[go: up one dir, main page]

TW201105224A - Method and structure of thermo conductor having coplanar evaporator sections and heat sink with the thermo conductor - Google Patents

Method and structure of thermo conductor having coplanar evaporator sections and heat sink with the thermo conductor Download PDF

Info

Publication number
TW201105224A
TW201105224A TW98125589A TW98125589A TW201105224A TW 201105224 A TW201105224 A TW 201105224A TW 98125589 A TW98125589 A TW 98125589A TW 98125589 A TW98125589 A TW 98125589A TW 201105224 A TW201105224 A TW 201105224A
Authority
TW
Taiwan
Prior art keywords
heat
section
plane
contact plane
evaporation
Prior art date
Application number
TW98125589A
Other languages
Chinese (zh)
Other versions
TWI407897B (en
Inventor
Kuo-Len Lin
Chen-Hsiang Lin
Chih-Hung Cheng
Ken Hsu
Original Assignee
Cpumate Inc
Golden Sun News Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cpumate Inc, Golden Sun News Tech Co Ltd filed Critical Cpumate Inc
Priority to TW98125589A priority Critical patent/TWI407897B/en
Publication of TW201105224A publication Critical patent/TW201105224A/en
Application granted granted Critical
Publication of TWI407897B publication Critical patent/TWI407897B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink with a thermo conductor having coplanar evaporator sections is disclosed. The method of making the thermo conductor is as following. Firstly, it is provided with a plurality of heat pipes, a first tooling of concave arc surfaces and a second tooling. Next, press the heat pipes by the first tooling gradually to make cambered surfaces, then press the cambered surfaces again by the second tooling to form a contacting plane and an attaching plane that are perpendicular. Moreover, put adhesive on the contacting plane and arrange the heat pipes in a jig. The thermo conductor having coplanar evaporator sections will be done after the heat pipes were fixed by the adhesive. By the way, a plurality of fins are disposed on the condenser sections of the heat pipes for a heat sink.

Description

201105224 六、發明說明: 【發明所屬之技術領域】 特别有關於一種具有熱管 本發明係與導熱結構有關 之導熱結構及其製法。 【先前技術】 一般電子元件運作時皆會產生熱 技的進步,電子產品的功能及性 提迎者科 生的熱更是大幅地增加,為此,大=升J’其内部產 藉以控制工作溫度而維持;=散 的:種=流體而可進行熱傳她管,即為常見 μ參第-圖’係為習知的一種散熱器h a上设有複數溝槽lla,該等熱f 2Qa# =等溝槽,中,此外,再將設有穿孔之多數鰭:= ς於该熱官2GaJl,依此,令該導熱座此貼接一發熱201105224 VI. Description of the invention: [Technical field to which the invention pertains] Particularly relates to a heat-conducting structure having a heat pipe according to the present invention and a method of manufacturing the same. [Prior Art] Generally, the operation of electronic components will produce thermal technology. The function and nature of electronic products will increase the heat of the students. For this reason, the large-scale J's internal production will control the work. Maintained by temperature; = scattered: species = fluid and can be heat-transferred to her tube, which is a common type of reference - Figure ' is a conventional heat sink ha is provided with a plurality of grooves lla, the heat f 2Qa # =等槽,中, In addition, the majority of the fins will be provided with perforations: = ς 该 该 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热

凡件’該散熱器1_可導離該發熱電子元件所產 熱。 J 上述結構中,該等熱管2〇a係嵌固於該導熱基座1〇a 中,以利於將該等熱管2〇a貼附並結合該發熱電子元件; 然,該導熱基座20a非但增加該散熱器la的整體重量,也 I長熱的傳導路徑而減緩散熱速度,再者,該導熱基座 2〇a的設置,亦增加該散熱器la的製造成本。 有鑑於此,本發明人為改善並解決上述之缺失,乃特 201105224 潛心研究並配合學理之運用,終於提出—種設 效改善上述缺失之本發明。 σ且有 【發明内容】 本發月之主要目的,在於提供一種具受熱部共面 熱結構,可降低其整體重量及縮短熱的傳導路徑,並進 降低散熱器的製造成本並提高其散熱效率。 並進而 為了達成上述之目的,本發明係為一種呈 :!熱:構的製法,其步驟係包括顺供具蒸發段:複: 二、二二八有不同凹弧面之一第一模具、及具有平整面之一 第一挺具,b)以該第一模具之凹弧面對於 ,進行漸近式w,而於該熱管形成有相㈣二=發 ⑽該第二模具之平整面對該熱管之二弧面進行”,而 =相互垂直的—接觸平面及—貼附平面;d)於任二相鄰 接=該接觸平面塗覆一接著劍;以及em該等熱管之各 接觸平面並列置入一治具中而結合,在該等熱管之 >面形成有齊平並共面的一受熱部。 為了達成上述之目的,本發明係為—種具受熱部共面 ^導,結構,包括複數熱管及-接著劑,每-熱管具有_ “又於該瘵發段成型有一接觸平面及鄰接該接觸平面 =-貼附平面’該等熱管係以該接觸平面相鄰並列,該接 著劍塗覆於任二相鄰熱管之該接觸平面而結合,並在該等 熱管之各貼附平面形成有齊平並共面的一受熱部。 2了達成上述之目的,本發明係為一種具導熱結構之 散熱商’係包括一接著齊卜複數熱管及複數鰭#,每一熱 201105224 管係具-蒸發段及-冷凝段,於該蒸發段成型有—接觸平 面及鄰接該接觸平面的一貼附平面,該等熱管係以該接觸 平面相鄰並列,於任二相鄰熱管之該接觸平面係塗覆有該 接者劑而結合’且該等熱管之各貼附平面形成有齊平並共 面的一受熱部,複數鰭片係平行並列地穿設於該等熱管^ 冷凝段。 相較於習知技術,由於本發明先於熱管之蒸發段上成 ^有結合形狀,並其接觸面塗覆接著劑,待接著劑結合熱 官之蒸發段後,即形成受熱部齊平並共面之導熱結構,相 較於習知將熱管嵌設導熱基座之散熱器,由於本發明中熱 的傳導不需經由導熱基座,故可縮短熱傳路徑及提升傳熱 速度,另因無導熱基座的設置,散熱器之整體重量及成本 可大為降低’增加本發明之實用性及經濟性。 【實施方式】 有關本發明之詳細說明及技術内容,配合圖式說明如 下,然而所附圖式僅提供參考與說明用,並非用來對本發 明加以限制者。 請參照第二圖至第八圖,係為本發明具受熱部共面之 導熱結構的製造流程圖及製造示意圖;首先提供複數熱管 10、一弟一核具20及一弟二模具20(步驟1〇〇),該熱管 係呈ϋ型而具一蒸發段η及二冷凝段12,該第一模具2〇包 括一第一平台21及一第一壓桿22’其中,該第一模具20之 第一平台21可設有不同的凹弧面211 、211a,亦可準備複 數第一模具20,再將不同凹弧面211 、211a分別設置於各 201105224 第-模具20上(請參第五圖八及苐五圖B),而該第—壓桿 22亦可設有凹弧面221 。該第二模具3〇係包括一第二平台 31及-第二堡桿32,該第二平台31及第二愿桿32之表面係 分別設有一平整面311 、321 。 ’、 2參照第三圖至第五圖及第五圖A,將該熱管1〇置放 於該第-平台21上’並以該第一模具2〇對該熱管⑴之基發 段η進行漸近式的壓掌(步驟200),以於該蒸發段漸 近形成所要的弧面,本實施例中,該第一 二組相對應的凹弧面,待該第一模具20S合後,= =22與該第-平台21之凹弧面221、211即對該熱管川之 蒸發段11進行壓掣,以於該蒸發段形成有相鄰的弧面 111〜114,後續,再以另一凹弧面221a、2m對該弧面 hi〜114進行壓掣;#,倘使該第—_22未對該熱管1〇之 蒸發段11進行壓掣時,則該蒸發段21上僅形成有弧面 111〜113。The heat sink 1_ can be guided away from the heat generated by the heat-generating electronic component. In the above structure, the heat pipes 2〇a are embedded in the heat conducting base 1〇a to facilitate attaching and bonding the heat pipes 2〇a to the heat generating electronic components; however, the heat conducting base 20a is not only Increasing the overall weight of the heat sink 1a also reduces the heat dissipation speed by the long heat conduction path. Moreover, the arrangement of the heat conductive base 2〇a also increases the manufacturing cost of the heat sink 1a. In view of the above, the present inventors have made an effort to improve and solve the above-mentioned shortcomings, and the present invention has finally been proposed to improve the above-mentioned defects. σ且有有发明发明的内容 The main purpose of this month is to provide a coplanar thermal structure with a heat receiving portion, which can reduce the overall weight and shorten the heat conduction path, and reduce the manufacturing cost of the heat sink and improve the heat dissipation efficiency. And in order to achieve the above object, the present invention is a method of manufacturing: heat: a structure, the steps of which include a vapor supply section: a complex: two, two, two, a first mold having a different concave curved surface, And a first one having a flat surface, b) asymptotic w for the concave curved surface of the first mold, and a phase (four) two = hair (10) formed on the heat pipe The two arc faces of the heat pipe are ", and = mutually perpendicular - the contact plane and the attachment plane; d) the adjacent two adjacent joints = the contact plane is coated with a sling; and the em contact planes of the heat pipes are juxtaposed A heat-receiving portion that is flush and coplanar is formed on the surface of the heat pipe. In order to achieve the above object, the present invention is characterized in that the heat-receiving portion is coplanar and structured. a plurality of heat pipes and an adhesive, each heat pipe having _ "and a contact plane formed in the burst portion and adjacent to the contact plane = - attaching plane", the heat pipes are juxtaposed adjacent to the contact plane, and then The sword is applied to the contact plane of any two adjacent heat pipes and is combined Each of the attachment planes of the heat pipes is formed with a heat receiving portion that is flush and coplanar. 2 In order to achieve the above object, the present invention is a heat dissipator having a heat conducting structure, comprising a first and a plurality of heat pipes and a plurality of fins, each heat 201105224 pipe tie-evaporation section and a condensation section, in the evaporation The segment is formed with a contact plane and an attachment plane adjacent to the contact plane, the heat pipes are adjacent to each other in the contact plane, and the contact plane of any two adjacent heat pipes is coated with the connector and combined And each of the attachment surfaces of the heat pipes is formed with a heat-receiving portion that is flush and coplanar, and the plurality of fins are parallel and juxtaposed through the heat pipe condensation section. Compared with the prior art, since the present invention has a bonding shape prior to the evaporation section of the heat pipe, and the contact surface is coated with an adhesive, after the bonding agent is combined with the evaporation section of the heat official, the heat receiving portion is formed flush and The coplanar heat-conducting structure can reduce the heat transfer path and increase the heat transfer speed because the heat transfer in the present invention does not need to pass through the heat-conducting base. Without the arrangement of the heat-conducting pedestal, the overall weight and cost of the heat sink can be greatly reduced' to increase the utility and economy of the present invention. The detailed description and technical content of the present invention are set forth below with reference to the accompanying drawings. Please refer to the second to eighth figures, which are a manufacturing flow chart and a manufacturing schematic diagram of the heat-conducting structure having the heat-receiving portion in common with the heat-receiving portion of the present invention; firstly, a plurality of heat pipes 10, a brother-and-core device 20 and a second die 20 are provided. 1)), the heat pipe is of a crucible type and has an evaporation section η and a second condensation section 12, the first mold 2 includes a first platform 21 and a first pressing rod 22', wherein the first mold 20 The first platform 21 can be provided with different concave curved surfaces 211, 211a, and a plurality of first molds 20 can be prepared, and different concave curved surfaces 211 and 211a are respectively disposed on the respective molds 20 of the 201105224 (refer to the fifth FIG. 8 and FIG. 5B), and the first pressing bar 22 may also be provided with a concave curved surface 221 . The second mold 3 includes a second platform 31 and a second fort 32. The surfaces of the second platform 31 and the second rod 32 are respectively provided with a flat surface 311, 321 . ', 2 with reference to the third to fifth figures and the fifth figure A, placing the heat pipe 1 on the first platform 21' and performing the base section η of the heat pipe (1) with the first die 2 An asymptotic palm press (step 200), wherein the evaporating section asymptotically forms a desired arc surface. In this embodiment, the first two sets of corresponding concave arc surfaces are to be combined with the first mold 20S, == 22 and the concave curved surface 221, 211 of the first platform 21, that is, the evaporation section 11 of the heat pipe is compressed, so that the evaporation section is formed with adjacent curved faces 111 to 114, and then, another concave The arc faces 221a, 2m are pressed against the arc faces hi~114; #, if the first_22 is not pressed against the evaporation section 11 of the heat pipe 1〇, only the curved face 111 is formed on the evaporation section 21. ~113.

請續參照第六圖、第六圖A、第七圖及第七圖A,將 ,第-模具2G漸近壓¥過的熱管1()再置人該第二模㈣的 第二平台31上,並令該第二模具30對該熱管1〇之蒸發段11 的弧面III〜m進行壓掣(步驟3〇〇),其中,該第二模具 之第二平台31與該蒸發段丨丨相接觸的表面為一平整面^ i i ’該第二壓桿32與該熱管1G之蒸發利相接觸的表面亦可 設為一平整面321 ,本實施例中,該第二模具邓係設有二 組相對的平整面’因此’待該第二模具30壓合後,該第二 壓桿32與該第二平台31之平整面321、3ιι即對該熱㈣ 201105224 之蒸發段11進行壓平,其弧面ιη〜I14即形成相互垂直的二 組平面,經壓平後的蒸發段u,之截面係呈矩形,包括二 接觸平面1】2,、114,及與其相互垂直的二貼附平面ιη,、 113’ ’·再者,當該第二模具3〇僅壓掣該弧面⑴〜113時,該 熱管10之蒸發段U,的截面係呈「Q」狀。 x 該熱管10之蒸發段丨丨分別經該第一模具20及該第二模 具30之壓掣後,即完成後續結合時所需形狀,依上述方式 對其餘的熱管1G進行相同的步驟至所需熱管U)的數量,以 備結合該等熱管10。 凊另參照第八圖至第十一圖,係顯示本發明之熱管蒸 發段=結合示意圖;後續,依所需的熱管1〇數,於任二相 鄰熱管10之該接觸平面112,、114,塗覆一接著劑5〇(步驟 400),該接著劑50為具有導熱性質的黏著劑,如導熱膠等 〇 接著,將該等熱管10之各接觸平面112,、114,並列置 入設有複數穿孔_的治具4G中,將料歸狀蒸發段 11’置於該治具40的-座台4〇1上,該等接觸平面ιΐ2,、 114,藉由該接著劑5G而作初步的結合,再另取一壓板㈣ -夾板42,該壓板41及該夾板42係分別設有—壓料面 4H及-夾掣平面421,以平壓並定位該等熱管1〇之基發 (步驟) ’再以—c型爽43固定該壓板41,待該接 著劑50SMt*結合料熱管1G之蒸發段後即可將該 等熱管10自該治具40中移出。 請參第十-圖’係為本發明具受熱部共面之導熱結構 201105224 2局部剖經該治㈣的定位後 段11’係'以該接觸面112,、114, ^、m之蒸發 1。之蒸發段η,的崎面】]3,係等熱管 -受熱侧,以供點接一 共面的 者’該等熱管i。之蒸發段u、另未式),再 平且丑面而弗忐女门 點附千面Π3,亦為齊 /、面*成有—固持部咖,以供_ μ )夾設而將其ϋ定於該發熱f子元件上。 (圖未式 凊續參照第十二圖,将氧 Λ 散埶哭.节算H 、 共面之導熱結構的 :、二,該專熱官10之冷凝段】2係為分隔設置,且 ^圓形,於該等冷凝段12上復穿設複數籍片;二 成一散熱器1。 1 J 70 以上所述僅為本發明之較佳實施例,非用以限定本發 句應俱屬本發明之專利範圍。 又 【圖式簡單說明】 第—圖係為習知的熱管散熱器; 第二圖係為本發明具受熱部共面之導熱結構的製造流程 圖; 第三圖係、顯示本發明具受熱部共面之導熱結構的壓擎組 設示意圖; 第四圖係為第三圖之剖視圖; 第五圖係顯示本發明具受熱部共面之導熱結構的壓掣示 意圖; 第五圖Α係第五圖Α部分的局部放大圖; 第五圖B係顯示另一凹弧面的壓掣示意圖; 201105224 第六圖#本發明具受熱部共面之導熱結構的壓半組設圈 , 六圖A部分的局部放大示意圖; 圖侍、本發明具受熱部共面之導熱結構的壓平示意圖 =A係第七圖A部分的局部放大圖 固示意圖 圖係本發明具受熱部共面之導熱結構的組 第九圖 係本發明具受熱部共 面之導熱結構的鎖固示意 圖 第十圖 係本發明具受熱邹共面之導熱結構的鎖__ 第十一圖 本發明具*熱部共面之導熱結構的剖視圖;以 第十二圖係本發明具受熱部共面之 要元件符號說明 &lt;習知&gt; la 散熱器 na 溝槽 3〇a 鰭片 &lt;本發明&gt; 1 散熱器 11、Π’蒸發段 【主要元#篇铋约η'、、,·口構的散熱器。 10a 導熱座 熱管 201105224 111〜114 弧面 1130 受熱部 1110 固持部 111, 、113’貼附平面 112, 、114’接觸平面 20 第一模具 21 第一平台 211 、211a 凹弧面 22 第一壓桿 221 ' 221a 凹弧面 • 30 第二模具 31 第二平台 311 平整面 32 第二壓桿 321 平整面 40 治具 401 座台 41 壓板 411 壓掌平面 42 夹板 421 夾掣平面 43 C型夾 50 接著劑 60 鰭片 步驟 100-500Referring to the sixth figure, the sixth figure A, the seventh figure and the seventh figure A, the heat pipe 1 () of the first die 2G is placed on the second platform 31 of the second die (4). And causing the second mold 30 to compress the arc surface III~m of the evaporation section 11 of the heat pipe 1 (step 3〇〇), wherein the second platform 31 of the second mold and the evaporation section The contact surface is a flat surface ^ ii 'the surface of the second pressure rod 32 that is in contact with the evaporation of the heat pipe 1G can also be set as a flat surface 321 . In this embodiment, the second mold is provided with a double surface. The two sets of opposite flat faces 'so that' after the second die 30 is pressed, the second press bar 32 and the flat surface 321 , 3 ιι of the second platform 31 flatten the evaporation section 11 of the heat (4) 201105224 The curved faces ιη~I14 form two sets of planes perpendicular to each other, and the flattened evaporation section u has a rectangular cross section, including two contact planes 1], 2, 114, and two perpendicularly attached thereto. The plane ιη, 113' ' again, when the second mold 3 〇 only presses the arc surface (1) ~ 113, the section of the evaporation section U of the heat pipe 10 is "Q" shape. x After the evaporation section 该 of the heat pipe 10 is pressed by the first mold 20 and the second mold 30 respectively, the shape required for the subsequent bonding is completed, and the same steps are performed on the remaining heat pipes 1G in the above manner. The number of heat pipes U) is required to be combined with the heat pipes 10. Referring to the eighth to eleventh drawings, the heat pipe evaporation section of the present invention is shown in conjunction with the schematic diagram; subsequently, depending on the number of heat pipes required, the contact planes 112, 114 of any two adjacent heat pipes 10 Applying an adhesive 5〇 (step 400), the adhesive 50 is an adhesive having thermal conductivity, such as a thermal conductive adhesive, etc., and then the contact planes 112, 114 of the heat pipes 10 are juxtaposed. In the jig 4G having a plurality of perforations, the material-evaporating section 11' is placed on the seat 4'' of the jig 40, and the contact planes ιΐ2, 114 are made by the adhesive 5G. In a preliminary combination, a press plate (4) is further used - a splint 42 which is respectively provided with a pressing surface 4H and a clamping plane 421 for flat pressing and positioning the base of the heat pipes 1 (Step) 'The platen 41 is fixed by the -c type cool 43. After the evaporation section of the adhesive 50SMt* binder heat pipe 1G, the heat pipes 10 can be removed from the jig 40. Please refer to the tenth-figure diagram as the heat-conducting structure with the heat-receiving part coplanar in the present invention. 201105224 2 The partial section 11' of the section (the fourth section) of the treatment (4) is the evaporation of the contact surfaces 112, 114, ^, m. The evaporation section η, the surface of the surface]] 3, is the same heat pipe - the heating side, for the point to connect a coplanar 'the heat pipe i. The evaporation section u, the other type), and then the flat and ugly face, and the 忐 忐 门 附 附 附 附 附 附 附 附 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 It is determined on the heat-f element. (The figure is not followed by the twelfth figure, the oxygen 埶 埶 . . . . . . . . . . . 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 节 、 、 、 、 、 、 、 、 A circular shape is formed on the condensing section 12 to form a plurality of pieces; the second one is a heat sink 1. 1 J 70 The above description is only a preferred embodiment of the present invention, and is not intended to limit the present sentence. The patent scope of the invention. [Simplified description of the drawings] The first figure is a conventional heat pipe radiator; the second figure is a manufacturing flow chart of the heat conduction structure with the heat-receiving part coplanar; the third figure shows FIG. 4 is a cross-sectional view showing a heat transfer structure having a heat-receiving portion in common; FIG. 5 is a cross-sectional view showing a heat-conducting structure having a heat-receiving portion in common; FIG. Figure 5 is a partial enlarged view of a portion of the fifth figure; Figure 5B is a schematic view showing the pressure of another concave curved surface; 201105224 sixth figure # The present invention has a heat-conducting heat-conducting structure of the heat-receiving portion , a partial enlarged view of the portion A of the six figures; FIG. 9 is a partial enlarged view of a portion A of the seventh embodiment of the present invention. The ninth diagram of the heat-conducting structure having a heat-receiving portion of the present invention is a lock of a heat-conducting structure having a heat-receiving portion. The tenth figure of the solid schematic diagram is a lock of the heat-conducting structure with the heat of the co-planar surface of the present invention. The eleventh figure shows a cross-sectional view of the heat-conducting structure with the co-planar surface of the present invention; DESCRIPTION OF THE ELEMENTS OF THE ELEMENTS < Descrição </ RTI> la radiator t groove 3〇a fin &lt;present invention&gt; 1 radiator 11, Π' evaporation section ·The heat sink of the mouth. 10a Heat pipe heat pipe 201105224 111~114 Arc surface 1130 Heated part 1110 Holding part 111, 113' Attaching plane 112, 114' Contact plane 20 First mold 21 First platform 211, 211a Concave Curved surface 22 First pressing rod 221 ' 221a concave curved surface • 30 second mold 31 second platform 311 flat surface 32 second pressure rod 321 flat surface 40 jig 401 seat 41 pressure plate 411 pressure palm plane 42 splint 421 clamp Plane 43 C-clamp 50 60 fin steps 100-500

Claims (1)

201105224 七、申請專利範圍: 1 種具又熱部共面之導熱結構的製法,其步 括: 驟包 &amp;)提供具紐段之複數歸、具有不同凹弧面之 一杈具、及具有平整面之—第二模具; 罘 b)以該第—模具之凹弧面對於每—熱管之蒸發 漸近式的麗掣,而於該熱管形成有相鄰的二弧面.订 =該第二模具之平整面對該熱管之二弧面進行” 形成相互垂直的一接觸平面及一貼附平面; 巾於任二㈣熱管之賴財面塗覆―接著劑; e)將該等熱管之各接觸平面刻置人―治呈中而处入 ’在:等:::貼附平面形成有齊平並共面的:受熱;: 的製法,里中兮一丰^ ^,、、、、口稱 面。’、q ,中’該第一模具係設有不同的凹弧 3、如請求項第】項所述之呈 的製法,其中該❹驟中係設有複數第、二;Γ:?結構 面係分別設於不同的第—模具上複數帛_具,該寺凹孤 的製二項所述:具!熟部共面之導熱結構 段進行壓掣而令’違弟一模具係對該熱管之蒸發 5二孚=形成有另一相鄰的二弧面。 的製法,:c項所述之具受熱部共面之導熱結構 段進行&gt;1掣而右驟中’該第一換具係對該熱管之蒸發 有另-相互垂直的一接觸平面及一貼附 12 201105224 平面。 6如。月求項第)項所述之具受熱 的製中該㈣中,該接著劑係為導熱膠一 接菩Μ — ^又熱*共面之導熱結構’包括複數熱管及 熱管具有一蒸發段,於該蒸發段成型有- ==該接觸平面的一貼附平面,該等熱管係以 接觸平面而^並列,該接著劑塗覆於任二相鄰熱管之該 並在該等熱管之各貼附平面形成有齊平 並共面的一文熱部。 第7項所述之具受熱部共面之導熱結構 有另、-:觸發段的截面係呈矩形,該蒸發段係成型 有另-接觸平面及鄰接該接觸平面的另—貼附平面。 ,求項第7項所述之具受熱部共面之導熱結構 其中該熱官之蒸發段的截面係呈「0」狀。 二2求項第7項所述之具受熱部共面之導熱結構 凝與中:專熱管更分別包括有分隔設置的一冷凝段,該冷 减長之截面係呈圓形。 11、一種具導熱結構之散熱器,係包括. 接著劑; 複數熱管’每-熱管係具一蒸發段及一冷凝段,於該 洛發段成型有-接觸平面及鄰接該接觸平面的一貼附平面 ’該專熱官係以該接觸平面相鄰並列,於任二相_管之 =觸平面係塗覆有該接著劑而結合,且該等熱管之各貼 附平面形成有齋平並共面的—受熱部;錢 201105224 複數鰭片,係平行並列地穿設於該等熱管之冷凝段。 12、 如請求項第n項所述之具導熱結構之散熱器,其 中該熱管之蒸發段的截面係呈矩形,該蒸發段係成型有另 一接觸平面及鄰接該接觸平面的另一貼附平面。 13、 如請求項第11項所述之具導熱結構之散熱器,其 中該熱管之蒸發段的截面係呈「Ω」狀。 14、 如請求項第11項所述之具導熱結構之散熱器,其 中該等熱管更分別包括有分隔設置的一冷凝段,該冷凝段 之截面係呈圓形。201105224 VII. Scope of application for patents: 1 method for manufacturing a heat-conducting structure with a common surface, including: a package with a plurality of points, a cookware with different concave curved surfaces, and The flat surface - the second mold; 罘 b) with the concave curved surface of the first mold for each of the heat pipe evaporation asymptotically, the heat pipe is formed with adjacent two arc surfaces. The flat surface of the mold faces the two arc faces of the heat pipe to form a contact plane perpendicular to each other and an attachment plane; the towel is coated on the second (four) heat pipe to the front surface of the heat pipe; e) each of the heat pipes The contact plane engraves the person--the treatment is in the 'in::::: the attached plane is formed flush and coplanar: heated;: the method of production, the middle of the 兮一丰 ^ ^,,,,, mouth The method of ', q, and the 'the first mold is provided with different concave arcs 3, as described in the claim item 】, wherein the steps are plural and second; Γ:? The structural planes are respectively set on different first-die pairs, and the temple is made up of two parts: The heat-conducting structure section is pressed to make the evaporation of the heat pipe 5 volts to form another adjacent two-arc surface, and the heat-receiving part is coplanar The heat-conducting structure section is carried out &gt;1掣 and the right-hand is in the middle of the first heat exchanger, which has another contact plane perpendicular to the evaporation of the heat pipe and a affixing 12 201105224 plane. 6如月月求项) In the heat-receiving system, in the fourth embodiment, the adhesive is a thermal conductive adhesive, and the heat-conducting structure comprises a plurality of heat pipes and heat pipes having an evaporation section, and the evaporation section is formed in the evaporation section. - == an attachment plane of the contact plane, the heat pipes are juxtaposed in a contact plane, the adhesive being applied to any two adjacent heat pipes and being flushed on the respective attachment planes of the heat pipes And a co-planar heat part. The heat-conducting structure with the heat-receiving part coplanar in the seventh item has another, - the trigger section has a rectangular cross section, and the evaporation section is formed with another contact plane and adjacent to the contact plane. The other is attached to the plane. The heat conducting structure wherein cross-section and the evaporating section of the heat was official "0" state. The heat-conducting structure with the heat-receiving part being coplanar according to Item 2 of the second item is condensed and medium-sized: the heat-receiving tube further comprises a condensing section separately provided, and the cold-reduced section has a circular shape. 11. A heat sink having a heat conducting structure, comprising: a second agent; a plurality of heat pipes 'each heat pipe system having an evaporation section and a condensation section, and forming a contact plane and a sticker adjacent to the contact plane in the Luofa section Attached to the plane 'the special thermal system is adjacent to the contact plane, and the two-phase_tube=contact plane is coated with the adhesive, and the attachment planes of the heat pipes are formed with Coplanar-heated part; money 201105224 A plurality of fins are arranged in parallel parallel to the condensation section of the heat pipes. 12. The heat sink having a thermally conductive structure according to item n, wherein the evaporation section of the heat pipe has a rectangular cross section, and the evaporation section is formed with another contact plane and another attachment adjacent to the contact plane. flat. 13. The heat sink having a heat conducting structure according to claim 11, wherein the section of the evaporation section of the heat pipe has an "Ω" shape. 14. The heat sink of claim 12, wherein the heat pipes further comprise a condensing section disposed separately, the condensing section having a circular cross section.
TW98125589A 2009-07-29 2009-07-29 Method of thermo conductor having coplanar evaporator sections TWI407897B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98125589A TWI407897B (en) 2009-07-29 2009-07-29 Method of thermo conductor having coplanar evaporator sections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98125589A TWI407897B (en) 2009-07-29 2009-07-29 Method of thermo conductor having coplanar evaporator sections

Publications (2)

Publication Number Publication Date
TW201105224A true TW201105224A (en) 2011-02-01
TWI407897B TWI407897B (en) 2013-09-01

Family

ID=44813946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98125589A TWI407897B (en) 2009-07-29 2009-07-29 Method of thermo conductor having coplanar evaporator sections

Country Status (1)

Country Link
TW (1) TWI407897B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2298490A1 (en) * 2009-09-18 2011-03-23 Cpumate Inc. Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269629A (en) * 2005-03-23 2006-10-05 Toshiba Mitsubishi-Electric Industrial System Corp Heat pipe type cooler
TW200716939A (en) * 2005-10-25 2007-05-01 Hoff Thermal Industry A method to form a heat sink and its positioning structure
US20070261244A1 (en) * 2006-05-12 2007-11-15 Chih-Hung Cheng Leveling Method for Embedding Heat Pipe in Heat-Conducting Seat
US7597134B2 (en) * 2007-03-07 2009-10-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe
US7443676B1 (en) * 2007-08-09 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
TWM356369U (en) * 2008-12-18 2009-05-01 Golden Sun News Tech Co Ltd Heat dissipation device having protection structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2298490A1 (en) * 2009-09-18 2011-03-23 Cpumate Inc. Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith

Also Published As

Publication number Publication date
TWI407897B (en) 2013-09-01

Similar Documents

Publication Publication Date Title
US20130098584A1 (en) Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
TWI308052B (en)
TWM277984U (en) Mounting frame of heat pipe cooler
TW201105224A (en) Method and structure of thermo conductor having coplanar evaporator sections and heat sink with the thermo conductor
CN204859858U (en) A heat conduction structure and electronic equipment
TW201005253A (en) Manufacturing method for levelly combining evaporation ends of aligned heat pipes to fastening seat and structure thereof
TW200300838A (en) Method of manufacturing heat-dissipating device
TWM410251U (en) Heat dissipation module
CN101149235B (en) Heat pipe radiator and manufacturing method thereof
TWI305132B (en)
TWI378007B (en)
TWM408681U (en) Assembled structure of heat pipe and heat-conduction body
TWI331207B (en)
CN101990384A (en) Heat conduction structure with coplanar heating parts, manufacturing method and heat sink with the same structure
CN102049672B (en) Coplanar manufacturing method of multi-heat pipe evaporating part and its finished product structure and tools
TWI303971B (en)
TWI270339B (en) Heat conduits and method for forming heat-dissipating fins by squeeze-shaping
TWI236337B (en) Forming method of heat pipe and dissipation fin
TWI267726B (en) Improved structure and manufacturing method of heat collector sheet
TWI313203B (en)
TWM392990U (en) Heat-dissipating module
CN102984917B (en) Method for manufacturing heat sink
TWI312268B (en)
TWI220466B (en) Aluminum-copper junction heat sink and its manufacturing method
TWM416127U (en) Modular cooling device built in fin formed heat plates

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees