TW201038150A - Methods for manufacturing heat dissipation and insulated composite substrate and heat dissipation and insulated substrate thereof - Google Patents

Abstract

A method for manufacturing a heat dissipation and insulated substrate comprises the steps of: preparing at least one treated ceramic powder by hydrolysis-condensation reaction of at least one ceramic powder, wherein the at least one treated ceramic powder comprises a plurality of treated powder particles, each of which is grafted with an organic material; mixing the at least one treated ceramic powder, a polymer, and a curing agent to obtain a dielectric material; pressing the dielectric material through a slit to form a sheet-like substrate; and forming a first film and a second film on two sides of the sheet-like substrate so as to form the heat dissipation and insulated substrate, wherein the first and second films are a metal foil or mold-release film.

Description

201038150

4 I. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating substrate and a method of fabricating the same, and more particularly to a thermally conductive insulating polymer comprising an inter-penetrating-network (IPN) structure Thermal substrate for material and preparation method thereof. [Prior Art] In recent years, since the power of electronic components used in circuit boards in electronic devices has become higher and higher, thermal management problems caused by electronic components have become unnegligible. If the heat dissipation of the electronic components is poor, the electronic components will be in a high temperature state, and the temperature of the electronic components will be too high, which not only greatly reduces the performance of the electronic components, but also affects their lifetime and reliability. Therefore, the electronic device is often designed to use heat conduction. A good circuit board for providing a preferred heat dissipating ring for electronic components. The thermal conductive circuit substrate is prepared by coating a resin slurry obtained by mixing a liquid epoxy resin, a heat conductive filler and a curing agent onto a metal substrate. 'Ther is then heated to form a colloidal state (B-Stage), and finally made into a circuit board by thermocompression; or, after applying epoxy resin to the glass fiber cloth, 'heating to form a Β-stage 'A fiberglass circuit board was produced by a hot press process. The above-mentioned prior art process requires the use of a resin paste having a lower viscosity. However, the low-viscosity resin slurry may cause delamination of solids and liquids due to sedimentation of the thermally conductive filler, which may cause uneven mixing and thus affect The heat dissipation efficiency is also a problem that the resin slurry is also difficult to store. The circuit board made of glass fiber has a low thermal conductivity due to the glass fiber (about

136097.DOC 4 201038150 « > W/mK ), so its thermal conductivity is not good. In addition, the above-mentioned prior art processes use a coating process, however, the coating process has problems such as slow speed and low yield. In summary, the fabrication of the thermally conductive circuit substrate of the prior art utilizes a coating process: the coating process is slow, the yield is low, and because of the need to use a low-viscosity resin slurry, solid and liquid stratification is liable to occur. problem. In addition, since the thermal conductivity of the glass fiber is low, the heat dissipation effect of the circuit board made of glass fiber is not good. Therefore, there is still a need for a heat-conducting circuit substrate having high thermal conductivity and a method of manufacturing the thermally conductive circuit substrate capable of mass-producing the high thermal conductivity. SUMMARY OF THE INVENTION The present invention provides a thermally conductive insulating substrate and a thermally conductive insulating composite substrate prepared by using the thermally conductive insulating substrate, and a method for fabricating the same, wherein the thermally conductive insulating substrate is rubbery in a property having an interpenetrating structure (rubbery It is made of the 'edge material, which has high thermal conductivity and does not cause delamination of the solid body and the liquid, and can be produced by extrusion, so that the speed of preparation thereof can be improved. A first aspect of the present invention discloses a method for preparing a thermally conductive insulating substrate, comprising the steps of: performing a hydrolysis condensation reaction on at least one ceramic powder to obtain at least a modified ceramic powder, wherein each of the at least one modified Tao Jing powder comprises a plurality of modified powder particles, and a surface grafting-organic compound of each of the modified powder particles; mixing the at least one modified ceramic powder, a polymer material and a curing agent to obtain an insulating material; The material is extruded through a slit to form a plate-shaped substrate; and the first film 136097.DOC 5 201038150 t » material and the first film are respectively disposed on the two plates of the plate-like substrate, thereby forming the The thermally conductive insulating substrate, wherein the first film and the second film are selected from a metal material or a plastic material. A second aspect of the invention discloses a method for preparing a thermally conductive and insulating composite substrate, which comprises the steps of: performing a hydrolysis condensation reaction on at least one ceramic powder to obtain at least one modified ceramic powder, wherein each of the at least one ceramic powder comprises a plurality of powders And granules, after the hydrolysis condensation reaction, the surface of each of the modified powder particles is grafted with an organic compound; the at least one modified ceramic powder, a polymer material and a curing agent are mixed to obtain an insulating material, Extruding the insulating material through a slit to form a plate-shaped substrate; disposing a metal material on one of the plate-shaped base materials; and cutting the plate-shaped base material having the metal material to be thermally conductive and insulating And forming a thermally conductive insulating substrate at a pressing temperature to form the thermally conductive insulating substrate. [Embodiment] FIG. 1 shows a flow of a method for preparing a thermally conductive and insulating composite substrate according to an embodiment of the present invention. schematic diagram. An embodiment of the present invention discloses a method for preparing a thermally conductive and insulating composite substrate, the method comprising the steps of: performing a hydrolysis condensation reaction on at least one ceramic powder in step S11 to obtain at least one modified Taowan private, medium, Each of the granules contains a plurality of modified powder particles, and the surface of the modified powder particles is grafted with an organic compound. In one embodiment, the organic compound is an organic stone, and the hydrolysis condensation reaction is carried out in an acidic environment, and the organic stone is reacted with the at least one ceramic powder; in another embodiment, the organic The compound is organic and the hydrolysis

I36097.DOC 6 201038150 t * The condensation reaction is carried out by reacting the at least one ceramic powder with organic titanium in an acidic environment', and in the acidic environment of the above two examples, the acid value is about PH 1 to PH 5 between. In step S12, the at least one modified ceramic powder is mixed with a colloidal molecular material and a curing agent to obtain an insulating material, wherein the insulating material has a thermal conductivity greater than 0.5 W/mK. In step S13, the insulating material is extruded through a slit to form a plate-like substrate, wherein the insulating material is extruded through the slit at a temperature of 5 to 15 (TC). In S14, a first film material and a second film material are disposed on each of the two plate surfaces of the plate-shaped substrate. The first film material and the second film material may respectively comprise a release material and a metal material. The first film material The combination of the plate-shaped substrate and the second film (the first film/plate-like substrate/second film) may comprise a release profile/plate-like substrate/release profile (ie 'prepreg substrate'), metal material/ a different Q combination of a plate substrate/release material (ie, resin coated metal substrate) and a metal material/plate material/metal material (ie, metal core substrate). In step S15 Cutting the plate-shaped substrate of the first film and the second film into a heat-conductive insulating substrate, and the heat-conductive insulating substrate can be laminated with other metal substrates or printed circuit boards to form a single-panel, double-panel, metal core plate or multi-layer substrate Compressing a thermally conductive and insulating composite substrate at a pressing temperature, and The bonding temperature may be between 80 ° C and 220 ° C. In step S16, the thermally conductive insulating composite substrate is trimmed by a molding technique, wherein the molding technique includes cutting, shearing, punching, diamond cutting, etc. The composition of the polymer material comprises a thermoplastic and a thermosetting epoxy, and the thermosetting epoxy resin 136097.DOC 7 201038150 t · can occupy the volume of the polymer material The percentage is between 7〇% and 97%. The thermosetting epoxy resin can be cured by the curing agent at a curing temperature, wherein the curing temperature can be higher than 8 ° C. The method of mixing the insulating material firstly heats the molecular plastic material comprising the thermoplastic plastic enamel and the thermosetting epoxy resin by heating for about 30 minutes to form a uniform colloid. The ceramic powder is added to the uniform colloid and uniformly mixed to form a uniform rubber-like material, and the uniform rubber-like material is added to the crucible curing agent and the accelerator at a temperature of 80 ° C to form an insulating material, wherein the uniform rubber Material Inter-penetrating netw〇rk, and because the thermoplastic plastic and the thermosetting epoxy resin are mutually soluble and in a uniform phase (h〇m〇gene〇us), thereby making the ceramic The powder is uniformly dispersed in the interpenetrating structure to achieve an optimal heat conduction effect. The ceramic powder is uniformly dispersed in the polymer material, and the ceramic powder accounts for about 4% by volume of the insulating material to Between 70%. The thermoplastic plastic mentioned above may be an ultrahigh molecular weight phenoxy resin, wherein the molecular weight of the ultrafine molecular weight phenoxy resin may be greater than 30000<> the thermoplastic plastic may also contain a hydroxyl group. A phenoxy resin ether polymer structure in which the hydroxy-phenoxy resin ether polymer structure can be polymerized by reacting a diepoxide with a difunctional group. The thermoplastic plastic can be formed by reacting liquid epoxy resin with bisphenol A, liquid epoxy resin and divalent acid, liquid epoxy resin and amine. The above thermosetting epoxy resin may comprise an uncured liquid epoxy resin, a polymerized epoxy resin, a phenolphthalein epoxy resin or a phenolphthalein resin. 201038150 Λ .· Due to the characteristics of thermoplastic plastics, the thermal conductive insulation material can be formed through a thermoplastic plastic process, and because it contains a thermosetting plastic, it can be cured and crosslinked at a high temperature to form a thermoplastic plastic and heat. The structure of solid plastic cross-penetration, this structure can not only have the characteristics of thermosetting plastic with high temperature resistance, but also the characteristics of thermoplastic plastic which is not tough and brittle, and can be strong with metal electrodes or substrates. . Referring to FIG. 2Α 'on both sides of the thermally conductive insulating substrate η, one board surface may be provided with a printed circuit board 12, and the other board surface may be provided with a metal substrate 11 to 1.5 mm, and the laminated structure may be utilized A hot press is 2 inches. The crucible is formed by press-bonding at a pressure of 25 kg/cm2 to form a thermally conductive and insulating composite substrate 10. In one embodiment, the metal substrate can be a substrate, and the laminated composite substrate is a single-sided, double-layer aluminum substrate. The printed circuit board 12 may be of a composition having a patterned metal material 14 on at least one surface of the thermally conductive insulating substrate π. Referring to FIG. 2B, a metal material 15 is disposed on one surface of the heat-conductive insulating substrate, and a metal material 16 is disposed on the surface of the heat-insulating substrate. The metal material 15 is thermally conductive. The metal material 16 of the insulating substrate 11 is passed through 2〇〇〇c 90. After a minute of hot pressing (and controlling its thickness, for example, 〇5 mm), another aspect of the thermally conductive insulating composite substrate 10' having a thickness of 0.2 mm is formed, that is, a single-sided metal substrate. The metal material 15, the metal substrate 16 and the thermally conductive insulating substrate u are in physical contact with each other and have a thermal conductivity greater than 0.5 W/mK. The thermally conductive and insulating composite substrate has a thickness of less than 0.5 mm and can withstand a voltage greater than 1 volt. Referring to FIG. 2C, the thermally conductive insulating substrate U can be laminated with a plurality of different metal materials 15, and the synthetic metal material 15 / the thermally conductive insulating substrate u / the metal material 15 / the thermally conductive insulating substrate 11 / the metal material 15 are then hot pressed to form a metal core. Substrate structure. 136097.DOC 9 201038150 * · When the above-mentioned thermal compression bonding process is carried out, the sheet-like thermally conductive and insulating composite material does not undergo delamination because it has a parent interpenetrating structure. The materials of the foregoing metal materials are selected from the group consisting of copper, aluminum, nickel, copper alloys, aluminum alloys, nickel alloys, copper-nickel alloys and aluminum-copper alloys. The sheet-like thermally conductive insulating composite material has a rubbery appearance (non-resin) and thus has characteristics of convenient storage and processing. In addition, the thermally conductive and insulating composite material can be processed by a processing method generally used for thermoplastic molding, thereby improving the workability. In the polymer material used in the present invention, the thermoplastic plastic and the thermosetting ring-shaped milk tree are substantially mutually mutuaiiy soluble. "Substantially mutually soluble" means that a solution of a single glass transition temperature is formed when the thermoplastic plastic and the thermosetting epoxy resin are mixed. Because the thermoplastic plastic and the thermosetting epoxy resin are mutually soluble, when the two are mixed, the thermoplastic plastic knee will be dissolved into the thermosetting epoxy resin, so that the thermoplastic plastic is entangled. The glass transition temperature is substantially reduced and allows mixing of the two to occur below the normal softening temperature (n〇rmal s〇ftening temperature) of the thermoplastic. The resulting mixture (i.e., the polymer component) is rubbery (or solid) at room temperature and is easy to weigh and store. For example, even if the thermosetting epoxy resin is a liquid epoxy resin, the mixture formed after mixing with the thermoplastic plastic can be made into a leather-like tough film (tough) although it is not liquid. Leathery Him). At 25. Under the armpit, the mixture has a relatively high viscosity coefficient (about 105 to 1 〇 7 poise), which prevents the polymer component from being settling or redistributing 10 201038150 An important factor. In addition, the mixture has a sufficiently low viscosity coefficient (about 1〇4 to 1〇5 poise at 60 ° C) at a temperature at which mixing is generally carried out (about 40 ° C to 100 ° C), so that added The curing agent and the ceramic powder can be uniformly distributed in the mixture and reacted. A wide variety of examples of such mixtures can be found in PCT Patent Publication No. WO 92/08073 (published May 14, 1992), which is incorporated herein by reference. The curing temperature of the curing agent in the thermally conductive insulating polymer material of the present invention is higher than 100 ° C for curing (ie, crosslink)

Or catalytic polymerization) the thermosetting epoxy resin. The curing agent rapidly cures the thermosetting epoxy resin at a temperature higher than the mixing temperature Tramix, wherein the mixing temperature Tmix refers to the temperature at which the thermoplastic plastic, the thermosetting epoxy resin, and the curing agent are mixed. And the mixing temperature Tmix is generally from about 25 ° C to 100 ° C. When the curing agent is mixed at the mixing temperature Tmix, a substantial curing is not initiated. In the present invention, the amount of the curing agent is such that the thermosetting epoxy resin is cured at a temperature higher than the Q mixing temperature. Preferably, the curing agent does not initiate the substantial curing process at less than about 100 ° C and causes the thermally conductive insulating polymeric material to remain substantially uncured at 25 ° C for at least half a year. . In addition to the above, the thermoplastic plastic of the present invention may also be selected from a substantially non-crystalline thermoplastic resin. For the definition, please refer to "Saechtling International plastic Handbook for the Technology, Engineer and User, second

Edition, 1987, Hanser Publishers, Munich" Page 1. "Substantially non-201038150 s crystallization" means that the "crystallinity" portion of the resin accounts for at most 15%, preferably at most 10%, in particular at most 5%, for example: 0 to 5°/ The crystallinity of bismuth. The substantially amorphous thermoplastic resin is a high molecular weight polymer which exhibits a rigid or rubbery at room temperature, and is used in an uncured state of the polymer component. To provide properties such as strength and high viscosity. The volume percentage of the substantially amorphous thermoplastic resin in the polymer component is generally from 10% to 75%, preferably from 15% to 60%, particularly from 25% to 45%. The substantially amorphous thermoplastic resin may be selected from the group consisting of polysulfone, polyethersulfone, polystyrene, polyphenylene oxide, polyphenylene sulfide, Polyamide, phenoxy resin, polyimide, polyetherimide, polymyimide and ketone block copolymer (polyetherimide/ Silicone block ^ copolymer), polyurethane, polyester, polycarbonate, acrylic resin (eg polymethyl methacrylate) , styrene / Acrylonitrile and styrene block copolymers ° ° The thermoplastic may optimally comprise monohydroxy-phenoxy resin ether (hydroxy - Phenoxyether) polymer structure. The trans-p-phenoxy resin ether is polymerized by a suitable mixture of a diepoxide and a difunctional species (stoichiometric 136097.DOC 12 201038150 * mixture). Made. The diepoxide is an epoxy resin having an epoxy equivalent weight of from about 100 to about 10,000. For example: diglycidyl ether of bisphenol A, diglycidyl ether of 4,4'-sulfonyldiphenol, diglycidyl ether of 4,4'-oxydiphenol, diglycidyl ether of 4,4'-dihydroxybenzophenone, Diglycidyl ether of hydroquinone A diglycidyl ether of 9,9-(4-hydroxyphenyl)fluorine. The bifunctional species is a dihydric phenol, a dicarboxylic acid, a primary amine, a dithiol, a disulfonamide or a secondary amine. (bis — secondary amine). The binary may be selected from 4,4'-isopropylidene bisphenol (bisphenol A), 4,4'-sulfonyl diphenol, 4,4'-oxydiphenol, 4,4'-dihydroxybenzophenone or 9,9-bis (4-hydroxyphenyl) ) fluorene. The ditopolic acid may be selected from the group consisting of isophthalic acid, terephthalic acid, 4,4'- biphenylenedicarboxylic acid or 2,6-naphthalenedicarboxylic acid. The bis-second amine can be selected from the group consisting of piperazine, dimethylpiperazine or 1,2-bis(N-methylamino)ethane. The primary amine may be selected from the group consisting of 4-methoxyaniline or 2-aminoethanol. The dimercapto compound can be 4,4'-dimercaptodiphenyl ether. The disulfonamide may be selected from the group consisting of N, N'-dimethyl-1,3-benzenedisulfonamide or hydrazine, Ν1-bis(2-hydroxyethyl)-4,4-biphenyldisulfonamide I I36097.DOC 13 201038150, the bifunctional species may also be Contains two mixtures of different functionalities that can react with the epoxide group; for example; salicylic acid and 4-hydroxybenzoic acid. The thermoplastic plastic in the thermally conductive insulating polymer material of the present invention may also be selected from the group consisting of a liquid epoxy resin and a bisphenol A, a bisphenol F or a bisphenol S product ( Reaction product), a liquid cyclic oxime resin and a product of diacid (diacid) or a liquid epoxy resin and an amine product. The thermosetting epoxy resin in the thermally conductive insulating polymer material of the present invention may be selected from the materials described in Table 1, and may be selected from "Saechtling International plastic Handbook for the Technology, Engineer and User, Second Edition, 1987, Hanser Publishers. , thermosetting resin as defined on pages 1 and 2 of Munich". The volume percentage of the thermosetting resin in the polymer component is generally from 90% to 25%, preferably from 85% to 40%, particularly from 75% to 55%. And the volume ratio of the substantially amorphous thermoplastic resin to the thermosetting resin in the polymer component is about 1:9 to 3:1. The thermosetting resin preferably has a functional group of more than 2. The thermosetting resin exhibits a liquid or solid state at room temperature. If the thermosetting resin is cured without adding a thermoplastic resin, the thermosetting resin will exhibit a rigid or rubbery shape. A preferred thermoset resin is an uncured epoxy resin, particularly an uncured liquid epoxy resin defined in ASTM D 1763. For liquid epoxy resins, please refer to "Volume 2 I36097.DOC 14 201038150 « of Engineered Materials Handbook,Engineering

Plastics, published by ASM International", pages 240-241. The term "epoxy resin" means a conventional dimeric epoxy, an oligomeric epoxy or a polymeric epoxy resin comprising at least two epoxy functional groups. Polymeric epoxy). The type of the epoxy resin may be a product of bisphenol A and epichlorohydrin, a phenol and a formaldehyde, which is a type of varnish resin (novolacresin). Products, epichlorohydrin, cycloaliphatic, peracid epoxy and glycidyl ester, epichlorohydrin and p-amino The product of phenol), the product of epoxide and glyoxal tetraphenol, the acid: novolac epoxy or bisphenol A epoxy. Commercially available epoxidic esters are preferably 3,4 - epoxycyclohexyl methyl 3,4 - epoxycyclohexane - carboxylate (for example: ERL 4221 from Union Carbide or CY-179 from Ciba Geigy) or bis (3) , 4 — epoxycyclohexylmethyl) adipate (eg, ERL 4299 from Union Carbide). Commercially available diglycidic ether of bisphenol-A (DGEBA) may be selected from Aribaite 6010 from Ciba Geigy, DER 331 from The Dow Chemical Company, and Epon 825, 828, 826, 830 from Shell Chemical Company. 834, 836, 1001, 1004 or 1007, etc. In addition, polyepoxidized phenol formaldehyde novolac prepolymer 136097.DOC 15 201038150 may be selected from DEN 431 or 438 of The Dow Chemical Company and CY-281 of Ciba Geigy Co., Ltd. and polyepoxidized cersol for maldehyde novolac prepolymer It can be selected from ENC 1285, 1280 or 1299 from Ciba Geigy. Polyglycidyl ether of polyhydric alcohol may be selected from Ciba Geigy's Araldite RD-2 (based on butane-1, 4_diol) or Epon 812 from Shell Chemical Company (based on glycerin) ° The diepoxide of an alkylcycloalkyl hydrocarbon is a vinyl cyclohexane dioxide such as ERL 4206 from Union Carbide. Further, a suitable diepoxide of a cycloalkyl ether is bis(2,3 - diepoxycyclopentyl)-ether, for example, ERL 0400 of Union Carbide. In addition, commercially available flexible epoxy resins include polyglycol diepoxy (eg, DER 732 and 736 from The Dow Chemical Company) and diglycidyl ester of linoleic dimer acid (eg, Epon 871 and 872 from Shell Chemical Company). And diglycidyl ester of a bisphenol, wherein the aromatic ring is linked by a long aliphatic chain (for example: Lekutherm X-80 of Mobay Chemical company). In addition, the above thermosetting resin having a plurality of functional groups may be selected from DEN 4875 of Tow Chemical Co., Ltd. (which is a solid epoxy novolac resin), and Epon 1031 of Shell Chemical Co., Ltd. A tetrafunctional solid epoxy resin and a Ciba-Geigy Araldite MY 720 (N, N, N, N, a tetraglycidyl-4, 4'-methylenebisbenzenamine). In addition, Shuangguan 201038150 s « Difunctional epoxy resin (a double epoxide) can be selected from Shell Chemical Company's HPT 1071 (a solid resin, Ν, Ν, Ν ', Ν' - tetraglycidyl — a, a' — bis(4 — aminophenyl)p — diisopropylbenzene), HPT 1079 (a solid diglycidyl ether of bisphenol — 9 — fluorene) or Ciba — Geigy's Araldite 0500/0510 (triglycidylether of para-aminophenol) o The curing agent used in the present invention may be selected from the group consisting of isophthaloyl dihydrazide, benzophenone tetracarboxylic dianhydride, and

Oethyltoluene diamine, 3,5-dimethylthio-2,4-toluene diamine, dicyandiamide (available from Curazol 2PHZ from American Cyanamid) or DDS (di amino diphenyl sulfone) From Ciba — Calgure of Geigy.... The curing agent may also be selected from the group consisting of a substituted dicyandiamides (for example, 2,6-xylenyl biguanide), a solid polyamide (for example, HT-939 of Ciba-Geigy Co., Ltd. or Anchor Pacific Anchor Co., Ltd.). Ancamine 2014AS), a solid aromatic amine (eg, HPT 1061 and 1062 from Shell Chemical Company), a solid anhydride hardener (eg, pyromellitic dianhydride; PMD A) ), a phenolic resin hardener (for example: poly(p-hydroxy styrene), imidazole, 2-phenyl-2,4-dihydroxymethylimidazoleil 2 4-diamino-6(2'-methylimidazolyl(1)] ethyl — s — triazine isocyanate adduct), boron trifluoride and an amine complex (amine 136097.DOC 17 201038150 complex, eg Pacific Anchor's Anchor 1222 and 1907) and trimethylol propane triacrylate 〇

For the thermosetting epoxy resin, a preferred curing agent is the above-mentioned dicyandiamide, and can be used in combination with a curing accelerator. Commonly used curing accelerators include urea (urea) or urea compound (urea compound). For example: 3 — phenyl — 1,1 — dimethylurea ' 3 — (4-chlorophenyl) — 1,1 — dimethyl urea ' 3 — (3,4 — dichlorophenyl) — 1,1 — dimethyl urea, 3 — (3 — chloro — 4 — methylphenyl — — 1,1 — dimethyl urea and imidazole (eg 2 — heptadecylimidazole, 1 — cyanoethyl — 2 — phenylimidazole — trimellitate or 2 — [.beta. — {2'-methylimidazoyl — ( Γ)}] — ethyl — 4,6 — diamino — s — tri azine) o If the thermosetting epoxy resin is a urethane, the curing agent may use a barrier isocyanic acid vinegar. (blocked isocyanate) (for example: alkyl phenol blocked isocyanate, which can be taken from Mosquito's Desmocap 11 A) or a barrier viscous polyisocyanate adduct (phenol blocked) Polyisocyanate adduct) (for example: Mondur S from Mobay Corporation). If the thermosetting epoxy resin is an unsaturated polyester resin, the curing agent may use a peroxide or a free radical catalyst, for example, peroxidation. Dicumyl peroxide ' 2,5 — dimethyl — 2,5 — di(t — 136097.DOC 18 201038150 butylperoxy)hexane, t — butyl cumyl peroxide and 2,5 — dimethyl—2,5—di( T-butylperoxy)hexyne-3. Further, the non-saturated polyester resin may be irradiated (radiation, for example, ultraviolet irradiation, high-energy electron beam irradiation or gamma irradiation) to cause crosslinking. Some thermoset epoxy resins cure without the use of a curing agent. For example: If the thermosetting epoxy resin is a double bismaleimide (BMI), the bismaleimide will crosslink at a high temperature and a co-curing agent For example, 0,0' a diallyl bisphenol A, Ό can be added together to make the cured bismaleimide tougher. The above-mentioned peroxide crosslinking agent, high energy electron beam or gamma radiation may be used to produce a crosslinked resin. Preferably, an unsaturated crosslinking aid may be added, for example, tripropylene. Trial omega acid (TAIC), triallyl cyanurate (TAC) or trimethylol propanetriacrylate (TMPTA).一种 One or more ceramic powders may be included in the insulating material, and the ceramic powder may be selected from nitrides, oxides or a mixture of the foregoing nitrides and the foregoing oxides. As the nitride, tantalum nitride, boron nitride, aluminum nitride or tantalum nitride can be used. As the oxide, alumina, magnesia, oxidized, cerium oxide or titanium oxide can be used. Fig. 3 is a schematic view showing a continuous injection molding apparatus 20 according to an embodiment of the present invention. The continuous injection molding apparatus 20 includes a feeding mechanism 21, a feeding mechanism 22, a die 23 having a slit 32, a pressure roller device 24, and a cutting device 25. The feeding mechanism 21 is for providing an insulating material 26 for production. I36097.DOC 19 201038150 β « The feeding mechanism 22 presses the insulating material 26 through the slit 32 of the die 23, thereby forming a plate-like substrate 27, wherein the insulating material 26 is pressed through the slit 32 The temperature can range from 50 ° C to 150 ° C. The pressure roller device 24 includes a steel wheel 28' which revolves around the first film 29 and the second film 30, respectively. When the plate-like substrate 27 passes through the steel wheel 28, the first film 29 and the second film 30 are respectively pressed against the two plate faces of the plate-like substrate 27. The cutting device 25 is for cutting the plate-like base material 27 into the thermally conductive insulating substrate 31. The technical content and technical features of the present invention have been disclosed as above, but those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is not limited by the scope of the invention, and the invention is intended to be embraced by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic flow chart showing a method of fabricating a thermally conductive insulating substrate according to an embodiment of the present invention; FIG. 2A to FIG. 2C are schematic diagrams showing a thermal conductive insulating composite substrate according to an embodiment of the present invention; A schematic view of a continuous injection molding apparatus according to an embodiment of the present invention is shown. [Main component symbol description] S11~S16 process steps 1〇, 10', 10" Thermally conductive and insulating composite substrate 11 Thermally conductive and insulating substrate 12 Printed circuit board

136097.DOC 20 201038150 « « 13 Metal substrate • 14,15 metal material 20 Continuous injection molding device 21 Feed mechanism 22 Feed mechanism 23 Die 24 Pressure roller device 25 Cutting device 〇 26 Insulation material 27 Plate substrate 28 Steel wheel 29 first film 30 second film 31 thermally conductive substrate 32 slit ❹ I36097.DOC 21

Claims (1)

201038150 VII. Patent application scope: i A method for preparing a thermally conductive insulating substrate, comprising the steps of: performing a hydrolysis condensation reaction on at least one ceramic powder to obtain at least one modified Taoman powder, wherein each of the at least one modified ceramic powder The surface grafted compound comprising the modified powder particles and each of the modified powder particles; a. The at least one modified ceramic powder, the polymer material and the curing agent are mixed to obtain an insulating material; The insulating material is extruded through the slit to form a plate-shaped substrate, and the first film and the second film are disposed on the two plates of the plate-like substrate to form the thermally conductive insulating substrate. Wherein the first film and the second film are selected from a metal material or a release material. 2.= According to the heat conduction of the request, the method for preparing the silk plate, wherein the organic compound is an organic stone, and the hydrolysis condensation reaction is carried out in an inert environment, and the at least one ceramic powder is reacted with the organic germanium. . Ο 3. 2 According to the preparation method of the substrate of the money source of the request, the organic sigma compound is organically treated, and the hydrolysis condensation reaction is carried out by reacting the at least one ceramic powder with organic titanium in an acidic environment. . 4. The method of preparing a thermally conductive insulating substrate according to claim 2 or 3, wherein the pH of the acidic environment is about ΡΗ丨? Between 11 and 5. 5. The method of preparing a thermally conductive insulating substrate according to claim 1, wherein the component of the polymeric material comprises a thermoplastic plastic and a thermosetting epoxy resin. The method for preparing a thermally conductive insulating substrate according to claim 5, wherein the thermosetting type peroxy resin accounts for 7% to 97% by volume of the polymer material. 136097.DOC 22 201038150 *Cao % 7. The method of preparing the thermally conductive insulating substrate according to claim 5, wherein the curing agent cures the polymer material at a curing temperature, and the curing temperature is higher than § 〇 °C. 8. The method of producing a thermally conductive insulating substrate according to claim 5, wherein the thermoplastic type plastic is an ultrahigh molecular weight phenoxy resin. 9) The method for producing a thermally conductive insulating substrate according to claim 8, wherein the ultrahigh molecular weight of the present ethoxy resin is greater than 30,000. The method for producing a thermally conductive insulating substrate according to claim 5, wherein the thermosetting 环氧树脂 epoxy resin is an uncured liquid epoxy resin, a polymerized epoxy resin, a phenol phenol epoxy resin or a smoldering resin. 11. The method of preparing a thermally conductive insulating substrate according to claim 5, wherein the thermoplastic plastic and the thermosetting epoxy resin are homogeneous phases. 12. The method of preparing a thermally conductive insulating substrate according to claim 5, wherein the thermoplastic type plastic material comprises a monohydroxy-phenoxy resin ether polymer structure. 13. The method of producing a thermally conductive insulating substrate according to claim 12, wherein the hydroxyphenoxy resin ether polymer structure is formed by polymerization of a bisepoxide and a difunctional hydrazine species. 14. The method of preparing a thermally conductive insulating substrate according to claim 5, wherein the thermoplastic plastic is formed by reacting a liquid epoxy resin with bisphenol quinone. The method of preparing a thermally conductive insulating substrate according to claim 5, wherein the thermoplastic plastic is formed by reacting a liquid epoxy resin with a dibasic acid. 16. The method of preparing a thermally conductive insulating substrate according to claim 5, wherein the thermoplastic plastic is formed by reacting a liquid epoxy resin with an amine. 17. The method of preparing a thermally conductive insulating substrate according to claim 1, wherein the at least one ceramic powder comprises a volume percentage of the insulating material of between 4% and 7% by weight of 136097.DOC 23 201038150. 18. The method of preparing a thermally conductive insulating substrate according to claim 2, wherein the at least one ceramic powder is a nitride, an oxide or a mixture of the oxide and the nitride. 19. The method of preparing a thermally conductive insulating substrate according to claim 18, wherein the nitride is selected from the group consisting of tantalum nitride, nitriding, gasification, and nitriding. 20. The method of preparing a thermally conductive insulating substrate according to claim 18, wherein the oxide is a group consisting of oxides, magnesia, magnesia, oxidized granules, and titanium dioxide. The method of preparing a thermally conductive insulating substrate according to claim 1, wherein the step of extruding the insulating material through a slit comprises the following steps: the feeding mechanism extrudes the insulating material provided by a feeding mechanism through a die The slit is formed to form the plate-like substrate. The method of preparing a thermally conductive insulating substrate according to claim 1, wherein a temperature at which the insulating material is extruded through the slit is 5 (TC to 150 t. 23. According to the preparation method of the thermally conductive insulating substrate according to the claims, The step of separately setting the first film material and the second film material on the two plates of the plate substrate comprises the following steps: pressing the first film material and the second film material by using a pressure roller device The method of preparing the thermally conductive insulating substrate according to claim 2, wherein the material of the metal material is selected from the group consisting of copper, |g, recording, copper alloy, Shao alloy, nickel alloy , copper alloy and Ming copper alloy. 25. A method for preparing a thermally conductive and insulating composite substrate, comprising the steps of: performing a hydrolysis condensation reaction on at least one ceramic powder to obtain at least one 136097.DOC 24 201038150 The modified ceramic powder comprises a plurality of surface grafts, an organic polymer material and a curing agent, and the at least one modified ceramic powder is mixed to obtain an insulating material to form a plate-like substrate; a substrate; and pressing the insulating material through a slit to set a metal material or a release material to press the plurality of the heat conductive insulating substrate on the plate substrate, and forming the heat conductive insulation composite at a pressing temperature Substrate 26. The method for producing a thermally conductive and insulating composite substrate according to claim 25, wherein the pressing temperature is between 80 ° C and 220 ° C. 27. The method of preparing a thermally conductive and insulating composite substrate according to the item 25, wherein the thermally conductive and insulating composite substrate comprises a single panel, a double panel, a single-sided double-layer plate, a metal core plate, a multilayer plate, or the like. The method of preparing a thermally conductive and insulating composite substrate according to claim 25, further comprising the step of: trimming the plurality of thermally conductive insulating substrates after pressing. 29. The method of preparing a thermally conductive and insulating composite substrate according to claim 28, wherein the molding technique comprises a process of cutting, shearing, punching, diamond cutting, and the like. 136097.DOC 25