201108884 * 六、發明說明： • 【發明所屬之技術領域】 [0001] 本發明係關於一種印刷電路板，特別係—種軟性電路板 【先前技術】 〇 〇 [0002]軟性電路板是用柔性的絕緣基材製成的印刷電路板，具 有諸多硬性印刷電路板不具備的優點。例如軟性電路板 厚度較薄’可自由弯曲、捲繞、折疊，可依照空間佈局 要求任意安排’並於三維空間任意移動和伸縮，從而達 Jtc器件敦配和導線連接的一體化。利用軟性電路板可 大大縮小電子產品的體積，適用電子產品向高密度小 =、高可靠性方向發展的需要。故，軟性電路板於航 玉、軍事、移動通訊、手提電腦、電腦週邊、pM、數位 相機等領域或產品上得到了廣泛的應用。 [0003] =軟性電路板厚度極薄，而使位於上層電路板上的傳 :傳輸:層接地面的距離太近’由此造成軟性電路板無 =商迷差分訊號，於軟性電路板上，即使一般製程201108884 * VI. Description of the invention: • Technical field to which the invention pertains [0001] The present invention relates to a printed circuit board, particularly to a flexible circuit board. [Prior Art] [0002] A flexible circuit board is flexible. A printed circuit board made of an insulating substrate has many advantages that a rigid printed circuit board does not have. For example, the flexible circuit board has a thin thickness, which can be freely bent, wound, folded, and can be arbitrarily arranged according to the spatial layout requirements, and can be arbitrarily moved and expanded in a three-dimensional space, thereby integrating the Jtc device and the wire connection. The use of a flexible circuit board can greatly reduce the size of electronic products, and is suitable for the development of electronic products in the direction of high density and low reliability. Therefore, flexible circuit boards have been widely used in aviation, military, mobile communications, laptop computers, computer peripherals, pM, digital cameras and other fields or products. [0003] = the thickness of the flexible circuit board is extremely thin, so that the transmission on the upper circuit board: transmission: the distance between the ground planes of the layer is too close, thereby causing the flexible circuit board to have no difference signal, on the flexible circuit board, Even the general process
:的最細傳輸線寬度，如4密爾。密爾=0.0254毫 未）’亦難以達到高速訊號傳輪線的特性阻抗的要求。 【發明内容J: The finest transmission line width, such as 4 mils. Mill = 0.0254 mA)) It is also difficult to achieve the characteristic impedance requirements of high-speed signal transmission lines. [Summary of the Invention J
[0004] =述内容，有必要提供-種可傳輪高速訊號的軟性 [0005] 098127665 一種軟性電路板，包括一上 層美柄㈣板及―下層基板，該上 禮丞板上佈設一差分對， 下層心k ”刀對包括兩條傳輸線 下層基板上與該兩條傳輸線之間的區 表單編號Α〇1〇ι 該 域所垂直相對的部 第3頁/共μ頁 0982047447-0 201108884 [0006] [0007] [0008] [0009] 098127665 分佈設有接地導電材料，該差分對包括複數分段組，每 一分段組由對稱分佈在該兩條傳輸線上的兩分段組成， 每條傳輸線上每兩相鄰的分段的線寬不同，其中，每一 分段組中的兩分段的線寬以及該接地導電材料分別與每 一分段組相對的部为的寬度是根據每一分段組的一特定 的特性阻抗來對應確定的。 前述軟性電路板是僅在該下層基板上的部分區域佈設接 地導電材料，以避免差分對與下層基板上的接地導電材 料距離太近所導致的傳輸線阻抗偏低問題的產生，根據 每一分段組的特定的特性阻抗，可對應確定每一分段組 中的兩分段的線寬及該接地導電材料的寬度，故，可使 該差分對的每一分段組達到所需的特性阻抗，該軟性電 路板無需增加額外成本’只需調整現有佈:線方式即可實 現高速信號的傳輸。 【實施方式】 ； ： ... 下面結合附圖及較佳實施例對本發明作進一步詳細描述 〇 請一併參閱圖1及圖2，本發明軟性電路板丨的較佳實施例 包括一上層基板10及一下層基板20 ’該上層基板丨〇與下 層基板20之間填充一層絕緣介質3〇。一差分對4〇佈設於 該上層基板10上’該差分對40包括兩條傳輸線41及42。 該下層基板20上覆蓋有接地銅箔，為避免該差分對4〇的 兩條傳輸線41、42與該接地銅羯之間的垂直距離太近所 導致的傳輸線阻抗偏低問題的產生，僅在該下層基板2〇 上的與該傳輸線41及42之間的區域所垂直相對的區域佈 表單編號A0101 第4頁/共14頁 201108884 [0010] Ο [0011] ❹ [0012] 設接地銅荡22 ’該接地銅箔22的長度與該差分對40的長 度相等。當然’亦可根據實際需要適當增大或減小該接 地銅箔22的寬度，只要能避免該差分對4〇的兩條傳輸線 41、42與該接地銅箔之間的垂直距離太近所導致的傳輸 線阻抗偏低的問題即可。在其他實施例中，該接地銅箔 22亦可為其他接地導電材料。 該差分對40包括複數分段組，該等分段組設於該差分對 40的訊號輪入端與訊號輪出端之間，每一分段組中包括 對稱設於該傳輸線41的一分段及該傳輸線42上的一分段 ’每一分段組中的兩分段的尺寸與形狀相同。該差分對 40可等效為一低通濾波器，該等分段組的數量由設計的 低通濾波器的規格需求決定，本實施例中，以五個分段 組為例進行說明。 該傳輸線41包括分段411-415，該傳輸線42包括分段 42卜425，該分段411、421組成該差分對40的一分段組. Z1 ’該分段412、422組成該差分對40的一分段組Z2，該 分段413、423組成該差分辦40的一分段組Z3，該分段 414、424組成該差分對40的一分段組Z4，該分段415、 425組成該差分對40的一分段組Z5。 根據傳輸線的電氣特性，當傳輸線的線寬足夠窄時，其 具有電感的特性；當傳輸線的線寬足夠寬時，其具有電 容的特性。由於每一傳輸線41、42上的每相鄰兩分段的 線寬不同，故，具有該分段組Z1-Z5的該差分對40即可等 效為一低通濾波器。 098127665 表單編號A0101 第5頁/共14頁 0982047447-0 201108884 [0013] 請一併參閱圖3，每一分段組Z1-Z5中的兩分段的線長是 由該低通濾波器的一原型，即該差分對40的等效電路44 決定的，本實施例中，該差分對40的等效電路44包括互 相連接的三個電容組件C1-C3及兩個電感組件L1及L2。 在該差分對40中，該分段組Zl、Z3和Z5分別等效為該電 容組件Cl、C2、C3，該分段組Z2和Z4分別等效為該電感 組件L1及L2，故，該傳輸線41、42上的每相鄰兩分段的 線寬不同。其中，每一分段組Zl、Z3、Z5中的兩分段的 線長根據公式 C = —i— Λ馬 來對應確定，每一分段組Ζ2、Ζ4中的兩分段的線長根據 公式 來對應確定，其中，C為該分段組Zl、Z3或Z5所對應等效 的電容組件Cl、C2或C3的電容值，L為該分段組Z2或Z4 所等效的電感組件L1或L2的電感值， 為對應分段組的特定的特性阻抗，f為該低通濾波器傳輸 訊號的截止頻率， g[0004] = the content, it is necessary to provide a kind of flexible high-speed signal transmission [0005] 098127665 A flexible circuit board, comprising an upper layer of the US (four) board and the "lower layer", the upper board is provided with a differential pair , the lower core k ” knife pair includes two transmission lines on the lower substrate and the two transmission lines between the area form number Α〇1〇ι The vertical direction of the field page 3 / total μ page 0992047447-0 201108884 [0006 [0009] [0009] [0009] 098127665 is distributed with a grounded conductive material, the differential pair includes a plurality of segment groups, each segment group consisting of two segments symmetrically distributed on the two transmission lines, each transmission line The line width of each two adjacent segments is different, wherein the line width of the two segments in each segment group and the width of the portion of the ground conductive material respectively opposite to each segment group are according to each A specific characteristic impedance of the segment group is correspondingly determined. The foregoing flexible circuit board is disposed only on a portion of the underlying substrate with a grounded conductive material to prevent the differential pair from being too close to the grounded conductive material on the underlying substrate. The problem that the transmission line impedance is low, according to the specific characteristic impedance of each segment group, the line width of the two segments in each segment group and the width of the grounded conductive material can be correspondingly determined, so Each segment group of the differential pair achieves the required characteristic impedance, and the flexible circuit board does not need to add extra cost. It is only necessary to adjust the existing cloth: line mode to realize high-speed signal transmission. [Embodiment] ; : ... The present invention will be further described in detail with reference to the accompanying drawings and preferred embodiments. Referring to FIG. 1 and FIG. 2, a preferred embodiment of the flexible circuit board of the present invention includes an upper substrate 10 and a lower substrate 20'. An insulating medium 3 is filled between the crucible and the lower substrate 20. A differential pair 4 is disposed on the upper substrate 10. The differential pair 40 includes two transmission lines 41 and 42. The lower substrate 20 is covered with a grounded copper foil. In order to avoid the problem of low transmission line impedance caused by the vertical distance between the two transmission lines 41, 42 of the differential pair 4〇 and the grounded copper cymbal being too low, only on the lower substrate 2 The area between the transmission lines 41 and 42 is perpendicular to the area. Form No. A0101 Page 4 / Total 14 Pages 201108884 [0010] ❹ [0012] Grounding copper slab 22 'The length of the ground copper foil 22 The length of the differential pair 40 is equal. Of course, the width of the ground copper foil 22 can be appropriately increased or decreased according to actual needs, as long as the two transmission lines 41 and 42 of the differential pair 4 42 and the ground copper foil can be avoided. The problem that the transmission line impedance is too low caused by the vertical distance between them is too low. In other embodiments, the ground copper foil 22 may also be other grounded conductive materials. The differential pair 40 includes a plurality of segment groups, the The segment group is disposed between the signal wheel input end of the differential pair 40 and the signal wheel output end, and each segment group includes a segment symmetrically disposed on the transmission line 41 and a segment on the transmission line 42. The two segments in the segment group are the same size and shape. The differential pair 40 can be equivalent to a low-pass filter. The number of the segment groups is determined by the specification requirements of the designed low-pass filter. In this embodiment, five segment groups are taken as an example for description. The transmission line 41 includes segments 411-415, and the transmission line 42 includes a segment 42 425 that forms a segment group of the differential pair 40. Z1 'The segment 412, 422 constitutes the differential pair 40 a segment group Z2, the segments 413, 423 constitute a segment group Z3 of the difference device 40, the segments 414, 424 constitute a segment group Z4 of the differential pair 40, the segments 415, 425 A segment group Z5 of the differential pair 40. According to the electrical characteristics of the transmission line, when the line width of the transmission line is sufficiently narrow, it has an inductance characteristic; when the line width of the transmission line is sufficiently wide, it has a capacitance characteristic. Since the line width of each adjacent two segments on each of the transmission lines 41, 42 is different, the differential pair 40 having the segment groups Z1 - Z5 can be equivalent to a low pass filter. 098127665 Form No. A0101 Page 5 of 14 0982047447-0 201108884 [0013] Please refer to FIG. 3 together, the line length of the two segments in each segment group Z1-Z5 is one of the low-pass filters. The prototype, that is, the equivalent circuit 44 of the differential pair 40 determines that, in this embodiment, the equivalent circuit 44 of the differential pair 40 includes three capacitive components C1-C3 and two inductive components L1 and L2 connected to each other. In the differential pair 40, the segment groups Z1, Z3, and Z5 are equivalent to the capacitor components C1, C2, and C3, respectively, and the segment groups Z2 and Z4 are equivalent to the inductor components L1 and L2, respectively. The line width of each adjacent two segments on the transmission lines 41, 42 is different. Wherein, the line lengths of the two segments in each of the segment groups Z1, Z3, and Z5 are determined according to the formula C = -i - ΛMalay, and the line lengths of the two segments in each segment group Ζ2, Ζ4 are based on The formula is correspondingly determined, wherein C is the capacitance value of the equivalent capacitive component Cl, C2 or C3 corresponding to the segment group Z1, Z3 or Z5, and L is the equivalent inductance component L1 of the segment group Z2 or Z4 Or the inductance value of L2, which is the specific characteristic impedance of the corresponding segment group, and f is the cutoff frequency of the low-pass filter transmission signal, g
Λ 098127665 表單編號A0101 第6頁/共14頁 0982047447-0 201108884 為在該截止頻率下的訊號的波長，1為對應分段組中的每 一分段的線長，其中，f及098 098127665 Form No. A0101 Page 6 of 14 0982047447-0 201108884 is the wavelength of the signal at the cutoff frequency, 1 is the line length of each segment in the corresponding segment group, where f and
A 的值為定值，故，可根據每一分段組Z1、Z3、Z5所對應 等效的電容組件C1-C3的值來確定出每一分段組Zl、Z3 、Z5中的分段的線長，以及根據每一分段組Z2、Z4所對 應等效的電感組件LI、L2的值來確定出每一分段組Z2、 Z4中的分段的線長。 〇 [0014] 由於該差分對40的特性阻抗會隨著其傳輸線41、42之間 的水平間距或該傳輸線41、42與該接地銅箔22之間的水 平間距的改變而改變，故，可透過調整每一分段組Z1-Z5 中的兩分段的水平間距，或同時調整每一分段組Z1-Z5中 的兩分段與該接地銅箔22之間的水平間距，並借助仿真 軟體的仿真，來達到每一分段組Z1-Z5對於其特定的特性 阻抗 Ο Z〇 的要求，以實現高速訊號的傳輸。本實施例中，每一分 段組Z1-Z5中的兩分段的水平間距可透過調整每一分段的 線寬來調整，每一分段組Z1-Z5中的兩分段與該接地銅箔 22之間的水平間距可透過調整該接地銅箔22與每一分段 組Z1-Z5相對的部分的寬度來調整，使該接地銅箔22亦具 有複數分段，且該接地銅箔22的每兩相鄰分段寬度不同 〇 098127665 表單編號A0101 第7頁/共14頁 0982047447-0 201108884 [0015] 該軟性電路板1僅在該下層基板20上與該差分對40的兩傳 輸線41、42之間的區域所垂直相對的部分佈設接地導電 材料，可避免差分對40與下層基板2〇上的接地導電材料 距離太近所導致的傳輸線阻抗偏低問題的產生，透過該 低通濾波器的等效電路44來確定每一分段組Z1_Z5中的兩 分段的線長後，可借助仿真軟體的仿真來設定每—分段 組Z1-Z5中的兩分段的線寬或同時設定該接地銅箔22與每 一分段組Z1-Z5相對的部分的寬度，以達到該差分對銘上 的母一分段組Z1-Z5所要求的特性阻抗。本發明軟性電路 板1無需增加額外成本，只需調整現有佈線方式即可具有 低通滤波器的功能’並實現高迷訊號的傳輸。 [0016] 综上所述，本發明符合發明專利要件，麦依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 : 【圖式簡單說明】 [0017] 圖1係本發明軟性電路板較佳實施例的剖面示意圖。 [0018] 圖2係圖1中的差分對以及接地銅箔的俯視示意圖。 [0019] 圖3係圖1中的差分對的等效電路圖。 【主要元件符號說明】 [0020] 軟性電路板 1 上層基板 r~......... 10 下層基板 20 絕緣介質 ..................... 30 差分對 40 傳輪線 41、42 接地銅 22 分段 表單編號A0101 第8頁/共14頁 0982047447-0 098127665 421-425 分段組 Z1-Z5 等效電路 44 電感組件 LI ' L2 電容組件 Cl 、 C2 、 C3 201108884The value of A is a fixed value. Therefore, the segmentation in each segment group Z1, Z3, and Z5 can be determined according to the values of the equivalent capacitance components C1-C3 corresponding to each segment group Z1, Z3, and Z5. The line length, and the line length of the segments in each of the segment groups Z2, Z4 are determined according to the values of the equivalent inductance components LI, L2 corresponding to each segment group Z2, Z4.特性[0014] Since the characteristic impedance of the differential pair 40 changes with the horizontal spacing between the transmission lines 41, 42 or the horizontal spacing between the transmission lines 41, 42 and the grounded copper foil 22, By adjusting the horizontal spacing of the two segments in each segment group Z1-Z5, or simultaneously adjusting the horizontal spacing between the two segments in each segment group Z1-Z5 and the grounding copper foil 22, and by means of simulation The simulation of the software achieves the requirements of each segment group Z1-Z5 for its specific characteristic impedance ΟZ〇 to achieve high-speed signal transmission. In this embodiment, the horizontal spacing of the two segments in each segment group Z1-Z5 can be adjusted by adjusting the line width of each segment, and two segments in each segment group Z1-Z5 are grounded. The horizontal spacing between the copper foils 22 can be adjusted by adjusting the width of the portion of the grounded copper foil 22 opposite to each of the segment groups Z1-Z5, such that the grounded copper foil 22 also has a plurality of segments, and the grounded copper foil The width of each two adjacent segments of 22 is different. 098127665 Form No. A0101 Page 7 / 14 pages 0982047447-0 201108884 [0015] The flexible circuit board 1 is only on the lower substrate 20 and the two transmission lines 41 of the differential pair 40 The grounding conductive material is disposed in a vertically opposite portion of the region between 42 and 42, and the problem of low transmission line impedance caused by the distance between the differential pair 40 and the grounded conductive material on the lower substrate 2〇 is prevented, and the low-pass filter is transmitted through the low-pass filter. After the equivalent circuit 44 determines the line length of the two segments in each segment group Z1_Z5, the line width of the two segments in each segment group Z1-Z5 can be set by simulation of the simulation software or the same The portion of the grounded copper foil 22 opposite to each of the segment groups Z1-Z5 Width, to achieve a characteristic impedance of the differential pair of a parent segment groups Z1-Z5 on the desired inscription. The flexible circuit board 1 of the present invention can have the function of a low-pass filter only by adjusting the existing wiring mode and realize the transmission of a high-signal signal. [0016] In summary, the present invention meets the requirements of the invention patent, and the patent application is filed by Mai. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1 is a cross-sectional view showing a preferred embodiment of a flexible circuit board of the present invention. 2 is a top plan view of the differential pair and the grounded copper foil of FIG. 1. 3 is an equivalent circuit diagram of the differential pair in FIG. 1. [Description of Main Component Symbols] [0020] Flexible Circuit Board 1 Upper Substrate r~...10 Substrate 20 Insulation Medium.................. ... 30 differential pair 40 transmission line 41, 42 grounding copper 22 segmentation form number A0101 page 8 / total 14 pages 0992047447-0 098127665 421-425 segmentation group Z1-Z5 equivalent circuit 44 inductance component LI ' L2 Capacitor components Cl, C2, C3 201108884
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098127665 表單編號Α0101 第9頁/共14頁 0982047447-0098127665 Form No. Α0101 Page 9 of 14 0982047447-0