201032293 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種防潮技術’更明確地說’係有關一種防止晶 片受潮之技術。 0 【先前技術】 請參考第1圖。第1圖係為一先前技術之晶片1〇〇之示意圖。 晶片100係為以錫球陣列封裝(BaU Grid Array, BGA)之晶片。晶片 1〇〇包含第一封裝體110、第二封裝體12〇以及晶粒(die)13〇。第一 封裝體110用來作為一製模混合物(m〇lding c〇mp〇un(j)，其主要目的201032293 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a moisture-proof technique, more specifically, to a technique for preventing moisture exposure of a wafer. 0 [Prior Art] Please refer to Figure 1. Figure 1 is a schematic diagram of a prior art wafer. The wafer 100 is a wafer in a BaU Grid Array (BGA). The wafer 1A includes a first package body 110, a second package body 12A, and a die 13A. The first package body 110 is used as a mold mixture (m〇lding c〇mp〇un(j), its main purpose
係用來保護晶粒no;第二封裝體丨㈣來作為—基板，其下方並 植入錫球(S〇lderball)B以讓晶片100能夠透過錫球B，連接於印刷 ^ nnt Circuit Board, PCB)_L ° 130 線=、、讀第—封裝體12〇、錫球B，與印刷電路板上的其他電 ^進行溝通。此外，第二封裝體120更用來承載晶粒130。 第二撕，糊來說，可為魏細物㈣； 3 201032293 140接合®。這樣的架構，容易在兩封裝體的接合面14〇產生縫隙， 而讓水氣進人，如第1圖所示。如此一來，將會造成晶片1〇〇的壽 命與可靠度減短，造成使用者的不便。 【發明内容】 本發明提供一種晶片防潮裝置，用以提升一晶片之防潮性。該 鲁 曰曰片包含一第一封裝體與一第二封裝體。該防潮裝置包含一防水 膠’塗佈於該第一封裝體與該第二封裝體，以提升該晶片之防潮性。 本發明另提供一種防潮晶片。該晶片包含一晶粒、一第一封裝 體，位於該晶粒之上、一第二封裝體，位於該晶粒之下，以及一防 湖裝置。該防潮裝置包含一防水膠，塗佈於該第一封裝體與該第二 封裝體’以提升該晶片之防潮性。 本發明另提供一種提升一晶片之防潮性的方法。該方法包含於 該晶片之外圍塗佈防水膠。 【實施方式】 請參考第2圖。第2圖係為根據本發明之第一實施例之具防潮 ^ 功能的晶片200之示意圖。第2圖係為晶片200之剖面圖。於第2 圖中’本發明係在晶片200之外圍，塗佈上防水膠210以作為晶片 4 201032293 - 200的防潮裝置。更明確地說，係在晶片200的四週，塗佈上防水 膠210。防水膠210的材質，舉例來說’可為液態的矽樹脂()或者環 氧基樹脂。如第2圖所示，在第一封裝體110與第二封裝體丨如之 間的縫隙(），被防水膠210披覆。從第2圖可清楚看出，第一封裝 體110之側邊與第二封裝體120之側邊之間形成一接合處，而防水 膠2i〇便塗佈於該接合處之上。如此一來，水氣將無法透過第一7封 裝體110與第二封裝體12〇的縫隙進入晶片200，造成晶片2〇〇損 ❹ 壞’而能夠延長晶片200的壽命與可靠度。 請參考第3、4、5圖。第3、4、5圖係分別為本發明之第一實 施例之具防潮功能的晶片200之俯視圖、仰視圖以及立體俯視圖。 於第3、4、5圖中’可看出本發明在晶片2〇〇的四週塗佈上防水膠 ，以阻絕水氣進入晶片朋。此外，第5圖中的虛線a a，所切割 出來的剖面圖即為第2圖。 ❹ 請參考第6圖。第6 _為減本發明之第二實施例 功能的晶片_之示意圖。第6圖係為晶片㈣之剖面圖。於第6 圖中，本發明係在晶片_之外圍，塗佈上 更明確地說，係在晶請的四週二 防水膠⑽的材質，舉例來說，可為液態的石夕 、、體110的上表面與第二封裝體12〇的下表面，以 5 201032293 更 '曰強曰曰片600的防潮性。此外，值得注意的是，由於第二封裝體 的二表面會植人錫球B，因此在塗佈防水膠㈣時須避開錫 、、、卩”卩免錫球B同樣被防水膠61〇披覆而無法與印刷電路 板連接換句„舌說，第二封裝體ls〇的下表面包含錫球植佈區與非 錫球植佈區’喊錫球植顧制來植人錫球。因此防水膠⑽僅 塗佈於第二封裝體12G之下表_非錫球植佈區。 ❿ ❹ 月參考第7、8、9圖。第7、8、9圖係分別為本發明之第二實 施=之具_舰的晶片_之俯酬、仰姻以及域俯視圖。 ^ 财可看出本發明在晶片200的四週以及上下表面 =佈上防水膠610贿絕水氣進入晶片_。此外第9圖中的 1線A-A所切割出來的剖面圖即為第6圖。 w…，〈弟一封裝體與第二封裝體，其材料並非 材料，第—封裝體與第二封裝體皆為相同 判斷為兩個㈣㈣=在接合面，於本發财仍會將該兩封裝體 佈将知，本發批麟餘於：將防水膠塗 於 主要塗佈的區域即為晶片低之類的情況。防水膠 月上暴路於外界的接面的部分，意即縫隙產 6 201032293 生處；更進-步地，防水膠可不僅僅塗佈於晶片之縫隙產生處，亦 可更廣泛地塗佈於晶片的其他區域，如晶片的上表面/下表面，但仍 需避開晶片欲與外界接觸的部分，以免造成接觸不良。如此便可更 提高晶片的_性。因此，本發明所適用之範圍，並非僅限於前述 之BGA封襄，而可應用於任何具有隙縫處之封裝結構。 _綜上所述’利用本發明所提供的防潮技術，可有效隔絕水氣， ❹、輕由晶片的縫隙而進入晶片内部，以提高晶片的耐潮性，提供給使 用者更大的便利性。 以上所述僅為本㈣讀佳實侧’凡依本發”請專利範圍 所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 苐1圖係為一先前技術之晶片之示意圖。 第2圖係為根據本發明之第一實施例之具防潮功能的晶片之示意 圖。 第3圖係為本發明之第一實施例之具防潮功能的晶片之俯視圖。 第4圖係為本發明之第一實施例之具防潮功能的晶片之仰視圖。 第5圖係為本發明之第一實施例之具防潮功能的晶片之立體俯視 圖。 第6圖係為根據本發明之第二實施例之具防潮功能的晶片之示意 7 201032293 圖。 第7圖係為本發明夕货 ^ 〈第二實施例之具防潮功能的晶片之俯視圖。 第8圖係為本發明之第二實施例之具防潮功能的晶片之仰視圖。 第圖係為本發明之第二實施例之具防潮功能的晶片之立體俯視 圖。 【主要元件符號說明】 100、200、600 晶片 110 第一封裝體 120 第二封裝體 130 晶粒 140 接合面 210、610 防水膠 G 導線 B 錫球The second package body (4) is used as a substrate, and a solder ball (B) is implanted underneath to allow the wafer 100 to pass through the solder ball B and be connected to the printed circuit board. PCB)_L ° 130 line =, read the first package - 12 〇, solder ball B, and communicate with other circuits on the printed circuit board. In addition, the second package 120 is further used to carry the die 130. The second tear, for the paste, can be Wei Wei (4); 3 201032293 140 joint®. Such an arrangement makes it easy to create a gap between the joint faces 14 of the two packages, and allows moisture to enter, as shown in Fig. 1. As a result, the life and reliability of the wafer will be shortened, causing inconvenience to the user. SUMMARY OF THE INVENTION The present invention provides a wafer moisture barrier device for improving the moisture resistance of a wafer. The cymbal includes a first package and a second package. The moisture-proof device comprises a waterproof glue applied to the first package and the second package to improve the moisture resistance of the wafer. The invention further provides a moisture resistant wafer. The wafer includes a die, a first package over the die, a second package under the die, and a lake protection device. The moisture barrier device comprises a waterproof glue applied to the first package and the second package to enhance the moisture resistance of the wafer. The present invention further provides a method of improving the moisture resistance of a wafer. The method includes applying a waterproof glue to the periphery of the wafer. [Embodiment] Please refer to Figure 2. Fig. 2 is a schematic view of a wafer 200 having a moisture-proof function according to a first embodiment of the present invention. Figure 2 is a cross-sectional view of wafer 200. In the second drawing, the present invention is applied to the periphery of the wafer 200 with a waterproof adhesive 210 applied as a moisture-proof device for the wafer 4 201032293-200. More specifically, the waterproof adhesive 210 is applied around the wafer 200. The material of the waterproof rubber 210 is, for example, a liquid enamel resin or an epoxy resin. As shown in Fig. 2, the gap () between the first package body 110 and the second package body is covered by the waterproof adhesive 210. As is clear from Fig. 2, a joint is formed between the side of the first package body 110 and the side of the second package body 120, and the waterproof rubber 2i is applied over the joint. As a result, moisture cannot enter the wafer 200 through the gap between the first 7 package 110 and the second package 12, causing damage to the wafer 2, which can extend the life and reliability of the wafer 200. Please refer to pictures 3, 4 and 5. Figs. 3, 4, and 5 are a plan view, a bottom view, and a perspective plan view, respectively, of the wafer 200 having the moisture-proof function of the first embodiment of the present invention. It can be seen in Figures 3, 4, and 5 that the present invention is coated with a water-repellent glue around the wafer 2 to prevent moisture from entering the wafer. Further, in the broken line a a in Fig. 5, the cut sectional view is the second drawing. ❹ Please refer to Figure 6. Fig. 6 is a schematic view of a wafer for reducing the function of the second embodiment of the present invention. Figure 6 is a cross-sectional view of the wafer (four). In the sixth drawing, the present invention is on the periphery of the wafer, and more specifically, the material of the waterproof rubber (10) around the crystal, for example, the liquid crystal, the body 110 The upper surface and the lower surface of the second package 12〇 are more resistant to the moisture resistance of the cymbal 600 by 5 201032293. In addition, it is worth noting that since the second surface of the second package will implant the solder ball B, it is necessary to avoid the tin, and 卩 when applying the waterproof glue (4). Draped and can not be connected with the printed circuit board to change the sentence „ tongue said, the lower surface of the second package ls〇 contains the tin ball planting area and the non-tin ball planting area' shouting tin ball planting system to implant the tin ball. Therefore, the waterproof rubber (10) is only applied to the surface of the second package 12G under the non-tin ball implantation area. ❿ ❹ Refer to Figures 7, 8, and 9. Figures 7, 8, and 9 are respectively the second embodiment of the present invention = the wafer of the ship_, the inverse, and the top view of the domain. ^ It can be seen that the present invention is on the periphery of the wafer 200 and on the upper and lower surfaces = the water-repellent adhesive 610 is bribed to prevent the moisture from entering the wafer. In addition, the cross-sectional view cut by the one line A-A in Fig. 9 is the sixth drawing. w..., "Different package and second package, the material is not material, the first package and the second package are the same judgment as two (four) (four) = at the joint surface, the two will still be the two The package cloth will be known, and the hairpin is used in the case where the water-repellent glue is applied to the main coated area, that is, the wafer is low. The part of the waterproof rubber on the junction of the outside world means that the gap is produced. In addition, the waterproof glue can be applied not only to the gap of the wafer but also to the wider area. Other areas of the wafer, such as the upper/lower surface of the wafer, but still need to avoid the part of the wafer that is intended to be in contact with the outside to avoid contact failure. This will increase the wafer's _ness. Therefore, the scope of application of the present invention is not limited to the aforementioned BGA seal, but can be applied to any package structure having slits. In view of the above, the moisture-proof technology provided by the present invention can effectively isolate moisture, and lightly enter the inside of the wafer from the gap of the wafer to improve the moisture resistance of the wafer and provide greater convenience to the user. The above descriptions are only for the (4) reading of the good side of the "Following the hair" of the scope of the patent to make the equivalent changes and modifications, should be within the scope of the invention. [Simplified description of the diagram] 苐 1 map is a previous BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a schematic view of a wafer having a moisture-proof function according to a first embodiment of the present invention. Fig. 3 is a plan view of a wafer having a moisture-proof function according to a first embodiment of the present invention. 4 is a bottom view of a wafer having a moisture-proof function according to a first embodiment of the present invention. FIG. 5 is a perspective top view of a wafer having a moisture-proof function according to a first embodiment of the present invention. Fig. 7 is a plan view of a wafer having a moisture-proof function according to a second embodiment of the present invention. Fig. 8 is a plan view of the wafer of the present invention. A bottom view of a wafer having a moisture-proof function according to a second embodiment of the present invention is a perspective view of a wafer having a moisture-proof function according to a second embodiment of the present invention. [Description of Main Components] 100, 200, 600 Wafer 110 First seal The second package body 120 130 140 grains waterproof glue G wire bonding 210,610 solder balls B