201020507 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種光學檢測裝置，特別是關於一種三維 形貌檢測裝置。 【先前技術】 精後的形貌檢測是現代科技中非常重要的一環，當許多 元組件漸漸微小化，就更需要精確可靠的檢測技術來驗證 其微結構尺寸或形貌的精度，以控制品質及製程。其中利 用光予非接觸檢測方式之量測技術，可以非破壞方式取得 待測物表面精確的形貌資訊，已廣泛應用於各種產業中。 參照圖1，當待測物12形貌表面斜率較大時，因光學顯 微鏡11常使用的物鏡倍率為20倍以下，此區間之數值孔徑 過小，會造成待測物12表面反射光13無法進入光學顯微鏡 11，而無法取得待測物表面形貌資料。因此，往往只能採 用數值内插法，補足所缺的形貌資料，但無法量得實際形 貌尺寸及其粗糙度資料。 中華民國專利TW1229186利用雙視角之線性掃描裝置 搭配斜向光源，可用以檢測缺陷之大致形狀及尺寸，主 要優點為可較快速檢測大面積之缺陷，並判斷缺陷為凸起 或凹陷。但是無法精確量取微結構三維形貌尺寸，也沒有 解决待測物形貌表面斜率較大時，表面訊號無法被擷取到 的問題。 美國專利6,449,〇48利用將干涉儀傾斜一角度，與待測物 橫移方向不成垂直’可直接使用傳統的垂直掃描干涉儀 201020507 (vso及相移干涉儀（PSI)硬體，連續掃描制物表面， 不需用影像縫補技術，取得待測物表面形貌。但仍未能解 決待測物形貌表面斜率較大样夕入 卞议八呀之全方位角形貌取得之問 題。 QED Technology公司則發展出以傾斜待測物並旋轉的 方式’取得較大表面待測物斜率較大之表面形貌資料。但 此種方式受限於較小之待測樣品，若待測樣品較大，無法 配合傾斜時，則無法使用。 【發明内容】201020507 IX. Description of the Invention: [Technical Field] The present invention relates to an optical detecting device, and more particularly to a three-dimensional topography detecting device. [Prior Art] Post-finishing shape detection is a very important part of modern technology. When many components are gradually miniaturized, more accurate and reliable detection technology is needed to verify the accuracy of microstructure size or shape to control quality. And process. Among them, the measurement technology using the non-contact detection method can obtain accurate surface topography information of the object to be tested in a non-destructive manner, and has been widely used in various industries. Referring to FIG. 1, when the surface slope of the surface of the object to be tested 12 is large, the objective lens magnification often used by the optical microscope 11 is 20 times or less, and the numerical aperture of the interval is too small, which may cause the surface reflected light 13 of the object to be tested 12 to enter. The optical microscope 11 is unable to obtain the surface topography data of the object to be tested. Therefore, numerical interpolation can often only be used to make up the missing shape data, but the actual shape size and roughness data cannot be obtained. The Republic of China patent TW1229186 uses a dual-view linear scanning device with an oblique light source to detect the approximate shape and size of the defect. The main advantage is that the large-area defects can be detected relatively quickly, and the defects are judged to be convex or concave. However, it is impossible to accurately measure the three-dimensional shape of the microstructure, and there is no problem that the surface signal cannot be extracted when the slope of the surface of the object to be tested is large. US Patent 6,449, 〇48 uses the angle of the interferometer at an angle that is not perpendicular to the direction of traverse of the object to be tested. It can be directly used with the traditional vertical scanning interferometer 201020507 (vso and phase shifting interferometer (PSI) hardware, continuous scanning system) The surface of the object does not need to use image stitching technology to obtain the surface topography of the object to be tested. However, it still fails to solve the problem that the slope of the surface of the object to be tested is large and the omnidirectional shape of the image is obtained. Technology has developed a surface topography with a large slope of the surface to be tested by tilting the object to be tested and rotating. However, this method is limited by the smaller sample to be tested. If it is too large to match the tilt, it cannot be used. [Summary of the Invention]
本發明針對先進製程之切削 '壓印 '研磨、奈米加工產 業，開發精密機械所需微結構表面形貌尺寸、大行程奈米 解析、以及高速量測之共通先進檢測和驗證核心技術。本 發明提出一種三維形貌檢測系統，可以有效克服待測物形 貌表面斜率較大時，造成待測物表面反射光訊號無法進入 顯微鏡，而無法取得待測物表面形貌資料的問題。不論是 規則性簡單微結構或複雜之微結構，均得以利用本發明進 行微結構之檢測，可達奈米級之應用。 根據本發明一實施範例之三維形貌檢測裝置，其包含至 少二光學檢測裝置及一傾斜角度調整機構。該傾斜角度調 整機構將至少二光學檢測裝置架設其上，以調整該光學檢 測裝置之傾斜角度。當至少二光學檢測裝置的傾斜角度改 變時’至少二光學檢測裝置的焦點維持在同一位置（或同 一焦平面），並使待測物位於該至少二光學檢測裝置的視 場範圍（Field 〇f view)内。將該至少二光學檢測裝置擁取影 201020507 像資料進行影像重建後，即可得到待測物之三維形貌。 【實施方式】 本發明所揭示之三維形貌檢測系統架構之實現方法將 參考圖式舉例說明如τ，惟肖等實現方式僅係例示，而並 非為其侷限。 如圖2所示，三維形貌檢測裝置20主要包含兩光學檢測 裝置21 22，为置於一圓弧執道23之兩侧。光學檢測裝置 φ 21利用樞紐25於圓弧軌道23滑動，光學檢測裝置22亦利用 樞紐（其設置位置類似於樞紐25相對於光學檢測裝置2工之 位置，但恰為光學檢測系統22所阻擋而未見於圖中）於圓 弧軌道23滑動。圓弧軌道23係一體成型，具良好之剛性， 而可提升光學檢測裝置21、22移動位置之精密度。 根據此圓弧軌道23的路徑可以調整光學檢測裝置幻和 22的傾斜角度，亦即圓弧轨道23係-傾斜角度調整機構。 圓弧軌道23之圓弧中心為光學檢測裝置21和22之對焦成 • 像點，使光學檢測裝置21和22的傾斜角度改變時，光學檢 測裝置21和22的焦點隨時維持在同一位置（同一焦平 面）此外為了要使待測物26的位置落在光學檢測裝置 21和22的視場範_，或者要取得㈣㈣的全方位角影 像時，可以藉由待測物旋轉平台27及移動平台观助完成 取像工作。 光學檢測裝置21和22分別傾斜—個固定角度後各取像 _人此固疋角度之大小取決於待測物26之表面斜率，然 後分別取得的影像經由軟體進行縫合而重建出待測物％ 201020507 形貌。另外，可視待測物26的形貌結構複雜度決定是否需 要增設待測物26之轉動平台27及移動平台28,以改變不同 視角或檢測位置，取得全方位角之三維形貌影像。 上述二維形貌檢測裝置2〇之實際運用可如圖3及圖4所 不之架構，其中圖3顯示立體架構，圖4則為側視圖。經由 兩組步進馬達30轉動導螺桿31，移動連接於光學檢測裝置 21和22的連接軸43及44，使得各別形貌檢測裝置的樞紐 φ 25(另一枢紐未示於圖中）得以在圓弧軌道23上滑動。然後 光學檢測裝置21和22分別取得的影像可經由軟體進行縫 合而重建出待測物形貌。另外，可視待測物的形貌結構複 雜度決疋疋否需要待測物之轉動及移動平台，以改變不同 視角或檢測位置，取得全方位角之三維形貌影像。 實際應用上，並非以上述實施例為限，圓弧軌道亦可以 其他之傾斜角度調整機構替代，例如：連桿機構、χ_γ平 面位移平台、旋轉平台等可實現的機構。該光學檢測裝置 鲁 21、22包含光學顯微鏡、干涉儀等。 练§之，本發明之概念如圖5所示，一三維形貌檢測裝 置50包含兩光學檢測裝置51、52及一傾斜角度調整機構 53。光學檢測裝置5丨、52利用傾斜角度調整機構進行傾 斜角度位置調整，使光學檢測裝置51和52的傾斜角度改變 時，其焦點仍隨時維持在同一位置（同一焦平面），以針對 待測物55進行形貌檢測。三維形貌檢測裝置5〇可應用於檢 測規則性簡單微結構，如背光模組中的增亮膜（)等。 若需檢測如複雜的曲面或錐狀結構等時，複雜微結構係 201020507 單靠兩組光學檢測裝置及傾斜备择 斜角度調整機構仍無法完成 檢測，而需要搭配上可調整样：目丨丨私士人* 登得測物方向角機構才能夠完成 檢測工作。參照圖6，一=綠开;{始仏⑴莊 ―维形貌檢測裝置60除包含兩光 學檢測裝置5卜52及一傾斜角度調整機構㈣，另包含一 待測物方向角調整機構61 ’其可包含例如圖2所示之旋轉 平台27及移動平台28。The invention is directed to the cutting process of the advanced process, the "imprinting" grinding, the nanometer processing industry, the development of the micro-structure surface topography required for precision machinery, the large-stroke nano-analysis, and the high-speed measurement common advanced detection and verification core technology. The invention provides a three-dimensional shape detecting system, which can effectively overcome the problem that when the surface slope of the object to be tested is large, the reflected light signal on the surface of the object to be tested cannot enter the microscope, and the surface topography data of the object to be tested cannot be obtained. Whether it is a regular simple microstructure or a complicated microstructure, the invention can be used to detect microstructures up to nanometer applications. A three-dimensional topography detecting apparatus according to an embodiment of the present invention includes at least two optical detecting devices and an inclined angle adjusting mechanism. The tilt angle adjustment mechanism mounts at least two optical detecting devices thereon to adjust the tilt angle of the optical detecting device. When the tilt angle of at least two optical detecting devices is changed, 'the focus of at least two optical detecting devices is maintained at the same position (or the same focal plane), and the object to be tested is located in the field of view of the at least two optical detecting devices (Field 〇f Inside). After the at least two optical detecting devices capture the image of the 201020507 image, the three-dimensional shape of the object to be tested can be obtained. [Embodiment] The implementation method of the three-dimensional topography detecting system architecture disclosed in the present invention will be exemplified by reference to the figure, such as τ, but the implementation manners are only exemplified, and are not limited thereto. As shown in Fig. 2, the three-dimensional topography detecting device 20 mainly includes two optical detecting devices 21 22 disposed on both sides of an arc track 23 . The optical detecting device φ 21 is slid by the hinge 25 on the circular arc track 23, and the optical detecting device 22 also utilizes a hinge (the set position is similar to the position of the hinge 25 relative to the optical detecting device 2, but is blocked by the optical detecting system 22 Not seen in the figure) sliding on the circular arc track 23. The circular arc track 23 is integrally formed and has good rigidity, and the precision of the moving position of the optical detecting devices 21 and 22 can be improved. According to the path of the circular arc track 23, the inclination angle of the optical detecting means illusion 22, that is, the circular arc track 23-tilt angle adjusting mechanism can be adjusted. The center of the arc of the circular arc track 23 is the focus of the optical detecting devices 21 and 22, and when the tilt angles of the optical detecting devices 21 and 22 are changed, the focal points of the optical detecting devices 21 and 22 are maintained at the same position at any time (same In addition, in order to make the position of the object to be tested 26 fall on the field of view of the optical detecting devices 21 and 22, or to obtain the omnidirectional angle image of (4) and (4), the platform and the mobile platform can be rotated by the object to be tested. Help to complete the image acquisition work. The optical detecting devices 21 and 22 are respectively inclined at a fixed angle, and each of the images is taken. The size of the solid angle depends on the slope of the surface of the object to be tested 26, and then the images respectively obtained are stitched by software to reconstruct the object to be tested. 201020507 Shape. In addition, the complexity of the topography of the object to be tested 26 determines whether it is necessary to add the rotating platform 27 and the moving platform 28 of the object to be tested 26 to change different viewing angles or detecting positions, and obtain a three-dimensional topographic image of the omnidirectional angle. The actual application of the above two-dimensional topography detecting device 2 can be as shown in FIG. 3 and FIG. 4, wherein FIG. 3 shows a three-dimensional structure, and FIG. 4 shows a side view. The lead screw 31 is rotated via the two sets of stepping motors 30, and the connecting shafts 43 and 44 connected to the optical detecting devices 21 and 22 are moved so that the hinges φ 25 of the respective topography detecting devices (the other hub is not shown in the drawing) It is possible to slide on the circular arc track 23. Then, the images respectively obtained by the optical detecting devices 21 and 22 can be stitched by the software to reconstruct the shape of the object to be tested. In addition, the complexity of the topography of the object to be tested depends on whether the object to be tested is rotated and moved to change the different viewing angles or detection positions to obtain a three-dimensional image of the omnidirectional angle. In practical applications, not limited to the above embodiments, the circular arc track can be replaced by other tilt angle adjusting mechanisms, such as a link mechanism, a χ_γ plane displacement platform, a rotating platform, and the like. The optical detecting devices Lu 21 and 22 include an optical microscope, an interferometer, and the like. As shown in FIG. 5, a three-dimensional topography detecting device 50 includes two optical detecting devices 51, 52 and an inclined angle adjusting mechanism 53. The optical detecting devices 5, 52 adjust the tilt angle position by the tilt angle adjusting mechanism, and when the tilt angles of the optical detecting devices 51 and 52 are changed, the focus is always maintained at the same position (the same focal plane) for the object to be tested. 55 for topography detection. The three-dimensional shape detecting device 5 can be applied to detect a regular simple microstructure, such as a brightness enhancement film () in a backlight module. If it is necessary to detect such a complex curved surface or a tapered structure, the complex microstructures 201020507 can not be completed by two sets of optical detection devices and tilting alternative angle adjustment mechanisms, but need to be matched with adjustable samples: The private person* is able to complete the inspection work by the direction of the object. Referring to Fig. 6, open; {Starting (1) Zhuang-dimensional topography detecting device 60 includes two optical detecting devices 5 and 52 and an inclined angle adjusting mechanism (4), and further includes a to-be-measured object direction adjusting mechanism 61' It may comprise, for example, a rotating platform 27 and a mobile platform 28 as shown in FIG.
申言之，本發明湘傾斜式光學檢測架構，可取得斜率 較大之表面形貌資料，且可應用於待測樣品不方便傾斜之 狀況。另外，本發明利用傾斜角度調整架構可調整影像檢 測裝置至任意角度，以取得待測物影像並重建三維形貌； 且可檢測微結構形貌尺寸及較大表面待測物之形貌尺寸。 以應用面而言，例如應用於平面顯示器產業背光模組之 滾筒模仁加工機，可於加工完成後直接在加工機上檢測加 工精度’不需將工件卸下檢測，若檢測出加工精度不足， 又需再重新上機定位加工的麻煩，可節省時間，提高效 率。又如可應用於半導體產業、平面顯示器產業、光學元 件產業之微結構檢測及光學元件形貌檢測。本發明可用於 顯微鏡支架架構，用以檢測待測樣品之微結構三微形貌， 特別是可以克服斜率較大之表面檢測問題；或用於檢測較 大表面之待測物（如非球面鏡）之形貌尺寸，可確實掌握 產品品質’提尚製程效率。 本發明之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種 不背離本發明精神之替換及修飾。因此，本發明之保護範 201020507 圍應不限於實施範⑽揭示者，而應包括各種不f離本發 明之替換及修飾，並為以下之_請專利範圍所涵蓋。 【圖式簡單說明】 圖1顯示習知之二維形貌檢測裝置之示意圖； 圖2至圖4顯示本發明一實施範例之三維形貌檢測裝置 之示意圖；以及 圖5及圖6顯示本發明之三維形貌檢測裝置之概糸，一 圖。 &不意 ❹It is claimed that the Xiang tilt optical inspection architecture of the present invention can obtain surface topography data with a large slope, and can be applied to a situation in which the sample to be tested is inconvenient to tilt. In addition, the present invention utilizes the tilt angle adjustment architecture to adjust the image detecting device to an arbitrary angle to obtain an image of the object to be tested and reconstruct a three-dimensional topography; and to detect the size of the microstructure and the topography of the larger surface object to be tested. In terms of application, for example, the roller mold processing machine applied to the backlight module of the flat panel display industry can directly detect the machining accuracy on the processing machine after the completion of the processing, and does not need to remove the workpiece to detect, if the processing accuracy is insufficient Moreover, it is necessary to re-locate the machine to solve the problem, which can save time and improve efficiency. Another example can be applied to the semiconductor industry, the flat panel display industry, the optical component industry, microstructure inspection and optical component topography. The invention can be applied to a microscope support structure for detecting the microstructure of the sample to be tested, in particular, the surface detection problem with a large slope can be overcome; or the object to be tested for detecting a large surface (such as an aspherical mirror) The size of the shape can accurately grasp the product quality' to improve the process efficiency. The technical contents and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the protection of the present invention 201020507 is not limited to the disclosure of the embodiment (10), but should include various alternatives and modifications, and is covered by the following patent scope. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a conventional two-dimensional topography detecting device; FIG. 2 to FIG. 4 are views showing a three-dimensional topography detecting device according to an embodiment of the present invention; and FIGS. 5 and 6 show the present invention. An overview of the three-dimensional shape detection device, a picture. & don't care ❹
【主要元件符號說明】 11 光學顯微鏡 12 待測物 13 反射光 20 三維形貌檢測裝置 21 光學檢測裝置 22 光學檢測襞置 23 圓弧軌道 25 樞紐 26 待測物 27 旋轉平台 28 移動平台 30 馬達 31 導螺桿 43 連接軸 44 連接軸 50 二維形貌檢測裝晉 51 光學檢測裝置 52 光學檢測裝置 53 傾斜角度調整裝 55 待測物 60 一維形貌檢測袭 61 方向角調整機構[Explanation of main component symbols] 11 Optical microscope 12 Object to be tested 13 Reflected light 20 Three-dimensional shape detecting device 21 Optical detecting device 22 Optical detecting device 23 Arc track 25 Hub 26 Object to be tested 27 Rotating platform 28 Moving platform 30 Motor 31 Lead screw 43 Connecting shaft 44 Connecting shaft 50 Two-dimensional shape inspection Mounting 51 Optical detecting device 52 Optical detecting device 53 Tilt angle adjusting device 55 Object to be tested 60 One-dimensional shape detection attack 61 Directional angle adjustment mechanism