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TW201027835A - Antenna, method for making the antenna, and housing integrating the antenna - Google Patents

Antenna, method for making the antenna, and housing integrating the antenna Download PDF

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Publication number
TW201027835A
TW201027835A TW98100716A TW98100716A TW201027835A TW 201027835 A TW201027835 A TW 201027835A TW 98100716 A TW98100716 A TW 98100716A TW 98100716 A TW98100716 A TW 98100716A TW 201027835 A TW201027835 A TW 201027835A
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TW
Taiwan
Prior art keywords
antenna
layer
antenna element
layers
dielectric layer
Prior art date
Application number
TW98100716A
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Chinese (zh)
Inventor
Zhan Li
Original Assignee
Fih Hong Kong Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fih Hong Kong Ltd filed Critical Fih Hong Kong Ltd
Priority to TW98100716A priority Critical patent/TW201027835A/en
Publication of TW201027835A publication Critical patent/TW201027835A/en

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Abstract

An antenna unit includes a carrying layer, a substrate, a dielectric layer, and at least two antenna layers. The dielectric layer and the at least two antenna layers are alternately folded on the carrying layer. A method for making the antenna and a housing integrating the antenna are also disclosed.

Description

201027835 * 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種天線元件。 【先前技術】 無線通信終端的天線主要有内置天線及外 置天線兩種。相較於外置天線,内置天線能夠 有效地減小無線通信終端的尺寸,因而,目前 無線通"is終知通常採用内置天線的設計。請參 照圖1 ’習知之採用内置天線設計的無線通信終 Φ 端包括一外殼層91,一天線層92’ 一内殼層93、 〆導電端子94、電路板(圖未示)及由連接於 戶斤述電路板的一彈性導柱9 5。外殼層91通常為 〆装飾性塑膠薄膜,用於承載天線層92。天線 廣92成型於或貼附於外殼層91上,且夾設於 外毅層91與内殼層93之間。導電端子94 一端 與夭線層92導電接觸,其另〆端穿過内殼層93 彳^與彈性導柱95導電接觸,如此,實現天線層 92與所述電路板的電路結構的無線電信號交 流。但是,天線的設計越來越需要考慮天線多 Φ =能的實現,而習知的天線元件一般為單天線 廣,因此就需要設計複數天線元件以實現多功 於,如此,會使得天線元件佔用無線通信終端 ^更多的空間,不利於無線通信終端小裂化的 多現 實可 種 -供提。要件必元 有線 ,天 容的 内間 1上空 容以省 内於節 明鑒且 發 能 ί 功 3 201027835 另,有必要提供一種製作所述天線元 方法。 另,有必要提供一種集成有所述天線 的殼體。 一種天線元件,該天線元件包括:一 層、至少一介電層及至少兩天線層,該至 介電層及該至少兩天線層交互層疊於該承 上,該承載層為一樹脂薄膜。 一種製作具有多層結構的天線元件 法,其包括以下步驟: ® 提供一樹脂薄膜; 在該樹脂薄膜上交互地層疊至少兩天 和至少一介電層,該至少兩天線層是使用 油墨印刷而成。 一種殼體,其包括一注塑層及一天 件,該天j線元件包括:一承載層、至少一 層及至少兩天線層,該至少一介電層及該 兩天線層交互層疊於所述承載層上,該承 為一樹脂薄膜,該注塑層注塑結合於該天 φ 件上。 相較習知技術,本發明所述天線元件 多層天線,可實現天線的多功能,節省了 設計的空間。 【實施方式】 請參閱圖2,本發明較佳實施方式的天 件20包括一承載層21、若干天線層22及 介電層23。 承載層21可以為模内裝飾工藝中的模 飾膜,其為聚碳酸酯樹脂薄膜、丙烯腈-丁 - 件的 元件 承載 —-— 載層 的方 線層 導電 線元 介電 至少 載層 線元 具有 天線 線元 若干 内裝 二烯- 4 201027835 苯乙烯共聚物樹脂薄膜及聚對苯二甲酸乙 酉旨樹脂薄膜中之一種。 每一天線層22為藉由印刷的方式形成 電油墨層,其具有天線的輻射圖案。該等 層22可以分別是天線元件中之主天線輻射 輔天線輕射體。 每一介電層23為不導電的油墨層,其 印刷的方式形成於該等天線層22之間。天 22與介電層23交互層疊,天線層22即以 層23相間隔。各天線層22之間可形成有 ® 導通部24。電導通部24可以由導電油墨开j 電連接相鄰的兩天線層22。 製作時,將導電油墨以一天線輻射圖 刷於承載層21上,從而形成一天線層22。 將不導電之油墨印刷於天線層22上而 一介電層 23 ;其中,印刷不導電的油墨形 電層23時,可設計介電層23的印刷圖案 在介電層23形成後天線層22需要導電接 部位暴露。 φ 在介電層23上印刷導電油墨以形成另 線層 22,且所述導電油墨同時亦形成於先 天線層22需要導電接觸的部位上,此時, 於所述導電接觸的部位的導電油墨即為電 部 24,藉由電導通部 24即可實現相鄰天 22間的電導通。 如此,反復交互層疊地形成天線層22 電層23,即可以獲得天線元件20的多層天 構。各天線層22可分別用於實現不同的功 節省了天線設計的空間。 二醇 的導 天線 體及 措由 線層 介電 一電 成, 案印 形成 成介 以使 觸的 一天 前的 形成 導通 線層 及介 線結 能, 5 201027835 可以理解地,介電層23也可以是由喷塗工 藝形成的不導電的樹脂漆層。 可以理解地,該等天線層22也可以省略電 導通部 24,各天線層 22之間可以不直接電導 通,每一天線層22可以分別藉由電纜(如銅絲) 與一電路板連接,從而實現無線電信號的傳導。 本發明較佳實施方式的天線元件20可直接 集成於無線通訊裝置的殼體上。 請參閱圖3,本發明較佳實施方式的無線通 訊裝置的殼體100包括一注塑層30及所述的天 ® 線元件20。注塑層30可以是一樹脂層,如矽膠 樹脂或熱塑性樹脂,其藉由注塑成型的方式與 天線元件20結合。 在藉由注塑成型的方式製作殼體100時, 天線元件20置於一注塑成型模具(圖未示)中, 其具有承載層 21的一面與注塑成型模具相貼 附。注塑成型時,所述注塑層3 〇則成型於天線 元件20上相對於承載層21的一面。 當天線元件20中與承載層21相對的一面 φ 的最外層為天線層22時,注塑層30與天線層 22結合。 當所述天線元件20包括至少兩介電層 23 時,天線元件20中與承載層21相對的一面的 最外層可為介電層23,所述注塑層30也可以注 塑結合於介電層23上。此時,注塑層30在注 塑成型中不會對天線層22直接衝擊,因此不易 破壞天線層22的圖案,同時,可防止天線層22 在注塑成型中被氧化。 6 201027835 本發明較佳實施方式的殼體 100集成了多 層結構的天線元件20,有利於降低無線電裝置 的尺寸。 【圖式簡單說明】 圖1係習知的無線通信終端的剖面示意圖。 圖 2係本發明較佳實施方式所述的天線元件的 剖面示意圖。 圖 3係本發明較佳實施方式所述的殼體的剖面 示意圖。 參 【主要元件符號說明】 (習知) 外殼層 91 導電端子 94 天線層 92 導柱 95 内殼層 93 〇 (本發明) 殼體 100 介電層 23 天線元件 20 電導通部 24 承載層 21 注塑層 30 天線層 22 7201027835 * VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an antenna element. [Prior Art] The antenna of the wireless communication terminal mainly has two types of built-in antennas and external antennas. Compared with the external antenna, the built-in antenna can effectively reduce the size of the wireless communication terminal. Therefore, the current wireless communication system generally adopts the design of the built-in antenna. Please refer to FIG. 1 'The wireless communication terminal Φ end adopting the built-in antenna design includes a shell layer 91, an antenna layer 92', an inner shell layer 93, a tantalum conductive terminal 94, a circuit board (not shown) and connected thereto. A flexible guide column 9 5 of the circuit board is described. The outer skin layer 91 is typically a enamel decorative plastic film for carrying the antenna layer 92. The antenna 92 is formed or attached to the outer casing layer 91 and interposed between the outer layer 91 and the inner casing layer 93. One end of the conductive terminal 94 is in conductive contact with the squall layer 92, and the other end of the conductive terminal 94 is in conductive contact with the elastic pillar 95 through the inner shell layer 93, thus realizing radio signal communication between the antenna layer 92 and the circuit structure of the circuit board. . However, the design of the antenna needs to consider the implementation of multiple Φ = energy of the antenna. However, the conventional antenna element is generally a single antenna, so it is necessary to design a plurality of antenna elements to achieve multi-function, so that the antenna element is occupied. The wireless communication terminal has more space, which is not conducive to the multi-reality of the wireless communication terminal to be cracked. The essentials must be wired, and the inner space of the space can be used to save energy in the province. 2010 20103535 In addition, it is necessary to provide a method for fabricating the antenna element. In addition, it is necessary to provide a housing in which the antenna is integrated. An antenna element comprising: a layer, at least one dielectric layer and at least two antenna layers, wherein the dielectric layer and the at least two antenna layers are alternately laminated on the support, the carrier layer being a resin film. An antenna element method having a multilayer structure, comprising the steps of: providing a resin film; alternately laminating at least two days and at least one dielectric layer on the resin film, the at least two antenna layers being printed using ink . A housing comprising an injection molded layer and a day piece, the day j-line component comprising: a carrier layer, at least one layer and at least two antenna layers, the at least one dielectric layer and the two antenna layers are alternately stacked on the carrier layer Above, the bearing is a resin film, and the injection molding layer is injection molded and bonded to the φ piece. Compared with the prior art, the antenna element multi-layer antenna of the invention can realize the multi-function of the antenna and save the design space. [Embodiment] Referring to FIG. 2, a case 20 of a preferred embodiment of the present invention includes a carrier layer 21, a plurality of antenna layers 22, and a dielectric layer 23. The carrier layer 21 may be a molding film in an in-mold decoration process, which is a polycarbonate resin film, an acrylonitrile-butyl-piece component carrier---a square layer of a carrier layer, a conductive line element dielectric layer, at least a carrier layer line. The element has a plurality of antenna elements contained in the diene- 4 201027835 styrene copolymer resin film and a polyethylene terephthalate resin film. Each antenna layer 22 is formed by printing to form an electro-ink layer having a radiation pattern of the antenna. The layers 22 may be primary antenna radiation auxiliary antenna light emitters in the antenna elements, respectively. Each of the dielectric layers 23 is a non-conductive ink layer formed in a printed manner between the antenna layers 22. The day 22 is alternately laminated with the dielectric layer 23, and the antenna layer 22 is spaced by the layer 23. A conduction portion 24 may be formed between the antenna layers 22. The electrical conduction portion 24 can be electrically connected to the adjacent two antenna layers 22 by conductive ink. At the time of fabrication, the conductive ink is applied to the carrier layer 21 by an antenna radiation pattern to form an antenna layer 22. The non-conductive ink is printed on the antenna layer 22 and a dielectric layer 23; wherein, when the non-conductive ink-shaped electrical layer 23 is printed, the printed pattern of the dielectric layer 23 can be designed to form the antenna layer 22 after the dielectric layer 23 is formed. The conductive joint is required to be exposed. φ printing a conductive ink on the dielectric layer 23 to form a double layer 22, and the conductive ink is also formed on a portion where the first antenna layer 22 needs to be in conductive contact. At this time, the conductive ink at the conductive contact portion That is, the electrical portion 24 can be electrically connected to the adjacent day 22 by the electrical conduction portion 24. Thus, the antenna layer 22 is formed alternately by alternately forming the antenna layer 22, i.e., the multilayer structure of the antenna element 20 can be obtained. Each of the antenna layers 22 can be used to achieve different powers, respectively, saving space in the antenna design. The conductive antenna body of the diol and the wire layer are dielectrically formed, and the film is formed to form a conduction line layer and a dielectric junction energy one day before the touch, 5 201027835 It is understood that the dielectric layer 23 is also It may be a non-conductive resin lacquer layer formed by a spraying process. It can be understood that the antenna layer 22 can also be omitted from the electrical conduction portion 24, and the antenna layers 22 can be electrically disconnected from each other. Each antenna layer 22 can be connected to a circuit board by a cable (such as a copper wire). Thereby the conduction of radio signals is achieved. The antenna element 20 of the preferred embodiment of the present invention can be directly integrated into the housing of the wireless communication device. Referring to FIG. 3, the housing 100 of the wireless communication device of the preferred embodiment of the present invention includes an injection molded layer 30 and the antenna® wire member 20. The injection molded layer 30 may be a resin layer such as a silicone resin or a thermoplastic resin which is bonded to the antenna element 20 by injection molding. When the casing 100 is formed by injection molding, the antenna element 20 is placed in an injection molding die (not shown) having one side of the carrier layer 21 attached to the injection molding die. In the case of injection molding, the injection molded layer 3 is formed on one side of the antenna element 20 with respect to the carrier layer 21. When the outermost layer of the side φ of the antenna element 20 opposite to the carrier layer 21 is the antenna layer 22, the injection molded layer 30 is bonded to the antenna layer 22. When the antenna element 20 includes at least two dielectric layers 23, the outermost layer of the antenna element 20 opposite to the carrier layer 21 may be a dielectric layer 23, and the injection molding layer 30 may also be injection-molded to the dielectric layer 23. on. At this time, the injection molding layer 30 does not directly impinge on the antenna layer 22 in the injection molding, so that the pattern of the antenna layer 22 is not easily broken, and at the same time, the antenna layer 22 can be prevented from being oxidized in the injection molding. 6 201027835 The housing 100 of the preferred embodiment of the present invention integrates a multi-layered antenna element 20 to facilitate reducing the size of the radio. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a conventional wireless communication terminal. Fig. 2 is a schematic cross-sectional view showing an antenna element according to a preferred embodiment of the present invention. Figure 3 is a schematic cross-sectional view of a housing in accordance with a preferred embodiment of the present invention. Refer to [Main component symbol description] (conventional) Shell layer 91 Conductive terminal 94 Antenna layer 92 Guide post 95 Inner shell 93 本 (Invention) Housing 100 Dielectric layer 23 Antenna element 20 Electrical conduction portion 24 Carrier layer 21 Injection molding Layer 30 antenna layer 22 7

Claims (1)

201027835 七 1. 、申請專利範圍: 一種天線元件,其改良在於,該天線元件包 括:一承載層、至少一介電層及至少兩天線 層,該至少一介電層及該至少兩天線層交互 層疊在該承載層上,該承載層為一樹脂薄 膜。 2. 如申請專利範圍第1項所述的天線元件,其 中該至少兩天線層為使用導電油墨印刷而 成。 _ 3. 如申請專利範圍第2項所述的天線元件,其 中相鄰兩天線層之間形成有一電導通部,該 電導通部由導電油墨形成並電連接相鄰的 兩天線層。 4. 如申請專利範圍第2項所述的天線元件,其 中該至少兩天線層分別藉由電纜與一電路 板連接。 5. 如申請專利範圍第1項所述的天線元件,其 中該至少一介電層為不導電的油墨層。 6. 如申請專利範圍第1項所述的天線元件,其 7. 中該至少一介電層為不導電的樹脂漆層。 如申請專利範圍第1項所述的天線元件,其 中該承載層為聚碳酸S旨樹脂薄膜、丙烯腈-丁二烯-苯乙烯共聚物樹脂薄膜及聚對苯二 曱酸乙二醇酯樹脂薄膜中的一種。 8. 一種製作天線元件的方法,包括以下步驟: 提供一樹脂薄膜; 在該樹脂薄膜上交互地層疊至少兩天線層 和至少一介電層,所述至少兩天線層是使用 導電油墨印刷而成。 201027835 ' 9. 如申請專利範圍第8項所述的製作天線 的方法,其中該至少一介電層為不導電 墨層,其藉由印刷的方式形成。 10. 如申請專利範圍第8項所述的製作天線 的方法,其中該至少一介電層為不導電 脂漆層。 11. 如申請專利範圍第8項所述的製作夫線 的方法,其中在前一天線層上形成介 後,該前一天線層的需與後一天線層導 觸的部位暴露;形成後一天線層時,形 ® 後一天線層的導電油墨同時印刷於該 天線層的需與後一天線層導電接觸的部 12. 一種殼體,包括一注塑層和一天線元件 中該天線元件為申請專利範圍第1 -7項 一項所述的天線元件,該注塑層注塑結 該天線元件上。 13. 如申請專利範圍第12項所述的殼體, 該天線元件中與該承载層相對的一面 外層為介電層,該注塑層注塑結合於該 像 層上。 14. 如申請專利範圍第12項所述的殼體, 該天線元件中與該承載層相對的一面 外層為天線層,該注塑層注塑結合於該 層上。 件油 件樹 件層接該一。其任於 中最電 中最線 元的 元的 元電電成前位,中合 其的介 其的天 9201027835 VII. Patent application scope: An antenna component, the antenna component comprising: a carrier layer, at least one dielectric layer and at least two antenna layers, the at least one dielectric layer and the at least two antenna layers interacting Laminated on the carrier layer, the carrier layer is a resin film. 2. The antenna element of claim 1, wherein the at least two antenna layers are printed using conductive ink. 3. The antenna element according to claim 2, wherein an electrical conduction portion is formed between adjacent two antenna layers, the electrical conduction portion being formed of a conductive ink and electrically connecting adjacent two antenna layers. 4. The antenna element of claim 2, wherein the at least two antenna layers are respectively connected to a circuit board by a cable. 5. The antenna element of claim 1, wherein the at least one dielectric layer is a non-conductive ink layer. 6. The antenna element according to claim 1, wherein the at least one dielectric layer is a non-conductive resin lacquer layer. The antenna element according to claim 1, wherein the carrier layer is a polycarbonate resin film, an acrylonitrile-butadiene-styrene copolymer resin film, and a polyethylene terephthalate resin. One of the films. 8. A method of fabricating an antenna element, comprising the steps of: providing a resin film; alternately laminating at least two antenna layers and at least one dielectric layer on the resin film, the at least two antenna layers being printed using conductive ink . The method of fabricating an antenna according to claim 8, wherein the at least one dielectric layer is a non-conductive ink layer formed by printing. 10. The method of fabricating an antenna according to claim 8, wherein the at least one dielectric layer is a non-conductive paint layer. 11. The method according to claim 8, wherein after forming a medium on the previous antenna layer, the portion of the previous antenna layer that needs to be in contact with the latter antenna layer is exposed; In the case of a line layer, the conductive ink of the shape of the rear antenna layer is simultaneously printed on the portion of the antenna layer that is in conductive contact with the latter antenna layer. A housing comprising an injection molding layer and an antenna element in the antenna component is an application The antenna element according to any one of claims 1 to 7, wherein the injection molding layer is injection molded on the antenna element. 13. The casing of claim 12, wherein an outer layer of the antenna element opposite the carrier layer is a dielectric layer, the injection molding layer being injection molded bonded to the image layer. 14. The housing of claim 12, wherein an outer layer of the antenna element opposite the carrier layer is an antenna layer, the injection layer being injection molded bonded to the layer. The oil component tree is connected to the one. It is the former element of the yuan in the middle of the most electricity, and the day of its integration.
TW98100716A 2009-01-09 2009-01-09 Antenna, method for making the antenna, and housing integrating the antenna TW201027835A (en)

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