201028639 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱鰭片、散熱器及增加鰭片散 熱效果的方法，特別是指一種表面具有多數導熱顆粒的散 熱鰭片、散熱器及藉此增加鰭片散熱效果的方法。 【先前技術】 隨著電腦運算效能的提升，電腦内部之電子元件例 如：中央處理單元（CPU)、顯示卡（VGA)及北橋（N〇nh Bridge)晶片等需要處理的資料量越來越大，且處理資料的 速度也越來越高，因此伴隨著電子元件在處理資料時所產 生的熱能也相對增加，而過高的溫度將嚴重影響電腦運作 上的穩定性及效能。 因此，現今常將散熱器裝設於電子元件上，以期快速 逸散電子元件所產生的熱能。但是，在筆記型電腦 Notebook)中，現今一般具有多數個散熱鰭片（Fin)的散熱 器已漸漸無法達到有效地散熱，其原因在於筆記型電腦的 散熱空間有限，以致於散熱器的位置及大小皆被限制住， 使得散熱器在導熱時容易產生熱邊界層效應 B〇UndaryLayerEffect)，配合參閱圖i及圖2，圖2為風流 經過習知散熱鰭片90的位置與對應該位置的溫度之關係， 其中，縱轴為散熱鰭片9〇的溫度，橫軸為風流經過散熱鰭 片90的位置且橫軸的方向為風流的方向。風流會從D〇位 置吹向D2位置，而D〇、D1及⑴代表在散熱縛片9〇上 的不同位置，由於風流所能帶走的熱能會隨著風流所經過 201028639 散熱鰭片90的距離增加而遞減，亦即，熱能帶走的越少， 散熱錄片90上的溫度也就越南’因此，從d〇到〇 1的、、w 度曲線會漸漸上升。但是，當風流通過D1位置且繼續往 D2位置前進時，溫度曲線將不會再上升，此時，即表示風 流所能帶走的熱能已經飽和，無法再帶走散熱鰭片9〇上其 餘的熱能，故溫度曲線會趨近於—水平線，而產生了所謂 的熱邊界層效應。若電子元件所產生的熱能越多，其效:201028639 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating fin, a heat sink and a method for increasing the heat dissipating effect of the fin, in particular to a heat dissipating fin and a heat sink having a plurality of heat conductive particles on the surface thereof. And a method for increasing the heat dissipation effect of the fins. [Prior Art] With the improvement of computer computing performance, the amount of data to be processed, such as central processing unit (CPU), display card (VGA), and North Bridge (N〇nh Bridge) chips, is increasing. And the speed of processing data is getting higher and higher, so the thermal energy generated by the electronic components in processing the data is relatively increased, and the excessive temperature will seriously affect the stability and performance of the computer operation. Therefore, heat sinks are often installed on electronic components to quickly dissipate the thermal energy generated by the electronic components. However, in the notebook notebook, the heat sinks with many heat sink fins (Fin) are gradually unable to achieve effective heat dissipation. The reason is that the cooling space of the notebook computer is limited, so that the position of the heat sink and The size is limited, so that the heat sink is prone to thermal boundary layer effect (B〇UndaryLayerEffect) when it is thermally conductive. Referring to Figure i and Figure 2, Figure 2 shows the position of the wind flow through the conventional heat sink fin 90 and the corresponding position. The relationship between the vertical axis is the temperature of the fins 9,, and the horizontal axis is the position where the wind flows through the fins 90 and the direction of the horizontal axis is the direction of the wind flow. The airflow will blow from the D〇 position to the D2 position, while D〇, D1 and (1) represent different positions on the heat dissipation tab 9〇. The thermal energy that can be carried away by the wind flow will pass the 201028639 heat sink fin 90 with the wind flow. The distance decreases, that is, the less heat is carried away, the temperature on the heat-dissipating film 90 is also Vietnamese. Therefore, from d〇 to 〇1, the w-degree curve will gradually increase. However, when the wind flow passes through the D1 position and continues to the D2 position, the temperature curve will not rise any more. At this time, it means that the heat energy that can be taken away by the wind flow is saturated, and the remaining fins on the fins 9 can no longer be taken away. Thermal energy, so the temperature curve will approach the - horizontal line, resulting in the so-called thermal boundary layer effect. If the thermal energy generated by the electronic components is more, the effect:
越是明顯’因此會導致筆記型電腦容易發生散熱不佳的情 形。 【發明内容】 種可以增加鰭片散 因此’本發明之目的，即在提供一 熱效果的方法》 於是’本發明增域丨散熱效果的方法是在至少一鲜 片部分表面上形成多數個導熱顆粒。 較佳地，料導熱祕制㈣砂技術及燒結技術宜 中之-钻著於朗片部分表面上，且導熱顆粒的選擇是根 據韓片與鄰近的另—鰭片之間的距離，其粒徑不大於該距 離的十分之—。此外，導熱顆粒需為高導熱錄的材料， 例如：銅粉、鋁粉、銅粉與鋁粉混合等等。 較佳地’韓片與鄰近的另—綠片之間的距離為1〇3公 二：導熱顆粒為粒徑約為1〇.6公尺的銅粉，也就是說導 熱顆粒的粒徑範圍⑽公尺至…公尺間。從另一個觀 =:導熱顆粒粒經的數量級…-6公尺，也就是粒 工 _與10x10-6之間變化，即直徑在1〇-5公尺至 201028639 ι〇·6公尺間。 此外，本發明之另一目的，即在提供 熱效果的散熱鰭片。 了以增加散 本發明散熱‘鰭片部分表面上形成多數 增加散熱韓片之表面積，減輕熱邊界層效應其^= ’以 顆粒是利用喷砂技術及燒結技術其中之-枯著於散 至少部分表面上。 欺…、鰭片 較佳地，導熱顆粒的粒徑是取決於 鰭片之間的距離’其粒徑不大於該距離的十分之—。 外，導熱顆粒需為高導熱係數的材料，例如：銅粉、2 粉、銅粉與鋁粉混合等等。 銘 =，韓片與鄰近的另一韓片之間的距離為10_3公 ，導…、顆粒為粒徑約為1〇-6公尺的鋼粉，也就 熱顆粒的粒徑範圍為1〇-4公尺至1〇.6公尺間 參 點觀之，導熱顆粒粒徑的數量級約為心公尺 =一之，，即直徑…:: 此外，本發明之另—目的，即在提供一種可以 熱效果的散熱器。 θ加散 本發明散熱器具有多數個散熱韓片，且在至少 :片部分:面上形成多數個導熱顆粒，以增加散熱二 表面積，減輕熱邊界層效應，其中所述導熱顆 之 砂技術及燒結技術其中之—㈣於散熱㈣至少 ^ 201028639 較佳地，導熱顆粒的粒徑是取 ^ u 疋取决於鰭片與鄰近的另一 鑛片之間的距離，其粒㈣大於訪離的十分之一。此 外’導熱顆粒需為高導熱係數的材料，例如：銅粉、艇 粉、銅粉與鋁粉混合等等。 較佳地，鰭片與鄰近的另一嗜片 释月之間的距離為10-3公 尺’ Μ熱顆粒為粒彳㈣為⑽公尺的鋼粉，也就是說導 熱顆粒的粒徑_…公尺至1〇·6公尺間。從另一個觀The more obvious it is, the more likely it is that the notebook will be less susceptible to heat dissipation. SUMMARY OF THE INVENTION It is possible to increase the fin dispersion so that the object of the present invention is to provide a thermal effect. Thus, the method of the present invention is to form a plurality of heat conduction on the surface of at least one fresh chip portion. Particles. Preferably, the material heat conduction secret (4) sand technology and sintering technology are suitable for drilling on the surface of the slab portion, and the selection of the heat conductive particles is based on the distance between the Korean film and the adjacent other fin, the granule The diameter is not greater than the tenth of the distance. In addition, the heat conductive particles need to be materials with high thermal conductivity, such as: copper powder, aluminum powder, copper powder and aluminum powder mixed, and the like. Preferably, the distance between the 'Korean sheet and the adjacent other green sheet is 1 〇 3 gong: the heat conductive particles are copper powder having a particle diameter of about 1 〇. 6 meters, that is, the particle size range of the heat conductive particles. (10) Metric to ... meters. From another view =: The order of the thermal particles is ... 6 meters, which is the change between the grain _ and 10x10-6, that is, the diameter is between 1〇-5 meters and 201028639 ι〇·6 meters. Further, another object of the present invention is to provide a heat-dissipating fin. In order to increase the heat dissipation of the invention, the surface of the fin portion is formed to increase the surface area of the heat-dissipating Korean film, and the thermal boundary layer effect is reduced. The particle is made by using sand blasting technology and sintering technology - at least part of the drying On the surface. Preferably, the particle size of the thermally conductive particles is determined by the distance between the fins whose particle size is not greater than the distance. In addition, the thermal conductive particles need to be materials with high thermal conductivity, such as: copper powder, 2 powder, copper powder mixed with aluminum powder, and the like. Ming =, the distance between the Korean film and the other adjacent Korean film is 10_3 gong, the grain is a steel powder with a particle size of about 1 〇 6 meters, and the particle size range of the hot granule is 1 〇 -4 meters to 1 〇.6 meters between the points of view, the thermal particle size is about the order of the square = one, that is, the diameter ...:: In addition, the other purpose of the present invention, that is, A heat sink that can be used with heat. Θ-dispersion The heat sink of the invention has a plurality of heat-dissipating Korean sheets, and forms at least a plurality of heat-conducting particles on the surface of the sheet portion to increase the heat-dissipating surface area and reduce the thermal boundary layer effect, wherein the heat-conducting sand technology and Sintering technology among them - (d) in heat dissipation (four) at least ^ 201028639 Preferably, the particle size of the thermally conductive particles is taken from the distance between the fin and another adjacent piece of the piece, the grain (four) is larger than the ten One of the points. In addition, the heat conductive particles need to be materials with high thermal conductivity, such as copper powder, boat powder, copper powder mixed with aluminum powder, and the like. Preferably, the distance between the fin and the adjacent other release film is 10-3 meters'. The hot particles are the steel powder of (10) meters, that is, the particle size of the heat conductive particles. ...meter to 1〇·6 meters. From another view
點觀之’導熱顆粒粒徑的數量級約為1().6公尺也就是粒 徑可在1X101 10><10-6之間變化，即直縣1〇-5公尺至 10-6公尺間。 本發明之功效在於’藉由在緒片表面形成複數導熱顆 粒，増加散熱鰭片的表面積，提高鰭片的散熱效果。 【實施方式】 有關本發明之則述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中將可 清楚的呈現。 參閱圖3及圖4,為本發明散熱器之較佳實施例，該 散熱器1可應用於散熱模組2中，並裝設在各種電子元件 3上，例如：中央處理單元（CPU) '顯示卡（VGA)及北橋 (North Bridge)晶片等，以提高電子元件3散熱的效果。 在本實施例中’散熱模組2包括一風扇4、一散熱管 (Heat Pipe)5及散熱器1。其中，散熱器i具有多數個散熱 鰭片10。在本實施例中，該散熱器1是如圖3所示，包含 多數個形狀概呈倒U形的散熱錯片10，但由以下描述可 201028639 知·’本發明所應料稱散熱器可以為任何種類型式，例 如』裝型、一體成型等等，且形狀也不受限，可為矩 形、多邊形、圓形、放射狀等等。散熱模叙2的散教管5 穿入每-個散熱韓片10之倒_開口並與散熱韓片1〇迫 緊連f 電子元件3在運作時所產生的熱能會透過 散熱官5將熱能傳導至散熱管5的本體上及與散熱管$連 接的每一個散熱籍片10上，再利用風扇4旋轉導入風流將 散熱結片10上的熱能帶出電子元件3外。The point of view of the 'thermal particle size is about 1 (). 6 meters, that is, the particle size can vary between 1X101 10 >< 10-6, that is, straight county 1〇-5 meters to 10-6 Between meters. The effect of the present invention is to improve the heat dissipation effect of the fins by forming a plurality of thermally conductive particles on the surface of the sheet and adding the surface area of the fins. The present invention will be clearly described in the following detailed description of the preferred embodiments of the present invention. Referring to FIG. 3 and FIG. 4, in a preferred embodiment of the heat sink of the present invention, the heat sink 1 can be applied to the heat dissipation module 2 and mounted on various electronic components 3, such as a central processing unit (CPU). A display card (VGA) and a North Bridge wafer are used to improve the heat dissipation of the electronic component 3. In the present embodiment, the heat dissipation module 2 includes a fan 4, a heat pipe 5 and a heat sink 1. Among them, the heat sink i has a plurality of heat radiating fins 10. In the present embodiment, the heat sink 1 is as shown in FIG. 3, and includes a plurality of heat-dissipating strips 10 having an inverted U-shape. However, the following description can be used to describe the heat sink. For any type, for example, "mounting", integral molding, and the like, and the shape is not limited, and may be rectangular, polygonal, circular, radial, or the like. The heat-dissipating tube 5 of the heat-dissipating model 2 penetrates into each of the heat-dissipating Korean films 10 and is connected to the heat-dissipating Korean film. The heat generated by the electronic component 3 during operation is transmitted through the heat-dissipating officer 5. Conducted on the body of the heat pipe 5 and each of the heat sink sheets 10 connected to the heat pipe #, and then the fan 4 is rotated to introduce the air flow to bring the heat energy on the heat sink film 10 out of the electronic component 3.
者為了降低熱邊界層效應，使散熱鰭片1〇可以吸 更多的.'、、此，必須延長風流（冷空氣）經過散熱鰭片的 P卩加風流（冷空氣）在散熱鰭片1〇上發生熱交換的 時間因此’參閱圖4 ’本實施例之散熱器1中，每-個 散熱錄片10的表面上皆枯著多數個導熱顆粒n，用於增 加每個散熱鰭片10之表面積，如此即可延長風流經過散 熱錯片10的時間，參閲圖5，其中圖5⑷及圖冲)分別表 不f知散熱_片及本實施例之散熱錄片的熱邊界層效應。 由圖5(b)中所不’風流能帶走的熱能達到飽和的位置從原 圖⑷的D1位置退後至圖5⑼的〇1，位置，也就是說風 流能夠帶走的熱能相較於未枯著導熱顆粒n之韓片增加許 多降低了散熱轉片10的熱邊界層效應。 本實施例之散熱鰭片10在實際製作上是先置備一鰭 2本實施例中’該鰭片為銅片或鋁片，其表面積為 接著，根據鰭片與鰭片之間的距離，選擇一種顆 粒大小適中且任意形狀的導熱顆粒1卜此用意在於，在散 201028639 …模組2中通常會裝設多個_片來進行散熱，若導熱顆粒 1的顆粒過大，則導熱顆粒u會卡在_片與雜片之間的 縫隙中，如此會導致韓片散熱的效果不增反減，因此，所 選擇的導熱顆粒11之粒徑必須不大於於錯片與錯片之間的 3距，的十分之一，而本實施例歸片與韓片之間的距離為爪 A尺因此可以選擇使用鋼粉或鋁粉製成之導熱顆粒 11 ’且每-導熱㈣U的粒徑約4 1()·6公尺，也就是說導 熱顆粒11的粒徑範圍為1()-4公尺至iq.6公尺 個觀點觀之，由於每—導熱軸u純賴量級約為ι〇·6 公尺，也就是粒徑可在lxlG.6與1GxlG、間變化，即直 徑在10-5公尺至10-6公尺間。 參 在選擇導熱顆粒u之後，即可將導熱顆粒η以喷砂 技術枯者於縛片的全部表面上’而製成本實施例之散敎鰭 片。Η)’且每-_片的表面積可增加⑽職2，故若散熱 器1具有55個散熱韓片1〇，則表面積即可多增加 5500随2’其散熱的效果會優於無任何導熱難^之韓 一提的是，粘著於散熱鰭片10上的導熱顆粒11 熱係數的材料，例如：金屬材料或是多種金屬材料 1口，例如銅粉加轉，且導熱顆粒η的材質不 ==片10相同，例如可以鋼片喷上銘粉。再者，、著 =並不限於噴砂的方式’亦可以利用燒 顆粒U結合於散_片1G的燒結技術， 黏附的方式皆可實現。 麗 參閱圖4,本實施例之散熱器1中的散熱續片10具有 201028639 第面1〇1及一第二面102，而導熱顆粒u粘著於散熱 鰭片10#範圍可以只有第一面101 s戈第二面102的部分表 面或是只粘著於第一面101及第二面ι〇2的其令任一面， 此外，本實施例是先將多個散熱鰭片10組裝於散熱器i， 再利用喷砂技術一次將導熱顆粒u噴灑於散熱器丨，也可 以是先將每一個散熱鰭片10皆喷上導熱顆粒u後再組 裝於散熱器1中，當然，散熱器i的種類型式並不受限， 右散熱器1為非組裝型，則直接將導熱顆粒u嘴灑於散熱 器1即可，不以本實施例為限。 綜上所述，本發明散熱器丨透過喷砂技術及燒結技術 其中之一將導熱顆粒n粘著於散熱鰭片10，藉此增加散 熱鰭片10的表面積，以延長風流經過散熱鰭片1〇的時間 並增加風流能夠帶走的熱能，如此可有更好的散熱效果。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖’說明習知的散熱鰭片； 圖2是曲線圖，說明風流經過習知散熱鰭片的位置與 散熱鰭片的溫度之關係； 圖3是一示意圖’說明本發明散熱器之較佳實施例， 其中散熱器是應用於散熱模組並裝設於電子裝置中； 圖4是一立體圖’說明本實施例之散熱器中的其中一 201028639 個散熱鰭片；及 圖5是曲線圖，分別說明習知與本實施例之散熱鰭片 的熱邊界層效應。In order to reduce the thermal boundary layer effect, the heat sink fins 1 can absorb more. ',,,,, must extend the wind flow (cold air) through the heat sink fins P卩 plus air flow (cold air) in the heat sink fins 1 The time during which heat exchange occurs on the crucible is therefore referred to in FIG. 4 . In the heat sink 1 of the present embodiment, a plurality of thermally conductive particles n are absent on the surface of each of the heat-dissipating recording sheets 10 for increasing each of the heat dissipation fins 10 The surface area, thus extending the time of the wind flow through the heat dissipating chip 10, referring to FIG. 5, wherein FIG. 5(4) and FIG. 3) respectively show the thermal boundary layer effect of the heat dissipating film and the heat dissipating film of the embodiment. The position where the thermal energy that is taken away by the wind flow in Figure 5(b) is saturated from the D1 position of the original figure (4) to the position of the 〇1 of Fig. 5 (9), that is, the heat energy that the wind can take away is compared with The increase in the thermal boundary layer effect of the heat-dissipating fins 10 is greatly increased by the fact that the Korean sheets which are not dried with the heat-conductive particles n are increased. The fins 10 of the present embodiment are first provided with a fin 2 in the actual fabrication. In the embodiment, the fin is a copper sheet or an aluminum sheet, and the surface area is followed by the distance between the fin and the fin. A heat-conducting particle having a moderate particle size and an arbitrary shape is intended to dissipate a plurality of sheets in the 201028639 module 2 for heat dissipation. If the particles of the heat-conducting particles 1 are too large, the heat-conducting particles will be stuck. In the gap between the 片 and the chip, the effect of heat dissipation of the Korean film is not increased or decreased. Therefore, the particle size of the selected heat conductive particles 11 must be no more than 3 distances between the wrong piece and the wrong piece. One tenth of the size, and the distance between the film and the Korean film in this embodiment is the claw A. Therefore, the heat conductive particles 11' made of steel powder or aluminum powder can be selected and the particle diameter of each heat conduction (four) U is about 4 1 () · 6 meters, that is to say, the particle size range of the heat conductive particles 11 is from 1 () to 4 meters to iq. 6 meters from the viewpoint, since each heat conduction axis u is about ι 〇·6 meters, that is, the particle size can vary between lxlG.6 and 1GxlG, ie between 10-5 meters and 10-6 meters in diameterAfter the selection of the thermally conductive particles u, the thermally conductive particles η can be dried on the entire surface of the tab by the sand blasting technique, and the divergent fins of this embodiment are formed. Η)' and the surface area of each -_ film can be increased by (10) job 2, so if the heat sink 1 has 55 heat sinks, the surface area can be increased by 5,500 with 2' heat dissipation effect is better than no heat conduction It is difficult to mention that the material of the thermal conductivity of the heat-conducting particles 11 adhered to the heat-dissipating fins 10, for example, a metal material or a plurality of metal materials, such as copper powder, and the material of the heat-conducting particles η Not == The piece 10 is the same, for example, the steel sheet can be sprayed with the powder. Furthermore, the method of blasting is not limited to the method of sand blasting. It is also possible to use the sintering technique in which the granules U are bonded to the scatter sheet 1G, and the adhesion method can be realized. Referring to FIG. 4, the heat dissipating film 10 in the heat sink 1 of the present embodiment has a first surface 1〇1 and a second surface 102 of 201028639, and the heat conductive particles u are adhered to the heat dissipating fin 10#. A part of the surface of the second surface 102 of the 101 s is adhered to only one surface of the first surface 101 and the second surface ι 2, and in this embodiment, the plurality of heat dissipation fins 10 are first assembled to dissipate heat. Then, using the sand blasting technique, the heat conductive particles u are sprayed on the heat sink 一次 at a time, or each of the heat radiating fins 10 may be sprayed with the heat conductive particles u before being assembled in the heat sink 1, of course, the heat sink i The type of the type is not limited. If the right heat sink 1 is of an unassembled type, the heat conductive particles u can be directly sprinkled on the heat sink 1, which is not limited to the embodiment. In summary, the heat sink of the present invention adheres the heat conductive particles n to the heat dissipation fins 10 through one of the sand blasting technology and the sintering technology, thereby increasing the surface area of the heat dissipation fins 10 to extend the wind flow through the heat dissipation fins 1 The embarrassing time and increase the heat energy that the wind can take away, so that there is better heat dissipation. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view illustrating a conventional heat sink fin; FIG. 2 is a graph illustrating a relationship between a position of a wind flow passing through a conventional heat sink fin and a temperature of the heat sink fin; FIG. A preferred embodiment of the heat sink of the present invention, wherein the heat sink is applied to the heat dissipation module and mounted in the electronic device; FIG. 4 is a perspective view illustrating one of the 201028639 heat sink fins in the heat sink of the embodiment. And FIG. 5 is a graph illustrating the thermal boundary layer effect of the conventional heat dissipating fins of the present embodiment.
10 201028639 【主要元件符號說明】 1…… •…散熱器 2 •…· ••…散熱模組 1 π..... ____私勒缺y ^ ..... 1 U /1 J ..... .....電千裝置 101 ··· —第 面 4 ••… .....風扇 102… •…第二面 5 ••… .....散熱管 11…… •…導熱顆粒 ❹ 1110 201028639 [Description of main component symbols] 1... •...heatsink 2 •...· ••...thermal module 1 π..... ____ 私勒缺 y ^ ..... 1 U /1 J . .... ..... 电千装置 101 ··· —第面4 ••... ..... Fan 102... •...Second side 5 ••... ..... Heat pipe 11... •...thermal particles ❹ 11