TW201042389A

TW201042389A - Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same

Info

Publication number: TW201042389A
Application number: TW099104748A
Authority: TW
Inventors: Masahiro Miyasaka; Yukiko Muramatsu
Original assignee: Hitachi Chemical Co Ltd
Priority date: 2009-02-26
Filing date: 2010-02-12
Publication date: 2010-12-01
Also published as: WO2010098183A1; CN104808444A; KR101339530B1; TWI479261B; CN103543608A; JP5327310B2; JPWO2010098183A1; CN102317864A; KR20110106912A

Abstract

Disclosed is a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator and (D) a sensitizing dye, wherein the binder polymer (A) has a constituent unit derived from (meth)acrylic acid and a constituent unit derived from (meth)acrylic acid benzyl ester or a (meth)acrylic acid benzyl ester derivative, the photopolymerizable compound (B) comprises a compound having one ethylenically unsaturated bond, and the sensitizing dye (D) comprises a compound represented by general formula (1). In formula (1), R1 and R2 independently represent a substituted or unsubstituted phenyl, thienyl or furyl group; R3 represents an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or an alkylester group having 1 to 10 carbon atoms; a and b independently represent an integer of 0 to 2; and m represents an integer of 0 to 5.

Description

201042389 六、發明說明：【發明所屬之技術領域】本發明係關於感光性樹脂組成物、以及使用其之感光性元件、光阻圖型的形成方法及印刷電路板的製造方法。【先前技術】對於印刷電路板的製造領域，作爲使用於蝕刻或鍍敷〇等之光阻材料，廣泛使用感光性樹脂組成物或感光性元件 (層合體）。印刷電路板例如可如以下製造。首先，將感光性元件的感光性樹脂組成物層層合於電路形成用基板上。其次，以活性光線照射於感光性樹脂組成物層之所定部分，使該所定部分曝光並使其硬化。其後，將支持薄膜剝離除去後，藉由將該所定部分以外之部分（未曝光•未硬化部分）由基板上除去（顯像），於基板上形成由感光性樹脂組成〇 w 物的硬化物所成之光阻圖型。對於所得之光阻圖型施予蝕刻處理或鍍敷處理，於基板上形成電路後，最後將光阻剝離除去製造出印刷電路板。其中所謂蝕刻處理爲，藉由光阻圖型將未經被覆的電路形成用基板之導體層經蝕刻除去後，剝離光阻之方法。另一方面，所謂鍍敷處理爲，藉由光阻圖型於未經被覆的電路形成用基板之導體層上進行銅及焊接等鍍敷處理後除去光阻，藉由該光阻將經被覆的金屬面進行軟蝕刻之方法 -5- 201042389 作爲上述曝光之方法，過去將水銀燈作爲光源，使用介著光罩使其曝光之方法。又，近年來，將稱爲DLP ( Digital Light Processing)或 LDI ( Laser Direct Imaging) 的圖型數位數據直接於感光性樹脂組成物層進行描畫之直接描畫曝光法已被提案（例如參照非專利文獻1)。該直接描畫曝光法比介著光罩之曝光法可更精準的對好位置，且因可得到高精細圖型，故可應用於高密度封裝基板之製作上。曝光步驟中，欲提高生產效率之，必須儘可能縮短曝光時間。但上述的直接描畫曝光法中，藉由於光源使用雷射等單色光，一邊掃描基板一邊照射光線下，與過去介著光罩之曝光方法相比，有著需要更多曝光時間之傾向。因此，與過去相比感光性樹脂組成物之感度必須更提高。另一方面，隨著近年印刷電路板之高密度化，對於感光性樹脂組成物，對高解像性及高密著性之要求亦日漸提高。特別對於封裝基板製作，期待可形成線寬/間距寬（ L/S )爲10/10 (單位：μιη )以下之光阻圖型的感光性樹脂組成物。又，高密度封裝基板中，因電路間的寬度較爲狹隘，故光阻形狀優良亦爲重要。光阻的截面形狀可爲台形或逆台形，若有著光阻之袖擺時，於藉由其後的蝕刻處理或鎪敷處理所形成之電路會有產生短路或斷線之可能性而不佳，光阻形狀爲矩形且不具有袖擺者爲佳。且，對於感光性樹脂組成物其硬化後之剝離特性優良 -6- 201042389 被要求者。即，藉由縮短光阻之剝離時間，驟之生產效率，又若使光阻的剝離片尺寸變對電路基板上之剝離片的再附著，提高生產: 其中，專利文獻1中作爲亦可對應直接具有良好感度的感光性樹脂組成物，已揭示劑聚合物或敏化色素等之感光性樹脂組成物專利文獻2中揭示欲使對基板的密著性 ^ )良好，導入多官能丙烯酸酯化合物使交聯性樹脂組成物。專利文獻3中揭示欲使曝光部分與未曝 (成像性）變的良好，使用兒茶酚、氫醌等感光性樹脂組成物。 [先行技術文獻] [專利文獻] 〇 [專利文獻1]特開2005-122123號公報 [專利文獻2]特開2003-2 15799號公報 [專利文獻3]特開2000-1 62767號公報 [非專利文獻] [非專利文獻1 ]「電子實際裝置技術」’ ，p . 7 4 〜7 9 【發明內容】可提高剝離步小時，可防止客。描畫曝光法而使用特定黏合〇 (耐顯像液性點變多的感光光部分之對比聚合禁止劑的 2002年6月號 201042389 發明所要解決的課題感光性樹脂組成物中必須平衡良好下提高如感度、解像性、密著性、光阻形狀及硬化後之剝離特性的各特性。然而，專利文獻1的感光性樹脂組成物於感度或剝離特性等點下爲良好，但對於解像度及密著性的點並非充分〇專利文獻2的感光性樹脂組成物雖具有良好密著性，但相反地對於剝離特性的點則並不充分，有著硬化物難以由基板進行剝離除去之傾向。專利文獻3的感光性樹脂組成物爲解像度、密著性及成像性之點上良好者但感度的點上並未充分，使用於直接描畫曝光法時必須要更長的曝光時間。如此，過去的感光性樹脂組成物皆無法平衡良好下使光阻圖型形成後的感光性樹脂組成物所被要求之各特性達到令人充分滿足的程度。其中，本發明係以提供感度、解像性、密著性、光阻形狀及硬化後之剝離特性皆良好之感光性樹脂組成物、以及使用其之感光性元件、光阻圖型的形成方法及印刷電路板的製造方法爲目的。欲達到上述目的，本發明爲提供一種含有（A)黏合劑聚合物、（B )光聚合性化合物、（C )光聚合啓始劑及 (D )敏化色素之感光性樹脂組成物，其中（A )黏合劑聚合物爲具有以（甲基）丙烯酸爲基準的結構單位、與以 (甲基）丙烯酸苯甲酯或（甲基）丙烯酸苯甲酯衍生物爲 -8 ~ 201042389 乙烯基準的結構單位，（B )光聚合性化合物含有具有1個性不飽和鍵之化合物，（D )敏化色素含有下述一般5 )所示化合物者。 [化1][Technical Field] The present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for forming a photoresist pattern, and a method for producing a printed wiring board. [Prior Art] In the field of manufacturing printed circuit boards, a photosensitive resin composition or a photosensitive element (laminate) is widely used as a photoresist material used for etching or plating. The printed circuit board can be manufactured, for example, as follows. First, a photosensitive resin composition layer of a photosensitive element is laminated on a circuit-forming substrate. Next, the predetermined portion of the photosensitive resin composition layer is irradiated with active light, and the predetermined portion is exposed and hardened. Thereafter, after the support film is removed by peeling off, the portion other than the predetermined portion (unexposed or unhardened portion) is removed from the substrate (developed), and hardening of the photosensitive material is formed on the substrate. The pattern of the photoresist formed by the object. After the resulting photoresist pattern is subjected to an etching treatment or a plating treatment, a circuit is formed on the substrate, and finally the photoresist is peeled off to produce a printed circuit board. The etching treatment is a method in which the conductor layer of the uncoated circuit-forming substrate is removed by etching by a photoresist pattern, and the photoresist is removed. On the other hand, the plating treatment is performed by performing a plating treatment such as copper and soldering on a conductor layer of a circuit-formed substrate which is not coated by a photoresist pattern, and then removing the photoresist, and the photoresist is coated by the photoresist. Method for Soft Etching of Metal Surface-5-201042389 As a method of the above exposure, a mercury lamp has been used as a light source in the past, and a method of exposing it through a photomask has been used. In addition, in recent years, a direct drawing exposure method in which pattern digital data called DLP (Digital Light Processing) or LDI (laser Direct Imaging) is directly drawn on a photosensitive resin composition layer has been proposed (for example, refer to the non-patent literature). 1). The direct drawing exposure method can more accurately position the mask than the exposure method of the mask, and can be applied to the fabrication of a high-density package substrate because a high-definition pattern can be obtained. In the exposure step, in order to increase production efficiency, it is necessary to shorten the exposure time as much as possible. However, in the direct drawing exposure method described above, since the light source is irradiated with light by using monochromatic light such as laser light, it tends to require more exposure time than the exposure method in which the photomask is used in the past. Therefore, the sensitivity of the photosensitive resin composition must be improved as compared with the past. On the other hand, with the recent increase in the density of printed circuit boards, the requirements for high resolution and high adhesion have been increasing for photosensitive resin compositions. In particular, in the production of a package substrate, it is expected that a photosensitive resin composition having a line width/pitch width (L/S) of 10/10 (unit: μιη) or less can be formed. Further, in the high-density package substrate, since the width between the circuits is narrow, it is important that the shape of the photoresist is excellent. The cross-sectional shape of the photoresist may be a mesa shape or a counter-top shape. If the sleeve is formed with a photoresist, the circuit formed by the subsequent etching treatment or the enamel treatment may have a short circuit or a broken line. It is preferable that the shape of the photoresist is rectangular and does not have a sleeve. Further, the photosensitive resin composition is excellent in peeling properties after curing -6-201042389. In other words, by shortening the peeling time of the photoresist and the production efficiency, the size of the peeling sheet of the photoresist is changed to the re-adhesion of the peeling sheet on the circuit board, and the production is improved. A photosensitive resin composition which has a good sensitivity, and a photosensitive resin composition such as a polymer or a sensitizing dye is disclosed. Patent Document 2 discloses that a polyfunctional acrylate compound is introduced in order to improve the adhesion to a substrate. A crosslinkable resin composition is obtained. Patent Document 3 discloses that a photosensitive resin composition such as catechol or hydroquinone is used in order to improve the exposed portion and the unexposed (imaging property). [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2005-122123 [Patent Document 2] JP-A-2003-1-15799 [Patent Document 3] JP-A-2000-1 62767 [Non- [Patent Document] [Non-Patent Document 1] "Electronic Device Technology", p. 7 4 to 7 9 [Invention] The peeling step can be increased to prevent passengers. In the case of the exposure method, a specific adhesive enthalpy (a comparative polymerization inhibitor which is resistant to the development of a photosensitive liquid portion) is disclosed. The problem of the photosensitive resin composition must be balanced and improved. Each of the characteristics of the sensitivity, the resolving property, the adhesiveness, the resistive shape, and the peeling property after the curing. However, the photosensitive resin composition of Patent Document 1 is excellent in terms of sensitivity or peeling characteristics, but is excellent in resolution and density. The point of the property is not sufficient. The photosensitive resin composition of the patent document 2 has good adhesion, but conversely, the point of the peeling property is not sufficient, and the cured product tends to be difficult to be removed by the substrate. The photosensitive resin composition of 3 is excellent in resolution, adhesion, and imageability, but the sensitivity is not sufficient, and it is necessary to use a direct exposure method for a direct exposure time. Thus, the past sensitization The resin composition is not balanced, and the characteristics of the photosensitive resin composition after the formation of the photoresist pattern are required to be satisfactory. The present invention provides a photosensitive resin composition which is excellent in sensitivity, resolution, adhesion, photoresist shape, and peeling property after hardening, and a photosensitive member and photoresist using the same. The object of the invention is to provide a method for forming a pattern and a method for producing a printed circuit board. To achieve the above object, the present invention provides a polymer comprising (A) a binder, (B) a photopolymerizable compound, and (C) a photopolymerization initiator. And (D) a photosensitive resin composition of a sensitizing dye, wherein (A) the binder polymer has a structural unit based on (meth)acrylic acid, and is benzyl (meth)acrylate or (methyl) A benzyl acrylate derivative is a structural unit based on ethylene from -8 to 201042389, (B) a photopolymerizable compound contains a compound having one individual unsaturated bond, and (D) a sensitizing dye contains a compound represented by the following general 5) By. [Chemical 1]

[式（1 )中，R1及R2各獨立，表示取代或無取代的苯噻吩基或呋喃基，R3表示碳數1〜的烷基、碳數1〜烷氧基或碳數1〜1〇的烷基酯基，a及b各獨立，表示的整數，m表示0〜5的整數，m表示2〜5時，複數存 R3彼此可爲相同或相異。] 即，本發明的感光性樹脂組成物因具有上述構成 ❹ 感度、解像性、密著性、光阻形狀及硬化後之剝離特良好。本發明者們，推測藉由使用具有特定結構單位 A )黏合劑聚合物，可提高解像性及硬化後之剝離性由使用含有具有1個乙烯性不飽和鍵之化合物的（B) 合性化合物，可平衡良好下提高解像性、密著性、光狀及硬化後之剝離特性，藉由使用含有上述一般式所合物的（D )敏化色素，可提高感度，將這些組合後到滿足上述所有特性之感光性樹脂組成物。本發明的感光性樹脂組成物中，（B )光聚合性基、 10的 0〜2 在之，其性皆之（，藉光聚阻形示化可得化合 -9 - 201042389 物爲含有分別由下述一般式（2)或下述一般式（3)所示各化合物8 [化2][In the formula (1), R1 and R2 each independently represent a substituted or unsubstituted phenylthienyl group or a furyl group, and R3 represents an alkyl group having 1 to 10 carbon atoms, a carbon number of 1 to alkoxy group or a carbon number of 1 to 1 Å. The alkyl ester group, a and b are each independently represented by an integer, m represents an integer of 0 to 5, and m represents 2 to 5, and the plural R3 may be the same or different from each other. In other words, the photosensitive resin composition of the present invention is excellent in the above-mentioned composition, sensitivity, resolution, adhesion, photoresist shape, and peeling after curing. The inventors of the present invention presumed that by using a specific structural unit A) binder polymer, the resolution and the peeling property after hardening can be improved by using (B) compound containing a compound having one ethylenic unsaturated bond. The compound can improve the resolution, the adhesion, the light, and the peeling property after hardening, and the sensitivity can be improved by using the (D) sensitizing dye containing the above general formula, and these are combined. A photosensitive resin composition satisfying all of the above characteristics. In the photosensitive resin composition of the present invention, (B) a photopolymerizable group, 10 to 2 of 10, all of which have their properties (by photopolymerization, the compound can be obtained - 9 - 201042389 Each compound 8 represented by the following general formula (2) or the following general formula (3) [Chemical 2]

[式（2)中，R4表示氫原子或甲基，rS表示氫原子、甲基或鹵化甲基，R6表示碳數1〜6的烷基、碳數1〜6的烷氧基、羥基或鹵素原子，η表示0〜4的整數，p表示1〜4的整數，η表示2〜4時，複數存在之R6可相同或相異。] [化3][In the formula (2), R4 represents a hydrogen atom or a methyl group, rS represents a hydrogen atom, a methyl group or a halogenated methyl group, and R6 represents an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group or The halogen atom, η represents an integer of 0 to 4, p represents an integer of 1 to 4, and η represents 2 to 4, and the plural R6 may be the same or different. ] [Chemical 3]

ΟII oc2h4)；—〇—c—c=ch2 (3) [式（3)中，R7表示氫原子或甲基，Rs表示碳數^丨之的院基、碳數1〜12的院氧基、羥基或鹵素原子，r表示1〜 12的整數’ k表示0〜5的整數，k表示2〜5時，複數存在之 R8可爲相同或相異。] 藉此，感光性樹脂組成物之解像性、密著性、光PH形狀及硬化後的剝離特性可平衡良好下提高。又，（B)光聚合性化合物可進一步含有雙酚a系二（甲基）丙烯酸酯化合物。藉此，可進一步提高鹼顯像,丨生、解像性及硬化後之剝離特性。 -10- 201042389 且，（B)光聚合性化合物可進一步含有具有（聚）氧伸乙基鏈或（聚）氧伸丙基鏈之三羥甲基丙烷三（甲基 )丙烯酸酯化合物。藉此，可進一步提高感光性樹脂組成物的鹼顯像性、解像性、密著性及硬化後之剝離特性。且，（B)光聚合性化合物可進一步含有具有（聚）氧伸乙基鏈及（聚）氧伸丙基鏈之聚烷二醇二（甲基）丙烯酸酯。藉此，可提高感光性樹脂組成物之硬化物（硬化〇膜）的可撓性。對於本發明的感光性樹脂組成物，（A )黏合劑聚合物若進一步具有以（甲基）丙烯酸烷基酯爲基準的結構單位時，可更提高鹼顯像性及硬化後之剝離特性。又，（A )黏合劑聚合物可進一步具有以苯乙烯或苯乙烯衍生物爲基準的結構單位，藉此可更提高感光性樹脂組成物之解像性及密著性。又，（A )黏合劑聚合物之酸値酸値以1〇〇〜250 〇 mgKOH/g爲佳。藉此感光性樹月旨組成物的鹼顯像性可更提高。又，（A)黏合劑聚合物之重量平均分子量以1 0000〜 1 00000爲佳。藉此，可更平衡良好下提高感光性樹脂組成物之鹼顯像性及密著性。由更提高感光性樹脂組成物之感度的觀點來看’本發明的感光性樹脂組成物可進一步含有（E )胺系化合物。本發明又提供一種具備由支持薄膜、與形成於該支持薄膜上之上述感光性樹脂組成物所成之感光性樹脂組成物 -11 - 201042389 層的感光性元件。藉由使用本發明的感光性元件，可感度良好且有效率地形成解像性、密著性、光阻形狀及硬化後之剝離特性皆良好的光阻圖型。本發明進一步提供一種光阻圖型的形成方法，其含有將由上述感光性樹脂組成物所成之感光性樹脂組成物層層合於基板上的層合步驟、於感光性樹脂組成物層之所定部分以活性光線照射使該所定部分進行曝光後使其硬化之曝光步驟、藉由將感光性樹脂組成物層的所定部分以外之部分自基板上除去，於基板上形成由感光性樹脂組成物之硬化物所成之光阻圖型的顯像步驟。藉此，可感度良好且有效率地形成解像性、密著性、光阻形狀及硬化後之剝離特性皆良好的光阻圖型。上述活性光線的波長以3 90〜42Onm爲佳。藉此，可感度更良好且有效率地形成解像性、密著性及光阻形狀更良好之光阻圖型。又，本發明提供一種印刷電路板的製造方法，其爲含有將藉由上述光阻圖型的形成方法形成有光阻圖型之基板進行蝕刻或鍍敷之步驟。所謂該製造方法，可精度良好且有效率地製造高密度封裝基板、如矽晶片再配線之高密度化的配線的印刷電路板。本發明爲可提供一種感度、解像性、密著性、光阻形狀及硬化後之剝離特性皆良好的感光性樹脂組成物、以及使用此的感光性元件、光阻圖型之形成方法及印刷電路板的製造方法。 -12- 201042389 實施發明的形態以下對於實施本發明的最佳形態做詳細說明。但’本發明並未限定於以下實施形態者。且’本說明書中’所謂 (甲基）丙烯酸表示丙烯酸或甲基丙烯酸，所謂（甲基）丙烯酸酯表示丙烯酸酯或甲基丙烯酸酯，所謂（甲基）丙烯醯基表示丙烯醯基或甲基丙烯醯基。又，（聚）氧伸乙〇基鏈表示氧伸乙基或聚氧伸乙基鏈，（聚）氧伸丙基鏈表示氧伸丙基或聚氧伸丙基鏈。 <感光性樹脂組成物> 本實施形態的感光性樹脂組成物含有（A )黏合劑聚合物（以下亦稱爲「（ A )成分」）、（B )光聚合性化合物（以下亦稱爲「（ B )成分」）、（C )光聚合啓始劑（以下亦稱爲「（ C )成分」）及（D )敏化色素（以下亦稱〇 ^ 爲「（ D)成分」）。以下對於構成本發明之感光性樹脂組成物的各成分，做更詳細說明。 [(A)成分：黏合劑聚合物] (A)成分之黏合劑聚合物具有以（甲基）丙烯酸爲基準的結構單位、與以（甲基）丙烯酸苯甲酯或（甲基）丙烯酸苯甲酯衍生物爲基準的結構單位。如此黏合劑聚合物，例如可藉由自由基聚合（甲基）丙烯酸、與（甲基） -13- 201042389 丙烯酸苯甲酯或（甲基）丙烯酸苯甲酯衍生物而製造視必要亦可共聚合其他聚合性單體。作爲（甲基）丙烯酸苯甲酯衍生物’例如可舉出甲基）丙烯酸苯甲酯之苯甲基位及/或苯基具有取代〇 (A)成分中之以（甲基）丙烯酸苯甲酯或（甲丙烯酸苯甲酯衍生物爲基準的結構單位之含有量由解及硬化後之剝離性的觀點來看’將成分全質量基準以5〜6 5質量％爲佳，以1 〇〜5 5質量％爲較佳’以 45質量％爲更佳。若該含有量未達5質量％時，有著無到充分解像性之傾向，若含有量超過6 5質量％時’剝會變大而有著剝離時間變長之傾向。作爲（甲基）丙烯酸、（甲基）丙烯酸苯甲酯或基）丙烯酸苯甲酯衍生物以外之其他聚合性單體，例舉出苯乙烯、乙烯基甲苯、α-甲基苯乙烯等α位或芳環中可被取代之可聚合苯乙烯衍生物；二丙酮丙烯醯丙烯醯胺；乙烯基-η-丁基醚等乙烯基醇之酯類；（甲丙烯酸烷基酯、（甲基）丙烯酸環烷基酯、（甲基）酸糠基酯、（甲基）丙烯酸四氫糠基酯、（甲基）丙異莰基酯、（甲基）丙烯酸金剛烷基酯、（甲基）丙二環戊烯基酯、（甲基）丙烯酸二甲基胺基乙基酯、基）丙烯酸二乙基胺基乙基酯、（甲基）丙烯酸環氧酯、2,2,2-三氟乙基（甲基）丙烯酸酯、2,2,3,3-四氟 (甲基）丙烯酸酯等（甲基）丙烯酸酯；α-溴（甲基。且於（基者基）像性作爲 20〜法得離片 (甲如可香族胺等基）丙烯烯酸烯酸 (甲丙基丙基 )丙 -14 - 201042389 烯酸、α-氯（甲基）丙烯酸、β-呋喃基（甲基）丙烯酸、 β-苯乙烯基（甲基）丙烯酸等（甲基）丙烯酸衍生物；馬來酸、馬來酸酐、馬來酸單甲酯、馬來酸單乙酯、馬來酸單異丙基等馬來酸衍生物；富馬酸、桂皮酸、α-氰基桂皮酸、衣康酸、巴豆酸、丙炔酸等有機酸衍生物及丙烯腈。這些可單獨或任意組合2種類以上後使用。 (A )黏合劑聚合物由提高鹼顯像性及剝離特性之觀 Ο 點來看，含有以（甲基）丙烯酸烷基酯爲基準的結構單位爲佳。（A)黏合劑聚合物含有以（甲基）丙烯酸烷基酯爲基準的結構單位時，由鹼顯像性及剝離特性之觀點來看，該含有量將（A)成分的全質量作爲基準下以1〜50質量 %爲佳。又，由欲更提高剝離性之觀點來看，上述含有量以1質量％以上爲佳，以2質量％以上爲較佳，以3質量％以上爲更佳。且，進一步提高鹼顯像後之解像性及密著性的觀點來看，上述含有量以50質量％以下爲佳，以30質量％ ^ 以下爲較佳，以20質量％以下爲更佳。作爲（甲基）丙烯酸烷基酯，可舉出下述一般式（4 )所示化合物。式（4)中，R9表示氫原子或甲基，R1Q表示碳原子數1〜12的烷基。 [化4] h2c=c-—c一〇—R10 (4) 作爲式（4)中之R1()所示碳原子數1〜12的烷基，可舉出甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基 -15- 201042389 、壬基、癸基、十一烷基、十二烷基及彼等結構異構物。由進一步提高剝離特性之觀點來看，上述烷基以碳原子數 4以下者爲佳。作爲上述一般式（4)所示化合物，例如可舉出（甲基）丙烯酸甲基酯、（甲基）丙烯酸乙基酯、（甲基）丙烯酸丙基酯、（甲基）丙烯酸丁基酯、（甲基）丙烯酸戊基酯、（甲基）丙烯酸己基酯、（甲基）丙烯酸庚基酯、 (甲基）丙烯酸辛基酯、（甲基）丙烯酸2_乙基己基酯、 (甲基）丙烯酸壬基酯、（甲基）丙烯酸癸基酯、（甲基 )丙烯酸十一烷基酯（甲基）丙烯酸十二烷基酯。這些可單獨使用或任意組合2種類以上後使用。 (A)黏合劑聚合物由平衡良好下提高解像性、密著性及剝離特性之觀點來看，可進一步含有以苯乙烯或其衍生物爲基準的結構單位。（A)黏合劑聚合物爲具有以苯乙烯或其衍生物爲基準的結構單位時，該含有量由解像性、密著性及剝離特性之觀點來看’將（A)成分之全質量作爲基準時以5〜6 5質量％爲佳。又，由更提高解像性及密著性之觀點來看，上述含有量以5質量％以上爲佳’以1 0質量％以上爲較佳，以15質量％以上爲更佳，以2〇質量％以上爲特佳，以3 0質量％以上爲極佳。且，由可更提高剝離性之觀點來看，上述含有量以65質量％以下爲佳’以60質量 %以下爲較佳，以55質量％以下爲更佳’以5〇質量％以下爲特佳。 (A)黏合劑聚合物的酸値酸値以100〜25 0 mgK0H/g -16- 201042389 爲佳。又，由提高鹼顯像性之觀點來看，黏合劑聚合物之酸値酸値以100 mgKOH/g以上爲佳，以120 mgKOH/g以上爲較佳，以140gKOH/g以上爲更佳，以150 mgKOH/g以上爲特佳。且，由耐顯像液性（密著性）優良的觀點來看，黏合劑聚合物的酸値酸値以25 0 mgKOH/g以下爲佳，以 230 mgKOH/g以下爲較佳，以220 mgKOH/g以下爲更佳，以210 mgKOH/g以下爲特佳。且，進行溶劑顯像時，少量〇地調製具有（甲基）丙烯酸等羧基之聚合性單體（單體）爲佳。 (A)黏合劑聚合物的重量平均分子量（Mw)藉由凝膠滲透層析儀（GPC )進行測定（使用標準聚苯乙烯作爲校正曲線進行換算）時，以10000〜1 00000爲佳。又，使感光性樹脂組成物的硬化物之耐顯像液性（密著性）良好之觀點來看，黏合劑聚合物的Mw以10000以上爲佳，以 20000以上爲較佳，以25000以上爲更佳。且由鹼顯像性優〇 ^ 良的觀點來看，黏合劑聚合物的Mw以1 00000以下爲佳，以80000以下爲較佳，以70000以下爲更佳。 (A)黏合劑聚合物之分散度（Mw/Mn)以1.0〜3.0 爲較佳，以1.0〜2.0爲更佳。由密著性及解像性優良的觀點來看，以3.0以下爲佳，以2.0以下爲較佳。 (A)黏合劑聚合物視必要可於分子內具有對於具有 3 50〜440nm範圍內波長的光具有感光性的特性基。 (A)黏合劑聚合物可使用單獨使用1種類黏合劑聚合物或亦可任意組合2種類以上黏合劑聚合物後使用。作爲 -17- 201042389 組合2種類以上後使用時的黏合劑聚合物，例如可舉出由相異共聚合成分所成的2種類以上（含有將相異單體單位作爲共聚合成分）黏合劑聚合物、相異重量平均分子量之 2種類以上的黏合劑聚合物、相異分散度之2種類以上的黏合劑聚合物。又，亦可使用具有特開平11-327137號公報所記載的多模分子量分佈的聚合物。 (A) 成分（黏合劑聚合物）之含有量對於（A)成分及（B)成分的總量1〇〇質量份而言，以30〜70質量份爲佳。由賦予薄膜性之觀點來看，以30質量份以上爲佳，以 3 5質量份以上爲較佳，以40質量份以上爲更佳。又，由感度及解像性優良的觀點來，以70質量份以下爲佳，以65質量份以下爲較佳，以60質量份以下爲更佳。 [(B)成分：光聚合性化合物] (B) 成分之光聚合成化合物含有分子內具有1個乙嫌性不飽和鍵之化合物。由可平衡地提高解像性、密著性、光阻形狀及硬化後之剝離特性的觀點來看’該含有量對於 (B)成分全體之全質量100質量份而言，以含有1〜30質量份時爲佳，以含有3〜25質量份時爲較佳’以含有5〜20 質量份時爲更佳。作爲分子內具有1個乙烯性不飽和鍵之光聚合性化合物，例如可舉出下述一般式（2)、下述一般式（3)所示化合物，可舉出前述（甲基）丙烯酸烷基酯’但由可更提高本發明之效果的觀點來看，含有下述一般式（2)或下 -18- 201042389 述一般式（3)所示化合物者爲佳。 [化5] Ο :ch2 〇 /^^C-(〇C2H4·^—〇—c—c:ΟII oc2h4);—〇—c—c=ch2 (3) [In the formula (3), R7 represents a hydrogen atom or a methyl group, Rs represents a carbon number, and a carbon number of 1 to 12 And a hydroxyl group or a halogen atom, r represents an integer of 1 to 12', k represents an integer of 0 to 5, and k represents 2 to 5, and R8 in the plural may be the same or different. Thereby, the resolution, adhesion, light PH shape, and peeling property after curing of the photosensitive resin composition can be improved in balance. Further, the (B) photopolymerizable compound may further contain a bisphenol a-based di(meth)acrylate compound. Thereby, alkali development, ablation, resolution, and peeling characteristics after hardening can be further improved. -10-201042389 Further, the (B) photopolymerizable compound may further contain a trimethylolpropane tri(meth) acrylate compound having a (poly)oxyethylidene chain or a (poly)oxypropanylene chain. Thereby, the alkali developability, the reproducibility, the adhesion, and the peeling property after curing of the photosensitive resin composition can be further improved. Further, the (B) photopolymerizable compound may further contain a polyalkylene glycol di(meth) acrylate having a (poly)oxyethylidene chain and a (poly)oxypropanylene chain. Thereby, the flexibility of the cured product (hardened ruthenium film) of the photosensitive resin composition can be improved. In the photosensitive resin composition of the present invention, when the (A) binder polymer further has a structural unit based on an alkyl (meth)acrylate, the alkali developability and the peeling property after curing can be further improved. Further, the (A) binder polymer may further have a structural unit based on styrene or a styrene derivative, whereby the resolution and adhesion of the photosensitive resin composition can be further improved. Further, (A) the binder polymer is preferably lanthanum citrate in an amount of from 1 Torr to 250 〇 mgKOH/g. Thereby, the alkali developability of the photosensitive tree composition can be further improved. Further, the weight average molecular weight of the (A) binder polymer is preferably from 1,000,000 to 1,000,000. Thereby, the alkali developability and adhesion of the photosensitive resin composition can be improved in a more balanced manner. The photosensitive resin composition of the present invention may further contain (E) an amine compound from the viewpoint of further improving the sensitivity of the photosensitive resin composition. Further, the present invention provides a photosensitive element comprising a photosensitive resin composition -11 - 201042389 formed of a support film and the photosensitive resin composition formed on the support film. By using the photosensitive element of the present invention, a photoresist pattern excellent in resolution, adhesion, photoresist shape, and peeling property after curing can be formed with good sensitivity and efficiency. The present invention further provides a method for forming a photoresist pattern comprising a lamination step of laminating a photosensitive resin composition layer formed of the photosensitive resin composition on a substrate, and setting a layer of the photosensitive resin composition An exposure step of exposing the predetermined portion to a portion by exposure to active light, and removing a portion other than a predetermined portion of the photosensitive resin composition layer from the substrate to form a photosensitive resin composition on the substrate. The imaging step of the photoresist pattern formed by the hardened material. Thereby, the photoresist pattern which is excellent in resolution, adhesion, photoresist shape, and peeling property after hardening can be formed with good sensitivity and efficiency. The wavelength of the above active light is preferably from 3 to 90 nm. Thereby, it is possible to form a photoresist pattern which is more excellent in resolution, adhesion, and photoresist shape with better sensitivity and efficiency. Further, the present invention provides a method of manufacturing a printed circuit board comprising the step of etching or plating a substrate on which a photoresist pattern is formed by the above-described photoresist pattern forming method. In this manufacturing method, it is possible to efficiently and efficiently manufacture a high-density package substrate, and a printed circuit board having a high-density wiring such as a tantalum wafer. The present invention provides a photosensitive resin composition excellent in sensitivity, resolution, adhesion, photoresist shape, and peeling property after curing, and a photosensitive element using the same, a method for forming a photoresist pattern, and A method of manufacturing a printed circuit board. -12- 201042389 MODE FOR CARRYING OUT THE INVENTION Hereinafter, the best mode for carrying out the invention will be described in detail. However, the present invention is not limited to the following embodiments. And 'in this specification', the so-called (meth)acrylic acid means acrylic acid or methacrylic acid, the so-called (meth)acrylic acid ester means acrylate or methacrylate, and the so-called (meth)acryl fluorenyl group means propylene fluorenyl group or methyl group. Acryl sulfhydryl. Further, the (poly)oxyethylidene chain represents an oxygen-extended ethyl group or a polyoxyalkylene chain, and the (poly)oxypropionyl group represents an oxygen-extended propyl group or a polyoxy-propion-propylene chain. <Photosensitive resin composition> The photosensitive resin composition of the present embodiment contains (A) a binder polymer (hereinafter also referred to as "(A) component)" and (B) a photopolymerizable compound (hereinafter also referred to as "(B) component"), (C) photopolymerization initiator (hereinafter also referred to as "(C) component") and (D) sensitizing pigment (hereinafter also referred to as "(D) component") . Hereinafter, each component constituting the photosensitive resin composition of the present invention will be described in more detail. [(A) component: binder polymer] (A) component of the binder polymer having a structural unit based on (meth)acrylic acid, and benzyl (meth)acrylate or benzyl (meth)acrylate The methyl ester derivative is the structural unit of the reference. Such a binder polymer can be produced, for example, by radical polymerization of (meth)acrylic acid, with (meth)-13- 201042389 benzyl acrylate or benzyl (meth) acrylate derivative. Polymerization of other polymerizable monomers. Examples of the benzyl (meth)acrylate derivative include, for example, a benzyl group of benzyl methacrylate and/or a phenyl group having a substituted fluorene (A) component. The content of the ester or the structural unit based on the benzyl methacrylate derivative is determined by the solution and the peeling property after hardening. The total mass basis of the component is preferably 5 to 65% by mass, preferably 1 〇. 5 5 % by mass is more preferably '45% by mass. If the content is less than 5% by mass, there is a tendency to have insufficient resolution, and if the content exceeds 65 % by mass, the peeling may be changed. Large and tend to have a long peeling time. As a polymerizable monomer other than (meth)acrylic acid, benzyl (meth)acrylate or benzyl methacrylate derivative, styrene and vinyl are exemplified. a polymerizable styrene derivative which may be substituted in the α-position or the aromatic ring such as toluene or α-methylstyrene; a diacetone propylene oxime acrylamide; an ester of a vinyl alcohol such as vinyl-η-butyl ether; (alkyl methacrylate, cycloalkyl (meth) acrylate, (methyl) Acid decyl ester, tetrahydrofurfuryl (meth) acrylate, (meth) propyl isodecyl ester, adamantyl (meth) acrylate, (meth) propylene dicyclopentenyl ester, (A) Dimethylaminoethyl acrylate, diethylaminoethyl acrylate, epoxy (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, (Meth) acrylate such as 2,2,3,3-tetrafluoro(meth)acrylate; α-bromo (methyl) and (based on) image as 20~ method Acrylamine or the like) acrylenoic acid (methylpropyl)propane-14 - 201042389 enoic acid, α-chloro(meth)acrylic acid, β-furyl (meth)acrylic acid, β-styrene a (meth)acrylic acid derivative such as a (meth)acrylic acid; a maleic acid derivative such as maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate or monoisopropyl maleate An organic acid derivative such as fumaric acid, cinnamic acid, α-cyano cinnamic acid, itaconic acid, crotonic acid or propiolic acid, and acrylonitrile. These may be used alone or in combination of two or more kinds. (A) The binder polymer is preferably a structural unit based on alkyl (meth)acrylate from the viewpoint of improving alkali developability and peeling properties. (A) Adhesive polymer When the structural unit based on the alkyl (meth)acrylate is contained, the content is 1 to 50% by mass based on the total mass of the component (A) from the viewpoint of alkali developability and peeling characteristics. In addition, the content is preferably 1% by mass or more, more preferably 2% by mass or more, and still more preferably 3% by mass or more, and further improving the alkalinity. The content of the content is preferably 50% by mass or less, more preferably 30% by mass or less, and still more preferably 20% by mass or less, from the viewpoints of resolution and adhesion after development. The (meth)acrylic acid alkyl ester may, for example, be a compound represented by the following general formula (4). In the formula (4), R9 represents a hydrogen atom or a methyl group, and R1Q represents an alkyl group having 1 to 12 carbon atoms. H2c=c--c-〇-R10 (4) The alkyl group having 1 to 12 carbon atoms represented by R1() in the formula (4) may, for example, be a methyl group, an ethyl group or a propyl group. , butyl, pentyl, hexyl, heptyl, octyl-15- 201042389, fluorenyl, decyl, undecyl, dodecyl and their structural isomers. From the viewpoint of further improving the peeling property, the alkyl group is preferably a carbon number of 4 or less. Examples of the compound represented by the above general formula (4) include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and butyl (meth)acrylate. , pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (A) Base) decyl acrylate, decyl (meth) acrylate, undecyl (meth) acrylate (decyl) (meth) acrylate. These can be used singly or in combination of two or more types. (A) The binder polymer may further contain a structural unit based on styrene or a derivative thereof from the viewpoint of improving the resolution, adhesion, and peeling properties under good balance. (A) When the binder polymer is a structural unit based on styrene or a derivative thereof, the content is the total mass of the component (A) from the viewpoints of resolution, adhesion, and peeling characteristics. It is preferably 5 to 65% by mass as a standard. In addition, from the viewpoint of further improving the resolution and the adhesion, the content is preferably 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, and more preferably 2% by weight. The mass% or more is particularly good, and it is excellent in 30% by mass or more. In addition, the content is preferably 65% by mass or less, preferably 60% by mass or less, more preferably 55% by mass or less, and more preferably 5% by mass or less. good. (A) The binder polymer has a bismuth citrate of preferably 100 to 25 mg K0H/g -16 to 201042389. Further, from the viewpoint of improving the alkali developability, the bismuth citrate of the binder polymer is preferably 100 mgKOH/g or more, more preferably 120 mgKOH/g or more, and still more preferably 140 gKOH/g or more. It is particularly preferable to be 150 mgKOH/g or more. Further, from the viewpoint of excellent liquid resistance (adhesion), the bismuth citrate of the binder polymer is preferably 25 mgKOH/g or less, more preferably 230 mgKOH/g or less, and 220. It is more preferably not more than mgKOH/g, and particularly preferably 210 mgKOH/g or less. Further, in the case of performing solvent development, it is preferred to prepare a polymerizable monomer (monomer) having a carboxyl group such as (meth)acrylic acid in a small amount. (A) When the weight average molecular weight (Mw) of the binder polymer is measured by a gel permeation chromatography (GPC) (converted using a standard polystyrene as a calibration curve), it is preferably 10,000 to 10,000. In addition, the Mw of the binder polymer is preferably 10,000 or more, more preferably 20,000 or more, and more than 25,000, from the viewpoint of improving the image liquid resistance (adhesiveness) of the cured product of the photosensitive resin composition. For better. Further, from the viewpoint of excellent alkali developability, the Mw of the binder polymer is preferably 100,000 or less, more preferably 80,000 or less, and still more preferably 70,000 or less. The dispersion of the (A) binder polymer (Mw/Mn) is preferably 1.0 to 3.0, more preferably 1.0 to 2.0. In view of excellent adhesion and resolution, it is preferably 3.0 or less, and preferably 2.0 or less. (A) The binder polymer may have a characteristic group having photosensitivity to light having a wavelength in the range of 3 50 to 440 nm in the molecule as necessary. (A) The binder polymer may be used by using one type of binder polymer alone or in combination of two or more types of binder polymers. When the binder polymer used in combination of two or more types is used in the combination of -17 to 201042389, for example, two or more types (including a dissimilar monomer unit as a copolymerization component) of a binder which is formed of a different copolymerization component are polymerized. Two or more types of binder polymers having different average molecular weights of different substances, and two or more types of binder polymers having different dispersities. Further, a polymer having a multimodal molecular weight distribution described in JP-A-11-327137 can also be used. The content of the component (the binder polymer) is preferably 30 to 70 parts by mass based on 1 part by mass of the total of the component (A) and the component (B). From the viewpoint of imparting film properties, it is preferably 30 parts by mass or more, more preferably 35 parts by mass or more, and still more preferably 40 parts by mass or more. Further, from the viewpoint of excellent sensitivity and resolution, it is preferably 70 parts by mass or less, more preferably 65 parts by mass or less, and still more preferably 60 parts by mass or less. [(B) component: photopolymerizable compound] (B) The photopolymerization of the component is a compound containing a compound having one ethyl septic unsaturated bond in the molecule. From the viewpoint of improving the resolution, the adhesion, the shape of the photoresist, and the peeling property after hardening, the content is 1 to 30 in terms of 100 parts by mass of the total mass of the entire component (B). The parts by mass are preferably at least 3 to 25 parts by mass, more preferably 5 to 20 parts by mass. The photopolymerizable compound having one ethylenic unsaturated bond in the molecule may, for example, be a compound represented by the following general formula (2) or the following general formula (3), and the aforementioned (meth)acrylic acid may be mentioned. The base ester 'is preferably a compound represented by the general formula (2) or the following general formula (3), which is represented by the following general formula (2) or lower -18 to 201042389, from the viewpoint of further improving the effects of the present invention. [化5] Ο :ch2 〇 /^^C-(〇C2H4·^—〇—c—c:

(2) \ \~(-OC2H4);—Ο—C—C=CH2 (3) (R8)k^==/ ' 式（2)中，R4表示氫原子或甲基。R5表示氫原子、甲基或鹵化甲基，以甲基或鹵化甲基爲佳’以鹵化甲基爲更佳。作爲鹵化甲基，可舉出可由氟原子、氯原子、溴原子、碘原子、砸原子等取代之甲基。R6表示碳數1〜6的院〇基、碳數1〜6的烷氧基、羥基或鹵素原子，上述碳數1〜6 的烷基或碳數1〜6的烷氧基可爲直鏈狀亦可爲分支狀。又，P表示1〜4的整數，以1〜3的整數爲佳。n表示〇〜4的整數，η表示2〜4時，複數存在的R6可表示相同或相異。作爲上述一般式（2 )所示化合物，例如可舉出r _氯_ β_經基丙基- β，-(甲基）丙嫌酶氧基乙基-〇 -苯二甲酸醋、 β-羥基乙基- β’-(甲基）丙烯醯氧基乙基-0-苯二甲酸醋、及β-經基丙基- β’-(甲基）丙嫌釀串I基乙基-〇-苯二甲酸酯 ’其中亦以r-氯-β-經基丙基-β’_ (甲基）丙燦醢氧基乙基-〇-苯二甲酸酯爲佳。τ-氯-β-羥基丙基-β，·甲基丙條酸 -19- 201042389 氧基乙基-〇-苯二甲酸酯爲FA-MECH (日立化成工業股份有限公司製，商品名）可由商業上獲得。這些可單獨使用或組合2種類以上後使用。上述一般式（3)中，R7表示氫原子或甲基。R8表示碳數1〜12的烷基、碳數1〜12的烷氧基、羥基或鹵素原子，以碳數1〜12的烷基爲佳，以碳數6〜12的烷基爲較佳。 r表示1〜12的整數，以3〜10的整數爲較佳，以4〜8的整數爲更佳。k表示0〜5的整數，k表示2〜5時，複數存在之 R8可爲相同或相異。作爲上述一般式（3 )所示化合'物，例如可舉出壬基苯氧三伸乙氧基丙烯酸酯、壬基苯氧四伸乙氧基丙烯酸酯、壬基苯氧五伸乙氧基丙烯酸酯、壬基苯氧六伸乙氧基丙烯酸酯、壬基苯氧七伸乙氧基丙烯酸酯、壬基苯氧八伸乙氧基丙烯酸酯、壬基苯氧九伸乙氧基丙烯酸酯、壬基苯氧十伸乙氧基丙烯酸酯、壬基苯氧十一伸乙氧基丙烯酸酯。這些可單獨使用、或任意組合2種類以上後使用。又，（B )成分由提高感度、解像性及密著性之觀點來看，進一步含有分子內具有2個以上的乙烯性不飽和鍵的光聚合性化合物爲佳。作爲分子內具有2個以上的乙烯性不飽和鍵之光聚合性化合物，例如可舉出雙酚A系二（甲基）丙烯酸酯化合物、於多元醇反應α，β-不飽和羧酸所得之化合物、於分子內具有胺基甲酸酯鍵之（甲基）丙烯酸酯化合物等胺基甲酸酯單體、環氧丙基含有化合物使α ,β-不飽和羧酸進行反應所得之化合物。這些可單獨使用、 -20- 201042389 或組合2種類以上後使用。 (B )光聚合性化合物由可提高解像性、及硬化後的剝離特性之觀點來看’以含有雙酚A系二（甲基）丙烯酸酯化合物者爲佳。作爲雙酚A系二（甲基）丙烯酸酯化合物，例如可舉出2,2 -雙（4-((甲基）丙烯氧基聚乙氧基）苯基）丙烷、2，2-雙（4-((甲基）丙烯氧基聚丙氧基）苯基）丙烷 ◎ 、2,2-雙（4-((甲基）丙烯氧基聚丁氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基聚乙氧基聚丙氧基）苯基）丙烷。其中由可進一步提高解像性及剝離特性的觀點來看’以2,2-雙（4-((甲基）丙烯氧基聚乙氧基）苯基 )丙烷爲佳。作爲2,2-雙（4-((甲基）丙烯氧基聚乙氧基）苯基 )丙烷’例如可舉出2,2-雙（4-((甲基）丙烯氧基二乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基三乙〇一 # — 氧基）本基）丙烷、2,2_雙（4_((甲基）丙烯氧基四乙氧基）苯基）丙烷、2,2_雙（4_((甲基）丙烯氧基五乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基六乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基七乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基八乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基九乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基十乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基十— 乙氧基）苯基）丙烷、2,2_雙（4_((甲基）丙烯氧基十 -21 - 201042389 二乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基十三乙氧基）苯基）丙烷、2，2-雙（4-((甲基）丙烯氧基十四乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基十五乙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基十六乙氧基）苯基）丙烷。其中亦以2,2 -雙（4-( (甲基）丙烯氧基聚乙氧基）苯基）丙烷之1分子內的氧伸乙基的數爲4〜20時爲佳，以8〜I5爲較佳。彼等中’ 2,2-雙（4-(甲基丙烯氧基五乙氧基）苯基〇 )丙院可作爲ΒΡΕ-500 (新中村化學工業股份有限公司製 ’商品名）或FA-321M (日立化成工業股份有限公司製，商品名）而由商業上獲得。2,2_雙（心（甲基丙烯氧基十五乙氧基）苯基）丙烷可作爲ΒΡΕ-1300 (新中村化學工業股份有限公司製，商品名）而由商業上獲得。這些可單獨使用、或任意組合2種類以上後使用。作爲2,2-雙（4-((甲基）丙烯氧基聚丙氧基）苯基 )丙烷’例如可舉出2,2-雙（4-((甲基）丙烯氧基二丙 I》氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基三丙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基四丙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基五丙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基六丙氧基）苯基）丙烷' 2,2-雙（4-((甲基）丙烯氧基七丙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基八丙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基九丙氧基）本基）丙烷、2,2-雙（4-((甲基）丙烯氧基十丙 -22 - 201042389 氧基）苯基）丙烷、2,2-雙（4_((甲基）丙烯氧基_|—— 丙氧基）苯基）丙烷、2，2-雙（4-((甲基）丙嫌氧基十二丙氧基）苯基）丙烷、2,2-雙（4·((甲基）丙稀氧基十三丙氧基）苯基）丙烷、2,2-雙（4_ ((甲基）丙稀氧基十四丙氧基）苯基）丙院、2,2-雙（4-((甲基）丙稀氧基十五丙氧基）苯基）丙烷、2，2-雙（4-((甲基）丙烯氧基十六丙氧基）苯基）丙烷。作爲2,2 -雙（4-((甲基）丙烯氧基聚乙氧基聚丙氧基）苯基）丙院，例如可舉出2,2 -雙（4-((甲基）丙烯氧基二乙氧基八丙氧基）苯基）丙烷、2,2-雙（4-((甲基）丙烯氧基四乙氧基四丙氧基）苯基）丙烷、2,2_雙（ 4-((甲基）丙烯氧基六乙氧基六丙氧基）苯基）丙烷。 (B)成分含有雙酚A系（甲基）丙烯酸酯化合物時的含有量以（B)成分之全質量作爲基準時以20〜80質量％爲佳，以3 0〜7 0質量％爲較佳。作爲於多元醇使α，β-不飽和羧酸反應而得之化合物，例如可舉出乙烯基的數爲2〜14之聚乙二醇二（甲基）丙烯酸酯、丙烯基的數爲2〜14之聚丙二醇二（甲基）丙烯酸酯、三羥甲基丙烷二（甲基）丙烯酸酯' 三羥甲基丙烷三（甲基）丙烯酸酯、ΕΟ改性三羥甲基丙烷三（甲基）丙烯酸酯（氧伸乙基的重複總數爲1〜5者）、ΡΟ改性三羥甲基丙烷三（甲基）丙烯酸酯、ΕΟ,ΡΟ改性三羥甲基丙烷三 (甲基）丙烯酸酯、四羥甲基甲烷三（甲基）丙烯酸酯、四羥甲基甲烷四（甲基）丙烯酸酯、二季戊四醇五（甲基 -23- 201042389 )丙烯酸酯、二季戊四醇六（甲基）丙烯酸酯獨使用、或組合2種類以上後使用。其中所謂表示具有（聚）氧伸乙基鏈之嵌段結構的化合伸乙基化之化合物），所謂「p〇改性」表示具伸丙基鏈之嵌段結構的化合物（經聚氧伸丙基 )，所謂「ΕΟ · PO改性」表示具有（聚）氧 (聚）氧伸丙基鏈之嵌段結構的化合物（經聚及聚氧伸丙基化之化合物）。彼等中，四羥甲基甲烷三丙烯酸酯作爲A-中村化學工業股份有限公司製，商品名）而由，EO改性三羥甲基丙烷三甲基丙烯酸酯作爲 TMPT3 0E (日立化成工業股份有限公司製，商商業上獲得。又，（B)成分由可進一步平衡良好下提、解像性、密著性、及硬化後之剝離特性的觀含有分子內具有（聚）氧伸乙基鏈或（聚）氧三羥甲基丙烷三（甲基）丙烯酸酯化合物，其內具有（聚）氧伸乙基鏈之三羥甲基丙烷三（酸酯化合物者爲較佳。（B )成分含有這些化含有量以（B )光聚合性化合物之全質量作爲g 5 〇質量％爲佳，以1 0〜4 0質量％爲較佳。又，（B )成分由提高感光性樹脂組成物硬化膜）之可撓性的觀點來看，可含有分子內氧伸乙基鏈及（聚）氧伸丙基鏈之聚烷二醇二。這些可單「Ε Ο改性j 物（經聚氧有（聚）氧化之化合物伸乙基鏈及氧伸乙基化 TMM-3 (新商業上獲得 TMPT21E 、品名）而由高鹼顯像性點來看，可伸丙基鏈之中含有分子甲基）丙烯合物時，該 S準時以5〜的硬化物（具有（聚） (甲基）丙 -24- 201042389 烯酸酯。（B)成分含有這些化合物時，該含有量以（B) 光聚合性化合物之全質量作爲基準時，以5〜50質量％爲佳，以10〜40質量％爲更佳。作爲聚烷二醇二（甲基）丙烯酸酯之分子內的（聚）氧基伸烷基鏈，其中具有（聚）氧伸乙基鏈及（聚）氧伸丙基鏈（（聚）氧基-η-伸丙基）鏈或（聚）氧基異伸丙基鏈）者爲佳。又，聚烷二醇二（甲基）丙烯酸酯進一步具 © 有（聚）氧基-η-伸丁基鏈、（聚）氧基伸丁基鏈、（聚）氧基-η-伸戊基鏈、（聚）氧基伸己基鏈、或這些結構異構物等之碳原子數4〜6程度的（聚）氧基伸烷基鏈爲佳。對於聚烷二醇二（甲基）丙烯酸酯之分子內，（聚）氧伸乙基鏈及（聚）氧伸丙基鏈可各連續而以嵌段方式存在、亦可以隨機方式存在。又，對於（聚）氧基異伸丙基鏈，伸丙基之2級碳可鍵結於氧原子、或i級碳可鍵結於氧原子。〇作爲聚烷二醇二（甲基）丙烯酸酯，特別以下述一般式（5) 、（6)或（7)所示化合物爲佳。這些可單獨使用、或組合2種類以上後使用。 -25- 201042389 [化7] 0 _E〇UpotiE〇·(2) \ \~(-OC2H4); -Ο-C-C=CH2 (3) (R8)k^==/ ' In the formula (2), R4 represents a hydrogen atom or a methyl group. R5 represents a hydrogen atom, a methyl group or a halogenated methyl group, and a methyl group or a halogenated methyl group is preferred, and a halogenated methyl group is more preferred. The halogenated methyl group may, for example, be a methyl group which may be substituted by a fluorine atom, a chlorine atom, a bromine atom, an iodine atom or a ruthenium atom. R6 represents a fluorenyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyl group or a halogen atom, and the above alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms may be a linear chain. The shape can also be branched. Further, P represents an integer of 1 to 4, and preferably an integer of 1 to 3. n represents an integer of 〇~4, and when η represents 2 to 4, R6 in the plural may represent the same or different. Examples of the compound represented by the above formula (2) include r-chloro-β-transpropylpropyl-β,-(methyl)propanyloxyethyl-hydrazine-phthalic acid vinegar, and β- Hydroxyethyl-β'-(meth)acryloyloxyethyl-0-phthalic acid vinegar, and β-propylidene-β'-(methyl)propyl saponin I-ethyl-oxime - phthalate' is also preferably r-chloro-β-propylidene-β'-(methyl)propancanoxyethyl-indole-phthalate. τ-Chloro-β-hydroxypropyl-β,·Methylpropionic acid-19- 201042389 Ethoxyethyl-indole-phthalate is FA-MECH (product of Hitachi Chemical Co., Ltd., trade name) It is commercially available. These can be used alone or in combination of two or more types. In the above general formula (3), R7 represents a hydrogen atom or a methyl group. R8 represents an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, a hydroxyl group or a halogen atom, preferably an alkyl group having 1 to 12 carbon atoms, and preferably an alkyl group having 6 to 12 carbon atoms. . r represents an integer of 1 to 12, preferably an integer of 3 to 10, and more preferably an integer of 4 to 8. k represents an integer of 0 to 5, and k represents 2 to 5, and R8 of the plural may be the same or different. Examples of the compound represented by the above general formula (3) include a nonylphenoxy ethoxy acrylate, a nonyl phenoxy ethoxy acrylate, and a nonyl phenyloxy pentylene ethoxy group. Acrylate, nonylphenoxy hexaethoxy acrylate, nonylphenoxy hexaethoxy acrylate, nonyl phenoxy ethoxy acrylate, nonyl phenyloxy hexaethoxy acrylate , nonylphenoxy decyl ethoxy acrylate, nonyl phenyloxy eleven ethoxy acrylate. These can be used individually or in combination of 2 or more types. Further, the component (B) is preferably a photopolymerizable compound having two or more ethylenically unsaturated bonds in the molecule, from the viewpoint of improving the sensitivity, the resolution, and the adhesion. Examples of the photopolymerizable compound having two or more ethylenically unsaturated bonds in the molecule include a bisphenol A-based di(meth)acrylate compound and a reaction of a polyol with an α,β-unsaturated carboxylic acid. A compound obtained by reacting a compound, a urethane monomer such as a (meth) acrylate compound having a urethane bond in a molecule, and a glycidyl propyl group-containing compound to react an α,β-unsaturated carboxylic acid. These can be used alone, -20- 201042389 or a combination of 2 or more types. (B) The photopolymerizable compound is preferably a bisphenol A-based di(meth)acrylate compound from the viewpoint of improving the resolution and the peeling property after curing. Examples of the bisphenol A-based di(meth)acrylate compound include 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, 2,2-bis ( 4-((Meth)acryloxypolypropoxy)phenyl)propane ◎, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, 2,2- Bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane. Among them, 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane is preferred from the viewpoint of further improving the resolution and the peeling property. As 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, for example, 2,2-bis(4-((meth)acryloxy)diethoxy) Phenyl)propane, 2,2-bis(4-((meth)propenyloxytriethylphosphonium)-propenyl)propane, 2,2-bis(4-((meth)propene) Oxytetraethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, 2,2-bis(4-((methyl)) Propenyloxyhexaethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, 2,2-bis(4-((A) Propyloxy octaethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, 2,2-bis(4-( (Meth)acryloxy-decaethoxy)phenyl)propane, 2,2-bis(4-((meth)propenyloxy-t-ethoxy)phenyl)propane, 2,2_bis ( 4-((Meth)acryloxy-10-21 - 201042389 diethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxytridecyloxy)phenyl)propane 2,2-bis(4-((meth)acryloxy)tetradecyl Oxy)phenyl)propane, 2,2-bis(4-((meth)propenyloxypentadecyloxy)phenyl)propane, 2,2-bis(4-((methyl)propeneoxy) Hexylhexadecyloxy)phenyl)propane. Wherein, the number of oxygen-extended ethyl groups in the molecule of 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane is preferably 4 to 20, and is preferably 8~ I5 is preferred. Among them, '2,2-bis(4-(methacryloxypentaethoxy)phenyl) propylamine can be used as ΒΡΕ-500 (trade name of New Nakamura Chemical Industry Co., Ltd.) or FA- 321M (made by Hitachi Chemical Co., Ltd., trade name) is commercially available. 2,2_bis (heart (methacryloxy-l-pentaethoxy)phenyl)propane is commercially available as ΒΡΕ-1300 (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name). These can be used singly or in combination of two or more types. As 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, for example, 2,2-bis(4-((meth)acryloxydipropyl I) can be mentioned. Oxy)phenyl)propane, 2,2-bis(4-((meth)acryloxytripropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxy) Tetrapropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypentapropoxy)phenyl)propane, 2,2-bis(4-((meth)propene) Oxyhexapropoxy)phenyl)propane ' 2,2-bis(4-((meth)propenyloxy heptapropoxy)phenyl)propane, 2,2-bis(4-((methyl) ) propyleneoxy octapropoxy)phenyl)propane, 2,2-bis(4-((meth) propylene oxy) pentyloxy) yl) propane, 2,2- bis (4-(( Methyl)propenyloxypropane-22 - 201042389 oxy)phenyl)propane, 2,2-bis(4-((meth)acryloxy)-)-propoxy)phenyl)propane, 2, 2-bis(4-((methyl)propano-dodecyloxy)phenyl)propane, 2,2-bis(4.((methyl)propoxy-tridecyloxy)benzene) Propane, 2,2-bis(4_((methyl)propoxyoxytetradecyloxy) Phenyl) propyl, 2,2-bis(4-((methyl)propoxypentadecane)phenyl)propane, 2,2-bis(4-((meth)propeneoxy) Hexylhexadecyloxy)phenyl)propane. Examples of the 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propyl group include 2,2-bis(4-((meth)acryloyloxy) Di-diethoxyoctapropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxytetraethoxytetrapropoxy)phenyl)propane, 2,2_double (4-((Methyl)acryloxyhexaethoxyhexapropyloxy)phenyl)propane. When the component (B) contains a bisphenol A-based (meth) acrylate compound, the content is preferably 20 to 80% by mass based on the total mass of the component (B), and is preferably 30 to 70% by mass. good. Examples of the compound obtained by reacting an α,β-unsaturated carboxylic acid with a polyhydric alcohol include polyethylene glycol di(meth)acrylate having a vinyl group number of 2 to 14 and a number of propylene groups of 2 ～14 polypropylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate trimethylolpropane tri(meth)acrylate, hydrazine modified trimethylolpropane tris(A) Acrylate (the total number of repeats of oxygen-extended ethyl group is 1 to 5), hydrazine-modified trimethylolpropane tri(meth)acrylate, hydrazine, hydrazine-modified trimethylolpropane tri(methyl) Acrylate, tetramethylol methane tri(meth)acrylate, tetramethylol methane tetra(meth)acrylate, dipentaerythritol penta (methyl-23- 201042389) acrylate, dipentaerythritol hexa(methyl) Acrylates are used singly or in combination of two or more types. Here, the compound represented by the compound having a block structure of a (poly)oxyethyl group), the "p〇 modified" means a compound having a block structure of a propyl group (polyoxygen extension) Propyl), "ΕΟ · PO modified" means a compound having a block structure of a (poly)oxy (poly)oxypropyl group (a compound which is subjected to poly(polyoxy) agitation). Among them, tetramethylol methane triacrylate is manufactured by A-Nakamura Chemical Co., Ltd., trade name), and EO modified trimethylolpropane trimethacrylate is used as TMPT3 0E (Hitachi Chemical Industry Co., Ltd. Co., Ltd. is commercially available. In addition, the component (B) has a (poly) oxygen-extended ethyl group in the molecule which can be further balanced, good release, resolution, adhesion, and peeling characteristics after hardening. A chain or (poly)oxytrimethylolpropane tri(meth) acrylate compound having a (poly)oxyethylidene chain and a trimethylolpropane tri(ester compound is preferred. (B) It is preferable that the component contains the compounding amount of (B) the total mass of the photopolymerizable compound as g 5 〇 mass%, preferably 10 to 40% by mass. Further, the component (B) is composed of a photosensitive resin. From the viewpoint of flexibility of the cured film, it may contain an intramolecular oxygen-extended ethyl chain and a (poly)oxypropanyl chain-containing polyalkylene glycol 2. These may be "single-modified" (by Polyoxygenated (poly) oxidized compound extended ethyl chain and oxygen extended ethylation When TMM-3 (newly obtained TMPT21E, product name) and high base imaging point of view, when the propyl group contains a molecular methyl group acrylate, the S is punctured with 5~ hardened material ( When (B) component contains these compounds, the content is 5 to 50% by mass based on the total mass of the (B) photopolymerizable compound. Preferably, it is preferably 10 to 40% by mass. As a (poly)oxyalkylene chain of a polyalkylene glycol di(meth)acrylate, which has a (poly)oxyethylidene chain and It is preferred that the poly)oxypropyl group ((poly)oxy-η-extended propyl) chain or (poly)oxyisopropenyl propyl chain). Further, polyalkylene glycol di(meth)acrylate Further, there are (poly)oxy-η-butylene chain, (poly)oxybutylene chain, (poly)oxy-η-exopentyl chain, (poly)oxyhexanyl chain, or these structural isomers, etc. The (poly)oxyalkylene chain having a carbon number of 4 to 6 is preferred. For the intramolecular group of the polyalkylene glycol di(meth)acrylate, The poly(oxy)ethylidene chain and the (poly)oxypropanyl propyl chain may be present in a continuous manner in a block manner or in a random manner. Further, for a (poly)oxyisopening propyl chain, a propyl group The secondary carbon may be bonded to the oxygen atom, or the i-carbon may be bonded to the oxygen atom. As the polyalkylene glycol di(meth)acrylate, the following general formula (5), (6) or (7) is particularly used. The compound shown is preferred. These may be used alone or in combination of two or more types. -25- 201042389 [Chem. 7] 0 _E〇UpotiE〇·

II ¢5)II ¢ 5)

Ο II H2〇=C—C—Ο-RΟ II H2〇=C—C—Ο-R

EO·^—^-ΡΟ-^-Ο—C=CH2 0 II h2c=c—〇—〇 REO·^—^-ΡΟ-^-Ο—C=CH2 0 II h2c=c—〇—〇 R

"C-~~C=CH2 R o (6) ΈΟ- )4-"C-~~C=CH2 R o (6) ΈΟ- )4-

0 II0 II

PO·^—c—C =CH2 04 RPO·^—c—C =CH2 04 R

上述式（5) 、（6)及（7)中，R各獨立，表示氫原子或甲基，EO表示氧伸乙基，PO表示氧伸丙基。mi、m2 、m3及m4表示由氧伸乙基所成之結構單位的重複數，ηι、 n2、n3及n4表示由氧伸丙基所成之結構單位的重複數，氧伸乙基的重複總數，其中m3及m4 (平均値）各獨立，表示1〜30的整數，氧伸丙基的重複總數ηι，其中n2 + n3 及n4(平均値）各獨立，表示1〜30的整數。對於上述一般式（5 ) 、（ 6 )或（7 )所示化合物，氧伸乙基之重複總數HM + mz、m3及m4爲1〜30的整數，其中亦以1〜10的整數爲佳，以4〜9的整數爲較佳，以5〜8 的整數爲更佳。由解像性、密著性及光阻形狀優良的觀點來看，氧伸乙基之重複數的總數以3 0以下爲佳’以1 0以下爲較佳，以9以下爲更佳’以8以下爲特佳。又，氧伸丙基的重複總數η,，其中n2 + n3及n4爲1〜30 的整數，其中以5〜20的整數爲佳，以8〜16的整數爲較佳，以1 0〜1 4的整數爲更佳。由解像性之提高及污垢的減低 -26- 201042389 爲優之觀點來看，氧伸丙基的重複總數以30以下爲佳，以 2 0以下爲較佳，以1 6以下爲更佳，以I 4以下爲特佳。作爲一般式（5)所示化合物，可舉出R=甲基、 mi+m2 = 6 (平均値）、ηι = 12 (平均値）之乙烯基化合物（日立化成工業股份有限公司製，商品名「FA-023M」）等。作爲一般式（6)所示化合物，可舉出R=甲基、m3 = 6 ( 平均値）、n2 + n3 = 12 (平均値）之乙烯基化合物（日立化 Ο 成工業股份有限公司製，商品名「FA-024M」）等。作爲一般式（7)所示化合物，可舉出R =氫原子、m4=l (平均値）、n4 = 9 (平均値）之乙烯基化合物（新中村化學工業股份有限公司製，商品名「NK酯HEMA-9P」）等。這些可單獨使用、或組合2種類以上後使用。作爲於分子內具有胺基甲酸酯鍵之（甲基）丙烯酸酯化合物，例如可舉出於/3位具有OH基之（甲基）丙烯酸單體與二異氰酸酯化合物（異佛爾酮二異氰酸酯、2,6-甲 ^ 苯二異氰酸酯、2,4-甲苯二異氰酸酯、1，6-六伸甲基二異氰酸酯等）的加成反應物、參（（甲基）丙烯氧基四乙二醇異氰酸酯）六伸甲基三聚異氰酸酯、EO改性胺基甲酸酯二（甲基）丙烯酸酯、EO、PO改性胺基甲酸酯二（甲基 )丙烯酸酯。作爲EO改性胺基甲酸酯二（甲基）丙烯酸酯，可舉出U A -1 1 (新中村化學工業股份有限公司製，商品名）。又，作爲EO、PO改性胺基甲酸酯二（甲基）丙烯酸酯，可舉出UA-13(新中村化學工業股份有限公司製，商品名）。這些可單獨使用或組合2種類以上後使用。 -27- 201042389 (B) 成分（光聚合性化合物）之含有量對於（a)成分及（B)成分之總量100質量份時以30〜70質量份爲佳。由提高感度及解像性之觀點來看，（B)成分之含有量以 30質量份以上爲佳’以35質量份以上爲較佳，以40質量份以上爲更佳。由賦予薄膜性的觀點、及硬化後光阻形狀優良的觀點來看，（B)成分的含有量以70質量份以下爲佳 ’以65質量份以下爲較佳，以60質量份以下爲更佳。 [(C)成分：光聚合啓始劑] 作爲（C )光聚合啓始劑，僅選擇所使用之曝光機的光波長，與（C )光聚合啓始劑的功能表現上爲必要之波長可配合者即可，對於使用過去公知者並無特別限制。作爲（C )光聚合啓始劑，例如可舉出二苯甲酮、2-苯甲基-2-二甲基胺基-1- ( 4-嗎啉代苯基）-丁酮-1，2-甲基- l-[4-( 甲硫基）苯基]-2-嗎啉代-丙酮-1等芳香族酮；烷基蒽醌等醌類；苯偶因烷基醚等苯偶因醚化合物；苯偶因、烷基苯偶因等苯偶因化合物；苯甲基二甲基酮縮醇等苯甲基衍生物；2- (〇-氯苯基）-4,5-二苯基咪唑二聚物、2-(〇-氟苯基）-4,5-二苯基咪唑二聚物等2,4,5-三芳基咪唑二聚物： 9 -苯基吖啶、1，7 - ( 9，9，-吖啶基）庚烷等吖啶衍生物。這些可單獨使用、或組合2種類以上後使用。 (C) 成分（光聚合啓始劑）的含有量對於（A)成分及（B )成分之總量100質量份而言以0.1〜1〇質量份爲佳。由感度、解像性或密著性優良的觀點來看’ （C )成分 -28- 201042389 的含有量以〇_ 1質量份以上爲佳，以1質量份以上爲較佳，以2質量份以上爲更佳，以3質量份以上爲特佳。又，由硬化後之光阻形狀優良的觀點來看，（C )成分之含有量以 10質量份以下爲佳，以7質量份以下爲較佳，以6質量份以下爲更佳，以5質量份以下爲特佳。 [(D)成分：敏化色素]In the above formulae (5), (6) and (7), R each independently represents a hydrogen atom or a methyl group, EO represents an oxygen-extended ethyl group, and PO represents an oxygen-extended propyl group. Mi, m2, m3 and m4 represent the number of repeats of the structural unit formed by the oxygen-extended ethyl group, and ηι, n2, n3 and n4 represent the number of repeats of the structural unit formed by the oxygen-extended propyl group, and the repetition of the oxygen-extended ethyl group The total number, wherein m3 and m4 (average 値) are independent, represents an integer from 1 to 30, and the total number of repeats of the oxygen-extended propyl group, wherein n2 + n3 and n4 (average 値) are independent, representing an integer from 1 to 30. For the compound of the above general formula (5), (6) or (7), the total number of repeats of the oxygen-extended ethyl group HM + mz, m3 and m4 is an integer of from 1 to 30, preferably from 1 to 10 integers. Preferably, an integer of 4 to 9 is preferred, and an integer of 5 to 8 is more preferably. From the viewpoints of excellent resolution, adhesion, and photoresist shape, the total number of repetitions of the oxygen-extended ethyl group is preferably 30 or less, preferably 10 or less, and more preferably 9 or less. 8 is especially good. Further, the total number of repetitions of the oxygen-extended propyl group, wherein n2 + n3 and n4 are integers of 1 to 30, wherein an integer of 5 to 20 is preferable, and an integer of 8 to 16 is preferably used, and 1 to 10 is 1 An integer of 4 is better. From the viewpoint of improvement in resolution and reduction of soil -26-201042389, the total number of repetitions of the oxygen-extended propyl group is preferably 30 or less, more preferably 20 or less, and even more preferably 16 or less. It is especially good below I 4 . The compound represented by the general formula (5) is a vinyl compound of R = methyl group, mi + m2 = 6 (average 値), and ηι = 12 (average 値) (product name, manufactured by Hitachi Chemical Co., Ltd.) "FA-023M") and so on. The compound represented by the general formula (6) is a vinyl compound of R = methyl group, m3 = 6 (average 値), and n2 + n3 = 12 (average 値) (manufactured by Hitachi Chemical Co., Ltd., Product name "FA-024M"). The compound represented by the general formula (7) is a vinyl compound (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name "R = hydrogen atom, m4 = l (average enthalpy), and n4 = 9 (average enthalpy). NK ester HEMA-9P") and the like. These can be used alone or in combination of two or more types. As the (meth) acrylate compound having a urethane bond in the molecule, for example, a (meth)acrylic monomer having a OH group at the /3 position and a diisocyanate compound (isophorone diisocyanate) may be mentioned. Addition reaction of 2,6-methyl benzene diisocyanate, 2,4-toluene diisocyanate, 1,6-hexamethylene diisocyanate, etc., ginseng ((meth) propylene oxytetraethylene glycol) Isocyanate) hexamethylene monoisocyanate, EO modified urethane di(meth) acrylate, EO, PO modified urethane di(meth) acrylate. As the EO-modified urethane di(meth)acrylate, U A -1 1 (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name) can be mentioned. Further, EO and PO-modified urethane di(meth) acrylate are UA-13 (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name). These can be used individually or in combination of 2 or more types. -27- 201042389 (B) The content of the component (photopolymerizable compound) is preferably 30 to 70 parts by mass based on 100 parts by mass of the total of the components (a) and (B). The content of the component (B) is preferably 30 parts by mass or more, more preferably 35 parts by mass or more, more preferably 40 parts by mass or more, from the viewpoint of improving the sensitivity and the resolution. The content of the component (B) is preferably 70 parts by mass or less from the viewpoint of imparting film properties and the shape of the photoresist after curing. It is preferably 65 parts by mass or less, and more preferably 60 parts by mass or less. good. [(C) component: photopolymerization initiator] As the (C) photopolymerization initiator, only the wavelength of the light used in the exposure machine is selected, and (C) the wavelength of the photopolymerization initiator is necessary to exhibit the wavelength It can be used as a partner, and there is no particular limitation on the use of those known in the past. Examples of the (C) photopolymerization initiator include benzophenone and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1. An aromatic ketone such as 2-methyl-l-[4-(methylthio)phenyl]-2-morpholino-acetone-1; an anthracene such as an alkyl group; a phenylene group such as a benzoin alkyl ether Ether compound; benzoin compound such as benzoin or alkyl benzoin; benzyl derivative such as benzyl dimethyl ketal; 2-(〇-chlorophenyl)-4,5-di 2,4,5-triarylimidazole dimer such as phenylimidazole dimer, 2-(fluorene-fluorophenyl)-4,5-diphenylimidazole dimer: 9-phenyl acridine, 1 An acridine derivative such as 7-(9,9,-acridinyl)heptane. These can be used alone or in combination of two or more types. The content of the component (the photopolymerization initiator) is preferably 0.1 to 1 part by mass based on 100 parts by mass of the total of the components (A) and (B). The content of the component (C) component -28 to 201042389 is preferably 〇 1 part by mass or more, more preferably 1 part by mass or more, and 2 parts by mass, from the viewpoint of excellent sensitivity, resolution, or adhesion. The above is more preferable, and it is particularly preferable to be 3 parts by mass or more. Moreover, the content of the component (C) is preferably 10 parts by mass or less, more preferably 7 parts by mass or less, even more preferably 6 parts by mass or less, from the viewpoint of excellent shape of the photoresist after curing. The following parts are particularly good. [(D) component: sensitizing pigment]

(D)成分之敏化色素含有下述一般式（1)所示化合物0 [化8]The sensitizing dye of the component (D) contains the compound represented by the following general formula (1) [Chemical Formula 8]

式（1 )中，R1及R2各獨立，表示取代或無取代的苯基、噻吩基或呋喃基，由進一步提高解像性之觀點來看’ 以取代或無取代的苯基爲佳。作爲其取代基’可舉出碳數 1〜10的烷基、碳數1〜1〇的烷氧基或碳數1〜10的烷基酯基，以碳數1〜1〇的烷基或碳數1〜10的烷氧基爲佳’以碳數3〜8的烷基或碳數1〜5的烷氧基爲較佳。a及b各獨立，表示0〜2的整數。 R3表示碳數1〜1〇的烷基、碳數1〜10的烷氧基或碳數 1〜10的院基酯基。其中’以碳數1〜10的院基或碳數1〜 -29- 201042389 10的烷氧基時爲佳，碳數3〜8的烷基或碳數1〜5的烷氧基爲較佳。m表示〇〜5的整數。m表示2〜5時，複數R3彼此可相同或相異。 R1〜R3的取代基以進—步提高感度及對溶劑之溶解性的觀點來看，以碳數1〜3的烷基或碳數1〜10的烷氧基時爲佳。上述碳數1〜10的烷基或碳數1〜10的烷氧基可爲直鏈狀亦可爲分支狀。作爲碳數1〜10的烷基，例如可舉出甲基、乙基 '異丙基、η-丁基、tert-丁基、異戊基、tert-辛基，但並未限定於此等。又，一般式（1)中之a及b的總和以1〜6爲佳’以1〜4爲較佳，以1〜3爲更佳。作爲上述一般式（1 )所示化合物，例如可舉出1 - ( 4-甲氧基苯基）-3 -苯乙烯基-5-苯基-吡唑啉、1-苯基- 3-( 4-甲氧基苯乙烯基）-5-(4-甲氧基苯基）-吡唑啉、1,5-雙-(4 -甲氧基苯基）-3- (4 -甲氧基苯乙烯基）-吡唑啉、1-(4-異丙基苯基）-3-苯乙烯基-5-苯基-吡唑啉、1-苯基-3-(4 -異丙基苯乙烯基）-5_ (4 -異丙基苯基）-吡唑啉、1,5-雙- (4-異丙基苯基）_3_(4-異丙基苯乙烯基）-吡唑啉、卜（4-甲氧基苯基）-3_( 4_tert_ 丁基-苯乙烯基）-5_(4_ tert-丁基-苯基）-吡唑啉、i_(4-tert-丁基-苯基）·3，（4-甲氧基苯乙烯基）-5- (4 -甲氧基苯基）-吡唑啉、(4-異丙基-苯基）-3-(4-tert-丁基-苯乙烯基）-5-(4-tert-丁基-苯基）-卩比哩啉、1_ ( 4-tert-丁基-苯基）-3- ( 4 -異丙基-苯乙烯基）-5- (4-異丙基-苯基）-吡唑啉、1_(4 -甲氧 -30- 201042389 基苯基）-3- (4 -異丙基本乙稀基）-5- (4 -異丙基本基）-吡唑啉、卜（4-異丙基-苯基）-3- (4_甲氧基苯乙烯基）-5-(4-甲氧基苯基）-吡唑啉、1-苯基- 3-(3,5-二甲氧基苯乙烯基）-5-(3,5-二甲氧基苯基）-吡唑啉、1-苯基- 3-( 3.4- 二甲氧基苯乙烯基）-5-(3,4-二甲氧基苯基）-吡唑啉、1-苯基-3-(2,6-二甲氧基苯乙烯基）-5-(2,6-二甲氧基苯基）-吡唑啉、1-苯基- 3-(2,5 -二甲氧基苯乙烯基）-5- O (2,5-二甲氧基苯基）-吡唑啉、1-苯基- 3-(2，3-二甲氧基苯乙烯基）-5·(2,3 -二甲氧基苯基）-吡唑啉、1-苯基-3-(2,4_二甲氧基苯乙烯基）_5- (2,4-二甲氧基苯基）-吡唑啉、1-(4 -甲氧基苯基）-3- (3,5 -二甲氧基苯乙烯基）-5-(3，5-二甲氧基苯基）-吡唑啉、1-(4-甲氧基苯基）-3-( 3.4- 二甲氧基苯乙烯基）-5-(3,4-二甲氧基苯基）-耻唑啉、1-(4-甲氧基苯基）-3-(2,6-二甲氧基苯乙烯基）-5-( 2,6-二甲氧基苯基）-耻唑啉、卜（4-甲氧基苯基）-3-( ^ 2,5-二甲氧基苯乙烯基）-5- (2,5-二甲氧基苯基）-吡唑啉、1-(4-甲氧基苯基）-3-(2,3-二甲氧基苯乙烯基）-5-( 2.3- 二甲氧基苯基）-吡唑啉、卜（4 -甲氧基苯基）-3-( 2.4- 二甲氧基苯乙烯基）_5- ( 2〆-二甲氧基苯基）-吡唑啉、1-(44 6^-丁基-苯基）-3-(3,5-二甲氧基苯乙烯基）-5-(3,5-二甲氧基苯基）-吡唑琳、1-(4-161^-丁基-苯基 )-3- (3,4-二甲氧基苯乙烯基）-5-( 3，4-二甲氧基苯基 )-吡唑啉、1-(4-以4-丁基-苯基）-3-(2,6-二甲氧基苯乙烯基）-5- ( 2,6-二甲氧基苯基）-吡唑啉、1- ( 4-tert-丁 -31 - 201042389 基-苯基）_3-(2,5-二甲氧基苯乙烯基）-5_(2,5-二甲氧基苯基）-吡唑啉、1- ( 4-tert-丁基-苯基）-3- ( 2,3-二甲氧基苯乙烯基）-5- (2,3-二甲氧基苯基）-吡唑啉、1-(4-tert-丁基-苯基）-3-( 2，4-二甲氧基苯乙烯基）-5-( 2,4-二甲氧基苯基）-吡唑啉、1-(4_異丙基-苯基）-3-(3，5-二甲氧基苯乙烯基）-5- (3,5-二甲氧基苯基）-吡唑啉、1-(4-異丙基-苯基）-3- ( 3,4-二甲氧基苯乙烯基）-5- ( 3,4-二甲氧基苯基）-吡唑啉、1-(4-異丙基-苯基）-3-(2,6-二甲氧基苯乙烯基）-5- (2,6-二甲氧基苯基）-吡唑啉、1-(4-異丙基-苯基）-3-(2,5-二甲氧基苯乙烯基）-5-(2,5-二甲氧基苯基）-吡唑啉、1-(4-異丙基-苯基）-3-(2，3-二甲氧基苯乙烯基）-5_(2,3-二甲氧基苯基）-吡唑啉、1-(4-異丙基-苯基）-3-(2，4-二甲氧基苯乙烯基）-5-(2,4-二甲氧基苯基）-吡唑啉、1- ( 4-tert-丁基-苯基）-3-苯乙烯基-5-苯基-吡唑啉、1-苯基-3- (4-tert-丁基-苯乙烯基 )-5- ( 4-tert-丁基-苯基）-吡唑啉、1,5-雙-(4-tert-丁基-苯基）-3- ( 4-tert-丁基-苯乙烯基）-吡唑啉、1- ( 4-tert-辛基-苯基）-3-苯乙烯基-5-苯基-吡唑啉、1-苯基-3-( 4-tert-辛基-苯乙烯基）-5- ( 4-tert-辛基-苯基）-吡唑啉、 1 ,5-雙-(4-tert -辛基-苯基）-3- ( 4-tert-辛基-苯乙稀基）-吡唑啉、1-(4-十二烷基-苯基）-3-苯乙烯基-5-苯基-吡唑啉、1-苯基-3-(4-十二烷基-苯乙烯基）-5-(4-十二烷基-苯基）-吡唑啉、1- ( 4-十二烷基-苯基）-3- ( 4-十二烷基-苯乙烯基）-5- ( 4-十二烷基-苯基）-吡唑啉、1- ( 4-tert- -32- 201042389 辛基-苯基）-3 - ( 4-1ert- 丁基-苯乙稀基）-5- ( 4-tert-丁基-苯基）-吡唑啉、1- ( 4-tert-丁基-苯基）-3- ( 4-tert-辛基-苯乙烯基）-5- ( 4-tert-辛基-苯基）-吡唑啉、1- ( 4-十 —院基-苯基）-3- ( 4-tert -丁基-苯乙稀基）-5- ( 4-tert -丁基-苯基）-吡唑啉、1-( 4-tert-丁基-苯基）-3- (4-十二烷基-苯乙烯基）-5-( 4-十二烷基-苯基）-吡唑啉、1-(4-十二烷基-苯基）-3- ( 4-tert-辛基-苯乙烯基）-5- ( 4-tert-辛 ❹ 基-苯基）-吡唑啉、1-( 4-tert-辛基-苯基）-3- (4-十二烷基-苯乙烯基）-5-(4-十二烷基-苯基）-吡唑啉、1-(2,4-二丁基-苯基）-3- (4-十二烷基-苯乙烯基）-5- (4-十二烷基-苯基）-吡唑啉、1-苯基-3- (3,5-二-tert-丁基·苯乙烯基）-5- ( 3,5-二-tert-丁基-苯基）-吡唑啉、1-苯基-3-( 2,6-二461^-丁基-苯乙烯基）-5-(2,6-二461^-丁基-苯基 )-卩比哩琳、1-苯基-3- ( 2,5- —>-tert -丁基本乙嫌基）-5-( 2.5- 二- tert-丁基-苯基）-吡唑啉、1-苯基-3- (2,6-二-η-丁〇 W 基-苯乙烯基）-5- (2,6-二-η-丁基-苯基）-吡唑啉、1-( 3，4-二-tert-丁基-苯基）-3-苯乙烯基-5-苯基-吡唑啉、1-( 3.5- 二- tert-丁基-苯基）-3-苯乙烯基-5-苯基-吡哇啉、1-( 4-tert-丁基-苯基）-3- (3,5-二- tert-丁基-苯基）-吡唑啉、 1- ( 3,5-二- tert-丁基-苯基）-3- ( 3，5-二- tert-丁基-苯乙烯基）-5- ( 3,5-二- tert-丁基-苯基）-吡哩啉、1-苯基- 3-(2-噻吩基）-5-(44 61*1-丁基苯基）-吡唑啉、1-苯基-3-(2-噻吩基）乙烯基-5- (2-噻吩基）-吡唑啉、1-苯基- 3-(2-噻吩基）-5 - ( 2 -噻吩基）-吡唑啉、1 -苯基-3 - ( 2 -噻吩基 -33- 201042389 )-5-苯乙烯基吡唑啉等。這些可單獨使用或組合2種以上後使用。上述化合物中’亦由提高合成容易度及感度之觀點來看，以1-苯基-3- (4 -甲氧基苯乙稀基）-5- (4 -甲氧基苯基 )-吡唑啉爲特佳。又，由提高合成之容易度及對溶劑之溶解性的觀點來看’以1-苯基-3- (4 -異丙基苯乙烯基）-5- ( 4-異丙基苯基）-吡唑啉爲特佳。 (D)成分中，上述一般式（1)所示化合物的含有量由感度及解像性優良的觀點來看，將（D)成分的總質量作爲基準以1 0〜1 00質量％爲佳，以3 0〜1 00質量％爲較佳，以50〜100質量％爲更佳。又，本發明之感光性樹脂組成物中，以不損害本發明的效果之程度下’可合倂添加上述一般式（1)所示化合物以外的敏化色素。具體而言，例如可舉出二烷基胺基二苯甲酮類、蒽類、香豆素類、咕噸酮類、噁唑類、苯並噁唑類、噻唑類、苯並噻唑類、三唑類、芪類、三嗪類、噻吩類、萘二甲醯亞胺類、三芳基胺類。這些可單獨使用、或可組合2種以上後使用。 (D)成分之含有量對於（A)成分及（B)成分的總量100質量份而言，以0.01〜10質量份爲佳。由感度及解像性優良的觀點來看，（D )成分的含有量以0.01質量份以上爲佳’以0 · 0 5質量份以上爲較佳，以〇 . 1質量份以上爲更佳。由硬化後的光阻形狀優良的觀點來看，（D )成分的含有量以1 0質量份以下爲佳，以5質量份以下爲較佳， -34- 201042389 以3質量份以下爲更佳。 [(E )成分··胺系化合物] 本實施形態的感光性樹脂組成物由進一步提高感度的觀點來看，可含有作爲（E)成分之胺系化合物。作爲（E )胺系化合物，可舉出雙[4-(二甲基胺基）苯基]甲烷、雙[4-(二乙基胺基）苯基]甲烷、還原型結晶紫等。這些 Ο 可單獨使用、或組合2種類以上後使用。感光性樹脂組成物含有（E )成分（胺系化合物）時，該含有量對於（A)成分及（B)成分的總量1〇〇質量份而言以0.01〜10質量份爲佳。由感度優良的觀點來看，（ E)成分的含有量以〇.〇1質量份以上爲佳，以0.05質量份以上爲較佳，以〇. 1質量份以上爲更佳。薄膜形成後欲防止析出作爲異物的過剩（E )胺系化合物，（D )成分的含有量以10質量份以下爲佳，以5質量份以下爲較佳，以2質量〇 w 份以下爲更佳。 [其他成分] 本實施形態的感光性樹脂組成物視必要可含有分子內具有至少1個陽離子可聚合之環狀醚基的光聚合性化合物 (環氧丙烷化合物等）'陽離子聚合啓始劑、孔雀石綠等染料、三溴苯基颯、還原型結晶紫等光發色劑、熱發色防止劑、P-甲苯胺磺醯等可塑劑、顔料、塡充劑、消泡劑、難燃劑、安定劑、密著性賦予劑、塗平劑、剝離促進劑、 -35- 201042389 抗氧化劑、香料、成像劑、熱交聯劑。這些可單獨使用、或組合2種類以上後使用。這些含有量對於（A)成分及（ B )成分之總量100質量份而言，各以0.01〜20質量份程度爲佳。 <感光性樹脂組成物之溶液> 本實施形態的感光性樹脂組成物爲溶解於有機溶劑，作爲固體成分30〜60質量％程度之溶液（塗佈液）使用。作爲有機溶劑例如可舉出甲醇、乙醇、丙酮、甲基乙基酮、甲基賽路蘇、乙基賽路蘇、甲苯、N，N-二甲基甲醯胺、丙二醇單甲基醚、或這些混合溶劑。將上述塗佈液塗佈於金屬板等表面上，使其乾燥後，可形成由本實施形態之感光性樹脂組成物所成之感光性樹脂組成物層。作爲金屬板，可舉出銅、銅系合金、鎳、鉻、鐵、不銹鋼等鐵系合金，較佳可舉出銅、銅系合金、鐵系合金。感光性樹脂組成物層之厚度因其用途而不同，但乾燥後之厚度以1〜ΙΟΟμιη程度爲佳。亦可以保護薄膜覆蓋與感光性樹脂組成物層之金屬板相反側之表面。作爲保護薄膜可舉出聚乙烯、聚丙烯等聚合物薄膜。 <感光性元件> 本發明的感光性元件1如圖1所示，具備支持薄膜2、與形成於支持薄膜2上之感光性樹脂組成物層3，視必要於 -36- 201042389 感光性樹脂組成物層3上可進一步具備保護薄膜4者。將上述感光性樹脂組成物的溶液塗佈於支持薄膜2上，藉由使其乾燥，於支持薄膜2上可形成由前述感光性樹脂組成物所成之感光性樹脂組成物層3 »藉此，具備支持薄膜2、與形成於該支持薄膜2上之感光性樹脂組成物層3 ，得到本實施形態之感光性元件1。作爲支持薄膜，可使用聚乙烯對苯二甲酸酯等聚酯、 Ο 聚丙烯、聚乙稀等具有耐熱性及耐溶劑性之聚合物薄膜。支持薄膜（聚合物薄膜）之厚度若考慮到對該強度及解像性之影響時，以1〜ΙΟΟμιη爲佳，以5〜50μιη爲較佳，以5 〜30μιη爲更佳。該厚度未達Ιμηι時，剝離支持薄膜時，有著支持薄膜容易破裂的傾向。又，欲使其不會影響到解像性以ΙΟΟμηι以下爲佳，以50μιη以下爲較佳，以30μηι以下爲更佳。感光性元件1視必要可具備覆蓋與感光性樹脂組成物 Ο 層3的支持薄膜2爲相反側的表面之保護薄膜4。作爲保護薄膜，對於感光性樹脂組成物層之接著力比對支持薄膜的感光性樹脂組成物層之接著力還小者爲佳，又以低魚眼之薄膜爲佳。其中所謂「魚眼」表示將材料經熱熔融 '混煉、壓出、二軸延伸、濺鍍法等而製造薄膜時 ’材料之異物、未溶解物、氧化劣化物等會由薄膜中得到者。即所謂「低魚眼」表示薄膜中較少上述異物等。作爲保護薄膜，具體可使用聚乙烯對苯二甲酸酯等聚酯、聚丙烯、聚乙烯等、聚酯等具有耐熱性及耐溶劑性之 -37- 201042389 聚合物薄膜。作爲販賣品’可舉出王子製紙股份有限公司製ArufunMA-410、E-200C、信越薄膜股份有限公司製等聚丙烯薄膜、帝人股份有限公司製PS-25等PS系列等聚乙烯對苯二甲酸酯薄膜。且保護薄膜亦可爲與支持薄膜相同者。保護薄膜之厚度以1〜ΙΟΟμηι爲佳，以5〜50μπι爲較佳，以5〜30μιη爲更佳，以15〜30μηι爲特佳。該厚度未達 Ιμιη時，當將感光性樹脂組成物層及保護薄膜層合於基板上時，有著保護薄膜容易破裂的傾向，若超過1〇〇 μπι時，由廉價性的觀點來看並未令人滿意。感光性樹脂組成物之溶液對於支持薄膜上的塗佈可藉由輥塗佈、缺角輪塗佈（Comma coater )、凹版塗佈、氣刀塗佈、狹縫塗佈、棒塗佈等公知之方法進行。上述溶液的乾燥於70〜150t下進行5〜30分鐘程度爲佳。乾燥後感光性樹脂組成物層中之殘存有機溶劑量，由在後步驟防止有機溶劑之擴散的觀點來看，以2質量份以下爲佳。感光性元件中之感光性樹脂組成物層的厚度雖依據用途而相異，乾燥後之摩度以1〜ΙΟΟμιη爲佳，以1〜50μηι爲較佳，以5〜40μηι爲更佳。該厚度未達Ιμιη時，有著工業上難進行塗佈之傾向，超過ΙΟΟμιη時，有著無法得到充分密著性及解像性之傾向。上述感光性樹脂組成物層對於紫外線之透過率爲，對於波長405nm之紫外線而言以5〜75%爲佳。由密著性優良 -38- 201042389 的觀點來看，該透過率以5 %以上爲佳，以1 〇 %以上爲較佳，以1 5 %以上更佳。由解像性優良的觀點來看，以7 5 %以下爲佳，以65%以下爲較佳，以55 %以下爲更佳。上述透過率可藉由UV分光計進行測定。作爲UV分光計可舉出日立股份有限公司製作所製22 8 Α型W光束分光光度計。感光性元件可進一步具有緩衝層、接著層、光吸收層〇、氣體阻斷層等中間層等。所得之感光性元件可爲薄片狀或於捲芯捲爲輥狀下保管。於輥狀進行捲取時，捲取成支持薄膜爲外側方式進行爲佳。作爲捲芯，可舉出聚乙烯樹脂、聚丙烯樹脂、聚苯乙烯樹脂、聚氯化乙烯基樹脂、ABS樹脂（丙烯腈-丁二烯-苯乙烯共聚合物）等塑質等。如此所得之輥狀感光性元件輥的端面上，由端面保護之觀點來看，設置端面分離器爲佳，由耐熔邊（edge fusion)之觀點來看，設置防濕〇 w 端面分離器爲佳。作爲綑綁梱方法，以透濕性較小的黑薄片包埋之包裝爲佳。 <光阻圖型之形成方法> 使用本發明之感光性樹脂組成物，可形成光阻圖型。有關本實施形態之光阻圖型的形成方法爲具有（i)將由上述感光性樹脂組成物所成之感光性樹脂組成物層層合於基板上的層合步驟、（ii )於感光性樹脂組成物層之所定部分照射活性光線後使該所定部分進行曝光’經硬化的曝 -39- 201042389 光步驟、與（iii )將感光性樹脂組成物層的所定部分以外之部分自基板上除去後，於基板上形成由感光性樹脂組成物之硬化物所成之光阻圖型的顯像步驟。 (i )層合步驟首先，將由感光性樹脂組成物所成之感光性樹脂組成物層層合於基板上。作爲基板，可使用具備絕緣層與於該絕緣層上所形成之導體層的基板（電路形成用基板）。感光性樹脂組成物層對於基板上之層合，例如將上述感光性元件之保護薄膜除去後，一邊加熱感光性元件之感光性樹脂組成物層，一邊壓著於前述基板而進行。藉此，可得到以基板、感光性樹脂組成物層與支持薄膜之順序層合而成的層合體。該層合作業由密著性及追蹤性的觀點來看，在減壓下進行爲佳。壓著時的感光性樹脂組成物層及/或基板之加熱在70〜130t的溫度下進行爲佳，以〇.1〜1·〇 MPa程度（ 1〜10 kgf/cm2程度）之壓力下壓著爲佳，但這些條件並無特別限制。且若將感光性樹脂組成物層於7〇〜1 30°C進行加熱，可無須將基板進行預熱處理，但欲進一步提高層合性，亦可進行基板之預熱處理。 (Π)曝光步驟其次，於基板上之感光性樹脂組成物層的所定部分以活性光線進行照射後使該所定部分進行曝光，並使其硬化 -40- 201042389 。此時，存在於感光性樹脂組成物層上的支持薄膜對於活性光線具有透過性時，可透過支持薄膜照射活性光線，但若支持薄膜爲遮光性時，除去支持薄膜後，於感光性樹脂組成物層照射活性光線。作爲曝光方法，可舉出通過稱爲原圖（artwork)之負型或正型光罩圖型，以活性光線照射於畫像上之方法（光罩曝光法）。又，亦可採用 LDI (Laser Direct Imaging) Ο 曝光法或DLP ( Digital Light Processing)曝光法等藉由直接描畫曝光法將活性光線照射於畫像狀的方法。作爲活性光線之光源，可使用公知光源，例如可使用碳弧燈 '水銀蒸氣弧燈、高壓水銀燈、氙氣燈、氬雷射等氣體雷射、YAG雷射等固體雷射、半導體雷射等紫外線、可見光等可有效放射者。作爲活性光線之波長（曝光波長），由可確實得到本發明之效果的觀點來看，以350〜420nm之範圍內爲佳，以〇 390〜42〇nm之範圍內爲較佳。 (i i i )顯像步驟且’藉由將感光性樹脂組成物層之所定部分以外的部分由基板上除去，於基板上形成由感光性樹脂組成物之硬化物所成的光阻圖型。於感光性樹脂組成物層上存在支持薄膜時’除去支持薄膜後，進行上述所定部分（曝光部分 )以外部分（未曝光部分）之除去（顯像）。顯像方法中雖有濕顯像與乾顯像，但濕顯像廣泛被使用。 -41 - 201042389 藉由濕顯像進行時’使用對應感光性樹脂組成物的顯像液，藉由公知顯像方法進行顯像。作爲顯像方法，可舉出使用浸漬方式、攪煉（puddle )方式、噴霧方式、洗刷、拍擊、刮削 '搖動浸漬等的方法，由解像性提高之觀點來看，高壓噴霧方式爲最適合。亦可組合此等2種以上的方法進行顯像。作爲顯像液，可舉出鹼性水溶液、水系顯像液、有機溶劑系顯像液等。鹼性水溶液作爲顯像液使用時，其爲安全且安定，操作性良好者。作爲鹼性水溶液之鹼，可使用鋰、鈉或鉀之氫氧化物等氫氧化鹼；鋰、鈉、鉀或銨之碳酸鹽或重碳酸鹽等碳酸鹼；磷酸鉀、磷酸鈉等鹼金屬磷酸鹽；焦磷酸鈉、焦磷酸鉀等鹼金屬焦磷酸鹽。作爲鹼性水溶液，以〇. 1〜5質量％碳酸鈉之稀薄溶液、0.1〜5質量％碳酸鉀之稀薄溶液、0.1〜5質量％氫氧化鈉之稀薄溶液、0 · 1〜5質量％四硼酸鈉之稀薄溶液爲佳。鹼性水溶液的pH以9〜1 1之範圍爲佳，該溫度可配合感光性樹脂組成物層之鹼顯像性而調節。鹼性水溶液中亦可混入表面活性劑、消泡劑、促進顯像之少量有機溶劑等。水系顯像液，例如爲水或鹼性水溶液與一種以上之有機溶劑所成的顯像液。其中，作爲鹼性水溶液之鹼，如先前所述物質以外，例如可舉出硼砂或甲基矽酸鈉、氫氧化四甲基銨、乙醇胺、伸乙基二胺、二伸乙基三胺、2-胺基-2-羥基甲基-1，3-丙烷二醇、1，3-二胺基丙醇-2、嗎啉。水 -42- 201042389 系顯像液的pH可充分進行顯像的範圍之較小値爲佳’以 pH8〜12爲佳，以pH9〜10爲較佳。作爲使用於水系顯像液之有機溶劑，可舉出丙酮、乙酸乙酯、具有碳原子數1〜4的烷氧基之烷氧基乙醇、乙基醇、異丙基醇、丁基醇、二乙二醇單甲基醚、二乙二醇單乙基醚 '二乙二醇單丁基醚。這些可單獨使用、或組合2 種類以上使用。水系顯像液中之有機溶劑的濃度，一般以 Ο 2〜90質量％爲佳，該溫度可配合鹼顯像性而做調整。水系顯像液中亦可混入少量界面活性劑、消泡劑等。作爲有機溶劑系顯像液，可舉出1,1，1-三氯乙烷、N-甲基吡咯烷酮、N，N-二甲基甲醯胺、環己酮、甲基異丁基酮、γ-丁內酯等有機溶劑。這些有機溶劑中欲防止起火，添加1〜20質量％範圍之水爲佳。除去未曝光部分後，視必要進行60〜250°c程度之加熱或0.2〜10 J/cm2程度的曝光後，可使光阻圖型進一步硬 ❹化。 <印刷電路板的製造方法> 藉由將經上述方法形成之光阻圖型的基板進行蝕刻或鎪敷，可製造印刷電路板。基板的蝕刻或鍍敷係可將所形成之光阻圖型作爲光罩，對於基板之導體層等進行。作爲進行鈾刻時的蝕刻液，可舉出氯化第二銅溶液、氯化第二鐵溶液、鹼蝕刻溶液、過酸化氫蝕刻液，彼等中由蝕刻函數良好的觀點來看，使用氯化第二鐵溶液爲佳。 -43- 201042389 作爲進行鍍敷時的鍍敷方法，可舉出硫酸銅鍍敷、焦磷酸銅鍍敷等銅鍍敷、高流動銲接劑鎪敷等鑛敷、瓦特鍍浴（Watts Bath)(硫酸鎳-氯化鎳）鍍敷、胺磺酸鎳等鎳鍍敷、硬鍍金、軟鍍金等鍍金。蝕刻或鍍敷終了後，光阻圖型例如可藉由比顯像所使用的鹼性水溶液更強鹼性的水溶液進行剝離。作爲該強鹼性之水溶液，例如可使用1〜1 0質量％氫氧化鈉水溶液、1 〜10質量％氫氧化鉀水溶液。其中亦以使用1〜〗〇質量％氫氧化鈉水溶液或氫氧化鉀水溶液爲佳，以使用1〜5質量％氫氧化鈉水溶液或氫氧化鉀水溶液爲較佳。作爲光阻圖型之剝離方式，可舉出浸漬方式、噴霧方式等，這些可單獨使用或亦可倂用。又，形成光阻圖型之印刷電路板可爲多層印刷電路板，亦可具有小徑通孔，亦可爲具有如高密度封裝基板及矽晶片再配線之高密度化配線的印刷電路板。【實施方式】 [實施例] 以下舉出實施例對於本發明更具體說明。但，本發明並非限定於以下實施例者。 (A)黏合劑聚合物 (A-1 ) 混合聚合性單體（單體）之甲基丙烯酸15〇g、甲基丙 -44- 201042389 烯酸苯甲基l；25g、甲基丙烯酸甲基25g及苯乙烯200g (質量比30/25/5/40 )、與偶氮二異丁腈9.0g所得之溶液作爲「溶液a」。於甲基賽路蘇60g及甲苯40g的混合液（質量比3 : 2 ) l〇〇g，溶解偶氮二異丁腈1.2g所得之溶液作爲「溶液b」〇於具備攪拌機、迴流冷卻器、溫度計、滴液漏斗及氮 C) 氣導入管的燒瓶中，投入甲基賽路蘇270g及甲苯180g之混合液（質量比3 : 2 ) 45 0g，一邊於燒瓶內吹入氮氣一邊進行攪拌，加熱昇溫至8〇°C。於燒瓶內之混合液，將上述溶液a經4小時滴下後，一邊攪拌一邊在80°C下保溫2小時。其次，於燒瓶內之溶液中，將上述溶液b經10分鐘滴下後，一邊攪拌燒瓶內溶液，一邊於80°C下保溫3小時。且將燒瓶內之溶液經30分鐘昇溫至90 °C，在90°C下保溫2小時後，冷卻後得到黏合劑聚〇 ^ 合物（A-ι)之溶液。黏合劑聚合物（A-1)之不揮發分（固體成分）爲 47.8質量％，重量平均分子量爲30000，酸値酸値爲196 mgKOH/g。且，重量平均分子量藉由凝膠滲透層析儀法（ GPC )測定，使用標準聚苯乙烯之校正曲線，經換算導出。GPC之條件如下所示。 (GPC條件）幫浦：日立 L-6000型（日立股份有限公司製作所製 -45- 201042389 管柱：以下共3根In the formula (1), R1 and R2 each independently represent a substituted or unsubstituted phenyl group, a thienyl group or a furyl group, and a substituted or unsubstituted phenyl group is preferred from the viewpoint of further improving the resolution. Examples of the substituent 'the alkyl group having 1 to 10 carbon atoms, the alkoxy group having 1 to 1 carbon atom, or the alkyl ester group having 1 to 10 carbon atoms may be an alkyl group having 1 to 1 carbon number or The alkoxy group having 1 to 10 carbon atoms is preferably 'having an alkyl group having 3 to 8 carbon atoms or an alkoxy group having 1 to 5 carbon atoms. Each of a and b is independent, and represents an integer of 0 to 2. R3 represents an alkyl group having 1 to 1 carbon atom, an alkoxy group having 1 to 10 carbon atoms, or a group-based ester group having 1 to 10 carbon atoms. Wherein 'the alkyl group having a carbon number of 1 to 10 or the alkoxy group having a carbon number of 1 to -29 to 201042389 10 is preferred, and the alkyl group having 3 to 8 carbon atoms or the alkoxy group having 1 to 5 carbon atoms is preferred. . m represents an integer of 〇~5. When m is 2 to 5, the plural R3 may be the same or different from each other. The substituent of R1 to R3 is preferably an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 10 carbon atoms from the viewpoint of further improving sensitivity and solubility in a solvent. The alkyl group having 1 to 10 carbon atoms or the alkoxy group having 1 to 10 carbon atoms may be linear or branched. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl 'isopropyl group, an η-butyl group, a tert-butyl group, an isopentyl group, and a tert-octyl group. However, the alkyl group is not limited thereto. . Further, the sum of a and b in the general formula (1) is preferably 1 to 6', preferably 1 to 4, more preferably 1 to 3. Examples of the compound represented by the above formula (1) include 1-(4-methoxyphenyl)-3-styryl-5-phenyl-pyrazoline and 1-phenyl-3-( 4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1,5-bis-(4-methoxyphenyl)-3-(4-methoxy Styryl)-pyrazoline, 1-(4-isopropylphenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-isopropylbenzene Vinyl)-5-(4-isopropylphenyl)-pyrazoline, 1,5-bis-(4-isopropylphenyl)_3_(4-isopropylstyryl)-pyrazoline, (4-methoxyphenyl)-3_(4_tert_butyl-styryl)-5-(4_tert-butyl-phenyl)-pyrazoline, i_(4-tert-butyl-phenyl) ·3,(4-Methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, (4-isopropyl-phenyl)-3-(4-tert-butyl -styryl)-5-(4-tert-butyl-phenyl)-indole porphyrin, 1-(4-tert-butyl-phenyl)-3-(4-isopropyl-styryl) -5-(4-isopropyl-phenyl)-pyrazoline, 1-(4-methoxy-30-201042389-phenyl)-3-(4-isopropylcarbinyl)-5- ( 4-isopropyl basic)-pyrazoline (4-isopropyl-phenyl)-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-phenyl-3-(3) ,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(3.4-dimethoxystyryl)- 5-(3,4-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxy Phenyl)-pyrazoline, 1-phenyl-3-(2,5-dimethoxystyryl)-5-O (2,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,3-dimethoxystyryl)-5·(2,3-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2, 4-dimethoxystyryl)_5-(2,4-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(3,5-dimethyl Oxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(3.4-dimethoxystyryl) -5-(3,4-dimethoxyphenyl)- thiazoline, 1-(4-methoxyphenyl)-3-(2,6-dimethoxystyryl)-5 -( 2,6-dimethoxyphenyl)- thiazoline, Bu (4-methoxyphenyl)-3-(^ 2,5-dimethoxystyryl) -5-(2,5-Dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(2,3-dimethoxystyryl)-5- (2.3-Dimethoxyphenyl)-pyrazoline, Bu (4-methoxyphenyl)-3-(2.4-dimethoxystyryl)_5-( 2〆-dimethoxybenzene , pyrazoline, 1-(44 6^-butyl-phenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl) )-pyrazin, 1-(4-161^-butyl-phenyl)-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl) )-pyrazoline, 1-(4- to 4-butyl-phenyl)-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl) )-pyrazoline, 1-(4-tert-butyl-31 - 201042389 phenyl-phenyl)_3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxybenzene , pyrazoline, 1-(4-tert-butyl-phenyl)-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl) )-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl) -pyrazoline, 1-(4-isopropyl-phenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)- Pyrazoline, 1-(4-isopropyl-phenyl)-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazole Porphyrin, 1-(4-isopropyl-phenyl)-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1- (4-isopropyl-phenyl)-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-(4- Isopropyl-phenyl)-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline, 1-(4-tert- Butyl-phenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-tert-butyl-styryl)-5- (4-tert-butyl -Phenyl)-pyrazoline, 1,5-bis-(4-tert-butyl-phenyl)-3-(4-tert-butyl-styryl)-pyrazoline, 1-( 4-tert-octyl-phenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-tert-octyl-styryl)-5- (4 -tert-octyl-phenyl)-pyrazoline, 1,5-bis-(4-tert-octyl-phenyl)-3-(4-tert-octyl-phenylethyl)-pyrazole Porphyrin, 1-(4-12 -Phenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-dodecyl-styryl)-5-(4-dodecyl -phenyl)-pyrazoline, 1-(4-dodecyl-phenyl)-3-(4-dodecyl-styryl)-5-(4-dodecyl-phenyl )-pyrazoline, 1-(4-tert--32- 201042389 octyl-phenyl)-3 - (4-1ert-butyl-styrene)-5- (4-tert-butyl- Phenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(4-tert-octyl-styryl)-5-(4-tert-octyl-phenyl) -pyrazoline, 1-(4-deca-phenyl-phenyl)-3-(4-tert-butyl-phenylethenyl)-5-(4-tert-butyl-phenyl)-pyridyl Oxazoline, 1-(4-tert-butyl-phenyl)-3-(4-dodecyl-styryl)-5-(4-dodecyl-phenyl)-pyrazoline, 1-(4-dodecyl-phenyl)-3-(4-tert-octyl-styryl)-5-(4-tert-octyl-phenyl)-pyrazoline, 1- (4-tert-octyl-phenyl)-3-(4-dodecyl-styryl)-5-(4-dodecyl-phenyl)-pyrazoline, 1-(2, 4-dibutyl-phenyl)-3-(4-dodecyl-styryl)-5-(4-dodecyl-phenyl)-pyridyl Porphyrin, 1-phenyl-3-(3,5-di-tert-butylstyryl)-5-(3,5-di-tert-butyl-phenyl)-pyrazoline, 1- Phenyl-3-(2,6-di-461-butyl-styryl)-5-(2,6-di-461-butyl-phenyl)-indole-pyrene, 1-phenyl- 3-( 2,5- —>-tert-butyl-ethyl)-5-( 2.5-di-tert-butyl-phenyl)-pyrazoline, 1-phenyl-3-(2, 6-di-η-butanyl W-styryl)-5-(2,6-di-η-butyl-phenyl)-pyrazoline, 1-(3,4-di-tert-butyl -phenyl)-3-styryl-5-phenyl-pyrazoline, 1-(3.5-di-tert-butyl-phenyl)-3-styryl-5-phenyl-pyr Porphyrin, 1-(4-tert-butyl-phenyl)-3-(3,5-di-tert-butyl-phenyl)-pyrazoline, 1-(3,5-di-tert-butyl -phenyl)-3-(3,5-di-tert-butyl-styryl)-5-(3,5-di-tert-butyl-phenyl)-pyridinoline, 1-benzene 3-(2-thienyl)-5-(44 61*1-butylphenyl)-pyrazoline, 1-phenyl-3-(2-thienyl)vinyl-5- (2- Thienyl)-pyrazoline, 1-phenyl-3-(2-thienyl)-5-(2-thienyl)-pyrazoline, 1-phenyl-3-(2-thienyl-33- 201042389 )-5-Phenyl B Alkenylpyrazoline and the like. These can be used singly or in combination of two or more. In the above compounds, '1-phenyl-3-(4-methoxyphenylethyl)-5-(4-methoxyphenyl)-pyrene is also used from the viewpoint of improving the ease of synthesis and sensitivity. Oxazolines are particularly preferred. Further, from the viewpoint of improving the ease of synthesis and solubility in a solvent, '1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)- Pyrazolines are particularly preferred. In the component (D), the content of the compound represented by the above formula (1) is preferably from 10 to 100% by mass based on the total mass of the component (D) from the viewpoint of excellent sensitivity and resolution. It is preferably from 30 to 100% by mass, more preferably from 50 to 100% by mass. Further, in the photosensitive resin composition of the present invention, the sensitizing dye other than the compound represented by the above general formula (1) can be added to the extent that the effects of the present invention are not impaired. Specific examples thereof include dialkylaminobenzophenones, anthraquinones, coumarins, xanthones, oxazoles, benzoxazoles, thiazoles, benzothiazoles, and the like. Triazoles, anthracenes, triazines, thiophenes, naphthyl imines, triarylamines. These can be used individually or in combination of 2 or more types. The content of the component (D) is preferably 0.01 to 10 parts by mass based on 100 parts by mass of the total of the components (A) and (B). The content of the component (D) is preferably 0.01 parts by mass or more, and more preferably 0 parts by mass or more, more preferably 1 part by mass or more, from the viewpoint of excellent sensitivity and resolution. The content of the component (D) is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and more preferably 3 parts by mass or less, from the viewpoint of excellent shape of the resist after curing. . [(E) component·amine compound] The photosensitive resin composition of the present embodiment may contain an amine compound as the component (E) from the viewpoint of further improving the sensitivity. Examples of the (E) amine compound include bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, and reduced crystal violet. These Ο can be used singly or in combination of two or more types. When the photosensitive resin composition contains the component (E) (amine compound), the content is preferably 0.01 to 10 parts by mass based on 1 part by mass of the total of the components (A) and (B). The content of the component (E) is preferably 1 part by mass or more, more preferably 0.05 part by mass or more, more preferably 1 part by mass or more. After the formation of the film, it is preferable to prevent the precipitation of the excess (E) amine compound as a foreign matter, and the content of the component (D) is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and still more preferably 2 parts by weight or less. good. [Other components] The photosensitive resin composition of the present embodiment may contain a photopolymerizable compound (such as a propylene oxide compound) which has at least one cationically polymerizable cyclic ether group in the molecule, and a cationic polymerization initiator. Malachite green dyes, tribromophenyl hydrazine, reduced crystal violet and other photochromic agents, thermal hair color preventive agents, P-toluidine sulfonium and other plasticizers, pigments, chelating agents, defoamers, flame retardants Agent, stabilizer, adhesion imparting agent, coating agent, peeling accelerator, -35- 201042389 Antioxidant, perfume, imaging agent, thermal crosslinking agent. These can be used individually or in combination of 2 or more types. These contents are preferably from 0.01 to 20 parts by mass per 100 parts by mass of the total of the components (A) and (B). <Solution of a photosensitive resin composition> The photosensitive resin composition of the present embodiment is used as a solution (coating liquid) which is dissolved in an organic solvent and has a solid content of about 30 to 60% by mass. Examples of the organic solvent include methanol, ethanol, acetone, methyl ethyl ketone, methyl stilbene, ethyl siroli, toluene, N,N-dimethylformamide, propylene glycol monomethyl ether, Or these mixed solvents. The coating liquid is applied onto a surface of a metal plate or the like and dried to form a photosensitive resin composition layer of the photosensitive resin composition of the present embodiment. Examples of the metal plate include an iron-based alloy such as copper, a copper-based alloy, nickel, chromium, iron, or stainless steel, and copper, a copper-based alloy, and an iron-based alloy are preferable. The thickness of the photosensitive resin composition layer varies depending on the use thereof, but the thickness after drying is preferably from 1 to ΙΟΟμηη. It is also possible to protect the surface of the film from the opposite side to the metal plate of the photosensitive resin composition layer. As the protective film, a polymer film such as polyethylene or polypropylene can be mentioned. <Photosensitive element> The photosensitive element 1 of the present invention includes a support film 2 and a photosensitive resin composition layer 3 formed on the support film 2 as shown in Fig. 1, and is required to be -36-201042389 Further, the resin composition layer 3 may further include a protective film 4. A solution of the photosensitive resin composition is applied onto the support film 2, and dried to form a photosensitive resin composition layer 3 formed of the photosensitive resin composition on the support film 2. The support film 2 and the photosensitive resin composition layer 3 formed on the support film 2 are provided, and the photosensitive element 1 of this embodiment is obtained. As the support film, a polyester film such as polyethylene terephthalate, a polymer film having heat resistance and solvent resistance such as styrene polypropylene or polyethylene can be used. The thickness of the support film (polymer film) is preferably 1 to ΙΟΟμηη, preferably 5 to 50 μm, and more preferably 5 to 30 μm, in consideration of the influence on the strength and the resolution. When the thickness is less than Ιμηι, when the support film is peeled off, there is a tendency that the support film is easily broken. Further, it is preferable that the resolution is not more than ημηι, and it is preferably 50 μm or less, more preferably 30 μηι or less. The photosensitive element 1 may have a protective film 4 covering the surface opposite to the support film 2 of the photosensitive resin composition Ο layer 3 as necessary. As the protective film, the adhesion of the photosensitive resin composition layer is preferably smaller than the adhesion of the photosensitive resin composition layer of the support film, and the film of the fisheye is preferably used. The term "fisheye" means that when a film is produced by hot-melting 'kneading, extruding, biaxial stretching, sputtering, etc.', foreign matter, undissolved matter, oxidative degradation, etc. of the material are obtained from the film. . That is, the "low fisheye" means that the above-mentioned foreign matter or the like is scarce in the film. As the protective film, specifically, a polymer film such as a polyester such as polyethylene terephthalate, polypropylene, polyethylene or the like, and a heat-resistant and solvent-resistant polyester such as polyester can be used. As a sales item, a polypropylene film such as Arufun MA-410, E-200C, and Shin-Etsu Film Co., Ltd. manufactured by Oji Paper Co., Ltd., and PS series such as PS-25 manufactured by Teijin Co., Ltd., etc., may be cited. Acid film. And the protective film may be the same as the support film. The thickness of the protective film is preferably 1 to ΙΟΟμηι, preferably 5 to 50 μm, more preferably 5 to 30 μm, and particularly preferably 15 to 30 μm. When the thickness is less than Ιμηη, when the photosensitive resin composition layer and the protective film are laminated on the substrate, the protective film tends to be easily broken. When it exceeds 1 μm, it is not from the viewpoint of inexpensiveness. Satisfactory. The solution of the photosensitive resin composition can be applied to the support film by roll coating, Comma coater, gravure coating, air knife coating, slit coating, bar coating, and the like. The method is carried out. The drying of the above solution is preferably carried out at 70 to 150 tons for 5 to 30 minutes. The amount of the residual organic solvent in the photosensitive resin composition layer after drying is preferably 2 parts by mass or less from the viewpoint of preventing the diffusion of the organic solvent in the subsequent step. The thickness of the photosensitive resin composition layer in the photosensitive element differs depending on the application, and the degree of drying after drying is preferably 1 to ΙΟΟμηη, more preferably 1 to 50 μm, and even more preferably 5 to 40 μη. When the thickness is less than Ιμηη, it tends to be difficult to apply industrially. When it exceeds ΙΟΟμηη, it tends to have insufficient adhesion and resolution. The transmittance of the photosensitive resin composition layer to ultraviolet rays is preferably 5 to 75% for ultraviolet rays having a wavelength of 405 nm. From the viewpoint of excellent adhesion -38 to 201042389, the transmittance is preferably 5% or more, more preferably 1% or more, and even more preferably 15% or more. From the viewpoint of excellent resolution, it is preferably 75 % or less, more preferably 65% or less, and still more preferably 55% or less. The above transmittance can be measured by a UV spectrometer. As the UV spectrometer, a 22 8 W W beam spectrophotometer manufactured by Hitachi, Ltd. is used. The photosensitive element may further have an intermediate layer such as a buffer layer, an adhesive layer, a light absorbing layer 、, a gas blocking layer, or the like. The obtained photosensitive member may be in the form of a sheet or may be kept under the roll in the form of a roll. When winding in a roll form, it is preferable to roll up the support film to the outside. Examples of the core of the core include plastics such as a polyethylene resin, a polypropylene resin, a polystyrene resin, a polychlorinated vinyl resin, and an ABS resin (acrylonitrile-butadiene-styrene copolymer). In the end face of the roll-shaped photosensitive element roll thus obtained, it is preferable to provide an end face separator from the viewpoint of end face protection, and from the viewpoint of edge fusion, a moisture-proof 端面w end face separator is provided. good. As a method of binding the enamel, it is preferable to package the black sheet which is less permeable to moisture. <Formation Method of Photoresist Pattern> Using the photosensitive resin composition of the present invention, a photoresist pattern can be formed. The method for forming a photoresist pattern according to the present embodiment includes (i) a lamination step of laminating a photosensitive resin composition layer formed of the photosensitive resin composition on a substrate, and (ii) a photosensitive resin. After a predetermined portion of the composition layer is irradiated with the active light, the predetermined portion is exposed to the 'cured exposure-39-201042389 light step, and (iii) the portion other than the predetermined portion of the photosensitive resin composition layer is removed from the substrate. A step of developing a photoresist pattern formed by a cured product of a photosensitive resin composition is formed on the substrate. (i) Lamination step First, a photosensitive resin composition layer made of a photosensitive resin composition is laminated on a substrate. As the substrate, a substrate (circuit forming substrate) having an insulating layer and a conductor layer formed on the insulating layer can be used. After the photosensitive resin composition layer is laminated on the substrate, for example, the protective film of the photosensitive element is removed, and the photosensitive resin composition layer of the photosensitive element is heated while being pressed against the substrate. Thereby, a laminate in which the substrate, the photosensitive resin composition layer, and the support film are laminated in this order can be obtained. This layer of cooperation is better from the point of view of adhesion and traceability, under reduced pressure. The heating of the photosensitive resin composition layer and/or the substrate at the time of pressing is preferably carried out at a temperature of 70 to 130 t, and is pressed at a pressure of about 1 to 1 〇 MPa (about 1 to 10 kgf/cm 2 ). It is better, but these conditions are not particularly limited. Further, when the photosensitive resin composition layer is heated at 7 Torr to 30 ° C, it is not necessary to preheat the substrate, but it is also possible to perform preheat treatment of the substrate in order to further improve the laminate property. (Π) Exposure step Next, a predetermined portion of the photosensitive resin composition layer on the substrate is irradiated with active light, and then the predetermined portion is exposed and hardened -40 - 201042389. In this case, when the support film which is present on the photosensitive resin composition layer is transparent to the active light, the support film can be irradiated with the active light. However, when the support film is light-shielding, the support film is removed and the photosensitive resin is formed. The layer illuminates the active light. As the exposure method, a method of irradiating an image with active light by a negative or positive mask pattern called an artwork (mask exposure method) can be mentioned. Further, a method of irradiating active light to an image by direct drawing exposure such as LDI (Laser Direct Imaging) 曝光 exposure method or DLP (Digital Light Processing) exposure method may be employed. As the light source of the active light, a known light source can be used. For example, a carbon arc lamp, a mercury vapor arc lamp, a high pressure mercury lamp, a xenon lamp, an argon laser or the like, a solid laser such as a YAG laser, or a semiconductor laser can be used. , visible light, etc. can be effectively emitted. The wavelength (exposure wavelength) of the active light is preferably in the range of 350 to 420 nm from the viewpoint of obtaining the effect of the present invention, and preferably in the range of 390 to 42 〇 nm. (i i i ) development step and by removing a portion other than the predetermined portion of the photosensitive resin composition layer from the substrate, a photoresist pattern formed of a hard material of the photosensitive resin composition is formed on the substrate. When the support film is present on the photosensitive resin composition layer, the removal (development) of the portion (unexposed portion) other than the predetermined portion (exposed portion) is performed after the support film is removed. Although wet imaging and dry imaging are used in the development method, wet imaging is widely used. -41 - 201042389 When performing by wet development, development is carried out by a known development method using a developing solution corresponding to the photosensitive resin composition. Examples of the development method include a method using an immersion method, a puddle method, a spray method, a scrubbing method, a slap, and a scraping method, and a high-pressure spray method is considered to be the most effective from the viewpoint of improving the resolution. Suitable for. It is also possible to combine these two or more methods for imaging. Examples of the developing solution include an alkaline aqueous solution, a water-based developing liquid, and an organic solvent-based developing liquid. When an alkaline aqueous solution is used as a developing solution, it is safe and stable, and has good workability. As the base of the alkaline aqueous solution, an alkali hydroxide such as a hydroxide of lithium, sodium or potassium; a carbonate such as lithium, sodium, potassium or ammonium carbonate or a bicarbonate; an alkali metal phosphate such as potassium phosphate or sodium phosphate can be used. Salt; alkali metal pyrophosphate such as sodium pyrophosphate or potassium pyrophosphate. As an alkaline aqueous solution, a thin solution of 1 to 5 mass% of sodium carbonate, a thin solution of 0.1 to 5 mass% of potassium carbonate, a thin solution of 0.1 to 5 mass% of sodium hydroxide, and 0 to 1 to 5 mass% of four A thin solution of sodium borate is preferred. The pH of the alkaline aqueous solution is preferably in the range of 9 to 1 1 , and the temperature can be adjusted in accordance with the alkali developability of the photosensitive resin composition layer. A surfactant, an antifoaming agent, a small amount of an organic solvent which promotes development, and the like may be mixed in the alkaline aqueous solution. The aqueous developing solution is, for example, a developing solution of water or an aqueous alkaline solution and one or more organic solvents. In addition, examples of the base of the alkaline aqueous solution include borax or sodium methyl citrate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, and di-ethyltriamine. 2-Amino-2-hydroxymethyl-1,3-propanediol, 1,3-diaminopropanol-2, morpholine. Water -42 - 201042389 It is preferred that the pH of the developing solution is sufficiently small in the range of development, preferably pH 8 to 12, and preferably pH 9 to 10. Examples of the organic solvent used in the aqueous developing solution include acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, and butyl alcohol. Diethylene glycol monomethyl ether, diethylene glycol monoethyl ether 'diethylene glycol monobutyl ether. These can be used individually or in combination of 2 or more types. The concentration of the organic solvent in the aqueous developing solution is preferably Ο 2 to 90% by mass, and the temperature can be adjusted in accordance with the alkali developability. A small amount of surfactant, defoaming agent, etc. may be mixed into the water-based developing solution. Examples of the organic solvent-based developing solution include 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, and methyl isobutyl ketone. An organic solvent such as γ-butyrolactone. In order to prevent ignition in these organic solvents, it is preferred to add water in the range of 1 to 20% by mass. After the unexposed portion is removed, the photoresist pattern can be further hardened by heating at a temperature of about 60 to 250 ° C or an exposure of about 0.2 to 10 J/cm 2 as necessary. <Manufacturing Method of Printed Circuit Board> A printed circuit board can be manufactured by etching or smearing the resist pattern type substrate formed by the above method. The etching or plating of the substrate can be performed by using the formed photoresist pattern as a mask for the conductor layer of the substrate or the like. Examples of the etching liquid for performing uranium engraving include a second copper chloride solution, a second iron chloride solution, an alkali etching solution, and a hydrogen peroxide etching solution, and in view of the fact that the etching function is good, chlorine is used. The second iron solution is preferred. -43- 201042389 As a plating method for plating, copper plating such as copper sulfate plating or copper pyrophosphate plating, mineralization such as high-flow soldering, and Watts Bath (Watts Bath) are mentioned. Nickel plating such as nickel sulfate-nickel chloride plating, nickel sulfonate, hard gold plating, soft gold plating, etc. After the etching or plating is completed, the photoresist pattern can be peeled off, for example, by an aqueous solution which is more alkaline than the alkaline aqueous solution used for development. As the aqueous solution having a strong basicity, for example, a 1 to 10% by mass aqueous sodium hydroxide solution and a 1 to 10% by mass aqueous potassium hydroxide solution can be used. Further, it is preferred to use a 1% by mass or 5% by mass aqueous sodium hydroxide solution or an aqueous potassium hydroxide solution, and it is preferred to use a 1 to 5 mass% aqueous sodium hydroxide solution or an aqueous potassium hydroxide solution. Examples of the peeling method of the resist pattern include an immersion method, a spray method, and the like, and these may be used singly or in combination. Further, the printed circuit board forming the photoresist pattern may be a multilayer printed circuit board, or may have a small-diameter through hole, or may be a printed circuit board having a high-density wiring such as a high-density package substrate and a tantalum wafer. [Embodiment] [Examples] Hereinafter, the examples will be more specifically described for the present invention. However, the present invention is not limited to the following embodiments. (A) Adhesive polymer (A-1) 15 g of methacrylic acid mixed with a polymerizable monomer (monomer), methyl propyl-44- 201042389 benzoic acid benzyl 1; 25 g, methyl methacrylate 25 g and 200 g of styrene (mass ratio 30/25/5/40) and 9.0 g of azobisisobutyronitrile were used as "solution a". A mixture of 60 g of methyl sarcolu and 40 g of toluene (mass ratio: 3:2) l〇〇g, a solution obtained by dissolving 1.2 g of azobisisobutyronitrile as "solution b", equipped with a stirrer, a reflux cooler In a flask of a gas introduction tube, a mixture of 270 g of methyl sarbuta and 180 g of toluene (mass ratio: 3:2) was placed in a flask of a gas introduction tube, and the mixture was stirred while blowing nitrogen gas into the flask. Heat up to 8 °C. The solution a in the flask was dropped over 4 hours, and then kept at 80 ° C for 2 hours while stirring. Next, the solution b was dropped from the solution in the flask over 10 minutes, and the solution in the flask was stirred while maintaining the temperature at 80 ° C for 3 hours. Further, the solution in the flask was heated to 90 ° C over 30 minutes, and kept at 90 ° C for 2 hours, and then cooled to obtain a solution of the binder polymer (A-I). The non-volatile content (solid content) of the binder polymer (A-1) was 47.8% by mass, the weight average molecular weight was 30,000, and the bismuth citrate was 196 mgKOH/g. Further, the weight average molecular weight was measured by gel permeation chromatography (GPC), and was converted using a calibration curve of standard polystyrene. The conditions for GPC are as follows. (GPC condition) Gang: Hitachi L-6000 type (manufactured by Hitachi Co., Ltd. -45- 201042389 Pipe column: 3 pieces below

Gelpack GL-R420 Gelpack GL-R430Gelpack GL-R420 Gelpack GL-R430

Gelpack GL-R440 (以上爲日立化成工業股份有限公司製，商品名）溶離液：四氫呋喃測定溫度：40°C 流量：2.05ml/分鐘檢測器：日立 L - 3 3 0 0型RI (日立股份有限公司製作所製之商品名）作爲聚合性單體’將表1所示材料使用同表所示質量 (A-2)及（A-3 ) 比以外，與得到黏合劑聚合物（A -1)之溶液的方法相同下得到黏合劑聚合物（A-2 )及（A-3 )之溶液。 f表11 單體(質量比） Mw 酸値酸値 (mgKOH/g) (A-1) 甲基丙烯酸/甲基丙烯酸苯甲酯/甲基丙烯酸甲@曰7苯乙嫌之共聚物 (30/25/5/40) _____— 30000 196 (A-2) 甲基丙烯酸/甲基丙烯酸苯甲酯/甲基芮烯酸甲酯/本乙稀之共聚物 (30/30/5/35)___ 30000 196 (A-3) 甲基丙烯酸/甲基丙烯酸甲酯/苯乙烯之共聚物 (25/50/25) _- 30000 163 -46 - 201042389 [感光性樹脂組成物的溶液之調製] 將以下表2及3所示成分，以同表所示配合量進行混合後，調製出實施例1〜1 3及比較例1〜3之感光性樹脂組成物的溶液。且表2及3所示（A)成分之配合量表示不揮發分之質量（固體成分量）。 [表2]Gelpack GL-R440 (The above is manufactured by Hitachi Chemical Co., Ltd., trade name) Solvent: Tetrahydrofuran Measurement temperature: 40 ° C Flow rate: 2.05 ml / min Detector: Hitachi L - 3 3 0 0 type RI (Hitachi shares limited The name of the product manufactured by the company is as a polymerizable monomer. The materials shown in Table 1 are used in the same manner as the masses shown in the table (A-2) and (A-3), and the binder polymer (A -1) is obtained. A solution of the binder polymers (A-2) and (A-3) was obtained in the same manner as the solution. f Table 11 Monomer (mass ratio) Mw Barium bismuth citrate (mgKOH/g) (A-1) Methacrylic acid / benzyl methacrylate / methacrylate A@曰7 phenylethyl copolymer (30 /25/5/40) _____— 30000 196 (A-2) methacrylic acid/benzyl methacrylate/methyl methyl decenoate/ethylene copolymer (30/30/5/35) ___ 30000 196 (A-3) Copolymer of methacrylic acid/methyl methacrylate/styrene (25/50/25) _- 30000 163 -46 - 201042389 [Preparation of solution of photosensitive resin composition] The components shown in the following Tables 2 and 3 were mixed in the amounts shown in the same table, and a solution of the photosensitive resin compositions of Examples 1 to 13 and Comparative Examples 1 to 3 was prepared. Further, the blending amount of the component (A) shown in Tables 2 and 3 indicates the mass of the nonvolatile matter (solid content). [Table 2]

成分實施例 1 2 3 4 5 6 7 8 9 (A) (A-1) 50 - 50 50 50 50 50 50 50 (A-2) - 50 - - - - - - - (A-3) - (B) M-114 5 5 5 5 5 5 - - — FA-MECH - - - - - — 5 5 5 FA-321M 15 15 15 15 15 15 15 15 15 BPE-100 15 15 15 15 15 15 15 15 15 TMPT21 15 15 15 15 - - - - - FA-024M - - - - 15 15 15 15 15 CC) B-CIM 3.7 3.7 3.7 37 3.7 3.7 3.7 3.7 3.7 (D) (D-1) 0.15 0.15 — - - - - - - (D-2) - - 0.15 - - 一 - — - (D-3) - - - 0.15 - - — - — (D-4) - - - 1.2 - - - - (D-5) - - - - - 1.2 - - 一 (D-6) - - - - - — 0.3 一 - (D-7) - - - - - - - 0.15 - (D-8) 0.5 (D-9) - - - - - - - — - (E) LCV 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 025 染料 MKG 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 溶劑丙_ 9 9 9 9 9 9 9 9 9 甲苯 5 5 5 5 5 5 5 5 5 甲醇 5 5 5 5 5 5 5 5 5 -47- 201042389 [表3] 成分資施例 tfcKM 10 11 12 13 14 1 2 3 (A) (A-1) 50 50 50 50 50 - 50 - (A—2) 一 — — - - - 50 (A-3) - - - - - 50 — - (B) M-114 - — 一一 5 - - FA-MECH 5 5 5 5 5 - - - FA-321M 15 15 30 30 - 15 15 15 ΒΡΕ-100 15 15 - 一 - 15 25 25 ΤΜΡΤ21 - 15 15 - 15 15 — - FA-024M 15 一 — 15 30 - 10 10 (C) B—CIM 3.7 3.7 3.7 3.7 3.7 3.7 3.7 3.7 (D) (D-1) - 0.15 0.15 0.15 0.15 0.15 0.15 0.15 (D-2) - 一 — 一 - - - - (D—3) - 一 - - - - — - (D-4) - 一 - - - — - (D—5) - - 一 — - - - - (D-6) - — 一 — - - - - (D-7) - - — — - - - - (D-8) - 一一一 - - - - (D-9) 0.25 - 一一 - - ~ - (E) LCV 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 染料 MKG 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 溶劑哪 9 9 9 9 9 9 9 9 甲苯 5 5 5 5 5 5 5 5 甲酵 5 5 5 5 5 5 5 5 對於上述表所示各成分之詳細內容，如以下所示。 (B )光聚合性化合物 TMPT2 1 (日立化成工業股份有限公司製，商品名） ·‘ EO改性三羥甲基丙烷三丙烯酸酯（一般式（1)中， RLRkR、甲基、a + b + c = 21 (平均値）的化合物） FA-32 1M (日立化成工業股份有限公司製，商品名） :2,2-雙（4-(甲基丙烯氧基五乙氧基）苯基）丙烷 FA-〇24M (日立化成工業股份有限公司製，商品名） :—般式（6)中，R=甲基、m3 = 6(平均値）、n2 + n3=12 (平均値）之化合物 M-114(東亞合成股份有限公司製，商品名）：4 -正壬基苯氧八乙二醇丙烯酸酯 -48- 201042389 ΒΡΕ-1 00 (新中村化學工業股份有限公司製，商品名 ):ΕΟ改性雙酚Α系二甲基丙烯酸酯（氧伸乙基之重複總數爲2_6) FA-MECH (日立化成工業股份有限公司製，商品名） :(2_羥基-3-氯）丙基-2-甲基丙烯醯氧基乙基苯二甲酸酯 (C )光聚合啓始劑 B-CIM ( Hampford公司製，商品名）：2,2，_雙（2_氯苯基）-4,4’，5,5’-四苯基雙咪哗 (D )敏化色素 (D-l) : 1-苯基-3- ( 4-tert-丁基苯乙烯基）-5- ( 4-tert-丁基苯基）吡唑啉 (D-2):卜苯基-3- ( 4-甲氧基苯乙烯基）_5_ ( 4_甲氧基苯基）耻唑啉 (D-3) : 1-苯基-3- ( 4-異丙基苯乙烯基）_5_ ( 4_異丙基苯基）吡唑啉 (D-4) : 1,3-二苯基-5- (4 -異丙基苯基）吡唑啉 (D-5) : 1-苯基-3- (4-甲氧基苯基）_5- ( 4-tert-丁基苯基）吡唑啉 (D-6) : 1-苯基-3- (2-噻吩基）-5- ( 4-tert-丁基苯基）吡唑啉 (D-7) : 1-苯基-3- ( 2-噻吩基）乙烯基_5_ ( 2_噻吩 -49 - 201042389 基）吡唑啉 (D-8):卜苯基- 3-(2-噻吩基）-5-(2-噻吩基）吡 U坐啉 (D-9) : 1-苯基-3-(2-噻吩基）-5-苯乙烯基吡唑啉 (以上爲日本化學工業所股份有限公司製） (E )胺系化合物 LCV (山田化學股份有限公司製，商品名）：還原型結晶紫 (染料） MKG (大阪有機化學工業股份有限公司製，商品名） :孔雀石綠 [感光性元件] 將上述實施例及比較例之感光性樹脂組成物的溶液各均勻塗佈於厚度16μιη之聚乙烯對苯二甲酸酯薄膜（帝人股份有限公司製，商品名「HTF-01」）上，在70°C及1 10°C 之熱風對流式乾燥器進行乾燥’形成乾燥後膜厚爲25 μπι之感光性樹脂組成物層。於該感光性樹脂組成物層上貼合保護薄膜（Tamapoly股份有限公司製，商品名「NF-15」），得到以聚乙烯對苯二甲酸酯薄膜（支持薄膜）、感光性樹脂組成物層、與保護薄膜之順序下層合之感光性元件。 -50- 201042389 [層合基板] 將由玻璃環氧材、與於該兩面所形成之銅箱（厚度 35 μιη)所成之貼銅層合板（日立化成工業股份有限公司製，商品名「MCL-E-67」）的銅表面’使用具有相當之刷子的硏磨機（三啓股份有限公司製）進行硏磨’水洗後下空氣流使其乾燥。將該貼銅層合板（以下稱爲「基板」）進行加熱而昇溫至8 0 °C後’將有關實施例1〜1 4及比 Ο 較例1〜3之感光性元件，層合於基板之銅表面。層合爲一邊除去保護薄膜，一邊使各感光性元件的感光性樹脂組成物層可與基板的銅表面呈密著’於溫度l2〇°C，laminate壓力4 kgf/cm2之條件下進行。如此得到於基板的銅表面上層合感光性樹脂組成物層及聚乙烯對苯二甲酸酯薄膜之層合基板。 [感度之評估] 放置冷卻所得之層合基板，成爲23 °C之時間點時，於層合基板之聚乙烯對苯二甲酸酯薄膜上密著具有濃度區域 0.00〜2.00、濃度梯度0.05、板子尺寸20mmxl87mm、各梯度之尺寸爲3mm X. 12mm之41段梯度板的曝光用具（ Phototool )。使用波長405nm之青紫色雷射二極管作爲光源的直描曝光機（Hitachi Via Mechanics製，商品名「DE-1AH」、），在70m J/cm2能量（曝光量）介著曝光用具（ Phototool )及聚乙烯對苯二甲酸酯薄膜對感光性樹脂組成物層進行曝光。且照度之測定使用適用405nm對應探針的 -51 - 201042389 紫外線照度計（Ushio電機股份有限公司製，商品名「 UIT-1 50」）進行。曝光後自層合基板剝離聚乙烯對苯二甲酸酯薄膜，露出感光性樹脂組成物層，將1質量％碳酸鈉水溶液在30°C藉由24秒噴霧使未曝光部分除去。如此於基板的銅表面上形成感光性樹脂組成物之硬化物所成的硬化膜。藉由測定作爲硬化膜所得之梯度板的殘存段數，評估感光性樹脂組成物之感度。感度係由梯度板之段數顯示，該段數越高表示感度越良好。結果如表5及6所示。 [解像性及密著性之評估] 使用線寬（L ) /間距寬（S )(以下稱爲「L/S」）爲 5/5〜3 0/30 (單位：μιη)之描畫圖型，以41段梯度板之殘存段數成爲11段的能量對於前述層合基板之感光性樹脂組成物層進行曝光（描畫）。曝光後進行與前述感度之評估相同的顯像處理。顯像後間距部分（未曝光部分）乾淨地被除去，且線部分（曝光部分）無產生蛇行或欠缺下所形成的光阻圖型中，由最小線寬/間距寬之値評估解像性·密著性。該數値越小，表示解像性及密著性同時越良好。結果如表5及6 所示。 [光阻形狀之評估] 對於上述解像性·密著性之評估，將所得之光阻形狀 -52- 201042389 (光阻圖型的截面形狀）使用日立掃描型電 500A進行觀察。結果如表5及6所示。光阻形狀爲台形或逆台形時’或具有光阻有著於藉由其後蝕刻處理或鍍敷處理所形成的生短路或斷線的傾向。因此’光阻形狀爲矩形，且並無光阻之袖擺’亦未存在顯像殘渣者爲光阻形狀良好時爲「矩形」’於光阻圖型觀察 ❹ 「袖擺」，觀察到顯像殘渣時「顯像殘渣」。其中，圖2爲使用於說明光阻圖型中之「模式截面圖。如圖2所示’所謂「袖擺」爲，圖型之截面形狀時，於基板12的銅箔13之表面顯像後光阻圖型1 4並非矩形，於間距部分（未具有如袖擺之形狀。又，圖3爲使用於說明光「顯像殘渣」時的模式截面圖。所謂「顯像殘察光阻圖型的截面形狀時，顯像後的光阻圖型〇，袖擺爲顯著，於間距部分殘留顯像殘渣1 5而狀態。 [剝離特性的評估] 將各感光性元件層合於前述貼銅層合板（藉由在表4所示條件下進行曝光及顯像，製造成硬化膜之試驗片（40mmx50mm)。將該試驗 2 5 °C )放置一晚後，在如表4所示條件下進行拌開始，至硬化膜自基板完全剝離除去的時間子顯微鏡S- 之袖擺時，電路容易產 (長方形）佳。於此，到袖擺者爲袖擺」時的觀察到光阻上所形成的曝光部分）阻圖型中之渣」爲，觀 14並非矩形埋於線間之基板）上，出基板上形片在室溫（剝離。自攪作爲剝離時 -53- 201042389 間。又，剝離後的剝離片尺寸以目視觀察，藉由以下基準進行評估。剝離時間越短，剝離片尺寸越少者剝離特性越表示良好。且，剝離片尺寸爲薄片狀匙時以「L」表示， 30-40mm角時以「M」表示，比30mm角還小時以「S」表示。結果如表5及6所示。 [表4] 製程條件曝光暴光機:Hitachi Vie Mechanics製、直描曝光機「DE-1AH」 (405nm之青紫色雷射二極管作爲光源）暴光量:70 mJ/cm2 顯像顯像液:1質量％Na2C03水溶液液溫:30。。噴霧式剝離剝離液:3質量％ NaOH水溶液液溫:50〇C 有施行浸漬攪拌 [表5] 實施例 1 2 3 4 5 6 7 8 9 感度(段數Γ 11 11 11 11 11 11 11 11 11 解像性·密著性 (um) 8 8 8 8 8 8 10 10 10 剝離時間(秒） 65 61 66 65 65 67 68 67 66 剝離片尺寸 S S S S S S S S S 一^5狀矩形矩形矩形矩形矩形矩形矩形矩形矩形 -54- 201042389 [表6] 實施例比較例 10 11 12 13 14 1 2 3 感度(段數Γ 11 11 11 11 11 11 11 11 解像性•密著性 (/zm) 10 8 10 10 10 16 14 14 剝離時間(秒） 66 65 72 70 70 55 102 97 剝離片尺寸 S S S S S S Μ Μ 光阻形狀矩形矩形矩形矩形矩形袖擺顯像殘渣顯像殘渣 *1…曝光量70 mJ/cm2中之階段數〇由表5及6可得知，實施例1〜1 4的感光性樹脂組成物爲感度、解像性、密著性、光阻形狀及硬化後之剝離特性皆良好者。另一方面，於黏合劑聚合物中不使用（甲基）丙烯酸苯甲酯的比較例1、作爲光聚合性化合物未使用於分子內具有1個乙烯性不飽和鍵之光聚合性化合物的比較例2、3，其與實施例相比，解像性、密著性、光阻形狀、剝離片尺寸皆較差。〇產業上可利用性本發明的感光性樹脂組成物可適用作爲使用於形成製造印刷電路板時的光阻圖型的材料。特別上述感光性樹脂組成物的感度、解像性、密著性、光阻形狀及硬化後之剝離特性皆良好，故亦適用於製造具有高密度封裝基板等經細線化•高密度化的配線的印刷電路板時的光阻圖型形成上。 -55- 201042389 【圖式簡單說明】 [圖1 ]表示本發明之感光性元件的較佳一實施形態的模式截面圖。 [圖2]表示使用於說明光阻圖型中之「袖擺」之模式截面圖。 [圖3 ]表示使用於說明光阻圖型中之「顯像殘渣」的模式截面圖。【主要元件符號說明】 1 :感光性元件 2 :支持薄膜 3 :感光性樹脂組成物層 4 :保護薄膜 12 :基板 13 :銅箔 1 4 :光阻圖型 1 5 :顯像殘渣 -56 -Ingredient Example 1 2 3 4 5 6 7 8 9 (A) (A-1) 50 - 50 50 50 50 50 50 50 (A-2) - 50 - - - - - - - (A-3) - ( B) M-114 5 5 5 5 5 5 - - - FA-MECH - - - - - - 5 5 5 FA-321M 15 15 15 15 15 15 15 15 15 BPE-100 15 15 15 15 15 15 15 15 15 TMPT21 15 15 15 15 - - - - - FA-024M - - - - 15 15 15 15 15 CC) B-CIM 3.7 3.7 3.7 37 3.7 3.7 3.7 3.7 3.7 (D) (D-1) 0.15 0.15 — - - - - - - (D-2) - - 0.15 - - One - - - (D-3) - - - 0.15 - - - - - (D-4) - - - 1.2 - - - - (D-5) - - - - - 1.2 - - One (D-6) - - - - - - 0.3 One - (D-7) - - - - - - - 0.15 - (D-8) 0.5 (D-9) - - - - - - - - - - (E) LCV 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 025 Dye MKG 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 Solvent C - 9 9 9 9 9 9 9 9 9 Toluene 5 5 5 5 5 5 5 5 5 Methanol 5 5 5 5 5 5 5 5 5 -47- 201042389 [Table 3] Component Example tfcKM 10 11 12 13 14 1 2 3 (A) (A-1) 50 50 50 50 50 - 50 - ( A-2) A — — — — — 50 (A-3) - - - - - 50 — - (B) M-114 - — 一一5 - - FA-MECH 5 5 5 5 5 - - - FA-321M 15 15 30 30 - 15 15 15 ΒΡΕ-100 15 15 - One - 15 25 25 ΤΜΡΤ21 - 15 15 - 15 15 — - FA-024M 15 One - 15 30 - 10 10 (C) B-CIM 3.7 3.7 3.7 3.7 3.7 3.7 3.7 3.7 (D) (D-1) - 0.15 0.15 0.15 0.15 0.15 0.15 0.15 (D-2) - One - one - - - - (D-3 ) - 一 - - - - - - - (D-4) - 一 - - - - - (D-5) - - 一 - - - - - (D-6) - - 一 - - - - - (D- 7) - - - - - - - - (D-8) - One-to-one - - - - (D-9) 0.25 - One-one - - ~ - (E) LCV 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 Dye MKG 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 Solvent 9 9 9 9 9 9 9 9 Toluene 5 5 5 5 5 5 5 5 Azide 5 5 5 5 5 5 5 5 For the details of each component shown in the above table, such as the following Shown. (B) Photopolymerizable compound TMPT2 1 (manufactured by Hitachi Chemical Co., Ltd., trade name) · 'EO-modified trimethylolpropane triacrylate (in general formula (1), RLRkR, methyl group, a + b + c = 21 (average 値) compound) FA-32 1M (manufactured by Hitachi Chemical Co., Ltd., trade name): 2,2-bis(4-(methacryloxypentaethoxy)phenyl) Propane FA-〇24M (manufactured by Hitachi Chemical Co., Ltd., trade name): In the general formula (6), R = methyl, m3 = 6 (average 値), n2 + n3 = 12 (average 値) M-114 (manufactured by Toagosei Co., Ltd., trade name): 4-n-decylphenoxy octaethylene glycol acrylate-48- 201042389 ΒΡΕ-1 00 (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name): ΕΟModified bisphenol oxime dimethacrylate (repeated total number of oxygen extended ethyl groups is 2_6) FA-MECH (manufactured by Hitachi Chemical Co., Ltd., trade name): (2-hydroxy-3-chloro)propyl -2-Methyl propylene oxirane ethyl phthalate (C) photopolymerization initiator B-CIM (manufactured by Hampford Co., Ltd., trade name): 2, 2, _ bis (2- chlorobenzene) -4,4',5,5'-tetraphenyl bismuth (D) sensitizing dye (Dl) : 1-phenyl-3-(4-tert-butylstyryl)-5- ( 4-tert-butylphenyl)pyrazoline (D-2): phenyl-3-(4-methoxystyryl)_5_(4-methoxyphenyl)azozoline (D- 3) : 1-phenyl-3-(4-isopropylstyryl)_5_(4-isopropylphenyl)pyrazoline (D-4) : 1,3-diphenyl-5- ( 4-isopropylphenyl)pyrazoline (D-5) : 1-phenyl-3-(4-methoxyphenyl)_5-(4-tert-butylphenyl)pyrazoline (D -6) : 1-phenyl-3-(2-thienyl)-5-(4-tert-butylphenyl)pyrazoline (D-7) : 1-phenyl-3-(2-thiophene Vinyl _5_( 2_thiophene-49 - 201042389 yl)pyrazoline (D-8): phenyl 3-(2-thienyl)-5-(2-thienyl)pyrrole (D-9) : 1-phenyl-3-(2-thienyl)-5-styrylpyrazoline (manufactured by Nippon Chemical Industry Co., Ltd.) (E) Amine compound LCV (Yamada Chemical Co., Ltd.) Co., Ltd., product name): Reduced crystal violet (dye) MKG (made by Osaka Organic Chemical Industry Co., Ltd., trade name): Malachite green [photosensitive element] Each of the solutions of the photosensitive resin compositions of the above examples and the comparative examples was uniformly applied to a polyethylene terephthalate film (manufactured by Teijin Co., Ltd., trade name "HTF-01") having a thickness of 16 μm. The hot air convection dryer at 70 ° C and 1 10 ° C was dried to form a photosensitive resin composition layer having a film thickness of 25 μm after drying. A protective film (trade name "NF-15", manufactured by Tamapoly Co., Ltd.) was bonded to the photosensitive resin composition layer to obtain a polyethylene terephthalate film (support film) and a photosensitive resin composition. A layer, a photosensitive element laminated under the order of the protective film. -50- 201042389 [Laminated substrate] A copper-clad laminate made of a glass epoxy material and a copper box (thickness 35 μm) formed on both sides (manufactured by Hitachi Chemical Co., Ltd., trade name "MCL- The copper surface of E-67") was honed by a honing machine (manufactured by Sanke Co., Ltd.) having a comparable brush. After washing, the air stream was dried and dried. After the copper-clad laminate (hereinafter referred to as "substrate") was heated and heated to 80 ° C, the photosensitive elements of Examples 1 to 14 and Comparative Examples 1 to 3 were laminated on the substrate. The copper surface. The protective film is removed by laminating, and the photosensitive resin composition layer of each photosensitive element can be adhered to the copper surface of the substrate at a temperature of 1 〇 ° C and a laminate pressure of 4 kgf / cm 2 . Thus, a laminated substrate of a photosensitive resin composition layer and a polyethylene terephthalate film was laminated on the copper surface of the substrate. [Evaluation of Sensitivity] When the laminated substrate obtained by cooling is placed at a time point of 23 ° C, the polyethylene terephthalate film on the laminated substrate is adhered to a concentration region of 0.00 to 2.00, a concentration gradient of 0.05, The exposure tool (Phototool) of the 41-segment gradient plate with a plate size of 20 mm x l87 mm and a gradient of 3 mm X. 12 mm. A direct exposure machine (manufactured by Hitachi Via Mechanics, trade name "DE-1AH") using a blue-violet laser diode having a wavelength of 405 nm as a light source, and an exposure tool (Phototool) at 70 m J/cm 2 of energy (exposure amount) The polyethylene terephthalate film is exposed to the photosensitive resin composition layer. The illuminance was measured using a -51 - 201042389 ultraviolet illuminometer (manufactured by Ushio Electric Co., Ltd., trade name "UIT-1 50") using a 405 nm corresponding probe. After the exposure, the polyethylene terephthalate film was peeled off from the laminated substrate, and the photosensitive resin composition layer was exposed, and the unexposed portion was removed by spraying a 1% by mass aqueous sodium carbonate solution at 30 ° C for 24 seconds. Thus, a cured film of a cured product of the photosensitive resin composition is formed on the copper surface of the substrate. The sensitivity of the photosensitive resin composition was evaluated by measuring the number of remaining portions of the gradient plate obtained as the cured film. The sensitivity is shown by the number of segments of the gradient plate, and the higher the number of segments, the better the sensitivity. The results are shown in Tables 5 and 6. [Evaluation of Resolution and Adhesion] Drawings with line width (L) / pitch width (S) (hereinafter referred to as "L/S") of 5/5 to 3 0/30 (unit: μιη) In the type, the number of remaining segments of the 41-stage gradient plate is 11 segments of energy, and the photosensitive resin composition layer of the laminated substrate is exposed (drawn). After the exposure, the same development processing as the evaluation of the aforementioned sensitivity is performed. After the development, the pitch portion (unexposed portion) is cleanly removed, and the line portion (exposed portion) is free from the occurrence of a meandering or under-formed photoresist pattern, and the resolution is evaluated by the minimum line width/space width. · Adhesiveness. The smaller the number, the better the resolution and the adhesion. The results are shown in Tables 5 and 6. [Evaluation of the shape of the photoresist] The evaluation of the above-mentioned resolution and adhesion was carried out by observing the obtained resist shape -52 - 201042389 (cross-sectional shape of the resist pattern) using Hitachi-scan type electric 500A. The results are shown in Tables 5 and 6. When the photoresist shape is a mesa shape or a counter-top shape, or has a photoresist, there is a tendency for a short circuit or a disconnection due to a subsequent etching treatment or a plating treatment. Therefore, 'the shape of the photoresist is rectangular, and there is no light-resistance of the sleeves'. If there is no developer residue, the shape of the photoresist is "rectangular" and it is observed in the photoresist pattern. Like the "residue residue" when it is residue. 2 is a schematic cross-sectional view for explaining the pattern of the photoresist pattern. As shown in FIG. 2, the so-called "sleeve swing" is a cross-sectional shape of the pattern, and is imaged on the surface of the copper foil 13 of the substrate 12. The rear photoresist pattern 14 is not rectangular, but is in a pitch portion (not having a shape such as a sleeve swing. Moreover, Fig. 3 is a schematic cross-sectional view for explaining the "developing residue" of light. The so-called "development remnant photoresist" In the cross-sectional shape of the pattern, the pattern of the photoresist pattern after development is remarkable, and the sleeve is in a state of being left in the gap portion. [Evaluation of Peeling Characteristics] Each photosensitive element is laminated on the above-mentioned sticker. Copper laminate (a test piece (40 mm x 50 mm) which was formed into a cured film by exposure and development under the conditions shown in Table 4, and the test was carried out at 25 ° C for one night, and the conditions shown in Table 4 were as shown in Table 4. When the mixing starts, the time when the hardened film is completely peeled off from the substrate, the sub-microscope S- sleeve swings, the circuit is easy to produce (rectangular). Here, when the sleeve is placed on the sleeve, the photoresist is observed. The exposed portion of the formed pattern is the slag in the pattern, and the view 14 is not a moment. The substrate on the substrate was placed at room temperature (peeling. Self-stirring was performed as peeling -53-201042389. Further, the peeling sheet size after peeling was visually observed and evaluated by the following criteria. The shorter the peeling time is, the smaller the peeling sheet size is, the better the peeling property is. The peeling sheet size is represented by "L" when the sheet size is a sheet-shaped spoon, and the "M" is indicated at an angle of 30-40 mm, and is smaller than the angle of 30 mm. The results are shown in Tables 5 and 6. [Table 4] Process conditions Exposure exposure machine: Hitachi Vie Mechanics, direct-drawing exposure machine "DE-1AH" (405-nm blue-violet laser diode as a light source) Amount: 70 mJ/cm2 Development imaging liquid: 1% by mass Na2C03 aqueous solution liquid temperature: 30. Spray-type peeling liquid: 3 mass% NaOH aqueous solution liquid temperature: 50 〇C immersion stirring was performed [Table 5] Example 1 2 3 4 5 6 7 8 9 Sensitivity (number of segments Γ 11 11 11 11 11 11 11 11 11 Resolution/adhesiveness (um) 8 8 8 8 8 8 10 10 10 Peeling time (seconds) 65 61 66 65 65 67 68 67 66 Peeling sheet size SSSSSSSSS A ^5-shaped rectangular rectangular rectangle Rectangular Rectangular Rectangular Rectangular-54- 201042389 [Table 6] Example Comparative Example 10 11 12 13 14 1 2 3 Sensitivity (number of segments Γ 11 11 11 11 11 11 11 11 Resolution • Adhesion (/zm) 10 8 10 10 10 16 14 14 Peeling time (seconds) 66 65 72 70 70 55 102 97 Peeling piece size SSSSSS Μ Μ Resistor shape Rectangular rectangular Rectangular rectangular Rectangular sleeve pendulum image Residue residue*1...Exposure 70 mJ/ The number of stages in cm2 is shown in Tables 5 and 6. The photosensitive resin compositions of Examples 1 to 14 are excellent in sensitivity, resolution, adhesion, resist shape, and peeling properties after hardening. . On the other hand, Comparative Example 1 in which benzyl (meth)acrylate is not used in the binder polymer, and comparison of a photopolymerizable compound having no ethylenic unsaturated bond in the molecule as a photopolymerizable compound Examples 2 and 3 have poor resolution, adhesion, photoresist shape, and peeling sheet size as compared with the examples. INDUSTRIAL APPLICABILITY The photosensitive resin composition of the present invention can be suitably used as a material for forming a resist pattern when manufacturing a printed circuit board. In particular, since the photosensitive resin composition is excellent in sensitivity, resolution, adhesion, photoresist shape, and peeling property after curing, it is also suitable for producing a thinned and high-density wiring having a high-density package substrate. The photoresist pattern is formed on the printed circuit board. -55-201042389 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a preferred embodiment of a photosensitive element of the present invention. Fig. 2 is a schematic cross-sectional view showing the "sleeve" used in the description of the photoresist pattern. Fig. 3 is a schematic cross-sectional view showing a "developing residue" used in the description of the photoresist pattern. [Explanation of main component symbols] 1 : Photosensitive element 2 : Support film 3 : Photosensitive resin composition layer 4 : Protective film 12 : Substrate 13 : Copper foil 1 4 : Photoresist pattern 1 5 : Development residue -56 -

Claims

201042389 VII. Patent application scope: 1_ A photosensitive resin composition which is a photosensitive resin composition containing (A) compound, (B) photopolymerizable compound, (C) photopolymerization start sensitizing dye , characterized in that the above mixture polymer is a (meth)acrylic acid-based knot; and a structural unit based on benzyl (meth)acrylate or benzene (meth)acrylate, the aforementioned (B) The photopolymerizable compound contains a compound having one ethylene 1 bond, and the (D) sensitizing dye contains the following general formula (1): i (mixture) and (D (A) viscosity, unit, ester derivative: unsaturated : compound

In the formula (1), R1 and r2 each independently represent a substituted or unsubstituted phenylphenyl group or a furyl group, and r3 represents an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms or an alkyl group having 1 to 10 carbon atoms. The base groups ' & and 15 each independently represent a 〇' number, and m represents an integer of 0 to 5' m represents 2 to 5 'the plural may exist to be different or the same]. 2. The photosensitive resin composition according to the first aspect of the invention, wherein the (B) photopolymerizable compound contains a compound represented by the following general formula (3): 2 of the whole R3, where (2) or -57- (2) 201042389 [Chemical 2] ~ (ό〇2Η4·)^—Ο—C—C=CH2

o-CH2CH——R5 I OH [In the formula (2), R4 represents a hydrogen atom or a methyl group] R5 represents a hydrogen atom, a methyl group or a halogenated methyl group, and R6 represents an alkyl group having 1 to 6 carbon atoms and a carbon number of 1 to 6 6 alkoxy, sulfhydryl or halogen atom, p represents an integer of 1 to 4, η represents an integer of 〇~4, and η represents 2 to 4, and the plural R6 may be the same or different]; ]

OC2H4);

[In the formula (3), 'R7 represents a hydrogen atom or a methyl group' R8 represents an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, a hydroxyl group or a halogen atom, and r represents an integer of 1 to 12'k An integer representing 〇~5, where k is 2 to 5, and R 8 in the plural may be the same or different]. 3. The photosensitive resin composition of the first or second aspect of the invention, wherein the (B) photopolymerizable compound further contains a bisphenol a-based di(meth)acrylate compound. 4. The photosensitive resin composition of any one of the above-mentioned (B) photopolymerizable compounds further comprising (poly)oxyethylidene or (poly)oxy A propyl chain trimethylolpropane tri(meth) acrylate compound. 5. The photosensitive tree-58-201042389 lipid composition according to any one of claims 1 to 4, wherein the (B) photopolymerizable compound further contains (poly)oxyethylidene chain And (poly)oxyl propyl chain polyalkylene glycol di(meth) acrylate. 6. The photosensitive resin composition of any one of claims 1 to 5 wherein the (A) binder polymer further has a structural unit based on an alkyl (meth)acrylate. . 7. The photosensitive dendritic composition of any one of claims 1 to 6, wherein the (A) binder polymer is further based on a styrene or styrene derivative. Structural unit. 8. The photosensitive resin composition according to any one of claims 1 to 7, wherein the (A) binder polymer has a strontium of from 1 250 to 250 mgKOH/g. The photosensitive resin composition according to any one of claims 1 to 8, wherein the (A) binder polymer has a weight average molecular weight of from 1,000,000 to 100,000 ° 〇W 1 〇. The photosensitive resin composition according to any one of the items 1 to 9, further comprising (E) an amine compound. A photosensitive element comprising a support film and a photosensitive resin formed from the photosensitive resin composition according to any one of claims 1 to 10, which is formed on the support film. Composition layer. A method for forming a photosensitive resist pattern comprising a photosensitive resin composition obtained by the photosensitive resin composition according to any one of claims 1 to 10, wherein the photosensitive resin composition layer is formed by laminating a laminating step on a substrate, -59-201042389, exposing the active light to a predetermined portion of the photosensitive resin composition layer, exposing and hardening the predetermined portion, and forming the photosensitive resin composition A portion other than the predetermined portion of the layer is removed from the substrate, and a development step of a resist pattern formed of a cured product of the photosensitive resin composition is formed on the substrate. 13. The method for forming a photoresist pattern according to claim 12, wherein the wavelength of the active light is in the range of 390 to 420 nm. A method of manufacturing a printed circuit board, comprising the step of etching or plating a substrate on which a photoresist pattern is formed by the method of claim 12 or claim 13. -60 -