TW201030879A - Cleaning module for a substrate and apparatus for processing a substrate having the same - Google Patents

Abstract

In an apparatus including a cleaning module for cleaning a substrate, the cleaning module includes a transfer for transfer the substrate in a first direction and a cleaning block positioned adjacent to the substrate and extending in a second direction substantially perpendicular to the first direction. The cleaning block includes a first block for supplying a cleaning agent onto the substrate and a second block that is positioned at a side portion of the first block and sucks up the cleaning agent on the substrate. The first and second blocks are arranged in such a configuration that the cleaning agent flows on the substrate in a direction reverse to the first direction, so that the second block is positioned prior to the first block in the first direction.

Description

201030879 i wj〇iur/\ VI. Description of the Invention: [Technical Field] The present invention relates to a substrate processing apparatus and a cleaning module thereof, and more particularly to a cleaning module for a substrate of a flat display device and A substrate processing apparatus having the cleaning module. [Prior Art] Flat panel display devices are usually fabricated on a large substrate (e.g., a glass substrate) via different cell fabrication processes. For example, in the unit manufacturing process, the etching process, the removing process, the cleaning process, and the drying process are continuously performed on the substrate, so the substrate is continuously transferred to each of the program devices to execute each unit manufacturing process. In general, the program devices are continuously arranged in the order of the unit manufacturing program. For example, the program device includes a cleaning module that performs a cleaning process on the substrate, and a drying module that performs a drying process on the substrate. Conventional cleaning modules typically use a brush to remove contaminants from the substrate. However, due to the depression or deflection of the brush, contaminants on the edge portion of the substrate are not easily removed. In addition, conventional cleaning modules must be enlarged to accommodate the brush. Further, the brush may also provide different particles to contaminate the substrate. SUMMARY OF THE INVENTION The present invention is primarily directed to providing an innovative concept for providing a cleaning module that reduces volume and enhances cleaning capabilities. Providing a concept comprising the invention primarily provides an innovation, 3 201030879,

TW5810PA The substrate processing device for the above cleaning module. According to some embodiments of the inventive concept, a cleaning module includes a transmitter for transmitting a substrate in a first direction, and further comprising: a second direction disposed adjacent to the substrate and substantially perpendicular to the first direction Extended cleaning block. The cleaning block includes a first cleaning block for providing a cleaning agent on the substrate, and a second cleaning block disposed at an edge portion of the first cleaning block and for sucking the cleaning agent on the substrate. In one embodiment, the first cleaning block and the second cleaning block are disposed in a configuration that causes the cleaning agent to flow toward the substrate in a direction opposite to the first direction, thus the second cleaning zone in the first direction The block is set in front of the first cleaning block. In one embodiment, the first cleaning block includes a buffer space for receiving the cleaning agent, and the dense cell block is for supplying the cleaning agent to the substrate via the buffer space via the dense hole block. In one embodiment, the buffer space is defined by the side walls, the upper plate in contact with the side walls, and the dense hole blocks disposed in the lower portion of the side walls. In one embodiment, the first cleaning block includes a buffer space for receiving the cleaning agent, and the through opening is for supplying the cleaning agent from the buffer space to the substrate via the through opening. In one embodiment, the buffer space is surrounded by the side walls, the upper plate in contact with the side walls, and the through opening through the lower portion of the side walls. In one embodiment, the cleaning block further includes an air curtain block disposed at an edge portion of the first and second cleaning blocks, respectively, and the air curtain block supplies gas on the substrate, thereby providing a gas curtain on the substrate On the surface. In an embodiment, the air curtain block includes a buffer for accommodating air 201030879

The 1 ' J W^XIUFA space also includes a through opening for supplying gas from the buffer space to the substrate via the through opening. In the example of rw, the cleaning block includes an upper cleaning block disposed on the upper surface of the substrate, and a lower cleaning block disposed on the second surface, the upper block having substantially the same as the lower block. structure. Some embodiments of the invention provide a cleaning module, the device may include a cleaning process performed on the substrate, U pure (4) - riding a device for use, and also including a - cleaning model woman The 10,000-gate transfer substrate 'on the side of the first cleaning block' f-cleaning agent' also includes the cleaning agent on the substrate, and also includes the dry; the module process: and the first-drying block is used to provide The drying gas is applied to the second drying block disposed at the edge of the first drying block for the drying gas on the substrate. The first and the first adjacent to the substrate and substantially in the ancient "" Ghost sighs in an embodiment, the first 4 poor, * 槿, the visitor's total household and the first cleaning block are set to a knot ^, ^ ^ ^, the direction of the first direction causes the cleaning agent to flow to the substrate. Therefore, the second cleaning block is set in the first direction in the first direction, and the first direction is in the direction perpendicular to the first direction. rU ^ In a consistent embodiment, in an embodiment, the first receiving the cleaning agent further comprises supplying the substrate through the opening opening. The cleaning block comprises a buffer space for the mouth to pass the cleaning agent from the buffer space through the 201030879.

TW5810PA

In an embodiment, the cleaning module further includes: the air curtain is disposed at an edge portion of the first and second cleaning blocks, and the air curtain block provides gas on the substrate, thereby providing a gas curtain on the substrate surface. In the embodiment - the first and second drying blocks are arranged in a sturdy configuration, the structure is made to dry in a direction opposite to the first direction: 22 plates, so the second drying block is in the first side Upward setting ratio:;:; In the embodiment, the 'drying module further includes beforehand to perform the first step (4) before the drying process, and the setting is to use the front part of the block and provide dry gas on the substrate, An additional dry (four) 4 of dry olefin after the drying procedure is placed at the back and provides dry air on the substrate. Drying block The dry flat block includes a buffer space for accommodating, and the opening also includes a through-opening to allow dry air to be supplied to the substrate from the slow-opening opening. The left-handed-in the embodiment, the through-opening of the front block includes an upper port that extends vertically downward from the buffer space, and a lower through-opening σ connection: the opening 'and in a direction opposite to the first direction relative to Running through

Higher than the former portion: ==== dry air supplied by the block. In one embodiment, the first dry selection F accommodates the dry gas, and the dense-pore block allows the buffer space to be used for the dense-pore block supply. On the substrate. The block allows fine air to pass from the buffer space. In an embodiment, the first dry-drying block includes a buffer space for the 201030879 1 1 wjoiur eight-capacity drying gas, and the through-opening allows dry air to pass from the buffer space through the through opening Supply to the substrate. In one embodiment, the program device further includes a second cleaning module that performs the second cleaning process and is disposed between the cleaning module and the drying module. The second cleaning module extends upwardly on the substrate and includes an injection nozzle for spraying the cleaning agent onto the substrate via the injection nozzle. In one embodiment, the injection nozzle includes first and second plates, and the through opening is interposed between the pair of plates and extends in the second direction, and the cleaning agent is supplied to the substrate through the through opening of the ejection nozzle. In the first embodiment, the first supply line is for supplying the cleaning solution to the through opening, and the second supply line is for supplying the gas and connecting one of the plates such that the cleaning solution and the air are mixed with each other in the through opening, thereby Form a clean spray. In one embodiment, the injection nozzle includes a tip end portion adjacent to the substrate and a head portion remote from the substrate, and the first supply line is connected to a central portion of the board, and the second supply line is connected to the head of the injection nozzle. Part of the upper portion of the plate, so that the through opening extends downward from the head portion to the tip end portion, and the gas is supplied above the cleaning solution in the through opening of the injection nozzle. In an embodiment, the first plate includes a groove portion, and the second plate includes a protrusion for inserting into the groove portion of the first plate, so the through opening includes the groove portion and the protrusion The path changes. In one embodiment, the groove portion and the projection are disposed between the central portion and the end portion of the plate, and the end portion of the plate corresponds to the tip end portion of the injection nozzle. 201030879 1 W5»1UPA, (In one embodiment, the through opening has a first width around the tip portion, and the second width having a greater than first visibility is around the head portion, the cleaning solution and gas are throughout The open head portions are mixed with each other. According to the above innovative embodiment of the present invention, the first cleaning block is used to supply the cleaning agent on the substrate, and the second cleaning block is used to inhale the cleaning agent from the US board. Can be installed in the cleaning module, so it is enough to clean the efficiency. In addition, the 'first-cleaning module can be removed' further, the cleaning solution and gas can be formed in the _, the main combination - thus forming a uniform cleaning spray Fog. The substrate is used to replace the cleaning solution, minus the amount of liquid. The water π is the cleaning solution of the substrate further, the first drying zone plate, and the second drying block is used to supply the drying gas to the base. Installed in the drying module, so the drying gas can be further dried. The drying block can be extended in the center of the heart ==. The extension is sufficient to make the drying module scale the width of the transfer direction. Therefore, the program device Including the first and the stem_, the main, and enough, can be used to make the scale smaller and reduce the amount of drying and the amount of drying. And let the detergent and dry gas = make the above content of the present invention even more poor For example, in conjunction with the drawings, a detailed description will be given below. [Embodiment] Please refer to the formula, and the implementation of the present invention (4) is more fully disclosed as 201030879.

1 Γ I. However, the invention is applicable to a variety of different forms and should not be limited to the disclosed embodiments. The invention is susceptible to various embodiments and is not limited to the embodiments described herein. The embodiments described below are intended to provide a complete understanding of the invention, and may be fully understood by those of ordinary skill in the art. To more clearly illustrate the invention, the dimensions and associated proportions of layers and regions may be exaggerated by the explicit description. When the phrase "a component is placed on the other component" or "an element is connected or coupled to another component", one component can be directly disposed on another component or directly connected to another component. , or there is another element or intermediate layer between the two. In contrast, when the phrase "a component is directly above another component" or "a component is directly connected to another component", there are no other components or intermediate layers. Similar components are labeled with similar symbols. The phrase "and/or" used herein includes any and all combinations of the listed items. It will be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and sections, these terms should not be limited thereto. These terms are only used to distinguish one element, component, region, layer Therefore, the first element, component, region, layer, and portion described herein may be a second element, component, region, layer, and portion without departing from the invention. The space relative terms, such as "lower" or "upper" or the like, may be used to simply describe a component as depicted in the drawings, or a feature and another component or feature. relationship. It can be understood that these spatially relative terms are used to include descriptions of other orientations and are not limited by the orientation in the drawings. For example, when the device in the drawing is upside down, "a 9 201030879,,

The description of "i W^81UPA component is located under another component or feature" means "one component is above another component or feature". Therefore, the word "below" includes both "upper" and "lower". The elements can be oriented in other directions (rotated 90 degrees or toward other directions), and the space used herein is interpreted correspondingly to the words. The words used herein are merely illustrative of the embodiments of the invention and are not intended to limit the invention. The singular forms of "a", "an" and "the" are used in the s The features, integers, steps, operations, components or components described in the "comprising" and "comprising" are not intended to exclude other features, integers, steps, operations, components, components or combinations thereof. The embodiments of the present invention are described herein with reference to the accompanying drawings, and the accompanying drawings illustrate the preferred embodiments (and intermediate structures) of the invention. Thus, differences from the shapes of the drawings, for example, which are caused by manufacturing techniques and/or errors, are contemplated. The embodiments of the present invention should not be construed as limiting the shape of a particular region, but should include, for example, differences in the shape of the manufacture. The regions illustrated in the figures are only schematic and are not intended to depict the actual shapes of the regions of the device and are not intended to limit the scope of the invention. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning In addition, unless otherwise defined, the terms defined by the ordinary dictionary used herein are consistent with the meaning of the terms used in the related art, and are not intended to be idealized or overly formal. The embodiments and the associated drawings are explained in detail below. 1 is a schematic view of a substrate processing apparatus including a cleaning module of an embodiment consistent with the spirit of the present invention 201030879 1 vv iv/rrv. Hereinafter, the substrate processing apparatus may be simply referred to as a processing apparatus. Referring to Fig. 1, the processing apparatus 2 conforms to the embodiment of the present invention, and the substrate 4 such as a glass substrate of a flat display device (FPD) can be cleaned and dried. In an embodiment, the processing device 2 can include a processing chamber 6 that extends horizontally such that the substrate 4 can be transported horizontally via a plurality of rollers within the processing chamber 6. In an embodiment, the processing device 2 may include a first cleaning module 10 for performing a first cleaning process on the substrate 4, and a second cleaning module 40 for performing a second cleaning process on the substrate 4. And the drying module 50 is used to perform a drying process on the substrate 4. The processing chamber 6 can be divided into a first cleaning area, a second cleaning area and a drying area via the partitioning plate 8, so that the first cleaning module 10, the second cleaning module 40 and the drying module 50 can be respectively configured for processing a first cleaning zone, a second cleaning zone, and a drying zone of the cavity. In an embodiment, the first cleaning module 10 can include a first conveyor ® 12, an upper cleaning block 200, and a lower cleaning block 250. The substrate 4 is movable in the first direction via the first conveyor 12, and the upper cleaning block 200 and the lower cleaning block 250 are disposed in the first cleaning module 10, respectively, above and below the substrate 4. For example, the upper cleaning block 200 and the lower cleaning block 250 may extend substantially in a second direction perpendicular to the first direction and may be disposed adjacent to the upper and lower surfaces of the substrate 4. Fig. 2 is a plan view of the first conveyor of the first cleaning module of Fig. 1, and Fig. 3 is a front view of the first conveyor of Fig. 2. Referring to FIGS. 2 and 3, a plurality of rotating shafts 102 may be disposed in the first side 201030879 1 1 W3»iUKA 1 〇2 direction, such as the x direction of FIG. 2, in which the rotating shaft directions may mutually Separated by a gap distance. Each of the axes of rotation 102$ extends at a first *, ", such as the y-axis of FIG. 2, in such a configuration that the sleeves are rotated over the upper cleaning block 200 and the lower cleaning block 250. A plurality of transmissions may be mounted on each of the rotating shafts 102 and support the substrate 4° >#,4, in the processing of the driving unit 106' f s for driving the rotating shaft 102 and the outside of the true cavity 6. For example, the drive unit 〇6 may include a motor (not shown) for rotating the shaft. A plurality of first magnetic disks 1〇8 may be disposed on an outer surface of the side wall of the processing chamber 6, and a plurality of second magnetic disks 110 may be disposed at an end portion of the rotating shaft 1〇2, the end portion being referred to close to the processing The inner surface of the side wall of the cavity 6 and the opposite side of the outer surface just mentioned. The driving unit 106 is connected to the first magnetic disk 108. In particular, the bracket 112 facing the side wall of the cavity 6 provides a plurality of drive shafts U4, and = a magnetic disk 108 can be respectively coupled to the drive shaft 114, so that the magnetic disk 108 is driven by the drive shaft 114 rotates and rotates. The driven pulley il6 can be mounted on each of the drive shafts 114. The movable pulley 118, which can be coupled to the shaft of the drive unit 106, can be coupled to the driven pulley 116 via the belt 120. Further, the plurality of idlers 122 can be mounted to the bracket 112 and a uniform tension can be applied to the drive belt 120. The rotational power that is also applied to the ' drive unit 106 can be transmitted to the first magnetic disk via the active pulley ία, the driven pulley 116, and the belt 120, and a magnetic disk 108 can be rotated about its central axis. Therefore, the _th and the first magnetic disk 11? are rotated by the first magnetic disk 108 due to the magnetic force, and the axis is rotated. The second magnetic disk 108 rotates due to the rotation. 201030879 r 1 w^6iur/\ In an embodiment, the first magnetic disk 108 and the second magnetic disk 110 may include a plurality of magnetic groups (not shown). The magnetic group is disposed along the circumferential direction of the first magnetic disk 108 and the second magnetic disk 110, and the polarity of the magnetic group is selectively changeable in the circumferential direction. A groove 124 may be formed on the outer surface of the side wall of the processing chamber 6, so that the gap distance between the first magnetic disk 108 and the second magnetic disk 110 may be reduced. A plurality of brackets 126 can be configured and support the rotating shaft 102 within the processing chamber 6. ® Figure 4 depicts a cross-sectional view of the upper and lower cleaning blocks in Figure 1. Referring to Fig. 4, the upper cleaning block 200 has substantially the same structure as the lower cleaning block 250. For example, the upper cleaning block 200 may include a first cleaning block 210 for supplying a cleaning agent to the substrate 4, and a second cleaning block 220 disposed adjacent to the first cleaning block 210 and for drawing the substrate 4 The cleaner on it. The cleaning agent may include a cleaning solution and a mixture of the cleaning solution and other gases. In one embodiment, the first cleaning block 210 and the second cleaning block 220 may be disposed within the processing chamber 6, such that the cleaning agent flows toward the substrate in a direction opposite to the first direction, wherein One direction is the substrate transfer direction. In other words, the second cleaning block 220 may be disposed before the first cleaning block 210 along the substrate transport direction, and thus the second cleaning block 220 and the first cleaning block 210 are arranged in order along the first direction. In an embodiment, the cleaning agent can include deionized water. However, the above deionized water is only used to illustrate the cleaning agent, and thus does not limit the understanding of the present invention. 13 201030879 ,, 1 W^81UPA , therefore, the cleaning agent can flow to the substrate 4 in a direction opposite to the substrate transport direction, that is, from the first cleaning block 210 to the second cleaning block 220, thus using cleaning The agent cleans the contaminants on the substrate 4. In an embodiment, the air curtain block 230 may be disposed at an edge portion of the first cleaning block 210 and the second cleaning block 220, respectively. The air curtain block 230 can prevent contaminants from remaining in the area, wherein the area is between the substrate 4 and the first cleaning block 210 and the second cleaning block 220. Additionally, the air curtain block 230 can direct contaminants between the first cleaning block 210 and the second cleaning block and be drawn into the second cleaning block 220 to dry the substrate 4. In an embodiment, the first cleaning block 210 may include two first side walls > 212, the first upper plate 214 is in contact with the first side wall 212, and the dense hole block 216 is between the first side walls 212. The lower part. For example, the dense cell block 216 can comprise a dense pore material, such as carbon and stainless steel, which can be formed via a sintering process. Accordingly, the first cleaning block 210 can include a first buffer space 218 defined by the first side wall 212, the first upper plate 214, and the dense hole block 216. The cleaning agent may be housed in the first buffer space 218 of the first cleaning block 210 and supplied to the substrate 4 via the dense hole block 216. The cleaning agent can be uniformly supplied onto the substrate 4 because the first buffer space 218 is. For example, the dense cell block 216 can have a hole having a diameter of approximately 0.1 um to 5 um, and a supply line connected to a solution reservoir (not shown) can be coupled to the first upper plate 214. In an embodiment, the second cleaning block 220 may include two second side walls 222, a second upper plate 224 and a second buffer space 226 in contact with the second side wall, wherein the second buffer space 226 is second. Side wall 222 and second side 14 201030879 * iw jo iur / \ The second upper plate 224 of the upper portion of wall 222 is defined. The first through opening 228 can extend through a lower portion of the second side wall and can be coupled to the second buffer space 226. Therefore, contaminants cleaned on the substrate 4 via the cleaning agent can be drawn in together via the first through opening 228 and the cleaning agent. The contaminants and detergent may be inhaled uniformly through the first through opening 228 due to the second buffer space 226. A pump module (not shown) and a pump line can be further mounted to the second upper plate 224 for inhaling contaminants and detergents. When the above embodiment is disclosed, the second cleaning block 220 can include a first through opening 228 for inhaling contaminants and detergents, any other configuration or device, which is generally known in the art. Various changes and retouchments, such as the use or connection of the first through opening 228. For example, a plurality of holes can be used at different locations of the first through opening 228 to draw in contaminants and detergent. The holes may be spaced apart from each other by a fixed distance, and the lower plate may be further provided to the second cleaning block 220 to form a hole therein. In an embodiment, each air curtain may also include two third side walls 232, a third upper plate 234 that contacts the third side wall 232, and a third buffer space 236, wherein the third buffer space is third. The side wall 232 is defined by a third upper plate 234 at an upper portion of the third side wall 232. The second through opening 238 may extend through a lower portion of the third side wall 232 and may be coupled to the third buffer space 236. Therefore, a gas curtain is formed between the substrate 4 and the upper cleaning block 200 by the second through opening 238. The gas may be uniformly supplied to the substrate 4 by the third buffer space 236 of the air curtain block 230, and the third upper plate 234 may be connected to a gas supply (not shown). 15 201030879 (, 1 W^XIUPA, the lower cleaning block 250 may have substantially the same structure as the upper cleaning block 200 described above, so any description about the lower cleaning block may be omitted. Correspondingly, the cleaning agent may Rapidly flowing between the upper cleaning block 200 and the substrate 4 toward the upper surface of the substrate 4, and between the lower cleaning block 250 and the substrate 4 to the lower surface of the substrate 4, thereby increasing the cleaning efficiency on the substrate 4. In other words, The cleaning agent is disposed under the Coanda effect due to the flow path supplied from the first cleaning block 210 to the second cleaning block 220, so that the contaminant effectively removes and cleans the substrate. ❿ 4 〇 According to the embodiment of the present invention as described above, the substrate 4 can be cleaned by the upper cleaning block 200 and the lower cleaning block 250 from the beginning without using a brush, thereby effectively reducing the first cleaning The scale of the module 10. Figure 5 is a cross-sectional view depicting the upper cleaning block and the lower cleaning block modified in Figure 4. Referring to Figure 5, the modified upper cleaning block 300 may include a first cleaning block 310, Second cleaning area 320 and air curtain block 330. The second cleaning block 320 and the air curtain block 330 have substantially the same structure as the second cleaning block 220 and the air curtain block 230 described in Fig. 4. Therefore, afterwards The detailed description of the two cleaning blocks 320 and the air curtain block 330 may be omitted. In an embodiment, the first cleaning block 310 may include side walls 312, an upper plate 314 in contact with the side walls 312, and a buffer space 316. The buffer space 316 is defined by the side wall 312 and the upper plate 314 at the upper portion of the side wall 312. The through opening 318 can extend through the lower portion of the side wall and is coupled to the buffer space 16 201030879 * 1 vv w»oi ur r\ 316. Therefore, the cleaning agent can be supplied to the substrate 4 via the through opening 318. Due to the buffer space 316, the cleaning agent can be uniformly supplied to the substrate 4 via the through opening 318. The upper plate 314 can be connected to a solution reservoir (not shown). The through opening 318 of the first cleaning block 310 may extend downward from the buffer space 316, and the cleaning agent in the buffer space 316 may be supplied to the substrate 4 in a direction perpendicular to the upper surface of the substrate 4. Modified lower cleaning area Block 350 is substantially There is the same structure as the modified upper cleaning block 300, so any further description about the modified lower cleaning block 350 can be omitted. Referring to Figure 1, the second cleaning module 40 can perform a second cleaning. The program is on the substrate 4, and the substrate 4 has passed the first cleaning process of the first cleaning module 10. In an embodiment, the second cleaning module 40 can include a second transmitter 42 and an injection nozzle 400, via The injection nozzle 400 can be sprayed onto the substrate 4. The substrate 4 can be transported by the second conveyor in the first direction in the second cleaning module 40. The second transmitter 42 can have the same configuration as the first transmitter 12, so any further description about the second transmitter 42 can be omitted. The second cleaning module 40 can further include a first shower head 44 and a second shower head 46, and the cleaning agent can be supplied via the first shower head 44 and the second shower head 46. The injection nozzle 400 may be disposed between the first shower head 44 and the second shower head 46. Fig. 6 is a cross-sectional view of the injection nozzle in Fig. 1, and Fig. 7 is a side view of the injection nozzle in Fig. 1. Referring to Figures 6 and 7, the injection nozzle 400 may include two plates, 17 201030879 TW5XJWA i , i.e., the first plate 410 and the second plate 420, extending perpendicularly to the upper surface of the substrate 4. The first plate 410 and the second plate 420 may be connected to each other. Under such a structure, a through opening 430 may be formed between the first plate and the second plate. The cleaning agent can be sprayed onto the substrate 4 via the through opening 43. The ejection nozzle 400 may include a tip end portion T adjacent to the substrate 4, and a head region away from the substrate and opposite the tip end portion. Further, the injection nozzle 400 may include a sealing group 4〇2 between the first plate 41〇 and the second plate 420, and the sealing group is not shown in detail in FIG. The detergent leaks from the injection nozzle 4〇〇. The solution reservoir 440 can be coupled to the central portion of the first plate 410 via a solution supply line 442. Solution supply line 442 can pass through the first plate to extend through through opening 430. In the present embodiment, a plurality of solution supply lines may be connected to the central portion of the first plate 410. The gas reservoir 450 can be coupled to the head portion of the injection nozzle 400 via a gas supply line 452 and can provide gas to the injection nozzle 4A. In this embodiment, the gas supply line 452 can be coupled to the upper portion of the first plate 41A and can extend through the first plate 410 to the through opening 43A, thereby providing gas from the gas supply line 452 to the through opening 43〇. 'The cleaning agent supplied from the solution supply line 442 can be pushed down into the through opening 43A. In the present embodiment, a plurality of gas supply lines 452 may be coupled to the upper portion of the first plate 41''. In an embodiment, the first plate 410 can include a recessed portion 412, and the second plate 420 can include a protrusion 422 corresponding to the recessed portion. The groove portion 412 and the protrusion 422 may have a first width wi and a second width w2, respectively. When the first plate 410 and the second plate 420 are connected to each other, the protrusion 18 .201030879 ' 1 VV IV/r/Λ. The object 422 can be placed in the groove portion 412, so the first width w1 can be slightly larger than the second width w2. Since the path of the through opening 430 is changed due to the groove portion 412 and the projection 422, the cleaning agent can be uniformly incident on the substrate 4. In one embodiment, after the path of the through opening 430 caused by the recessed portion 412 and the projection 422 is changed, the through opening 430 can extend upward from the tip end portion T of the ejection nozzle 400 to the head portion. In particular, the path change through the opening 430 can be disposed below the central portion of the first plate and connected to the solution supply line 442. In other words, the groove portion 412 and the projection 422 may be disposed between the intermediate portion of the first plate 410 and the tip end portion of the injection nozzle 400. In other words, the through opening 430 may include a first through opening 432 that is connectable to the air supply line 452 and further includes a second through opening 434 that is connectable to the solution supply line 442 and further includes a third through opening 436 that is recessed The groove portion 412 and the protrusion 422 are defined, and further include a fourth through opening 438 defined by the first plate 410 and the second plate 420 which are projected from the tip end portion of the nozzle 400. For example, the cleaning agent and the gas may be mixed with each other at the second through opening 434. In the present embodiment, the first through opening 432, the third through opening 436, and the fourth through opening 438 may have a first gap, and the second through opening 434 may have a second gap larger than the first gap. The first gap has a range of approximately 0.05 mm to 0.1 mm, and the second gap has a range of approximately 0.1 mm to 1.0 mm. The cleaning agent and the gas may be mixed with each other, and a cleaning spray is formed at the second through opening 434 by the pressure of the cleaning agent and the air. Next, the second through opening 434 19 201030879

The cleaning spray in the TW5810PA passes through the third through opening 436 and the fourth through opening 438 and is uniformly incident on the substrate 4.

According to a modified embodiment of the present invention, the detergent ' supplied by the plurality of solution supply lines 442 and the gas supplied via the plurality of gas supply lines 452 are mixed at the second through opening 434, thus forming a uniform cleaning spray. Then, the cleaning spray can be incident on the substrate 4 via the third through opening 436 and the fourth through opening 438, wherein the third through opening 436 is defined by the groove portion 412 and the protrusion 422, thus being promoted on the substrate 4. The uniformity of the detergent. Referring again to FIG. 1, the drying module 50 can include a third conveyor 52, an upper drying block 500 and a lower drying block 55A. The third transmitter 52 may have substantially the same configuration as the first transmitter 12, and thus any further description about the second transmitter 52 may be omitted. The upper drying block 500 may be disposed above the base J.J-» 传输 transported by the third conveyor 52, so that the upper surface of the substrate 4 may be dried via the upper drying block 5〇〇. The upper drying block 5 〇〇 extends substantially in a second direction perpendicular to the ❹ ^ direction of the substrate 4 transport direction. In the present embodiment, the upper drying block 5 is disposed adjacent to the upper surface of the substrate 4. wheel. The lower drying block 550 may be disposed under the substrate 4 and passed through the second 52-passing wheel, so the lower surface of the substrate 4 may pass through the lower drying block 5: i In the present embodiment, the lower drying block 550 may have substantially The same structure as the = dry block. The lower drying block 55A may also be in the second third, the second direction being substantially perpendicular to the direction of transport of the substrate 4. In the present embodiment, the lower drying block 55A may be disposed adjacent to the lower surface of the fourth surface and parallel to the upper drying block 5''. 20 201030879 1 wj〇iur/\ Fig. 8 is a cross section of the upper drying block and the lower drying block in Fig. 8 . The drying block 5 (9) in Fig. 8 is substantially the same structure as the block 550. For example, the upper drying zone may include a dry (four) block 510 for supplying dry gas to the substrate 4, and further comprising a second: 20 series disposed adjacent to the first drying block and used for drawing into the substrate 4. Dry gas. In the embodiment, the first drying block 51G and the second drying block 520 are: 2 in the processing chamber 6 'which is configured such that dry air can flow toward the substrate in the opposite direction ::- The second drying block 520 of the first direction S substrate 2 can be disposed before the first drying block 5H along the substrate transport direction, and thus the second drying block 52 and the drying block 510 It is continuous and sequential in the first direction. In one embodiment, the drying gas may include a gas having a temperature of 1 degree c. However, the above gas is merely used to illustrate the cleaning agent of the present embodiment and is not intended to limit the understanding of the present invention. For example, an inert gas like V can be used to displace the gas. Therefore, the drying gas can flow to the substrate 4 in a direction opposite to the substrate transport direction, that is, from the first drying block 51 to the second drying block 520, so that the substrate 4 can be sufficiently dried by the drying gas. Further, minute contaminants remaining on the upper surface of the substrate 4 can be sufficiently removed by the drying gas. In an embodiment, the rear block 540 can be disposed on the back of the first drying block 510 so that the substrate 4 can be additionally dried by the dry gas 'ejected from the rear block 540. The front block 530 is disposed at the front of the second drying block 52 〇 21 201030879 t, so that the substrate 4 can be dried first by the drying gas passing through the front block 530. Therefore, the residual detergent on the substrate 4, such as deionized water, can be dried first, so that the detergent can be prevented from being introduced into the space between the upper drying block 500 and the substrate 4. In other words, the cleaning agent can be removed from the substrate prior to beginning the drying process of drying block 500. In an embodiment, the first drying block 510 can include two first side walls 512, a first upper plate 514 and a dense hole block 516 that are in contact with the first side wall 512, wherein the dense hole block is Below the first side plate 512. For example, the dense cell block 516 can comprise a dense pore material such as carbon and stainless steel that can be formed via a sintering process. Accordingly, the first drying block 510 can include a first buffer space 518 defined by the first side wall 512, the first upper plate 514, and the dense hole block 516. The drying gas may be housed in the first buffer space 518 of the first drying block 510 and may be supplied to the substrate 4 via the dense hole block 516. Therefore, the dry gas can be uniformly supplied onto the substrate 4 due to the first buffer space 518. For example, the dense hole block 516 may have a through opening having a diameter ranging from about O. lum to 5 um, and the gas supply line connected to the dry gas storage tank (not shown) may be connected to the first upper plate. 514. In an embodiment, the second drying block 520 can include two second side walls 522, the second upper plate 524 is in contact with the second side wall 522, and the second buffer space 526 is bounded by the second side wall 522 and The second upper plate 524 is defined by the upper portion of the two side walls 522. The first through opening 528 can pass through a lower portion of the second side wall 522 and can connect the second buffer space 526. Therefore, the drying gas can be drawn in through the first through opening 528. 22 201030879 * ι >ν *>〇 iur/Ί The dry air on the substrate 4 can be uniformly sucked through the first through opening 528 by the second buffer space 526. A vacuum module (not shown) and a vacuum line may be further mounted to the second upper plate 524 to draw dry air from the substrate 4. When the above embodiment is disclosed, the second drying block 520 can include a first through opening 528 for drawing in dry air, any other configuration or device, as is conventional in the art, when various changes can be made. With the retouch, like the use or connection of the position on the first through opening 528. For example, a plurality of holes can be used at different locations of the first through opening 528 to draw in dry air. The holes may be spaced apart from each other by a fixed distance, and the lower plate may be further provided to the second cleaning block 520 to form a hole thereon. In an embodiment, the front block 530 can include two third side walls 532, a third upper plate 534 and a third buffer space 536 that are in contact with the third side wall 532, wherein the third buffer space 536 is The three side walls 532 and the third upper plate 534 above the third side wall 532 are defined. The second through opening ® 538 can pass through the lower portion of the third side wall 532 and can be coupled to the third buffer space 536. The drying gas can uniformly supply dry gas to the substrate 4 due to the third buffer space 536 of the front block 530, and the third upper plate 534 can be connected to the dry gas storage tank. In the present embodiment, the second through opening 538 may include an upper through opening 538a extending vertically downward from the third buffer space 536, and further including a lower through opening 538b connected to the upper through opening 538a and opposite to the upper end 23 201030879 The TW5S10PA through opening 538a is inclined in a direction opposite to the substrate transfer direction. For example, the lower through opening 538b may have an inclined angle with respect to the upper surface of the substrate 4 and between about 60 and 80 degrees. In an embodiment, the rear block 540 can include two. The fourth fourth side wall 542, the fourth upper plate 544 and the fourth buffer space 546 are in contact with the fourth side wall 542, wherein the fourth buffer space 546 is surrounded by the fourth side 542 and the fourth side wall 542. The upper fourth upper plate 544 is defined. ~ me. The second through opening 548 can penetrate the lower portion of the fourth side wall 542 and can be connected to the fourth buffer space 546 干燥 The dry air can be uniformly supplied to the substrate 4 by the fourth buffer space 546 of the rear block 540, and the fourth The upper plate can be connected to a dry gas reservoir. The portion block 54 (four) third through opening 548 may extend vertically downward from the fourth buffer space 546, so that dry air may be vertically supplied onto the substrate 4. ◎ In the modified embodiment, from the rear section 54. The dry gas supplied (extra dry gas) is different from the dry gas f provided by the first dry series. For example, an additional gas supplied to the substrate has a temperature higher than that of the base gas. In the present embodiment, 'the temperature at which gas and nitrogen can be supplied to the substrate 4 is about 20 degrees C, and the additional dry gas has a temperature of about C. This is an additional dry* sequence on the substrate* and controls the temperature of the substrate 4. . In a further modified embodiment, the rear block 54A may include a close-hole block (not shown) below the fourth side wall for replacing the third through opening 24 201030879 548. Therefore, it is supplied to the substrate 4 through the rear block. The dense pore block of 540, the drying gas can be dried under the block 55 〇 | new, , ^ ) () can have substantially the same structure as the above-mentioned dry block 500, as described above, The detailed description of the drying block 550 can be omitted. The upper drying block 5 〇〇 and the lower drying block 55 〇 can be separated by the substrate 4, and the gap distance is between about 30 um and 100 um. In the present embodiment, the gap distance between the substrate 4 and the drying block 5 〇〇 Shoukou 55 大约 is approximately the field. The gap distance between the substrate 4 and the drying block 5 〇〇 * HO can be determined depending on the drying efficiency and the second cleaning efficiency of the contaminants on the substrate 4. Correspondingly, the gap distance between the substrate 4 and the drying block 5〇〇 and $ in this embodiment can be smaller than that between the conventional air knife and the substrate, so that the dry air can flow rapidly between the substrate 4 and the ', The distance from the space of 550, thus improving the drying efficiency on the substrate 4. ^Block S00 The flow path from which the dry gas is supplied from the first drying block 510 and then from the second, dry 520, so that the dry air is under the Coanda effect, so that the pollutants can be effectively Remove and second, effect 4. , μ clean substrate Figure 9 is a cross-sectional view of Figure 8. Medium modified upper cleaning block and lower cleaning area _ Referring to FIG. 9, the modified upper drying block 6〇〇 may include a first block 610, a second drying block 62〇, a front block 63〇, and a rear portion η . Dry can 640. The second cleaning block, the front block 63〇, and the rear block block 4G substantially 25 201030879 5 , 1W^81UPA * and the second cleaning block 520 and the front block 530 described in detail in FIG. It has the same structure as the rear block 540. Therefore, any further explanation regarding the second drying block 620, the front block 630, and the rear block 640 can be omitted later. In an embodiment, the first drying block 610 can include a side wall 612, an upper plate 614 that contacts the side wall 612, and a buffer space 616, wherein the buffer space 616 is the side wall 612 and the upper side wall 612 The upper board 614 is defined. The through opening 618 can extend through the lower portion of the side wall 612 and can be coupled to the buffer space 616. Therefore, dry air can be supplied to the substrate 4 via the through opening 618. Dry air may be supplied to the substrate 4 via the through opening 618 due to the buffer space 616. The upper plate 614 can be connected to a dry air reservoir (not shown). The through opening 618 of the first drying block 610 may extend vertically downward from the buffer space 616, and the dry air in the buffer space 616 may be supplied to the substrate 4 in a direction perpendicular to one of the upper surfaces of the substrate 4.修改 The modified lower cleaning block 650 may have substantially the same structure as the modified upper cleaning block, so any further description regarding the lower cleaning block 650 may be omitted. According to a concept of some embodiments of the present invention, a first cleaning block for supplying a cleaning agent to a substrate, and a second cleaning block for drawing a cleaning agent from the substrate may be mounted to the first cleaning module, thus being sufficiently Improve the cleaning efficiency of the cleaning module. In addition, the first cleaning block can be sufficiently removed by the removal of the brush 26 201030879

- I W551UPA becomes smaller. Further, the detergent and gas can be mixed in the second cleaning module to form a uniform cleaning spray. Therefore, the cleaning spray can be used to displace the cleaning agent to be supplied to the substrate. Thus, the amount of the cleaning agent used to clean the substrate is reduced.

Further, the first drying block for supplying the dry gas and the second drying block for drawing the dry air from the substrate can be mounted to the drying module, thereby sufficiently improving the drying efficiency of the drying module. Further, the drying module can be extended in the width direction of the substrate substantially perpendicular to the substrate transport direction, so that the drying module can be sufficiently reduced in size. Therefore, the program device includes the first and second cleaning modules, and the dry mold group can be sufficiently small, and the amount of clear_and dry (four) gas can be reduced. The description of the above embodiments does not limit the invention. A few embodiments are described, and the present invention belongs to the present invention, and the present invention does not deviate from the essence of the present invention; Retouching. Accordingly, all of the various modifications are possible within the scope of the invention. When applying for patents and modifications within the scope of the application, the means of function means are used to include the structure of the functions described herein, including the equivalents of the structures described herein, not only. The knowledge P of the different embodiments described above also includes its equivalent structure. The disclosure of the present invention is not limited to the scope of the invention, and the embodiments of the invention are not limited to the scope of the application and the scope of the disclosure. Therefore, the scope defined by the scope of the present invention shall prevail. 27 201030879

J W3SIWA [Simple Description of the Drawings] ^ ! ^ The scale includes a cleaning mold according to the embodiment of the present invention, and a schematic diagram of the substrate processing apparatus. Fig. 2 is a plan view showing the first conveyor of the first cleaning device of Fig. 1. Figure 3 is a front view of the first wheel former in Figure 2. Figure 4 shows the relationship! A cross-sectional view of the upper and lower cleaning blocks in the figure. Figure 5 is a cross-sectional view of the cleaning block and the lower cleaning block, not modified in Figure 4. Fig. 6 is a cross-sectional view showing the injection nozzle in Fig. 1 . Fig. 7 is a side view showing the injection nozzle in Fig. 1. Figure 8 is a cross-sectional view showing the upper dry block and the lower dry block in Fig. 1. And Fig. 9 is a perspective view showing the modification of the upper cleaning block and the lower cleaning block in Fig. 8. [Main component symbol description] 2 : Processing device 4 : Substrate 6 : Processing chamber 8 : Partition 10 : First cleaning module 12 : First transmitter 40 : Second cleaning module 42 : Second transmitter 44 : First shower head 28 201030879 * 1 w-Joiur/Λ

46: second shower head 50: drying module 52: third conveyor 102: rotating shaft 104: transport roller 106: drive unit 108: first magnetic disk 110: second magnetic disk 112: bracket 114: drive shaft 116: driven pulley 118: active pulley 120: transmission belt 122: idler 124: groove 126: bracket 200, 300: upper cleaning block 210, 310: first cleaning block 212, 512: first side wall 214, 514 : first upper plate 216, 516: dense hole blocks 218, 518: first buffer space 220, 320: second cleaning block 222, 522: second side wall 224, 524: second upper plate 226, 526: Second buffer space 228, 432, 528: first through opening 230, 330: air curtain block 232, 532: third side wall 234, 534 · · third upper plate 29 201030879

1 W^SIUKA 236, 536: third buffer space 238, 434, 538: second through opening 250, 350: lower cleaning block 312, 612: side wall 314, 614: upper plate 316, 616: buffer space 318 430, 618: through opening 400: injection nozzle 402: sealing group 410: first plate 412: groove portion 420: second plate 422: protrusions 436, 548: third through opening 438: fourth through opening 440: solution storage tank 442: solution supply line 450: gas storage tank 452: gas supply line 500, 600: upper drying block 510, 610: first drying block 520, 620: second drying block 530, 630: Front block 538a: upper through opening 538b: lower through opening 540, 640: rear block 542: fourth side wall 544: fourth upper plate 546: fourth buffer space 550, 650: lower drying block

Claims (1)

201030879 1. Vf - / U 1 VI VII. Patent Application Range: 1. A cleaning module 'used to clean a substrate, comprising: a transmitter for transmitting the substrate in a first direction; and a cleaning block' Adjacent to the substrate, and extending in a second direction, the second direction being substantially perpendicular to the first direction, the cleaning block comprising: a first cleaning block for providing a cleaning agent And a second cleaning block disposed on an edge portion of the first cleaning block for sucking the cleaning agent on the substrate. 2. The cleaning module of claim 1, wherein the first cleaning block and the second cleaning block are arranged such that the cleaning agent flows in a direction opposite to the first direction. On the substrate, in the first direction, a first cleaning block is disposed before the first cleaning block. 3. The cleaning module of claim 1, wherein the ®-cleaning block comprises: a buffer space for accommodating the cleaning agent; and a dense-pore block, the cleaning agent The dense hole block is supplied from the buffer space to the substrate. The cleaning module of claim 3, wherein the buffer space is a side wall, an upper plate contacting the side walls, and a lower portion disposed on the side walls The dense hole block is defined. 5. The cleaning mold according to claim 1, wherein the first cleaning block comprises: 31 201030879 ., 1 WM51UKA, a buffer space for accommodating the cleaning agent; and a through opening The cleaning agent is supplied from the buffer space to the substrate via the through opening. 6. The cleaning module of claim 5, wherein the buffer space is formed by two side walls, an upper plate contacting the side walls, and a lower portion disposed on the side walls. Defined through the opening. 7. The cleaning module of claim 1, wherein the cleaning block further comprises: a plurality of air curtain blocks respectively disposed in the first cleaning block and the second cleaning areas a plurality of edge portions of the block, the gas curtain block supplying gas to the substrate to supply an air curtain to a surface of the substrate. 8. The cleaning module of claim 7, wherein the air curtain block comprises: a buffer space for accommodating the gas; and a through opening through which the gas passes from the through hole A buffer space is supplied to the substrate. 9. The cleaning module of claim 1, wherein the cleaning block comprises: an upper cleaning block disposed adjacent to an upper surface of the substrate; and a lower cleaning block disposed adjacent to The lower surface of the substrate, the upper cleaning block and the lower cleaning block are substantially identical in construction. 10. A substrate processing apparatus comprising: a cleaning module, performing a cleaning process on the substrate and comprising: a first transmitter for transmitting the base 32 in a first direction 201030879 ' - 1 wj〇 Iwr/\ board; a first cleaning block is for supplying a cleaning agent on the substrate; and a second cleaning block is disposed at an edge portion of the first cleaning block and sucking the substrate The cleaning agent; the first and second cleaning blocks are disposed adjacent to the substrate and extend in a second direction, the second direction is substantially perpendicular to the first direction; and a drying module is attached Performing a drying process on the substrate and comprising: a first drying block for supplying a dry gas to the substrate; and a second drying block disposed at an edge of the first drying block Partially, and sucking the dry air on the substrate. 11. The device of claim 10, wherein the first and second cleaning blocks are arranged such that the cleaning agent flows onto the substrate in a direction opposite to the first direction such that In the first direction, the second cleaning block is disposed before the first cleaning block. The device of claim 10, wherein the first cleaning block comprises: a buffer space for accommodating the cleaning agent; and a dense hole block through which the cleaning agent passes A dense hole block is supplied from the buffer space to the substrate. 13. The device of claim 10, wherein the first cleaning block comprises: a buffer space for receiving the cleaning agent; and a through opening through which the cleaning agent passes from the through opening The device of claim 10, wherein the cleaning module further comprises: a plurality of air curtain blocks, respectively disposed on the buffer space 33 201030879 (the TW581UPA is provided on the substrate. a plurality of edge portions of the first cleaning block and the second cleaning blocks, the gas curtain block supplying gas on the substrate, thereby supplying a gas curtain on a surface of the substrate. The device of claim 10, wherein the first and second drying modules are arranged such that the gas flows upward on the substrate in a direction opposite to the first direction, such that the first direction is The second drying block is disposed in front of the first drying block. The device of claim 15, wherein the drying module further comprises: a front block, tied to Before the drying process, a preliminary drying process is performed, and the preliminary drying process is disposed at a front portion of the second drying block and supplies the drying gas to the substrate; and a rear block is dried After the program, an additional drying process is performed, and the additional drying process is disposed on a rear crotch portion of the first drying block and supplies the drying gas to the substrate. 17. As claimed in claim 16 The device, wherein the front block comprises: a buffer space for accommodating the dry gas; and a through opening through which the dry gas is supplied from the buffer space to the substrate. The device of claim 17, wherein the through opening of the front block comprises: 34 201030879 ' 1 vv i vr /λ an upper through opening extending vertically downward from the buffer space; And a through opening that connects the upper through opening and is inclined with respect to the upper through opening in a direction opposite to the first direction. 19. Patent Application No. 16 The device of the invention, wherein the temperature of the dry gas supplied from the rear block is greater than the temperature of the dry residual gas supplied from the front block. 20. According to claim 10 The device, wherein the Φ-dry block comprises: a buffer space for accommodating the dry gas; and a dense-pore block, the dry gas is supplied from the buffer space via the dense-pore block The device of claim 10, wherein the first drying block comprises: a buffer space for accommodating the drying gas; and a through opening, the drying gas The substrate is supplied from the buffer space through the through opening. 22. The device of claim 10, further comprising: another cleaning module that performs another cleaning procedure and is disposed between the cleaning module and the drying module, the other cleaning module The group extends in the direction of the substrate and includes an ejection nozzle through which the cleaning agent is sprayed onto the substrate. 23. The device of claim 22, wherein the injection nozzle comprises: 35 201030879 TW5810PA a first plate and a second plate; and - a through opening is attached to the first plate and the second plate Between and in the extension, the cleaning agent is supplied through the through opening of the injection nozzle. 24. The device according to claim 23, wherein the 管线G==line is used to provide a cleaning solution. Within the opening/opening, ·, and the medium-second supply line, connecting the first plate or the third gas 'to make the cleaning and mixing with the city body (four) 'form-clear; time fog. 25. "Please refer to paragraph 24 of the patent scope for nozzles including: /, A and a tip portion at the proximal end of the substrate; and the interface portion is attached to the distal end of the substrate and the first The supply line is connected to the central portion of the ejection jet and the second supply line is connected to the upper portion of the plate corresponding to the head portion of the door opening, so the spurting: sneezing: the squat extends to the a tip portion, and the gas remaining above the cleaning solution in the through opening of the mouth; a plate comprising the device of claim 25, wherein the first groove portion; And the second plate comprises: the penetrating two-out t' is used for placing the groove portion of the first plate, so that the diameter change Y port includes all the way caused by the groove portion and the protrusion 27. The device of claim 26, wherein the recess 36 201030879 * Λ. 9Ψ I \Jl slot portion is disposed in the first plate (four) the protrusion is disposed in the second ^ Between the end=parts, and between, the end portion of the first plate and the injection jet of the central portion and the bundle end portion The end portion of the tip portion is relative to the device described in claim 25, wherein the device has a -th-width around the mouth portion and a head: two; a gas width The width is such that the cleaning solvent and the φ rolling body are mixed with each other around the head portion in the opening of the teeth. 37