201102249 bond the protected coating. 四、指定代表圖： (一）本案指定代表圖為：第（1 )圖。 (二）本代表圖之元件符號簡單說明： 殼體 10 薄膜層 11 裝飾層 13 不導電金屬層 15 保護層 17 基體 19 五、本案若有化學式時，請揭示最能顯示發明特徵之化 學式： 益 * 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種殼體的製作方法及由該方法製得的殼 體，特別涉及一種具有金屬外觀的殼體的製作方法及由該 方法製得的殼體。 【先前技術】 IML工藝目前被廣泛應用於可攜式電子產品殼體的製 作中。採用該工藝製成的殼體通常包括一透明的塑膠薄 膜、一印刷於塑膠薄膜内表面的油墨層及一注塑於油墨層 表面的塑膠基體層。由該工藝製成的殼體的外表面為一而于 201102249 磨财到傷的透明薄膜，中間為印刷油墨層，内表面為塑膠 $印刷油墨夾在中間，使用過程中可防止油墨的脫落及 Π，因而可長期雜產品輕明亮的顏色，深受消費 的月睞然而’上述殼體的外觀存在只能呈現出印刷油 墨的色¥及外觀、難以具備金屬f感的缺陷。 【發明内容】 馨於此，有必要提供一種具金屬外觀的殼體的製作方 法。 另還有必要提供一種由上述方法所製得的殼體。 :種殼體的製作方法，其包括如下步驟： 提供一透明薄膜層； 在5亥透明薄膜層的—表面上設置-不導電金屬層； 於所述不導電金屬層上設置一保護層； 於该保護層上注塑一基體。 :種殼體，其包括H薄膜層及-基體，該殼體還 包括形成於薄膜層表面的轉電金屬層及形成於不導電金 屬層表面的保護層，所述基體以注塑成型的方式與所述保 護層相結合。 ” ,·相較於f知技術，本發明殼體的製作方法藉由設置_ 導電金屬層於;^膜層及基體之間，使所述殼體呈現出金 屬的外觀。且夾設於薄膜層與基體之間的不導電金屬層不 會被磨損。本發明殼體具有更強的外冑吸引力。 【實施方式] •本發明一較佳實施方式的殼體的製作方法包括如下步 201102249 提供-透明薄膜層。該透明薄膜層 騎丙稀(PP)、聚酿胺叫聚碳賴 0.125-0.175mm 〇 〜相薄膜層的厚度約為 〜月薄膜層的一表面印刷一裝飾層。該裝飾層 明或半透明油墨層，其可採用常規絲網印刷 的方式形成。該裝飾層的厚度在3·5·4.5_之間。 在該褒飾層的表面上設置一不導電金屬層。該不導電 金屬層可以真工洛鍵或濺鑛的方式製成。蒸鍍或濺鍍所述 ^導電金屬層的乾材可選自銦、錫、銦錫合金、銘、鈦、 碳化鈦、鋁矽及不銹鋼等材料中的任意一種。該不導電金 屬層具有金屬質感外觀’其厚度在之間。該不導電 金屬層可為半透明或不透明。該不導電金屬層不導電，其 對無線射頻的傳輸或接收不會產生干擾。 於所述不導電金屬層上設置一保護層。該保護層可為 以絲網印刷的方式形成的透明油墨層。所述油墨優選為紫 外光固化油墨。為提高該保護層在後續注塑基體時的抗沖 蝕能力，該保護層可分多次印刷形成，例如7-8次印刷。 每次印刷後均對印刷的油墨進行紫外光固化。每次印刷的 油墨厚度可在8-1〇μιη之間。該保護層具有較高的硬度及抗 沖姓能力’其能很好的抵抗注塑基體時注塑塑膠的沖蝕， 並確保不導電金屬層不受到損害。 將所述形成有裝飾層、不導電金屬層及保護層的透明 薄膜層熱壓成型為待成型殼體的邊圍形狀。 201102249 提供一成型模具，將該成型後的透明薄膜層置於該模 具中，並注塑一基體於所述保護層的表面。注塑該基體的 材料可選自為透明或不透明的聚乙烯（PE)、聚醯胺（PA)、 聚碳酸酯（PC)、丙烯腈-苯乙烯-丁二烯共聚合物（ABS)、 聚曱基丙烯酸甲酯（PMMA )及聚對苯二甲酸乙二酯（PET ) 等塑膠中的任一種。 請參閱圖1所示，一種由上述方法所製得的殼體10包 括一薄膜層11及依次形成於薄膜層11 一表面的裝飾層 • 13、不導電金屬層15、保護層17及基體19。所述裝飾層 13為透明或半透明彩色油墨層，其使所述殼體10呈現出 彩色的外觀。所述不導電金屬層15可為半透明或不透明， 其使所述殼體10呈現出金屬的外觀及光澤。所述保護層 17為多次印刷形成的透明紫外光固化漆層，所述基體19 以注塑成型的方式結合於保護層17的表面。 本發明較佳實施方式殼體的製作方法藉由設置一不導 電金屬層於薄膜層及基體之間，使所述殼體呈現出金屬的 • 外觀。且夾設於薄膜層與基體之間的不導電金屬層不會被 磨損。本發明殼體具有更強的外觀吸引力。 【圖式簡單說明】 圖1係本發明一較佳實施方式殼體的剖視示意圖。 【主要元件符號說明】 殼體 10 薄膜層 11 裝飾層 13 不導電金屬層 15 保護層 17 基體 19201102249 bond the protected coating. 4. The designated representative map: (1) The representative representative of the case is: (1). (2) Brief description of the symbol of the representative figure: Shell 10 Thin film layer 11 Decorative layer 13 Non-conductive metal layer 15 Protective layer 17 Substrate 19 V. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 6. Technical Description of the Invention The present invention relates to a method of manufacturing a housing and a housing produced by the method, and more particularly to a method of manufacturing a housing having a metallic appearance and a method for manufacturing the same The casing. [Prior Art] The IML process is currently widely used in the manufacture of portable electronic product housings. The housing made by the process generally comprises a transparent plastic film, an ink layer printed on the inner surface of the plastic film, and a plastic substrate layer molded on the surface of the ink layer. The outer surface of the casing made by the process is a transparent film which is worn to the injured in 201102249, the printing ink layer is in the middle, and the inner surface is plastic. The printing ink is sandwiched in the middle, and the ink can be prevented from falling off during use. Π 因而 Π 可 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂SUMMARY OF THE INVENTION It is necessary to provide a method of manufacturing a housing having a metallic appearance. It is also necessary to provide a housing made by the above method. a method for manufacturing a seed casing, comprising the steps of: providing a transparent film layer; disposing a non-conductive metal layer on a surface of the transparent film layer; and providing a protective layer on the non-conductive metal layer; A protective layer is overmolded with a substrate. a seed casing comprising an H film layer and a substrate, the casing further comprising a conductive metal layer formed on a surface of the film layer and a protective layer formed on a surface of the non-conductive metal layer, the substrate being injection molded The protective layers are combined. Compared with the prior art, the manufacturing method of the present invention has a metal appearance by providing a conductive metal layer between the film layer and the substrate, and is sandwiched between the film and the film. The non-conductive metal layer between the layer and the substrate is not worn. The housing of the present invention has a stronger external attractiveness. [Embodiment] The manufacturing method of the housing according to a preferred embodiment of the present invention includes the following steps: 201102249 Providing a transparent film layer. The transparent film layer is made of propylene (PP), and the polystyrene is called a polycarbonate 0.125-0.175 mm 〇 phase film layer having a thickness of about ～ a layer of a film layer printed on a decorative layer. A decorative layer or a translucent ink layer can be formed by conventional screen printing. The decorative layer has a thickness of between 3.5 and 4.5. A non-conductive metal layer is disposed on the surface of the enamel layer. The non-conductive metal layer can be made by means of real or double-spraying. The dry material of the conductive metal layer can be selected from indium, tin, indium-tin alloy, indium, titanium, titanium carbide, Any one of materials such as aluminum crucible and stainless steel. The non-conductive metal layer The metallic appearance has a thickness therebetween. The non-conductive metal layer may be translucent or opaque. The non-conductive metal layer is non-conductive, and does not interfere with transmission or reception of radio frequency. A protective layer is disposed on the layer. The protective layer may be a transparent ink layer formed by screen printing. The ink is preferably an ultraviolet curing ink. To improve the erosion resistance of the protective layer in the subsequent injection molding of the substrate, The protective layer can be formed by multiple printing, for example, 7-8 printings. The printed ink is UV-cured after each printing. The thickness of the ink can be between 8-1 〇μηη per printing. It has high hardness and resistance to surname. It can resist the erosion of injection molded plastic when injection molding substrate, and ensure that the non-conductive metal layer is not damaged. The decorative layer, non-conductive metal layer and protection are formed. The transparent film layer of the layer is thermoformed into the shape of the edge of the shell to be formed. 201102249 A molding die is provided, the formed transparent film layer is placed in the mold, and a substrate is injection molded. The surface of the protective layer. The material for injection molding the substrate may be selected from polyethylene (PE), polyamine (PA), polycarbonate (PC), acrylonitrile-styrene-butadiene which are transparent or opaque. Any of plastics such as polymer (ABS), polymethyl methacrylate (PMMA), and polyethylene terephthalate (PET). See Figure 1 for a shell made by the above method. The body 10 includes a film layer 11 and a decorative layer 13 formed on a surface of the film layer 11, a non-conductive metal layer 15, a protective layer 17, and a substrate 19. The decorative layer 13 is a transparent or translucent color ink layer. The housing 10 is rendered in a colored appearance. The electrically non-conductive metal layer 15 can be translucent or opaque, which provides the housing 10 with a metallic appearance and gloss. The protective layer 17 is a transparent ultraviolet curable lacquer layer formed by multiple printing, and the substrate 19 is bonded to the surface of the protective layer 17 by injection molding. In a preferred embodiment of the present invention, the housing is formed by providing a non-conductive metal layer between the film layer and the substrate to give the housing a metallic appearance. And the non-conductive metal layer interposed between the film layer and the substrate is not worn. The housing of the present invention has a greater aesthetic appeal. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a casing of a preferred embodiment of the present invention. [Description of main component symbols] Housing 10 Thin film layer 11 Decorative layer 13 Non-conductive metal layer 15 Protective layer 17 Substrate 19