鑑於此， ^明人即思考如何設計—組垂直式探針卡，有效地降低探針的 i_仍不會降低探針卡所需的測試及接觸效能。 【發明内容】 本發月之主要目的是 試用導電㈣直式&針卡，疋利用日曰片測 媒仑。餘\ $針作為戦作針的晶片測與電性傳輸的 、I孩針為細勒*非 A主 、 負貝與待測晶片相接觸，該晶片測試用 導電膠則負責探針接觸 禪觸時的彈性緩衝，利用此方式所採用的探針 201102663 成本較低，連帶著紐探針卡的製造成本也降低， 場競爭力。 φ 本發明之次要目的提供一種垂直式探針卡，主要是免除傳统 部份探針㈤如懸臂式探針)須輝接導線的缺點，本發 件的鎖固及依序組裝方式即可確保各構件的電性接觸，讓生產組 裝上更為方便性，產品良率也會提升。 為達成上述目的，本發明包括有電路板、晶㈣朗導電膠、 固定模組、以及複數根探針。該晶片測試用導電谬的縱向分佈著 複數個鄰近但相互稍_導㈣，該導賴線餘小並且有能 被_的職。制定餘是結合於魏路板下面，鋪數探針 則設置於岐肋處。該晶片戦科電軸置是魏制於該電 路板下面與該固定模組固定該探針的所在區域上面之間，該探針 頂面是與該晶片測試用導電膠相接觸，該探針是經該晶片測試用 導電膠之導電體與該電路板相電性連接，如此形成本發明之垂直 式探針卡。 兹配合下列之圖示說明本發明之詳細結構及其連結關係，俾 使熟習該微術領域者在研縣綱紐罐以實施。 【實施方式】 凊參閱第-、二圖所示，係為本發明垂直式探針卡之局部區 域的仰視圖及局部區域的剖面示意圖。本發明探針測試卡1〇〇主 要是由電路板卜晶片測_導電膠2、岐敝3、以及複數根 探針4所構成。 201102663 . 以下就各構件之結構作一詳細的描述。如第三圖所示。該探 針4為似細針狀’圖巾是放大示㈣’實際上該探針4尺寸僅介 於〇. 14〜0. 32麵。該探針4是由一接觸針41及一卡科42兩部^ 所構成’該卡擎件42的外徑較該接觸針41大，該卡擎件处是位 於該接觸針41之上。此探針4並不具有類似彈簧的彈性。 β如第二圖所示’該固定模組3是結合於該電路板1的下面，兩 者是採螺絲鎖固（圖中未將螺絲畫出），使固定模組3不會任意移 鲁動。該固定模組3是負責固定及限制該晶片測試用導電膠2與複 _數探針4於電路板1下面的位置。如第四圖所示，該固定模組3 '處具有複數貫穿個探針孔31，該探針孔31是由孔徑不同的卡掣孔 312及針孔311所構成。該卡掣孔力孔徑大於針孔，位置 並位於該針孔311之該針孔311及卡f孔312的孔徑分別對 應該探針4的接觸針41及卡掣件42。在組裝時該探針4雖被安 置於相對應的探針31内，但位置並非完全固定，該探針4仍能作 φ向上輕微距離的移動。該探針孔31的縱向尺寸是小於探針4的長 度，使該探針4組裝於固定模組3時，該探針4的接觸針41底端 及卡掣件42頂端皆伸出固定模組3的探針孔幻外。 δ亥固疋杈組3固定著複數個探針4的位置區域頂面形成有一 凹的谷置空間32 ’第二圖中僅晝出容置空間32的部份區域而 已。该容置容間32主要作為該晶片測試用導電膠2的設置之處， 第圖所示，虛線所表示該晶片測試用導電膠2的範圍，相對地 也疋遠谷置空間32的範圍。該晶片測試用導電膠2是被限制於該 201102663 '下面與該固定模組3固定複數探針4的所在區域上面 之fa γ _時’該晶片測試用導電膠2是緊貼於該電路板1的 ^面’該複數探針4的卡掣件42頂面是緊貼於該晶片測試用導電 膠2的下表面’使該晶片測試料電膠2的位置被固定。Generally, the semiconductor crystal probe card is tested, mainly for all kinds of probes in contact with the semiconductor wafer. Among all the components of the probe card, the cost of the probe is mostly the cost of the needle card. The types of probes currently used include cantilever probes, magazine probes (s) and vertical flexure probes (feticai Bending Pr〇be). The smaller the semiconductor, the smaller the size of the probe, the smaller the size of the probe. The narrow needle must still be properly elastic so that the probe does not cause contact with the wafer. It is also necessary to make the electrical signal 2 good. Therefore, the smaller the cost of the probe is also compiled. In view of this, the person who thinks about how to design a group of vertical probe cards effectively reduces the i_ of the probe. The test and contact performance required for the probe card will not be reduced. [Summary of the Invention] The main purpose of this month is to test the conductive (four) straight & needle card, and use the sundial to measure the media. The wafer is measured and electrically transferred, and the I-pin is in contact with the wafer to be tested. The conductive adhesive for the wafer test is responsible for the elastic buffer of the probe when it touches the Zen touch. The probe 201102663 used in this way is relatively low cost, and is manufactured with a new probe card. This is also a reduction in field competitiveness. φ The secondary object of the present invention is to provide a vertical probe card, which mainly eliminates the disadvantages of the conventional partial probe (5), such as a cantilever probe, which must be connected to the wire, and the lock of the present invention. The solid and sequential assembly method ensures the electrical contact of the components, which makes the production assembly more convenient and the product yield is also improved. To achieve the above object, the present invention includes a circuit board, a crystalline (four) conductive paste, a fixed module, and a plurality of probes. The wafer is tested for the longitudinal direction of the conductive crucible with a plurality of adjacent but slightly adjacent (four), the guide line is small and has the ability to be _. The formulation is combined with the Weilu board, and the paving probe is placed at the rib. The wafer is disposed between the lower surface of the circuit board and the upper surface of the fixing module, and the top surface of the probe is in contact with the conductive adhesive for testing the wafer. The electrical conductor of the conductive paste for testing the wafer is electrically connected to the circuit board, thus forming the vertical probe card of the present invention. The detailed structure of the present invention and its connection relationship will be described in conjunction with the following figures, so that those skilled in the art of microsurgery can implement it in the research and development of the county. [Embodiment] Referring to Figures 2 and 2, a partial view of a partial region of a vertical probe card of the present invention and a cross-sectional view of a partial region are shown. The probe test card 1 of the present invention is mainly composed of a circuit board, a conductive paste 2, a 岐敝3, and a plurality of probes 4. 201102663 . The following is a detailed description of the structure of each component. As shown in the third figure. The probe 4 is shaped like a thin needle. The figure is enlarged (4). The size of the probe 4 is actually only 〇. 14~0. 32 faces. The probe 4 is composed of a contact pin 41 and a card 42. The outer diameter of the card holder 42 is larger than the contact pin 41, and the card member is located above the contact pin 41. This probe 4 does not have spring-like elasticity. As shown in the second figure, the fixed module 3 is coupled to the lower surface of the circuit board 1. The two are screwed (not shown in the figure), so that the fixed module 3 does not move arbitrarily. move. The fixing module 3 is responsible for fixing and limiting the position of the wafer test conductive paste 2 and the complex number probe 4 under the circuit board 1. As shown in the fourth figure, the fixed module 3' has a plurality of probe holes 31 extending through the plurality of pin holes 312 and pinholes 311 having different apertures. The hole diameter of the card hole is larger than that of the pin hole, and the hole diameter of the pin hole 311 and the card hole 312 located at the pinhole 311 respectively correspond to the contact pin 41 of the probe 4 and the latching member 42. Although the probe 4 is placed in the corresponding probe 31 during assembly, but the position is not completely fixed, the probe 4 can still move φ upward by a slight distance. The longitudinal dimension of the probe hole 31 is smaller than the length of the probe 4. When the probe 4 is assembled to the fixed module 3, the bottom end of the contact pin 41 of the probe 4 and the top end of the latching member 42 extend out of the fixed mold. Group 3 probe holes are magical. The top surface of the Δ海固疋杈 group 3 in which the plurality of probes 4 are fixed is formed with a concave valley space 32'. In the second figure, only a portion of the accommodating space 32 is cut out. The accommodating space 32 is mainly used as the place where the conductive paste 2 for the wafer test is disposed. As shown in the figure, the range of the conductive paste 2 for the wafer test is indicated by a broken line, and the range of the space 32 is relatively large. The conductive adhesive 2 for the wafer test is limited to the fa γ _ on the area under which the fixed probe 3 is fixed to the fixed module 3 and the conductive paste 2 for the wafer test is adhered to the circuit board. The top surface of the latching member 42 of the plurality of probes 4 is in close contact with the lower surface of the wafer test conductive paste 2 to fix the position of the wafer test material 2 .
該晶片測試用導電膠2為目前已存在的商品，英文名稱為ICThe conductive adhesive 2 for wafer testing is currently in existence, and the English name is IC.
Tes_ toer-Co聰ct〇r。如第五a及五B圖所示，該晶片測試 用、電膠2主要是在本身材料的縱向分佈著複數個鄰近但相互不Tes_ toer-Co is ct〇r. As shown in the fifth and fifth B diagrams, the wafer test and the electro-adhesive 2 are mainly distributed in the longitudinal direction of the material itself, but not adjacent to each other.
接觸的導電體2卜導電體21周形成有絶緣物㈡。圖中是以 放大數拾倍的方式呈現，實際上該導電體21㈣徑小於 〇.慨麵，相鄰的兩導電㈣之間的間距也僅(U〜〇. G5腿。由於 複數導電體21極細’垂直方向施壓於導電體21時，該導電體^ 具有輕微彎曲的彈性。本發明即該晶片賴科電膠2之導 電體21所具有的雜’使探針4在與制；相接㈣也具有彈 性。 • 該棘板1錄整親構的最上層位置。該板丨上、下 表面白八有細線路’錢路板丨下表面的線路必賴該複數探 ’十4的位置相配合。而電路板J的上表面線路與測試裝置相連接， 以便進仃細的測試。在本發日种是彻該晶片測試用導電膠2 作為電路板i與探針4相接觸的介質，由於晶片測試用導電膠2 的導電體21極為細小且密集，每一支探針4具有4 8根導電體21 與之接觸，該導電體21並會與電路板i下表面相對的金屬墊相接 觸並作電性訊號傳輸，故能確保該垂直式探針卡運作正常。 201102663 如第二圖所示，當組裝時，複數雜針4是先安裝於該固定 模、、且3之相對位置的探針孔31内，再將該晶片測試用導電谬2置 於固定模組3之容置郎32處，此時該晶片測試用導電膠 2是位 於複數根探針4的頂掣件42 _面。之後再將該_組3以螺 絲鎖固定電如的働£，使喊_飾。如此一來， 該晶片測試聘電膠2驗置就_於電路板丨触定模组3之 間，並且該晶片測試用導電膠2的頂面是緊貼著該電路板i的下 表面，該晶>1測試解電膠2的下表_與複數探針4緊密接觸。 由於晶片測試用導電膠2上分佈著密集細微的導電體。，因此每 個探針4都會有至少數個導電體21與之接觸，該導電體21另一 端則與電路板1相對的線路接觸，確保電路板1至探針4之的訊 號傳輸通暢，錢行⑼測試過财也*會短路。 、，在上述實際例中，該探針4為似針狀，外型採圓針狀設計， Y並不以此為限’如第六圖所示，為本發明之探針4八另一種實施 例的立體圖’該楝針^仍是由接觸針4lA及卡科似所構成， 但形狀為立體四邊型針狀’該卡掣件42A較接觸針41A扁平。 综合以上所述’本發明垂直式探針卡是利用複數個針狀的探 針及該晶片測導轉作為·板與制晶狀_接觸及訊 號傳輸的介質。彻針狀聰針能大幅減少製成探針卡所需之費 用’使得探針卡的成本降低但又不會影響探針卡所需之必要特 性。而且探針卡上是採用垂直式探針所形成的測試作業區，測試 作業區的_可讀小，有册現今晶來愈小的趨勢，另外 201102663 •也较設計者斜狀於電路板上軸〇_試健區，藉以 提面測試的效率。 惟以上所述者’僅為本發明之較佳實關而已，當不能以之 限定本發明實施之範圍，即大凡依本發明申請專利範圍所作之均 等變化與修飾’皆應仍屬於本發明專利涵蓋之範圍内。 【圖式簡單說明】 第一圖為本發明探針卡之局部區域之仰視圖； •第二圖為第剖面示意圖，圖巾該晶片測試用導電膠 的導電體並未在此圖中畫出； 第三圖為本發明之探針的放大立體圖； 第四圖為本發明之探針與固定模組之分解示意圖； 第五A圖係為本發明所使用之晶片測試用導電膠橫切面的局部放 大示意圖； 第五B圖係為本發明所使用之晶片測試用導電膠縱切面的局部放 φ 大示意圖； 第六圖係為本發明之第二種探針的放大立體圖。 【主要元件符號說明】 A 探針卡 1 電路板 2 晶片測試用導電膠 21 導電體 22 絶緣體 [s] 8 201102663 3 固定模組 31 探針孔 311 針孔 312 卡掣孔 32 容置空間 4 探針 41 接觸件 42 卡掣件 4A 探針 41A 接觸件The contacted electrical conductor 2 is formed with an insulator (2) around the conductor 21 . In the figure, it is presented in an enlarged number of times. In fact, the diameter of the conductor 21 (four) is smaller than that of the surface of the conductor. The spacing between the adjacent two conductors (four) is also only (U~〇. G5 leg. Since the plurality of conductors 21 When the extremely thin 'vertical direction' is applied to the conductor 21, the conductor has a slight bending elasticity. The present invention is that the conductor 21 of the Lai Kee electro-adhesive 2 has a miscellaneous 'probe of the probe 4; The connection (4) also has elasticity. • The slab 1 records the uppermost position of the pro-construction. The upper and lower surfaces of the slab are white and have a fine line. The line of the lower surface of the Qianlu board must depend on the complex number. The position is matched, and the upper surface of the circuit board J is connected to the test device for the fine test. In the present invention, the conductive adhesive 2 for the wafer test is used as the circuit board i in contact with the probe 4. The medium, since the conductor 21 of the conductive paste 2 for wafer testing is extremely fine and dense, each probe 4 has 48 conductors 21 in contact therewith, and the conductor 21 is opposite to the lower surface of the board i. The pads are in contact with each other and are electrically transmitted, so that the vertical probe card can be transported As shown in the second figure, when assembled, the plurality of magnetic needles 4 are first mounted in the probe holes 31 of the fixed mold and at the relative positions of the third, and the conductive test pads 2 for the wafer test are placed. The fixing module 3 is accommodated at 32 places. At this time, the conductive rubber 2 for testing the wafer is located on the top surface 42 of the plurality of probes 4. After that, the _ group 3 is fixed by screws. In the case of the wafer test 丨 contact module 3, the top surface of the wafer test conductive paste 2 is in close contact with the wafer. On the lower surface of the circuit board i, the following table of the crystal > 1 test electrolyte 2 is in close contact with the plurality of probes 4. Since the conductive paste 2 for the wafer test is densely distributed with fine electric conductors, each probe The needle 4 will have at least a plurality of electrical conductors 21 in contact therewith, and the other end of the electrical conductor 21 is in contact with the circuit board 1 to ensure smooth signal transmission from the circuit board 1 to the probe 4, and the money (9) has been tested. Also * will be short-circuited. In the above practical example, the probe 4 is needle-like, and the outer shape is round-needle-shaped, Y is not This is a limit view as shown in the sixth figure, which is a perspective view of another embodiment of the probe 4 of the present invention. The needle is still composed of the contact needle 4lA and the card, but the shape is a stereo four-sided needle. The card member 42A is flatter than the contact pin 41A. The above-described vertical probe card of the present invention utilizes a plurality of needle-shaped probes and the wafer is guided to be a plate and a crystallized contact. The medium for signal transmission. The needle-shaped needle can greatly reduce the cost of making the probe card', so the cost of the probe card is reduced without affecting the necessary characteristics required for the probe card. Using the test area formed by the vertical probe, the test operation area is _ readable, and the trend is now smaller. In addition, the 201102663 is also oblique to the axis on the board. To improve the efficiency of the face test. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent variation and modification of the scope of the patent application of the present invention should still belong to the present invention. Within the scope of coverage. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a bottom view of a partial area of the probe card of the present invention; • The second figure is a schematic view of the first section, and the conductor of the conductive adhesive for the wafer test is not drawn in this figure. The third drawing is an enlarged perspective view of the probe of the present invention; the fourth drawing is an exploded view of the probe and the fixing module of the present invention; and the fifth drawing is the cross section of the conductive adhesive for wafer testing used in the present invention; Fig. 5 is a schematic view showing a partial φ of a longitudinal section of a conductive paste for wafer testing used in the present invention; and Fig. 6 is an enlarged perspective view of a second probe of the present invention. [Main component symbol description] A Probe card 1 Circuit board 2 Conductor adhesive for wafer test 21 Conductor 22 Insulator [s] 8 201102663 3 Fixed module 31 Probe hole 311 Pinhole 312 Card hole 32 accommodating space 4 Probe 41 Contact 42 Clamp 4A Probe 41A Contact
42A 卡掣件42A card assembly