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TW201029914A - Assembly method of 3D micro structures - Google Patents

Assembly method of 3D micro structures Download PDF

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Publication number
TW201029914A
TW201029914A TW98103836A TW98103836A TW201029914A TW 201029914 A TW201029914 A TW 201029914A TW 98103836 A TW98103836 A TW 98103836A TW 98103836 A TW98103836 A TW 98103836A TW 201029914 A TW201029914 A TW 201029914A
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TW
Taiwan
Prior art keywords
layer
rotating shaft
dimensional microstructure
assembling
assembly
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Application number
TW98103836A
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Chinese (zh)
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TWI365167B (en
Inventor
Yi Chiu
wei-zhi Huang
Chang-Shiou Wu
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Univ Nat Chiao Tung
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Priority to TW098103836A priority Critical patent/TWI365167B/en
Publication of TW201029914A publication Critical patent/TW201029914A/en
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Publication of TWI365167B publication Critical patent/TWI365167B/en

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Abstract

An assembly method for 3D micro structures requiring only a one-push operation to assemble is disclosed. This method includes providing a substrate base layer with a depressed accommodating space; forming a flip-up component with an assembly push pad and at least one rotational axis; forming a fixing device for the flip-up component including at least one hinge, arranged on and across a rotational axis; and finally, pushing the assembly push pad to rotate the rotational axis until the push pad fully submerges into the accommodating space, by which time the flip-up components has been flipped up. Moreover, the present invention discloses a hinge of V-like arm which enables playless rotation of the rotational axis. The present invention is compatible with electronic package process, and is convenient to be automated. Especially if there are multiple micro structures arranged in array, the automated equipment can be configured to push multiple assembly push pads simultaneously to assemble.

Description

201029914 六、發明說明: 【發明所屬之技術領域】 本發明係有關一種三維微結構之組裝方法,特別是一種可使用電子 封裝的標準設備且只需簡單一推之控制來組裝的方法,以及組裝所需 的鉸鏈裝置。 【先前技術】 微組裝之三維結構有許多微機電系統(Micro-Electro-Mechanical201029914 VI. Description of the Invention: [Technical Field] The present invention relates to a method for assembling a three-dimensional microstructure, in particular, a method that can be assembled using a standard device of an electronic package and controlled by a simple push, and assembly The required hinge device. [Prior Art] Micro-assembled three-dimensional structure has many MEMS (Micro-Electro-Mechanical

Systems,MEMS)方面的應用,例如像微光學系統所需之鏡子和平面光 學元件,以及高頻率應用所需之線圈電感。多數這些元件在一層薄膜 上利用表面微機械加工(Micromachining)技術製作,再被豎立以形成三 維微系統。其中,微鉸鏈為一種普遍的固定豎立元件之方式。習知有 許多技術可用來組裝三維元件。除了用探針手動組裝以外,運用外力 的組裝包括磁力、靜電力、離心力、超音震動或微致動器。自組裝包 括運用預應力雙層樑(Pre-stressedbimorphbeams)以及表面張力。因為 系統封裝需要將多個晶片接合及打線,所以自動)化組裝表可=力電= 裝製程的標準設傷或使用特殊設備。使用標準設備中的取放 (PiCk-and_Plaee)及打線設備來輔助微機電系統元件的組裝可以達成一 個更具可靠性 '雜,及更纽⑽組裝和封裝過程。 自由度與高精 個設備來自動崎三維微機«统其中一 與笑物器的控制蚊位。因為將被豎立之元件 準小,將探針插入缝隙的動作需要高 4 201029914 【發明内容】 為解決上述問題’本發明目的之一係提供一種三維微結構之 法’先提供-具有組裝推墊及至少—旋轉軸之登立树於基底層上方 且於基底層上設有對應組裝推墊位置的容置郎;並設錢定 含鉸鏈固定元件橫置練_上;再來,只需以—如探針之裝= 向下往容置的方向推組裝推塾,以稱由鉸鏈固定元件固定 轉軸,使豎立元件t立。容置空間提供探針在垂直方向的定位許 度,即探針可以推雜深但仍秘響豎立元件的最㈣^橫向定位 亦不需很精準’只要探針是在組裝推墊面積含蓋的細内即可。 本發明目狀-紐供-種三維縣構_綠,可細於組 列設置之複數個微結構,每-個均包含g立元件、容置空間及固定裝 置,利用自動化控制之複數個探針,同時推動每—微結構上之 塾,以迳忐細雄。 本發明目的之-係提供-種鉸鏈EI定裝置,祕組裝三維微社構, 係以至少一似V懸臂橫置於旋轉軸上,且似v懸臂之至少一端固定於 基底層上,使旋轉轴旋轉時,上下左右均不會晃動。 、Systems, MEMS) applications such as mirrors and planar optics required for micro-optical systems, and coil inductance required for high frequency applications. Most of these components are fabricated on a thin film using surface micromachining techniques and erected to form a three dimensional microsystem. Among them, the micro-hinge is a common way to fix the erected components. There are many techniques that can be used to assemble three-dimensional components. In addition to manual assembly with a probe, the assembly using external forces includes magnetic force, electrostatic force, centrifugal force, supersonic vibration or microactuator. Self-assembly includes the use of pre-stressed bimorph beams and surface tension. Because the system package needs to bond and wire multiple wafers, the automatic assembly table can be used to control the standard damage of the process or use special equipment. The use of pick-and-place (PiCk-and_Plaee) and wire-bonding equipment in standard equipment to assist in the assembly of MEMS components can lead to a more reliable 'noisy' and more new (10) assembly and packaging process. The degree of freedom and high precision of the equipment to automatically Saki three-dimensional microcomputer «one of them with the control of the mosquito bites. Since the component to be erected is small, the action of inserting the probe into the slit needs to be high. 4 201029914 [Invention] In order to solve the above problem, one of the objects of the present invention is to provide a method of three-dimensional microstructure, which is provided first - with an assembly push pad And at least - the axis of the rotating shaft is above the base layer and is provided with a corresponding arranging position on the base layer corresponding to the position of the push pad; and the money fixing hinge fixing member is placed horizontally _ on the bottom layer; For example, if the probe is mounted, push the assembly pusher in the direction of the accommodating direction, so that the hinge is fixed by the hinge fixing member, so that the erected component is erected. The accommodating space provides the positioning degree of the probe in the vertical direction, that is, the probe can push the deep but still the most (4) horizontal positioning of the erected component, and the lateral positioning does not need to be very precise 'as long as the probe is covered in the assembled push pad area The fineness can be. The object of the present invention - the new supply - the three-dimensional county structure _ green, can be finer than the plurality of microstructures arranged in the group, each of which contains the g-component, the accommodating space and the fixture, using a plurality of automatic control The needle, at the same time, pushes the 塾 of each micro-structure to make it fine. The object of the present invention is to provide a hinge EI fixing device, which is a three-dimensional micro-architecture, which is placed on a rotating shaft with at least one V-like cantilever, and at least one end of the v-like cantilever is fixed on the base layer to rotate When the shaft rotates, it will not shake up, down, left, and right. ,

本發明一實施例之一種三維微結構之組裝方法,係包括提供一基底 層,具有下凹之-容置空間;提供-豎立元件平置於基底層上,^中 豎立元件包括一主體,至少一旋轉軸,以及一組裝推墊,係設置於主 體之底部’其巾容置空間躲對餘裝推餘聽設置轉納組裝推 墊;提供一固定裝置直接或間接固定豎立元件於基底層上,其中固定 裝置包括至少一鉸鏈固定元件且分別橫置於旋轉軸上;以及推動組裝 推墊使其沒入容置空間,以旋轉由鉸鏈固定元件固定之旋轉軸,使豎 立元件豎立。 本發明一實施例之一種鉸鏈固定元件應用於一三維微結構之組 裝,此三維微結構係設置於一基板上並具有至少一旋轉轴,其中鉸鏈 固定元件包括:至少一似V懸臂,具有一肘部及兩支臂,肘部係對準 5 201029914 並疊置於旋轉轴上’兩支臂分別向旋轉軸之兩側延伸,且似v懸寶之 至少一端固定於基板上。 以下藉由具體實施例配合所_圖式詳加說明,當更容易瞭解本發 明之目的、技術内容、特點及其所達成之功效。 【實施方式】 請參閱圖1,為本發明三維微結構之組裝方法一實施例之組裝前之 立體結構示意®,本發贱提供了-結構包括-基麟1G,具有下凹 之一容置空間11; 一豎立元件31,置於基底層1〇上,包括一主體311、 一旋轉轴312b及一組裝推墊313,設置於主體之底部;一固定裝置51, 直接或間制定t立元件31於基底層1G上,包括—鉸姻定元件 5n,橫置於旋轉抽312b上。本發明接著提供了一便捷的组裝步驟,即 推動組裝推墊313使其沒入容置空間u,以旋轉由鉸鍵固定元件511 固定之旋轉軸迎,使g立元件31豎立。於本實施例中,旋轉轴 係置於主體311之右側(亦可為左側)。 請參閱圖2 ’為本發明另一實施例之組裝前立體結構示意圖,其相 較於圖1之實施例’在主體311之左側多了一組旋轉軸312b,及鉸鏈 固定元件511,橫置於左側之旋轉軸312b上。以下之實施例均以二旋 轉軸312b,二鉸鏈固定元件作說明。 接續上述說明,言青參閱圖如’本發明一實施例之每一鉸鍵固定元 件511 ’包括至少一似v懸臂(v_likearm) 5m,具有一肘部511“及 二支臂5111b,肘部5nia係疊置於旋轉軸312b上,二支臂5111b分 別向旋轉軸312b之兩侧延伸,且似v懸臂51u至少一端直接或間接 固定於基底層1G上,如ϋ丨所示。請參關3b,觸如之局部側視 圖,當豎立元件31豎立時,二支臂5111b向上彎曲,造成一垂直向下 之力量,垂直壓固旋轉軸312b。請參閱圖3c,為圖3&之俯視圖,肘部 5111a之兩側水平壓固旋轉軸312b之兩側。因此,此似v懸臂5ΐιι, 6 201029914 H旋轉軸312b旋轉時上下左右均不會晃動。 ,參閱圖4’本發明一實施例之每—鉸鏈固定元件511搭配似v懸 :,知之訂書針構件5112,訂書針構件5112之兩端分別直接 =接固定_熱遍之_基絲1G上,習知之訂書針構件 ^赚繼熱之綠本㈣又—實施例之每—鉸賴定元件 511,、包括訂書針構件5112。 3續參關4,本發明-實施例之豎立元件31更包括二中空側 Li 一中空側翼312,如圖1所示),設置於主體311之兩側, 太^日—上緣Μ%及―下軸,此下鱗料錢熱312b。接續上述, 之固定裝置”更包括二嵌翻定元件叫或只有一嵌 #51= ’如圖1所不),分別包括—嵌鎖片5121,上設有一 V形凹 彈性部位5122 ’其一端繼鎖片5121,另-端 直=間接固定於基底層!。上。當g立元件31豎立時,中㈣翼阳 之上緣312a滑進V形凹槽5121a,以卡住暨立元件 本發I實施例以-探針來推動_轉。喊時,容置 ==ΐΓ多裕度,且探針可以推動的較深,而不影響豎 ί ’因此在力度上無报大限制;而組裝推墊: 水平讀上有料容限,故轉崎供了—種只需推動一次即 π成組裝二維微結構的方法,探針不需要高精準度與自由 :f 可以複數娜針,同時縣㈣紅轉敝置’ 關(optical switch),及顯示器等。本發 及尤開 器之微透鏡,或是高頻應用之線圈電感。70件亦可為應用於顯示 圖 5a、5b、5c、5d 為本發明—實御彳之製奴喊轉之結構剖 201029914 面圖,如圖5a所示,先提供一基板s,此基板s可為一絕緣層上矽 (Silkcm_〇n-insulat〇r, S0I)基板,其包括一基底層1〇,一絕緣層2〇,及 一裝置層30。再來請參照圖5b ,利用適當方式,例如微影蝕刻方法, 將裝置層30圖案化,以形成豎立元件31,其巾暨立元件31包括主體 311、旋轉轴3i2b及組裝推墊313。接續參考圖5b,再設置一圖案化之 犧牲層4G雌置層3〇上,此齡層⑽之材料可縫錄並以電聚輔 助化學氣相沈積(Plasma _Enhenced Chemical Vapor Deposition^ PECVD:)A method for assembling a three-dimensional microstructure according to an embodiment of the present invention includes providing a base layer having a recessed-accommodating space; providing a standing component lying flat on the base layer, wherein the upright component includes a body, at least a rotating shaft, and an assembly push pad, is disposed at the bottom of the main body, and the towel receiving space is arranged to hide the assembly push pad; and a fixing device is provided to directly or indirectly fix the standing component on the base layer The fixing device includes at least one hinge fixing member and is respectively placed on the rotating shaft; and pushes the assembling push pad to be immersed in the accommodating space to rotate the rotating shaft fixed by the hinge fixing member to erect the erecting member. A hinge fixing component according to an embodiment of the present invention is applied to assembly of a three-dimensional microstructure, which is disposed on a substrate and has at least one rotating shaft, wherein the hinge fixing component comprises: at least one V-like cantilever, having one The elbow and the two arms, the elbows are aligned with 5 201029914 and stacked on the rotating shaft. The two arms respectively extend to both sides of the rotating shaft, and at least one end of the v-like suspension is fixed on the substrate. The purpose of the present invention, the technical content, the features, and the effects achieved by the present invention will be more readily understood by the following detailed description. [Embodiment] Please refer to FIG. 1 , which is a schematic diagram of a three-dimensional structure before assembly according to an embodiment of a method for assembling a three-dimensional microstructure according to the present invention. The present invention provides a structure including a base 1G, and has a recessed one. a vertical member 31 is disposed on the base layer 1 , and includes a main body 311 , a rotating shaft 312 b and an assembly push pad 313 disposed at the bottom of the main body; and a fixing device 51 for directly or indirectly forming the t-shaped member 31 on the base layer 1G, including the hinged element 5n, is placed across the rotary pumping 312b. The present invention then provides a convenient assembly step of pushing the push pad 313 into the receiving space u to rotate the rotating shaft held by the hinge fixing member 511 to erect the g member 31. In the present embodiment, the rotating shaft is placed on the right side (may also be the left side) of the main body 311. 2 is a schematic view of a three-dimensional structure before assembly according to another embodiment of the present invention. Compared with the embodiment of FIG. 1 , a set of rotating shafts 312 b and a hinge fixing member 511 are placed on the left side of the main body 311, and are placed transversely. On the left side of the rotating shaft 312b. The following embodiments are illustrated by two rotating shafts 312b and two hinge fixing members. Following the above description, each of the hinge fixing members 511' according to an embodiment of the present invention includes at least one v-like arm 5m having an elbow 511" and two arms 5111b, elbow 5nia. The two arms 5111b are respectively disposed on the two sides of the rotating shaft 312b, and the at least one end of the v-shaped cantilever 51u is directly or indirectly fixed to the base layer 1G, as shown in ϋ丨. a partial side view, when the upright member 31 is erected, the two arms 5111b are bent upward, causing a vertical downward force to vertically press the rotating shaft 312b. Please refer to FIG. 3c, which is a top view of FIG. 3 & The two sides of the portion 5111a are horizontally pressed and fixed on both sides of the rotating shaft 312b. Therefore, the v-cantilever 5 ΐ ιι, 6 201029914 H rotating shaft 312b does not sway when rotating, and sees FIG. 4' each of the embodiments of the present invention. - the hinge fixing member 511 is matched with a v-suspension: the staple member 5112 is known, and the two ends of the staple member 5112 are directly connected to the fixed heat_the base wire 1G, and the conventional staple member is earned. Heat Green (4) Again - each of the examples - hinged The member 511 includes a staple member 5112. The continuation member 4 of the present invention further includes two hollow sides Li, a hollow side flap 312 (shown in FIG. 1), and two of the main body 311. Side, too ^ day - upper edge Μ% and ―lower axis, the next squama money heat 312b. Continued above, the fixture "includes two inverting elements called or only one embedded #51 = ' as shown in Figure 1 No, respectively, the locking piece 5121 is provided with a V-shaped concave elastic portion 5122', one end of which is followed by the locking piece 5121, and the other end is straight = indirectly fixed to the base layer! . on. When the g-shaped member 31 is erected, the middle (four) wing male upper edge 312a slides into the V-shaped groove 5121a to catch the gantry element. The embodiment of the present invention pushes the _ turn with the probe. When shouting, the placement == ΐΓ multi-margin, and the probe can push deeper without affecting the vertical ί ' so there is no big limit on the strength; and the assembly push pad: the horizontal reading has the material tolerance, so turn Saki provides a method of assembling a two-dimensional microstructure with only one push, that is, π into a two-dimensional microstructure. The probe does not require high precision and freedom: f can be used for multiple needles, and the county (four) red switch is set to 'optical switch'. And monitors, etc. The microlens of this and the special opener, or the coil inductance of high frequency applications. 70 pieces can also be used for the display of Figures 5a, 5b, 5c, 5d. This is a cross-sectional view of the structure of the invention, which is shown in Figure 5a. First, a substrate s is provided. It can be an insulating layer (Silkcm_〇n-insulat〇r, S0I) substrate, which comprises a substrate layer 1 , an insulating layer 2 , and a device layer 30 . Referring again to Figure 5b, the device layer 30 is patterned by a suitable means, such as a lithography process, to form the upstanding member 31, which includes a body 311, a rotating shaft 3i2b, and an assembly pad 313. Next, referring to FIG. 5b, a patterned sacrificial layer 4G is disposed on the female layer 3, and the material of the layer (10) can be sewn and electrically vapor-deposited (Plasma_Enhenced Chemical Vapor Deposition^PECVD:).

之方法來製作。再來,如圖5。所示,設置—固定層5()於犧牲層上, 圖案化固定層5〇轉烟定裝置51(圖巾所示為鉸顧定元件之財部 5111a)’此固定層5〇可以由su_8光阻、金屬或絕緣物質等材料來形成; ,且’在基底層10上形成容置空間n,此容置空間U可為一通孔, 可由基底層1G底侧郷t如圖5d所示,將犧牲層4()及部分絕緣 層20移除’使登立元件3卜及部分固定裝置51可以活動 推 使其没人容置空間11,達成將豎立元件31 ^立,需說 月的疋,圖5d所示為圖3中虛線ΑΑ,之剖面。 容可活躺賢立耕及翔找置於設置有下凹的 底層上。其中,賢立元件設有-組裝推墊及至少-二 Γ包括至少一鉸鏈固定元件,設置於旋轉軸上。再來: =裝,,使旋轉轴在鉸鏈元制定之下_ 二 塾疋全没人谷置空m元件即已豎立成—三維微 政褒推 化之探針’達成一次推動的動作,若有多個微結構】可 =可利用多個探針,同時完成—次推動的動作。另外 叹置’ 本發=提供-種鉸鏈_元件包括—似v懸臂,其置 都不會晃動 2-端固定於旋轉轴之兩側’可使旋轉轴轉動時,= 其目的在 當不能以 魅以上所述之實施例僅係為說明本發明之技術思想及触 …、習此項技藝之人士能夠瞭解本發明之内容並據以實施,’ 8 201029914 之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等 •變化或修飾,仍應涵蓋在本發明之專利範圍内。 201029914 f圖式簡單說明j 圖i所示為本發明一實施例組裝前之立體結構示意圖。 圖2所示為本發明一實施例組裝前之立體結構示意圖。 圖3a、圓3b與圖3c所示為本發明似ν懸臂鉸鏈固定元件之示章圖。 圖4所示為本發明一實施例組裝前之平面示意圖。 ®I5b圖Sc圖%所示為本發明一實施例之製程及組裝步潑 之結構剖面圖。 ® 【主要元件符號說明】 S 10 11 20 30 31 311 312 312a 312b 313 40 50 51The method to make. Again, as shown in Figure 5. As shown, the fixing layer 5 () is disposed on the sacrificial layer, and the fixed layer 5 is patterned to rotate the cigarette fixing device 51 (the figure shows the wealth of the component 5111a). This fixed layer 5 can be lighted by su_8 a material such as a resist, a metal or an insulating material is formed; and 'the accommodating space n is formed on the base layer 10, and the accommodating space U can be a through hole, which can be 郷t from the bottom side of the base layer 1G, as shown in FIG. 5d. The sacrificial layer 4 () and the portion of the insulating layer 20 are removed to enable the erecting member 3 and the portion of the fixing device 51 to be moved so that no one can accommodate the space 11 to achieve the erecting of the erecting member 31. 5d is a cross section of the dotted line 图 in Fig. 3. It can be placed on the ground floor with a concave surface. Wherein, the sturdy element is provided with an assembly push pad and at least - two Γ includes at least one hinge fixing element disposed on the rotating shaft. Then: = Install, make the rotating shaft under the hinge element _ 塾疋 塾疋 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人 没人There are multiple microstructures.] = Multiple probes can be used to perform the simultaneous push action. In addition, the sigh 'this hair = provide - kind of hinge _ components include - like v cantilever, it will not shake the 2-end fixed on both sides of the rotating shaft' can make the rotating shaft rotate, = its purpose is not The embodiments described above are merely illustrative of the technical idea of the present invention, and those skilled in the art can understand the contents of the present invention and implement it according to the '8 201029914, which defines the patent scope of the present invention. Equivalences, variations, or modifications made in accordance with the spirit of the invention should still be included in the scope of the invention. 201029914 f BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the three-dimensional structure of an embodiment of the present invention before assembly. FIG. 2 is a schematic view showing the three-dimensional structure before assembly according to an embodiment of the present invention. Fig. 3a, circle 3b and Fig. 3c are diagrams showing the ν cantilever hinge fixing member of the present invention. 4 is a schematic plan view showing an embodiment of the present invention before assembly. ® I5b Figure Sc Figure % shows a cross-sectional view of the process and assembly steps of an embodiment of the present invention. ® [Main component symbol description] S 10 11 20 30 31 311 312 312a 312b 313 40 50 51

基板 基底層 容置空間 絕緣層 裝置層 豎立元件 主體 中空側翼 上緣 旋轉轴 組裝推墊 犧牲層 固定層 固定裝置 鉸鏈固定元件 511 201029914 5111 似V懸臂 5111a 肘部 5111b 支臂 5112 訂書針構件 512 嵌鎖固定元件 5121 嵌鎖片 5121a V形凹槽 5122 彈性部位Substrate base layer accommodation space insulation layer device erecting element body hollow side wing upper edge rotation axis assembly push pad sacrificial layer fixing layer fixing device hinge fixing member 511 201029914 5111 like V cantilever 5111a elbow 5111b arm 5112 staple member 512 embedded Lock fixing element 5121 Inserting piece 5121a V-shaped groove 5122 Elastic part

Claims (1)

201029914 • 七、申請專利範圍: 1 ·種二維微結構之喊方法,其包含下列步碑: 知供基底層,其中該基底層具有下凹之一容置空間; 提供一豎立元件平置於該基底層上,其中該豎立元件包含: —主體; 至少一旋轉轴;以及 —組裝推墊,係設置該主體之底部,其中該容置空間係於對應 該組裝推塾位置處設置以容納該組裝推墊; 、‘ )j供一固定裝置將該豎立元件直接或間接固定於該基底層上,其中 • 该固定裝置包含至少一鉸鏈固定元件,橫置於該旋轉軸上;以及 〜推動該組裝推塾使其沒人該容置空間,以旋轉由該鉸鏈固定元件固 定之該旋轉軸,使該豎立元件豎立。 2. 如請求項1所述之三維微結構之組裝方法,其中該鉸鏈固定 元件包含: 至少一似V懸臂(V-like arm),具有一肘部及兩支臂,該肘部係對準 並叠置於該旋轉軸上,該兩支臂分別向該旋轉軸之兩侧延伸,且似V懸 臂之至少一端直接或間接固定於該基底層上。 3. 如請求項1所述之三維微結構之組裝方法,其中該鉸鏈固定元 φ 件包含: 至少一訂書針式構件,其兩端分別直接或間接固定於該旋轉軸兩側 之該基底層上。 4. 如請求項1所述之三維微結構之組裝方法,其中該豎立元件更 包含至少一中空側翼設置該主體之側,該中空側翼包含一上緣與一下 軸,以及該下轴即為該旋轉軸。 5. 如請求項4所述之三維微結構之組裝方法,其中該固定裝置 更包含至少一嵌鎖固定元件設置於該中空側翼之尾處,且該嵌鎖固定元 • 件係包含: 12 201029914 一嵌鎖片’具有-v形凹槽,在該豎立元件 空側翼之該上緣;以及 轉丑立時’卡住該中 至少-彈性部位,其中該彈性部位之_端連接 直接或間翻定於該基底層上。 # ’另-端則 6. 如請求項1所述之三維微結構之組裝方法, 塾之步驟係麟完成。 4推動該組裝推 7. 如請求項6所述之三維㈣構之組裝方法, ❹ 參 為;數個,係陣列設置;該容置空間為複數個對應糾豎: 凡件,該固定裝置為複數個’對應該些豎立元件;以及; 為複數個,同時將該些豎立元件豎立。 7 8. 如請求項i所述之三維微結構之崎 為一微鏡。 共中該豎立7G件 9. 如請求項1所述之三維微結構之組裝方法,更包入. 其由下社依序包含-基顧裝置層; 圖案化該裝置層以形成該豎立元件; 設置圖案化之一犧牲層於該裝置層上; $-固定層於圖案化之該犧牲層上,並圖案化該固定層以形成該 固疋褒置,以及 以活Ϊ去該犧牲層與雜親緣層,使辟立元件及部份制定裝置可 I0:?,9所述之三維微結構之組裝方法,其中該基板為-多&緣增上够基板。 求項9所述之三維微結構之組裝方法,其中該犧牲層為 電聚輔助化學氣相沈積(Plasma Enh繼d㈤瓜⑹! Vapor Dep〇siti〇n,pECVD)方法製作。 13 201029914 1如_1 絲項9所述之三賴結狀㈣枝,其巾除去該犧牲 層與部份該絕緣層之步驟係使用絲酸蒸氣(HFvap〇r)。 13.如請求項9所述之三維微結構之組裝方法,其中該固定層之 材質可為光阻、金屬或絕緣物質。 14_如請求項9所述之三維微結構之組裝方法,其中該容置空間可 為一通孔貫穿該基板。 15.如請求項9所述之三維微結構之組裝#法,其中該通孔可由從 該基板底部刻餘而成。 ❿ 16.—種鉸定元件應胁—三維微結構之組裝,該三維微結構係設置 於一基板上並具有至少一旋轉軸,其中該鉸鏈固定元件包含: 至少-似V懸臂’具有-肘部及兩支臂,該肘部係對準並叠置於該 旋轉軸上,該兩支臂分別向該旋轉軸之兩侧延伸,且該似V懸臂之至少 一端直接或間接固定於該基板上。 ’ V 17·如請求項16述之鉸鏈固定元件,其中該似V懸臂之兩端係貼附於該 旋轉軸之兩側,該豎立元件豎立時,該些支臂向上彎曲,形成一向下之 力量,垂直壓固該旋轉軸。 18.如請求項16述之鉸鍊固定元件,其中該似V懸臂之該肘部兩側係水 平壓固該旋轉轴之兩側。 鲁201029914 • Seven, the scope of application for patents: 1 • A two-dimensional micro-structure shouting method, which includes the following steps: Knowing the base layer, wherein the base layer has a recessed accommodation space; providing a vertical component to be placed flat The erecting element, wherein the erecting component comprises: a body; at least one rotating shaft; and an assembly push pad, the bottom of the body is disposed, wherein the accommodating space is disposed at a position corresponding to the assembled push to accommodate the Assembling the push pad; , ') j for a fixing device to directly or indirectly fix the upright member to the base layer, wherein: the fixing device comprises at least one hinge fixing member transverse to the rotating shaft; and The pusher is assembled so that no one can accommodate the space to rotate the rotating shaft fixed by the hinge fixing member, so that the standing member is erected. 2. The method of assembling a three-dimensional microstructure according to claim 1, wherein the hinge fixing member comprises: at least one V-like arm having an elbow and two arms, the elbow alignment And stacked on the rotating shaft, the two arms respectively extend to both sides of the rotating shaft, and at least one end of the V-like cantilever is directly or indirectly fixed to the base layer. 3. The method of assembling a three-dimensional microstructure according to claim 1, wherein the hinge fixing member φ comprises: at least one staple member having two ends directly or indirectly fixed to the base on both sides of the rotating shaft On the floor. 4. The method of assembling a three-dimensional microstructure according to claim 1, wherein the upright member further comprises at least one hollow flank providing a side of the body, the hollow flank comprising an upper edge and a lower axis, and the lower axis is the Rotate the axis. 5. The method of assembling a three-dimensional microstructure according to claim 4, wherein the fixing device further comprises at least one interlocking fixing element disposed at the tail of the hollow side wing, and the locking fixing element comprises: 12 201029914 a locking tab 'having a -v-shaped recess in the upper edge of the yoke of the upright member; and engaging at least the elastic portion of the erected portion, wherein the _ end connection of the elastic portion is directly or indirectly On the substrate layer. # ‘其他-端等 6. As in the assembly method of the three-dimensional microstructure described in claim 1, the step of the 系 is completed. 4 Pushing the assembly push 7. The assembly method of the three-dimensional (four) structure described in claim 6 is 参 为; several, the array is set; the accommodating space is a plurality of corresponding erecting: A plurality of 'corresponding to the erected components; and; a plurality of, and the erected components are erected at the same time. 7 8. The three-dimensional microstructure of claim i is a micromirror. A total of 7G pieces are erected. 9. The assembly method of the three-dimensional microstructure according to claim 1 is further included. It is sequentially included by the lower body - the device layer is patterned; the device layer is patterned to form the upright component; Forming one of the sacrificial layers on the device layer; $-fixing the layer on the patterned sacrificial layer, and patterning the pinned layer to form the solid layer, and removing the sacrificial layer and the living layer The kinetic layer enables the arranging device and the partial elaboration device to be assembled by the three-dimensional microstructure described in I0:?, 9, wherein the substrate is multi- & The method for assembling a three-dimensional microstructure according to claim 9, wherein the sacrificial layer is produced by electropolymerization assisted chemical vapor deposition (Plasma Enh, followed by d (5) melon (6)! Vapor Dep〇siti〇n, pECVD). 13 201029914 1 The three-layered (four) branch of the yarn item 9, wherein the step of removing the sacrificial layer and a portion of the insulating layer is a filament acid vapor (HFvap〇r). 13. The method of assembling a three-dimensional microstructure according to claim 9, wherein the material of the fixing layer is a photoresist, a metal or an insulating material. The method of assembling a three-dimensional microstructure according to claim 9, wherein the accommodating space is a through hole penetrating the substrate. 15. The method of assembling a three-dimensional microstructure according to claim 9, wherein the through hole is formed by engraving from the bottom of the substrate. ❿ 16. The hinge element is a component of the three-dimensional microstructure, the three-dimensional microstructure is disposed on a substrate and has at least one axis of rotation, wherein the hinge fixing element comprises: at least - like a V-cantilever' has an elbow And two arms, the elbows are aligned and stacked on the rotating shaft, the two arms respectively extend to two sides of the rotating shaft, and at least one end of the V-like cantilever is directly or indirectly fixed to the substrate on. The hinge fixing member of claim 16, wherein the two ends of the V-shaped cantilever are attached to both sides of the rotating shaft, and when the standing members are erected, the arms are bent upward to form a downward direction. Force, vertically compress the rotating shaft. 18. The hinge fixing member of claim 16, wherein the sides of the elbow of the V-like cantilever are horizontally pressed against both sides of the rotating shaft. Lu
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TWI488801B (en) * 2011-02-23 2015-06-21 Univ Nat Chiao Tung A three dimensional oblique microstructure built up by a pressing downward method is provided

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TWI729066B (en) * 2017-02-03 2021-06-01 光環科技股份有限公司 High speed multi-channel transmitter optical module and method for fabricating the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488801B (en) * 2011-02-23 2015-06-21 Univ Nat Chiao Tung A three dimensional oblique microstructure built up by a pressing downward method is provided

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