201022112 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種半導體元件測試分類系統，尤其是 一種半導體元件獨立測試機台及測試分類系統。 【先前技術】 半導體元件已經成為絕大部分電子設備中不可或缺 的核心，例如各類電子產品中之微處理器、數位相機内含 ❿ 之CMOS(互補性氧化金屬半導趙）元件或電麵合元件 (CCD);而目前用來測試半導體元件之自動化測試機台， 除藉由電性檢測得以快速發現待測元件斷路、短路或錯接 製造誤失外，亦透過實境測試將待測半導體元件置入實際 使用環境中運作，獲得該待測元件在實際使用環境下的反 應狀態’得知其是否可供實際裝機。 若所欲量測之元件為CCD，上述實境測試之測試電路 板即為例如照相手機之電路板，若所測元件為顯示卡用之 IC，即可以顯示卡作為測試電路板，同理，應用於例如門 禁管制辨識的射頻（RF)IC亦復如此。 一種習知1C檢測分類機台如圖1所示，係以第一置 料裝置110容納盛裝待測1C之料盤，並由移料裝置160 從第一置料裝置110處之料盤中，以吸嘴吸取單一顆待測 1C，沿圖式之χ_γ平面搬移至載送裝置140上，載送裝置 140再將待測ic左右橫移至對應之取放機構132處；再 由三組取放機構132中之對應的取放器133供應至對應的 201022112 •測試器131的測試，並將完測的ic取出，放回載送褒置 14〇;再由移料裝置160自載送裝置140處取回完測的IC， 最終將完測Ic依照檢測結果，移出至第二置料裝置150 處分類或未合格區12〇收納。 由於入料與出料均由單一組移料裝置16〇執行，即使 為提升檢測效率，額外在移料裝置16〇上設置複數個例如 以正方形排列的四個吸嘴，並且在測試裝置13〇設置對應 的複數組測試器131，嘗試同步檢測多顆待測ic ;但是詳 ® 、細考量檢測流程，如果每次吸取四顆待測1C進行測試， 即使假設料盤恰可容納8行與10列共計80顆IC，因此 可以恰巧以整數的20次吸取動作，檢測一整盤料盤中所 容納1C ’從而加快入料速度。 然而，在後續的分類過程中，由於必然產生部分次級 品、不良品、或是需重測之產品，使得每次完測的四顆Ic 將不可能全部被放入第二置料裝置150，若第二置料裝置 150也是如同前述的8行與10列共80個容置槽結構，依 照目前常見的例如95%良率為例，每個料盤中的8〇顆待 測1C約有4顆不能順利通過檢測；將導致出料分類過程 中，無法每次都恰好填滿第二置料裝置15〇的各行，一旦 有奇數的空缺出現，將迫使下一次分類置放時，移料裝置 160必須先填滿前一行的奇數空缺，再繼續換行置放剩下 的1C，延緩置放過程的處理速度。 尤其考量在某一批的4顆完測IC中，若有一顆屬於 不良αο ’則移料裝置160還需要先後將合格的3顆置放至 201022112 第二置料裝置150，並單獨將不良品放入未合格區12〇, 使得移料裝置160行走路線更加複雜而緩慢。受限於此種 繁複的流程，檢測效率無法被進一步提升，且機台要能執 行此種複雜動作，製造成本亦無法大幅降低；尤其是所有 動作都需仰賴同一組移料裝置16〇,移料裝置16〇之速度 將成為整體檢測效率的瓶頸；加以，當受測試1C之檢測 過程需耗費較長時間，移料裝置16〇將被迫空置等待，後 續之分類作業亦無獨立運作而需停止。 〇 再者，當受測1C為RFIC或WiMAX —類產品時，由 於易受外部電磁波干擾，必須於檢測前在機台外增設一套 隔絕電磁波的屏蔽裝置，並且經良好的接地與屏蔽確認， 才能精確執行檢測。然而，受限於此類產品的數量有限， 且測試機台價格甚高，許多封裝測試廠商往往無法提供專 屬機台進行此類1C檢驗，而是在更換檢測生產線時，才 臨時加裝屏蔽裝置。在每次裝設過程中，都會浪費相當時 間，若設一 RFIC專屬檢測分類機台，又將有閒置景況發 _ 生’造成1C封裝測試廠商的兩難困境。 【發明内容】 因此，本發明之一目的，在提供一種簡化完測1C置 放途徑並可提升速率之半導體元件獨立測試機台。 本發明之另一目的，在提供一種結構簡化、製造成本 隨之降低之半導體元件獨立測試機台。 本發明之再一目的，在提供一種易於批次檢測半導體 元件之半導體元件獨立測試機台。 201022112 本發明之又一目的在提供一種分別簡化完測Ie置放 途徑與分類途徑，從而大幅提昇測試效率之半導體元件測 試分類系統。 本發明又另一目的，在提供一種可依照測試速度與分 類速度差異，輕易改變兩種機台比例，提升系統效率之半 導體元件測試分類系統。 本發明之又再一目的，在提供一種分別簡化測試機台 與分類機台結構，從而大幅降低造價，使得專屬測試機台 © 成為可能的半導體元件測試分類系統。 因此，本發明揭露一種半導體元件獨立測試機台係 供測試複數分別容置於一個承載裝置之複數對應容置槽 中的半導體元件，且該承載裝置具有一個辨識標記，該測 試機台包含：一個形成有一個供置放該容置有該等待測半 導體元件之承載裝置的入料位置’及一個供置放該容置有 該等全部完測之半導體元件的承載裝置之出料位置的基 座，一組具有至少一個測試位置，並供將該等待測半導體 ® 元件移至該至少-個測試位置、進行測試、且將該等完測 半導體元件移出該至少一個測試位置之搬移測試裝置；及 一組供接收該搬移測試裝置測試結果，並將該測試結果、 與該受測半導體元件在該承載裝置中之容置槽位置1共同 紀錄及輸出之處理裝置》 本發明更揭露一種半導體元件測試分類系統，係供測 試複數分別容置於至少一個承載裝置之複數對應容置槽 中的半導體元件並加以分類’且該至少一個承載裝置具有 201022112 •—個辨識標記，該系統包含：複數組半導體元件獨立測試 機台，該等測試機台分別包括：一個形成有一個供置放該 容置有該等待測半導體元件之承載裝置的入料位置及: - 個供置放該容置有該等全部完測之半導體元件的承載裝 置之出料位置的基座；一組具有至少一個測試位置，並供 將該等待測半導體元件移至該至少一個測試位置、進行測 試、且將該等完測半導髋元件移出該至少一個測試位置之 搬移測試裝置；及一組供接收該搬移測試裝置測試結果， ® 並將受測半導體元件測試結果紀錄及輸出之處理裝置；及 數目少於該等獨立測試機台之至少一具分類機台，該分類 機台包括：一個形成有一個供接收該來自該等獨立測試機 台之至少一個承載裝置的接收位置，及一個置放有複數供 置換之合格半導體元件的備料位置之基部；一組供讀取該 至少一個承載裝置辨識標記並輸出之讀取裝置；一組置換 裝置；及一組供接收來自該等獨立測試機台處理裝置輸出 訊號、及該讀取裝置訊號，並依照該輸出訊號驅動該置換 馨 裝置’將該至少一個承載裝置中之測試不合格的完測半導 體元件與該備料位置之合格半導體元件相互置換，使該至 少一個承載裝置之該等容置槽中所容納者均為合格的完 測半導體元件之驅動裝置。 本發明藉由獨立的測試機台，僅負責檢測並紀錄檢測 結果而暫時不執行·分類，使得每次移動效率最佳化，不僅 簡化整體結構，並可提升檢測本身的流程速度；再者，由 於分類速率普遍高於測試速率，考量此種測試與分類機台 201022112 的速度差異，將可藉由本案之設計而採一台分類機台配合 複數測試機台之系統配置，獲得整體處理系統之最佳效 率’且將測試機台與分類機台切割分離後，系統縮減了分 類單凡之叹置空間，以及減少不必要的分類部分購置成 . 纟，更因購置成本被大幅降低，從而使得專屬之特殊測試 機台易於實現，提供測試廠商更佳選擇彈性。 【實施方式】 ❹彳關本發明之技術内容、特點與功效，在以下配合參 考圖式之較佳實施例的詳細說明中，將可清楚的呈現。且 為方便說明而避免圖面蒼亂，包括連接單元與支架線路等 易於明瞭之結構均予省略。 本發明第一實施例之半導體元件獨立測試機台如圖2 所示，係以實境測試為例；作為承載裝置的料盤，其容置 槽數目則以4x8共計32顆為例；並利用一組搬移測試裝 置進行半導體元件之測試動作。 〇 獨立測試機台20的基座200上形成有一個入料位置 及一個出料位置，並分別容置裝有待測半導體元件Μ及 完測半導體元件92的兩個承載裝置51、52，本例中的搬 移測試裝置則包括一組搬移半導體元件91、92的機械臂 241 ’且為提升單一批次檢測數量，該組機械臂例釋 為具有四個吸嘴2413,以同時汲取四個待測半導體元件 91，且位於測試位置63之測試埠242、243亦例釋為具有 四個相對應的測試單元2423、2433，使每—測試痒242、 243均可批次接受四顆待測半導體元件91進行檢測。 201022112 • 請一併參照圓3，待測半導體元件91檢測完後，檢 測結果由測試埠242、243傳至處理裝置23加以處理；本 ‘案特殊之處在於，無論完測半導趙元件92之測試結果為 •何，均仍以機械臂241搬移所有完測半導體元件92至出 .料位置置放於同-完測半導體元件92承载裝置52中。 尤其如本例所示，當受測半導體元件91承載裝置51 :完測半導體元件92承載裝置52配置結構相同時更可 ❻完全將完測半導趙元件92擺放在㈣時之相同位置，由 此，32顆元件可被單純以8次（每次4顆）的形式完成全部 測試過程，亦即，整盤32顆元件之測試，僅需花費8次 簡：之入料動作，以及8次單純的出料移動，大幅簡化機 械臂之機械動作，從而加速整盤元件的測試流程。 為便於辨識各元件之測試結果，每一個完測半導體元 件92承載裝置52均設置有例示為條碼的辨識標記”， 並由處理裝置23分別紀錄承載裝置52之辨識標記53、 G 每一顆完測半導體元件92在承載裝置52中容置槽52〇的 所在位置、以及每顆元件之測試結果。當然，如熟悉本技 術領域者所能輕易理解，此處之測試埠242、243亦可因 應測試需求，被設計成分別負責彼此相異的二組不同測試 流程而先後運作，將兩種測試步驟在單一測試機台中進 行，提升機台使用的彈性；或加裝屏蔽裝置244以進行例 如RFIC之檢測。 當測試速率與分類速率相當時，則可一併參照圓4所 示，組成本發明考導體元件測試分類系統2之第一實施 201022112 例’本例中分類機台3係被設置於測試機台Μ輸送流道 下游位置’將上述待測半導體元件91由測試機台2〇入料 位置Η處之承载裝置51搬移至測試棒242，經測試完畢 而置於出料位置62處之承載裝s 52中；並以移載裝置 35將承載裝置52與完測之半導體元件％搬移至分類機 台3之接收位置66 ’由例示為條碼讀取器的讀取裝置η201022112 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor component test classification system, and more particularly to a semiconductor component independent test machine and a test classification system. [Prior Art] Semiconductor components have become an indispensable core in most electronic devices, such as microprocessors in various electronic products, CMOS (complementary oxidized metal semiconductor) components or digital devices. Face-to-face component (CCD); the automated test machine currently used to test semiconductor components, except for the electrical detection, can quickly find out that the device under test is open, shorted or misplaced, and is also tested by the actual test. The semiconductor component is placed in the actual use environment to obtain the reaction state of the component under test in the actual use environment to know whether it is available for actual installation. If the component to be measured is a CCD, the test circuit board of the above-mentioned actual test is a circuit board of, for example, a camera phone. If the component to be tested is an IC for a display card, the display card can be used as a test circuit board. Similarly, This is also true for radio frequency (RF) ICs such as access control identification. A conventional 1C inspection sorting machine is shown in FIG. 1 , and the first loading device 110 is used to accommodate a tray for holding 1 C to be tested, and is moved from the tray of the first loading device 110 by the loading device 160. A single 1C to be tested is sucked by the nozzle, and moved to the carrying device 140 along the χγ plane of the figure, and the carrying device 140 traverses the ic to be tested to the corresponding pick-and-place mechanism 132; The corresponding pick and place unit 133 of the discharge mechanism 132 is supplied to the corresponding test of the 201022112 • tester 131, and the completed ic is taken out and put back to the carrying device 14〇; and then the loading device 160 self-carrier device At 140, the tested IC is retrieved, and finally the finished Ic is removed to the classified or unqualified area 12 of the second loading device 150 according to the detection result. Since both the feed and the discharge are performed by a single group of transfer devices, even if the detection efficiency is improved, a plurality of four nozzles, for example, arranged in a square, are additionally disposed on the transfer device 16 and are in the test device 13 Set the corresponding complex array tester 131 to try to detect multiple ics to be tested synchronously; but the detailed test and the detailed test process, if you take four test 1Cs to test each time, even if the tray is just enough to accommodate 8 rows and 10 The column has a total of 80 ICs, so it can happen to take an integer of 20 suction actions to detect the 1C ' contained in a whole tray to speed up the feed rate. However, in the subsequent classification process, since some sub-products, defective products, or products to be re-tested are inevitably generated, it is impossible for all the four Ics that are completed each time to be placed in the second loading device 150. If the second loading device 150 is also a total of 80 accommodating groove structures as in the above 8 rows and 10 columns, according to the current common example, for example, 95% yield, 8 待 in each tray is to be measured 1C. Four of them can't pass the test smoothly; it will lead to the process of sorting and discharging, which can't fill the rows of the second feeding device 15〇 every time. Once there are odd vacancies, it will force the next sorting to be placed. The material device 160 must first fill the odd number of the previous line, and then continue to change the line to place the remaining 1C, delaying the processing speed of the placement process. In particular, if one of the four completed ICs in a batch is defective, then the transfer device 160 needs to place the qualified three pieces in succession to the 201012112 second loading device 150, and separately treat the defective products. Putting into the unqualified area 12〇 makes the walking path of the loading device 160 more complicated and slow. Due to such complicated processes, the detection efficiency cannot be further improved, and the machine must be able to perform such complicated actions, and the manufacturing cost cannot be greatly reduced; in particular, all actions need to rely on the same group of loading devices. The speed of the material device 16〇 will become the bottleneck of the overall detection efficiency; in addition, when the test process of the test 1C takes a long time, the transfer device 16〇 will be forced to wait vacant, and the subsequent classification operation does not need to operate independently. stop. Furthermore, when the 1C is tested as an RFIC or WiMAX-type product, it is necessary to add a shielding device for shielding electromagnetic waves outside the machine before the detection, because it is susceptible to external electromagnetic interference, and it is confirmed by good grounding and shielding. The detection can be performed accurately. However, due to the limited number of such products and the high price of the test machine, many package testers often cannot provide a dedicated machine for such 1C inspection, but temporarily install the shielding device when the inspection production line is replaced. . In each installation process, it will waste a considerable amount of time. If an RFIC-specific inspection and classification machine is set up, there will be idle situation, which will cause the dilemma of 1C package test vendors. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor component independent test machine that simplifies the completion of the 1C placement path and can increase the rate. Another object of the present invention is to provide a semiconductor component independent test machine which is simplified in structure and has a reduced manufacturing cost. Still another object of the present invention is to provide a semiconductor component independent test machine which is easy to batch-detect semiconductor elements. 201022112 Another object of the present invention is to provide a semiconductor component test classification system which simplifies the completion of the Ie placement and classification methods, thereby greatly improving the test efficiency. Still another object of the present invention is to provide a semiconductor component test classification system which can easily change the ratio of two types of machines according to the difference between the test speed and the classification speed and improve the efficiency of the system. Still another object of the present invention is to provide a simplified test machine and sorting machine structure, thereby substantially reducing the cost, and making the dedicated test machine © a possible semiconductor component test classification system. Therefore, the present invention discloses a semiconductor component independent testing machine for testing a plurality of semiconductor components respectively accommodated in a plurality of corresponding receiving slots of a carrier device, and the carrier device has an identification mark, and the testing machine includes: Forming a feed position for placing the carrier device accommodating the semiconductor component to be tested and a pedestal for placing a discharge position of the carrier device housing the fully-measured semiconductor device a set of transfer test devices having at least one test location for moving the test semiconductor component to the at least one test location, performing a test, and moving the test semiconductor component out of the at least one test location; A processing device for receiving the test result of the moving test device and recording and outputting the test result together with the receiving slot position 1 of the tested semiconductor component in the carrying device. The present invention further discloses a semiconductor component test. The classification system is configured to be respectively accommodated in a plurality of corresponding receiving slots of at least one carrying device And the at least one carrier device has 201022112 • an identification mark, the system comprises: a complex array of semiconductor component independent test machines, the test machines respectively comprise: one for forming a Having a receiving position of the carrying device for the semiconductor component to be tested and: a pedestal for placing a discharge position of the carrying device that houses the all-completed semiconductor component; one set having at least one Testing a position and for moving the standby semiconductor component to the at least one test location, performing a test, and moving the completed semi-guided hip component out of the at least one test position; and a set for receiving the shift Test device test results, ® and processing device for recording and outputting test results of the tested semiconductor components; and at least one sorting machine having fewer than the independent test machines, the sorting machine includes: one formed with one Receiving a receiving position of the at least one carrying device from the independent testing machines, and placing a plurality of receiving devices a base of a stocking position of the qualified semiconductor component; a set of reading devices for reading and outputting the at least one carrier identification mark; a set of replacement devices; and a set of signals for receiving output signals from the independent test machine processing devices And reading the device signal, and driving the replacement device according to the output signal to replace the test semiconductor component in the at least one carrier device with the qualified semiconductor device in the stocking position, so that the at least one The receivers of the receiving slots of the carrying device are all qualified driving devices for the semiconductor components. The invention is only responsible for detecting and recording the detection result and temporarily not performing and classifying by means of an independent testing machine, so that each movement efficiency is optimized, not only simplifies the overall structure, but also improves the process speed of the detection itself; Since the classification rate is generally higher than the test rate, considering the speed difference between the test and the classification machine 201022112, the system configuration of a classification machine and the complex test machine can be adopted by the design of the case to obtain the overall processing system. The best efficiency' and the separation of the test machine and the sorting machine, the system reduces the sigh space of the classification, and reduces the unnecessary classification of the part to purchase. 纟, because the purchase cost is greatly reduced, thus making The exclusive special test machine is easy to implement and offers testers a better choice of flexibility. DETAILED DESCRIPTION OF THE INVENTION The technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. For the sake of convenience, the drawings are not disturbed, and the structures that are easy to understand, such as the connection unit and the bracket line, are omitted. The semiconductor component independent testing machine of the first embodiment of the present invention is shown in FIG. 2, taking the reality test as an example; as the tray of the carrying device, the number of the receiving slots is 32 x 4 x 8 as an example; A set of transfer test devices performs test operations on semiconductor components. The base 200 of the independent test machine 20 is formed with a feeding position and a discharging position, and respectively accommodates two carrying devices 51 and 52 including the semiconductor component to be tested and the semiconductor component 92 to be tested. The moving test device in the example includes a set of mechanical arms 241' that move the semiconductor components 91, 92 and to increase the number of single batch detections, the set of mechanical arms is illustrated as having four nozzles 2413 to simultaneously capture four The semiconductor device 91 is tested, and the test electrodes 242, 243 at the test position 63 are also illustrated as having four corresponding test units 2423, 2433, so that each test itch 242, 243 can accept four semiconductors to be tested in batches. Element 91 performs the test. 201022112 • Please refer to circle 3 together. After the semiconductor component 91 to be tested is detected, the test result is transmitted from the test 埠242, 243 to the processing device 23 for processing; the special case of this case is that the semi-guided component 92 is completed. The result of the test is that all the semiconductor components 92 are still moved by the robot arm 241 to the position of the material to be placed in the same-test semiconductor component 92 carrying device 52. In particular, as shown in this example, when the semiconductor device 91 under test device 51 is configured to have the same configuration of the semiconductor device 92, the semiconductor device 92 can be completely placed in the same position as (4). Thus, 32 components can be completed in exactly 8 times (4 each time), that is, the test of 32 components of the entire disk, only takes 8 times: the feeding action, and 8 The simple discharge of the material greatly simplifies the mechanical action of the robot arm, thereby accelerating the testing process of the entire component. In order to facilitate the identification of the test results of the components, each of the completed semiconductor component 92 carrying devices 52 is provided with an identification mark exemplified as a bar code, and the processing device 23 records the identification marks 53 and G of the carrying device 52, respectively. The position of the semiconductor element 92 in the carrying device 52 is accommodated in the carrying device 52, and the test result of each component. Of course, as can be easily understood by those skilled in the art, the test 埠242, 243 herein can also be adapted. The test requirements are designed to be operated separately for two different sets of test processes that differ from each other, and the two test steps are performed in a single test machine to enhance the flexibility of the machine use; or a shielding device 244 is added to perform, for example, RFIC. When the test rate is equal to the classification rate, it can be combined with the circle 4 to form the first implementation of the test conductor component test classification system 2 of the present invention. 201022112 Example 'In this example, the classification machine 3 is set to The test machine Μ conveyance flow path downstream position 'moves the above-mentioned semiconductor component 91 to be tested from the load bearing device 51 of the test machine 2 into the feed position 至 to the test The rod 242 is tested and placed in the load-bearing device s 52 at the discharge position 62; and the carrier device 52 and the finished semiconductor component % are moved by the transfer device 35 to the receiving position 66' of the sorting machine 3 a reading device η exemplified as a barcode reader
讀取辨識標記53，從錢驅㈣置33得知待處理的承載 裝置52為何。 驅動裝置33從而取得承載裝置52内所有各容置槽 似的半導體元件92之對應資訊，並指令置換裝置“移 除承載裝置52中的不合格元件，再由分類機台3基部_ 上之備料位置65處的備料承載裝置中，取出—顆合格的 完測元件補滿承載裝置52中的空缺，使得承載裝置”迅 速完成分類作業而可出貨。 另方面，如熟悉本技術領域者所能輕易理解，依照目 前技術，測試待測半導體元件並不要將元件從料盤中 取出，如圖5所示本發明之第二實施例’其中，所有待測 半導想元# 91’是以接點93,向上方式被容納於承載裝置 51’之容置槽中，測試機台2〇’則以一組例釋為皮帶與皮帶 輪之搬移器251，運送承載裝置51，至測試位置，並利用下 方設置有複數測試頭252’的下壓臂253,向下位移，直接接 觸各待測半導體元件91，之接點93’，為提升檢測效率本 例中係將測試頭252,之個數設計為尊同於承載裝置Μ，之 容置槽數目，藉以將整盤待測元件一次測完。當然，無論 12 201022112 測試頭M2’個數是否等同於容置槽，其皆為熟悉本技術領 域者所能輕易理解。 延續前述，當測試速度需費時數分鐘，且分類速度遠 高於測試速度時，本發明之第二實施例之半導體元件測試 分類系統2’將如圖6所示，圖式左側的兩台測試機台2〇, 分別藉由輸送流道，將完測之承載裝置傳輸至圖式右侧分 類機台3’移載裝置35,之接收位置。來自不同測試機台2〇, 之承載裝置將分別由讀取裝置32,讀取其辨識標記，並由 ❹ 驅動裝置參照各承載裝置容置槽中，各對應元件之測試資 訊’驅動置換裝置34’由備料位置65’上料盤中撿取合格元 件，替換承載裝置内的不合格元件；由於一盤例如32顆 元件中，平均僅丨至2顆不符合標準，因此分類機台3, 可以迅速更換這1至2顆元件後，將裝滿合格元件的承載 裝置快速輸出而結束所有測試與分類作業。 如熟悉本技術領域者所能輕易理解，承前文所例，驅 φ 動裝置藉由條碼讀取器讀取條碼以確認待處理的承载裝 置承載物型號；另一方面，如圖7所示本發明之第三實施 例’在承載裝置52’，亦可省略條碼之編排，本例中例示有 一台獨立測試機台，機台測試痒檢測完畢後，將檢測結果 傳至處理裝置23’’加以處理，依一預設順序先後送抵分類 機台’再由驅動裝置33’，能夠依此預設順序進行分類。 經由上述揭露’測試作業中的完測IC置放流程因而 簡化，測試速度從而提高，並使批次檢測流程更順暢；測 試機台整體結構亦因此而簡化’造償隨之降低，使得特殊 13 ^----^ 201022112 測試流程具有專屬測試機台成為可行。測試完畢後之分類 流程亦同步被簡化，無論測試或分類作業都可分別加快， 大幅增進檢測分類效能；尤其使用者可考量自身產品測試 速度與分類速度差異’輕易改變兩種機台比例，提升系統 整體效率。且當測試機台與分類機台並非如習用技術必須 採取一比一比例設置，無疑減少不必要的分類機台數目， 藉此減少無謂成本與空間耗用，更增加廠商競爭力。 惟以上所述者，僅為本發明之較佳實施例而已，當不 © 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1為一半導趙元件測試分類系統之俯視示意圖； 圖2為本發明第一實施例之半導體元件獨立測試機 台的立體示意圖； ❹ @ 3為本發明第—實施例之半導H元件測試分類系 統的方塊示意圖； 圖4為本發明篦—參 货乃第實施例之半導體元件測試分類系 統的俯視示意圖； 圖 5為本發明篦-參 第一實施例之半導體元件獨立測試機 台的立體示意圖及 圖6為本發明笫-香 第一實施例之半導體元件測試分類系 統的俯視示意圖。 201022112 圖7為本發明第三實施例之半導趙元件測試分 統’分類完成後之承載裝置堆疊示意圖。 、 【主要元件符號說明】 ❹The identification mark 53 is read, and from the money drive (four) setting 33, the carrier device 52 to be processed is known. The driving device 33 thus obtains the corresponding information of all the semiconductor elements 92 in the receiving device 52, and instructs the replacing device to "remove the defective components in the carrying device 52, and then prepare the materials on the base of the sorting machine 3". In the stock carrying device at position 65, a qualified completion component is taken up to fill the gap in the carrying device 52, so that the carrying device "can quickly complete the sorting operation and can be shipped. On the other hand, as can be easily understood by those skilled in the art, according to the current technology, the semiconductor component to be tested is tested and the component is not taken out from the tray, as shown in FIG. 5, the second embodiment of the present invention The semi-conducting element #91' is a contact 93, which is accommodated in the receiving slot of the carrying device 51' in an upward manner, and the test machine 2'' is interpreted as a belt and pulley shifter 251. The carrying device 51 is transported to the test position, and the lower pressing arm 253 provided with the plurality of test heads 252' is downwardly displaced to directly contact the semiconductor elements 91 to be tested, and the contact point 93' is used to improve the detection efficiency. The middle test unit 252 is designed to be the same as the carrying device, and the number of the receiving slots is used to measure the entire device to be tested at one time. Of course, no matter whether the number of test heads M2' of 12 201022112 is equivalent to the accommodating slot, it can be easily understood by those skilled in the art. Continuing the foregoing, when the test speed takes a few minutes and the classification speed is much higher than the test speed, the semiconductor component test classification system 2' of the second embodiment of the present invention will be as shown in FIG. 6, two tests on the left side of the figure. The machine 2 〇 transmits the completed carrying device to the receiving position of the right sorting machine 3' transfer device 35 by the conveying flow path. The bearing devices from different test machines 2 will be read by the reading device 32 respectively, and the test information of each corresponding component will be driven by the ❹ driving device with reference to the test information of each corresponding device. 'Received components from the stocking position 65' in the tray to replace the defective components in the carrying device; since only one of the 32 components, for example, only 2 of the 32 components do not meet the standard, the sorting machine 3 can After quickly replacing the 1 to 2 components, the load carrying device filled with the qualified components is quickly outputted to end all testing and sorting operations. As can be easily understood by those skilled in the art, in the foregoing example, the driving device reads the barcode by the barcode reader to confirm the carrier type of the carrier to be processed; on the other hand, as shown in FIG. The third embodiment of the invention 'in the carrying device 52' may also omit the arrangement of the bar code. In this example, an independent test machine is illustrated. After the machine test is completed, the test result is transmitted to the processing device 23''. The processing is sent to the sorting machine 'by the driving device 33' in a preset order, and can be classified according to the preset order. Through the above disclosure, the test IC placement process in the test operation is simplified, the test speed is improved, and the batch inspection process is smoother; the overall structure of the test machine is simplified, and the compensation is reduced accordingly, making the special 13 ^----^ 201022112 The test process has a dedicated test machine that becomes feasible. After the test is completed, the classification process is also simplified at the same time. The test or classification operation can be speeded up separately, which greatly improves the detection classification efficiency. In particular, the user can consider the difference between the test speed and the classification speed of the product, and easily change the ratio of the two machines and improve the ratio. Overall system efficiency. Moreover, when the test machine and the sorting machine are not set in a one-to-one ratio as in the conventional technology, the number of unnecessary sorting machines is undoubtedly reduced, thereby reducing unnecessary cost and space consumption, and increasing the competitiveness of the manufacturer. However, the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, i.e., the simple equivalent changes made in accordance with the scope of the present invention and the contents of the description of the invention. Modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view of a semi-guided component test classification system; FIG. 2 is a perspective view of a semiconductor component independent test machine according to a first embodiment of the present invention; ❹ @3 is a first embodiment of the present invention FIG. 4 is a top plan view of a semiconductor component test classification system according to the first embodiment of the present invention; FIG. 5 is a semiconductor component of the first embodiment of the present invention. A perspective view of an independent test machine and FIG. 6 is a top plan view of a semiconductor component test and classification system according to a first embodiment of the present invention. 201022112 FIG. 7 is a schematic diagram showing the stacking of the carrying device after the classification of the semi-conductive component test sub-section of the third embodiment of the present invention. , [Main component symbol description] ❹
110..·第一置料裝置 252’..·測試頭 120…未合格區 253’·..下壓臂 130…測試裝置 3、3’…分類機台 131..·測試器 3〇〇…基部 132…取放機構 32 ' 32’··.讀取裝置 133…取放器 33 ' 33’’…驅動裝置 14〇…載送裝置 34 ' 34’..·置換裝置 150...第二置料裝置 35、35’.·.移載裝置 160…移料裝置 520…容置槽 2、2_…測試分類系統 53…辨識標記 20、20’.·.獨立測試機台 61…入料位置 200…基座 62…出料位置 23、23”…處理裝置 6 3…測試位置 241…機械臂 65、65’.··備料位置 242、243…測試埠 66…接收位置 244…屏蔽裝置 91、92、91，...半導體元件 2413.·.吸嘴 93’·..接點 2423、2433...測試單元 251’..·搬移器 51、51’、52、52”…承載裝置 15110..·First loading device 252'..·Test head 120...Failed area 253'.....Pushing arm 130...Testing device 3,3'...Classification machine 131..·Tester 3〇〇 ... base 132... pick-and-place mechanism 32 ' 32'·. reading device 133... pick-and-placer 33 '33''... drive unit 14〇...carrier 34' 34'..·placement unit 150... Two-feed device 35, 35'.. transfer device 160... transfer device 520... accommodating groove 2, 2_... test classification system 53... identification mark 20, 20'..... independent test machine 61... Position 200...Base 62...Dropping position 23,23"...Processing device 6 3...Testing position 241...Machining arm 65,65'.. Stocking position 242, 243...Test 埠66...Receiving position 244...Shielding device 91 , 92, 91, ... semiconductor element 2413. ·. suction nozzle 93'·.. contact 2423, 2433... test unit 251 '..······················· 15