201105443 六、發明說明： 【發明所屬之技術領域】 一本發明係關於—雷射加I裝置及方法，特別是—種可控制加工 冰度的雷射加工裝置及方法。 【先前技術】 戈生活中’各式裝置輕薄短小的趨勢下，傳統的後加工 方式，如模具沖壓、鑽床鑽孔及銑刀切削等，由於上述加工工具 有疋的體知，同時於加工時亦會產生較大的作用力，以 至於若加工之特徵範圍較小或需加工之工件強度較弱時，則上述 之加工方式將無法適用，甚緣致工件的損壞。因此 :加：於加工上的限制，遂提供-應用雷射光線之加= +田射切的能量，用以於加工工件表面切割出所需的特 二工而每射光線的截面積微小，適合_精密及小尺寸特徵進行 習知利用雷射光線的加工方法係將f射光線 件表面材料進行逐次㈣加1，叫得所㈣ 於雷射光線於單次加4光點面積 =由 加工，往往造成雷射光線的能量過於集t，於: f熱應力’而且h深度亦不易控制，且對於強度不足的t =會造成損壞，是厚_的卫件，甚至會直牛 件，造成工件的毁損’影響加工品質。 工方法往往會產生過多的钮刻量 ^的雷射加 塵，附著於加工裝 广成過-的工件材料粉 成汙木把成加工裝置故障率的增加。 201105443 其次，傳統雷射加工方式為簡化製程，以增進加工效率，常用 的方法乃將待加工之工件逐一排列，以於一次供給過程，將複數 工件置於加工裝置以完成加工，免除多次供給、取出工件步驟所 造成工時的增加。然而，各工件排列的相對位置難免產生誤差， 造成加工過程中，雷射光線無法準確地逐次照射於各工件表面， 影響了加工的品質。 是故，提供一雷射加工的裝置及方法，避免強度過於集中的雷 射光線造成工件的損壞，進而控制雷射光線於工件的加工深度， 同時提升加工品質，增進準確性，乃為此業界所亟需共同努力之 目標。 【發明内容】 本發明之一目的在於提供一雷射加工裝置，該雷射加工裝置適 可於加工過程中控制工件表面所接受的雷射光線強度，以獲得準 確的加工深度。同時，更可於加工過程針對複數工件提供對位、 補正及監看功能，以同時提升加工速度及品質。 為達上述目的，本發明揭露一雷射加工裝置，用以加工一立體 工件，該雷射加工裝置包含一雷射光源、一鏡片總成、一致動裝 置及一移動式平台，該雷射光源適以提供一第一光線入射該鏡片 總成，藉由該致動裝置旋轉該鏡片總成，使該第一光線形成相對 於該第一光線具有一角度偏移量之一第二光線，並照設置放於該 移動式平台上之立體工件，以進行雷射加工。該雷射加工裝置更 包含一影像擷取裝置，適以擷取該移動式平台上之該立體工件之 一立體影像集合，以於加工過程中，使該移動式平台依據該立體 201105443 體工件上 工件’―立 本發明之另一目的在於提供_雷射加工方法 適以準確地將雷射光線照射於工件表面，並控㈣工方法 表面的切割深度，使加工品質得以掌控。 ^於工件 j達上述目的’本發明更揭露—雷射加工方法，用以針對置放 方、移動式平台上之立體卫件進行加工該方法包 刚取該立體工件之—立體影像集合；⑻根據該立=定 ㈣⑷提供H線；_折該第—光線=二 弟二光線’其中該第二光線相對該第—光線具有—角度偏移量. 以及⑷旋轉該第二光線，俾該第二光線於該立體工件 閉執跡。 取對 下文 乂為讓本發明之上述目的、技術特徵和優點能更明顯易懂 係以較佳實施例配合所附圖式進行詳細說明。 【實施方式】 本發明之第-實施例如第i圖所示，一雷射加工裝置卜用以加 工至少-立體工件10，雷射加工裝置i包含一雷射光源u、一鏡 片總成14、—致動裝置18、—移動式平台19、以及-影像擷取裝 置（於本實施例中係包含三影像擷取單元13、15、17)。其中，影 像擷取裝置適以擷取置於移動式平台19上之立體工件1〇之一立 體影像集合。移動式平台19係依據該立體影像集合’沿—平面（圖 未不出）平移置放於其上之立體工件丨〇，俾雷射光源u所產生的 光線適可透過鏡片總成14，經由反射鏡12a、12b，投射至立體工 201105443 件ίο，以進行加工。 /併參閱第2A圖所示’雷射光源u適以提供—第—光 第一光線2〗經由入射設置於雷射 ， 後、商以报士外 源1之—端的鏡片總成】4 後’⑽成-第二光線23’其中第二光線Μ —成: 2!具有-角度偏移量卜詳細而言 先、、泉 ，浐Η %曰 兄月〜成】4包含至少—鏡 具有一入射面22與一出射面24,1中，出射面 為一傾斜面，俾利第-光線21由出射面24射心，=面24 射效應，產生角度偏移#θ ΑΑ Τ猎由光孥折 王内度偏私里Θ。其次，致動裝置ΐ8，例如 適可沿一轴向Ζ旋轉鏡片總成14，藉此，由出射面24射出之第 -光線23 _熱向ζ沿—關_轉。配合移動 平移立體工件10至一適當位 ° 弟一光線23適可於立體工件1 〇 之一表面’如第3Α圖所示，形成環型封閉軌跡％，並進行切 於本實施例中，軸向Ζ係為第一光線21行進方向的延伸方向，°藉 此第-光線23於立體工件1G之表面所形成之環形封閉軌跡料 質上為圓形。同時，鏡片25之一位置[係可調整，俾調整第二光 線23於立體工件1〇上形成該封閉執跡之範圍。移動式平台a更 可連續移動立體工件1()，如第3B圖所示，以於立體工件ι〇上形 成加工路徑3，其中加工路徑3係由複數封閉執跡％所組成。 於其他實施例中，如第2B圖所示’鏡片總成14更可包含複數 鏡片25、25, ’第一光線21係入射鏡片乃之入射面22，經由出 射面24出射，而後再經由鏡Μ 25,之入射面22,入射，並經由出射 面 出射，而形成與第一光線21具有另一角度偏移量0，之第二 光線23。相似地，致動裝置18係沿軸向ζ旋轉鏡片總成14，藉 201105443 此， 以於立體工件10 之表面形成環形封閉執跡 同時，鏡片25、 25’間之一位置L，係可調整，同樣可藉 工件10上形成該封閉軌跡之範圍。 以調整第二光線23於立體 於上述之實施例中，鏡片25、 25係以相同之對應關係設置，然 而於其他實施例中，如第2Γ IR1 π - ⑦儿圖所不，鏡片25、25,係以另一對應 關係設置。同時’熟悉本項技術者，更可輕易思及鏡片總成Μ包 含更多鏡片，配合各鏡片間不同之對應關係及相對位置，藉以於 立體工件10上獲得不同範圍之封閉軌跡。 為簡化製程，並增進加工效率，本發明之雷射加工裝置i係可 於同-供給製程，針對複數立體卫件1G進行加工。如第,所示， 於加工前，複數立體工件10係以—預設之相對位置依序排列於一 基板4，並置放於移動式平台19之上，待進行後續加工程序。然 而複數立體工件之排列難免產生誤差，導至各立體讀間之相 對距離並丨致’因此’若加卫過程依據該預設相對位置平移立 體工件10，將影響到後續加工的準確性。有鑑於此，本發明之雷 射加工I置1係利用影像擷取裝置所擷取之立體影像集合，並透 過將工件影像加以對位之處理，用以於加工各立體工件1〇之前先 進厅方位的校正。此定位之目的在於使雷射光線可準確地投射至 立體工件10之預定位置，以於正確的方位上對立體工件丨〇進行 切割加工，進而剝除立體工件10表面之遮蔽物，直至完成複數立 體工件10之加工。 於本實施例令，影像擷取裝置主要由電荷耦合元件 (Charge-coupled Device, CCD)所構成，具體而言其包含一定位 201105443 二像搁取早70 13、—監控影像操取單元15以及-輔助影像操取單 ，刀㈣取&位影像、一監控影像以及一輔助影像。其中， iv像木D係可為上述定位影像監控影像及輔助影像之任意 組^，於較佳的實施態樣中，立體影像集合包含上述三種影像: I精由#f力式平台19之移動卫件的手段，達到精準定位立體工件 1〇、=監視立體工件1G以及補正立體卫件1G—角度之目的。 於本貝知例巾，因輔助影像娜單元17為傾斜設置，所以必須確201105443 VI. Description of the Invention: [Technical Field of the Invention] One invention relates to a laser plus I device and method, and more particularly to a laser processing apparatus and method for controlling ice processing. [Prior Art] In the life of Ge's life, the traditional post-processing methods, such as die stamping, drilling machine drilling and milling cutter cutting, are also known because of the above-mentioned processing tools, and also during processing. A large force is generated, so that if the processing range is small or the strength of the workpiece to be processed is weak, the above processing method will not be applicable, and the workpiece may be damaged. Therefore: Add: in the processing limit, 遂 provide - apply the application of laser light = + field cut energy, used to cut the surface of the workpiece to cut the required special work and the cross-sectional area of each shot is small, Suitable for _ precision and small size features, the conventional processing method using laser light is to increase the surface material of the f-lighting material by (4) one by one, which is called (4) for the laser light in a single plus 4 spot area = by processing , often causes the energy of the laser light to be too concentrated, in: f thermal stress 'and h depth is not easy to control, and for the lack of strength t = will cause damage, is a thick _ of the guard, and even straight cattle, resulting in The damage of the workpiece 'affects the processing quality. The method often results in excessive laser dusting of the button volume, and the workpiece material powder attached to the processing package is increased into a processing device failure rate. 201105443 Secondly, the traditional laser processing method is to simplify the process to improve the processing efficiency. The commonly used method is to arrange the workpieces to be processed one by one to place the plurality of workpieces in the processing device to complete the processing in one supply process, eliminating multiple supply. The increase in man-hours caused by the removal of the workpiece step. However, the relative position of each workpiece arrangement is inevitably causing an error, so that the laser light cannot be accurately and sequentially irradiated to the surface of each workpiece during the processing, which affects the quality of the processing. Therefore, a laser processing device and method are provided to prevent the damage of the workpiece caused by the excessively concentrated laser light, thereby controlling the processing depth of the laser light on the workpiece, improving the processing quality and improving the accuracy. The goal of joint efforts is urgently needed. SUMMARY OF THE INVENTION One object of the present invention is to provide a laser processing apparatus that is adapted to control the intensity of laser light received by a workpiece surface during processing to obtain an accurate processing depth. At the same time, it can provide alignment, correction and monitoring functions for multiple workpieces in the machining process to simultaneously improve processing speed and quality. In order to achieve the above object, the present invention discloses a laser processing apparatus for processing a three-dimensional workpiece, the laser processing apparatus comprising a laser light source, a lens assembly, an actuating device and a mobile platform, the laser light source Equivalently providing a first light incident on the lens assembly, and rotating the lens assembly by the actuating device to form the first light to form a second light with an angular offset from the first light, and The three-dimensional workpiece placed on the mobile platform is set for laser processing. The laser processing apparatus further includes an image capturing device adapted to capture a stereoscopic image set of the three-dimensional workpiece on the mobile platform, so that the mobile platform is based on the stereo 201105443 body workpiece during processing Workpiece '- Another object of the present invention is to provide a laser processing method suitable for accurately irradiating laser light onto the surface of the workpiece, and controlling the cutting depth of the surface of the method, so that the processing quality can be controlled. ^ The workpiece j achieves the above purpose'. The invention further discloses a laser processing method for processing a stereoscopic guard on a placement side or a mobile platform. The method package just takes a stereoscopic image set of the three-dimensional workpiece; (8) Providing an H line according to the vertical = (4) (4); _ folding the first light ray = two second light ray 'where the second light has an angle offset with respect to the first light ray. And (4) rotating the second light, 俾 the first The second light is closed to the solid workpiece. The above objects, technical features and advantages of the present invention will become more apparent from the following description. [Embodiment] In a first embodiment of the present invention, as shown in FIG. 19, a laser processing apparatus is used to process at least a three-dimensional workpiece 10, and the laser processing apparatus i includes a laser light source u, a lens assembly 14, - Actuating device 18, mobile platform 19, and image capturing device (in this embodiment, three image capturing units 13, 15, 17). The image capturing device is adapted to capture a set of stereoscopic images of the solid workpiece 1 placed on the mobile platform 19. The mobile platform 19 is configured to transpose the three-dimensional workpiece 置 placed thereon according to the stereoscopic image set 'on-plane (not shown), and the light generated by the laser light source u is adapted to pass through the lens assembly 14 via the lens assembly 14 The mirrors 12a, 12b are projected to the stereoscopic 201105443 pieces for processing. / And refer to Figure 2A, 'Laser light source u is suitable to provide - the first light first light 2 is set to the laser through the incident, and then the lens assembly of the outer end of the newspaper 1 '(10) into - second ray 23' where the second ray Μ - into: 2! has - angle offset amount, in detail, first, spring, 浐Η %曰兄月~成]4 contains at least - the mirror has one In the incident surface 22 and an exit surface 24, 1, the exit surface is an inclined surface, and the Philippe-light 21 is illuminated by the exit surface 24, and the surface 24 is radiated to produce an angular offset #θ ΑΑ Τ 由 由 由The king of the king is in a private state. Secondly, the actuating device 8 is adapted, for example, to rotate the lens assembly 14 along an axial direction, whereby the first ray 23 _ heat-emitted by the exit surface 24 is turned to turn off. Cooperating to move the three-dimensional workpiece 10 to a suitable position, the light ray 23 is suitable for one surface of the three-dimensional workpiece 1 ' as shown in FIG. 3, forming a ring-shaped closed track %, and cutting is performed in the embodiment, the axis The enthalpy is the extending direction of the traveling direction of the first ray 21, and the annular trajectory formed by the first ray 23 on the surface of the solid workpiece 1G is circular. At the same time, one position of the lens 25 is adjusted, and the second light line 23 is adjusted to form a range of the closed trace on the three-dimensional workpiece 1 . The mobile platform a can continuously move the solid workpiece 1 (), as shown in Fig. 3B, to form a processing path 3 on the solid workpiece ι, wherein the processing path 3 is composed of a plurality of closed traces. In other embodiments, as shown in FIG. 2B, the lens assembly 14 may further include a plurality of lenses 25, 25, and the first light 21 is incident on the incident surface 22 of the lens, exits through the exit surface 24, and then passes through the mirror. The entrance surface 22 of the aperture 25 is incident and exits through the exit surface to form a second ray 23 having a different angular offset from the first ray 21 by zero. Similarly, the actuating device 18 rotates the lens assembly 14 axially, by means of 201105443, to form an annular closed track on the surface of the solid workpiece 10, while the position L between the lenses 25, 25' is adjustable. The range of the closed trajectory can also be formed by the workpiece 10. In order to adjust the second light 23 in the above embodiment, the lenses 25, 25 are arranged in the same corresponding relationship, but in other embodiments, as in the second Γ IR1 π - 7 , the lenses 25, 25 , set in another correspondence. At the same time, those who are familiar with the technology can easily think that the lens assembly includes more lenses, and the different correspondences and relative positions between the lenses can be used to obtain different ranges of closed tracks on the three-dimensional workpiece 10. In order to simplify the process and improve the processing efficiency, the laser processing apparatus i of the present invention is capable of processing the plurality of three-dimensional guards 1G in the same-supply process. As shown in the figure, before processing, the plurality of three-dimensional workpieces 10 are sequentially arranged on a substrate 4 with a predetermined relative position, and placed on the mobile platform 19 for subsequent processing. However, the arrangement of the plurality of three-dimensional workpieces inevitably causes an error, leading to the relative distance between the stereo readings and causing the 'and therefore' if the urging process shifts the vertical workpiece 10 according to the preset relative position, which will affect the accuracy of the subsequent processing. In view of the above, the laser processing I set 1 of the present invention utilizes a set of stereoscopic images captured by the image capturing device, and is processed by aligning the workpiece images for processing the three-dimensional workpieces. Correction of orientation. The purpose of this positioning is to enable the laser light to be accurately projected to a predetermined position of the three-dimensional workpiece 10, to cut the three-dimensional workpiece 正确 in the correct orientation, and then to peel off the surface of the solid workpiece 10 until the plural is completed. Processing of the solid workpiece 10. In the embodiment, the image capturing device is mainly composed of a charge-coupled device (CCD), and specifically includes a positioning 201105443 image taken early 70 13 , the monitoring image operation unit 15 and - Auxiliary image manipulation, knives (4) Take & image, a surveillance image and an auxiliary image. Wherein, the iv-like wood D system can be any group of the above-mentioned positioning image monitoring images and auxiliary images. In a preferred embodiment, the stereo image collection includes the above three types of images: I fine movement by the #f force platform 19 The means of the guards achieve the purpose of accurately positioning the three-dimensional workpiece 1〇, = monitoring the solid workpiece 1G, and correcting the stereoscopic 1G-angle. In the case of Benbe, because the auxiliary image unit 17 is tilted, it must be confirmed.
認欲擷取之單—立社件（例如立體no)影像不至被鄰近其 他立體工件（例如立體工件10，）所阻擋。 進一步而言，本實_中，欲加工之複數立體工件ι〇排列於基 …表面％置放於移動式平台19。於加工之前，監控影像榻取 早70 15配合一反射鏡12d，首先針對整個基板4上之複數立體工 進行疋位，其方式係可挑選位於基板4側緣處二相對設置之 立體工件U)a、⑽，透過監控影像麻單元15之影像視窗，確認 立體工件10a、1〇b是否成一直線對齊，若無對齊則透過移動式 平台19使其對齊。其中，若立體工件伽、㈣本身方位誤差過 大，造奴位困難，則可再另外挑選其他之立體工件（如立體工 件10c、10d)以進行基板4整體之定位。 其·人，如第5圖所示，以監控影像擷取單元丨5選取於基板4中 (方、第5圖中係以一父又點表示）f付近之一立體工件1如，經 由監控影像掏取單元15之影像視窗，測量立體工件⑽距離基板 〇心C之-水平距離χ及—垂直距離y，並透過原先各立體工件 之已知的預設相對位置，而獲得整個基板4上每—立體工件相對 201105443 於基板4中心C之位置。 接著，於進行切割程序前，立體工件10須進行初次影像擷取調 整。詳言之，該影像擷取調整係利用上述所獲得之各立體工件相 對於基板4中心C之位置，透過移動式平台19移動當前欲切割之 立體工件（如立體工件10)至一預定加工位置，並透過定位影像 擷取單元13配合反射鏡12c，如第6A圖所示，確認所獲得之立 體工件10的影像是否位於定位影像擷取單元13之影像視窗6〗内 之中心（即第6A圖中虛線所示之二定位線交點是否位於立體工件 10之中心），並透過移動式平台19之移動，以針對立體工件 之位置進行定位。再者，如第6B圖所示，透過辅助影像擷取單元 17，確認所獲得之立體工件1〇影像之一頂邊3與—側邊匕是否分 別與輔助影像擷取單元17之影像視窗63中之二定位線（即第佔 圖中之二虛線）對齊，並透過移動式平台19之旋轉，以針對立體 工件10之角度進行校正。 然而，於本實施例中，由於立體工件10欲加工之圓錐部份101, 並未盡然準確的位於立體工件10之中心，因此，必需再進行以下 更細U的权正’以獲得更精確的加工結果。如第6C圖所示，藉由 已知圓錐部分1G1的尺才，以於定位影像操取單元13之影像視窗 61内顯*出對應於已知圓錐料其尺寸之校準區域（即第6C 圖所不之虛線矩形區域），並使立體工件1Q之影像中，圓雜部分 101與额準區域之各邊相互切齊，以達到更精準對位之目的。 =貫際加工進行時，藉由上述之初次影像擷取調整過程，配合 心而仵之立體工件1Q與基板4中心㈢水平距離X及垂直距離 201105443 y’以及基板4上已知各立體工件的預設相對位置，可完成初步之 各立體工件的加工定位。隨後’再藉由針對各立體工件重複進行 欲加工之圓錐部份101之細微校正，因此雷射光線即可準確地投 射到各立體工件表面’而獲得良好的加工結果。 於上述方位補正過程中，各影像擷取單元13、15、以分別包 ^利用照明光源13a、15a'17a，照射於立體工件，以於各影像視 固内獲得較清晰之影像。另—方面，當欲進行加工的立體工件⑺ 其影像於校正程序時’如發現立體工件1〇之方位偏差過大，而難 以補正，則跳過該立體H對其加工，以避免產生錯誤之切 割加工。於雷射切割的同時’監控影像搁取單元μ亦可用於監看 立體工件10之加工結果是否正確。 本實施例中，雷射加工裝置i更包含一控制器（圖未示出）及一控 制軟體儲存於該控㈣中。其中控餘體可設定於—定點上雷射 先線之切割時間、似彳次數及雷射延遲參數，控制器可以控制雷 射光線之移動速度、功率大小與頻率值。而藉此方式，即可控制 雷射光線於立體工件10之切割深度及線寬，而輕易逹成精準的加 於本實施例中，雷射光線係為一固態紅外光雷射光線或一固離 紫外光雷射光線，其射出之第一光線21波長約為193奈米至祕 奈未’藉此，於立體工件1G之表面所產生之切割鎳寬約％微米。 w明的是’由於前述雷料線所產生的切割不至產生過大的熱 反力，因此適合於結構較為輕薄的工件加工。 如第7圖所示’相應於前述之雷射加卫裝置i，本發明更揭露一 201105443 =:方法，合併參閱第，雷射加工方法用以加工置於一 夕 台19上之立體工件10,相關之流程說明如下。於步驟 71中係掏取立體工件10之一立體影像集合。詳細而言雷射加 方^係刀別提供-定位影像擷取單元13、一監控影像操取單元 15及一輔助影像操取單元17，分別用以操取-定位影像、 =像=像。該立體影像集合係為定位影像、監控影： “且5。於步驟72中’雷射加工裝置1係依據該立 體影像集合，俏蔣動々亚a , 了抵像及立 動式·^ ° 19移動’以定位置放於移動式平台19 件1G。詳細之定位過程已於上述實施例說明，於此不 冉賢述。 一：體：件1〇於定位完成後’合併參閱第2A圖，步驟73係提供 f線21 ’第—光線21適可由上述實施例之雷射光源㈣ 棱隨後，於步驟74係使第一 尤忒21產生偏折，以形成一第 7 ^，其中第二光線23相對第—光線21具有—角度偏移量 ϋ。农後，於步驟75中#旌麟筮-止μ 此 〒係^弟-先線23’俾第二光線23於立體 =1〇上形成一封閉軌跡。其中’上述步驟係以-致動裝置18, 4鏡片總成14，使第二光線23沿—軸向ζ :軌跡係成環形。詳細之第二光線23的偏折方式及封閉二 成，已知露於前述之實拖例，於此不再贅述。 ::之雷射加工方動式平台Η ’以連續移動立體 二件10 ’使第二光線23於立體工件i0上形成—加工路徑，其中 =工路棱係為上述封閉轨跡所組成。藉此，適以剝除立體工件 表面之遮蔽物，直至完成複數立體工件10之加工。 12 201105443A single-acquisition piece (e.g., stereo no) image is not blocked by adjacent other solid objects (e.g., solid workpiece 10). Further, in the present embodiment, the plurality of three-dimensional workpieces to be processed are arranged on the surface of the substrate and placed on the mobile platform 19. Before processing, the monitoring image is taken 7015 with a mirror 12d, and firstly, the plurality of three-dimensional workpieces on the entire substrate 4 are clamped by selecting two opposite workpieces U) located at the side edges of the substrate 4. a. (10), by monitoring the image window of the image hemp unit 15, confirming whether the three-dimensional workpieces 10a, 1b are aligned in a straight line, and if there is no alignment, aligning them through the mobile platform 19. Wherein, if the three-dimensional workpiece gamma, (4) itself has too large azimuth error, and the slave position is difficult, another three-dimensional workpiece (such as the three-dimensional workpieces 10c, 10d) may be additionally selected to perform the overall positioning of the substrate 4. The person, as shown in FIG. 5, is selected by the monitoring image capturing unit 丨5 in the substrate 4 (the square and the fifth figure are represented by a parent and a dot). The image window of the image capturing unit 15 measures the horizontal distance χ and the vertical distance y of the solid workpiece (10) from the substrate core C, and obtains the predetermined relative position of the original three-dimensional workpiece to obtain the entire substrate 4. Each of the three-dimensional workpieces is at the position of the center C of the substrate 4 with respect to 201105443. Next, the stereo workpiece 10 is subjected to an initial image capture adjustment before the cutting process. In detail, the image capturing adjustment uses the position of each of the obtained three-dimensional workpieces relative to the center C of the substrate 4 to move the three-dimensional workpiece (such as the three-dimensional workpiece 10) to be cut through the movable platform 19 to a predetermined processing position. And the positioning image capturing unit 13 is coupled to the mirror 12c. As shown in FIG. 6A, it is confirmed whether the image of the obtained three-dimensional workpiece 10 is located at the center of the image window 6 of the positioning image capturing unit 13 (ie, 6A). Whether the intersection of the two positioning lines indicated by the broken lines in the figure is located at the center of the three-dimensional workpiece 10, and moving through the movable platform 19, is positioned for the position of the three-dimensional workpiece. Furthermore, as shown in FIG. 6B, it is confirmed by the auxiliary image capturing unit 17 whether the top edge 3 and the side edge of one of the obtained three-dimensional workpieces are respectively associated with the image window 63 of the auxiliary image capturing unit 17. The second of the positioning lines (i.e., the two dashed lines in the first figure) are aligned and rotated by the movable platform 19 to correct for the angle of the solid workpiece 10. However, in the present embodiment, since the conical portion 101 to be processed by the solid workpiece 10 is not exactly located at the center of the solid workpiece 10, it is necessary to perform the following finer U to obtain a more accurate Processing results. As shown in FIG. 6C, by arranging the rule of the conical portion 1G1, a calibration area corresponding to the size of the known conical material is displayed in the image window 61 of the positioning image manipulation unit 13 (ie, FIG. 6C). In the image of the solid workpiece 1Q, the sides of the circular portion 101 and the marginal region are aligned with each other to achieve a more accurate alignment. When the continuous processing is performed, the above-mentioned initial image capturing and adjusting process, the horizontal workpiece 1Q and the substrate 4 center (3) horizontal distance X and vertical distance 201105443 y', and the known three-dimensional workpieces on the substrate 4 By presetting the relative position, the initial machining positioning of each three-dimensional workpiece can be completed. Then, by repeating the fine correction of the conical portion 101 to be processed for each of the three-dimensional workpieces, the laser beam can be accurately projected onto the surface of each of the three-dimensional workpieces to obtain a good processing result. During the orientation correction process, the image capturing units 13 and 15 respectively illuminate the three-dimensional workpiece by using the illumination light sources 13a and 15a'17a to obtain a clear image in each image. On the other hand, when the three-dimensional workpiece (7) to be processed is imaged in the calibration procedure, if it is found that the orientation deviation of the solid workpiece 1 is too large and it is difficult to correct, the stereo H is skipped and processed to avoid erroneous cutting. machining. The laser image capture unit μ can also be used to monitor whether the machining result of the solid workpiece 10 is correct. In this embodiment, the laser processing apparatus i further includes a controller (not shown) and a control software stored in the control (4). The control body can be set at the cutting time of the laser on the fixed point, the number of times of the laser, and the laser delay parameter. The controller can control the moving speed, power level and frequency value of the laser light. In this way, the cutting depth and line width of the laser beam on the solid workpiece 10 can be controlled, and can be easily added to the embodiment. The laser light is a solid infrared laser light or a solid. The ultraviolet light is emitted from the ultraviolet light, and the first light 21 emitted from the laser beam has a wavelength of about 193 nm to the secret of the secret. The cut nickel produced on the surface of the solid workpiece 1G is about 100 μm wide. It is clear that the cutting caused by the aforementioned lightning line does not cause excessive thermal reaction force, so it is suitable for the processing of workpieces with relatively thin structure. As shown in FIG. 7 'corresponding to the aforementioned laser-assisting device i, the present invention further discloses a 201105443 =: method, which is incorporated by reference, the laser processing method for processing the three-dimensional workpiece 10 placed on the holster 19 The related process is described below. In step 71, a stereoscopic image set of the solid workpiece 10 is captured. In detail, the laser processing unit is provided with a positioning image capturing unit 13, a monitoring image capturing unit 15 and an auxiliary image capturing unit 17, respectively, for acquiring and positioning the image, = image = image. The stereoscopic image collection is a positioning image and a surveillance image: "And 5. In step 72, the laser processing device 1 is based on the stereoscopic image collection, and the image is abbreviated and erected. ^ ° 19 moves 'positioned on the mobile platform 19 pieces 1G. The detailed positioning process has been described in the above embodiment, and it is not mentioned here. One: body: after the positioning is completed, 'combination refers to Figure 2A, steps The 73 series provides the f line 21 'the first light ray 21 can be adapted from the laser light source (four) edge of the above embodiment. Subsequently, in step 74, the first 忒 21 is deflected to form a seventh ray 23, wherein the second ray 23 The relative light ray 21 has an angle offset ϋ. After the farm, in step 75, the 旌 筮 止 止 〒 〒 〒 ^ ^ - - - - 先 先 先 先 先 先 先 先 先 先 先 先 先 先 先 先 先 先 - 先 先 俾 俾 俾Closed trajectory, wherein 'the above steps are used to actuate the device 18, 4 the lens assembly 14 to make the second light ray 23 along the axial ζ: the trajectory is looped. The detailed second light ray 23 is deflected and closed. Cheng, is known to be exposed to the above examples, and will not be described here. :: Laser processing square platformΗ The second light ray 23 is formed on the three-dimensional workpiece i0 by continuously moving the two pieces 10' to form a processing path, wherein the working circuit edge is composed of the closed trajectory. Thereby, the shielding for peeling off the surface of the three-dimensional workpiece is suitable. Until the processing of the plurality of solid workpieces 10 is completed. 12 201105443
綜上所述，本發明提供一雷射加工裝置及方法，透過使雷射光 線產生偏折及旋轉的方式，於立體卫件表面形成封閉軌跡，並以 移動式平台連續移動立體工件，而形成加工路徑，藉以針對微型 立體工件進行加工，避免了制傳統之加工方式，容易造成立體 工件的損壞。同時，透過形成封閉軌跡的加工方式，更可方便地 控制加X深度，改善習知㈣衝雷射光線造隸應力的過度集令 4成立體工件貝牙’且免除產生較多的工件材料粉塵，形成雷射 加工裝置的汙染。雷射加工裝置更利用-影像擷取裝置，操取立 體工件之立體影㈣合，透過移動式平台移動立^件，可同步 對複數個立體件it行加卫，以提高加工品質。 上述之實施例僅用來例舉本發明之實施態樣，以及闊釋本發明 之技術特徵’並非絲限制本發明之保護範^任何熟悉此技術 者可㈣完成线變或均等性之安㈣屬於本發明所主張之範 圍’本發明之權利保護範圍應以中請專利範圍為準。 【圖式簡單說明】 第1圖係為本發明之—雷射加工裝置示意圖； 第2A圖係為本發明之一鏡片總成之示意圖； 第2B圖係為本發明之另一鏡片總成之示意圖； 第2C圖係為本發明之又一鏡片總成之示意圖； 第3A圖係為一封閉軌跡之示意圖； 第圖係為第3A圖之封閉軌跡所组成之—加卫路徑之示意圖 第4圖係為本發明之複數立體工件置於—移動式平台之示意圖 13 201105443 弟5圖係為本發明用於定義一立體T灿 姐工件之位置之示意圖； 第6Α圖係為本發明之雷射加工梦 衣置疋位一立體工件之示意圖； 體工件之角度之 第6Β圖係為本發明之雷射加工裝置定位一立 示意圖； 第6C圖係為本發明之雷射加梦 丄表置疋位一立體工件之欲加 部分之示意圖；及 第7圖係為本發明之—雷射加工方法之流程圖。 【主要元件符號說明】 1 :雷射加工裝置 10、10’ ：立體工件 l〇a、l〇b :立體工件 10c、10d、l〇e :立體工件 11 ·雷射光源 12a、12b、12c、12d :反射鏡 13 :定位影像擷取單元 13a、15a、17a :照明光源 14 :鏡片總成 15 :監控影像擷取單元 17 :辅助影像擷取單元 18 :致動裝置 :移動式平台 21 :第一光線 22 ' 22’ ：入射面 23 :第二光線 24 ' 24’ ：出射面 25、25’ ：鏡片 3:加工路徑 30 :封閉執跡 4 :基板 61、6 3 ··影像視窗In summary, the present invention provides a laser processing apparatus and method for forming a closed trajectory on a surface of a three-dimensional guard by deflecting and rotating a laser light, and continuously moving the three-dimensional workpiece with a movable platform to form The processing path is used to process the micro-stereo workpieces, avoiding the traditional processing method and easily causing damage to the three-dimensional workpiece. At the same time, through the processing method of forming a closed trajectory, it is more convenient to control the X-depth and improve the conventional (4) over-collection of the laser-induced ray stress. 4 The body part of the tooth is formed and the workpiece material dust is eliminated. Forming a contamination of the laser processing device. The laser processing device further utilizes the image capturing device to operate the three-dimensional shadow of the vertical workpiece (four), and moves the vertical member through the movable platform to simultaneously synchronize the plurality of three-dimensional pieces to improve the processing quality. The above embodiments are only used to exemplify the embodiments of the present invention, and the technical features of the present invention are not intended to limit the protection of the present invention. Anyone familiar with the technology can (4) complete the line change or the equality (4) The scope of the claims of the present invention should be based on the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a laser processing apparatus of the present invention; FIG. 2A is a schematic view of one lens assembly of the present invention; and FIG. 2B is another lens assembly of the present invention. 2C is a schematic diagram of another lens assembly of the present invention; FIG. 3A is a schematic diagram of a closed trajectory; and the first diagram is a closed trajectory of FIG. 3A. The figure is a schematic diagram of a plurality of three-dimensional workpieces placed on the mobile platform of the present invention. 13 201105443 The figure 5 is a schematic diagram for defining the position of a stereo T-sister workpiece; the sixth diagram is the laser of the present invention. A schematic diagram of processing a dream garment with a three-dimensional workpiece; a sixth diagram of the angle of the workpiece is a schematic diagram of the positioning of the laser processing apparatus of the present invention; and FIG. 6C is a laser and a nightmare of the invention. A schematic diagram of a portion of a three-dimensional workpiece; and FIG. 7 is a flow chart of a laser processing method of the present invention. [Description of main component symbols] 1 : Laser processing apparatus 10, 10': three-dimensional workpieces l〇a, l〇b: three-dimensional workpieces 10c, 10d, l〇e: three-dimensional workpieces 11 · laser light sources 12a, 12b, 12c, 12d: mirror 13: positioning image capturing unit 13a, 15a, 17a: illumination source 14: lens assembly 15: monitoring image capturing unit 17: auxiliary image capturing unit 18: actuating device: mobile platform 21: A light 22 ' 22 ' : incident surface 23 : second light 24 ' 24 ' : exit surface 25, 25': lens 3: processing path 30: closed trace 4: substrate 61, 6 3 · image window
14 201105443 101 :圓錐部分 b :側邊 X :水平距離 Z .轴向 L、L’ ：位置 a :頂邊 C :中心 y :垂直距離 θ、θ’ ：角度偏移量14 201105443 101 : Cone part b : Side X : Horizontal distance Z . Axial L, L' : Position a : Top edge C : Center y : Vertical distance θ, θ' : Angle offset
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