201029120 六、發明說明： 【發明所屬之技術領域】 本發明關於-種用於至少部分地 之閉合平坦載體的裝置，其包含具^子零件 模具部件，該第_ 、, 第一模穴之第— 阶要a 八；連接至該載體的一第而丨、真 配置一層封裝材科於該載體的第-側邊上。帛一側邊及 【先前技術】 〇 應了解的是—載體意指一運載 材料部件。該等電子路之實質上平坦 件，在此可被配置在該載體上以及 電氣^連接 内。通常此一載體由至少 刀地在該載體 如矽或是一陶瓷材料，雖 諸 材料，諾、”未排除一具有良好電氣傳導之 至少一絕緣材料層以徒不須接著亦具有 可特別0… 同電路間的電氣分離。此種載體 3疋 *體材料形成’但非限制性地。 ❹ =知，提供此種載體於載體的一側邊上具有封裝材料 Μ &或疋-層封裝材料，㈣等封裝材料連接至該載體 的電子電路是被彳早增 被保護的。此種載體通常具有相當大的尺 声 ， 、去 iX· | \ A刀。經驗顯示由於配置該封裝材料使得該等 可此捲曲。由於連接件是極端地靠近彼此放置，此可 能導致在載體進一步製造上相當多的問題。 【發明内容】 4 201029120 爲了此目的，本發明提— 是避免上述之問題。 冑方法及-種裝置，其中 此目的是以陳述在前言部 裝裳置具有一第二掇一…之裝置而達成，其中該封 -„ 、八’、適於連接至該載體於載體的第 一側邊上及適於配署__ 不 置層封裝材料於载體的此第二側邊 上0 此目的相同地是藉由— 籍由種用於至少部分地封裝一具有 電子零件之閉合平坦載體的方、、夫.去> —戰菔旳方法達成，包含放置該閉合平 坦載體於一第一描;且Αβ杜μ 八件上’於模具中封住該具有電子零 件之閉合平坦載體在介於第一 科腹隹；丨於弟及第二模具部件之間的相反 側邊上及配置一層封裝材料於載體的兩侧邊上。 由^這些方法，一層封裝材料配置於載體的兩側邊 上於疋藉由配置層於載體中造成之應力是彼此補償及捲 曲是被避免的。在此指出在載體的任—侧邊上之層的厚度 可不同，以此夠補償載體本身的不對稱構形，並且載體的 層並非必須被完全封閉。 此種裝置的使用或是此種方法的應用導致一具有電子 零件實質上平坦、閉合載體，該電子零件以—層封裝材料 提供於至少一側邊上，此載體在其第二側邊上亦具有一層 封裝材料。以此方式可以有效方式避免載體的捲曲。 根據一第一較佳具體實施例，該裝置適於配置一層封 裝材料在一半導體晶圓的兩側邊上。半導體晶圓代表本發 明一極重要的應用領域；電子電路最初形成於半導體晶圓 内已準備被封裝在一側邊的一層級上，在該層級該半導體 201029120 晶圓仍形成一整體。接著個別的電 格定藉由半導體晶圓之 鑛開或切開而彼此分開，在個为丨番 幻別電路分開後再進一步加 工。捲曲的問題亦發生在這4b丰道雜 一千導體晶圓一邊的覆蓋層 内，這使得半導體晶圓進一步的知τ苗上 妁加工更加困難或甚至是不 可能。這些問題可藉由應用根據本發明之方法而避免。部 分地取m步的生產製程導體晶圓進-步的處理 及最終產品#於其等已被封裝在續邊上而亦是簡化的。 此較佳的具體實施例同樣地關於此一方法，其中該載 體是由一半導體晶圓形成。此方法的優點是參考上文所述 根據本發明裝置的優點。 該第-及第二模穴較佳地適於西己置在載體的兩侧邊 上：：層封裝材料分佈於整個表面上。以此方式載體的捲 曲疋被避免於整個載體表面上。應指出該術語「於整個表 面上」非排除存在於層内之開口，例如用於接觸部件的管 路，但所配置的層每一者由單一部件組成，以致於其等可 由一單一流道（runner)連接至相關的模穴而達到；因此該層 不需要被封閉。當本發明是應用至一半導體晶圓，在其内 形成之電路將接著被分開；由分開所形成之半導體晶圓的 部分的每一者通常將接著具有封裝的一實質上相等部分， 其·可僅藉由配置該層封裝材料分佈於整個表面上而達成。 此具體實施例同樣地關於一種方法，其中配置該封裝 材料分佈於載體的兩側邊的整個表面上，及關於由此所獲 得的載體。 為了達成模穴一致及快速的填充，該裝置具有至少一 201029120 第一及第二流道，該第—流道連接至該第一模穴及該第二 μ道連接至該第二模穴是重要的。此避免自一模穴的封裝 材料必須被移動通過載體或是沿著該載體至其他的模穴。 當該封裝材料被獨立地饋給至載體的兩側邊，可達成同樣 的效果。 ❹ 在某些情形下，對於兩流道被連接至相同的封裝材料 -及對於-可調整的或是可控制限制被配置在該等流道 至>一者是吸引人的。—獨立控制的方法是藉此以— 源達成。封裝材料的饋給通常藉由一柱塞進行，以 該因加熱而變成液體之封穿材 印磁制、从、 #裝材枓是被壓入該模穴（亦稱作轉 、。二而’在本發明内容中其他饋給封 可能的，諸如例如藉由汴舢士別 4 了叶万法疋 1 糟由，主射成型。關於該封裝材料，在太 發明的内容令亦有其他的 斜在本 饋給可呈液能形心例如封裝材料的 (體環氧樹脂)供應或是例如-由至少 兩分開地供應之成分因混入而田儿^ 夕 封裝材料。 〇固化之熱固化（thermocuring) 替代地，該流道連接至— 源的第一掇〜r # + ^弟封裝材料 料二第==接至—將被連接至-第二封裝材 的控制是可能的。=兩封*材料源是可被彼此獨立地 π疋j月&的。封裴材料餹蛑 任—側邊上彼此獨立地 机”壓力可在載體的 有— 6 ，此對於載體在任一測邊上具 不冋的構形之情形是會 運具 著在載體的任一侧邊 门。畢竟，該封裝材料將接 材料的行為可被獨立地:：：同的流動行為’其中該封裝 7 201029120 當該封裝材料自一不同的源饋給至放置於該褀穴内的 載體之兩側邊上可獲得相同的優點。 、 根據另-較佳的具體實施例，該封裝材 同的流率饋給至放置於該模穴内的載體之任一側邊。不 了在在載體任一側邊上獲得封裝性質的差異，例如為 =載^第續邊較翁體的另讀邊上獲律“較佳的妖 、是建議該第一㈣二封翁材料 同類型的封料料。以此方式可在詩^ ^彼此不 一具有不n nt哲 Λ 了在載體的任一侧邊上獲得 具有不同性質之不同的封裝材料。 出接觸吸Γ的具體實施例，尤其是具有突出部件諸如突 =觸-件之載體’提供以下方法，料模穴 配置在該模穴内之固二可藉由— (tape)或是薄膜形成， :3彈性材料的帶 製程循環後更新。—彈::料材:在在由:給機構之-或更多 該突出接觸元件或是其他突出部件等可穿透進 =層’藉此避免該封裝材㈣蓋料突出料。 件因此維持沒有封裝材料，因此可無須清理而被 貝毀該等突出部件的機會亦是相#大地減少。 該相同的具體實施例關於一種方法，彡中在至少—側 :有。P件犬出於其表面外側之一載體是放置在模穴 該等突出部彳，諸如更特別的是接觸元件，穿透進 入一層彈性材料， 地保護該模穴。以：方：：在該模穴關閉時’至少部分 方式’獲得一載體，其之側邊的至少 201029120 一者上具有部件突出於封裝材料的表面之外側。 載體’特別的是半導體晶圓，通常在至少一側邊上具 有半導體電路被連接至該載體。其亦是有利的應用本發明 於此種障元> 中。該封裝裝置較佳地適用於此目的以至少部 分地封裝载體，該載體在至少一側邊上具有半導體電路被 連接至該載體。 當該载體及該半導體電路之間具有一空間的情形中， 對於該封裝裝置適於配置封裝材料在該載體及這些零件之 ® 間的空間中亦是吸引人的。 相同的具體實施例提供以下的方法，在該封裝裝置中 放置一載體，在其至少一側邊上具有電子電路，及在封裝 期間封裝材料被配置在介於該電子電路及載體之間的空 門進步該專電子零件將具有一受限尺寸（1_20微米）之開 口（亦稱作為「孔」）亦是可能的。在該電子零件及該封裝材 料之間一改良的黏附是藉由以封裝材料填充該等開口而獲 得0 Φ 在另一具體實施例變化中，堆疊複數個的電子零件。 因此堆疊的電子零件可相同地被麵合，選擇性地彼此藉由 通過-通道（thrcmgh-channel)傳導，亦稱作為受限尺寸（ι·2〇 微米）的 TSVs(tluough siHcon vias，通過矽孔）。 本發明相關類型的載體，通常地呈一半導體晶圓形 式’常常具有相當大的尺寸。由於封裝質量流入該模穴， f生在模穴壁上的壓力是相當大的。此造成開口的危險或 是模具部件的變形及已封裝載體的最終變化及封裝過程的 9 201029120 分裂。為了避免這些問題，一較佳的具體實施例提出該封 裝裝置具有用於控制關閉壓力之控制手段，該模具部件以 該關閉壓力關閉至載體上。一可控制的補償壓力（對此情形 是可調整的）’以此方式可被應用於模具部件的壁之外部側 邊°當在此仍未有封裝材料存在於模具的内部時，此控制 能力在避免此壓力藉由施加一過度壓力而損壞載體是重要 的。 相同的優點是當模具部件上的關閉壓力在放置於該模 穴内之載體的封裝期間是受控的而獲得。 為了使在模具的模穴内由封裝材料所施加的壓力之補 償為可能的，另一具體實施例提出用於該模具部件關閉壓 力的控制手段，該控制手段是被連接至用於偵測存在於該 模穴内壓力之感測器。 在相同具體實施例的方法，由該模具部件施加在載體 上之關閉壓力是受至少一封裝材料源所施加之壓力而被控 制。 其是吸引人的’當該流道連接至該模穴使得封裝材料 流的運動方向實質上地對角地相對一格柵延伸，電子電路 是依據該格栅放置在載體上。以此方式，該封裝材料可無 兩在強勁的、突然的方向改變而推進，以致於封裝材料流 遭遇較少的障礙物及更一致地行進。在此應注意的是此 方法不僅可與本發明結合應用；其亦可被應用於僅只一載 體的單一側邊用於電子電路而被封裝的情形，或是當其他 類型的零件實質上地被排列呈一矩形結構而被封裝的情 201029120 形0 本發明特別是可廄田s ^ ^ ''至用於相當大尺寸的電子零株+ 載體，在它們被進—步加 电于零件之 射切割或是水切割被分開成較小的片段錯開、雷 【實施方式】 圖1A概要地顯示一 ^ ^ ^ ^ 逋過用於封裝用於電子零件之巷_ 的裝置之截面，其整體以 +仵之載體 參 了方模具部件以及 ，日不。该裝置包含- 上方模具部件2b。凹推兮笪描曰* 2a，2b之每—者岐 ㈣以模具部件 刀另J的模穴3a，3b。合一并** Λ 放置介於模具部件2 田載體4是 , L 間，該分別的模穴3a，3b關μ 於載體4上。配置—声 0關閉 々丨•道5導向該模穴為 至模穴3。該封裝材料 巧’饋，、“裝材料 ^ 藉由一柱塞6供應’該柱塞是可銘 動於-圓柱狀外殼1〇十。 枉基疋了移 坐落相對於流道5的側·多。道被連接至該模穴3 放置用於封裝之載許4 。㉛可被分開以便 識^ 衮之載體4而咬异游 Φ ,,A 飞疋移除已封裝之載體4。 模具部\3a，Y示’該裝置是經尺寸設定用於封裝放置在 導體曰圓兩：邊之間的—載體4的兩側邊。此可發現在半 导體日日圓兩側邊上的封裝 產製程中通常較早實施期中，於一生 必々权干實施封裝步驟，在封 已封裝在半導I* s圓★ , 後、座配置 奘而妯八时 电于電路疋冋盼連同所配置的封 裝而被分開，例如藉 4Θ ^ ^ 鋸開或是雷射切割。為了避免由於 根據先前技藝封裝在— 、 Λ , Β 忉逯上從而之丰導體晶圓的捲 曲’ 5亥丰導體晶圓是封 對裝於兩側邊上。如顯示在1Α的情 11 201029120 形，可藉由從—單一流道5館給而進行。 在此應注意的是封I 、 £ t 于裝了在一稞載體上進行，其中在封 電氣連接徠㉛置開°以獲得進人配置在载體之電路及 St但亦在載體上，接觸元件已呈例如軟焊珠^ 將是明顯Μ 9(§#如記憶晶片）的形式被放置在載體上。其 的相反側邊上，晶H Q 4、a k ' j 或是軟焊珠8被放置在僅只單一侧 二可月b的。軟焊珠8及晶片9亦可被放置在載體201029120 VI. Description of the Invention: [Technical Field] The present invention relates to an apparatus for at least partially closing a flat carrier, comprising: a mold part having a part, the first, the first cavity - a sequence of eight; a first layer of the package attached to the carrier, the true configuration of a layer of packaging material on the first side of the carrier.帛One side and [Prior Art] 〇 It should be understood that the carrier means a carrier material component. The substantially planar members of the electronic circuits can be disposed on the carrier and within the electrical connections. Usually, the carrier is at least knives in the carrier such as a crucible or a ceramic material, although the materials, no, do not exclude a layer of at least one insulating material with good electrical conduction so as not to have a special 0... Electrical separation between the same circuit. Such a carrier 3 '* body material is formed 'but not limited. ❹ = know that such a carrier is provided on one side of the carrier with encapsulating material amp & or 疋-layer encapsulating material (4) The electronic circuit to which the encapsulating material is attached to the carrier is protected by the enthalpy. This carrier usually has a considerable scale sound, and goes to iX· | \ A knife. Experience shows that due to the configuration of the packaging material This may be curled. Since the connectors are placed extremely close to each other, this may cause considerable problems in the further manufacture of the carrier. [Invention] 4 201029120 For this purpose, the present invention is to avoid the above problems. And a device, wherein the purpose is achieved by stating that the device has a second device in the foreword, wherein the seal - „, 八' is adapted to be connected to the device On the first side of the carrier and on the second side of the carrier, which is suitable for dispensing, the same purpose is achieved by at least partially encapsulating one The method of closing the flat carrier of the electronic component, the husband's method, the method of arranging, including placing the closed flat carrier on a first drawing, and the Αβ杜μ8 piece on the mold to seal the electronic The closed flat carrier of the part is disposed on the opposite side of the first web and on the opposite side between the second mold member and a layer of encapsulating material on both sides of the carrier. By these methods, a layer of encapsulating material disposed on both sides of the carrier and the stress caused by disposing the layer in the carrier are mutually compensated and curled are avoided. It is noted herein that the thickness of the layers on either side of the carrier can be varied to compensate for the asymmetric configuration of the carrier itself, and that the layers of the carrier do not have to be completely enclosed. The use of such a device or the application of such a method results in a substantially flat, closed carrier having electronic components provided on at least one side of the package, the carrier being on its second side Has a layer of packaging material. In this way, curling of the carrier can be avoided in an effective manner. According to a first preferred embodiment, the apparatus is adapted to configure a layer of encapsulant material on both sides of a semiconductor wafer. Semiconductor wafers represent a very important application area of the present invention; electronic circuits are initially formed on a layer of semiconductor wafer that is ready to be packaged on one side, at which level the semiconductor 201029120 wafer is still formed as a whole. The individual cells are then separated from each other by the opening or cutting of the semiconductor wafers, and further processed after the separation of the phantom circuits. The problem of curling also occurs in the overlay of one side of the 4b conductor wafer, which makes the semiconductor wafer further difficult or even impossible to process. These problems can be avoided by applying the method according to the invention. The step-by-step processing of the m-step production process conductor wafer and the final product # are already simplified on the continuation side. This preferred embodiment is also directed to such a method wherein the carrier is formed from a semiconductor wafer. An advantage of this method is the reference to the advantages of the device according to the invention as described above. The first and second cavities are preferably adapted to be placed on both sides of the carrier: the layer encapsulating material is distributed over the entire surface. In this way, the curl of the carrier is avoided on the entire surface of the carrier. It should be noted that the term "on the entire surface" does not exclude openings present in the layer, such as conduits for contacting components, but the layers configured are each composed of a single component such that they can be made from a single flow path. (runner) is connected to the relevant cavity to reach; therefore the layer does not need to be closed. When the invention is applied to a semiconductor wafer, the circuitry formed therein will then be separated; each of the portions of the semiconductor wafer formed by the separation will typically have a substantially equal portion of the package, This can be achieved only by configuring the layer of encapsulation material to be distributed over the entire surface. This embodiment is equally directed to a method in which the encapsulating material is disposed over the entire surface of both sides of the carrier, and with respect to the carrier thus obtained. In order to achieve uniform and rapid filling of the cavity, the device has at least one first and second flow passages of 201029120, and the first flow passage is connected to the first cavity and the second microchannel is connected to the second cavity. important. This prevents the encapsulating material from a cavity from being moved through the carrier or along the carrier to other cavities. The same effect can be achieved when the encapsulating material is independently fed to both sides of the carrier. ❹ In some cases, it is attractive for two channels to be connected to the same packaging material - and for - adjustable or controllable limits to be placed in the channels to >. - The method of independent control is achieved by means of - source. The feeding of the encapsulating material is usually carried out by a plunger, and the sealing material which becomes liquid by heating is pressed, and the material is pressed into the cavity (also referred to as turn, and 'In the context of the present invention, other feeds are possible, such as, for example, by the gentleman's 4, and the main shot is formed. With regard to the packaging material, there are other obliques in the contents of the invention. In the present feed, the liquid energy can be shaped, for example, the encapsulating material (body epoxy resin) or, for example, the ingredients supplied by at least two separate materials can be mixed into the material. 〇Curing thermal curing (thermocuring) Alternatively, the flow path is connected to - the first source of the source - r # + ^ The package material 2 = = connected to - the control to be connected to - the second package is possible. = two * The material source can be π 疋 月 & 。 。 。 。 。 。 。 。 。 。 。 。 。 。 — — — — — — — ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” The situation of the configuration of the skeleton is that it will be transported on either side of the carrier. After all, the seal The behavior of the material joining material can be independently::: the same flow behavior 'where the package 7 201029120 is obtained when the packaging material is fed from a different source to the sides of the carrier placed in the cavity Advantages. According to another preferred embodiment, the same flow rate of the package is fed to either side of the carrier placed in the cavity. It is not possible to obtain the encapsulation property on either side of the carrier. The difference, for example, is that the sequel is the same as that of the other side of the body. The preferred demon is the same type of seal material recommended for the first (four) two seals. This way can be found in poems ^ ^I don't have to have each other to obtain different packaging materials with different properties on either side of the carrier. Specific embodiments of contact suction, especially with protruding parts such as protrusions/contacts The carrier 'provides the following method, the solid solution in which the cavity is disposed in the cavity can be formed by a tape or a film, and the tape of the elastic material is renewed after the process cycle. - The bomb:: material: in the : to the mechanism - or more of the protruding contact element or The protruding member or the like can penetrate into the layer' to thereby prevent the encapsulating material (4) from covering the material, thereby maintaining the absence of the encapsulating material, so that the chance of being destroyed by the beard and destroying the protruding members is also greatly reduced. The same specific embodiment relates to a method in which at least the side of the sputum is provided. The carrier of the P piece is placed on the outer side of the surface of the cavity, such as a contact element, such as a contact element, Passing through a layer of elastic material to protect the cavity. In the following manner: when the cavity is closed, at least part of the carrier is obtained, and at least 201029120 of the side thereof has a component protruding from the surface of the packaging material. The outer side. The carrier 'in particular is a semiconductor wafer, typically having semiconductor circuitry connected to the carrier on at least one side. It is also advantageous to apply the present invention to such a barrier element>. The packaged device is preferably adapted for this purpose to at least partially encapsulate a carrier having a semiconductor circuit connected to the carrier on at least one side. In the case where there is a space between the carrier and the semiconductor circuit, it is also attractive for the package device to be adapted to configure the encapsulating material in the space between the carrier and the ® of these components. The same specific embodiment provides a method in which a carrier is placed in the packaging device, having electronic circuitry on at least one side thereof, and the packaging material is disposed between the electronic circuit and the carrier during packaging. It is also possible to improve the opening of the electronic component with a limited size (1-20 microns) (also known as a "hole"). An improved adhesion between the electronic component and the encapsulating material is achieved by filling the openings with the encapsulating material to obtain 0 Φ. In another embodiment variation, a plurality of electronic components are stacked. Thus the stacked electronic components can be identically surfaced, selectively conductive to each other by a through-channel (thrcmgh-channel), also known as TSVs of limited size (1⁄2 micron) (tluough siHcon vias) hole). Carriers of the type associated with the present invention, typically in the form of a semiconductor crystal, often have a relatively large size. As the quality of the package flows into the cavity, the pressure on the wall of the cavity is quite large. This creates a risk of opening or deformation of the mold parts and the final change of the packaged carrier and the packaging process. In order to avoid these problems, a preferred embodiment proposes that the packaging device has control means for controlling the closing pressure, the mold part being closed to the carrier with the closing pressure. A controllable compensating pressure (which is adjustable in this case) can be applied to the outer side of the wall of the mould part in this way. This control capability is also present when there is still no encapsulating material present inside the mould. It is important to avoid this pressure by damaging the carrier by applying an excessive pressure. The same advantage is obtained when the closing pressure on the mold part is controlled during the packaging of the carrier placed in the cavity. In order to compensate for the pressure exerted by the encapsulating material within the cavity of the mold, another embodiment proposes a control means for the closing pressure of the mold part, the control means being connected for detecting presence in The sensor of the pressure in the cavity. In the method of the same embodiment, the closing pressure exerted on the carrier by the mold member is controlled by the pressure applied by at least one source of packaging material. It is attractive' when the flow channel is connected to the cavity such that the direction of movement of the flow of encapsulating material extends substantially diagonally relative to a grid on which the electronic circuitry is placed. In this way, the encapsulating material can be advanced without a strong, abrupt change in direction such that the flow of encapsulating material encounters fewer obstacles and travels more consistently. It should be noted here that this method can be applied not only in conjunction with the present invention; it can also be applied to the case where only a single side of a carrier is used for electronic circuitry to be packaged, or when other types of parts are substantially The arrangement is in a rectangular structure and is encapsulated. 201029120 Form 0 The invention is particularly applicable to the s ^ ^ '' to the relatively large size of the electronic zero plant + carrier, where they are stepped up and powered by the part. Cutting or water cutting is divided into smaller segments staggered, mine [Embodiment] FIG. 1A schematically shows a section of a device for encapsulating a lane for electronic parts, which is generally + The carrier of the enamel participates in the square mold parts as well, and does not. The device comprises - an upper mould part 2b. Concave push 兮笪 * 2a, 2b each - 岐 (4) with mold parts Knife J hole 3a, 3b. Integrally and ** placed between the mold parts 2, the field carrier 4 is, L, and the respective cavity 3a, 3b is closed on the carrier 4. Configuration—Sound 0 Off 々丨•道5 leads the cavity to the cavity 3. The encapsulating material is skillfully 'fed,' and the "packing material ^ is supplied by a plunger 6" which is readable in a cylindrical casing 1 〇 10. The 枉 base is moved to the side of the flow path 5 The track is connected to the cavity 3 and placed for packaging. The package can be separated to identify the carrier 4 and bite the Φ, and the A hopper removes the packaged carrier 4. \3a, Y shows that the device is dimensioned for packaging on both sides of the carrier 4 between the two sides of the conductor. This can be found on the sides of the semiconductor yen. In the process, the implementation process is usually implemented earlier. In the whole life, the encapsulation step must be implemented. The package is packaged in a semi-conducting I* s circle ★, and the rear configuration is 妯 妯 电 电 电 电 电 电 连同 连同 连同 连同Packaged and separated, for example, by 4Θ ^ ^ sawing or laser cutting. In order to avoid the curling of the conductor wafer due to the packaging according to the prior art, the 5Honcon conductor wafer is The seals are mounted on the sides of the sides. If displayed in 1Α, the shape of 2010 11120 can be obtained from the single channel 5 It should be noted that the seals I and £t are carried on a carrier, wherein the electrical connection 徕31 is opened to obtain the circuit arranged in the carrier and St is also in the carrier. Above, the contact element has been placed on the carrier in the form of, for example, a solder bead, which is apparently 9 (§# as a memory chip). On the opposite side, crystal HQ 4, ak ' j or soft solder beads 8 is placed on only a single side, two months b. The solder beads 8 and the wafer 9 can also be placed on the carrier
=同側邊上，可能地結合晶片9或是軟焊珠8於另一側 。此外，對於接觸元件具有—有別於軟焊珠的形式， 诸如例如棍’區塊或是任一隨意形式是可能的。 圖二及1C顯示如圖1A所顯示的裝置之兩連續的視 圖’以描述該裝置“由 有 6,，其可在兩分開的圓 成〇’ 1〇’内移動。顯示在圖1B之柱塞6控制封裝 材枓饋給至在模具部件2b内的模穴化及顯示在圖⑴之柱 塞6控制封裝材料饋給至在模具部件&内的模穴^。= On the same side, it is possible to combine the wafer 9 or the solder bead 8 on the other side. Furthermore, it is possible for the contact elements to have a form different from the soft bead, such as, for example, a stick' block or any random form. Figures 2 and 1C show two consecutive views of the apparatus as shown in Figure 1A 'to describe the apparatus' by having 6, which can move within two separate circles into a '1'. The plunger shown in Figure 1B is shown. 6 Controlling the encapsulation of the encapsulating material to the cavity in the mold part 2b and the plunger 6 shown in Fig. (1) controls the supply of the encapsulating material to the cavity in the mold part &
材料在載體4相反侧邊上㈣給是因此藉由分開的柱塞/ ^控制的’及饋給至模穴3a’ 3b的流率可被彼此獨立地調 知理想地使得封裝材料的流體前端（flow f_t)可以多於或 夕於在載體4的兩侧邊上之相同速度移動。 芝 根據如圖2顯示之第二具體實施例，使用兩流道5a， ::的組成」每一者分別地被連接至一分開的封裝材料源 6b這些源6a，6b是可個別地控制以允許封裝材料至 下方模穴3a的饋給可獨立於至上方模穴孙的饋給進行。此 12 201029120 當兩模穴内側的空間由於模穴的不同厚度或放置於載體上 或載體下的零件構形不同而彼此不同，是特別地重要。相 同地其是可能的使用單一源的組成，及一可控制的限制被 配置在一或是兩流道内以能夠達成僅使用一單—源的獨立 饋給。 源6a，6b兩者亦可包含一不同的封裝材料，以用於在 載體的任一側邊上以一不同的材料封裝。The material on the opposite side of the carrier 4 (four) is thus controlled by the separate plunger / ^ and the flow rate fed to the cavity 3a' 3b can be independently monitored from each other ideally such that the fluid front end of the encapsulating material (flow f_t) may move more or more at the same speed on both sides of the carrier 4. According to a second embodiment shown in Fig. 2, the two flow channels 5a, the composition of :: are each separately connected to a separate source of packaging material 6b. These sources 6a, 6b are individually controllable. The feeding of the encapsulating material to the lower cavity 3a is allowed to be independent of the feeding to the upper die. This 12 201029120 is particularly important when the space inside the two cavities differs from each other due to the different thickness of the cavities or the different configuration of the parts placed on the carrier or under the carrier. Similarly, it is possible to use a single source composition, and a controllable limit is placed in one or two flow paths to enable independent feeds using only a single source. Both sources 6a, 6b may also comprise a different encapsulating material for encapsulation in a different material on either side of the carrier.
圖3顯示一具體實施例，其中相對載體4之上方模穴 3b的内部侧邊具有一層撓性材料12。此層可藉由—層形 成，該層被ϋ定地配置在模穴31)内及其仍必須不時的被替 換，但亦可藉由例如一片自黏膠黏帶在每一封裝之後替 換。圖3顯示一具體實施例，其中使用一帶12。 此具體實施例是特別地可應用在載體4之上方側邊上 具有呈接觸珠8形式之接觸元件。其是重要的，這些㈣ 珠8可達成用於在已配置封裝之後形成電氣連接之目的。 圖3所顯示的情形中’纟中載體4是被放置在模具】内， 但其中該模具1是尚未被關閉。 "” w丨月ν，丹τ 3見接觸珠8已 進入該撓性材料層12,同時囷5顯示其中對半模且 3b已以封裝材料裝填之情形。應注意的是接觸_ 8突出於 =袭材料層的外側’以致於其是立即可用於形成接觸之目 〇此同樣地顯示在圖6，圖6顯示—已封裝之栽體*，當 口樣:St件2&，几之間的封裝製程完成後，其是被移除。 7此突出可為最小的’及甚至是可與封裝本身之平面 13 201029120 齊平的。 最後注意的是，載體在其底 魇側具有一些零件9被附接 至載體心這些通常為由半導體電路或是晶片所形成之零件 9,諸如例如記憶電路，其是適用與載趙4整合之電路丘同 作用。在此，載體4通常包含-大數量的相同電路，其等 在封裝製程後是被分開-因此每—所建立的部件接著包含 此種記憶電路’其在本具體實施例中在一側邊上且有一 憶電路9及在另一侧邊上具有一肽七:° 形式外的㈣元件。 —㈣珠8或疋呈除珠狀 其將是明顯的，同樣地有可铱 於㈣4… *也有了能的亦放置-層撓性材料 i載體4的底側上，以便於可！埋认庇 選擇地使一電子零件的活性 或非活性侧邊清空以用於冷卻之目的或用於光學 或機械交互作用。其亦是可 u Μ疋可$的在封裝期間優先使放置在 底側上之接觸元件8清空。除 可坐落於料9±。 之外^㈣讀8亦 ❹ 圖7顯示-載體20,在其之上放置一特別的電子 21(所謂的MEMS)。電子裳杜 20及> 1轉觸件22連接至載體 有-密封件23，藉此在電子零件21下方建立一 閉工間°電子零件21以封裝材料24封裝。 21 置在㈣體内^管路25，㈣管路電子零件 置在疋:此接接至於載體2〇的相反侧邊上的接觸位置26。配 性二:層：位置：的是軟焊珠27,該等軟焊珠藉由-撓 庄材枓層（未顯不在此圖中 ^ , 圓史）在封裝材料28於載體20的相反 之饋給期間時而保護，使得該軟焊珠27保持部分地 14 201029120 不又封裳材料28的限制。該環 24可，若需要時，為相同於或是，相反^ 2二之封裝材料 軟焊珠27之間的封裝材料2卜 於配置在 圖8顯示一载體30,其具有封裝材 上。坐落於接觸側邊上的是軟焊_ 33 ::於兩側邊 料32封住，使得軟焊珠33可以簡單的方裝材 :實“-步的操作。在載體3〇相反於軟焊珠33的側邊 四個堆疊的電子零件34是放置在載體3〇上。電子零件 34具有通過-通道35, 36(TSVs)，其在此情形下稱作中空 爪出，在封裝材料31的饋給期間亦可以封裝材料”裝 填。此顯示在兩左御j TSVs35中。這些通過_通冑35通常具 有:非常小的直徑（1-2G微米），及因此是無法清楚的以比例 繪製。四個右側TSVs具有一不同於中空TSVs35的結構； TSVs36是非中空的但為例如銅組成之實體結構。該堆疊的 電子零件34使用例如一膠黏層功能上地彼此結合。該以封 裝材料31裝填之TSVs35給予更多機械強度至該堆疊的電 子零件3 4。虛線形成可能的鑛開線路，沿著該虛線載體3 〇 可被細分。 其將是明顯的，在不同的具體實施例中所討論之方法 可彼此結合。 【圖式簡單說明】 本發明將以顯示在以下圖式之示範性具體實施例為基 礎而進一步闡明。在此： 15 201029120 圖丨A是根據本發明裝置的第— 圖； 具體實施例的截面視 圖1B及1C顯示根據本發明數置的第— 連續的截面視圖； 一體實施例兩 圖2是本發明第二具體實施例的截面視圖； 圖3是味發鄭第三具锻實施姆在 价 要截面視圖； V打開位置的一概 圖4疋圖3所顯示的具體實施例在模 概要截面視圖； 圖5疋圖3所顯示的具體實施例在封裝期間的— 截面視圖； 圖6疋以圖3至5所顯示之方法而獲得之產品 要截面視圖； 圖7是根據本發明的一載體具有封裝材料於兩側邊 的一截面視圖；及 圖8是根據本發明的一載體的另一具體實施例變化， 其具有封裝材料於兩側邊上的一截面視圖。 具關閉位置的一 ❹ 概要 的一概 上 ❹ 明 說 號 符 件 元 要 主 [Μ 16Figure 3 shows a specific embodiment in which the inner side of the upper cavity 3b opposite the carrier 4 has a layer of flexible material 12. This layer can be formed by a layer which is fixedly disposed in the cavity 31) and which must still be replaced from time to time, but can also be replaced after each package by, for example, a piece of self-adhesive tape . Figure 3 shows a specific embodiment in which a belt 12 is used. This embodiment is particularly applicable to the contact elements in the form of contact beads 8 on the upper side of the carrier 4. It is important that these (4) beads 8 can be used for the purpose of forming an electrical connection after the package has been configured. In the case shown in Fig. 3, the carrier 4 in the crucible is placed in the mold, but the mold 1 is not yet closed. "" w丨月ν,丹τ 3 see contact beads 8 have entered the flexible material layer 12, while 囷5 shows the case where the mold halves and 3b have been filled with packaging materials. It should be noted that the contact _ 8 protrudes The outer side of the layer of material is so that it is immediately available for the purpose of forming a contact. This is also shown in Figure 6, which shows the packaged *, when the mouth is: St 2 & After the packaging process is completed, it is removed. 7 This protrusion can be the smallest 'and even flush with the plane 13 201029120 of the package itself. Finally, the carrier has some parts on its bottom side 9 Attached to the carrier core, these are typically parts 9 formed by semiconductor circuits or wafers, such as, for example, memory circuits, which are suitable for use in conjunction with the circuit of the carrier 4. Here, the carrier 4 typically contains - a large number The same circuit, which is separated after the packaging process - thus each of the established components then includes such a memory circuit' which in this embodiment is on one side and has a memory circuit 9 and on the other side On the side with a peptide seven: ° form (4) - (4) Beads 8 or 疋 beveled in the shape of bead, it will be obvious, and the same can be found in (4) 4... * Also available is also placed on the bottom side of the layer of flexible material i carrier 4, so that it can be! Buried to selectively empty the active or inactive side of an electronic component for cooling purposes or for optical or mechanical interactions. It is also possible to prioritize placement at the bottom during packaging. The contact element 8 on the side is emptied. In addition to being located at the material 9±. ^ (4) Reading 8 is also ❹ Figure 7 shows the carrier 20 on which a special electron 21 (so-called MEMS) is placed. 20 and > 1 The contact member 22 is connected to the carrier-seal 23, thereby establishing a closed compartment under the electronic component 21. The electronic component 21 is packaged with the encapsulation material 24. 21 placed in the body of the (24) (4) The electronic components of the pipeline are placed on the 疋: this is connected to the contact position 26 on the opposite side of the carrier 2〇. Qualitative two: layer: position: the soft bead 27, the soft bead by means of - The layer of crepe material (not shown in this figure) is protected during the opposite feeding of the encapsulating material 28 to the carrier 20, so that The soft bead 27 is maintained in part by the 14 201029120 and is not limited by the sealing material 28. The ring 24 may, if desired, be the same or the opposite package of the encapsulating material solder bead 27 The material 2 is arranged in a configuration shown in Fig. 8. A carrier 30 is provided on the package. On the side of the contact side, the solder _ 33 :: is sealed on the side edges 32 so that the solder beads 33 can be simple. Square material: real "-step operation. On the side of the carrier 3, opposite to the side of the solder bead 33, four stacked electronic components 34 are placed on the carrier 3''. The electronic component 34 has pass-channels 35, 36 (TSVs), which in this case are referred to as hollow jaws, and may also be filled with the encapsulating material during the feeding of the encapsulating material 31. This is shown in the two left y TS TSs 35. These pass-throughs 35 typically have a very small diameter (1-2 G microns) and are therefore not clearly drawn in scale. The four right TSVs have a different structure than the hollow TSVs 35; the TSVs 36 are non-hollow but for example The physical structure of the copper. The stacked electronic components 34 are functionally bonded to each other using, for example, an adhesive layer. The TSVs 35 loaded with the encapsulating material 31 impart more mechanical strength to the stacked electronic components 34. The dashed lines form possible The open line along which the carrier 3 can be subdivided can be subdivided. It will be apparent that the methods discussed in the different embodiments can be combined with each other. [Schematic Description] The present invention will be shown in the following The exemplary embodiment of the formula is further clarified on the basis of which: 15 201029120 Figure A is a first view of the device according to the invention; sectional views 1B and 1C of the specific embodiment BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a cross-sectional view of a second embodiment of the present invention; FIG. 3 is a cross-sectional view of a third-forged implementation of the Weifa Zheng; FIG. 3 is a schematic cross-sectional view of the embodiment shown in FIG. 3; FIG. 3 is a cross-sectional view of the embodiment shown in FIG. 3 during the packaging; FIG. 6 is shown in FIGS. Figure 7 is a cross-sectional view of a carrier having encapsulating material on both sides in accordance with the present invention; and Figure 8 is a variation of another embodiment of a carrier in accordance with the present invention, A cross-sectional view of the encapsulating material on both sides. A glimpse of the closed position.