201028763 Αυυ»υ» 131 30045twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於—種背光模組及顯示裝 置’且特別是 有關於-種具有㈣胃的電路板固定方⑽背光模組及 【先前技術】 φ 隨者產業曰皿發達，行動電話(mobile phone)、數位相 機(digital camera)、數位攝影機(digitd 〇 _㈣、筆記 型電腦(notebook)以及桌上型電腦等數位化工具無不朝向 更便利:多功能且美觀的方向發展。在使用這些資訊產品 時’顯不螢幕是不可或缺的人機溝通界面，透過上述產品 之顯不榮幕將可為使用者的操作帶來更多的便利。其中， 液晶顯示裝置已成為顯示螢幕之主流。然而，由於液晶顯 示裝置的液晶顯示面板本身無法發光，故在液晶顯示面板 了方必須提供-背光模組以提供光源，進而達到顯示的功 馨能。 -般來說’背光模組至少具有殼體、光學膜片以及光 源。其中光源與光學膜片配置於殼體内，且根據光源配置 於殼體内的方式，還可區分為直下式背光模組或侧邊入光 式背光模組。 為了驅動液晶顯示面板，通常會在殼體外部設置有印 刷電路板（printed circuit board ’ PCB )，並使印刷電路板 與液晶顯示面板電性連接。而為了固定並保護殼體外部的 201028763 Αυυδυ» ι31 30045twf.doc/n 印刷電路板，避免其受到外在環境的影響，通常會採用一 背蓋覆蓋印刷電路板的方式進行保護，接著，再以螺絲同 時鎖附印刷電路板與背蓋，使其固定於背光模組的殼體 上。或者是，先以螺絲將印刷電路板鎖附於背光模組的殼 體上進行固疋後’接著，再貼附一保護膜於印刷電路板上， 以對其進行保護。 然而，採用上述鎖固印刷電路板的方式會造成本的負 • 2，例如是：背蓋與鎖固螺絲的材料成本，或鎖附螺絲所 而的人力工時成本。因此，如何提供一種印刷電路板固定 於背光模組殼體的方式，以減少成本的負擔，實為一項重 要的課題。 【發明内容】 本發明提供一種背光模組，其在固定印刷電路板時， 〜有較簡易的固定方式，並可減少成本上的負擔。 % 本發明亦提供一種顯示裝置，其採用上述背光模組， 而具有上述所描述的優點。 、 和㈣提出—種背光模組，其包括-背板、-凸肋結 支撐凸台、一電路板、一覆蓋膜、一黏膠層、一膠 x及框架。背板具有一前表面以及一後表面，其令背 ^之後表面具有—電路板放置區。凸肋結構位於背^之後 =的，路板放置區的周邊，其中凸肋結構之頂部表面具 ，著區。支撐凸台位於背板之後表面的電路板放置區 。電路板位於背板之後表面電路板放置區内，並被支撐 5 201028763 Λ-υυουοιϋ 30045twf.doc/n 位於電路板放置區周邊的凸肋 方向的移動。覆蓋膜覆蓋住電路板 構，以限制電路板在z方向的移動。黏膠層位 ^覆二凸肋結構之黏著區之間。膠框位於背板的侧 面。框架位於膠框之外側。 本發明綠ίϋ-麵林置，其包括—顯*面板以及 光模組。月光模組包括-背板、一凸肋結構、一支樓 • *台、匕一電路板、一覆蓋膜、一黏膠層、-膠框以及-框 架。背板具有一前表面以及一後表面，其中背板之後表面 具有-電路板放置區。凸肋結構位於背板之後表面的電路 板放置區的周邊’其中凸肋結構之頂部表面具有一黏著 區。支撐凸台位於背板之後表面的電路板放置區内。電路 板位於背板之後表面的電路板放置區内，並被支撐凸台所 支撐，其中電路板被位於電路板放置區周邊的凸肋結構而 限制其X方向與γ方向的移動。覆蓋膜覆蓋住電路板以及 ，肋結構，以限制電路板在z方向的移動。黏膠層位於覆 醪蓋膜與凸肋結構之黏著區之間。膠框位於背板的側面，其 中膠框具有一面板放置區。顯示面板架設於面板放置區 上。框架位於膠框之外側，用以固定背光模組與顯示面板。 在本發明之一實施例中，覆蓋膜更延伸至框架之表 面。 — 在本發明之一實施例中，黏膠層更包括位於框架與覆 蓋膜之間。 〃 在本發明之一實施例中，黏膠層更包括位於電路板與 201028763 Λυυουουί 30045twf.d〇c/n 覆蓋膜之間。 在本發明之-實施例中，更包括至少一軟性電路板。 軟性電路板位於框架與膠框之間。 林發明之一實施例中，凸肋結構與背板為一體成 型。 在本發明之-實施例中，支撐凸台與背板為一體成 型0 林發明之一實施例中’凸肋結構位於電路板的三個 侧邊處。 在本發明之-實施例t，凸肋結構為連續的結構。 在本發明之-實施例中，凸肋結構為不連續的結構。 基於上述’本發明之背光模組使用一凸肋結構來限制 電路板在X方向與Y方向上的移動，並使用—覆蓋膜覆蓋 於電路板以及凸肋結構上，以限制電路板在2方向上的ς 動並保護電路板免於受到外在環境的影響。換言之，本發 明之背光模組無須使用背蓋與螺絲之類的材料 ® 締鎖固，即可良好地岐電路板，進而可降低成本負擔。 另外，本發明亦提出一種採用上述背光模組的顯 進而具有上述所提及的優點。 .裝 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉多個實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1Α為本發明—實補之顯示裝置的背部示意圖 7 201028763 Λυυδυουί 30045twf.doc/n 圖1Β為沿圖ΙΑ之ΑΑ，剖線所繪示之顯示裝置的剖面示意 圖，而圖1C則為沿圖1Α之ΒΒ，剖線所繪示之顯示裝置的 剖面示意圖。請同時參考圖1Α、圖1Β與圖1C，本實施 例之顯示裝置1〇〇，其包括一顯示面板11〇以及一背光模 組120。背光模組120包括一背板12卜一凸肋結構122、 一支撐凸台123、一電路板124、一覆蓋膜125、一黏膠層 126、一膠框127以及一框架128。其中，膠框127位於該 背板121的側面121c ;框架128位於膠框127之外側，主 要是用以固定顯示面板11〇與背光模組120。 以下先就背光模組120各構件之間的連接關係進行說 明’而後再針對背光模組120與顯示面板11〇之間連接關 係進行說明。 在背光模組120中，背板121具有一前表面i2la以 及一後表面121b，其中背板之後表面121b具有一電路板 放置區CB1，如圖1A〜1C所繪示。凸肋結構122位於背板 121之後表面121b的電路板放置區CB1的周邊，其中凸 肋結構122之頂部表面122a具有一黏著區122b。在本實 施例中，凸肋結構122與背板121的結構可以是一體成型。 舉例來s兒，凸肋結構122的形成方式例如是使用射出成型 或是模具沖壓的方式’而直接地在背板〗21的後表面121b 上形成如圖1B所繪示之凸肋結構122。在其他實施例中， 凸肋結構122與背板121的結構也可以是採用非一體成型 的結構’本實施例係以凸肋結構122與背板121的結構為 —體成型作為說明，但不限於此。 201028763 AU0808131 30045twf.doc/n 另外’支撐凸台123位於背板121之後表面121b的 電路板放置區CB1内，用以支撐位於背板121之後表面 121b的電路板放置區CB1内的電路板124，遂可避免電路 板124上的電子元件(未繪示)直接與背板121接觸或可避 免電路板124上的電子元件遭擠壓。在本實施例中，支撐 凸台123與背板121的結構可為一體成型。類似地，支撐 凸台123的形成方式可以是採用上述射出成型或是模具沖 壓的方式，以在背板121的後表面121b上直接形成如圖 1B所繚示之支樓凸台123。在另一實施例中，支樓凸台123 與背板121的結構也可以是採用非一體成型的方式，上述 僅係以支撐凸台123與背板121的結構為一體成型作為說 明，但不限於此。在一較佳的實施例中，也可採用上述射 出成型或是模具沖壓的技術’在背板121的後表面12ib 上同時形成上述凸肋結構122與支撐凸台123，以節省製 作時間與成本。上述凸肋結構122與支撐凸台123的形成 方式僅為舉例說明’實際情況可依使用者的需求而略做調 整’在此不再贅述。另外，支撐凸台123所排成的圖樣， 主要以不妨礙電路板124線路分布或不影響電路板124上 的電子元件為考量，其排列圖樣可視使用者需求而做調整。 在本實施例中，電路板124設置於電路板放置區CB1 内’且凸肋結構122位於背板121之後表面121b的電路板 放置區CB1的周邊，如此一來，電路板124便會被位於電 路板放置區CB1周邊的凸肋結構122限制其在X方向與γ 方向的移動，而形成一種在χ_γ平面上固定電路板124的 9 201028763 Λυυουο 61 30045twfdoc/n 方式，如圖ΙΑ所繪示。另外，覆蓋膜125覆蓋住電路板 124以及凸肋結構122，以限制電路板124在ζ方向上的 移動，如圖1Α與圖1Β所繪示。詳細來說，覆蓋膜125係 使用黏膠層126以使覆蓋膜125與凸肋結構122二者黏合 固定，其中黏膠層126是位於覆蓋膜125與凸肋結構122 之黏著區122b之間。 本實施例以凸肋結構122位於電路板124的三個側邊 124a作為實施範例，且各凸肋結構122所排成的圖樣可以 是採用不連續結構的料，例如是圖1A所繪示之分段的 门子型概念，但不限於此。在另一未繪示的實施例中，各 凸肋結構122所排成的圖樣也可以是採用連續結構的設 計，例如是將圖1A之兩相鄰的凸肋結構122相連而形成 一連續的门字型圖樣，其中上述凸肋結構122所排成的圖 樣，主要以不妨礙電路板124電性連接至外部為考量，與 可限制電路板124在X方向與γ方向的移動為考量，其排 列圖樣可視使用者需求而做調整，上述僅為舉例說明。 在本實施例中，背光模組12〇更可包括一發光結構 129，其中發光結構129位於背板121之前表面ma，如 圖1B或圖1C所綠示。依據使用者的需求或設計，發光結 構129例如是採用侧邊入光式背光模組的發光結構12%， 如圖2A所示；或者是採用直下式背光模組的發光結構 12% ’如圖2B所示。詳細而言，在圖2A中，發光結構 129a可包括一導光板142、一光源144以及至少一光學膜 片146。導光板142會位於上述背板121之前表面121a， 201028763 AUU8U8iil 30045twf.doc/n 而光源144則會位於導光板142之至少一側邊142a。另 外’光學膜片146位於導光板142上，以均勻化或偏極化 從導光板142射出的光線，或是增強從導光板142射出的 光線。換言之，光學膜片146例如採用是擴散片、偏光片、 增光片或是複合式光學膜至少其中一。 在圖2B中，發光結構129b可包括多個光源152以及 一擴散片154。光源152位於上述背板121之前表面121a ❹ 上。擴散板154位於這些光源152之上方，如圖2B所繪 示。詳細來說’擴散片152主要是用來均勻化來自光源152 的光線，以使入射至顯示面板的光線可較為均勻。上述僅 是舉例說明本實施例之發光結構129所可採用的發光結 構，在其他未繪示的實施例中，發光結構丨29、129a、129b 内的光學膜層或是光源種類等當可視使用者的需求而做其 他適當的調整。 在本實施例中，膠框127位於背板121的側面121C， 其中膠框127可具有一面板放置區127a，而顯示面板no 參 可架設於面板放置區127a上，如圖與圖ic所繪示。 膠框127主要是用來固定背光模組12〇内部各構件，例如 疋上述發光結構129、129a、129b及其内部的構件(光源或 光學膜片等）。而框架128則可用來固定顯示面板n〇與上 述之背光模組120。 為了能更佳地限定電路板124在Z方向上的移動，而 使其具有較佳的固定性’覆蓋膜125更可以延伸至框架128 之表面’如圖1B與圖1C所繪示。如此一來，框架eg與 11 201028763 AUU8U8I31 30045twf.doc/n 覆盍膜125之間則需具有上述之黏膠層126，以使覆蓋膜 125可與框架128黏接固定，進而固定電路板124在z方 向上的位置。在其他可能的情況下，黏膠層126也可以位 於電路板124與覆蓋膜125之間（未繪示）。 另外，為了驅動顯示面板11〇上的驅動電路以進行顯 示，顯示裝置100更可以包括至少一軟性電路板116。軟 性電路板116位於框架128與膠框127之間，且軟性電路 ❿ 板116電性連接電路板124與顯示面板110,如圖1A與圖 1B所繪不。在本實施例中，顯示面板11〇可包括一主動元 件陣列基板112與一彩色濾光基板114，其中主動元件陣 列基板112與彩色濾光基板114之間具有一液晶層（未繪 示）。詳細來說，軟性電路板116例如是電性連接主動元 件陣列基板112的周邊電路區（未繪示)與電路板124，其中 電路板124可透過軟性電路板116來驅動主動元件陣列基 板112上的各主動元件(未繪示），以使顯示面板11〇進^ 顯不，其中相關的顯示及驅動原理為本領域之通常知識者 ® #可熟識，在此便不再贅述。需要說明的是，上述軟性電 路板116並非是侷限與顯示面板11〇電性連接的軟性電路 板，此軟性電路板116也可以包含與光源電性連接的軟性 電路板，如此一來，電路板124可透過軟性電路板116而 與顯示面板110電性連接外，亦可電性連接光源。換言之， 位於背板121上的電路板124，其可透過軟性電路^ ιΐ6 而電性連接至其他構件，而其可能的電性連接方式皆為本 發明所欲涵蓋之範圍。另外，上述之顯示面板11〇係以液 12 201028763 /\uw〇i/〇i31 30045twf.d〇〇/n 晶顯示面板為例’然而’在其他可能的實施例中 有可能使㈣背域組的辭面板當可適驗 及的概念。 —ha所徒 可此形態中，顯示裝置驗可以是採用其他 叮月匕的-置方式來限制電路板124在χ γ平面上的移動， 如圖3所繪示。在圖3中，顯示裝置驗與顯示裝置刚 相似’惟二者不同處在於，電路板124的四個側邊124a 參 目凸肋結構122。制如®3所示之凸肋結構 122的汉计，亦可達到良好固定電路板124在χ_γ方向上 的=置。值得—提的是，#於設置有軟性電魏ιΐ6之側 邊设置凸肋結構122時，需考慮到避開軟性電路板US所 $的位置:目而在此側邊之凸肋結構122通常為非連續的 結構二同樣地，可再制覆蓋膜125覆蓋電路板124以及 凸:結構122上’並使用黏膠層126黏接覆蓋膜125與凸 肋結構122的點著區mb，來固定電路板以在乙方向上 的f動。換言之，顯示裝置馳之凸肋結構122採用上述 的设计，亦可有效地固定電路板124在χγζ方向的位置， 而具有較佳的固定方式。 北，上述可知，本實施例之顯示裝置100、100a無須使 用背蓋或螺絲來對電路板進行鎖固，而僅在背板121上形 成亡述凸肋結構122，並透過上述所提及的固定方式，即 可較^地固^電路板124 ’而可減少成本上的負擔。 综上所述，本發明之背光模組與顯示裝置藉由凸肋結 構來限制電路板在χ方向與γ方向上的移動，同時使用覆 13 201028763 —vouo.,1 3〇〇45twf.d〇c/n 以及凸肋結構上，以限制電路板在z方 羯並㈣電路板免於料㈣的辟古之， 本發明之背光模組血顯示裝置由 ' a 、σ 類的姑㈣/ 於無顯背蓋與螺絲之 來對電路板進行鎖固’即可較佳地 仗而可降低成本負擔與具有較簡易的狀方式。板 =本發明已以實施纖露如上，然其並_以限定 ❹ 本^明所屬技術領域中具有通常知識者，在不脫離 i發月之精神和範_ ’當可作些許之更動與潤飾，故本 么明之保護範圍當視後附之巾請專纖圍所界定者為準。 【圖式簡單說明】 圖1A為本發明一實施例之顯示裝置的背部示意圖。 圖1B為沿圖1A之AA’剖線所繪示之顯示裝置的剖面 示意圖。 圖1C則為沿圖ία之BB’剖線所繪示之顯示裝置的剖 面示意圖。 ❿ 圖2A為本發明一實施例之發光結構的示意圖。 圖2B為本發明另一實施例之發光結構的剖面示意 圖。 " 圖3為本發明另一實施例之顯示裝置的背部示意圖。 【主要元件符號說明】 100、100a :顯示裝置 110 :顯示面板 14 30045twf.doc/a 201028763, 1 ». \J\J\J\J * J1 112 :主動元件陣列基板 114 :彩色濾光基板 116 :軟性電路板 120 :背光模組 121 :背板 121a :前表面 121b :後表面 122 :凸肋結構 ❹ 122a:頂部表面 122b ··黏著區 123 :支撐凸台 124 :電路板 124a :側邊 125 :覆蓋膜 126 :黏膠層 127 :膠框 φ l27a :面板放置區 128 :框架 129、129a、129b :發光結構 142 :導光板 144、152 :光源 146 :光學膜片 154 ’·擴散片 CB1 :電路板放置區 15201028763 Αυυ»υ» 131 30045twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a backlight module and a display device, and in particular to a circuit board having a (four) stomach Fixed side (10) backlight module and [prior art] φ follow-up industry equipment, mobile phone, digital camera, digital camera (digitd 〇 _ (four), notebook (notebook) and table Digitalized computers and other digital tools are all more convenient: multi-functional and beautiful. In the use of these information products, 'display screen is an indispensable human-machine communication interface, through the above products will not be honorable. It brings more convenience to the user's operation. Among them, the liquid crystal display device has become the mainstream of the display screen. However, since the liquid crystal display panel of the liquid crystal display device itself cannot emit light, it is necessary to provide a backlight mode in the liquid crystal display panel. The group provides a light source to achieve the performance of the display. - Generally speaking, the backlight module has at least a housing, an optical film and a light source. The source and the optical film are disposed in the casing, and can be further divided into a direct type backlight module or a side edge light-emitting backlight module according to the manner in which the light source is disposed in the casing. In order to drive the liquid crystal display panel, A printed circuit board (PCB) is disposed outside the casing, and the printed circuit board is electrically connected to the liquid crystal display panel. In order to fix and protect the exterior of the casing, the 201028763 Αυυδυ» ι31 30045twf.doc/n printed circuit board is fixed. To avoid being affected by the external environment, it is usually protected by a cover covering the printed circuit board, and then the printed circuit board and the back cover are simultaneously locked by screws to be fixed to the casing of the backlight module. Or, first, the printed circuit board is firstly screwed to the housing of the backlight module for fixing, and then a protective film is attached to the printed circuit board to protect it. The above method of locking the printed circuit board causes the negative of the present, for example, the material cost of the back cover and the locking screw, or the labor cost of locking the screw. Therefore, how to provide a method for fixing a printed circuit board to a backlight module housing to reduce the cost is an important issue. [Invention] The present invention provides a backlight module that is fixed on a printed circuit board. In the meantime, there is a simpler fixing method, and the burden on the cost can be reduced. % The present invention also provides a display device using the above-described backlight module, and having the advantages described above, and (4) proposing a backlight mode The group includes a back plate, a rib joint support boss, a circuit board, a cover film, an adhesive layer, a glue x and a frame. The back plate has a front surface and a rear surface, which makes the back ^ The surface then has a board placement area. The rib structure is located at the periphery of the backing area of the backing plate, wherein the top surface of the rib structure has a landing area. The support boss is located in the board placement area on the back surface of the backplane. The board is located in the surface board placement area behind the backplane and is supported 5 201028763 Λ-υυουοιϋ 30045twf.doc/n The movement in the direction of the ribs around the board placement area. The cover film covers the circuit board to limit the movement of the board in the z direction. The adhesive layer is between the adhesive regions of the two rib structures. The frame is located on the side of the backing plate. The frame is located on the outside of the frame. The invention relates to a green ϋ-face forest, which comprises a display panel and an optical module. The moonlight module includes a back plate, a rib structure, a floor, a table, a circuit board, a cover film, an adhesive layer, a plastic frame, and a frame. The backsheet has a front surface and a back surface, wherein the back surface of the back panel has a circuit board placement area. The rib structure is located at the periphery of the board placement area on the rear surface of the back sheet, wherein the top surface of the rib structure has an adhesive area. The support boss is located in the board placement area on the back surface of the backplane. The circuit board is located in the board placement area on the rear surface of the backplane and is supported by the support bosses, wherein the board is ribbed at the periphery of the board placement area to limit its movement in the X and gamma directions. The cover film covers the circuit board as well as the rib structure to limit the movement of the board in the z direction. The adhesive layer is located between the cover film and the adhesive region of the rib structure. The plastic frame is located on the side of the backboard, and the plastic frame has a panel placement area. The display panel is mounted on the panel placement area. The frame is located on the outer side of the plastic frame to fix the backlight module and the display panel. In one embodiment of the invention, the cover film extends further to the surface of the frame. - In an embodiment of the invention, the adhesive layer further comprises a frame between the frame and the cover film. In one embodiment of the invention, the adhesive layer is further disposed between the circuit board and the 201028763 Λυυουουί 30045twf.d〇c/n cover film. In an embodiment of the invention, at least one flexible circuit board is further included. The flexible circuit board is located between the frame and the plastic frame. In one embodiment of the invention, the rib structure is integrally formed with the backing plate. In the embodiment of the invention, the support boss and the backing plate are integrally formed. In one embodiment of the invention, the rib structure is located at three sides of the circuit board. In the embodiment t of the invention, the rib structure is a continuous structure. In an embodiment of the invention, the rib structure is a discontinuous structure. The backlight module of the present invention uses a rib structure to limit the movement of the circuit board in the X direction and the Y direction, and covers the circuit board and the rib structure with a cover film to limit the circuit board in the 2 direction. The above is activated and protects the board from the external environment. In other words, the backlight module of the present invention can be used for the circuit board without using a material such as a back cover and a screw to secure the circuit board, thereby reducing the cost. Further, the present invention also proposes the use of the above-described backlight module to further have the above-mentioned advantages. The above features and advantages of the present invention will become more apparent from the following description. [Embodiment] FIG. 1 is a schematic diagram of the back of a display device of the present invention - 201028763 Λυυδυουί 30045twf.doc/n FIG. 1A is a cross-sectional view of the display device taken along the line, and FIG. 1C The cross-sectional view of the display device is shown along the line of FIG. Referring to FIG. 1A, FIG. 1A and FIG. 1C, the display device 1 of the embodiment includes a display panel 11A and a backlight module 120. The backlight module 120 includes a backing plate 12, a rib structure 122, a supporting boss 123, a circuit board 124, a cover film 125, an adhesive layer 126, a plastic frame 127, and a frame 128. The frame 127 is located on the side 121c of the back plate 121. The frame 128 is located on the outer side of the frame 127, and is mainly used to fix the display panel 11 and the backlight module 120. Hereinafter, the connection relationship between the respective members of the backlight module 120 will be described hereinafter, and then the connection relationship between the backlight module 120 and the display panel 11A will be described. In the backlight module 120, the back plate 121 has a front surface i2la and a rear surface 121b, wherein the back surface 121b has a circuit board placement area CB1, as shown in FIGS. 1A to 1C. The rib structure 122 is located at the periphery of the board placement area CB1 of the rear surface 121b of the backing plate 121, wherein the top surface 122a of the rib structure 122 has an adhesive area 122b. In the present embodiment, the structure of the rib structure 122 and the backing plate 121 may be integrally formed. For example, the rib structure 122 is formed by, for example, injection molding or die stamping, and the rib structure 122 as shown in FIG. 1B is directly formed on the rear surface 121b of the backing plate 21. In other embodiments, the structure of the rib structure 122 and the back plate 121 may also be a non-integral structure. In this embodiment, the structure of the rib structure 122 and the back plate 121 is formed as a description, but Limited to this. 201028763 AU0808131 30045twf.doc/n Further, the 'support boss 123 is located in the board placement area CB1 of the rear surface 121b of the back board 121 for supporting the circuit board 124 in the board placement area CB1 of the rear surface 121b of the back board 121, The electronic components (not shown) on the circuit board 124 can be prevented from directly contacting the backplane 121 or the electronic components on the circuit board 124 can be prevented from being squeezed. In this embodiment, the structure of the support boss 123 and the back plate 121 may be integrally formed. Similarly, the support boss 123 may be formed by the above-described injection molding or die pressing to directly form the branch boss 123 as shown in FIG. 1B on the rear surface 121b of the back plate 121. In another embodiment, the structure of the support boss 123 and the back plate 121 may also be formed in a non-integral manner. The above is only an integral form of the structure of the support boss 123 and the back plate 121, but not Limited to this. In a preferred embodiment, the above-mentioned rib structure 122 and the support boss 123 are simultaneously formed on the rear surface 12ib of the back plate 121 by the above-described technique of injection molding or die stamping, thereby saving production time and cost. . The manner in which the rib structure 122 and the support boss 123 are formed is merely an example. The actual situation may be slightly adjusted according to the needs of the user, and details are not described herein again. In addition, the pattern arranged by the support bosses 123 is mainly considered to prevent the circuit board 124 from being distributed or affecting the electronic components on the circuit board 124, and the arrangement pattern can be adjusted according to the user's needs. In the present embodiment, the circuit board 124 is disposed in the circuit board placement area CB1 and the rib structure 122 is located at the periphery of the circuit board placement area CB1 of the rear surface 121b of the back board 121, so that the circuit board 124 is located. The rib structure 122 around the board placement area CB1 limits its movement in the X direction and the γ direction to form a 9 201028763 Λυυουο 61 30045 twfdoc/n mode for fixing the circuit board 124 on the χ γ plane, as shown in FIG. In addition, the cover film 125 covers the circuit board 124 and the rib structure 122 to limit the movement of the circuit board 124 in the x-direction, as shown in FIGS. 1A and 1B. In detail, the cover film 125 uses an adhesive layer 126 to bond the cover film 125 and the rib structure 122, wherein the adhesive layer 126 is located between the cover film 125 and the adhesive region 122b of the rib structure 122. In this embodiment, the rib structure 122 is located on the three sides 124a of the circuit board 124 as an example, and the rib structure 122 may be arranged in a discontinuous structure, for example, as shown in FIG. 1A. Segmented door type concept, but not limited to this. In another embodiment, the rib structure 122 may be arranged in a continuous structure, for example, by connecting two adjacent rib structures 122 of FIG. 1A to form a continuous shape. The pattern of the rib structure 122 is mainly for the purpose of not restricting the electrical connection of the circuit board 124 to the outside, and the movement of the circuit board 124 in the X direction and the γ direction is considered. The arrangement pattern can be adjusted according to the user's needs. The above is only an example. In this embodiment, the backlight module 12 can further include a light emitting structure 129, wherein the light emitting structure 129 is located on the front surface ma of the back plate 121, as shown in FIG. 1B or FIG. 1C. According to the user's needs or design, the light-emitting structure 129 is, for example, 12% of the light-emitting structure of the side-lit backlight module, as shown in FIG. 2A; or 12% of the light-emitting structure of the direct-lit backlight module. 2B is shown. In detail, in FIG. 2A, the light emitting structure 129a may include a light guide plate 142, a light source 144, and at least one optical film 146. The light guide plate 142 is located on the front surface 121a of the back plate 121, 201028763 AUU8U8iil 30045twf.doc/n, and the light source 144 is located on at least one side 142a of the light guide plate 142. Further, the optical film 146 is positioned on the light guide plate 142 to homogenize or polarize the light emitted from the light guide plate 142 or to enhance the light emitted from the light guide plate 142. In other words, the optical film 146 is, for example, at least one of a diffusion sheet, a polarizer, a brightness enhancement sheet, or a composite optical film. In FIG. 2B, the light emitting structure 129b may include a plurality of light sources 152 and a diffusion sheet 154. The light source 152 is located on the front surface 121a of the back plate 121. A diffuser plate 154 is located above these light sources 152, as depicted in Figure 2B. In detail, the diffuser 152 is mainly used to homogenize the light from the light source 152 so that the light incident on the display panel can be relatively uniform. The above is only an example of the light-emitting structure that can be used in the light-emitting structure 129 of the present embodiment. In other embodiments not shown, the optical film layer or the type of the light source in the light-emitting structures 丨29, 129a, and 129b can be used visually. Make other appropriate adjustments to the needs of the person. In this embodiment, the plastic frame 127 is located on the side 121C of the back plate 121, wherein the plastic frame 127 can have a panel placement area 127a, and the display panel no can be mounted on the panel placement area 127a, as shown in FIG. Show. The plastic frame 127 is mainly used to fix the internal components of the backlight module 12, for example, the above-mentioned light-emitting structures 129, 129a, 129b and their internal components (light source or optical film, etc.). The frame 128 can be used to fix the display panel n and the backlight module 120 described above. In order to better define the movement of the circuit board 124 in the Z direction, it has a better fixability. The cover film 125 can extend to the surface of the frame 128 as shown in Figs. 1B and 1C. In this way, the adhesive layer 126 is required between the frame eg and the 11 201028763 AUU8U8I31 30045twf.doc/n covering film 125, so that the cover film 125 can be adhered and fixed to the frame 128, and the fixed circuit board 124 is fixed. The position in the z direction. In other possible cases, the adhesive layer 126 may also be located between the circuit board 124 and the cover film 125 (not shown). In addition, in order to drive the driving circuit on the display panel 11A for display, the display device 100 may further include at least one flexible circuit board 116. The flexible circuit board 116 is located between the frame 128 and the plastic frame 127, and the flexible circuit board 116 is electrically connected to the circuit board 124 and the display panel 110, as shown in FIGS. 1A and 1B. In this embodiment, the display panel 11A can include an active device array substrate 112 and a color filter substrate 114. The active device array substrate 112 and the color filter substrate 114 have a liquid crystal layer (not shown). In detail, the flexible circuit board 116 is electrically connected to a peripheral circuit area (not shown) of the active device array substrate 112 and the circuit board 124. The circuit board 124 can be driven on the active device array substrate 112 through the flexible circuit board 116. The active components (not shown) are used to make the display panel 11 appear, and the related display and driving principles are well known to those skilled in the art, and will not be described here. It should be noted that the flexible circuit board 116 is not a flexible circuit board that is electrically connected to the display panel 11 . The flexible circuit board 116 may also include a flexible circuit board electrically connected to the light source. Thus, the circuit board The 124 can be electrically connected to the display panel 110 through the flexible circuit board 116, or can be electrically connected to the light source. In other words, the circuit board 124 on the backplane 121 can be electrically connected to other components through the flexible circuit, and the possible electrical connection manners are within the scope of the present invention. In addition, the display panel 11 described above is exemplified by the liquid 12 201028763 /\uw〇i/〇i31 30045twf.d〇〇/n crystal display panel. However, in other possible embodiments, it is possible to make the (four) back domain group. The resignation panel is a testable concept. In this form, the display device can be used to limit the movement of the circuit board 124 on the γ γ plane, as shown in Fig. 3. In Fig. 3, the display device is similar to the display device, except that the four sides 124a of the circuit board 124 are referenced to the rib structure 122. The rib structure 122 as shown in Fig. 3 can also be set to be in the χ_γ direction of the good fixed circuit board 124. It is worth mentioning that, when the rib structure 122 is disposed on the side of the flexible electric device 6, it is necessary to consider the position of avoiding the flexible circuit board US: the rib structure 122 on the side is usually Similarly, for the non-continuous structure 2, the reproducible cover film 125 covers the circuit board 124 and the convex structure 122 and adheres to the landing area mb of the cover film 125 and the rib structure 122 by using the adhesive layer 126. The board moves with f in the direction B. In other words, the display device rib structure 122 adopts the above design, and can also effectively fix the position of the circuit board 124 in the χγζ direction, and has a better fixing manner. In the above, it can be seen that the display device 100, 100a of the present embodiment does not need to use a back cover or a screw to lock the circuit board, but only forms the rib structure 122 on the back plate 121, and transmits the above mentioned In a fixed manner, the circuit board 124' can be fixed and the cost burden can be reduced. In summary, the backlight module and the display device of the present invention restrict the movement of the circuit board in the x-direction and the γ direction by the rib structure, and use the cover 13 201028763 — vouo., 1 3〇〇45twf.d〇 The c/n and the rib structure are used to limit the circuit board in the z-square and the (4) circuit board is free from the material (four). The backlight module blood display device of the present invention is composed of 'a, σ class (4)/ Without the back cover and the screw to lock the circuit board, it can be better, and the cost burden and the simpler manner can be reduced.板=The present invention has been implemented as the above, but it is limited to the general knowledge in the technical field of the present invention, and it is possible to make some changes and refinements without departing from the spirit of the moon. Therefore, the scope of protection of this Ming Ming is subject to the definition of the attached towel. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic view of the back of a display device according to an embodiment of the present invention. Fig. 1B is a schematic cross-sectional view of the display device taken along line AA' of Fig. 1A. Fig. 1C is a cross-sectional view showing the display device taken along the line BB' of Fig. ία. 2A is a schematic view of a light emitting structure according to an embodiment of the present invention. Fig. 2B is a schematic cross-sectional view showing a light emitting structure according to another embodiment of the present invention. " Figure 3 is a schematic view of the back of a display device according to another embodiment of the present invention. [Description of main component symbols] 100, 100a: display device 110: display panel 14 30045twf.doc/a 201028763, 1 ». \J\J\J\J * J1 112 : active device array substrate 114: color filter substrate 116 : Flexible circuit board 120 : Backlight module 121 : Back plate 121 a : Front surface 121 b : Rear surface 122 : Rib structure ❹ 122 a : Top surface 122 b · Adhesion area 123 : Support boss 124 : Circuit board 124 a : Side 125 : cover film 126 : adhesive layer 127 : plastic frame φ l27a : panel placement area 128 : frame 129 , 129a , 129b : light-emitting structure 142 : light guide plate 144 , 152 : light source 146 : optical film 154 ' · diffusion sheet CB1 : Board placement area 15