TW201023207A - Method for manufacturing composite metal conductive particules - Google Patents
Method for manufacturing composite metal conductive particules Download PDFInfo
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- TW201023207A TW201023207A TW97147919A TW97147919A TW201023207A TW 201023207 A TW201023207 A TW 201023207A TW 97147919 A TW97147919 A TW 97147919A TW 97147919 A TW97147919 A TW 97147919A TW 201023207 A TW201023207 A TW 201023207A
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- composite metal
- metal conductive
- acidic solution
- copper particles
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- 239000002131 composite material Substances 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000002245 particle Substances 0.000 claims abstract description 85
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000003929 acidic solution Substances 0.000 claims abstract description 35
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 9
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000004140 cleaning Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- UBXAKNTVXQMEAG-UHFFFAOYSA-L strontium sulfate Chemical compound [Sr+2].[O-]S([O-])(=O)=O UBXAKNTVXQMEAG-UHFFFAOYSA-L 0.000 description 2
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
201023207 九、發明說明： - 【發明所屬之技術領域】 . 本發明係有關於一種導電粒子之製作方法，特別係有 關於一種複合金屬導電粒子之製作方法。 【先前技術】 習知晶片與基板係以錫球或錫凸塊進行電性連接，其 係在晶片上形成錫凸塊或錫球以結合於電路板，然而，晶 Φ 片上形成錫凸塊或錫球之製程（如電鍍、無電鍍製程）製程 複雜，且製作成本相對較高，再者，習知錫球之尺寸較大， 無法應用於高密度或細間距之封裝產品的電性連接。 【發明内容】 本發明之主要目的係在於提供一種複合金屬導電粒 子之製作方法，其係包含下列步驟：提供一鍍槽裝置，該 鑛槽裝置係包含有-第-槽體、-設置於該第一槽體内之 第二槽體及一可驅動該第二槽體之旋轉器，該第二槽體係 © 具有複數個濾孔；置入複數個銅粒子於該第二槽體内；加 入一酸性溶液於該第一槽體内，該酸性溶液係通過該第二 槽體之該些渡孔接觸該些銅粒子，且藉由該旋轉器驅動該 第二槽體轉動，使得該酸性溶液微蝕該些鋼粒子表面，以 去除該些銅粒子之表面氧化物，其中去除表面氧化物後之 该些銅粒子之粒徑係不小於該些渡孔之孔徑；以及加入一 含錫酸性溶液於該第一槽體内，㉟些銅粒子係與該含錫酸 眭’谷液進行一錫鋼置換反應以形成複數個複合金屬導電 粒子。本發明係藉由控制製程參數，例如：在該酸性溶液 201023207 微蝕該些銅粒子表面，以去除該些銅粒子之表面氧化物之 . 步驟中，以控制該酸性溶液微蝕該些銅粒子表面之時間， • 達到控制該些複合金屬導電粒子之尺寸之目的，其係具有 製程簡單、降低製作成本及高量產性之功效。 【實施方式】 請參閱第1及2A至2E圖，依據本發明之一具體實施 例係揭示一種複合金屬導電粒子之製作方法，其係包含下 〇 列步驟：首先，請參閱第丨圖之步驟丨丨及第2八圖，提供 一鍍槽裝置100,該鍍槽裝置100係包含有一第一槽體 11〇、一設置於該第一槽體110内之第二槽體12〇及—可 驅動該第二槽體120之旋轉器13〇，該第二槽體12〇係具 有複數個濾孔121 ;接著，請參閲第【圖之步驟12及第 2B圖，置入複數個銅粒子21〇於該第二槽體内，藉由 該第二槽體120初步篩選該些銅粒子21〇，使得該些銅粒 子210粒徑大於該些濾孔121孔徑之該些銅粒子2ι〇被保 〇 留於該第二槽體12〇中，在本實施例中，被保留於該第二 槽體120中之該些銅粒子210之平均粒徑係介於丨微米至 1 00微米之間；之後，請參閱第1圖之步驟丨3及第2c圖， 加入一酸性溶液A於該第一槽體11 〇内，該酸性溶液a係 通過該第二槽體120之該些濾孔121接觸該些銅粒子 210，且藉由該旋轉器130驅動該第二槽體丨2〇轉動，使 得該酸性溶液A微蝕該些銅粒子210表面，以去除該些銅 粒子210之表面氧化物’其中去除表面氧化物後之該些銅 粒子210之粒徑係不小於該些濾孔ι21之孔徑，在本實施 7 201023207 例中，去除表面氧化物後之該些銅粒子210之粒徑係介於 〇·1微米至30微米之間。201023207 IX. Description of the invention: - [Technical field to which the invention pertains] The present invention relates to a method for producing conductive particles, and more particularly to a method for producing a composite metal conductive particle. [Prior Art] The conventional wafer and the substrate are electrically connected by solder balls or tin bumps, which are formed on the wafer to form tin bumps or solder balls to be bonded to the circuit board. However, tin bumps are formed on the crystal grains. The process of solder ball (such as electroplating and electroless plating process) is complicated and the production cost is relatively high. Moreover, the size of the conventional solder ball is large and cannot be applied to the electrical connection of high-density or fine-pitch package products. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for fabricating composite metal conductive particles, which comprises the steps of: providing a plating device, the ore device comprising a -th-cavity, disposed on the a second tank body in the first tank body and a rotator capable of driving the second tank body, the second tank system © having a plurality of filter holes; placing a plurality of copper particles in the second tank; An acidic solution is in the first tank, the acidic solution contacts the copper particles through the ferry holes of the second tank, and the second tank is rotated by the rotator to make the acidic solution Micro-etching the surface of the steel particles to remove surface oxides of the copper particles, wherein the particle diameter of the copper particles after removing the surface oxide is not less than the pore diameter of the ferrite; and adding a tin-containing acidic solution In the first tank, 35 copper particles are subjected to a tin steel displacement reaction with the strontium sulphate-containing solution to form a plurality of composite metal conductive particles. The invention controls the process parameters, for example, micro-etching the surface of the copper particles in the acidic solution 201023207 to remove the surface oxides of the copper particles. In the step, controlling the acidic solution to micro-etch the copper particles The time of the surface, • The purpose of controlling the size of the conductive particles of the composite metal is to have the advantages of simple process, low production cost and high mass productivity. [Embodiment] Please refer to Figures 1 and 2A to 2E. According to an embodiment of the present invention, a method for fabricating a composite metal conductive particle is disclosed, which comprises the following steps: First, please refer to the steps of the figure And a plating apparatus 100, the plating tank apparatus 100 includes a first tank body 11〇, a second tank body 12 disposed in the first tank body 110, and The rotator 13A of the second tank body 120 is driven, and the second tank body 12 has a plurality of filter holes 121; then, refer to step 12 and FIG. 2B of the figure, and a plurality of copper particles are placed. In the second tank body, the copper particles 21 are initially screened by the second tank body 120, so that the copper particles 210 have a particle diameter larger than the pore size of the filter holes 121. The retention of the copper particles 210 in the second tank 120 is between 丨 micrometers and 100 micrometers. After that, please refer to steps 丨3 and 2c of FIG. 1 , and add an acidic solution A in the first tank 11 ,, The acidic solution a contacts the copper particles 210 through the filter holes 121 of the second tank 120, and the second tank body 丨2〇 is rotated by the rotator 130, so that the acidic solution A micro-etches the The surface of the copper particles 210 is removed to remove the surface oxides of the copper particles 210. The particle size of the copper particles 210 after removing the surface oxide is not less than the pore diameter of the filter holes ι21, in the present embodiment 7 201023207 The particle size of the copper particles 210 after removing the surface oxide is between 1 μm and 30 μm.
接著’請參閱第1圖之步驟14’移除該酸性溶液a， 在本實施例中，該鍍槽裝置1〇〇係另包含有一攻水閱14〇， 以移除該酸性溶液A ;之後，請參閱第1圖之步驟ι5及 第2D圖’進行一第一次清洗步驟，其係加入一清洗液I 於該第一槽體u〇内，該清洗液I係可為去離子水，並藉 由該旋轉器130驅動該第二槽體120轉動，以清洗該些銅 粒子210，或者，在另一個實施例中，係可以該清洗液t 直接沖洗該些銅粒子21G，該清洗液！係可藉由該线水闕 140排出該第一槽體11〇;接著，請參閱第】圖之步驟ι6 及第2E圖，加入一含錫酸性溶液SA於該第一槽體 内，該些銅粒子210係與該含錫酸性溶液SA進行一錫銅 置換反應以形成複數個複合金屬導電粒子2〇〇，該些金屬 導電粒子_係為該些銅粒子21()表面形成有覆層 220 ’在本實施例中，該含錫酸性溶液係為硫酸亞錫溶 液（SnS〇4)，該含錫酸性溶液SA之溫度係介於峨至峨 之間，該些錫包覆層22〇之平均厚度係介於。別微米至2 未之間。 此外，請參閱第i圖之步驟17，對該些複合金屬導電 粒子200進行—筮_ 士、土、山u ^ 弟一次清洗步驟，其係先移除該含錫酸性 冷液SA再利用該清洗液1清洗該些複合金屬導電粒子 最後凊參閲第1圖之步驟18，對該些複合金屬導 電粒子200進行一乾择 乾媒步驟，以去除殘留水分，其係可採 8 201023207 用自然乾燥法或將該些複合金屬導電粒子2〇〇置於烘箱内 進行乾燥㈣。心本發明之該些複合金屬導電粒子細 係可利用控制製程參數，例如：在該酸性溶液八微触該些 銅粒子210表面’以去除該些銅粒子21〇之表面氧化物之 步驟中，藉由控制該酸性溶液Α微蝕該些銅粒子21〇表面 之時間，以達到控制該些複合金屬導電粒子2〇〇之尺寸之Then, please refer to step 14 of FIG. 1 to remove the acidic solution a. In the embodiment, the plating device 1 further comprises a water-repellent solution to remove the acidic solution A; Please refer to step ι5 and FIG. 2D of FIG. 1 to perform a first cleaning step, which is to add a cleaning solution I to the first tank body, and the cleaning liquid I can be deionized water. And rotating the second tank 120 by the rotator 130 to clean the copper particles 210, or in another embodiment, the cleaning liquid t can directly rinse the copper particles 21G, the cleaning liquid ! The first tank body 11〇 can be discharged by the line water raft 140; then, referring to steps ι6 and 2E of the figure, a tin-containing acidic solution SA is added to the first tank body, and The copper particles 210 are subjected to a tin-copper displacement reaction with the tin-containing acidic solution SA to form a plurality of composite metal conductive particles 2, wherein the metal conductive particles are formed with a coating layer 220 on the surface of the copper particles 21 In the present embodiment, the tin-containing acidic solution is a stannous sulfate solution (SnS〇4), and the temperature of the tin-containing acidic solution SA is between 峨 and 峨, and the tin-clad layers 22 The average thickness is between. Do not micron to 2 no. In addition, referring to step 17 of the first embodiment, the composite metal conductive particles 200 are subjected to a cleaning step of removing the tin-containing acid cold liquid SA, and then using the same. The cleaning liquid 1 cleans the composite metal conductive particles. Finally, referring to step 18 of FIG. 1 , the composite metal conductive particles 200 are subjected to a dry-drying step to remove residual moisture, which can be dried naturally. Or the composite metal conductive particles 2〇〇 are placed in an oven for drying (4). The composite metal conductive particle fine layer of the present invention may be controlled by using process parameters, for example, in the step of removing the surface oxide of the copper particles 21 from the surface of the copper particles 210 by the acidic solution, Controlling the time of the surface of the copper particles 21 by micro-etching the acidic solution 以 to control the size of the composite metal conductive particles 2
Ο 目的’且本發明之製作方法係具有製程簡單、降低製作成 本及高量產性之功效。 、本發明之㈣範圍當視後附之中請專利範圍所界定 =準’任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範 【圖式簡單說明】 第1圖：依據本發明之一具體實施例，一種複合金 屬導電粒子之製作方法流程圖。 第2A至2E圖：依據本發明之—具體實施例，該複合金屬 導電粒子之製作方法之截面示意囷。 【主要元件符號說明】 11提供一鑛槽裝置，該鐘槽裝置係包含有—第一槽體 -設置於該第一槽體内之第二槽體及一可驅動3該第 二槽體之旋轉器 Λ 12置入複數個銅粒子於該第二槽體内 13 加入一酸性溶液於該第一槽體内 14 移除該酸性溶液 201023207 15 進行一第一次清洗步驟，其係加入一清洗液於該第一 槽體内 16 加入一含錫酸性溶液於該第一槽體内，以形成複數個 複合金屬導電粒子 17 對該 些複合金屬導電 ，粒 子 進行- -第 二次清洗步 18 對該 些 複合金屬導電 :粒 子 進行- -乾 燥步驟 100 鍍槽 裝 置 110 第一 槽 體 120 第 二 槽體 121濾孔 130 旋轉 器 140 洩 水 閥 200 複合金 屬導電粒子 210 銅粒 子 220 錫 包 覆層The purpose of the invention is that the preparation method of the invention has the advantages of simple process, reduced production cost and high mass productivity. The scope of the invention is defined by the scope of the invention as defined by the scope of the invention. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention belong to the protection of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a method of fabricating a composite metal conductive particle according to an embodiment of the present invention. 2A to 2E are views showing a cross section of the method for producing the composite metal conductive particles according to the embodiment of the present invention. [Main component symbol description] 11 provides a mine tank device, which comprises a first tank body - a second tank body disposed in the first tank body and a driveable 3 second tank body The rotator Λ 12 is filled with a plurality of copper particles in the second tank 13 and an acidic solution is added to the first tank 14 to remove the acidic solution 201023207 15 for a first cleaning step, which is added to a cleaning step. The liquid in the first tank 16 is added with a tin-containing acidic solution in the first tank to form a plurality of composite metal conductive particles 17 to conduct electricity to the composite metals, and the particles are subjected to - a second cleaning step 18 The composite metal is electrically conductive: particles are carried out - drying step 100 plating tank device 110 first tank body 120 second tank body 121 filter hole 130 rotator 140 drain valve 200 composite metal conductive particles 210 copper particles 220 tin coating
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| US8574408B2 (en) | 2007-05-11 | 2013-11-05 | SDCmaterials, Inc. | Fluid recirculation system for use in vapor phase particle production system |
| US8604398B1 (en) | 2007-05-11 | 2013-12-10 | SDCmaterials, Inc. | Microwave purification process |
| US8906316B2 (en) | 2007-05-11 | 2014-12-09 | SDCmaterials, Inc. | Fluid recirculation system for use in vapor phase particle production system |
| US8893651B1 (en) | 2007-05-11 | 2014-11-25 | SDCmaterials, Inc. | Plasma-arc vaporization chamber with wide bore |
| US8524631B2 (en) | 2007-05-11 | 2013-09-03 | SDCmaterials, Inc. | Nano-skeletal catalyst |
| US8759248B2 (en) | 2007-10-15 | 2014-06-24 | SDCmaterials, Inc. | Method and system for forming plug and play metal catalysts |
| US9302260B2 (en) | 2007-10-15 | 2016-04-05 | SDCmaterials, Inc. | Method and system for forming plug and play metal catalysts |
| US8575059B1 (en) | 2007-10-15 | 2013-11-05 | SDCmaterials, Inc. | Method and system for forming plug and play metal compound catalysts |
| US9597662B2 (en) | 2007-10-15 | 2017-03-21 | SDCmaterials, Inc. | Method and system for forming plug and play metal compound catalysts |
| US9186663B2 (en) | 2007-10-15 | 2015-11-17 | SDCmaterials, Inc. | Method and system for forming plug and play metal compound catalysts |
| US9592492B2 (en) | 2007-10-15 | 2017-03-14 | SDCmaterials, Inc. | Method and system for forming plug and play oxide catalysts |
| US8507401B1 (en) | 2007-10-15 | 2013-08-13 | SDCmaterials, Inc. | Method and system for forming plug and play metal catalysts |
| US9089840B2 (en) | 2007-10-15 | 2015-07-28 | SDCmaterials, Inc. | Method and system for forming plug and play oxide catalysts |
| US8507402B1 (en) | 2007-10-15 | 2013-08-13 | SDCmaterials, Inc. | Method and system for forming plug and play metal catalysts |
| US9737878B2 (en) | 2007-10-15 | 2017-08-22 | SDCmaterials, Inc. | Method and system for forming plug and play metal catalysts |
| US8481449B1 (en) | 2007-10-15 | 2013-07-09 | SDCmaterials, Inc. | Method and system for forming plug and play oxide catalysts |
| US9090475B1 (en) | 2009-12-15 | 2015-07-28 | SDCmaterials, Inc. | In situ oxide removal, dispersal and drying for silicon SiO2 |
| US9308524B2 (en) | 2009-12-15 | 2016-04-12 | SDCmaterials, Inc. | Advanced catalysts for automotive applications |
| US8906498B1 (en) | 2009-12-15 | 2014-12-09 | SDCmaterials, Inc. | Sandwich of impact resistant material |
| US8545652B1 (en) | 2009-12-15 | 2013-10-01 | SDCmaterials, Inc. | Impact resistant material |
| US8992820B1 (en) | 2009-12-15 | 2015-03-31 | SDCmaterials, Inc. | Fracture toughness of ceramics |
| US8877357B1 (en) | 2009-12-15 | 2014-11-04 | SDCmaterials, Inc. | Impact resistant material |
| US9039916B1 (en) * | 2009-12-15 | 2015-05-26 | SDCmaterials, Inc. | In situ oxide removal, dispersal and drying for copper copper-oxide |
| US8470112B1 (en) | 2009-12-15 | 2013-06-25 | SDCmaterials, Inc. | Workflow for novel composite materials |
| US8865611B2 (en) | 2009-12-15 | 2014-10-21 | SDCmaterials, Inc. | Method of forming a catalyst with inhibited mobility of nano-active material |
| US9119309B1 (en) * | 2009-12-15 | 2015-08-25 | SDCmaterials, Inc. | In situ oxide removal, dispersal and drying |
| US9126191B2 (en) | 2009-12-15 | 2015-09-08 | SDCmaterials, Inc. | Advanced catalysts for automotive applications |
| US8859035B1 (en) | 2009-12-15 | 2014-10-14 | SDCmaterials, Inc. | Powder treatment for enhanced flowability |
| US9149797B2 (en) | 2009-12-15 | 2015-10-06 | SDCmaterials, Inc. | Catalyst production method and system |
| US8557727B2 (en) | 2009-12-15 | 2013-10-15 | SDCmaterials, Inc. | Method of forming a catalyst with inhibited mobility of nano-active material |
| US8828328B1 (en) | 2009-12-15 | 2014-09-09 | SDCmaterails, Inc. | Methods and apparatuses for nano-materials powder treatment and preservation |
| US8821786B1 (en) | 2009-12-15 | 2014-09-02 | SDCmaterials, Inc. | Method of forming oxide dispersion strengthened alloys |
| US8803025B2 (en) | 2009-12-15 | 2014-08-12 | SDCmaterials, Inc. | Non-plugging D.C. plasma gun |
| US8652992B2 (en) | 2009-12-15 | 2014-02-18 | SDCmaterials, Inc. | Pinning and affixing nano-active material |
| US8668803B1 (en) | 2009-12-15 | 2014-03-11 | SDCmaterials, Inc. | Sandwich of impact resistant material |
| US8932514B1 (en) | 2009-12-15 | 2015-01-13 | SDCmaterials, Inc. | Fracture toughness of glass |
| US9332636B2 (en) | 2009-12-15 | 2016-05-03 | SDCmaterials, Inc. | Sandwich of impact resistant material |
| US9533289B2 (en) | 2009-12-15 | 2017-01-03 | SDCmaterials, Inc. | Advanced catalysts for automotive applications |
| US9522388B2 (en) | 2009-12-15 | 2016-12-20 | SDCmaterials, Inc. | Pinning and affixing nano-active material |
| US8669202B2 (en) | 2011-02-23 | 2014-03-11 | SDCmaterials, Inc. | Wet chemical and plasma methods of forming stable PtPd catalysts |
| US9216406B2 (en) | 2011-02-23 | 2015-12-22 | SDCmaterials, Inc. | Wet chemical and plasma methods of forming stable PtPd catalysts |
| US9433938B2 (en) | 2011-02-23 | 2016-09-06 | SDCmaterials, Inc. | Wet chemical and plasma methods of forming stable PTPD catalysts |
| US8969237B2 (en) | 2011-08-19 | 2015-03-03 | SDCmaterials, Inc. | Coated substrates for use in catalysis and catalytic converters and methods of coating substrates with washcoat compositions |
| US9498751B2 (en) | 2011-08-19 | 2016-11-22 | SDCmaterials, Inc. | Coated substrates for use in catalysis and catalytic converters and methods of coating substrates with washcoat compositions |
| US8679433B2 (en) | 2011-08-19 | 2014-03-25 | SDCmaterials, Inc. | Coated substrates for use in catalysis and catalytic converters and methods of coating substrates with washcoat compositions |
| US9533299B2 (en) | 2012-11-21 | 2017-01-03 | SDCmaterials, Inc. | Three-way catalytic converter using nanoparticles |
| US9156025B2 (en) | 2012-11-21 | 2015-10-13 | SDCmaterials, Inc. | Three-way catalytic converter using nanoparticles |
| US9511352B2 (en) | 2012-11-21 | 2016-12-06 | SDCmaterials, Inc. | Three-way catalytic converter using nanoparticles |
| US9586179B2 (en) | 2013-07-25 | 2017-03-07 | SDCmaterials, Inc. | Washcoats and coated substrates for catalytic converters and methods of making and using same |
| US9566568B2 (en) | 2013-10-22 | 2017-02-14 | SDCmaterials, Inc. | Catalyst design for heavy-duty diesel combustion engines |
| US9427732B2 (en) | 2013-10-22 | 2016-08-30 | SDCmaterials, Inc. | Catalyst design for heavy-duty diesel combustion engines |
| US9517448B2 (en) | 2013-10-22 | 2016-12-13 | SDCmaterials, Inc. | Compositions of lean NOx trap (LNT) systems and methods of making and using same |
| US9950316B2 (en) | 2013-10-22 | 2018-04-24 | Umicore Ag & Co. Kg | Catalyst design for heavy-duty diesel combustion engines |
| US9687811B2 (en) | 2014-03-21 | 2017-06-27 | SDCmaterials, Inc. | Compositions for passive NOx adsorption (PNA) systems and methods of making and using same |
| US10086356B2 (en) | 2014-03-21 | 2018-10-02 | Umicore Ag & Co. Kg | Compositions for passive NOx adsorption (PNA) systems and methods of making and using same |
| US10413880B2 (en) | 2014-03-21 | 2019-09-17 | Umicore Ag & Co. Kg | Compositions for passive NOx adsorption (PNA) systems and methods of making and using same |
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