201102222 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種研磨砂輪，特別是一種具有活動式配重 塊，而可常態維持重心平衡的研磨砂輪。 【先前技術】 在如石材加工業或精密磨削工業中，研磨加工是相當重要的 步驟之一，而在研磨加工程序中所使用的研磨砂輪的轉動平衡更 關係著加工物件研磨哺確度。習用的研磨砂輪在使用上係與一 夾座結構組成為砂輪組，並將此研磨砂輪組ϋ定於研磨機座的旋 轉轴承上以進行研磨操作，在此砂輪組當中的夾座結構主要包括 一主夾盤及一次夾座，主夾盤具有環狀的凹部，凹部内可放置數 個配重塊。同時在次纽與主越之_成有_，用以供研磨 y'輪放置在:人夾座與主夾座之間，使研磨砂輪藉由砂輪失座裝設 於研磨機台的旋轉軸承上以供研磨操作。並且在研磨過程中，可 藉由改變配重塊在Μ盤凹勒的位置來達到研騎輪伴隨旋轉 抽承轉動時_態平衡’⑽免因研磨砂輪組在旋熟承上的重 量分佈不平均所造成的振動以及旋轉軸承損壞的問題。 然而這種主夾座上设置配重塊的方式雖可改善研磨砂輪在轉 動時的穩定性’但是卻鋪存在下舰點：首先，在研磨砂輪组 的設置上’研磨砂輪係透過主夾盤與次夾座的夾綱定，因此隨 著研磨操作時間的增加’將使研磨砂輪與主夾盤與次夾座之間的 結合緊密度降低’導致研磨砂輪於主夹盤與次夾座之間產生鬆 201102222 此時即使透過調整主夹盤配重塊的方式，亦無法對研磨砂輪 ，行平衡校正，飾影響研磨操作的效能。再者，由於配重塊係 又置於主夾盤上’其在進行配重塊位置的難過程中，係對於砂 輪體的重心進行調整，因此必須同時考量主夾盤、研磨砂輪 及人夾盤H喊材料差異性所造成的重量分佈錢尺寸準確 度的問題’進而使砂輪組的重心位置變得難以掌握而需要花費相 當時間進行微調。 齡軸目讀將配重塊直触置於研磨砂輪的設置方式，如日 本專利第1G28677G 1(JP1G28677()A)所揭*者，其係於研磨砂輪的 研磨盤上開設複數個螺孔，並設置有與螺孔相.配合的配重塊，然 後在研磨〜輪平衡板正的操作上，將配重塊依需求鎖合固定於這 些螺孔中。惟這鋪研磨砂輪進行平衡校正的方式，由於螺孔在 研磨盤上關㈣位置為固定，使配重塊的_位置受到限制， ^匕無法精確的調整研磨砂輪的重心。並且，由於需使用相當數 >量的配重塊鎖固於螺孔中’因此在調整彻砂輪重心的過輕中時 常會發生配重塊遺失掉落的問題。 同時’在研磨砂輪進行研磨加卫的過程中，通常會—併地使 用切削液增加研磨時加讀件與研磨砂輪之間的潤滑性，以提高 研磨砂輪的研磨能力，切削液並同時將研磨過程中所產生的磨屬 及雜質從研磨砂輪上去除，以避免雜朗及雜餘塞於研磨砂 輪的研磨片周圍，而影響研磨砂輪的研磨效能。一般在切削液的 使用上，係於研磨砂輪進行研磨時，藉由一切削液輸送裝置將切 201102222 削液從研磨砂輪之-側噴灑於研磨片上，藉以沖刷位於研磨片附 近的磨屑和雜質。_這種__供給方式需使賴外的輸送 裝置，造成設備成本的增加。並且由於切削液係由研磨砂輪之— 側進入’無法迅速的擴散流動輯有的研磨片上，而使切削液對 於研磨片的供給不平均’容易造成研磨砂輪上局部區域仍然存在 有磨屑和雜質的堆積’進喊損研磨砂輪的補效能和品質。 【發明内容】 鑒於以上的問題’本發明提供—種可觸態平衡及排屑之研 磨砂輪’細改良習用研磨砂輪在研麟作的過程巾，因為研磨 片的磨耗而造成研磨砂輪之重心的偏移以及f料磨砂輪所使用 的平衡校正方式過於繁雜，且無法確實掌握研磨砂輪重心位置等 問題。並且’本發關時改良習知研磨砂輪於研雜作時，切削 液無法直接且迅速的供給至所有的研磨#上，造成研磨砂輪上局 部區域容易堆積磨屑和雜質的問題。 本發明揭露一種可調動態平衡及排屑之研磨砂輪，係套設在 旋轉軸承上，此旋轉軸承並具有一切削液的出水口，用以供給 切削液至研磨砂輪上’本發明所娜之可調祕平衡及排屑之研 磨妙輪包括有-轉盤、複數個研磨片及數個配重塊。轉盤上具有 轴孔 溝槽、一相對的第一侧面及第二侧面、以及一侧邊， 侧邊位於二侧面之間並環設於二側面周緣，轉盤之軸孔貫穿第一 側面及第二側面，且轴孔套設於旋轉轴承上。複數個研磨片環設 於第一側面的外緣上，而溝槽則環設於轉盤上。複數個配重塊活 201102222 •動地設置於溝槽内，使轉盤可藉由調整各配重塊在溝槽内的位 置乂維持轉盤的重心在一定的位置上而保持可調動態平衡及排 屑之研磨砂輪的平衡狀態。 在本發明·賴另i實施雜中，可觸態平衡及排屑 之研磨妙麵套設在—旋轉軸承上，此旋轉軸承並具有—切削液 的出水口，用以供給切削液至可調動態平衡及·之研磨砂輪 上可調動態平衡及排屑之研磨砂輪包括有一轉盤、複數個研磨 # Μ、複數個配重塊及複數個導流片。轉盤上具有一轴孔、—溝槽、 二相對的第-側面及第二側面、以及—側邊，側邊位於二侧面曰之 間並環設於二側面周緣，轉盤之軸孔貫穿第一側面及第二側面， 且轴孔套設於旋轉軸承上。複數個研剌環設於第—側面的外緣 而溝槽則又於轉盤上。複數個配重塊活動地設置於溝槽内， 使轉盤可藉由調整各配重塊在溝槽内的位置，以維持轉盤的重心 在-定的位置上而保持可調動態平衡及制之研磨砂輪的平衡狀 態。複數個導流片以等間距的方式排列於轉盤的第一側面上，用 以導引切削液流動擴散至各個研磨片。 本發明所揭露之可_態平衡及_之研磨砂輪係於轉 溝槽内設置複數個活動式的配重塊，藉由調整配重塊在溝槽内的 位置而令可調動態平衡及御之研磨砂輪的重心保持一致， 使得可調_平衡蝴之研磨砂輪可_好嶋平衡盘動 態平衡。因財平概_之贿砂輪錢行研磨操作 時，可直接透過配重塊對可刪平衡侧之研磨砂輪上的重 201102222 量分佈進㈣整，令可觸態平衡及排叙研磨砂輪敎的在旋 轉軸承上轉動，使研磨效能獲得提升，同時可避免可觸態平衡 及排屑之研磨9輪因重心偏移使旋轉軸承的轴心偏離而產生振 動、毀壞的情形發生，並朗為配重塊直接的設置在可調動態平 衡及排屑之研料輪上，因此重塊係直接對可觸態平衡及排 屑之研磨砂輪的重心位置進行調整，而能快速且精確的掌握可調 動態平衡及排屑之研磨砂輪的平衡性。 再者’本發贿揭露的可觸態平衡及制之研磨砂輪，在 進行研磨操料係由可觸態平衡簡狀研磨砂輪財心位置 供給切削液，藉由可調動態平衡及排屑之研磨砂輪旋轉時的離心 力迅速的擴散至各個研磨片上，並配合呈傾斜設置的第一側面及/ 或導流片的導引’使切削液快速且平均的分散於研磨片，因此有 效提升切削液帶離磨屑及雜質的效率，以及可調動態平衡及排屑 之研磨砂輪研磨時的潤滑性。 以上之關於本發明内容之說明及以下之實施方式之說明係用 以不$色與解釋本發明之原理，並且提供本發明之專利申請範圍更 進一步之解釋。 【實施方式】 本發明所揭露之可調動態平衡及排屑之研磨砂輪係設置於一 研磨機座上，用以對一加工物件，如石材、半導體晶圓或研磨墊 專進行研磨加工，並且於研磨加工的過程中，配合可調動態平衡 及排屑之研磨砂輪之研磨片的磨耗，而機動性地調整可調動態平 201102222 衡及排屑之研磨砂輪上配重塊的位置，使可調動態平衡及排屑之 研磨砂輪的重心保持-致，藉以提升可調動態平衡及排屑之研磨 砂輪的研磨效能與品質。 請同時參閱「第1圖」和「第2圖」所示，本發明第一實施 例所揭露之可調動態平衡及排屑之研磨砂輪1〇包括有一轉盤^、 複數個研磨片12及複數個配重塊14。轉盤u上具有一轴孔ιη、 複數個螺孔112、二相對的第一側面113及第二側面114，以及一 鲁㈣115，側邊115係位於第一側面113及第二側面114之間，並 且環設在第-側面113及第二側面114的周緣。轉盤u上並具有 溝槽13 ’環设於轉盤η的第一侧面113上，且開設於軸孔⑴ 與研磨片12之間。軸孔U1貫穿於第一側面113及第二側面114, 複數個螺孔m同樣地貫穿第一侧面⑴及第二側面⑴，並等間 距環設於軸孔111周圍。轉盤u以軸孔⑴套設於一研磨機座(圖 鲁中未示)的旋轉軸承2〇上，並以螺絲3〇穿設過轉盤u上的螺孔 112 ’將可觸態平衡及排屑之研糾、輪10鎖S1於旋轉軸承20 上，以藉由旋轉軸承2〇帶動可調動態平衡及排屑之研磨砂輪1〇 轉動’而對加工物件進行研磨操作程序。 ㈤時為了在研㈣財增何調_平衡麟屑之研磨砂輪 10與加工物件之間的騎性，並避免研糾所產生的磨屑及雜質 隹積於了調動態平衡及排屑之研磨砂輪丄〇上造成可調動態平衡 及排屑之研磨砂輪的研磨、蝴能力下降。因此在旋轉轴承 穿°又過轴孔111之—端，具有複數個切肖懷出7jc口 21 ’用以供給 201102222 切削液至可觸態平衡及排屑之研磨砂輪！〇上以增加研磨時的潤 滑性，並沖刷去除可調動態平衡及排屑之研磨砂輪1〇上的磨屑及 雜質’使可調動態平衡及制之研磨砂輪1G可維持穩定的研磨品 質0 請繼續參閱「第1圖」和「第2圖」’可調動態平衡及排屑之 研磨砂輪10的複數個研磨片12環設於轉盤U之第一側面⑴的 外緣上JL研磨12係沿著平行於轉盤u的圓周方向排列，二 相鄰的研磨片12之間並具有—間隙’以便於使切削液及其所狹帶 的磨屑和雜質從可調動態平衡及排屑之研磨砂輪1〇上排出。因 此，為了使切削液所挾帶的磨屑和雜質能順利的排出於可調動態 平衡及排屑之研磨砂輪1G，如「第2圖」所示，可在研磨片^ 上設置複數個等間隔的磨料齒來達成此一目的，或是如「第3A圖」 和「第3B圖」所示，研磨片u以等間距排列的方式環設於轉盤 11之第一侧面113外緣，並分別將單一研磨片12的尺寸縮短或採 用圓柱狀的研磨片12 (如「第3B圖」所示），以增加相鄰二研磨片 12之間的_，又或者如「第3C圖」所示，將研磨片12傾斜一 角度’而朝同-方向傾斜設置於轉盤第—側面113的外緣，或是 .像「第3D圖」所示.，使相鄰的二研磨片12以相互垂直或朝相反 方向等間距的傾斜設置於轉盤第一侧自113料緣上，以藉由研 磨片12之間的間隙使切削液及其所挾帶的磨屑和雜質排出於可調 動態平衡及排屑之研磨砂輪10外。 ' 圖」’複數個 請同時參閱「第2圖」、「第4Α圖」和「第4Β 201102222 塊14設置在轉盤11的溝槽13内，-般採用三個配重塊14 以=動的方式活動設置於溝槽13内，並且在轉盤11的第 / 上，沿著溝槽13的邊'緣環設有複數個呈等間距排列的 =正刻度116 ’ __咖14的定⑽記，方便操作人員快 、、的將配重塊14固定於平衡位置。請配合「第圖」，配重塊 14具有螺^ 141及—滚珠142，魏重塊14上相鄰之二側面上 分別具有—n定孔ι43及—穿孔144，穿孔144係貫通至固定孔 田配重塊Η 5又置於溝槽13内時，配重塊Μ具有固定孔M3 的側表面145係露出於溝槽，且配重塊14具有穿孔⑷的側壁 146係與溝槽13之内壁面131相對應。201102222 VI. Description of the Invention: [Technical Field] The present invention relates to a grinding wheel, and more particularly to a grinding wheel having a movable weight, which can maintain a balance of center of gravity in a normal state. [Prior Art] In the stone processing industry or the precision grinding industry, grinding processing is one of the most important steps, and the rotational balance of the grinding wheel used in the grinding process is more related to the grinding accuracy of the workpiece. The conventional grinding wheel is composed of a grinding wheel set in use and a clamping seat structure, and the grinding grinding wheel set is fixed on the rotating bearing of the grinding machine base for grinding operation, and the clamping seat structure in the grinding wheel set mainly includes A main chuck and a primary holder, the main chuck has an annular recess, and a plurality of weights can be placed in the recess. At the same time, there is a _ in the second and the main _, for the grinding y' wheel is placed between: the person's holder and the main holder, so that the grinding wheel is installed on the grinding machine by the grinding wheel lost seat For the grinding operation. And during the grinding process, the weight distribution of the grinding wheel can be adjusted by changing the position of the weight in the groove of the disk. The balance of the grinding wheel is not affected by the weight distribution of the grinding wheel set. The vibration caused by the average and the problem of damage to the rotating bearing. However, the way of setting the weight on the main clamp seat can improve the stability of the grinding wheel when it rotates, but it is laid down in the lower point: firstly, the grinding wheel system passes through the main chuck on the setting of the grinding wheel set. With the clamping of the secondary holder, so as the grinding operation time increases 'will reduce the tightness of the bonding between the grinding wheel and the primary and secondary holders', resulting in the grinding wheel in the main and secondary holders At the same time, even if the weight of the main chuck is adjusted, the balance of the grinding wheel can not be corrected, and the effect of the grinding operation is affected. Furthermore, since the counterweight block is placed on the main chuck, it is adjusted in the difficulty of the position of the counterweight, and the center of gravity of the wheel body is adjusted. Therefore, the main chuck, the grinding wheel and the human clamp must be considered at the same time. The problem of the weight distribution accuracy of the weight distribution caused by the difference in the material of the disk H makes the position of the center of gravity of the grinding wheel set difficult to grasp and takes considerable time for fine adjustment. The aging axis reads the setting method of placing the weight directly on the grinding wheel, as disclosed in Japanese Patent No. 1G28677G 1 (JP1G28677()A), which is provided with a plurality of screw holes on the grinding disc of the grinding wheel. And a weighting block matched with the screw hole is arranged, and then in the positive operation of grinding the wheel balance plate, the weight blocks are fixedly fixed in the screw holes according to requirements. However, in this way, the grinding wheel is balanced and corrected. Since the screw hole is fixed on the grinding disc (4), the position of the weight is limited, and the center of gravity of the grinding wheel cannot be precisely adjusted. Moreover, since a considerable number of weighted weights are required to be locked in the screw holes, the problem that the weights are lost and dropped often occurs when the center of gravity of the grinding wheel is adjusted too lightly. At the same time, in the process of grinding and grinding the grinding wheel, it is common to use the cutting fluid to increase the lubricity between the reading and the grinding wheel during grinding to improve the grinding ability of the grinding wheel, and the cutting fluid will be ground at the same time. The abrasives and impurities generated in the process are removed from the grinding wheel to prevent the impurities and debris from being inserted around the grinding disc of the grinding wheel, which affects the grinding performance of the grinding wheel. Generally, in the use of the cutting fluid, when the grinding wheel is used for grinding, the cutting liquid 201102222 is sprayed from the side of the grinding wheel on the grinding piece by a cutting fluid conveying device, thereby scouring the grinding debris and impurities located near the grinding piece. . _ This kind of __ supply method needs to make the external conveying device, resulting in an increase in equipment costs. Moreover, since the cutting fluid enters from the side of the grinding wheel to the grinding piece which cannot be rapidly diffused and flows, the supply of the cutting fluid to the grinding piece is not uniform, and it is easy to cause wear debris and impurities in a local area on the grinding wheel. The accumulation of 'injection damage grinding wheel's complement performance and quality. SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a grinding wheel for the balance of the touch state and the chip removal of the chip. The polishing wheel of the conventional grinding wheel is used in the process of grinding the grinding wheel, and the center of gravity of the grinding wheel is caused by the abrasion of the grinding piece. The offset and the balance correction method used for the f-grinding wheel are too complicated, and it is impossible to accurately grasp the position of the center of gravity of the grinding wheel. Moreover, when the conventional grinding wheel was modified at the time of the customs clearance, the cutting fluid could not be directly and quickly supplied to all the grinding #, causing the problem that the local area on the grinding wheel easily accumulated grinding debris and impurities. The invention discloses a grinding wheel with adjustable dynamic balance and chip removal, which is sleeved on a rotary bearing and has a water outlet for cutting fluid for supplying cutting fluid to the grinding wheel. The grinding wheel with adjustable balance and chip removal includes a turntable, a plurality of abrasive sheets and a plurality of weights. The turntable has a shaft hole groove, an opposite first side and a second side, and one side, the side is located between the two sides and is disposed on the circumference of the two sides, and the shaft hole of the turntable penetrates the first side and the second side Side, and the shaft hole is sleeved on the rotary bearing. A plurality of abrasive ring rings are disposed on the outer edge of the first side, and the grooves are annularly disposed on the turntable. Multiple weights live 201102222 • Dynamically placed in the groove, the turntable can maintain the adjustable dynamic balance and row by adjusting the position of each weight in the groove to maintain the center of gravity of the turntable at a certain position The balance of the grinding wheel of the crumb. In the invention, the elliptical balance and the chipping effect of the chip are set on the rotary bearing, and the rotary bearing has a water outlet for the cutting fluid to supply the cutting fluid to the adjustable The dynamic balance and the grinding wheel with adjustable dynamic balance and chip removal include a turntable, a plurality of grinding #Μ, a plurality of weights and a plurality of deflectors. The turntable has a shaft hole, a groove, two opposite first side surfaces and a second side surface, and a side edge, the side edge is located between the two side turns and is disposed on the circumference of the two side surfaces, and the shaft hole of the turntable penetrates the first The side surface and the second side surface are sleeved on the rotary bearing. A plurality of mortar rings are disposed on the outer edge of the first side and the grooves are on the turntable. A plurality of weights are movably disposed in the grooves, so that the turntable can maintain the adjustable dynamic balance by adjusting the position of each weight in the groove to maintain the center of gravity of the turntable at a fixed position. The balance of the grinding wheel. A plurality of baffles are arranged on the first side of the turntable in an equidistant manner to guide the flow of the cutting fluid to spread to the respective abrasive sheets. The granulated balance wheel and the grinding wheel disclosed in the invention are provided with a plurality of movable weights in the groove, and the adjustable dynamic balance is adjusted by adjusting the position of the weight in the groove. The center of gravity of the grinding wheel is kept consistent, so that the adjustable grinding wheel of the balance butterfly can be balanced. Due to the fact that the company's bribes are used for grinding operations, it can be directly distributed through the weights on the weight of the grinding wheel on the balance side. The amount of weight can be balanced and the grinding wheel is aligned. Rotating on the rotary bearing improves the grinding efficiency, and at the same time avoids the balance of the contact state and the grinding of the chip. The 9-wheel grinding due to the center-of-gravity shift causes the vibration of the rotating bearing to deviate and the damage occurs. The weight is directly placed on the grinding wheel with adjustable dynamic balance and chip removal. Therefore, the weight is directly adjusted to the position of the center of gravity of the grinding wheel with adjustable balance and chip removal, and can be adjusted quickly and accurately. Balanced grinding wheel with dynamic balance and chip removal. In addition, 'the brittle balance disclosed by the bribe and the grinding wheel made by the bribe are supplied to the cutting fluid by the position of the tactile balance simple grinding wheel, by adjustable dynamic balance and chip evacuation. The centrifugal force during the rotation of the grinding wheel is rapidly spread to the respective polishing sheets, and the first side of the inclined arrangement and/or the guide of the baffle plate enables the cutting fluid to be quickly and evenly dispersed in the polishing sheet, thereby effectively improving the cutting fluid. The efficiency of the grinding wheel and impurities, as well as the lubricity of the grinding wheel with adjustable dynamic balance and chip removal. The above description of the present invention and the following description of the embodiments of the present invention are intended to explain the principles of the invention and to provide further explanation of the scope of the invention. [Embodiment] The adjustable dynamic balance and chip removal grinding wheel disclosed in the present invention is disposed on a grinding machine base for grinding a workpiece, such as a stone, a semiconductor wafer or a polishing pad, and In the process of grinding, with the grinding of the grinding wheel of the grinding wheel with adjustable dynamic balance and chip removal, the position of the weight on the grinding wheel of the adjustable grinding machine can be adjusted flexibly and flexibly. The center of gravity of the grinding wheel that adjusts the dynamic balance and the chip removal is maintained, so as to improve the grinding efficiency and quality of the grinding wheel with adjustable dynamic balance and chip removal. Please also refer to the "Fig. 1" and "Fig. 2". The adjustable grinding wheel and the chip removing grinding wheel 1 according to the first embodiment of the present invention include a turntable ^, a plurality of abrasive sheets 12 and a plurality of Counterweights 14. The turntable u has a shaft hole ιη, a plurality of screw holes 112, two opposite first side faces 113 and a second side face 114, and a ruthenium (115) 115. The side edge 115 is located between the first side face 113 and the second side face 114. And the ring is provided on the circumference of the first side surface 113 and the second side surface 114. The turntable u has a groove 13' disposed on the first side 113 of the turntable n and is disposed between the shaft hole (1) and the polishing pad 12. The shaft hole U1 penetrates through the first side surface 113 and the second side surface 114, and the plurality of screw holes m similarly penetrate through the first side surface (1) and the second side surface (1), and are equally spaced around the shaft hole 111. The turntable u is sleeved on a rotating bearing 2〇 of a grinding machine base (not shown in FIG. 2) with a shaft hole (1), and is screwed through a screw hole 112' on the turntable u to balance and arrange the touch state. The grinding and squeezing of the swarf, the wheel 10 lock S1 is on the rotary bearing 20, and the grinding operation procedure is performed on the workpiece by the rotary bearing 2 〇 driving the adjustable grinding wheel 1 〇 rotation of the adjustable dynamic balance and the chip removal. (5) In order to carry out research (4), what is the adjustment? Balance the riding between the grinding wheel 10 and the processed object, and avoid the grinding debris and impurities generated by the research and correction in the grinding dynamic balance and the grinding of the chip removal. The grinding wheel on the grinding wheel causes the adjustable dynamic balance and the grinding and grinding ability of the grinding wheel for chip removal. Therefore, at the end of the rotating bearing through the shaft hole 111, there are a plurality of cutting wheels with a 7jc port 21 ′ for supplying the 201102222 cutting fluid to the contactable balance and chip removal grinding wheel! The enamel is used to increase the lubricity during grinding, and to remove the grinding debris and impurities on the grinding wheel 1 of the adjustable dynamic balance and chip removal. Please continue to refer to "Figure 1" and "Figure 2". The plurality of abrasive sheets 12 of the grinding wheel 10 with adjustable dynamic balance and chip removal are ringed on the outer edge of the first side (1) of the turntable U. JL Grinding 12 Series Arranged in a circumferential direction parallel to the turntable u, there are gaps between the two adjacent abrasive sheets 12 to facilitate grinding of the cutting fluid and its tape from the adjustable dynamic balance and chip removal. The wheel is discharged on the top of the wheel. Therefore, in order to allow the grinding debris and impurities carried by the cutting fluid to be smoothly discharged to the grinding wheel 1G with adjustable dynamic balance and chip removal, as shown in "Fig. 2", a plurality of the polishing pieces can be provided. The abrasive teeth are spaced to achieve the purpose, or as shown in "3A" and "3B", the abrasive sheets u are arranged at equal intervals on the outer edge of the first side 113 of the turntable 11, and The size of the single abrasive sheet 12 is shortened or a cylindrical abrasive sheet 12 (as shown in "Fig. 3B") is used to increase the _ between the adjacent two abrasive sheets 12, or as in "3C" It is shown that the polishing sheet 12 is inclined at an angle 'and obliquely disposed in the same direction to the outer edge of the first side 113 of the turntable, or as shown in "3D", so that the adjacent two abrasive sheets 12 are mutually An equal or equal inclination in the opposite direction is disposed on the first side of the turntable from the edge of the 113 to allow the cutting fluid and the abrasive debris and impurities entrained therein to be discharged from the adjustable dynamic balance by the gap between the abrasive sheets 12. And the grinding wheel 10 for chip removal. 'Figure' 'Multiple, please refer to "2nd picture", "4th picture" and "4th Β 201102222 block 14 is set in the groove 13 of the turntable 11, generally using three weights 14 to = The mode activity is disposed in the groove 13, and on the /th of the turntable 11, along the edge of the groove 13, the edge ring is provided with a plurality of equal-diagonally arranged = positive scales 116 ' __ coffee 14 (10) It is convenient for the operator to fasten the weight 14 to the balance position. Please cooperate with the "figure", the weight 14 has a screw 141 and a ball 142, respectively, on the two adjacent sides of the Wei weight 14 Having a -n fixed hole ι43 and a through hole 144, the through hole 144 is penetrated to the fixed hole weight Η 5 and placed in the groove 13, the side surface 145 of the weight Μ having the fixing hole M3 is exposed in the groove And the side wall 146 of the weight 14 having the perforations (4) corresponds to the inner wall surface 131 of the groove 13.
月參閱第4Α圖」至「第4C圖」，配重塊14的滾珠142容 又；穿孔144内(如「第4匚圖」所示）’而螺检⑷係螺合於固定 孔M3 ’並於固定孔U3内抵靠於滚珠⑷。因此當轉動螺检⑷ 抵緊於/袞珠142時’將造成滚珠142朝向溝槽13之_面⑶移 動並緊迫於職13之内壁面131上，而姐重塊14被固定於溝 槽13内。相反地’當反向轉動螺栓141，解除螺栓141與滾珠⑷ 之間的抵緊狀態時’―併地解除滾珠142與溝槽之内壁面131的 緊Ht、使滚珠142脫離於溝槽之内壁面131，此時配重塊μ 即獲得釋放而可滑動於溝槽13内。 因此’請同時參閱「第1圖」、「第2圖」、「第4A圖」和「第 4B圖」’ #使用-全新的可調動態平衡及排狀研糾'輪1〇對一 加工物件(圖中未示)進行研磨_時，由於設置於轉盤 11之第一 11 201102222 側面H3上的研磨片12尚未受到磨損，因此在起始狀態下，配重 塊14於可調動態平衡及排屑之研磨砂輪1〇上的設置位置，係以 相互對稱(等間隔)的關係固定於溝槽.13内，以維持可調動態平衡 及排屬之研磨砂輪1〇的重…使可調_平衡及漏之研磨砂輪 10平衡地的設置在旋轉轴承2〇上。 當可調動態平衡及排屑之研磨砂輪1〇隨著旋轉轴承2〇的運 轉而對加工物件進行研磨時，隨著操作時間的增加，轉盤^之第 -側面⑴上的研磨片12遂逐漸的受到磨損，且由於^固研磨片 所受刺減不同，較研磨μ 12在可調祕平衡及排屑 之研磨雜H)上的轉讀斜均，_射觸料衡及排屑 之研磨砂輪1G的重心產生偏移。此時可藉由調整各個配重塊14 在溝槽13内的位置’直接的使可調動態平衡及排屑之研磨砂輪川 保持與起始狀態相同的重心位置，轉持可觸態平衡及排屑之 研磨砂輪H)在旋轉軸承20上的旋轉穩定性，使研磨加工品質與 效能獲得提升，並可避免因可觸態平衡及排叙研磨砂輪的 重心不穩，造成旋轉軸承20晃動而使研磨機座損壞的情形發生。 本發明於可調㈣平衡及之研磨砂輪1()上㈣可調整的 配重塊14,藉由改變配重塊14在可鶴態平衡及排屑之研磨砂輪 10上的分佈位置，直接的對可調動態平衡及排肩之研磨砂輪 進行重〜的罐’因此鮮.使可鶴態平衡及觸之研磨砂 輪10保持良好的靜態平衡與動態平衡。並且配重塊14在可調動 態平衡及排屬之研磨砂輪10上的設置方式，除了如「第2圖」所 12 201102222 示，裝配於轉盤u之第—側面113,且位於軸孔iu與 =間的設置方式外’亦可如「第5A圖」所示，將溝槽 :於轉盤η上第一侧面„3的外緣，使研磨一二 "配重職之間。或是如「第5Β圖」和「第5C圖」所示，分別 將溝槽13秘設置於轉盤u的側邊ιΐ5和第二側面…上Referring to Figure 4 to Figure 4C, the ball 142 of the weight 14 is again; the hole 144 is inside (as shown in Figure 4) and the screw (4) is screwed to the fixing hole M3 ' And abut against the ball (4) in the fixing hole U3. Therefore, when the turning screw (4) abuts against the bead 142, 'the ball 142 will be moved toward the face (3) of the groove 13 and pressed against the inner wall 131 of the job 13, and the weight 14 is fixed to the groove 13 Inside. Conversely, when the bolt 141 is reversely rotated to release the abutting state between the bolt 141 and the ball (4), the tightness Ht of the ball 142 and the inner wall surface 131 of the groove is released, and the ball 142 is disengaged from the groove. The wall 131, at this time, the weight μ is released and slidable in the groove 13. Therefore, please refer to "1st picture", "2nd picture", "4A picture" and "4B picture" at the same time. #使用-New adjustable dynamic balance and row-like research and correction' wheel 1〇 When the object (not shown) is ground _, since the abrasive sheet 12 disposed on the side surface H3 of the first 11 201102222 of the turntable 11 has not been worn, in the initial state, the weight 14 is adjusted in dynamic balance and The position of the grinding wheel 1 on the chip is fixed in the symmetry (equal interval) in the groove .13 to maintain the adjustable dynamic balance and the weight of the grinding wheel 1 使The balance grinding wheel 10 is equilibrated on the rotary bearing 2〇. When the grinding wheel 1 of the adjustable dynamic balance and chip removal is ground with the operation of the rotary bearing 2〇, the grinding piece 12 on the first side (1) of the turntable is gradually increased as the operation time increases. It is subject to wear and tear, and because of the different punctures of the solid-grinding abrasive sheet, it is more than the grinding and tilting of the grinding μ 12 in the adjustable balance and the grinding debris H), the grinding of the measuring material balance and the chip removal. The center of gravity of the grinding wheel 1G is offset. At this time, by adjusting the position of each weight 14 in the groove 13, the adjustable dynamic balance and the grinding wheel of the chip removal can be directly maintained at the same center of gravity as the initial state, and the tactile balance can be maintained. The rotation stability of the grinding wheel H) on the rotary bearing 20 improves the quality and performance of the grinding process, and avoids the instability of the center of gravity of the grinding wheel due to the balance of the touch and the rotation of the grinding wheel. Damage to the grinding machine base occurs. The invention is capable of adjusting the weight distribution block 14 on the adjustable grinding wheel 1 () and the adjusting weight of the grinding wheel 1 by directly changing the distribution position of the weighting block 14 on the grinding wheel 10 of the balance of the crane state and the chip removal. The tank with the adjustable dynamic balance and the shoulder grinding wheel is heavy ~ so fresh. The balance of the crane and the grinding wheel 10 maintain a good static balance and dynamic balance. And the weighting block 14 is arranged on the adjustable dynamic balance and the row of the grinding wheel 10, except as shown in the "Fig. 2" 12, 201102222, which is mounted on the first side 113 of the turntable u and located in the shaft hole iu and The setting mode between the two can also be as shown in Figure 5A. The groove is: the outer edge of the first side „3 on the turntable η, so that the grinding is one or two. As shown in Fig. 5 and Fig. 5C, the grooves 13 are respectively disposed on the side ι 5 and the second side of the turntable u.
樣的可藉由調整配重塊14在溝槽13内的位置，來達到維持可調 動態平衡及排屑之研磨砂輪1〇重心的目的。 如第6圖」和「第7圖」所示為本發明第二實施例可調動 態平衡及·之研磨砂輪之結構示意圖。本發明所揭露之第二實 %例與第—實施例在結構上大致相同，以下僅就兩者間之差異加 以_。本發明第二實補所揭露之可觸態平衡及排屑之研磨 砂輪10包括有-轉盤u、複數個研磨片12、複數個配重塊Μ、 及複數個導机>；15。轉盤^上具有—轴孔lu、複數個螺孔⑴、 二相對的第一側面113及第二侧面114,以及-側邊115,側邊115 係位於第-側面113及第二側面114之間，並且環設在第一側面 113及第二側面114的周緣。轉盤u上並具有一溝槽，環設於 轉盤11的第一側面113上，且開設於軸孔111與研磨片12之間。 其中軸孔111貫穿於第一側面113及第二側面114,複數個螺孔112 同樣地貫穿第—側© 113及第二侧面114,並㈣距環設於軸孔 111周圍。轉盤11以軸孔111套設於旋轉軸承20上，並以螺絲3〇 穿設過轉盤11上的螺孔112 ,將可調動態平衡及排屑之研磨砂輪 10鎖固於旋轉軸承上，以藉由旋轉轴承2〇帶動可調動態平衡及排 13 201102222 屑之研磨砂輪10轉動，而對加工物件進行研磨操作程序。 同時為了在研磨過程中增加可調動態平衡及排屑之研磨砂輪 10與加工物件之間的潤滑性，並避免研磨時所產生的磨屑及雜質 堆積於可簡齡衡麟狀研磨砂輪10上，造成可調動態平衡 及排屑之研磨砂輪1㈣研磨、切難力下降。因此在旋轉軸承20 穿設過軸孔U1之—端，具有複數個切削液出水口 2卜用以供給 切削液至可調動態平衡及排屑之研磨砂輪10上以增加研磨時的潤 滑性，並沖刷去除可調_平衡及之研磨砂輪1G上的磨屑及 雜質’使可調動態平衡及排屑之研射輪1G可維持穩定的研磨口 質。 。。 可調動態平衡及排屑之研磨砂輪1G的複數個研磨片12環設 於轉盤11之第—_ 113的外緣上，且研磨片12係沿著平行於 轉盤11 _周方向排列，二相鄰的研剌12之間並具有一間隙， 並且將研磨片12上的複數個研磨齒以等間關方式設置，以便於 使切削液及其所挾帶的磨屑和雜f，經由這些間隙與間隔排出於 可調動態平衡及排屑之研磨砂輪1〇外。 並且，如「第7圖」所示，為了使切削液能快速且均勻的輸 送至研磨>1 12’在健11之第—側面113上設置有複數個導流片 15 ’導流片15係位於研磨片12與轴孔ιη之間，且導流片的 兩端分別對應於研磨片12及軸孔⑴，並朝著同—方向傾斜一角 度的排列於第一側面113上》 請參閱「第7圖」至「第8圖」，複數個配重塊14設置在轉 201102222 盤U的漢槽13内一般採用三個配重塊14以可相對滑動的方式， -_的設置於溝槽13内’並且在轉盤u的第一侧面113上，沿 著細η❺邊緣環設有複數锻賴距排列的校正刻度116，用 以做為配重塊14的定位標記，方便操作人員快速的將配重塊14 口定於平衡位置。如「第8圖」所示，配重塊14具有—螺检⑷ 及一滾珠142 ’當配重塊14設置於溝槽13内時，螺栓141係穿設 於配重塊14露出於溝槽13之表面145,而滾珠142則活動的穿設 •於配重塊14的側壁146上，並與溝槽13之内壁面131相對應。 當轉動螺检141抵緊於滾珠142時，將造成滾珠142朝向溝 槽13之内壁面131移動並緊迫於溝槽13之内壁面131上，而使 配重塊14被固疋於溝槽13内。相反地，當反向轉動螺栓141，解 除螺栓141與滾珠142之間的抵緊狀態時，一併地解除滚珠142 與溝槽13之内壁面131的緊迫狀態，使滾珠142脫離於溝槽13 之内壁面131 ’此時配重塊14即獲得釋放而可滑動於溝槽13内。 • 因此，請同時參閱「第6圖」至「第8圖」，當使用一全新的 可調動態平衡及排屑之研磨砂輪10對一加工物件(圖中未示)進行 研磨操作時，由於設置於轉盤U之第一侧面113上的研磨片12 尚未叉到磨損，因此在起始狀態下，配重塊14於可調動態平衡及 排屬之研磨砂輪10上的設置位置，係以相互對稱(等間隔)的關係 固定於溝槽13内，以維持可調動態平衡及排屑之研磨砂輪1〇的 重心，使可調動態平衡及排屑之研磨砂輪10平衡地的設置在旋轉 軸承20上。 15 201102222 當可調動態平衡及排紅研磨砂輪10隨雜轉麻2〇的運 轉而對加工物件進行研磨時，切削液(圖中未示)經由設置於旋轉軸 承20上的切削液出水口 21輸送至可調動態平衡及排屑之研磨砂 輪10上，並受到可調動態平衡及排屑之研磨砂輪10旋轉時所產 生的離心力以及導流片15的導引，使域液從可觸態平衡及排 屑之研磨砂輪1〇的中央位置快速且平均的分散至各個研磨片 12。因此，在研磨過程中，從研磨片12上脫落的碎屑以及加工物 件上脫離的磨屑及雜質，受到切削液的沖刷而從研磨片12之間的 間隙流出於可調動態平衡及排屑之研磨砂輪1〇外，避免研磨片 受到這些磨屑與雜質的堆積而使研磨片12的研磨效能降低的問 題，並有效防止可調動態平衡及排屑之研磨砂輪1〇因為重量分佈 不平均，而產生重心偏移的情形發生。 如「第9圖」所示，在本發明第二實施例所揭露的可調動態 平衡及排屑之研磨砂輪10中，為了使切削液從可調動態平衡及排 屑之研磨砂輪10的中心位置擴散至研磨片12的速度加快，可將 可調動態平衡及排屑之研磨砂輪10之轉盤11上的第一侧面113 設置為朝向軸孔傾斜一角度的導斜面，藉由第一側面113於可調 動態平衡及排屑之研磨砂輪10上所形成的傾斜結構，使切削液在 可調動態平衡及排屑之研磨砂輪10的旋轉過程中，能直接且迅速 的流動至各個研磨片12的位置，以帶離集中於研磨片12附近的 磨屑與雜質。此外，亦可配合導流片15設置於第一側面113上的 ^歹】方式來達到此一目的。如「第l〇A圖」所示，複數個導流片 201102222 、15與研磨片12之間呈相互垂直的關係設置於第一側面113上。或 .是如「第10B圖」所示，複數個導流片15係以傾斜一角度的方式， 傾斜排列於第一側面m上，並且相鄰的二導流片15之間細向 相反方向傾斜設置。 請再次參閱「第6圖」和「第7圖」’同樣地，隨著操作時間 的增加’轉盤之第一側面113上的研磨片12逐漸的損耗，且 由於各個研磨片12所受到的損耗程度不同，導致研磨片在可 •調動態平衡及排屑之研磨砂輪10上的重量分佈不平均，進而使可 調動態平衡及排屑之研磨砂輪10的重心產生偏移。此時可藉由調 整各個配重塊14在溝槽13内的位置，以保持可調動態平衡及排 屑之研磨砂輪K)在旋轉軸承20上的重心位置，使可調動態平衡 及排屑之研磨砂輪10在旋轉軸承2〇上維持旋轉的穩定性，進而 使研磨加U質與效能獲得提升，並避免时觸鮮衡及排屑 之研磨砂輪10的重心不穩，造成旋轉軸承2〇晃動而使研磨機座 損壞的情形發生。 本發明所揭露之可調動態平衡及制之研磨砂輪上開設有一 溝槽’並且於溝槽内設Μ數個活動式配重塊，藉由調整配重塊 在賴内的位置使可調動態平衡及排屑之研磨砂輪的重心位置保 持-致’使可觸態平衡及之研磨砂輪轉良好的靜態平衡 ^動態平衡，目此當可觸態平衡及制之研磨砂輪在進行研磨 操作時’可直接透過配4塊對可觸態平衡及排屑之研磨砂輪的 實際重量分佈進行調整，以確實的掌握可觸態平衡及排屑之研 17 201102222 磨砂輪的重心位置，而令可調動態平衡及排屑之研磨砂輪穩定的 在旋轉軸承上轉動’使研磨效能獲得提升，同時可避免可調動態 平衡及排屑之研磨石少輪因重心偏移使旋轉軸承的軸心偏離而產生 振動、毀壞的情形發生。 並且，在可調動態平衡及排屑之研磨砂輪進行研磨操作時， 透過旋轉軸承從可調動態平衡及排屑之研磨砂輪的中心位置供給 切削液，藉由旋轉軸承轉動時所產生的離心力，使切削液擴散至 可調動態平衡及排屑之研磨砂輪的研磨片，以沖刷並帶離研磨時 所產生的磨屑與雜質，可防止磨屑與雜質堆積於研磨片周圍而影 響研磨片的研磨效率’此外在可調_平衡簡叙研磨砂輪上 進-步設置有導流片及/或傾斜設置的第一側面，使切削液在擴散 至研磨片的過程中，受到導流片及/或傾斜設置的第一侧面的導 引，旎更加快速的流動至研磨片，以增加可調動態平衡及排屑之 研磨砂輪在研磨時的潤滑性，並將磨屑及雜質從可調動態平衡及 排屑之研磨砂輪上帶離，使可調動態平衡及排屑之研磨砂輪具有 良好的研磨效能及品質。 雖然本發明之實施例揭露如上所述，然並非用以限定本發 明任何熟習相關技藝者，在不脫離本發明之精神和範圍内，舉 凡依本發明申請範圍所述之形狀、構造、特徵及精神當可做些許 之變更，因此本發明之專利保護範圍須視本說明書所附之申請專 利範圍所界定者為準。 【圖式簡單說明】 201102222 '第1圖為本發明第一實施例之立體組合示意圖； 第2圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪之結 構示意圖； 第3A、3B圖為本發明第一實施例可調動態平衡及排屑之研磨砂 輪的研磨片呈等間距排列之結構示意圖； 第3C圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪的 研磨片朝同一方向傾斜設置之結構示意圖； • 第3D圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪的 研磨片朝相反方向傾斜設置之結構示意圖； 第4A圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪之 剖面示意圖； 第4B圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪之 局部放大示意圖； • 第4C圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪之 局部分解示意圖； 第SA圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪之 研磨片設置於軸孔與溝槽之間之剖面示意圖； 第SB圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪之 配重塊設置於研磨砂輪側邊之剖面示意圖； 第5C圖為本發明第一實施例可調動態平衡及排屑之研磨砂輪之 配重塊設置於研磨砂輪第二側面之刮面示意圖； 第6圖為本發明第二實施例之立體組合示意圖； 201102222 態平衡及排叙研磨砂輪之結 第7圖為本發明第二實施例可調動 構示意圖； 第8圖為本發二實施例可調動態平衡及排屑之研磨砂卜 部剖面示意圖； /免之馬 第9圖為本發明第二實關可觸態平衡麟屑之研磨砂輪之轉 盤具有呈傾斜設置的第一侧面之結構示意圖； 第10A圖為本發明第二實施例可調動態平衡及排屑之研磨砂輪之 導流片垂直於研磨片排列之結構示意圖；以及 第10B圖為本發明第二實施例可調動態平衡及排屑之研磨砂輪之 導流片朝相反方向傾斜設置之結構示意圖。 【主要元件符號說明】 10 可調動態平衡及排屑之研磨砂輪 11 轉盤 111 軸孔 112 螺孔 113 第一侧面 114 第二側面 115 侧邊 116 校正刻度 12 研磨片 13 溝槽 131 内壁面 20 201102222 14 配重塊 141 螺栓 142 滾珠 143 固定孔 144 穿孔 145 表面 146 側壁 15 導流片 20 旋轉軸承 21 切削液出水口 30 螺絲 21The purpose of maintaining the center of gravity of the grinding wheel with adjustable dynamic balance and chip removal can be achieved by adjusting the position of the weight 14 in the groove 13. Fig. 6 and Fig. 7 are schematic views showing the structure of the grinding wheel which can adjust the dynamic balance and the second embodiment of the present invention. The second embodiment of the present invention is substantially identical in structure to the first embodiment, and only the difference between the two is added _. The grinding wheel 10 of the touchable balance and chip removal disclosed in the second embodiment of the present invention includes a turntable u, a plurality of abrasive sheets 12, a plurality of weights Μ, and a plurality of guides > The turntable has a shaft hole lu, a plurality of screw holes (1), two opposite first side faces 113 and second side faces 114, and a side edge 115, and the side edges 115 are located between the first side face 113 and the second side face 114. And ringing on the circumference of the first side surface 113 and the second side surface 114. The turntable u has a groove formed on the first side 113 of the turntable 11 and between the shaft hole 111 and the polishing pad 12. The shaft hole 111 is inserted through the first side surface 113 and the second side surface 114, and the plurality of screw holes 112 are similarly penetrated through the first side 113 and the second side surface 114, and (4) are disposed around the shaft hole 111 from the ring. The turntable 11 is sleeved on the rotary bearing 20 with the shaft hole 111, and is screwed through the screw hole 112 of the turntable 11 to lock the grinding wheel 10 with adjustable dynamic balance and chip removal to the rotary bearing. By rotating the bearing 2〇 to drive the adjustable dynamic balance and the grinding wheel 10 of the 201102222 chip, the grinding operation procedure is performed on the workpiece. At the same time, in order to increase the lubricity between the grinding wheel 10 and the workpiece during the grinding process, and to prevent the grinding debris and impurities generated during the grinding from accumulating on the simple and balanced grinding wheel 10 The grinding wheel 1 (4) which causes the adjustable dynamic balance and chip removal is ground and the digging force is reduced. Therefore, the rotary bearing 20 is disposed at the end of the shaft hole U1, and has a plurality of cutting fluid outlets 2 for supplying the cutting fluid to the grinding wheel 10 with adjustable dynamic balance and chip removal to increase the lubricity during grinding. And scouring removes the adjustable _ balance and the grinding debris and impurities on the grinding wheel 1G' so that the adjustable dynamic balance and the chip removal wheel 1G can maintain a stable grinding quality. . . The plurality of abrasive sheets 12 of the grinding wheel 1G with adjustable dynamic balance and chip removal are arranged on the outer edge of the first to the 113th of the turntable 11, and the abrasive sheets 12 are arranged along the parallel direction of the turntable 11 - two phases. There is a gap between the adjacent mortars 12, and a plurality of grinding teeth on the abrasive sheet 12 are arranged in an isometric manner so as to facilitate the cutting fluid and the abrasive debris and impurities f of the cutting fluid. It is discharged from the grinding wheel with adjustable dynamic balance and chip removal. Further, as shown in Fig. 7, in order to enable the cutting fluid to be quickly and uniformly conveyed to the polishing > 1 12', a plurality of baffles 15 'the deflector 15 are provided on the first side 113 of the finger 11 It is located between the polishing sheet 12 and the shaft hole ιη, and the two ends of the deflector correspond to the polishing sheet 12 and the shaft hole (1), respectively, and are arranged at an angle to the same direction on the first side 113. From "Fig. 7" to "Fig. 8", a plurality of weights 14 are arranged in the Hankou 13 of the 201102222 disk U. Generally, three weights 14 are used for relative sliding, and the -_ is arranged in the groove. In the groove 13' and on the first side 113 of the turntable u, a plurality of correction marks 116 arranged in a plurality of forging distances are arranged along the thin ❺ ❺ edge ring for use as a positioning mark of the weight 14 for the operator to quickly Set the counterweight 14 to the equilibrium position. As shown in FIG. 8, the weight 14 has a screw check (4) and a ball 142'. When the weight 14 is disposed in the groove 13, the bolt 141 is threaded through the weight 14 and exposed to the groove. The surface 145 of the 13 is traversed, and the ball 142 is movably disposed on the side wall 146 of the weight 14 and corresponds to the inner wall surface 131 of the groove 13. When the rotation screw 141 is pressed against the ball 142, the ball 142 is moved toward the inner wall surface 131 of the groove 13 and pressed against the inner wall surface 131 of the groove 13, so that the weight 14 is fixed to the groove 13 Inside. Conversely, when the bolt 141 is reversely rotated to release the abutting state between the bolt 141 and the ball 142, the pressing state of the ball 142 and the inner wall surface 131 of the groove 13 is released collectively, and the ball 142 is disengaged from the groove 13 The inner wall surface 131' is now released and slidable within the groove 13. • Therefore, please refer to “Picture 6” to “8” at the same time, when using a new adjustable dynamic balance and chip removal grinding wheel 10 to grind a workpiece (not shown), The abrasive sheet 12 disposed on the first side 113 of the turntable U has not been forked to wear, so in the initial state, the weights 14 are disposed on the adjustable dynamic balance and the arranged grinding wheel 10, which are mutually A symmetrical (equal spacing) relationship is fixed in the groove 13 to maintain the center of gravity of the grinding wheel 1 that can adjust the dynamic balance and the chip removal, so that the adjustable dynamic balance and the chip removing grinding wheel 10 are balancedly arranged in the rotary bearing 20 on. 15 201102222 When the adjustable dynamic balance and the red grinding wheel 10 grind the workpiece with the operation of the hybrid grinding wheel, the cutting fluid (not shown) passes through the cutting fluid outlet 21 provided on the rotary bearing 20. It is conveyed to the grinding wheel 10 with adjustable dynamic balance and chip removal, and is subjected to the centrifugal force generated by the adjustable dynamic balance and the chip removing grinding wheel 10 and the guiding of the baffle 15 to make the domain liquid from the touchable state. The center position of the grinding wheel for balancing and chipping is rapidly and evenly distributed to the respective polishing sheets 12. Therefore, during the grinding process, the debris falling off from the polishing sheet 12 and the abrasive chips and impurities detached from the workpiece are washed by the cutting fluid and flow out from the gap between the polishing sheets 12 to the adjustable dynamic balance and the chip discharge. The grinding wheel is 1 ,, to avoid the problem that the grinding piece is subjected to the accumulation of these grinding debris and impurities, so that the grinding performance of the polishing piece 12 is lowered, and the grinding wheel 1 with adjustable dynamic balance and chip removal is effectively prevented, because the weight distribution is uneven. And the situation in which the center of gravity shift occurs occurs. As shown in FIG. 9, in the adjustable dynamic balance and chip removal grinding wheel 10 disclosed in the second embodiment of the present invention, in order to make the cutting fluid from the center of the grinding wheel 10 with adjustable dynamic balance and chip removal The speed at which the position is spread to the polishing sheet 12 is increased, and the first side surface 113 of the turntable 11 of the grinding wheel 10 with adjustable dynamic balance and chip removal can be disposed as a guide inclined surface inclined at an angle toward the shaft hole by the first side 113 The inclined structure formed on the grinding wheel 10 with adjustable dynamic balance and chip removal enables the cutting fluid to flow directly and rapidly to the respective polishing sheets 12 during the rotation of the grinding wheel 10 with adjustable dynamic balance and chip removal. The position is to bring away the grinding debris and impurities concentrated near the abrasive sheet 12. In addition, the purpose can also be achieved by the manner in which the baffle 15 is disposed on the first side 113. As shown in "Fig. 1A", a plurality of baffles 201102222, 15 and the polishing sheet 12 are disposed on the first side 113 in a mutually perpendicular relationship. Or, as shown in FIG. 10B, the plurality of baffles 15 are obliquely arranged on the first side surface m at an oblique angle, and the opposite directions between the adjacent two guide vanes 15 are opposite to each other. Tilt setting. Please refer to "Fig. 6" and "Fig. 7" again. Similarly, as the operation time increases, the abrasive sheet 12 on the first side 113 of the turntable is gradually lost, and the wear due to each of the abrasive sheets 12 is lost. The degree of difference causes the unevenness of the weight distribution of the abrasive sheet on the grinding wheel 10 which can adjust the dynamic balance and the chip removal, thereby shifting the center of gravity of the grinding wheel 10 with adjustable dynamic balance and chip removal. At this time, the position of each weight 14 in the groove 13 can be adjusted to maintain the position of the center of gravity of the grinding wheel K) with adjustable dynamic balance and chip removal, so that the adjustable dynamic balance and chip removal can be adjusted. The grinding wheel 10 maintains the stability of the rotation on the rotating bearing 2〇, thereby improving the grinding quality and the efficiency, and avoiding the instability of the center of gravity of the grinding wheel 10 which is in contact with the fresh chip and the chip removing, resulting in a rotating bearing 2〇 Shaking causes the grinding machine base to be damaged. The adjustable dynamic balance disclosed in the invention has a groove formed on the grinding wheel and a plurality of movable weights are arranged in the groove, and the adjustable dynamics are adjusted by adjusting the position of the weight in the lining The position of the center of gravity of the grinding wheel for balancing and chip removal is maintained - resulting in a balance of the touchable state and a good static balance of the grinding wheel. Dynamic balance, when the balance can be achieved and the grinding wheel is made to perform the grinding operation. It can be adjusted directly through the distribution of the actual weight distribution of the grinding wheel with the balance of the touchable balance and the chip removal, so as to accurately grasp the position of the center of gravity of the grinding wheel and the adjustable center of the grinding wheel. Balanced and chip-removing grinding wheel rotates stably on the rotating bearing' to improve the grinding efficiency, while avoiding the adjustable dynamic balance and the chip removal of the grinding wheel. The wheel is offset by the center of gravity of the rotating bearing. The situation of destruction occurred. Moreover, in the grinding operation of the grinding wheel with adjustable dynamic balance and chip removal, the cutting fluid is supplied from the center position of the grinding wheel with adjustable dynamic balance and chip removal through the rotary bearing, and the centrifugal force generated by the rotation of the rotary bearing is The grinding disc is diffused to the grinding disc of the grinding wheel with adjustable dynamic balance and chip removal to wash away and remove the grinding debris and impurities generated during the grinding, thereby preventing the grinding debris and impurities from accumulating around the grinding disc and affecting the grinding disc. Grinding efficiency 'In addition, the first side of the deflector and/or the inclined side is arranged on the adjustable_balanced grinding wheel, so that the cutting fluid is diffused into the grinding piece, and is guided by the deflector and/or Or the guiding of the first side of the inclined setting, the 旎 flows more quickly to the grinding sheet to increase the lubricity of the grinding wheel with adjustable dynamic balance and chip removal during grinding, and adjust the grinding debris and impurities from the adjustable dynamic balance And the grinding wheel on the chip is separated, so that the grinding wheel with adjustable dynamic balance and chip removal has good grinding efficiency and quality. Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the scope of the present invention, and the shapes, structures, features and The spirit of the invention is subject to change without departing from the scope of the invention as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a first embodiment of the present invention; FIG. 2 is a schematic view showing the structure of a grinding wheel with adjustable dynamic balance and chip removal according to a first embodiment of the present invention; 3B is a schematic structural view showing the grinding pieces of the grinding wheel with adjustable dynamic balance and chip removal in an equal interval according to the first embodiment of the present invention; FIG. 3C is a grinding wheel with adjustable dynamic balance and chip removal according to the first embodiment of the present invention; FIG. 3D is a structural schematic view showing the grinding piece of the grinding wheel with adjustable dynamic balance and chip removal in the opposite direction according to the first embodiment of the present invention; FIG. 4A is a schematic view BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4B is a schematic partial enlarged view of a grinding wheel with adjustable dynamic balance and chip removal according to a first embodiment of the present invention; FIG. 4B is a partial enlarged view of a grinding wheel with adjustable dynamic balance and chip removal according to a first embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A partial exploded view of a grinding wheel with adjustable dynamic balance and chip removal according to a first embodiment of the present invention; Figure SA is a view of adjustable dynamic balance and chip removal of the first embodiment of the present invention A cross-sectional view of the grinding wheel of the grinding wheel is disposed between the shaft hole and the groove; FIG. SB is a schematic cross-sectional view of the weighting block of the grinding wheel with adjustable dynamic balance and chip removal disposed on the side of the grinding wheel according to the first embodiment of the present invention FIG. 5C is a schematic view showing the scraping surface of the grinding wheel of the adjustable dynamic balance and the chip removing grinding wheel disposed on the second side of the grinding wheel according to the first embodiment of the present invention; FIG. 6 is a perspective combination of the second embodiment of the present invention; Fig. 7 is a schematic diagram of an adjustable structure of a second embodiment of the present invention; Fig. 8 is a schematic cross-sectional view of an abrasive sand portion of an adjustable dynamic balance and chip removal according to the second embodiment of the present invention; FIG. 9 is a schematic view showing the structure of the first side surface of the second embodiment of the present invention, wherein the turntable of the grinding wheel has a tilted arrangement; FIG. 10A is a second embodiment of the present invention. The schematic diagram of the guide vane of the grinding wheel for balance and chip removal is perpendicular to the arrangement of the grinding disc; and FIG. 10B is the guide vane of the grinding wheel with adjustable dynamic balance and chip removal according to the second embodiment of the present invention. Instead of the inclined direction schematic structure. [Main component symbol description] 10 Adjustable dynamic balance and chip removal grinding wheel 11 Turntable 111 Shaft hole 112 Screw hole 113 First side 114 Second side 115 Side 116 Correction scale 12 Abrasive sheet 13 Groove 131 Inner wall surface 20 201102222 14 Counterweight 141 Bolt 142 Ball 143 Mounting hole 144 Perforation 145 Surface 146 Side wall 15 Guide piece 20 Swivel bearing 21 Cutting fluid outlet 30 Screw 21