201033565 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種導熱管之合金焊接裝置及方法，尤 其係指一種以銅銀合金進行焊接組裝，進而提升導熱管之 導熱效率的焊接裝置及方法。 【先前技術】 伴隨著電子元件性能提升的趨勢，高功率化的產品在 使用過程中無可避免地會產生高溫，因而造成產品的可靠 ❹ 度（rel iabi 1 i ty)產生問題，以iC設計為 例，在不斷增加晶片速度和密度的同時，晶片設計者也面 臨著各種產品的散熱問題；另外，就L E D模組應用於電 子產品而言，為了維持高功率化的設計，使得散熱效能的 課題亦備受重視。 為了解決散熱問題，過去係採用散熱片貼附於發熱產 品的表面，以熱傳導方式來散熱，但由於產品的發熱量越 來越大，且礙於產品體積的限制，散熱片的體積不允許隨 © 晶片發熱量的增加而增大，甚至在機體設計縮小的趨勢 下，機内可用空間限縮，更使散熱片體積不增反減，在可 用空間有限又得提升散熱效率的情況下，因此必須採行導 熱管（H e a t p i p e )技術。 導熱管各組件之間的組裝係採用焊接的方式進行，然 而，在習用的導熱管組件組裝過程，多係採用錫作為焊接 之焊料但在電子元件南功率化的趨勢下，所需逸散的熱 能亦隨之增加，然而由於錫的熔點較低以及其導熱係數不 足，恐怕無法跟上現階段電子產品之散熱需求；除此之外， 201033565 序，因此其製成品之可靠度有待商榷。 程 卜s用的導熱管焊接過財需採用助焊劑，且導 =内部係以空環境以維持其導熱效率，然由於目前的 ❹ 、、-选.*有间度的散熱需求，故只要真空環境稍微受到 導熱管的導熱效率便會受到影響便無法符合目前 疋件之錢格的散熱需求，而過去在導熱管各組件接 在使用助焊劑的焊接方式下會造成諸多缺點，使得其 内部真空環境有污染之虞，目而降低導熱管之產品良率： :其助焊劑會因時間而變質，進而影響到導熱管之使用壽 命〇 再者，導熱管在製程中的長度通常介於100mm至 〇 0mm之間’並且依照產品規格之需求去進行裁切， 再將該裁切端予以縮尾封合，由於該縮尾封合後的一端益 法進行導熱且不位處於熱傳導通路上’因此稱為熱傳導之 無效端，然該無效端的存在會降低導熱管之導熱效率故 ©無法達到高功率化電子元件之散熱需求。 綜°上述’在習用的導熱管製程中，不論是以錫作為 焊料、使用助焊劍或是裁切後封合管體形成無效端等作 法，都會對於導熱管之熱傳導效率產生負面影響，倘若 一種導熱管製程係不以錫為焊料、不使用助焊劑、更不會 產生無效端，便可進一步提升導熱管之熱傳導效率以符合 電子產品高規格的散熱需求。 【發明内容】 本發明人有鑑於上述既有導熱管製程所產生的缺點 201033565 乃積極著手從事研究’以期可以解決習用導熱管導熱效率 不足的問題’經過不斷的試驗及努力，終於開發出本發明。 本發明之主要目的在於提供一種以銅銀合金進行焊接 組裝，進而提升導熱管之導熱效率的焊接裝置及方法。 為了達到上述發明目的，本發明係採取以下之技術手 段予以達成，其中本發明之導熱管合金焊接裝置，包括： 溶焊爐’係一端為輸入端且另一端為輸出端之長形結 構’其包括： ® 一殼體’係由複數個防熱磚所組成，其具有： 一具開口之輸入端；以及 一具開口之輸出端，該開口係對應於該輸入端之 開口； 一剛性裡襯’係設置於該殼體中，其具有： 二開口 ’係分別對應於該殼體之輸入端開口及輸 出端開口； 一多段溶焊加熱器，係設置於該剛性裡襯中並鄰 © 近於該輸入端，其具有至少二加熱元件，各加熱元件係為 波浪狀；以及 一冷卻器’係設置於該剛性裡襯上並且介於該多 段溶焊加熱器與該輸出端開口之間； 傳輸裝置，係連結於該熔焊爐，其具有： 一輸入工作台，係設置於該熔焊爐之輸入端旁； 一輸出工作台，係設置於該熔焊爐之輸出端旁；以 及 一傳輸帶，係環狀繞設於該輸入工作台、熔焊爐、 201033565 輸出工作台。 本發明之導熱管合金焊接方法係使用於上述之導熱管 合金焊接裝置，該方法包括： 提供導熱管之組件； 組裝該導熱管之組件以形成組合件； 導入混合氣髏，該混合氣體之成分包括Ns、NH4以 及H2 ’該混合氣體中各成分之氣體分壓比率係為2:工： 1 ； ® 啟動一多段熔烊加熱器及冷卻器，以預熱該組合件溫 度至1 8 0 °C到2 2 0 °C之間； 放置該組合件於一傳輸裝置上； 熔烊該組合件以形成導熱管，其熔焊溫度係介於7 8 〇 °C至8 2 0 t之間； 冷卻該導熱管’使其溫度冷卻至1 5 0。(：到3 0 0 °C 之間；以及 自該傳輸裝置移除該導熱管。 © 本發明係採用銅銀合金作為焊接該導熱管各個組件之 焊料’由於該銅銀合金焊料具有優良的熱傳導效能，因此 取代習用的錫烊料，可提升導熱管的散熱能力；再者，本 發明不需要使用助焊劑進行焊接，使導熱管在製造過程當 中可避免產生管體内真空環境遭到污染的問題；另外，本 發明所製造出來的導熱管，因為係裁切管體所需要的長度 ㈣ 後進行封蓋組裝，而非裁切後直接縮尾封合，因此不會產 ' 生熱傳導之無效端’在熱傳導效率上更為優異。 故藉由上述之裝置與方法，本發明所製造出來的導熱 7 201033565 • 管不僅可免除錫焊料與助焊劑所產生的缺失，亦可避免無 效端的存在’進而提升導熱效能以符合高功率化電子產品 的散熱需求’而可應用於個人電腦、LED封裝、I C封 裝及太陽能等產業中。 【實施方式】 請參考第一圖，本發明導熱管之合金焊接裝置（1 ) 係包括： 熔焊爐（11)，係一端為輸入端且另一端為輸出端 ❹ 之長形結構，其包括： 一殼體（111)，係由複數個防熱碑所組成，其 具有： 一具開口之輸入端； 一具開口之輸出端，該開口係對應於該輸入端之 開口； 一内部徑向通道’係連通並介於該輸入端開口與 輸出端開口之間； © 複數個混合氣體導入孔（i i i i)，係分佈於 該殼體（1 1 1 )上； 一冷卻媒介輸入孔（11i2)，係穿設於該殼 體（1 1 1 )上並靠近該輸出端；以及 一冷卻媒介排放孔（1113)，係穿設於該殼 體1 1)上並靠近該輸出端； —剛性裡襯（112)，係對應並設置於該内部徑 向通道中，其具有： 二開口，係分別對應於該殼體（1 1 1 )之輸入 201033565 端開口及輸出端開口； « 一内牆，具有： 複數個混合氣體通孔，係分別對應於該混合氣 體導入孔（1 1 1 1 ); 二冷卻媒介通孔，係分別對應於該冷卻媒介輸 入孔（11 12)與該冷卻媒介排放孔（1113); 二側邊； 一頂邊；以及 〇 一平滑底邊； 複數個控溫感應器（1 1 2 1 )，係徑向分佈於 該剛性裡襯（1 1 2 )之内牆上； 複數個喷嘴，係可拆卸地分別對應設置於該混合 氣體導入孔（1 1 1 1 )與混合氣體通孔並且連通於一混 合氣體導入裝置； 一多段熔焊加熱器，係設置於該剛性裡襯（1 1 2 )中並鄰近於該輸入端，其具有至少二加熱元件（1工 〇 4 )，各加熱元件（1 1 4 )係為波浪狀並設置於該剛性 裡襯（1 1 2 )之内牆的侧邊及頂邊上；以及 一冷卻器，係設置於該剛性裡襯（1 1 2 )上並 且介於該多段熔焊加熱器與該輸出端開口之間，其具有： 至少一冷卻元件（1 1 5)，係設置於該内牆 上並連接於該冷卻媒介通孔； “至少一冷卻媒介輸入喷嘴，係連結於該冷卻媒 - 介輸入孔（1112);以及 至少一冷卻媒介排放喷嘴，係連結於該冷卻媒 201033565 介排放孔（1 1 1 3 ); m 傳輸裝置（12)，係連結於該熔焊爐（11)，其 '具有： 一輸入工作台（121)，係設置於該熔焊爐（1 1 )之輸入端旁，其具有： 一平台’係平行於該剛性裡襯（1 1 2 )之平滑 底邊並具有一前邊、二側邊及一具矩形凹口之後邊，該前 邊係鄰接於該殼體（1 1 i )之輸入端； © 二支撐腳，係分別連結於該平台之二側邊並往下 延伸；以及 一驅動輪’係可轉動地設置於該平台下方與該二 支撐腳之間、對應於該平台後邊之矩形凹口並且由一設置 於該平台下方之馬達驅動； 一輸出工作台（1 22)，係設置於該熔焊爐（1 1 )之輸出端旁，其具有： 一平台，係平行於該剛性裡襯（i丄2 )之平滑 ©底邊並具有一後邊、二側邊及一具矩形凹口之前邊，該後 邊係鄰接於該殼體（1 1 1 )之輸出端； " 二支撐腳，係分別連結於該平台之二側邊並往下 延伸；以及 一導輪，係可轉動地設置於該平台下方與該二 撐腳之間並且對應於該平台前邊之矩形凹口； 一傳輸帶（123)，係環狀繞設於㈣動輪 入工作台（1 2 1)、熔焊爐（1 1)、輸出工作台（/ 2 2 )及導輪’該傳輸帶（i 2 3 )在本實施例中係為一 201033565 鋼網輸送帶。 請參考第二圖，本發明導熱管之合金焊接方法係包括 下列步驟： 舉供導熱管之組件（A); 組裝該導熱管之組件以形成組合件（B );201033565 6. The invention relates to: an alloy welding device and method for a heat pipe, in particular to a welding device which is welded and assembled with a copper-silver alloy, thereby improving the heat conduction efficiency of the heat pipe and method. [Prior Art] With the trend of improvement in the performance of electronic components, high-powered products inevitably generate high temperatures during use, resulting in problems in product reliability (rel iabi 1 ty), designed by iC For example, while increasing wafer speed and density, chip designers are also facing heat dissipation problems of various products. In addition, in terms of LED modules used in electronic products, in order to maintain high power design, heat dissipation performance is achieved. The subject is also highly valued. In order to solve the problem of heat dissipation, in the past, a heat sink was attached to the surface of the heat-generating product to dissipate heat by heat conduction. However, due to the increasing heat generation of the product and the limitation of the volume of the product, the volume of the heat sink is not allowed to follow © The increase in heat generation of the chip increases, even in the trend of shrinking the design of the machine, the available space in the machine is limited, so that the volume of the heat sink is not increased or decreased, and in the case where the available space is limited and the heat dissipation efficiency is improved, it is necessary to Adopt heat pipe (H eatpipe) technology. The assembly between the components of the heat pipe is performed by welding. However, in the assembly process of the conventional heat pipe assembly, tin is used as the soldering solder, but in the trend of the south of the electronic component, the required dissipation is required. Thermal energy has also increased. However, due to the low melting point of tin and its insufficient thermal conductivity, it may not be able to keep up with the heat demand of electronic products at this stage. In addition, 201033565, the reliability of its finished products is open to question. The heat pipe used by Cheng Bu s needs to use flux for welding, and the internal system is empty to maintain its heat conduction efficiency. However, due to the current heat dissipation requirements of ❹, , -. The environment is slightly affected by the heat transfer efficiency of the heat pipe, which cannot meet the heat dissipation requirements of the current element. In the past, the heat transfer tube components were connected to the soldering method using the flux, which caused many disadvantages, resulting in internal vacuum. The environment is polluted, and the product yield of the heat pipe is reduced: the flux will deteriorate due to time, which will affect the service life of the heat pipe. Furthermore, the length of the heat pipe in the process is usually between 100mm and 〇0mm between 'and according to the requirements of the product specifications to cut, and then cut the end of the cut end, because the end of the shrinking seal is heat conduction and not in the heat conduction path' It is the ineffective end of heat conduction, but the existence of the ineffective end will reduce the heat conduction efficiency of the heat pipe. Therefore, the heat dissipation requirement of the high power electronic component cannot be achieved. In the above-mentioned 'heat conduction control process, whether it is tin as solder, using a welding sword or cutting the sealed body to form an invalid end, etc., will have a negative impact on the heat transfer efficiency of the heat pipe, if A heat conduction control system does not use tin as a solder, does not use a flux, and does not generate an ineffective end, thereby further improving the heat conduction efficiency of the heat pipe to meet the high heat dissipation requirements of the electronic product. SUMMARY OF THE INVENTION The present inventors have in view of the above-mentioned shortcomings of the existing heat conduction control process 201033565, and actively proceeded to study 'in order to solve the problem of insufficient heat conduction efficiency of the conventional heat pipe.' After continuous experimentation and efforts, the present invention was finally developed. . SUMMARY OF THE INVENTION A primary object of the present invention is to provide a welding apparatus and method for welding assembly using a copper-silver alloy and thereby improving the heat conduction efficiency of the heat pipe. In order to achieve the above object, the present invention is achieved by the following technical means, wherein the heat pipe alloy welding device of the present invention comprises: a soldering furnace 'an elongated structure whose one end is an input end and the other end is an output end' The method includes: a housing - consisting of a plurality of heat-resistant bricks having: an input end of the opening; and an output end of the opening corresponding to the opening of the input end; a rigid liner The system is disposed in the housing, and has: two openings ' corresponding to the input end opening and the output end opening of the housing respectively; a multi-stage soldering heater is disposed in the rigid lining and adjacent to At the input end, which has at least two heating elements, each heating element is wavy; and a cooler is disposed on the rigid lining and between the multi-stage soldering heater and the output end opening; The transmission device is coupled to the welding furnace, and has: an input table disposed beside the input end of the welding furnace; an output table disposed adjacent to the output end of the welding furnace And a conveyor belt looped around the input table, the welding furnace, and the 201033565 output table. The heat pipe alloy welding method of the present invention is used in the above-mentioned heat pipe alloy welding device, the method comprising: providing a heat pipe assembly; assembling the heat pipe assembly to form a combination; introducing a gas mixture, the composition of the gas mixture Including Ns, NH4, and H2 'The gas partial pressure ratio of each component in the mixed gas is 2: 1 : ® starts a multi-stage melting heater and cooler to preheat the temperature of the assembly to 1 800 Between °C and 2 2 ° ° C; placing the assembly on a transport device; melting the assembly to form a heat pipe having a fusion temperature between 7 8 〇 ° C and 8 2 0 t ; Cool the heat pipe 'cool its temperature to 150. (: to 300 ° C; and remove the heat pipe from the transfer device. © The present invention uses a copper-silver alloy as a solder for soldering the various components of the heat pipe.] Since the copper-silver alloy solder has excellent heat conduction The efficiency, therefore, replaces the tin tin used in the conventional one, which can improve the heat dissipation capacity of the heat pipe; furthermore, the invention does not need to use the flux for welding, so that the heat pipe can avoid the pollution of the vacuum environment in the pipe body during the manufacturing process. In addition, the heat pipe manufactured by the present invention is assembled by capping after the length (4) required for cutting the pipe body, and is not directly cut and sealed after cutting, so that the heat transfer is not effective. The end portion is more excellent in heat conduction efficiency. Therefore, the heat conduction 7 201033565 manufactured by the present invention can not only eliminate the defects caused by the tin solder and the flux, but also avoid the existence of the ineffective end by the above apparatus and method. In addition, it can improve the thermal conductivity to meet the heat dissipation requirements of high-powered electronic products, and can be applied to personal computers, LED packages, IC packages, and solar energy. [Embodiment] Referring to the first figure, the alloy welding device (1) of the heat pipe of the present invention comprises: a welding furnace (11) having an elongated structure with one end being an input end and the other end being an output end ,, The utility model comprises: a casing (111) consisting of a plurality of heat-resistant monuments, comprising: an input end with an opening; an output end of the opening corresponding to the opening of the input end; an internal diameter Connected to the channel 'between and between the input opening and the output opening; © a plurality of mixed gas introduction holes (iiii) distributed on the housing (1 1 1 ); a cooling medium input hole (11i2) ) is disposed on the housing (1 1 1 ) and adjacent to the output end; and a cooling medium discharge hole (1113) is disposed on the housing 1 1) and adjacent to the output end; The inner lining (112) is corresponding to and disposed in the inner radial passage, and has: two openings corresponding to the input of the housing (1 1 1 ), respectively, the opening of the end of the 201033565 opening and the opening of the output; « an interior wall , has: a plurality of mixed gas through holes, corresponding to The mixed gas introduction hole (1 1 1 1 ); two cooling medium through holes respectively corresponding to the cooling medium input hole (11 12) and the cooling medium discharge hole (1113); two sides; a top edge;平滑 a smooth bottom edge; a plurality of temperature control sensors (1 1 2 1 ) are radially distributed on the inner wall of the rigid lining (1 1 2 ); a plurality of nozzles are detachably respectively disposed on The mixed gas introduction hole (1 1 1 1 ) and the mixed gas through hole and communicate with a mixed gas introduction device; a multi-stage welding heater is disposed in the rigid liner (1 1 2 ) and adjacent to the An input end having at least two heating elements (1 work 4), each of the heating elements (1 1 4) being wave-shaped and disposed on a side edge and a top edge of the inner wall of the rigid liner (1 1 2) And a cooler disposed on the rigid lining (1 1 2 ) and interposed between the multi-segment welding heater and the output opening, having: at least one cooling element (1 15) Provided on the inner wall and connected to the cooling medium through hole; "at least one cooling medium input nozzle, And a cooling medium-discharge hole (1112); and at least one cooling medium discharge nozzle connected to the cooling medium 201033565 (1 1 1 3 ); m transmission device (12) coupled to the fusion A welding furnace (11) having: an input table (121) disposed beside the input end of the welding furnace (1 1 ), having: a platform 'separated parallel to the rigid liner (1 1 2) the smooth bottom edge has a front side, two side edges and a rectangular recess behind the front side, the front side is adjacent to the input end of the housing (1 1 i ); a second side of the platform extends downwardly; and a driving wheel is rotatably disposed between the platform and the two supporting legs, corresponding to a rectangular recess at the rear of the platform and disposed by the platform Motor drive; an output table (1 22) disposed beside the output end of the welding furnace (1 1 ), having: a platform parallel to the smooth lining of the rigid lining (i丄2) The side has a rear side, two side edges and a front side of a rectangular recess, the rear side is adjacent to An output end of the housing (1 1 1 ); " two support legs respectively connected to the two sides of the platform and extending downward; and a guide wheel rotatably disposed below the platform and the second support a rectangular recess between the feet and corresponding to the front of the platform; a conveyor belt (123), which is annularly wound around the (four) moving wheel into the table (1 2 1), the welding furnace (1 1), the output table ( / 2 2 ) and the guide wheel 'The conveyor belt (i 2 3 ) is a 201033565 steel mesh conveyor belt in this embodiment. Referring to the second figure, the alloy welding method of the heat pipe of the present invention comprises the following steps: assembly of the heat pipe (A); assembly of the heat pipe to form the assembly (B);
導入混合氣體（C)，該混合氣體之成分包括n2、N Η 4以及Η 2 ’該混合氣體中各成分之氣體分壓比率係為 2 ： 1 ： 1 ; Ο 啟動一多段熔焊加熱器及冷卻器（D)，以預熱該組 合件溫度至1 8 0。(：到2 2 0 之間； 放置該組合件於一傳輸裝置上（E); 熔焊該組合件以形成導熱管（F)，其熔悍溫度係介 於7 8 〇 °C至8 2 0。(：之間； 冷卻該導熱管（G)，使其溫度冷卻至1 5 〇它到3 0 0 °C之間；以及 自該傳輸裝置移除該導熱管（H) 之組件，該導熱管（2 (22) 〇 本發明之裝置及方法係適用於導熱管之合金焊接製程 中’首先’請參考第二圖及第三至五圖，提供導熱管⑴ 、一底板Introducing a mixed gas (C), the composition of the mixed gas includes n2, N Η 4, and Η 2 ' the gas partial pressure ratio of each component in the mixed gas is 2 : 1 : 1 ; Ο starting a multi-stage welding heater And a cooler (D) to preheat the temperature of the assembly to 180. (: between 2 2 0; placing the assembly on a transport device (E); welding the assembly to form a heat pipe (F) having a melting temperature of between 7 8 〇 ° C and 8 2 0. (: between; cooling the heat pipe (G), cooling its temperature to 15 〇 to 300 ° C; and removing the component of the heat pipe (H) from the transfer device, Heat pipe (2 (22) 装置 The device and method of the present invention are applicable to the alloy welding process of the heat pipe. First, please refer to the second figure and the third to fifth figures, and provide the heat pipe (1) and a bottom plate.
2)係包括一管體（2 1) 23)、一真空抽頭（24) 數個銅銀合金焊料等組件。2) includes a tube (2 1) 23), a vacuum tap (24), a number of copper-silver alloy solder and other components.
上端、一 )之管徑 业且畀有一 之下端的上表面，該上 以及複 壁以及-¾置於胃内壁之毛細結構。 (22)之面積係大於該管體（2 1 連結於該管艘（2 1 )之 201033565 表面具有一可供該管體（2 該封蓋（2 3)係設置 有一中央通孔（23 1)。 1)之下端設置之凹槽。 於該管體（2 1 )之上端並具 該真工抽頭（2 4)係設置於該中央通孔（2 3丄） 中並自該中央通孔（2 3 1 )往外延伸。 該銅銀合金焊料包括二大焊料環以及一小焊料環（2 6);該大焊料環包括-下焊料環（25A)以及一上焊 料環（2 5 B ) ^The upper end, a) of the tube diameter and has a lower end upper surface, the upper and the second wall and the capillary structure placed on the inner wall of the stomach. (22) The area is larger than the pipe body (2 1 is attached to the pipe of the pipe (2 1 ), and the surface of 201033565 has one for the pipe body (2 the cover (2 3) is provided with a central through hole (23 1) 1) a groove provided at a lower end. The upper end of the pipe body (2 1 ) and the real tap (2 4) are disposed in the central through hole (2 3 丄) and from the central through hole (2 3 1) extending outward. The copper-silver alloy solder includes two large solder rings and a small solder ring (26); the large solder ring includes a lower solder ring (25A) and an upper solder ring (2 5 B ) ^
e 其次，組裝該導熱管之組件以形成組合件（B)，此 步驟係先將該管體（2…下端裝設於該底板（22) 之上表面的凹槽上，再將該封蓋（2 3 )裝設於該管體（2 1 )之上端並且將該真空抽頭（2 4)裝設於該封蓋（2 3)之中央通孔（231)中；再將下焊料環（25a) 設置於該管體（2 i )之下端與該底板（2 2)之接合處， 將,焊料環（2 5B”没置於該管體（2 "之上端與該 封蓋（2 3 )之接合處並且將該小焊料環（2 6 )設置於 該真空抽頭（2 4)與該中央通孔（2 3 i )之接合處； 組裴完成後即形成組合件（2，）。 之後，請參考第一及二圖，導入混合氣體（c )，此 步驟係由一外部混合氣體導入裝置透過該混合氣體導入孔 (1 1 1 1 )與混合氣體通孔導入該溶焊爐（1 1 )中， 該混合氣體之成分包括N2、NH4以及H2，該混合氣體中 各成分之氣體分壓比率係為2:1:1。 接著’啟動一多段溶焊加熱器及冷卻器（D),此步 驟係由一加熱元件（1 1 4 )使該熔焊爐（1 1 )近輸入 12 201033565 . 端之溫度提升以預熱該組合件（2，）溫度至χ 8 〇 〇c到 2 2 Q C之間’藉此使得進人該溶焊爐（i i )之混合氣 體產生燃燒現象，使原本存在於該溶焊爐㈠㈠中大部 分的氧氣都隨著該混合氣體的燃燒而消耗進而達到預熱 該組合件（2，）以避免該組合件（氧化之目的。 然後，請參考第-、二及五圖，放置該組合件於一傳 輸裝置上（Ε)，此步称係將該組合件（2，）放置於該傳 輸裝置（1 2 )，並由該傳輸裝置（工2 )將該組合件（2，） ® 從該輸入工作台（1 2 1 )傳送進入該嫁焊爐（工工）。 再者，熔焊該組合件以形成導熱管（F)，此步驟係 由該加熱元件（i i 4 )將溫度提升至7 8 〇。(：至8 2 〇 °C之間而到達該銅銀合金焊料之熔點，在此熔焊過程中， 進入該溶焊爐（11)之混合氣體同樣產生燃燒現象，一 方面消耗氧氣以避免該組合件（2，）氧化，另一方面則透 過燃燒將該熔焊爐（i i )内的溫度維持在銅銀合金焊料 熔點之上，使原本為固態之銅銀合金填料熔化為液態以 ©滲入並填滿於該管體（2 i )與該底板（2 2)及封蓋（2 3 )之接合處缝隙以及該真空抽頭（2 4 )與該中央通孔 (231)之接合處縫隙’進而形成導熱管。 之後，凊參考第一、二、五及六圖，冷卻該導熱管（G )， 此步驟係由一冷卻器將該導熱管（2)之溫度降溫至i 5 〇 C到3 G G C m使填滿於該管體（2 i )與該底板 (2 2 )及封蓋（2 3 )之接合處縫隙以及該真空抽頭（2 4 )與該中央通孔（2 3 χ )之接合處縫隙的液態銅銀合 金填料冷卻固化，進而將各組件予以緊密結合。 13 201033565 最後，請參考第一、二及六圖，自該傳輸裝置移除該 導熱管（H)，此步驟係當該傳輪裝置（1 2)之傳輸帶 (1 2 3 )將冷卻固化後之導熱管（2 )傳送至該輸出工 作台（1 2 2 )後，經由自動化機具予以移除。 在整個製造過程中，不論是熔焊或者冷卻之步驟均 需要對於其溫度進行嚴密的控制，因此在該熔焊爐（i工） 中設有控溫感應器（i i 2 i )以便進行各步驟的溫度控 制。 ❹ 藉由上述之裝置及方法，本發明採用銅銀合金作為焊 接導熱管各個組件之填料’該銅銀合金填料之導熱效率更 優於習用的錫填料，並且不需要使用助焊劑而可避免導熱 管内真空環境遭受污染之虞，再者，使用本發明之合金焊 接裝置及方法製造出來的導熱管不會有無效端產生故本 發明可提升導熱管之熱傳導效率以符合高功率化電子產品 的散熱需求。 另外’透過本發明之裝置及方法所製程之導熱管，能 度㈣氏4“度的還原程序、溫度介於攝氏負 …5 〇度之間的冷熱衝擊（……I s 高、田〇=)測試以及溫度為攝氏3 0 0度歷時72小時之 L 獲得良好的可靠度，進而可適用於1C設計、 L ED模組或廢熱回收等領域。 此限者，僅為本發明之較佳實施例，當不能以 此限疋本發明實施之範 及發明說明書㈣g ’故’凡依本發明中請專利範圍 之簡單的等效變化與修飾，皆應仍 屬本發明專利涵蓋之範園内。 14 201033565 【圖式簡單說明】 第一圖係本發明導熱管之合金焊接骏署- 示 rg| 第二圖係本發明導熱管之合金焊接方 *、圖。 唆一 < 流程圖。 第二圖係本發明所製造之導熱管主要元件分解圖 第四圖係本發明所製造之導熱管主要元件與銅銀合金 焊料之分解圓。 第五圖係本發明所製造之導熱管裝設有銅銀合金烊料 狀態之示意圖。e. Next, assemble the assembly of the heat pipe to form the assembly (B). This step first installs the lower end of the pipe body (2... on the groove on the upper surface of the bottom plate (22), and then covers the cover. (2 3 ) is installed at the upper end of the pipe body ( 2 1 ) and the vacuum tap ( 2 4 ) is installed in the central through hole ( 231 ) of the cover ( 23 ); and then the lower solder ring (25a) ) is disposed at the junction of the lower end of the tube body (2 i ) and the bottom plate (22), and the solder ring (25B) is not placed on the tube body (2 " the upper end and the cover (2 3 And the small solder ring (26) is disposed at the junction of the vacuum tap (24) and the central via (2 3 i ); after assembly, the assembly (2,) is formed. Please refer to the first and second figures to introduce the mixed gas (c). The step is introduced into the welding furnace through an external gas introduction device through the mixed gas introduction hole (1 1 1 1 ) and the mixed gas through hole (1). 1), the composition of the mixed gas includes N2, NH4, and H2, and the gas partial pressure ratio of each component in the mixed gas is 2:1:1. Then 'start a multi-stage melting welding heating And the cooler (D), this step is to make the welding furnace (1 1 ) near the input 12 201033565 by a heating element (1 1 4 ). The temperature of the end is raised to preheat the temperature of the assembly (2,) to χ 8 〇〇c to 2 2 QC 'by this, the combustion gas entering the melting furnace (ii) is burnt, so that most of the oxygen originally present in the melting furnace (1) (a) is mixed with the mixture. The combustion of the gas is consumed to preheat the assembly (2) to avoid the assembly (for oxidation purposes. Then, please refer to Figures -, 2 and 5, placing the assembly on a conveyor (Ε) This step is to place the assembly (2,) on the transport device (1 2 ), and the assembly (2,) ® from the input table (1 2 1) by the transport device (2) Transferring into the welding furnace (worker). Further, the assembly is welded to form a heat pipe (F), and the step is to raise the temperature to 7 8 由 by the heating element (ii 4 ). 8 2 〇 ° C to reach the melting point of the copper-silver alloy solder, during the welding process, into the mixing furnace (11) mixture The body also produces a combustion phenomenon, on the one hand, oxygen is consumed to avoid oxidation of the assembly (2,), and on the other hand, the temperature in the furnace (ii) is maintained above the melting point of the copper-silver alloy solder by combustion, so that the original The solid copper-silver alloy filler is melted into a liquid state to permeate and fill the joint between the pipe body (2 i ) and the bottom plate (2 2) and the cover (23), and the vacuum tap (2 4 ) a gap with the central through hole (231) to form a heat pipe. Thereafter, referring to the first, second, fifth and sixth figures, the heat pipe (G) is cooled, and the step is performed by a cooler. (2) The temperature is lowered to i 5 〇C to 3 GGC m to fill the joint between the tube body (2 i ) and the bottom plate (2 2 ) and the cover (23) and the vacuum tap (2 4) The liquid copper-silver alloy filler in the gap with the central through hole (23 χ ) is cooled and solidified, and the components are tightly bonded. 13 201033565 Finally, please refer to the first, second and sixth figures to remove the heat pipe (H) from the transmission device. This step is when the conveyor belt (1 2 3) of the roller device (1 2) will cool and solidify. After the heat pipe (2) is transferred to the output table (1 2 2 ), it is removed via an automated machine. Throughout the manufacturing process, whether the steps of welding or cooling require strict control of the temperature, a temperature control inductor (ii 2 i ) is provided in the welding furnace for each step. Temperature control.藉 By the above apparatus and method, the invention adopts a copper-silver alloy as a filler for welding various components of the heat-conducting heat pipe. The copper-silver alloy filler has better thermal conductivity than the conventional tin filler, and does not require the use of a flux to avoid heat conduction. The vacuum environment inside the tube is polluted. Furthermore, the heat pipe manufactured by the alloy welding device and method of the present invention does not have an ineffective end. Therefore, the present invention can improve the heat transfer efficiency of the heat pipe to meet the heat dissipation of the high power electronic product. demand. In addition, the heat transfer tube manufactured by the apparatus and method of the present invention has a 4 (degree) reduction procedure and a thermal shock between the temperatures of 5 degrees Celsius (...I s high, field 〇 = Test and temperature of 30 ° C for 72 hours L to obtain good reliability, which can be applied to 1C design, L ED module or waste heat recovery, etc. This is only the preferred implementation of the present invention. For example, the invention should not be limited to the scope of the invention and the invention (4) g '故', and the simple equivalent changes and modifications of the scope of the patent in the present invention should remain within the scope of the invention. 201033565 [Simplified description of the drawings] The first figure is the alloy welding joint of the heat pipe of the present invention - showing rg| The second drawing is the alloy welding of the heat pipe of the present invention*, Fig. 唆一< Flowchart. The fourth element of the heat pipe main component manufactured by the present invention is a decomposition circle of the copper-silver alloy solder manufactured by the present invention. The fifth figure shows that the heat pipe manufactured by the present invention is provided with copper silver. Alloy material state Intentions.
第六圖係本發明所製造之導熱管成品示意圖。 【主要元件符號說明】 (1 )導熱管之合金焊接裝置 (1 1 )熔焊爐 (111)殼體 (1111)混合氣體導入孔 (1 1 1 2)冷卻媒介輸入孔 (1 1 1 3 )冷卻媒介排放孔 ❹ （1 1 2 )剛性裡襯 (1121)控溫感應器 (1 1 4)加熱元件 (11 5)冷卻元件 (1 2 )傳輸裝置 (1 2 1)輸入工作台 (1 2 2)輸出工作台 (1 2 3 )傳輪帶 (2 )導熱管 15 201033565 (2 1 )管體 (2 2 )底板 ( 2 3 )封蓋 (2 3 1 )中央通孔 (2 4 )真空抽頭 (2 5 A )下焊料環 (2 5 B )上焊料環 (2 6 )小焊料環 © ( 2 ’） 組合件 (A)提供導熱管之組件 (B )組裝該導熱管之組件以形成組合件 (C )導入混合氣體 (D) 啟動該多段熔焊加熱器及冷卻器 (E) 放置該組合件於該傳輸裝置上 (F )熔焊該組合件以形成導熱管 (G )冷卻該導熱管 〇 ( Η )自該傳輸裝置移除該導熱管 16The sixth drawing is a schematic view of the finished product of the heat pipe manufactured by the present invention. [Description of main component symbols] (1) Alloy welding device for heat pipe (1 1) Welding furnace (111) Housing (1111) Mixed gas introduction hole (1 1 1 2) Cooling medium input hole (1 1 1 3 ) Cooling medium drain hole 1 (1 1 2) rigid lining (1121) temperature control sensor (1 1 4) heating element (11 5) cooling element (1 2) transmission device (1 2 1) input table (1 2 2) Output table (1 2 3) transfer belt (2) heat pipe 15 201033565 (2 1) pipe body (2 2 ) bottom plate ( 2 3 ) cover (2 3 1 ) central through hole (2 4 ) vacuum tap (2 5 A ) Lower solder ring (2 5 B ) on the solder ring (2 6 ) Small solder ring © ( 2 ') Assembly (A) provides the assembly of the heat pipe (B ) assembles the components of the heat pipe to form a combination (C) introducing the mixed gas (D), starting the multi-stage welding heater and the cooler (E), placing the assembly on the conveying device (F) welding the assembly to form a heat pipe (G) to cool the heat conduction Tube (〇) removes the heat pipe 16 from the transfer device