201028075 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱結構，尤指一種設於—薄型化 電子裝置内之電路板與電子元件之間，以協助排散該電子 元件所產生之熱量的散熱結構。 【先前技術】 隨著電子產業的蓬勃發展，各式電子裝置除了功能愈 趨多樣化與複雜化之外，外型亦皆朝輕、薄、短、小之二 e 向發展，而為了達到使電子裝置體積縮小的目的，除了其 内部所使用的電子元件與電路板須朝薄型化、小型化來設 計之外，電子元件與電路板間以較為緊湊的方式配置也是 可以運用的方式之一。 參見第六圖所示之現有技術的電子裝置（60)，以一提 供筆記型電腦所須電源的電源供應器為例，其主要係於一 電路板（61)上設有若干電子元件（62)，該電子元件（62)係如 圖中所示之電晶體，其底部垂直突伸有複數根接腳（621)， ® 並於一背側面上形成有一片狀的導熱部（622);在組裝的過 程中，該電子元件（62)係以直立方式設置於電路板（61)上， 再透過該導熱部（622)朝周圍較為寬廣的空間進行散熱；在 此種形式的設計之下，電子元件（62)相對電路板（61)的高 度便大致形成了該電子裝置（60)的厚度； 因此若要進一步減少該電子裝置（6〇)的厚度，則可將 電子το件（62)之接腳（621)垂直彎折之後，讓該電子元件（62) 以平躺方式設置於電路板（61)上，俾使該電子元件（62)貼 近電路板（6彳），減少其組合後之厚度，進而達到薄型化設 201028075 計的要求。 惟在電子兀件（62)以直立方式設置於電路板（61)上 時，該電子裝置（60)的内部空間較為寬敞，故電子元件（62) 在運作過程所產生的熱量可直接透過其導熱部（622)朝周圍 排散，不會造成電子元件（62)因過熱而損壞的情況發生； 但當將電子元件（62)緊貼電路板（61)設置時，其產生 的熱量將會因散熱空間受到限制，而造成大量的熱源堆積 於其與電路板（62)之間，於是在熱量無法有效排散的情況 ❹下，將會造成該電子元件（62)甚至整組電子裝置（6〇)因過 熱而損壞的情況發生，故現有技術之電子裝置（6〇)在薄型 化設計的過程中，其内部散熱結構的設計實為一重要課 題。 【發明内容】 本發明之主要目的在於提供一種設於薄型化電子裝置 内部的一種散熱結構，希藉此設計改善現有技術之薄型化 電子裝置中容易產生散熱不良的缺點。 ❹ ^為了達到上述的發明目的，本發明所利用的技術手段 係設計一散熱結構，將該散熱結構設置於電子裝置之電路 板上’且與該電子元件之一導熱部相結合，該散熱結構包 括有： 一底片’其平放於電路板與電子零件之間 至少一側片，其由底片之側邊彎折成型。 貼近設置 體可與發 使得電子 本發明的優點在於，當電子元件以平躺方式 於電路板上時，由於所設計的散熱結構，其各片 出南熱的電子元件緊密貼合接觸並進一步導熱， 4 .201028075 元件於其運作過程所產生的熱量可經由此散熱結構上之各 片體逐步排散，避免堆積於電子元件與電路板之間，有效 防止薄型化後之電子裝置因散熱不易而導致過熱損壞的情 況發生。 【實施方式】 參見第一及二圖所示’為本發明之散熱結構設於一 薄型化電子裝置（5〇)(以一提供筆記型電腦所須電源的電源 供應器為例）内部，該電子裝置（5〇)内另設有一電路板（51) _ 與複數個電子元件（52) ’該電子元件（52)可如圖中所示之 金氧半導體（MetaUOxide Semiconductor，MOS)電晶體或 其他形式的電晶體，其底部突伸有若干接腳（521)，並於一 背側面上形成有一導熱部（522)，該接腳（521)彎折呈L型， 藉此使該電子元件（52)可以以平躺方式設置於該電路板（5 ” 上’此時，其導熱部（522)係對應並貼近該電路板（51)，而 本發明之散熱結構（1)即設於該電路板（51)與電子元件（52) 之導熱部（522)間，其包含有一底片（1〇)以及至少一側片 φ (2〇A)(20B)，其中： 配合參見第二圖所示，底片（1〇)平放於電路板（51)與 電子零件（52)之間，使電子零件（52)的導熱部（522)緊貼在 底片（10)平面上，以吸收該電子零件（52)在運作過程中所 產生之熱量； 側片（20A)(20B)由底片（10)之侧邊彎折成型，讓底片 (1 〇)所吸收之熱量可傳導至該側片（2QA)(2QBm再向周圍 排散，以避免因熱量堆積於該電路板（51)與電子元件（52) 之間而導致過熱損壞的情況發生。 5 .201028075 於本發明之較佳實施例中，該底片（1 〇)係包含有一承 …置部（11)及一延伸部（12) ’該承置部（11)可供設置該電子元 件（52)，並與電子元件（52)之導熱部（522)相互貼靠結合， 以吸收該電子零件（52)所產生之熱量’該延伸部（12)由承 置部（11)之其中兩側邊的交界處朝旁側延伸，以使該承置 部（11)所吸收的熱量可傳導至該延伸部（12)上； 此外’該散熱結構（1)係具有二側片（2〇A)(20B)，其中 一側片（20A)由底片（1〇)之承置部〇 ])的側邊處彎折成型， ❹ 並可與電路板（51)之側邊交錯設置，另一侧片（2〇B)由底片 (10)之延伸部（12)的侧邊處彎折成型，並可沿該電路板（51) 之側邊緣置’前述底片（1 〇)所吸收的熱量可分別傳導至該 侧片（20A)(20B)上，再由該側片（2〇a)(20B)向周圍排散， 此外’該二側片（2〇A)(20B)還可交錯相接，以互相協助排 散該熱量。 參見第四圖所示，為本發明之另一實施例，該散熱結 構（1A)具有一底片（10A)，以及一由底片（1〇A)之側邊處彎 ❹ 折成型的側片（20A’）’前述電子零件（52)的導熱部（522)緊 貼在底片（10A)平面上，藉此，該電子零件（52)在運作過程 中所產生之熱量即可由該底片（1〇A)傳導至側片（2〇Α·)上， 再由側片（20A1)向周圍排散； 參見第五圖所示，為本發明之再一實施例，該散熱結 構（1B)具有一底片（10B)，該底片（i〇b)具有一承置部（11B) 以及一朝該承置部（11 B)旁側延伸成型的延伸部（1 2B)，另 外再於該延伸部（12B)的側邊處彎折成型有一側片（2〇B，）， 前述電子零件（52)的導熱部（522)緊貼在底片（10B)之承置 201028075 部(11B)上，藉此，該電子零件(52)在運作過程中所產生之 熱量即可依序由底片（10B)之承置部（HB)與延伸部（ί2Β)傳 導至側片（20Β·)上，再由側片（2〇Β·)向周圍排散。 藉由上述〇又计，备電子零件（52)以平躺方式貼近設置 於該電路板（51)上，使該電子裝置（5〇)可達到薄型化設計 之要求時，肖電子零件（52)於運作過程所產生的熱量可透 過其導熱部（522)再經由本發明之散熱結構⑴，Β)逐步 排散，避免熱量堆積於電子零件（52)與電路板（51)之間， ❹以有效防止薄型化後之電子裝置(5〇)因散熱不易而導致過 熱損壞的情況發生。 以上所述僅是本發明的較佳實施例而已，並非對本發 明作任何形式上的限制，雖然本發明已以較佳實施例揭露 如t，然而並非用以限定本發明，任何熟悉本專業的技術 人貝，在不脫離本發明技術方案的範圍内，當可利用上述 揭不的技術内容作出些許更動或修飾為等同變化的等效實 施例，但凡是未脫離本發明技術方案的内容，依據本發明 〇 的技術實質對以上實施例所作的任何簡單修改、等同變化 與修飾，均仍屬於本發明技術方案的範圍内、 【圖式簡單說明】 第一圖為本發明之實施狀態示意圖。 第二圖為本發明設於一電路板與一電子元件 外觀圖。 第三圖為本發明設於電路板與電子元件間之立體分解 圖。 第四圖為本發明以另一實施狀態設於電路板與電子元 201028075 件間之立體分解圖。 第五圖為本發明再一實施狀態設於電路板與電子元件 間之立體分解圖。 第六圖為現有技術之立體外觀圖。 【主要元件符號說明】 (1)(1A)(1B)散熱結構（10)(10A)(10B)底片 (1 1)(1 1B)承置部 （12)(12B)延伸部 (20Α)(20Α，）（20Β)(20Β')4則片 (50)電子裝置 (52)電子零件 (522)導熱部 (61)電路板 (621)接腳 (51)電路板 (521)接腳 (60)電子裝置 (62)電子零件 (622)導熱部201028075 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating structure, and more particularly to a circuit board disposed between a thinned electronic device and an electronic component to assist in dissipating the electronic component. The heat dissipation structure of the heat. [Prior Art] With the rapid development of the electronics industry, in addition to the increasingly diversified and complicated functions of various electronic devices, the appearances are also moving towards light, thin, short, and small e-directions, in order to achieve For the purpose of reducing the size of the electronic device, the electronic component and the circuit board to be thinned and miniaturized are designed, and the electronic component and the circuit board are disposed in a relatively compact manner. Referring to the prior art electronic device (60) shown in FIG. 6, a power supply device for supplying power to a notebook computer is taken as an example, and the main circuit board (61) is provided with a plurality of electronic components (62). The electronic component (62) is a transistor as shown in the figure, a plurality of pins (621) are vertically protruded from the bottom thereof, and a sheet-shaped heat conducting portion (622) is formed on a back side; During the assembly process, the electronic component (62) is disposed on the circuit board (61) in an upright manner, and then radiates heat to the wider space through the heat conducting portion (622); under the design of this form The height of the electronic component (62) relative to the circuit board (61) substantially forms the thickness of the electronic device (60); therefore, if the thickness of the electronic device (6〇) is further reduced, the electronic component (62) can be used. After the pin (621) is bent vertically, the electronic component (62) is placed on the circuit board (61) in a lying manner, so that the electronic component (62) is close to the circuit board (6彳), reducing its The combined thickness, in order to achieve the requirements of thinning 201028075However, when the electronic component (62) is disposed on the circuit board (61) in an upright manner, the internal space of the electronic device (60) is relatively large, so that the heat generated by the electronic component (62) during operation can directly pass through the electronic component (62). The heat conducting portion (622) is discharged toward the periphery, and the electronic component (62) is not damaged by overheating; however, when the electronic component (62) is placed close to the circuit board (61), the heat generated by the electronic component (62) will be generated. Due to the limitation of the heat dissipation space, a large amount of heat is accumulated between the board and the circuit board (62), so that the electronic component (62) or even the entire set of electronic devices will be caused when the heat cannot be effectively dissipated ( 6〇) The damage caused by overheating occurs, so the design of the internal heat dissipation structure of the prior art electronic device (6〇) is an important issue in the process of thin design. SUMMARY OF THE INVENTION A main object of the present invention is to provide a heat dissipating structure provided inside a thinned electronic device, which is designed to improve the shortcomings of heat dissipation in the thin electronic device of the prior art. In order to achieve the above object, the technical means utilized by the present invention is to design a heat dissipating structure which is disposed on a circuit board of an electronic device and is combined with a heat conducting portion of the electronic component. The invention comprises: a negative film 'lying at least one side sheet between the circuit board and the electronic component, which is bent from the side of the negative film. The advantage of the present invention is that when the electronic component is laid on the circuit board in a flat manner, due to the designed heat dissipation structure, the electronic components of the south heat are closely contacted and further thermally conductive. 4,201028075 The heat generated by the components in the operation process can be gradually dissipated through the respective sheets on the heat dissipation structure to avoid accumulation between the electronic components and the circuit board, thereby effectively preventing the thinned electronic device from being difficult to dissipate heat. A condition that causes overheating damage. [Embodiment] Referring to the first and second figures, the heat dissipation structure of the present invention is provided in a thin electronic device (5 〇) (for example, a power supply for supplying a power supply for a notebook computer), The electronic device (5〇) is further provided with a circuit board (51) _ and a plurality of electronic components (52) 'The electronic component (52) can be a MetaUOxide Semiconductor (MOS) transistor as shown in the figure or Other forms of the transistor have a plurality of pins (521) protruding from the bottom thereof, and a heat conducting portion (522) is formed on a back side, and the pin (521) is bent into an L shape, thereby making the electronic component (52) can be disposed on the circuit board (5" in a lying manner. At this time, the heat conducting portion (522) corresponds to and close to the circuit board (51), and the heat dissipating structure (1) of the present invention is The circuit board (51) and the heat conducting portion (522) of the electronic component (52) comprise a negative film (1〇) and at least one side piece φ (2〇A) (20B), wherein: As shown, the backsheet (1〇) is placed between the circuit board (51) and the electronic component (52) to make the electronic component (52) The heat conducting portion (522) is in close contact with the plane of the backsheet (10) to absorb the heat generated by the electronic component (52) during operation; the side panel (20A) (20B) is bent from the side of the backsheet (10) Folding, allowing the heat absorbed by the film (1 〇) to be conducted to the side piece (2QA) (2QBm is then dispersed to the periphery to avoid heat accumulation between the board (51) and the electronic component (52) In the preferred embodiment of the present invention, the backsheet (1) includes a receiving portion (11) and an extending portion (12) 'the receiving portion ( 11) The electronic component (52) can be disposed and bonded to the heat conducting portion (522) of the electronic component (52) to absorb the heat generated by the electronic component (52). The extension (12) is The junction of the two sides of the receiving portion (11) extends toward the side so that the heat absorbed by the receiving portion (11) can be conducted to the extending portion (12); ) has two side panels (2〇A) (20B), wherein one side panel (20A) is bent and formed at the side of the receiving portion of the backsheet (1〇), ❹ And can be staggered with the side of the circuit board (51), and the other side piece (2〇B) is bent and formed by the side of the extension (12) of the negative film (10), and can be along the circuit board (51) The heat absorbed by the side film (1 〇) of the side edge can be respectively transmitted to the side piece (20A) (20B), and then discharged to the periphery by the side piece (2〇a) (20B), The two side panels (2〇A) (20B) may also be staggered to assist each other in dissipating the heat. Referring to the fourth figure, in another embodiment of the invention, the heat dissipation structure (1A) has a backsheet (10A), and a side panel (20A') formed by bending the side edges of the backsheet (1A). The heat conducting portion (522) of the electronic component (52) is in close contact with the backsheet (10A). In the plane, the heat generated by the electronic component (52) during operation can be conducted from the negative film (1〇A) to the side panel (2〇Α·), and then the side panel (20A1) to the periphery. Discharged; Referring to FIG. 5, in another embodiment of the present invention, the heat dissipation structure (1B) has a negative film (10B) having a receiving portion (11B) and a facing The bearing department 11 B) extending the formed extension portion (1 2B), and further bending a side piece (2〇B,) at the side of the extending portion (12B), the heat conducting portion of the electronic component (52) (522) is closely attached to the substrate (10B) of the negative film (10B), whereby the heat generated by the electronic component (52) during operation can be sequentially received from the bearing portion of the negative film (10B). (HB) and the extension (ί2Β) are conducted to the side panel (20Β·), and then are dispersed to the surroundings by the side panel (2〇Β·). By the above, the electronic component (52) is placed close to the circuit board (51) in a lying manner, so that the electronic device (5〇) can meet the requirements of the thin design, the Xiao electronic part (52) The heat generated during the operation can be gradually dissipated through the heat conducting portion (522) through the heat dissipating structure (1), Β) of the present invention to prevent heat from accumulating between the electronic component (52) and the circuit board (51). In order to effectively prevent the thinned electronic device (5〇) from being damaged due to heat dissipation, it may occur. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. In the scope of the technical solutions of the present invention, the equivalent embodiments may be modified or modified to be equivalently modified, but the content is not deviated from the technical solution of the present invention. The present invention is not limited to any simple modifications, equivalent changes and modifications of the above embodiments. The first embodiment is a schematic view of the implementation state of the present invention. The second figure is an external view of a circuit board and an electronic component according to the present invention. The third figure is an exploded perspective view of the present invention disposed between a circuit board and an electronic component. The fourth figure is an exploded perspective view of the present invention in another embodiment between a circuit board and an electronic component 201028075. Fig. 5 is an exploded perspective view showing a circuit board and an electronic component according to still another embodiment of the present invention. The sixth figure is a perspective view of the prior art. [Description of main component symbols] (1) (1A) (1B) Heat dissipation structure (10) (10A) (10B) Negative film (1 1) (1 1B) Extension part (12) (12B) extension (20 Α) ( 20Α,)(20Β)(20Β')4 piece (50)electronic device (52) electronic part (522) heat transfer part (61) circuit board (621) pin (51) circuit board (521) pin (60 ) electronic device (62) electronic parts (622) heat transfer part