TW201040226A - Resin composition - Google Patents

Abstract

[Issue] A resin composition is provided for forming a resin of an insulating layer of multilayered printed circuit boards to have excellent adherence with the conducting layer after an environmental test is accelerated. [Solution means] A resin composition for multilayered printed circuit boards comprises: (A) cyanate resin, (B) epoxy resin, (C) thermoplastic resin, (D) talc, and (E) silica. When the non-volatile constituent in the resin composition is 100 percent by mass, the total content of the constituent (D) and the constituent (E) is 35 percent by mass to 60 percent by mass, and the content of the constituent (D) as talc is 5 percent by mass to 20 percent by mass.

Description

[Technical Field] The present invention relates to a resin composition suitable for formation of an insulating layer such as a multilayer printed wiring board. [Prior Art] In recent years, with the miniaturization and high performance of electronic equipment, multi-layer printing and eight-wire boards have pursued the miniaturization of conductor wiring in order to increase the mounting density of electronic components. As the resin composition used for the insulating layer of the multilayer printed wiring board, for example, a resin composition containing an epoxy resin and a cyanate resin as a curing agent thereof is known to form an insulating layer excellent in dielectric properties. In addition, since the multilayer printed wiring board having a high density of wiring has a problem that cracking easily occurs due to the difference in thermal expansion coefficient between the conductor layer and the insulating layer, it is required to suppress the thermal expansion coefficient of the insulating layer to be low. The addition of an inorganic filler to a resin composition is a common means for lowering the coefficient of thermal expansion. As an inorganic filler, in particular, cerium oxide having high physical strength, high hardness, and excellent hot water resistance is generally used. For example, Patent Documents 1 and 2 disclose a resin composition containing an epoxy resin, a cyanate resin, or ruthenium dioxide. [Provisional Technical Documents] [Patent Document 1] [Patent Document 1] International Publication No. 2003/0 99952 [Patent Document 2] International Publication No. 2008/044766 [Invention Summary] -5-201040226 [Problems to be Solved by the Invention] On the other hand, the present inventors laminate a resin composition containing an epoxy resin and a cyanate ester ceria on a circuit board, and perform an environmental test on the insulating layer formed by hardening the tree under high temperature and high humidity. The peel strength between the hair layer and the insulating layer is remarkably lowered. According to the present invention, in order to provide a resin composition suitable for the formation of an insulating layer of a printed wiring board, it is possible to produce a circuit substrate by using the resin composition, and it is possible to maintain a resin composition in which the adhesion between the insulating layer and the insulating layer is maintained. [Means for Solving the Problems] The present inventors have found that when talc is blended in a resin containing an epoxy resin and a cyanate resin, the adhesion between the layer and the insulating layer after the accelerated environmental test can be stably maintained. On the other hand, it has been found that in order to maintain the sufficiency and reduce the thermal expansion coefficient of the insulating layer, the amount of talc is too large, and the melt viscosity of the structure is too high to be suitable for lamination. The inventors have found that the result of the re-inspection is found in a composition containing an epoxy resin, a cyanate resin, and a thermoplastic resin resin, and a conductor layer is formed by using a certain proportion of the inorganic filler material and the cerium oxide. The present invention has been completed by a good insulating layer having a good balance of adhesion and low thermal expansion coefficient. That is, the present invention includes the following. A resin composition comprising (A) a cyanate resin epoxy resin, (C) a thermoplastic resin, (d) talc, and (E) a resin composition for a printed wiring board, characterized in that When the resin composition has a hair content of 100% by mass, (1) component (D) talc and component (E) dioxane, lipid group, lipid group, body layer, lipid group conductor, dense grease, talc, layer (B) The total content of the product of 201040226 is 35 mass% to 60 mass%, and the content of the component (d) talc is 5 mass% to 20 mass%. 2. A resin composition comprising a resin comprising (A) a cyanate resin, (B) an epoxy resin, (C) a thermoplastic resin, (D) talc, and (E) cerium oxide. And the content of the (1) component (D) talc and the component (E) silica dioxide in the total amount of the resin composition is 45% by mass to 60% by mass, and 2) The content of the component (D) talc is 5% by mass to 20% by mass. 3. The resin composition of 1 or 2 wherein the average particle diameter of the component (〇) talc is 1. 3 μm or less. 4. A resin composition according to 1 or 2, wherein the component (c) thermoplastic resin is a phenoxy resin, a polyamidene resin, a polyamidimide resin, a polyether phthalimide resin, a polyfluorene resin. One or more resins selected from polyether maple resin, polyphenylene ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin 'polyacetal resin, and polybutyral resin. 5. A resin composition according to 1 or 2, wherein the component (C) thermoplastic resin is a phenoxy resin. 6. The resin composition according to any one of items 1 to 3, wherein the component (d) talc and the component (cerium) cerium oxide are previously subjected to surface treatment. 7. The resin composition according to any one of items 1 to 6, wherein the coefficient of thermal expansion is 44 ppm or less, and the adhesion retention ratio before and after the environmental test is 40% or more. 8. The resin composition according to any one of items 1 to 7, which is for interlayer insulation of a multilayer printed wiring board. 201040226 9. An adhesive film comprising a resin composition of any one of the features 1 to 8 formed on the upper layer of the support film. A prepreg characterized in that the resin composition of any one of the features 1 to 8 is impregnated with a flaky reinforcing substrate made of fibers. 1 1 ' A printed wiring board characterized by comprising an insulating layer containing a cured product of a resin composition of any one of 1 to 8 and a conductor layer formed on the insulating layer. [Effect of the Invention] According to the present invention, there is provided a resin composition suitable for forming an insulating layer of a circuit board such as a multilayer printed wiring board, and having excellent lamination property, and forming an insulating layer after hardening, even after an environment test under high temperature and high humidity, the conductor A resin composition in which the adhesion between the layer and the insulating layer is sufficient and the thermal expansion coefficient is also excellent. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail. [Talc, cerium oxide] The talc used in the present invention is not particularly limited, and various talc can be used, and calcined talc can also be used. The upper limit of the average particle size of talc is preferably 5 μ m from the viewpoint of fine wiring and insulation reliability, 4 μ m is better, 3 μ m is better, 2·5 μm is better, and 1.8 μm is particularly good, 1 · 3μιη is especially good. Further, the lower limit of the average particle diameter of the talc is preferably 0.1 μηι, -8-201040226 0.2 μιη, and 0.3 μπι, from the viewpoint of preventing the viscosity of the resin from being too high and the resin becoming difficult to be embedded in the fine wiring. Good, 0.4μηι is better, 〇·5μιη is especially good. Commercially available talc, such as Japanese talc (stock) D-600 (average particle size 0.6μηι), D-800 (average particle size 0·8μιη), D-1000 (average particle size Ι.Ομηι), SG-95S ( Average particle size 1.2 μm), SG - 9 5 (average particle size 2.5 μιη), P-8 (average particle size 3.3 μιη), P-6 (average particle size 4.0 μηι)' Ρ-4 (average particle size) 44·5μιη), Ρ-3 (average particle size 5.0μιη), Ρ-2 (average particle size 7.5μηη), L-1 (average particle size 5·0μιη), Κ-1 (average particle size 8.0μπΐ) ), ί- Ο G (average particle size 5·0μπ〇, etc. The average particle diameter of the above talc can be measured by the laser diffraction/scattering method according to the Mie scattering theory. Specifically, the laser diffraction type particle size distribution measuring device can be used. The particle size distribution of the inorganic filling material is determined on a volume basis, and the cerium particle diameter is determined as the average particle diameter. The measurement sample is preferably used in which the talc is dispersed in the ultrasonic wave by ultrasonic wave. The device can be used by LA-5 00, etc., which is manufactured by the company's market. The amount of talc is not particularly limited, but the upper limit of the talc is q 値, when the resin composition is not volatile, it is divided into 1 00. When the amount is %, it is preferable to prevent 20% by mass from being deteriorated in the lamination property of the circuit board, more preferably 19% by mass, more preferably 18% by mass, still more preferably 17% by mass, and particularly preferably 16% by mass, 15 On the other hand, the lower limit of the talc is 値, and when the non-volatile content of the resin composition is 100% by mass, the adhesion strength between the conductor layer and the insulating layer after the environmental test is prevented is reduced by 5 mass. % is better, 6 mass% is better' 7 mass% and better, 8 mass. /. even better, 9 mass% is especially good, and 10 mass% is particularly good. The total amount of talc and cerium oxide is not The upper limit of the total amount of talc and -9 - 201040226 cerium oxide is arbitrarily limited. When the non-volatile content of the resin composition is 100% by mass, 70% by mass is prevented from being deteriorated in the lamination property of the circuit board. Preferably, 65 mass% is better, 62 mass% is better, 60 mass% is better, 58 mass% is particularly good, and 56 mass% is particularly good. On the other hand, talc and cerium oxide The lower limit of the total amount of collocation, when the resin composition is not volatile, 1 When the mass % is 5%, the thermal expansion coefficient of the insulating layer is preferably 35 wt%, more preferably 40 mass%, more preferably 42 mass%, more preferably 45 mass%, and particularly preferably 47 mass%, 4 9 The cerium oxide to which the resin composition of the present invention is blended is not particularly limited, and various cerium oxides such as amorphous silica sand, molten oxidized slag, crystalline silica sand, and synthetic cerium oxide are used, particularly Spherical molten cerium oxide is preferred. The average particle size of the conventional sand is not particularly limited, and the average particle diameter is preferably 5 μm or less, particularly preferably 〇·1 μιη to 1. 〇μιη. When the average particle diameter is too small, the viscosity of the resin is too high, and the resin does not easily flow into the fine wiring line. When the thickness exceeds 5.0 μm, the insulation reliability between the fine wiring lines and the conductor layers tends to decrease. The talc and cerium oxide used in the present invention are preferably surface-treated with a surface treatment agent to have a moisture resistance or dispersibility of δ ε. The surface treatment agent may, for example, be an amino decane-based coupling agent, an epoxy sand-system coupling agent, a base-cutting system coupling agent, a decane-based coupling agent, an organic decane compound, or a titanate-based coupling agent. The amino decane coupling agent is aminopropyltrimethoxydecane, aminopropyldiethoxydecane, ureidopropyltriethoxydecane, N-phenylaminopropyltrimethoxydecane, hydrazine 2-(Aminoethyl)aminopropyltrimethoxyphosphonium-10-201040226 alkane is preferred. The epoxy decane coupling agent is glycidoxypropyltrimethoxy sane, glycidoxypropyl triethoxy decane, glycidoxypropyl methyldiethoxy decane, epoxy Preferably, propylbutyltrimethoxydecane or (3,4-epoxycyclohexyl)ethyltrimethoxydecane is preferred. The mercapto decane coupling agent is preferably propyl propyl trimethoxy decane or decyl propyl triethoxy decane. The decane coupling agent is preferably methyltrimethoxydecane, octadecyltrimethoxydecane, phenyltrimethoxydecane, methacryloxypropyltrimethoxydecane, imidazolium or triazinedecane. The organic sulfonium compound is hexamethyldiazepine, hexaphenyldioxane, triazane, cyclotriazane, 1,1,3,3,5,5-hexamethylcyclo Triterpenoid is preferred. The titanate coupling agent is a butyl titanate dimer, a titanium octyl glycol ester, a diisopropoxy titanium bis(triethanolamine), a dihydroxy titanium dilactate, a dihydroxy bis(ammonium lactate) titanium, Bis(dioctyl pyrophosphate) ethylene titanate, bis(dioctylpyrophosphate)oxyacetate titanate, tris-n-butoxytitanium monostearate, tetra·η_ Butyrate, tetrakis(2-ethylhexyl) titanate, tetraisopropylbis(dioctylphosphine)titanate Q ester, tetraoctylbis(di(tridecyl)phosphine) titanate , tetrakis(2,2-diallyloxymethyl-1-butyl)bis(di(tridecyl)phosphine titanate, isopropyl trioctadecyl titanate, isopropyl triisopropyl Phenylphenyl titanate, isopropyl triisostearate titanate, isopropylisostearyl decyldipropenyl titanate, isopropyl dimethyl propyl acrylate isostearyl Phthalate, isopropyl tris(dioctyl discate) titanate, isopropyl tris(dodecyl)benzenesulfonate titanate, isopropyl tris(dioctyl pyrophosphate) Titanate, isopropyl tris(Ν_醯amine ethyl. Aminoethyl) titanate good. -11 - 201040226 [Cyanate ester resin] The cyanate resin used in the present invention is not particularly limited, and is, for example, a novolac type (phenol novolak type, alkylphenol novolak type, etc.) cyanate resin, A bisphenol type (bisphenol A type, bisphenol F type, bisphenol S type, etc.) cyanate resin and a part of the triazine-based prepolymer. These may be used singly or in combination of two or more. The weight average molecular weight of the cyanate resin is not particularly limited, but is preferably 500 to 4,500, more preferably 600 to 3,000. Specific examples of the cyanate resin, such as bisphenol A dicyanate, polyphenol cyanate (oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylene Bis(2,6-dimethylphenyl cyanate), 4,4'-ethylenediphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4 _Cyanate ester) phenylpropane, 1, bis (4-cyanate phenyl) methane, bis (4-cyanate-3,5-dimethylphenyl) methane, 1,3-double ( 4-functional cyanate esters such as cyanate ester phenyl-1-(methylethylidene) benzene, bis(4-cyanate phenyl) sulfide, bis(4-cyanate phenyl) ether a resin; a polyfunctional cyanate resin derived from a phenolic novolac, a cresol novolac, a phenol resin of a dicyclopentadiene structure, or the like; a part of the cyanate resin pre-polymerized by triazine A commercially available cyanate resin, a phenolic novolak type polyfunctional cyanate resin represented by the following formula (2) (manufactured by Lonza Japan Co., Ltd., PT30, cyanate equivalent 124), and the following formula (3) ) The bisphenol A dicyanate represented by a part or all of the bisphenol A dicyanate is a dimerized prepolymer (Lonza Japan) System, BA230, cyanate equivalent 232), containing cyanate ester resin of dicyclopentadiene structure (Lonza Japan (shares) manufactured, DT-4000) and the like. -12-201040226

Ut !ocn OCN

OCN (2) [where n is an arbitrary number representing the mean 値. ]

[Chemical 2]

The content of the cyanate resin in the resin composition is not particularly limited, and the upper limit of the content of the cyanate resin is not reduced by the viewpoint of preventing the adhesion strength between the conductor layer and the insulating layer from being lowered. 1% by mass, preferably 50% by mass, more preferably 40% by mass, and even more preferably 30% by mass. In addition, the lower limit of the content of the cyanate resin is 5% by mass, and 5% by mass, based on the non-volatile content of the resin composition, from the viewpoint of preventing the heat resistance of the resin composition from being lowered and preventing the thermal expansion coefficient of the insulating layer from increasing. Good, 10% by mass is better, and 15% by mass is better. [Epoxy Resin] The epoxy resin used in the present invention is not particularly limited, and examples thereof include, for example, bisphenol-13-201040226 type A epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and phenol system. Novolak type epoxy resin, alkylphenol novolak type epoxy resin, biphenyl type epoxy resin, aralkyl type epoxy resin, naphthol type epoxy resin, fluorene type epoxy resin, dicyclopentylene An epoxide of a diene type epoxy resin, a naphthalene type epoxy resin, a condensate of a phenol and an aromatic aldehyde having a phenolic hydroxyl group, a biphenyl aralkyl type epoxy resin, a fluorene type epoxy resin, or an anthracene Tons of epoxy resin, triepoxypropyl isocyanurate, and the like. These epoxy resins may be used singly or in combination of two or more kinds. Commercially available epoxy resin, such as "JER828EL" (liquid bisphenol A type epoxy resin) manufactured by Japan Epoxy Resins Co., Ltd., "HP403 2" and "HP403 2D" manufactured by Dainippon Ink Chemical Industry Co., Ltd. "Epoxy resin", "HPOOO" (naphthalene type 4-functional epoxy resin) manufactured by Dainippon Ink Chemicals Co., Ltd., "Essence of ESN", "ESN-475V" and "ESN-185V" (naphthol type) "Epoxy resin", "PB-3600" (epoxy resin with butadiene structure) made by Daicel Chemical Industry Co., Ltd., "NC3 000H", "NC 3 000L", "NC3100" made by Nippon Kayaku Co., Ltd. And "NC3 000" (biphenyl type epoxy resin), "YX4000" (biphenyl type epoxy resin) manufactured by Japan Epoxy Resins Co., Ltd., GK3207 (biphenyl type epoxy resin) manufactured by Toho Chemical Co., Ltd. ), "YX8 800" (including enamel skeleton epoxy resin) made by japan Epoxy Resins. The content of the epoxy resin in the resin composition is not particularly limited, and is not more than 1% by mass, preferably 5 to 60% by mass, more preferably 10 to 50% by mass, based on the resin composition. More preferably 1 5 to 40% by mass. When the content of the epoxy resin is too small, the roughening treatment on the surface of the hardened composition described later tends to cause coarsening unevenness. If the content of the epoxy resin is too large, the content of the cyanate resin is decreased as compared with -14-201040226, so that the thermal expansion coefficient of the insulating layer tends to increase. The epoxy equivalent ratio of the cyanate ester equivalent of the cyanate resin to the epoxy resin is preferably 1:0.4 to 1:2, more preferably 1:0.5 to 1:1.5. When the equivalent ratio is outside the above range, the lower thickness of the surface of the insulating layer and the adhesion strength between the conductor layer and the insulating layer formed by plating in the wet roughening step will be difficult to achieve. ❹ [Thermoplastic resin] The thermoplastic resin used in the present invention may, for example, be a phenoxy resin, a polyimine resin, a polyamidimide resin, a polyether quinone resin, a poly maple resin or a polyether oxime. Resin, polyphenylene ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin, polyvinyl acetal resin, polyvinyl butyral resin, and the like. These thermoplastic resins may be used singly or in combination of two or more kinds. Q The thermoplastic resin is preferably a phenoxy resin or a polyvinyl acetal resin from the viewpoint of preventing deterioration of the laminate property of the circuit board. The polyvinyl acetal resin is preferably a polyvinyl butyral resin. Specific examples of the polyvinyl acetal resin include, for example, electro-chemical industrial (s) electroformation butyral 4000-2, 5000-A, 6000-C, and 6000-EP, and Sekisui Chemical Industry Co., Ltd. Bh series, BX series, KS series, BL series and BM series. Specific examples of the phenoxy resin include FX2 80 and FX293 manufactured by Toho Chemical Co., Ltd.

Japan Epoxy Resins (shares) YX8100, YX6954, YL6974, YL7482 'YL7553, YL6794, YL7213 and YL7290. Polyethylene -15- 201040226 The acetal resin is particularly preferred for glass transition temperatures above 80t. Here, the "glass transition temperature" is determined in accordance with the method of JIS K 7197. Further, when the glass transition temperature is higher than the decomposition temperature and the glass transition temperature is not actually observed, the decomposition temperature can be regarded as the glass transition temperature of the present invention. Further, the decomposition temperature is defined by the temperature at which the mass reduction rate at the time of measurement by Π S K 7 1 2 0 is 5%. The thermoplastic resin preferably has a weight average molecular weight of 5,000 to 200,000, more preferably 10,000 to 150,000, more preferably 15,000 to 1,000,000, and even more preferably 20,000 to 80,000. When the ratio is smaller than this range, the effect of improving the film forming ability or the mechanical strength may not be sufficiently exhibited. When the ratio is larger than this range, the compatibility with the cyanate resin and the epoxy resin is lowered, and the surface of the insulating layer is roughened. The thickness has a tendency to increase. Further, the weight average molecular weight of the present invention can be measured by a colloidal permeation chromatography (GPC) method (in terms of polystyrene). The weight average molecular weight of the GPC method is specifically used as a measuring device (LC-9A/RID-6A manufactured by Shimadzu Corporation), and as a column, Shodex K-8GGP/K-804L/K-made by Showa Denko Co., Ltd. 804L was measured as a mobile phase using chloroform or the like at a column temperature of 40 ° C and using a standard polystyrene calibration curve. The content of the thermoplastic resin in the resin composition is not particularly limited, and is not more than 100% by mass, preferably 1 to 20% by mass, more preferably 2 to 15% by mass, and more preferably the resin composition. Good for 3~1 〇 mass%. When the content of the thermoplastic resin is too small, the film forming ability or the effect of improving the mechanical strength is not exhibited, and the adhesion maintaining effect after the environmental test is not possible. The tendency to be exhibited is not sufficient, and if it is too large, the wet roughening will be described later. The thickness of the surface of the insulating layer after the step tends to increase. The resin composition of the present invention contains (A) component, (B) component, (C) component, (D) component, and (E) component, and has excellent lamination property, and can provide an insulating layer after hardening, even in the case of After the environmental test under high temperature and high humidity, the adhesion between the conductor layer and the insulating layer is sufficient, and the resin composition is excellent in low thermal expansion property. q The coefficient of thermal expansion of the cured product of the resin composition of the present invention can be grasped by the measurement method of the measurement and evaluation of the coefficient of thermal expansion (CTE) described later. The cured product of the resin composition of the present invention preferably has a thermal expansion coefficient of 44 ppm or less, more preferably 42 ppm or less, more preferably 40 ppm or less, more preferably 38 ppm or less, particularly preferably 36 ppm or less, and particularly preferably 34 ppm or less. Further, the lower limit 热 of the coefficient of thermal expansion is as low as possible, and preferably 30 ppm, more preferably 25 ppm, more preferably 20 ppm, more preferably 10 ppm, and 4 ppm Q is particularly preferable. The adhesion retention ratio before and after the environmental test of the insulating layer and the conductor layer formed of the resin composition of the present invention can be grasped by the measurement method of the measurement and evaluation of the adhesion strength (peeling strength) of the conductor layer to be described later. The adhesion maintaining ratio of the insulating layer and the conductor layer formed by the resin composition of the present invention before and after the environmental test is preferably 40% or more, more preferably 45% or more, more preferably 50% or more, and more preferably 55% or more. Good, 60% or more is especially good, 65% or more is particularly good, and 70% or more is very good. Moreover, the upper limit of the adhesion maintenance rate is as high as possible, preferably 80%, 82% is better, 84% is better, 8 6 % -17-201040226 is better, 90% is especially good. 100% is especially good. [Organic Metal Compound] In the resin composition of the present invention, an organic metal compound can be further added from the viewpoint of curing promotion. The organometallic compound 'is, for example, an organic copper compound such as copper (11) acetamidine acetone; an organic zinc compound such as zinc (antimony) acetonide acetone or zinc naphthalate U1); cobalt (II) acetoacetone, cobalt (III) An organic cobalt compound such as acetone; an organic nickel compound such as nickel (yttrium)acetonitrile; an organic iron compound such as iron (111) acetamidine or the like. The amount of addition of the organometallic compound 'is not more than 100% by mass in the resin composition, and the metal content of the organometallic compound is preferably from 25 to 500 ppm, more preferably from 40 to 200 ppm. When the thickness is less than 2 5 p p m, it becomes difficult to form a conductor layer having a peeling strength, and when it exceeds 500 ppm, the storage stability and the insulating property of the resin composition tend to be problematic. [Rubber Particles] The resin composition of the present invention may further contain rubber particles from the viewpoint of improving adhesion. The rubber particles which can be used in the present invention are, for example, those which are also insoluble in the varnish used to prepare the resin composition, and which are not compatible with a cyanate resin or an epoxy resin which must be formed. Therefore, the rubber particles are present in a dispersed state in the varnish of the resin composition of the present invention. Such rubber particles are generally prepared such that the molecular weight of the rubber component is insoluble in an organic solvent or a resin to make it large and particulate. Preferred rubber particles which can be used in the present invention are, for example, core-shell type rubber particles -18 - 201040226, crosslinked acrylonitrile butadiene rubber particles, crosslinked styrene butadiene rubber particles, propylene-based rubber particles and the like. The core-shell type rubber particles are rubber particles having a core layer and a shell layer, for example, a shell layer of an outer layer is composed of a glassy polymer, and a core layer of the inner layer is composed of a rubbery polymer, or an outer layer. The shell layer is composed of a glassy polymer, the intermediate layer is composed of a rubbery polymer, and the core layer is made of a glassy polymer. The glassy polymer layer is composed of, for example, a polymer of methyl methacrylate, and the rubbery polymer layer is composed of, for example, a butyl acrylate polymer (butyl rubber). Specific examples of the core-shell type rubber particles include Staphyloid AC3 832, AC3816N (trade name, manufactured by Ganz Chemical Co., Ltd.), and Metablen KW-4426 (trade name, manufactured by Mitsubishi Rayon Co., Ltd.). Specific examples of the crosslinked acrylonitrile butadiene rubber (NBR) particles are, for example, XER-91 (average particle diameter: 0.5 μm, manufactured by JSR Co., Ltd.). Specific examples of the crosslinked styrene butadiene rubber (SBR) particles include, for example, XSK-500 (average particle diameter: 0.5 μm, manufactured by JSR Co., Ltd.). Specific examples of the propylene-based rubber particles include Metablen W300A (average particle diameter Ο.ίμιη), W450A (average particle diameter 0.2 μmη) (manufactured by Mitsubishi Rayon Co., Ltd.), and the like. The average particle diameter of the rubber particles to be blended is preferably in the range of 0.005 to Ιμιη, more preferably in the range of 0.2 to 0.6 μm. The average particle diameter of the rubber particles used in the present invention can be measured by a moving light scattering method. For example, the rubber particles are uniformly dispersed by ultrasonic waves in a suitable organic solvent, and the particle size distribution of the rubber particles is -19-201040226 using a thick particle size analyzer (FPAR-10000; manufactured by Otsuka Electronics Co., Ltd.). In the production, the ruthenium particle diameter can be used as the average particle diameter to determine the rubber particle content, and the non-volatile content of the resin composition is 100% by mass, preferably 1 to 1 〇% by mass, and more preferably 2 to 5 by mass. %. [Flame Retardant] The resin composition of the present invention contains a flame retardant in a range that does not impair the effects of the present invention. Examples of the flame retardant include an organic phosphorus-based flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, an anthrone-based flame retardant, and a metal hydroxide. Examples of the organophosphorus-based flame retardant include a phosphine compound such as HC A, HCA-HQ, and HCA-NQ manufactured by Sanko Co., Ltd., and a benzohexazine compound such as HFB-2006M manufactured by Showa Polymer Co., Ltd. 'Aj inomoto Fine-Techno Co., Ltd. Li Aofu 30, 50, 65, 90' 110, TPP, RPD, BAPP, CPD, TCP, TXP, TBP, TOP, KP140 and TIBP, Beixing Chemical Industry Co., Ltd. PPQ, Clariant (share) OP93 0, Da Ba Chemical (share) PX200 phosphate compound, Dongdu Chemical (FX) FX2S9, FX3 10 and other phosphorus-containing epoxy resin, Dongdu Chemical Co., Ltd. Phosphorus phenoxy resin such as ERF 001. For the organic nitrogen-containing phosphorus compound, for example, SP67〇 manufactured by Shikoku Chemicals Co., Ltd., phosphate amide compound such as SP703, SPB100 and SPE100 manufactured by Otsuka Chemical Co., Ltd., and FP-series manufactured by Fushimi Manufacturing Co., Ltd. Such as phosphorus and nitrogen compounds. Metal hydroxides such as UD65, UD650, UD653 and other magnesium hydroxides manufactured by Ube Material Co., Ltd., B-30, B--20-201040226 325, B-315, B-308, manufactured by Ba Industrial Co., Ltd. Aluminum hydroxide such as B-303 and UFH-20. [Other components] The resin composition of the present invention can be blended with other components as necessary without impairing the effects of the present invention. Other ingredients, such as tantalum powder, nylon powder, fluorine powder and other organic filling agents: Oluban, Fantong and other tackifiers 'ketones, fluorine, polymer defoamers or coating agents; imidazole 0 series , adhesion promoters such as thiazoles, triazoles, and decane coupling agents; hardening accelerators such as imidazoles and amines; phthalocyanine blue, phthalocyanine, green, iodine, green, bisazo yellow, A coloring agent such as carbon black. The preparation method of the resin composition of the present invention is not particularly limited, and for example, a cyanic acid resin, an epoxy resin, a thermoplastic resin, talc, cerium oxide, a hardening accelerator necessary for curing, a curing catalyst, and the like may be used. A method in which rubber particles or other components are mixed by a rotary mixer or the like. The use of the resin composition of the present invention is not particularly limited, and it can be used for an insulating resin sheet such as a Q-thick film or a prepreg, a circuit board, a solder resist, a bottom-filling material, a die-adhesive material, a semiconductor sealing material, and a sealing hole. Resins, seal parts, and the like require a wide range of applications for resin compositions. Among them, the multilayer printed wiring board can be suitably used for forming an insulating layer. The resin composition of the present invention may be applied to a circuit board in a varnish state to form an insulating layer after curing. However, it is generally industrially used in the form of a sheet-like laminate such as a film or a prepreg. The softening point of the resin composition is preferably from 40 to 150 ° C from the viewpoint of laminar laminate lamination. -21 - 201040226 [Continuous film] The adhesive film of the present invention can be coated with a resin varnish in which a resin composition is dissolved in an organic solvent by a method known to the manufacturer, and the resin varnish is coated with a die coater or the like. The support film of the body is further produced by drying the organic solvent by heating or hot air blowing to form a resin composition layer. The organic solvent may, for example, be a ketone such as acetone, methyl ethyl ketone or cyclohexanone; ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, carbitol acetic acid Acetates such as esters; cellosolves; carbitols such as butyl carbitol; aromatic hydrocarbons such as toluene and xylene; dimethylformamide, dimethylacetamide, N-methyl Pyrrolidone and the like. The organic solvent may be used in combination of two or more kinds. The condition for drying and removing the organic solvent is not particularly limited, and the content of the organic solvent in the resin composition layer is preferably 1% by mass or less, more preferably 5% by mass or less. Although it varies depending on the amount of the organic solvent in the varnish and the boiling point of the organic solvent, for example, a varnish containing 30 to 60% by mass of an organic solvent is formed at 50 to 150 ° C for about 3 to 10 minutes to form an organic layer. The resin composition layer having a solvent content of 1% by mass or less. The manufacturer can set suitable and preferred drying conditions by simple experimentation. The thickness of the resin composition layer formed in the film is usually more than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the resin composition layer preferably has a thickness of 10 to ΙΟΟμπα. The support film in the present invention may, for example, be a polyolefin such as polyethylene, polypropylene or polychlorinated-22-201040226 ethylene; polyethylene terephthalate (hereinafter referred to as "PET"), polyethylene naphthalate A polyester such as an ester; a polycarbonate; a film formed by polyimine or the like, and further a metal foil such as a release paper, a copper foil, or an aluminum foil. Further, the support film and the protective film described later may be subjected to a mold release treatment in addition to a mat treatment or a corona treatment. The thickness of the support film is not particularly limited, and is preferably 10 to 150 μm, and more preferably 25 to 50 μm. The support film on the resin composition layer is not adhered to the surface, and the protective film can be laminated on the support film. The thickness of the protective film is not particularly limited, and is preferably 1 to 4 μm. By laminating the protective film, it is possible to prevent dust or the like from adhering to the surface of the resin composition layer or to prevent scratching. The film can then be rolled into a roll for collection. [Multilayer Printed Wiring Board Using Adhesive Film] Next, an example of a method of manufacturing a multilayer printed Q wiring board using the adhesive film manufactured as described above will be described. First, the adhesive film was laminated on one or both sides of the circuit substrate using a vacuum laminator. Examples of the substrate that can be used for the circuit board include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a silicone resin substrate, and a thermosetting polyphenylene ether substrate. Further, the circuit board is a conductor layer (circuit) in which a pattern is formed on one surface or both surfaces of the substrate as described above. Further, in the multilayer printed wiring board in which the conductor layer and the insulating layer are alternately laminated, the one or both sides of the outermost layer of the multilayer printed wiring board are also patterned circuit conductors (circuits) included in the circuit substrate. . The surface of the body layer can also be pre-applied by blackening treatment, copper micro-etching, etc. on the surface of the body layer -23-201040226. In the above lamination, when the film has a protective film, after the protective film is removed, the film and the circuit substrate are preheated as necessary, and the film is then pressed and heated while being pressed onto the circuit board. In the film of the present invention, a method of laminating to a circuit substrate under reduced pressure by vacuum lamination is suitably used. The lamination conditions are not particularly limited, and for example, the pressing temperature (laminating temperature) is preferably 70 to 140 ° C, and the pressing pressure is preferably 1 to llkgf/cm 2 (9.8 X 104 〜 1 07.9 X 1 04 N/m 2 ). It is preferred to laminate under reduced pressure at an air pressure of 20 mmHg (26.7 hPA) or less. Further, the lamination method may be batch type or continuous in rolls. Vacuum lamination can be carried out using a commercially available vacuum laminator. Commercially available vacuum laminating machine, for example, a vacuum compactor manufactured by Nichigo-morton Co., Ltd., a vacuum pressurizing laminator manufactured by Nihon Seiki Co., Ltd., a Hitachi INDUSTRES roll dry coater, Hitachi AIC (stock) vacuum laminator, etc. Further, the laminating step of heating and pressurizing under reduced pressure can be carried out using a general vacuum hot press. For example, it can be carried out by pressurizing a metal plate such as a heated SUS plate from the side of the support layer. Under normal conditions, the pressure-reducing condition is usually 1xl (T2MPa or less, preferably 1 X 1 0_3 ΜP a or less. The heating and pressurization can be carried out in one step', but the control resin is leaked in two stages or more. It is preferable to carry out under different conditions, for example, pressurization in the first stage at a temperature of 70 to 150 ° C, a pressure of 1 to 15 kgf/cm 2 , and a second stage of pressurization at a temperature of 150 to 200 ° C and a pressure of 1 to 40 kgf / The range of em2 is preferably carried out. The time of each stage is preferably 30 - 24 - 201040226 - 120 minutes. Commercially available vacuum hot presses, for example, MNPC-V-75 0-5-200 (shares) machine manufacturer System), VH 1 - 1 603 (Beichuan Seiki Co., Ltd.), etc. Then, after the film is laminated on the circuit board, and after cooling to room temperature and peeling off the support film, an insulating layer can be formed on the circuit board by peeling and heat curing. The condition of the heat hardening may be appropriately selected depending on the kind of the resin component in the resin composition, etc., but it is preferably at 150 ° C to 22 (20 minutes to 180 minutes under TC, more preferably 160 ° C to 200 ° Selecting at a temperature of 30 to 120 minutes at ° C. The film is not peeled off before hardening, and is peeled off after forming the insulating layer. Then, if necessary, the insulating layer formed on the circuit substrate is opened to form a through hole. The through hole may be formed by a known method such as a drill, a laser, a plasma, or the like by a combination of such methods, but a hole such as a carbon dioxide laser or a YAG laser is used to open the hole. Next, dry conductor plating or wet plating is applied to the insulating layer to form a conductor Q layer. For dry plating, a known method such as evaporation, sputtering, ion plating, or the like can be used. First, the surface of the hardened resin composition layer (insulating layer) is subjected to wet roughening treatment. The wet roughening treatment refers to permanganate (potassium permanganate, sodium permanganate, etc.), dichromate. , ozone, hydrogen peroxide / sulfuric acid, nitric acid and other oxidants roughening and The treatment of the anchor point of the convex and concave. The oxidant is preferably a sodium hydroxide aqueous solution such as potassium permanganate or sodium permanganate (alkaline permanganic acid aqueous solution). After the roughening treatment, combined electroless plating and electrolytic plating are used. The method of forming a conductor layer. In addition, the conductor layer refers to a plating resist which forms an inverse pattern and can also form a conductor layer only by electroless mineralization. The subsequent pattern - 25-201040226 formation method can be used, for example, which is well known to the manufacturer. Subtractive method, semi-additive method, etc. The surface of the produced conductor layer is roughened as described above, and the surface of the conductor layer is roughened to improve the adhesion of the resin to the conductor layer. The conductor layer is roughened to use an organic acid system. Preferably, the etching agent CZ-8100, CZ-8101, CZ-5480, etc., by using the resin composition for a printed wiring board of the present invention, is not related to the degree of roughening of the surface of the conductor layer, and is denser than the resin composition of the prior art. The property is improved, and an insulating layer having a low thermal expansion coefficient, lamination property, and balance with the adhesion strength of the conductor layer after the environmental test is formed. [Prepreg] The prepreg of the present invention can be obtained by the present invention Resin The flaky reinforcing base material formed of the fiber is impregnated by a hot melt method or a solvent method, and then heated and then semi-hardened. That is, the resin composition of the present invention can be used as a flaky reinforcing substrate in which the fiber is formed. A prepreg in an impregnated state. A flaky reinforcing substrate made of a fiber may be, for example, a glass cloth or a polyamidamide fiber or the like as a fiber for prepreg fibers. The hot melt method is not a resin. The organic solvent is temporarily applied to a coated paper having good release property from the resin, and is laminated on a sheet-like reinforcing substrate, or the resin is insoluble in an organic solvent, but is applied to a sheet by a die coater. a method of directly coating a substrate to prepare a prepreg, and a solvent method, as in the case of a film, dissolving the resin in an organic solvent to prepare a resin varnish, and immersing the flaky reinforcing substrate in a varnish. A method in which a resin varnish is impregnated into a sheet-like reinforcing substrate and then dried. -26- 201040226 [Multilayer printed wiring board using prepreg] Next, an example of a method of producing a multilayer printed wiring board using the prepreg manufactured as described above will be described. On the circuit board, a prepreg of the present invention or a plurality of sheets as necessary is superposed, and the release film is held by a metal plate, and pressure lamination is performed under pressure and heating. Pressurization. Heating conditions are preferably pressures of 5 to 40 kgf/cm2 (49xl04 to 392 xl04N/m2). The temperature is 120 to 2 00 ° C for 20 to 100 minutes. Similarly to the subsequent film, the prepreg may be laminated to the circuit board by vacuum lamination, and then heat-hardened. Thereafter, the surface of the prepreg which has been cured is roughened as described above in the same manner as the above-described method, and the conductor layer is plated to form a multilayer printed wiring board. Hereinafter, the invention will be specifically described by way of examples, but the invention is not limited to the examples. [Embodiment] [Examples] [Example 1] A bismuth A-cyanate vinegar prepolymer ("BA230S75" manufactured by L〇nza Japan Co., Ltd., a cyanate equivalent of about 232' nonvolatile content of 75% by mass) 30 parts by mass of a methyl ethyl ketone (hereinafter referred to as MEK) solution, and a phenolic phenolphthalein varnish type sulphate t-cyanate vinegar resin ("PT30"' manufactured by L〇nza japan" About 124) 10 parts by mass of 'MEK 10 parts by mass were stirred and mixed, and then mixed as a naphthol type epoxy resin, "Essex" (ESN_475V) (expressed as the following general formula. Epoxy equivalent of about -27-201040226 340) 40 parts by mass of a MEK solution having a nonvolatile content of 65% by mass, and further a liquid bisphenol fluorene type epoxy resin ("JER828EL" manufactured by Japan Epoxy Resins Co., Ltd., epoxy equivalent: about 185), 8 parts by mass, phenoxy resin Solution ("YX6954" manufactured by Japan Epoxy Resins Co., Ltd., a weight average molecular weight of 40000, a mixed solution of MEK and cyclohexanone having a nonvolatile content of 30% by mass) 20 parts by mass, cobalt (II) acetamidineacetone (Co(AcAc)) 2. 4 parts by mass of N,N-dimethylformamide (DMF) solution of Tokyo Chemical Co., Ltd.) , talc (Japan Dwarf Co., Ltd. "D-800" surface treated with amino decane, average particle size 〇.8μιη) 6 parts by mass, and spherical cerium oxide ("share" Admatechs "SO-C2" After the amine decane was used as a surface treatment agent and the average particle diameter of 55 μm was 42 parts by mass, 20 parts by mass of MEK was added, and the mixture was uniformly dispersed by a high-speed rotary mixer to prepare a thermosetting resin composition varnish. Next, the resin composition was varnished on a polyethylene terephthalate film (thickness: 38 μm, hereinafter abbreviated as PET film), and the thickness of the dried resin composition layer was 40 μm, using a die coater. Uniform coating was carried out for 6 minutes at 80 to 120 ° C (average 100 ° C) (the amount of residual solvent in the resin composition layer: about 1.5% by mass). Next, a polypropylene film having a thickness of 15 μm was attached to the surface of the resin composition layer and wound up into a roll shape. The roll-shaped film was cut into a width of 507 mm to obtain a sheet-like film of a size of 5 07 X 3 3 6 mm. -28 - 201040226

(η is the average number of 値1 to 6, X is a glycidyl group or a hydrocarbon group having a carbon number of 1 to 8, and the ratio of the hydrocarbon group to the epoxy group is 〇.〇5 to 2. Ο.) [Example 2 A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 1 part by mass and SO-C2 was 38 parts by mass. [Example 3] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 12 parts by mass and S0-C2 was 36 parts by mass. [Example 4] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 16 parts by mass of 'S0-C2. [Example 5] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 18 parts by mass and S0-C2 was 30 parts by mass. [Example 6] -29-201040226 A film was obtained in the same manner as in Example 1 except that D 8 00 of Example 1 was 22 parts by mass and SO-C2 was 26 parts by mass. [Example 7] A film was obtained in the same manner as in Example 1 except that D 800 was 24 parts by mass and SO-C2 was 24 parts by mass. [Example 8] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 11 parts by mass and SO-C2 was 28 parts by mass. [Example 9] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 15 parts by mass and SO-C2 was 57 parts by mass. [Example 1] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 18 parts by mass and SO-C2 was 90 parts by mass. [Example 1 1] A film was obtained in the same manner as in Example 1 except that D 8 00 of Example 1 was 8 parts by mass and SO-C2 was 66 parts by mass. [Example 1 2 ] -30 - 201040226 A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 22 parts by mass and SO-C2 was 50 parts by mass. [Example 1 3] Except that D8 00 of Substituting Example 1 was SG-95 (15 parts by mass of an amine decane surface treatment, an average particle diameter of 2.5 μm), and SO-C2 was 57 parts by mass, and Example 1 In the same manner as in Example 1, except that D800 of Example 1 was not used, and SO-C2 was 48 parts by mass, a film obtained in the same manner as in Example 1 was obtained. [Comparative Example 2] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 4 parts by mass and SO-C2 was 45 parts by mass. [Comparative Example 3] A film was obtained in the same manner as in Example 1 except that D 8 00 of Example 1 was 30 parts by mass and SO-C2 was 18 parts by mass. [Comparative Example 4] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 48 parts by mass, and SO-C2 was not used. -31 - 201040226 [Comparative Example 5] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 10 parts by mass and SO-C2 was 21 parts. [Comparative Example 6] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 21 parts by mass and SO-C2 was 115 parts by mass. [Comparative Example 7] A film was obtained in the same manner as in Example 1 except that D800 of Example 1 was 13 parts by mass and SO-C2 was 54 parts by mass without using Y X 6 9 5 4 . &lt;Preparation of adhesion strength measurement sample&gt; (1) Underlayer treatment of laminate sheet In order to evaluate the adhesion strength between the conductor layer and the insulation layer, a double-sided copper-clad laminate in which an inner layer circuit is formed [copper foil thickness 18 μm, substrate) The surface of the circuit was roughened (ra値=1 μιη) after being immersed in MECetchBONDCZ-8100 manufactured by Mec (double-sided) with a thickness of 33 mm and a R5715ES manufactured by Matsushita Electric Works Co., Ltd. (2) Next, lamination of the film was carried out using the following films prepared in Examples 1 to 1 and Comparative Examples 1 to 6, using a batch type vacuum pressure laminator MVLP-5(R) (manufactured by a famous machine) Product name), laminated on both sides of the laminate. The laminating system was decompressed for 30 seconds, and the -32-201040226 air pressure was below 13 hPa, followed by a pressure of 30 sec, 100 ° C, and a pressure of 74.74 MPa. (3) Bottom treatment of copper enamel The surface of the copper foil was roughened by immersing the shiny surface of 3EC-III (electric field copper foil, 35μηι) made by Mitsui Metals Co., Ltd. in MECetchBONDCZ-8100 manufactured by Mec.値=1μιη). (4) Lamination of Copper Foil and Formation of Insulating Layer The PET film obtained by laminating the film from the above (2) is peeled off, and the treated surface of the copper foil treated by (3) is used as the resin composition layer side, and (2) Under the same conditions, the copper foil was laminated on the resin composition layer formed on both surfaces of the circuit board. A sample was prepared by curing the resin composition at a hardening condition of 1 90 ° C for 90 minutes to form an insulating layer. <Measurement and Evaluation of Coefficient of Thermal Expansion CTE> In the examples and comparative examples, PET (Mitsubishi Resin Co., Ltd.) was used in addition to the support using a fluororesin-based release agent (ETFE). In the same manner as in the case of "Follow RL50KSE, a film having the same resin composition layer as each of the examples and the comparative examples was obtained. The obtained film was heated at 190 ° C for 90 minutes to be thermally cured, and the support was peeled off. A flaky cured product was obtained, and the cured product was cut into test pieces having a width of about 5 mm and a length of about 15 mm, and subjected to thermomechanical analysis by a tensile weighting method using a thermomechanical analyzer Thermo Plus TMA8310 (manufactured by Rigaku Co., Ltd.). After the test piece was placed in the above apparatus, the measurement was continuously performed twice under the measurement conditions of a load of 1 g and a temperature increase rate of 5 ° C /min. -33 - 201040226 The average linear thermal expansion of 25 t to 150 ° C in the second measurement was calculated. Rate (ppm): "?" when CTE is less than 35 ppm, "〇" when 35 ppm or less is less than 40 ppm, "△" when 40 ppm or less is less than 45 ppm, and "X" when it is 45 ppm or more. 1, 2. &lt;evaluation of lamination& The films of the examples and the comparative examples were laminated on a circuit board under the lamination conditions described in the above (3), and were judged as follows according to the visual inspection. The results are shown in Tables 1 and 2. 〇: The circuit portion of the circuit substrate was not obtained. In the crack, the resin is very continuous. X: The circuit board of the circuit board has a crack and the resin is insufficiently connected. <Measurement and evaluation of the adhesion strength (peeling strength) with the conductor layer> The sample of the above (4) is cut off by 510 x 340 mm. It is a small piece of 150x30mm. In the small copper box part, the slit is added to the part of the width l〇mm and the length of 100mm, and the end of the copper foil is peeled off to grasp the grasping tool. Using the Instron universal testing machine, 50mm/min at room temperature The speed was measured as the load at the time of pulling 3 5 mm in the vertical direction as the peel strength before the environmental test. Further, the same sample was used as a highly accelerated life test device PM42 2 (manufactured by Nanben Chemical Co., Ltd.) at 1 30 ° C, 85 After the environmental test was accelerated for 1 hour under %RH conditions, the tear strength was measured in the same manner as the peel strength after the environmental test. "Peel strength after environmental test + peel strength before environmental test X 1 00" is the adhesion retention ratio (%), and the peel strength before and after the accelerated environmental test is compared. When the adhesion retention rate is 75% or more, it is -34-201040226 "◎", which is less than 75% and is 50% or more. The time is "〇", which is "△" when it is less than 50% and 40% or more, and "X" when it is less than 40%. The results are shown in Tables 1 and 2.

-35- 201040226 [I谳Example I3 〇§ 00 § ο LO 57 144. 54 gs ◎ 1 &lt;3 1 0.66 1 1 0.35 1 og Example 12 〇§ 00 csj 〇s | 144.54 | g ____ 〇0.66 0.52丨®gi Example 11 〇 § 00 § 00 o 146. 54 g • s_✓ 〇 1 0.66 1 0. 33 os 闺 2 K 〇〇〇 00 o § | 180.54 | § 〇®§ 〇fH (C ο 0.35 οΈ &gt;w^ Example 1_?_ 〇00 § inch ΙΛ o L〇144. 54 go 〇1 0.66 1 0.39 OS Example 8 1_ 〇§ 00 inch rH o 00 | 111,54 | in c〇s og 〇0. 72 〇OS Example 7 〇§ 00 S inch CSJ o inch CQ 120. 54 s' og 〇1 0.62 1 LO 〇® § Example 6 〇§ 00 C&gt;3 CN3 o CO CNi | 120.54 | § οσ Ol ·»—^ 〇0. 66 〇©g Example 5 〇00 inch 00 o Another 120. 54 in o ^ V_✓ 〇0.67 1 0.50 ! Example 1^4 〇§ 00 inch CO o eg CO 120. 54 § CO og ο ο I 0.45 I OS Example! 3 〇§ GO § Inch N o ς〇CO 120. 54 I § oo 运&gt;1_/ 〇1 0.72 1 0.41 ' 0 5 Example L. 2_一〇00 § inch 〇o 00 CO I 120.54 I § 00 oi N-»» 〇1 0.76 1 0.38 1 1 o § Example 1 〇00 inch CO o inch | 120.54 uo oBarrenness 1 0.76 I 0.33 &lt;3 3 ·»_✓ Solid fraction ratio ( %) LO 〇ί-Η LA 〇TM τΉ ooooo T-^ Total solid content (parts by mass) ΊΙ Sell S m 璀s. ¥ =-—η Thermal expansion willow Pm) Adhesion retention rate after environmental test before environmental test (% ) Type BA230S75 ΡΤ30 ESN475V JER828EL YX6954 Co(acac)2 D-800 SG-95 ! S0-C2 Laminated peeling strength (kgf/cm) -36- 201040226 ο ο [3谳] Comparative Example 7 〇00 〇CO 〇 Inch LA 133.54 S ◎Daddy X 0.66 L_. Lili _ CO ο &lt;]? N—✓ Comparative Example 6 〇03 § inch 1—Η 〇LO 1-^ I 208.54 LO 〇® § X CS| co o eg CO o OS Comparative Example 5 〇§ 00 ο 〇CSI 1 103.54 1 〇v 8 inch 〇0.73 | 0· 35 I &lt;3? ·&gt;»_✓ Comparative example 4 〇〇〇s inch 00 inch 〇〇120. 54 § o? X o' | 0.50 | ◎ s Comparative Example 3 00 00 s inch 〇 CO 120. 54 1Λ cq 〇 poor N—✓ X 0. 66 [0.46 | 〇艺比比2 〇00 inch inch 〇ΙΛ inch 121 . 54 CO og 〇| 0.73 | | 0.25 | 八CO &gt;w^ Comparative Example 1 ό 00 § inch 〇◦ 00 inch 120. 54 ο 〇i 〇1 0-71 1 o X f Solid fraction (%) LO 〇 rH LA &lt;〇〇ι-Η 〇〇〇〇〇〇 Total solid content (parts by mass) Inorganic coating ratio (%) Talc ratio (%) Thermal expansion ratio (ppm) Laminated environmental test before environmental test Maintenance rate (%) Type BA230S75 PT30 ESN475v jER828EL YX6954 | Co (acac)2 D-800 SG-95 SO-C2 Peel strength (kgf/cm) -37- 201040226 m 'Laminarity and energy balance. The content of the dense θ talc after the environmental test exceeded the results of Tables 1 and 2. In the examples, the strength of the dense heat after the low thermal expansion environment test was excellent, and on the other hand, Comparative Examples 1 and 2 had less talc content. The intensity reduction becomes significant. Further, in Comparative Examples 3 and 4, the lamination property was deteriorated. Further, in Comparative Example 5, the total content of talc and silica sand was small, and the coefficient of thermal expansion increased. Further, in Comparative Example 6, the total amount of rl* of the talc and the silica sand was too large, and the laminate property was deteriorated. In Comparative Example 7, in comparison with Examples 9 and 13 in which the ratio of the inorganic material to the talc was the same, the adhesion retention ratio of the peel strength before and after the environmental test was lowered because the thermoplastic resin was not blended with the essential component. Further, since the viscosity is too low due to the absence of the phenoxy resin, the laminate property is also deteriorated. [Industrial Applicability] The resin composition of the present invention can provide a film, a prepreg, and a multilayer printed wiring board which are excellent in adhesion between the conductor layer and the insulating layer and have less adhesion reduction after the environmental test. Further, it is also possible to provide electric appliances such as computers, smashing telephones, digital cameras, televisions, and the like, or vehicles such as locomotives, automobiles, electric cars, ships, and airplanes. -38-

Claims (1)

201040226 VII. Patent application range % 1. A resin composition containing (A) cyanate resin, (B) epoxy resin, (C) thermoplastic resin, (D) talc and (E) dioxide In the resin composition for a printed wiring board, when the non-volatile content of the resin composition is 100% by mass, the total content of the component (D) talc and the component (E) cerium oxide is 35% by mass. ～60% by mass and (2) Component (D) The content of talc is 5% by mass to 20% by mass. 0 2. A resin composition comprising a (A) cyanate resin, (B) epoxy resin, (C) thermoplastic resin, (D) talc, and (E) cerium oxide printed wiring board The resin composition is characterized in that when the non-volatile content of the resin composition is 100% by mass, the total content of the component (D) talc and the component (E) ceria is from 45% by mass to 60% by mass, and (2) Component (D) The content of talc is 5% by mass to 20% by mass. The resin composition of claim 1 or 2, wherein the average particle diameter of the component (D) talc is 1.3 μm or less. Q. The resin composition of claim 1 or 2, wherein the component (c) thermoplastic resin is a phenoxy resin, a polyimide resin, a polyamidimide resin, a polyether quinone resin, One or more polymer resins selected from polyfluorene resins, polyether oxime resins, polyphenylene resins, polycarbonate resins, polyetheretherketone resins, polyester resins, polycondensation resins, and polybutyral resins. 5. The resin composition of claim 1 or 2, wherein the component (c) thermoplastic resin is a phenoxy resin. 6. The resin composition according to any one of claims 1 to 3, wherein the component (D) talc and the component (E) cerium oxide are previously subjected to surface treatment. The resin composition according to any one of claims 1 to 6, wherein the thermal expansion coefficient is 44 ppm or less, and the adhesion retention ratio before and after the environmental test is 40% or more. The resin composition according to any one of claims 1 to 7, which is used for interlayer insulation of a multilayer printed wiring board. An adhesive film characterized in that the resin composition of any one of claims 1 to 8 is formed on the upper layer of the support film. A prepreg characterized in that the resin composition of any one of claims 1 to 8 is impregnated with a sheet-like reinforcing substrate composed of fibers. A printed wiring board comprising: an insulating layer containing a cured product of a resin composition according to any one of claims 1 to 8; and a conductive layer formed on the insulating layer. -40- 201040226 IV. Designated representative circle: (1) The representative representative of the case is: None (2), the symbol of the representative figure is simple: no 〇 201040226 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: no C -4-