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TW201028227A - Method for manufacturing composite metal wire and product thereof - Google Patents

Method for manufacturing composite metal wire and product thereof Download PDF

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Publication number
TW201028227A
TW201028227A TW98102770A TW98102770A TW201028227A TW 201028227 A TW201028227 A TW 201028227A TW 98102770 A TW98102770 A TW 98102770A TW 98102770 A TW98102770 A TW 98102770A TW 201028227 A TW201028227 A TW 201028227A
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Taiwan
Prior art keywords
gold
wire
silver
palladium
component
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TW98102770A
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Chinese (zh)
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TWI373382B (en
Inventor
jun-de Li
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jun-de Li
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Priority to TW98102770A priority Critical patent/TW201028227A/en
Priority to JP2009233478A priority patent/JP5541440B2/en
Publication of TW201028227A publication Critical patent/TW201028227A/en
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Publication of TWI373382B publication Critical patent/TWI373382B/zh

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    • H10W72/015
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/43Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/43Manufacturing methods
    • H01L2224/438Post-treatment of the connector
    • H01L2224/43848Thermal treatments, e.g. annealing, controlled cooling
    • H10W72/50
    • H10W72/552
    • H10W72/5522

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  • Wire Bonding (AREA)

Abstract

This invention provides a method for manufacturing a composite metal wire, comprising the steps of: providing a main metallic material containing gold ingredient and silver ingredient; placing the main metallic material in a vacuum furnace and adding different proportions of palladium into the vacuum furnace as secondary metallic material to be mixed, and then performing mix smelting to produce a silver-palladium alloy melted liquid; then, continuously casting the silver-palladium alloy melting liquid and drawing into a silver-palladium alloy wire; and finally, drawing the gold-silver-palladium alloy wire into a gold-silver-palladium alloy solder wire having a predetermined diameter. The gold-silver-palladium alloy solder wire manufactured by mixing three metallic materials of gold, silver, and palladium not only can reach the efficacy of metallic bonding wire made of pure gold, but also can greatly reduce the cost.

Description

201028227 六、發明說明: 【發明所屬之技術領域】 本發明是關於一種金屬銲線,尤指一種用於半導體封 裝製程中的複合金線的製法及其成品。 【先前技術】 在半導體元件之封裝製程中,常以打線接合將金屬銲 線連接至晶片及電路基板上,藉金屬銲線電連接於晶片與 ❹電路基板,以作為晶片與電路基板之間的訊號及電流傳遞 路徑。 一般來說,金屬銲線之荷重強度、延展性、彎曲度、 熔點、電性、硬度及與1c晶片的銲接能力等主要特性與其 所採用的材料相關。而上述特性將影響半導體元件的壽命 及穩疋性。依照晶片與電路基板的型態不同,其搭配使用 之金屬知線的規格亦有所不同。 傳統金屬銲線主要為純金材質所製成。純金材質的金 ❹屬鲜線具有較佳的延展性及導電性等物理性f,但是,由 於純金材質的金屬銲線成本較高,也造成整體半導體元件 成本增加。 因此,對於上述問題’如何開發一種能達到純金鲜線 的功效’並可大幅降低材料成本的金屬銲線,乃是本發明 主要所要解決之課題。 【發明内容】201028227 VI. Description of the Invention: [Technical Field] The present invention relates to a metal bonding wire, and more particularly to a method for producing a composite gold wire used in a semiconductor packaging process and a finished product thereof. [Prior Art] In the packaging process of a semiconductor device, a metal bonding wire is often connected to a wafer and a circuit substrate by wire bonding, and is electrically connected to the wafer and the circuit substrate by a metal bonding wire to serve as a wafer and a circuit substrate. Signal and current transfer path. In general, the main characteristics of the load strength, ductility, bending, melting point, electrical properties, hardness, and welding ability of the 1C wafer of the metal wire are related to the materials used. The above characteristics will affect the life and stability of the semiconductor device. Depending on the type of the chip and the circuit board, the specifications of the metal wire used in combination are also different. Traditional metal wire is mainly made of pure gold. The gold wire of pure gold has a good physical property such as ductility and electrical conductivity. However, due to the high cost of the metal wire of pure gold, the cost of the entire semiconductor component is also increased. Therefore, the above-mentioned problem 'how to develop a metal wire which can achieve the effect of pure gold fresh wire' and can greatly reduce the material cost is the main problem to be solved by the present invention. [Summary of the Invention]

因此,本發明之目的,扃於姐糾 ^ A A 在於供一種以金、銀及把三 種的金屬元素調配製成,可遠糾 j運到純金材質的金屬銲線的功 3 201028227 效,並可降低成本之複合金線。 為達上述目的,本發明提供一種複合金線之製法,包 含:提供一包含金成份及銀成份之主要金屬原料;將該主 要金屬原料置於一真空熔爐中,並在該真空熔爐中加入不 同比例純鈀金屬為次要金屬原料調配後,進行混合熔煉, 以製成一銀把合金融熔液體;然後,將銀鈀合金融熔液體 經由連續鑄造再引拔拉伸成一銀鈀合金線材;最後,將金 鏐銀鈀合金線材拉伸為一預定線徑的金銀鈀合金銲線。 此外,本發明更提供一種以上述製法所製得之複合金 線,其組成成分主要包含:重量百分比為8 〇〇〜3〇 〇〇 %的金 成分、重量百分比為06.00〜90.00 %的銀成分;以及重量百 分比為0.01〜6.00 %的把成分。 本發明藉由金、銀及飽三種金屬元素調配製成之複合 金線,不僅能達到純金製成的金屬銲線的功效,並且可以 大幅降低成本。 _【實施方式】 有關本發明之技術内容及詳細說明,配合圖式說明如 下: 如第一圖及第二圖所示’分別為本發明之複合金線的 製造方法之流程圖及其細部流程圖。如圖所示,本發明之 複合金線的製造方法,首先,在步驟100中,先提供一包 含金成份及銀成分之主要金屬原料。 其次,在步驟102中,進行熔煉製造,將包含金成份 及銀成份的主要金屬原料置入於真空熔爐(如步驟 4 201028227 102a),並且,在真空熔爐中加入具有鈀(Pd)之次要金屬 原料進行混合熔煉(如步驟102b),以藉由真空熔爐煉製出 一金銀把合金融炫液體(如步驟102c)。該金銀纪合金融炼 液體的組成成分包含:重量百分比為8.00〜30.00 %的金成 分、重量百分比為66.00〜90.00 %的銀,以及重量百分比為 0.01 〜6.00 % 的 I巴。 然後,再將該金銀鈀合金融熔液體經由連續鑄造再引 _ 拔拉伸形成一預定線徑為4〜8 mm的金銀纪合金線材(如步 驟102d)。再透過捲收機捲取該金銀鈀合金線材(如步驟 102e),並進行該金銀Ig合金線材的成份分析(如步驟 102f),以判斷其成分比例是否符合要求。 步驟104,對鑄造完成之金銀鈀合金線材進行拉 伸,使其原本為4〜8mm的線徑經過一第一粗伸線機的拉伸 縮小至3mm或3mm以下(如步驟104a),再經一第二粗伸線 機拉伸至1.00mm或1.00mm以下(如步驟104b),再經一第一 ®細伸線機拉伸至0.18 mm或0.18 mm以下(如步驟104c), 然後,再將〇.18mm或0.18mm以下的金銀紀合金線材依序經 過一第二細伸線機(步驟104d)、一極細伸線機(步驟 104e),以及一超極細伸線機(步驟104f)將金銀鈀合金線材 拉伸為一預定線徑為 0.050 mm (2.00mil)至 0.010 mm (0.40mil)範 圍的特定金銀把合金銲線。 步驟106,進行表面清洗,對該金銀鈀合金銲線之表 面進行清洗。 步驟108,將經過拉伸完成的金銀鈀合金銲線進行烘 201028227 乾及熱退火處理,使金銀把合金銲線之斷裂荷重(Breaking Load)及斷裂應變(Elongation)等物理性質符合預定之所需範 圍。 上述本發明之複合金線可應用於1C、LED及SAW封裝 作為導線之用。 以下藉數個實施例對本發明進行更詳細的說明: <實施例1> 將包含金成份及銀成分的主要金屬原料置入於真空熔 爐,並在真空熔爐中加入鈀之次要金屬原料,然後,由真 空熔爐混合熔煉煉製出金銀鈀合金融熔液體。金銀鈀合金 融熔液體之組成成分包含:重量百分比為30.00%的金、重 量百分比為66.00%的銀,以及重量百分比為4.00%的把。 將該金銀鈀合金融熔液體經由連續鑄造再引拔拉伸出 線徑為4 mm的金銀Ie合金線材。通過捲收機捲取金銀把合 金線材,並進行金銀把合金線材的成份分析。 在金銀把合金線材鑄造完成後,進行線徑拉伸,使原 本為4 mm的線徑經過第一粗伸線機拉伸至3mm,經過第二 粗伸線機拉伸至1.0 mm,經過第一細伸線機拉伸至0.18 mm,再將0.18 mm的金銀纪合金線材依序經過第二細伸線 機、極細伸線機,以及超極細伸線機,將金銀鈀合金線材 拉伸為一預定線徑為0.050mm至0.010mm範圍的特定金銀 鈀合金銲線。 最後,對經過拉伸完成的金銀鈀合金銲線表面進行清 洗,並對金銀鈀合金銲線進行烘乾及熱退火處理。 6 201028227 <實施例2> 將包含金成份及銀成分的主要金屬原料置入於真空熔 爐,並在真空熔爐中加入鈀之次要金屬原料然後,由真空 溶爐混合溶煉煉製出金銀合金融炼液體。金銀Ig合金融 熔液體之組成成分包含:重量百分比為8.00%的金、重量 百分比為86.00%的銀,以及重量百分比為6.00%的鈀。 將該金銀把合金融溶液體經由連續鑄造再引拔拉伸出 φ 線徑為6 mm的金銀鈀合金線材。通過捲收機捲取金銀鈀合 金線材,並進行金銀合金線材的成份分析。 在金銀Ιε合金線材鑄造完成後,進行線徑拉伸,使原 本為6 mm的線徑經過第一粗伸線機拉伸至3mm,經過第二 粗伸線機拉伸至1.0 mm,經過第一細伸線機拉伸至0.18 mm,再將0.18 mm的金銀把合金線材依序經過第二細伸線 機、極細伸線機,以及超極細伸線機,將金銀Ig合金線材 拉伸為一預定線徑為0.050 mm至0.010 mm範圍的特定金銀 ®鈀合金銲線。 最後,對經過拉伸完成的金銀鈀合金銲線表面進行清 洗,並對金銀鈀合金銲線進行烘乾及熱退火處理。 <實施例3> 將包含金成份及銀成分的主要金屬原料置入於真空熔 爐,並在真空熔爐中加入鈀之次要金屬原料然後,由真空 熔爐混合熔煉煉製出金銀鈀合金融熔液體。金銀鈀合金融 熔液體之組成成分包含:重量百分比為9.99%的金、重量 百分比為90.00%的銀,以及重量百分比為0.01%的鈀。 7 201028227 將該金銀鈀合金融熔液體經由連續鑄造再引拔拉伸出 線徑為8mm的金銀鈀合金線材。通過捲收機捲取金銀鈀合 金線材,並進行金銀Ie合金線材的成份分析。 在金銀把合金線材鑄造完成後,進行線徑拉伸,使原 本為8 mm的線徑經過第一粗伸線機拉伸至2mm,經過第二 粗伸線機拉伸至1 ·0 mm,經過第一細伸線機拉伸至0.18 mm,再將0.18 mm的金銀纪合金線材依序經過第二細伸線 秦機、極細伸線機,以及超極細伸線機,將金銀把合金線材 拉伸為一預定線徑為0.050mm至0.010mm範圍的特定金銀 I巴合金鲜線。 最後,對經過拉伸完成的金銀鈀合金銲線表面進行清 洗,並對金銀鈀合金銲線進行烘乾及熱退火處理。 綜上所述,本發明藉由上述金屬元素調配製成之複合 金線,能達到純金製成的金屬銲線的功效,且可大幅降低 成本,確實達成本發明之功效。 ® 上述僅為本發明之較佳實施例而已,並非用來限定本 發明實施之範圍。即凡依本發明申請專利範圍所做的均等 變化與修飾,皆為本發明專利範圍所涵蓋。 【圖式簡單說明】 第一圖係本發明之複合金線之製法的流程圖。 第二圖係第一圖之細部流程圖。 【主要元件符號說明】 步驟100〜108 步驟102a〜102f 8 201028227 步驟104a〜104fTherefore, the object of the present invention is that the AA is made of gold, silver and three kinds of metal elements, which can be used for the metal welding wire of the pure gold material, 201028227, and A composite gold line that reduces costs. In order to achieve the above object, the present invention provides a method for preparing a composite gold wire, comprising: providing a main metal raw material comprising a gold component and a silver component; placing the main metal raw material in a vacuum melting furnace, and adding different in the vacuum melting furnace The proportion of pure palladium metal is prepared by mixing the secondary metal materials, and then performing mixed smelting to prepare a silver-plated financial melt liquid; then, the silver-palladium financial melt liquid is further drawn and drawn into a silver-palladium alloy wire through continuous casting; Finally, the gold-silver-palladium alloy wire is drawn into a gold-silver-palladium alloy wire of a predetermined wire diameter. In addition, the present invention further provides a composite gold wire obtained by the above method, the composition of which mainly comprises: a gold component of 8 〇〇 to 3 〇〇〇% by weight, and a silver component of 06.00 〜90.00% by weight. And the weight percentage is 0.01~6.00% of the ingredients. The composite gold wire prepared by blending gold, silver and saturated metal elements can not only achieve the effect of the metal welding wire made of pure gold, but also can greatly reduce the cost. _ [Embodiment] The technical content and detailed description of the present invention are described below with reference to the following drawings: As shown in the first and second figures, respectively, a flow chart of a method for manufacturing a composite gold wire of the present invention and a detailed process thereof Figure. As shown in the figure, in the method for producing a composite gold wire of the present invention, first, in step 100, a main metal material containing a gold component and a silver component is first provided. Next, in step 102, smelting is performed to place a main metal material containing a gold component and a silver component in a vacuum furnace (as in step 4 201028227 102a), and a secondary powder having palladium (Pd) is added to the vacuum furnace. The metal material is subjected to mixed smelting (step 102b) to refine a gold and silver liquid by a vacuum furnace (step 102c). The composition of the gold and silver financial liquid comprises: 8.00 to 30.00% by weight of gold component, 66.00 to 90.00% by weight of silver, and 0.01 to 6.00 % by weight of I bar. Then, the gold-silver-palladium financial melt liquid is further drawn and stretched by continuous casting to form a gold-silver alloy wire having a predetermined wire diameter of 4 to 8 mm (step 102d). The gold-silver-palladium alloy wire is then taken up by a retractor (step 102e), and the composition analysis of the gold-silver Ig alloy wire (step 102f) is performed to determine whether the composition ratio meets the requirements. Step 104, stretching the cast gold-silver-palladium alloy wire to reduce the wire diameter of 4~8 mm originally to 3 mm or less by a first thick wire drawing machine (step 104a), and then a second thick wire drawing machine is stretched to 1.00 mm or less (as in step 104b), and then stretched to 0.18 mm or less by a first® fine wire drawing machine (as in step 104c), and then The gold-silver alloy wire of 〇18mm or less is passed through a second thin wire drawing machine (step 104d), a very fine wire drawing machine (step 104e), and a super-fine wire drawing machine (step 104f). The gold-silver-palladium alloy wire is stretched into a specific gold-silver alloy wire with a predetermined wire diameter ranging from 0.050 mm (2.00 mil) to 0.010 mm (0.40 mil). In step 106, surface cleaning is performed to clean the surface of the gold-silver-palladium alloy wire. In step 108, the stretched gold, silver and palladium alloy wire is dried and thermally annealed in 201028227, so that the gold and silver meet the predetermined physical properties such as the breaking load and the elongation strain of the alloy wire. range. The composite gold wire of the present invention described above can be applied to 1C, LED and SAW packages for use as wires. The present invention will be described in more detail below by way of several examples: <Example 1> A main metal raw material containing a gold component and a silver component is placed in a vacuum melting furnace, and a secondary metal raw material of palladium is added to the vacuum melting furnace. Then, a gold-silver-palladium financial melt liquid is prepared by mixing and melting in a vacuum furnace. The composition of the gold-silver-palladium alloy melt liquid comprises: gold in an amount of 30.00% by weight, silver in a weight percentage of 66.00%, and a weight of 4.00%. The gold-silver-palladium financial melt liquid was drawn through a continuous casting to obtain a gold-silver Ie alloy wire having a wire diameter of 4 mm. The gold wire and silver wire are taken up by a reeling machine, and the composition of the alloy wire is analyzed by gold and silver. After the alloy wire is cast in gold and silver, the wire diameter is stretched, and the original wire diameter of 4 mm is stretched to 3 mm through the first thick wire drawing machine, and stretched to 1.0 mm through the second thick wire drawing machine. A thin wire drawing machine is stretched to 0.18 mm, and then the 0.18 mm gold-silver alloy wire is sequentially passed through a second thin wire drawing machine, a very fine wire drawing machine, and a super-fine wire drawing machine to stretch the gold, silver and palladium alloy wires into A specific gold-silver-palladium alloy wire having a predetermined wire diameter ranging from 0.050 mm to 0.010 mm. Finally, the surface of the gold-silver-palladium alloy wire which has been stretched is cleaned, and the gold-silver-palladium alloy wire is dried and thermally annealed. 6 201028227 <Example 2> A main metal raw material containing a gold component and a silver component is placed in a vacuum furnace, and a secondary metal raw material of palladium is added to the vacuum melting furnace, and then mixed and refined by vacuum melting furnace to produce gold and silver. Financial refining liquid. The composition of the gold-silver Ig and financial melt liquid comprises: 8% by weight of gold, 86.00% by weight of silver, and 6.00% by weight of palladium. The gold and silver blended financial solution body was continuously drawn through a continuous casting to produce a gold-silver-palladium alloy wire having a diameter of 6 mm. The gold, silver, and palladium alloy wires were taken up by a reeling machine, and the composition of the gold and silver alloy wires was analyzed. After the casting of the gold-silver Ιε alloy wire is completed, the wire diameter is stretched, and the original 6 mm wire diameter is stretched to 3 mm through the first thick wire drawing machine, and is stretched to 1.0 mm through the second thick wire drawing machine. A thin wire drawing machine is stretched to 0.18 mm, and then the 0.18 mm gold and silver alloy wire is sequentially passed through a second thin wire drawing machine, a very fine wire drawing machine, and a superfine wire drawing machine to stretch the gold and silver Ig alloy wire into A specific gold-silver® palladium alloy wire with a predetermined wire diameter in the range of 0.050 mm to 0.010 mm. Finally, the surface of the gold-silver-palladium alloy wire which has been stretched is cleaned, and the gold-silver-palladium alloy wire is dried and thermally annealed. <Example 3> A main metal raw material containing a gold component and a silver component is placed in a vacuum melting furnace, and a secondary metal raw material of palladium is added to the vacuum melting furnace, and then molten and refined by a vacuum melting furnace to produce a gold-silver-palladium financial melt liquid. The composition of the gold-silver-palladium financial melt liquid comprises: 9.99% by weight of gold, 90.00% by weight of silver, and 0.01% by weight of palladium. 7 201028227 The gold-silver-palladium financial melt liquid was drawn through a continuous casting to obtain a gold-silver-palladium alloy wire having a wire diameter of 8 mm. The gold, silver, and palladium alloy wires were taken up by a reeling machine, and the composition of the gold and silver Ie alloy wires was analyzed. After the alloy wire is cast in gold and silver, the wire diameter is stretched, and the original wire diameter of 8 mm is stretched to 2 mm through the first thick wire drawing machine, and stretched to 1 · 0 mm by the second thick wire drawing machine. After being stretched to 0.18 mm by the first thin wire drawing machine, the 0.18 mm gold-silver alloy wire is sequentially passed through the second fine wire drawing machine, the ultra-fine wire drawing machine, and the ultra-fine wire drawing machine, and the gold and silver alloy wire Stretching into a specific gold and silver I bar alloy fresh wire with a predetermined wire diameter ranging from 0.050 mm to 0.010 mm. Finally, the surface of the gold-silver-palladium alloy wire which has been stretched is cleaned, and the gold-silver-palladium alloy wire is dried and thermally annealed. In summary, the composite gold wire prepared by the above metal element can achieve the effect of the metal wire made of pure gold, and can greatly reduce the cost and achieve the effect of the present invention. The above is only the preferred embodiment of the invention and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of the method for producing a composite gold wire of the present invention. The second figure is a detailed flow chart of the first figure. [Description of main component symbols] Steps 100 to 108 Steps 102a to 102f 8 201028227 Steps 104a to 104f

Claims (1)

201028227 七、申請專利範圍: 1. 一種複合金線的製法,包含: ⑻提供一包含金成份及銀成份之主要金屬原料; (b) 將該主要金屬原料置於一真空熔爐,並在該真空嫁 爐中加入鈀成份之次要金屬元素進行混合熔煉,以製成一 金銀鈀合金融熔液體; (c) 將該金銀鈀合金融熔液體經由連續鑄造再引拔拉伸 @ 形成一金銀鈀合金線材;及 ⑹將該金銀鈀合金線材拉伸為一預定線徑的金銀把合 金鮮線。 2. 如申請專利範圍第1項所述之複合金線的製法,其 中,步驟a的金成分之重量百分比為8 00〜30 00 %。 3. 如申請專利範圍第2項所述之複合金線的製法,其 中’步驟a的銀成分之重量百分比為66.00〜90.00 %。 ❺ 4.如申請專利範圍第3項所述之複合金線的製法,其 中’步驟b的鈀成份之重量百分比為〇〇1〜6〇〇 %。 5·如申請專利範圍第1項所述之複合金線的製法,其 中’步驟b中的金銀鈀合金融熔液體經由連續鑄造再引拔 拉伸形成一預定線徑為4〜8 mm的金銀把合金線材,再透過 捲收機捲取該金銀鈀合金線材,並進行該金銀鈀合金線材 的成份分析。 6.如申請專利範圍第5項所述之複合金線的製法,其 中’步驟d中,將原本線徑為4〜8mm之該金銀鈀合金線 材’經過一第一粗伸線機的拉伸縮小其線徑至3mm或3mm 10 201028227 以下,再經一第二粗伸線機拉伸其線徑至1 .〇〇mm或1.00mm 以下,再經一第一細伸線機拉伸其線徑至〇. 18 mm或 0.18 mm以下,然後,再將0.18mm或0.18mm以下的該金銀 I巴合金線材依序經過一第二細伸線機、一極細伸線機,以 及一超極細伸線機將該金銀鈀合金線材拉伸為一預定線徑 為0.050mm至0.010mm範圍的金銀把合金銲線。 7. 如申請專利範圍第6項所述之複合金線的製法,其 @ 中,步驟d後更對該金銀鈀合金銲線進行表面清洗及烘乾 及熱退火處理。 8. —種複合金線,其組成成分包含: 重量百分比為8.00〜30.00%的金成份; 重量百分比為66.00〜90.00 %的銀成分;以及 重量百分比為0.01〜6.00 %的鈀成分。201028227 VII. Patent application scope: 1. A method for preparing a composite gold wire, comprising: (8) providing a main metal material containing a gold component and a silver component; (b) placing the main metal material in a vacuum furnace and at the vacuum The secondary metal element of the palladium component is mixed and smelted to form a gold-silver-palladium financial melt liquid; (c) the gold-silver-palladium financial melt liquid is drawn and stretched by continuous casting to form a gold, silver and palladium. The alloy wire; and (6) the gold-silver-palladium alloy wire is stretched into a predetermined wire diameter of gold and silver to make the alloy fresh wire. 2. The method of preparing a composite gold wire according to claim 1, wherein the weight percentage of the gold component of step a is from 00 to 300%. 3. The method of preparing a composite gold wire according to claim 2, wherein the weight percentage of the silver component in the step a is 66.00 to 90.00%. ❺ 4. The method for producing a composite gold wire according to claim 3, wherein the weight percentage of the palladium component in the step b is 〇〇1 to 6〇〇%. 5. The method for preparing a composite gold wire according to claim 1, wherein the gold-silver-palladium financial melt liquid in step b is drawn and drawn by continuous casting to form a gold and silver having a predetermined wire diameter of 4 to 8 mm. The alloy wire and the coiler are taken up by the reeling machine, and the composition of the gold, silver and palladium alloy wire is analyzed. 6. The method for preparing a composite gold wire according to claim 5, wherein in the step d, the gold-silver-palladium alloy wire having an original wire diameter of 4 to 8 mm is stretched by a first thick wire drawing machine. Reduce the wire diameter to 3mm or 3mm 10 201028227 or less, and then stretch the wire diameter to 1. 〇〇mm or 1.00mm through a second thick wire drawing machine, and then stretch the wire through a first thin wire drawing machine. The diameter is up to 18 mm or less, and then the gold-silver I-bar alloy wire of 0.18 mm or less is passed through a second fine wire drawing machine, a very fine wire drawing machine, and a super-fine wire drawing. The wire machine stretches the gold-silver-palladium alloy wire into a gold-silver alloy wire with a predetermined wire diameter ranging from 0.050 mm to 0.010 mm. 7. For the method of preparing the composite gold wire according to item 6 of the patent application, in step @, the gold-silver-palladium alloy wire is surface-cleaned, dried and thermally annealed. 8. A composite gold wire comprising: a gold component having a weight percentage of 8.00 to 30.00%; a silver component having a weight percentage of 66.00 to 90.00%; and a palladium component having a weight percentage of 0.01 to 6.00%.
TW98102770A 2009-01-23 2009-01-23 Method for manufacturing composite metal wire and product thereof TW201028227A (en)

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