TW201027094A - Array test apparatus and method of measuring position of point on substrate thereof - Google Patents

Abstract

Disclosed are array test apparatus and method of measuring a position of a point on a substrate of the array test apparatus. The array test apparatus includes a test part to support a substrate to be tested, a test module and a position indication member. The test module is disposed on the array test apparatus to accomplish at least a horizontal movement, and is provided with at least one modulator head to detect a defective portion of the substrate disposed on the test part. The position indication member extends laterally from the test part corresponding to a transfer path of the modulator head in adjacent to the modulator head and has a reference position mark and at least one adjacent position mark. The modulator head is provided with a camera assembly including a reference camera and at least one adjacent camera. The reference position mark is photographed by the reference camera and the adjacent position mark is photographed by the adjacent camera.

Description

201027094 VI. Description of the Invention: [Technical Field] The present invention relates to an array detecting device, and more particularly to an array detecting device capable of detecting the electrical properties of an electrode formed on a substrate through use of a camera defect. The present invention also relates to a fixed point position measuring method for a substrate of an array detecting device. ❹ [Prior Art] A photovoltaic device is a device that emits light by receiving electric energy, and includes a liquid crystal display (LCD) and a plasma display panel (PDP). Such optoelectronic devices typically comprise a substrate having an electrode. For example, a thin film transistor (TFT-LCD) includes a thin film liquid crystal substrate, a color filter substrate, a liquid crystal, and a backlight unit. The color filter substrate is disposed facing the thin film liquid crystal substrate and includes a color filter and a common electrode. The liquid crystal is disposed between the thin film liquid crystal substrate and the color filter substrate. Defects of the electrodes formed on the substrate can be detected by using the array detecting device. The array column detection device includes at least one modulation unit. The modulation unit can move at least in one direction to detect the defective electrode, and the modulation unit includes a modulation component and a camera. The modulation element includes a modulation electrode and a material property variable portion. The modulating electrode can form an electric field with respect to the electrodes of the substrate, and the material properties of the variable portion of the material property vary with the electric field strength. The modulating component performs array detection on one of the preset portions of the substrate 201027094, and then moves to the next detecting portion to repeat the array detection only. The camera is disposed relative to the substrate, and the modulation component is disposed between the two, so that the camera can capture the modulation component and the substrate. Since the material properties of the variable portion of the material property vary depending on the electric field, when a pixel has a defective electrode and is photographed by one of the pixels of the camera, the pixel having the defective electrode will display other elements with the camera. The difference. Therefore, the position of the defective electrode can be known from the pixel coordinates of the camera. However, since the camera must be disposed on each of the modulation units, the size of the camera is limited. In particular, in the case where the size of the display device is gradually increased, in order to quickly detect the defective electrode on the substrate of the display device, how to make An array detection device having a large field of view has become an important subject, but there is still no array detection device equipped with such a camera. In addition, the use of a larger field of view camera also causes a large amount of power consumption, increasing the manufacturing cost of the array detection device. SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an array detecting device that includes a camera. The array detecting device is used for photographing in an area where the operation is oblique, and the field of view of the camera can be adjusted with the size of the display device, thereby reducing the power and production cost required for the array display device. The present invention further provides a method of determining, pure (four) quantities, which are located on the substrate of the array of 201027094, and can accurately and quickly measure the position of the defective electrode in the array. The earth plate is used for the above purpose, according to the present invention, the detection unit, the detection module and the “: array; the detection device, the package substrate detection module is disposed on the array detection device and is at least horizontally movable, and the detection mode The group includes at least one of the substrates placed on the detecting portion to detect one of the transmission paths and the neighboring portion of the modulation unit corresponding to the modulation sheet and including a reference position mark and at least a lateral extension 'including - A camera assembly that contains a marker. Modulation unit The reference camera captures the reference position and/or at least—adjacent camera. "The adjacent camera captures the position of the adjacent position of the substrate of the present invention, and the step of performing the AS position measurement method of the camera assembly of the array detection device includes the reference based on the reference camera. The adjacent camera's - pixel coordinates, and the phase camera is in the positive direction of the first axis and the reference __ distance; according to the substrate - the default reference; and the "quote" Preset base plus 'where the pixel coordinates are taken according to the reference element and used to capture a certain point of the substrate. Compared with the prior art, the array detection display according to the present invention can simultaneously use a plurality of cameras The substrate image is captured 'so that a large area of the substrate can be taken in each operation' to reduce the driving voltage required to drive the entire camera assembly and the production cost of the camera assembly. 201027094 In addition, according to the fixed position measurement method of the present invention, According to one of the pre-set points of the substrate, it is not necessary to perform defect detection on one of the preset pixels of the adjacent camera, thereby reducing the error caused by the detection and being accurate The preferred embodiment of the present invention will be described in detail with reference to the preferred embodiments of the present invention. The following is a description of a method for measuring an array position of an array detecting device and a substrate thereof according to a preferred embodiment of the present invention with reference to the related drawings. Fig. 1 is a schematic diagram of an array detecting device according to a preferred embodiment of the present invention. The device ίο represents a device for detecting an electrical defect of an electrode on a substrate 2. The substrate 2 can be a panel, generally used for a flat panel display, such as a thin film liquid crystal panel of a thin film transistor liquid crystal display. Array detecting device 10 A detection module 50, a detecting portion 30, and a position indicating member 200 are included. The array, the head 10 detecting device 1 further includes a loading portion 20 and an unloading portion 40. The portion 20 includes at least two blasting expansion panels 22. The loading plates 22 are disposed in parallel with each other but at a certain distance, and are supported to support the base to be detected. 2. The substrate 2 is transported by an optical chuck 70 in the direction of the detecting portion 3. The detecting portion 30 is disposed on the side of the loading and unloading position 20. The substrate 2 carried along the loading plate 22 is disposed in the detecting portion 3 r·,,,&, a 1 川上' to detect electrical defects. The detecting unit 30 includes a detecting platform ^^32 and a voltage applying portion 38. The detecting flat 8 201027094 the table 32 can provide the substrate 2 to be provided The voltage is applied to the electrode of the substrate 2. The galvanic application portion 38 is configured to provide the detection module 50 on the upper side, the lower side or the lower side of the detecting portion 30, thereby detecting defects of the substrate 2 disposed on the detecting platform 32. The detection module 50 includes at least one modulation unit 1 . The modulation unit ( 10 ) is disposed on the detection module 5 , such that the modulation unit 100 can move parallel to at least one axial direction, and the modulation unit 1〇〇 Inclusion-solid

The component 110, a camera component 120, and a standard measurement modulation element 130 are provided. The fixing member 110 is coupled to the modulation unit 100 and movable horizontally along a holder, and the holder 60 is disposed in one of the directions across the detecting portion 3''. Camera assembly 120 includes a plurality of cameras' and the camera includes a reference camera 121 and at least one adjacent camera 123. The camera assembly 12 is arranged in a square or square shape. During the array detection process, the camera of the camera unit 12 can simultaneously photograph the substrate 2. Since the size of the area of each shot is enlarged in accordance with the increase in the number of cameras in the camera unit 120, the detection time can be shortened. Therefore, in the present embodiment, a large-sized camera is not required, and a large driving power is not required. The modulation element 130 is detachably coupled to the fixed element no. The modulation element 130 includes a modulation electrode portion and a physical property variable portion (not shown). The modulation electrode portion forms an electric field with respect to the electrode of the substrate 2. The modulating electrode portion may be formed of indium tin oxide or carbon nano tube (CNT) and is generally used as a common electrode. The physical property variable portion has an optical property that changes with an electric field. The electric field is generated between the modulation electrode portion and the electrode of the substrate 2. The physical property variable portion may comprise a polymer dispersed liquid crystal film. The polymer-dispersed liquid crystal film is disposed between the modulation electrode portion and the electrode of the substrate 2, and can generate polarization according to the electric field intensity formed between the modulation electrode portion and the electrode of the substrate 2 to change the light passing through itself. The amount of light. The modulation element 130 can further include a light transmissive substrate. The light transmissive substrate is formed of a light transmissive material and has a predetermined rigidity. The modulation electrode portion and the physical property variable portion may be sequentially connected to the upper half of the light-transmitting substrate. The position indicator 200 is disposed adjacent to the modulation unit 100 and extends laterally from the detecting portion 30 corresponding to one of the transmission units 100, corresponding to one of the reference position marks 221 of the reference camera 121 and at least corresponding to the adjacent camera 123. An adjacent position mark 223 is formed on the position indicating member 200. In the present embodiment, the position indicating members 200 are disposed on both sides of the detecting portion 30, so that the modulating unit 100 adjacent to the position indicating member 200 is also moved to both sides of the detecting portion 30 when the position indicating member 200 is photographed. However, the present invention is not limited to this embodiment. In another embodiment, the position indicator 200 is disposed only on one side of the detecting portion 30 or at least one of the front side and the rear side of the detecting portion 30. Although not shown in the drawing, a backlight unit is disposed under the detecting portion 30. The backlight unit emits the light irradiation detecting portion 30 and moves relative to the movement of the modulation element 130. In the present embodiment, the position indicating member 200 may be disposed on one side of the backlight unit. Before the array detection is performed, since the pixel coordinates of the adjacent camera 123 can be obtained according to the reference pixel of the reference camera 121, it can be 201027094

Knowing the phase...*-,,. 1-, the right side performs the defect detection at the reference coordinate of the reference camera m, since the reference coordinate of the base motor 121 is obtained by the fresh point of the wire 2, and thus, according to the substrate The reference point of 2 obtains the coordinates of the gold element of the defective electrode. 2 is a magnified view of the position indicator _ of the camera assembly shown in FIG. 1. The reference position mark 221 taken in the field of view of the reference camera is formed at a predetermined interval (7) at a position. The adjacent position marks 223 taken in the field of view of the adjacent cameras are formed on the position indicating member 2 at intervals of a predetermined interval G2. Further, the plurality of length marks 225 are formed at the position indication. The length mark 225 is spaced apart from the reference position mark 221 and the adjacent position mark 223 by a predetermined distance k. The length mark 2 can be taken in the field of view of the reference camera and each adjacent camera. The functions of the position mark 22i, the phase position mark 223, and the length mark 225 will be described in detail later. When the dish is used, the structure indicator 200 of the position 10 is folded inward to reduce the setting of the array detecting device 0 position indicator 200. In the present embodiment, the position indicator 2 is set to be folded outside, and during the shooting, the position indicator is in the optical line of the camera. On; and when the shooting operation is not implemented, so bit 2 of the substrate to be detected outside the conveying unloading unloading square portion provided at one side of the detecting section 30, the unloading section through the left foot 'of the array may be detecting means 41011201027094.

. The substrate is unloaded and the substrate 2 is disposed on the unloading plate and transported in the suspended state of the substrate 2 to be respectively formed on the loading portion, so as to provide the pressure of the substrate 2, please refer to FIG. 70 can be formed on the loading portion and the unloading portion. However, the configuration of the array detecting device is not limited to the embodiment shown in Fig. 1. According to another embodiment of the present invention, the substrate can be fixed to a fixed supporting member, and the detecting module moves in the X-axis and Y-axis directions to detect the presence or absence of a defective electrode on the substrate. According to still another embodiment of the present invention, the detecting module can perform limited movement in the X-axis direction, and the substrate can be moved in the x-axis and Y-axis directions. A method of measuring the position of a substrate according to the present invention will be described below. The fixed-point position detection method comprises: obtaining a pixel coordinate of an adjacent camera according to a reference element of the reference camera; adding a reference pixel coordinate obtained by one of the reference points of the substrate to a pixel coordinate, wherein the pixel is The coordinates are obtained based on the reference pixel P1 and are used to capture a certain point on the substrate. Therefore, the fixed point coordinates can be obtained from the reference point of the substrate 2. In this embodiment, the pixel coordinates of all the cameras in the camera assembly can be obtained based on the reference pixel P1 of the reference camera. In addition, since the cameras in the camera assembly have only a single field of view, the camera assembly can be viewed as a single camera' having a field of view equivalent to the sum of the fields of view of all cameras within the camera assembly. 201027094 In the present embodiment, if the bead pixel coordinates of the reference point with respect to the substrate 2 can be obtained, the pixel positions of all the cameras of the camera unit 2 can be obtained from the reference points of the substrate. Accordingly, the present embodiment eliminates the problem of having to consider the relative relationship between the position of each camera and the reference point of the substrate one by one. 3 to 8 are conceptual views of a method of measuring a preset point coordinate of a substrate in the array detecting device. For the sake of clarity, the present embodiment is implemented by one of the adjacent phases of the first camera in the same axial direction as the X-axis, but it should be noted that the following description applies to the village. A plurality of adjacent cameras spaced apart from the reference camera in an axial direction and/or a second axial direction. Referring to FIG. 3, the reference position mark 221 is taken by the reference camera 121 having the field of view F121 (as shown in FIG. 1), and the adjacent position mark 223 is taken by the adjacent camera 123 having the field of view F123 (eg, Figure 1). Therefore, the reference position mark 221 is taken by the photographing element P121 of one of the reference position marks of the reference camera 121, and the adjacent ❹ position mark 223 is taken by the photographing element P123 of the adjacent position mark of one of the reference cameras 121. In this embodiment, the distance between the reference position mark 221 and the adjacent position mark 223 may be a preset interval. Referring to Fig. 4 through Fig. 6, the steps of obtaining the pixel coordinates of the adjacent cameras 123 based on the reference pixels of the reference camera will be described. Referring to FIG. 4, when the fields of view of the camera are adjacent to each other with no or no overlap, a reference pitch L is obtained, which is between the photographing element P121 of the reference position mark and the photographing element pi23 of the adjacent quasi-position mark. The distance in the first axial direction. Please refer to FIG. 5 again, which is a step of obtaining a difference between the reference interval B and the actual distance G1 of 13 201027094. In detail, please refer to FIG. 4, in the step of obtaining the reference pitch L, the first distance L1 between the photographing element P121 and the first end element Prl which obtain the reference position mark may be further included; a second distance L2 between the photographing element P123 and a second end pixel pr2; and adding the first distance L1 and the second distance L2 to obtain a reference pitch L ° where the 'first end 昼The prime Prl is selected from the endmost field halogen in the positive direction of the first axial direction in the reference camera field F121, and the second terminal halogen pr2 is selected from the adjacent camera field F123 and located in the first axial direction. The most terminal element in the negative direction, and the negative direction is relative to the positive direction. Referring to Fig. 5, the difference between the reference pitch 1 and the actual pitch G1 is obtained, which is the first deviation value Os1 in the first axial direction. Therefore, it can be judged whether or not the field of view F121 of the reference camera and the field of view F123 of the adjacent camera overlap each other. It is also possible to determine the extent to which the field of view F121 of the reference camera and the field of view F123 of the adjacent camera overlap or are spaced apart from each other. However, the adjacent camera may also deviate from the reference camera 121 in the second axial direction (the Y-axis as shown in the drawing). Please refer to FIG. 6, which is the step of obtaining the second deviation value 〇s2. The second deviation value 〇 s2 corresponds to the degree of deviation of the adjacent camera from the reference camera in the second axial direction. In the embodiment, the step of obtaining the second deviation value 〇s2 further includes: obtaining a third distance L3 between the photographing element P123 and the third end element Pr3 of the adjacent position mark; and obtaining the reference position mark A distance between the pixel P124 and a fourth terminal element pr4 is taken as a fourth distance 201027094 and a difference between the third distance 1^3 and the fourth distance is obtained as the first deviation value Os2. Wherein, the second end pixel Pr3 is selected from the machine vision aid, and the last terminal element in the positive direction of the second axis is gambling, and the fourth end elemental m is selected from the field of view of the adjacent camera. The most terminal element in the positive direction of the second axis. The difference between the third distance L3 and the fourth distance L4 is the second deviation value 〇 s2.

Based on the above results, the pixel coordinates of adjacent cameras can be obtained from the reference camera. Referring to Fig. 7, the fifth terminal halogen Pr5 is the endmost pixel selected from the reference camera field F121 and located in the positive direction of the first axial direction. If the distance between the reference pixel P1 and the fifth terminal pixel pr5 is the fifth distance L5, and the preset pixel coordinates of the adjacent cameras are al and Μ, the adjacent camera obtained according to the reference camera reference element The default pixel coordinates will correspond to the coordinate values of L5 + al - Osl and bl - 〇s2. For example, it is assumed that the field of view F121 of the reference camera partially overlaps the field of view F123 of the adjacent camera, because the two first value of the value of 1 产生 and the second value of the value of '2 are used, and the reference element P1 and the The distance between the five terminal alizarins Pr5 is 200. In this embodiment, the preset pixel coordinates of adjacent cameras are 50 and 50, and the preset pixel coordinates of the adjacent camera 123 obtained according to the reference pixel P1 should be 200 + 50 - 10 and 50 + 2 The values correspond to coordinates of 240 and 52. The preset pixel coordinates can be converted to an actual distance from the start of the reference pixel. In detail, the actual length of the preset element can be obtained by multiplying the value of each preset element coordinate by the length of each element 15 201027094 bit. By the length of each element and the pixel length of the adjacent camera, for example, if the camera moves in a unit of time and moves with a t-key, the camera-displacement amount Φ can be obtained: The calculation method can also be used to obtain the length of the element: phase two parameters: as shown in Fig. 2, the length marks 225 are respectively formed on the area of the position indicator corresponding to the reference camera by ΐ:=, and are applied to each reference position. The adjacent position marks 223 are separated. In this case, if it corresponds to the reference camera and is at a distance from the reference position mark 221, the number of pixels between the photographing element and the length mark 225 of the base of the Jinxin 'You can get the actual pixel length of the reference camera. ❹ This phase length 'mark' is the distance between the reference position mark 223 and the length mark 5 of the adjacent camera, divided by the number of adjacent positions corresponding to the same adjacent camera. The photograph of the photographing element between the photographing element and the length mark 225 is taken as follows: Reference® 8 _, which rides the base of the thief based on the base plate P〇 coordinates of the base camera of the reference camera (a, b) ) and 昼素Ρχ Take: 'd) Add the step '昼素Ρχ is to accurately take a certain point on the substrate according to the reference element Pi. Finally, it is possible to take advantage of the location of the defective element on the substrate. 16 201027094 Since the pixel coordinates of adjacent cameras are smashed according to the reference pixels, the modulation component only needs to perform defect detection at coordinates (ab) relative to the reference element. As for the coordinates of the reference 四(4) It is obtained based on the reference point p of the substrate 2. According to the array detecting device of the present invention, even if a large number of adjacent cameras are provided, only the defect detection needs to be performed on the reference pixel position of the reference camera, all the pixel positions of the adjacent cameras can be obtained, and thus it is not necessary to The defect detection operation is performed separately on each adjacent machine, which can reduce the error caused by the detection and shorten the time taken for the array detection. = Bu, the above method can also be applied to a second phase whose reference camera is adjacent, but adjacent to the first adjacent camera. ^考图^ 斤示, which is the step of obtaining the coordinates of the 23a frame of the picture (4) formed by the first adjacent camera, and the basis of the reference camera ～ 123 _ F123 b (d) The step of forming the coordinates of the second (10): the position marker gamma is captured, and then the first adjacent camera is positioned 4 223a and 4 with respect to the first adjacent camera. The deviation value Os3 of μzhe-old set 223b is obtained by taking the deviation value of the first axial direction by a deviation value Os4, and the deviation value 〇sl and Os2 of the π 忡 忡 取得 取得 以及 以及between. For example, the actual spacing G 2 and the difference, that is, the position of the adjacent position mark of the machine corresponding to the deviation value 〇 咖 咖 实际 实际 实际 实际 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表 代表Fortunately -: the distance from the second adjacent phase • a prime P123__b. 201027094 Thereafter, the second adjacent camera can be obtained by adding the deviation values Os3 and 〇S4 of the second adjacent camera of the first adjacent camera to the deviation value of the first adjacent camera relative to the reference camera. The sum of the deviation values from the reference camera. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the invention may be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an enlarged view of a position indicator of a camera assembly shown in the schematic == of the array detecting device according to a preferred embodiment of the present invention. The steps of the camera, the actual spacing is the picture of the adjacent camera of the adjacent camera and the position of the adjacent position mark I, which is a schematic diagram of the step of taking the reference moment, the reference position of the reference door Marking the full-mouth flat spacing is the distance between the bases, J" prime and shooting the adjacent position marker shooting the first deviation of the pixel 2 = the difference between the spacing and the actual spacing to obtain, the cloth intent' : obtaining the second deviation value between the reference camera and the adjacent camera. 18 201027094 FIG. 7 is a schematic diagram of the steps of obtaining the preset pixel coordinates of the adjacent camera according to the reference camera reference standard, and FIG. 8 is based on the substrate. A schematic diagram of the steps of obtaining a preset pixel coordinate of an adjacent camera by a reference point; and FIG. 9 is a schematic diagram of a step of obtaining a deviation value when using a plurality of adjacent cameras.

[Main component symbol description]

10 : Array detecting device 100 : Modulation unit 110 : Fixing element 120 : Camera unit 121 : Reference camera 123 : Adjacent camera 130 : Modulating element 2 : Substrate 20 : Loading unit 200 : Position indicating member 22 : Loading plate 221 : Reference position mark 223: adjacent position mark 225 * length mark & 24: air hole 30: detecting portion 19 201027094 32 : detecting platform 38 : voltage applying portion 40 : unloading portion 50 : detecting module 60 : bracket 70 : optical chuck a, b, al, bl, c, d: coordinates F121, F123, F123-a, F123_b: field of view

Gl, G2: actual spacing k: preset spacing L, L6, L7: reference spacing L1: first distance L2: second distance L3: third distance L4: fourth distance

Osl: first deviation value 0s2: second deviation value 0s3, Os4: deviation value

Po : Reference point P1 : Reference element P121 : Recording element of the reference position mark P123 : Shooting element of the adjacent position mark P123_a, P123_b : Filming element Prl : First end element 201027094

Pr2: second terminal halogen Pr3: third terminal halogen Pr4: fourth terminal halogen Pr5: fifth terminal halogen Px: halogen X, Y: direction 21

Claims (1)

201027094 VII. Patent application scope: 1. An array detecting device, comprising: a detecting unit for supporting one substrate to be tested; a detecting module disposed on the array detecting device and capable of horizontally moving at least, and the detecting module Include at least one modulation unit to detect a defect of the substrate disposed on the detecting portion; and a position indicator corresponding to one of the transmission units of the modulation unit and adjacent to the modulation unit The detecting portion extends laterally and includes a reference position mark and at least one adjacent position mark, wherein the modulation unit includes a camera assembly including a reference camera and at least one adjacent camera, and the reference camera captures the reference position Marked, and the adjacent camera captures the adjacent position mark. 2. The array detecting device according to claim 1, wherein at least one length mark is formed on an area of the position indicating member, and a line is formed by the camera, and the length mark is marked with respect to the reference position. And a predetermined spacing between the adjacent position marks. 3. The array detecting device according to claim 1, further comprising: a control unit that obtains a pixel of the adjacent camera according to a reference pixel and uses a difference between an actual spacing and a reference spacing a coordinate, wherein the actual spacing is a distance between the reference position mark and the adjacent position mark, and when the fields of view of the cameras are adjacent to each other without or without overlapping, the reference spacing is the reference position mark One of the photographing pixels and one of the adjacent position marks captures the distance between the elements. The array detecting device of claim 1, wherein the position indicating member is rotatable on a rotating shaft. A method for measuring a fixed point position, the fixed point is located on a substrate, and the fixed point position measuring method uses the camera assembly of the array detecting device according to claim 1, wherein the fixed point position measuring method comprises the following steps: Obtaining a pixel coordinate of the adjacent camera according to one of the reference cameras, and the adjacent camera has a distance from the reference camera in a positive direction of the first axis; preset according to one of the substrates a reference point obtained by obtaining the reference pixel coordinates; and adding a unitary coordinate to the reference pixel coordinates obtained according to the predetermined reference point, wherein the pixel coordinates are obtained according to the reference element and used for Shoot a certain point of the substrate. 6. The fixed-point position measuring method according to claim 5, wherein obtaining the pixel coordinates of the adjacent camera comprises: obtaining an offset value between the reference position mark and the adjacent position mark, the offset The shift value includes a first offset value, wherein the first offset value corresponds to a difference between an actual pitch and a reference pitch in the positive direction of the first axis, the actual pitch being the reference position mark a distance from the adjacent position mark, and when the fields of view of the cameras are adjacent to each other without or without overlap, the reference pitch corresponds to one of the reference position marks in the positive direction of the first axis Shooting a pixel and one of the adjacent position marks to capture a distance between the elements of the 23 201027094; and according to the reference pixel coordinates of the reference camera, and using the offset value to obtain the pixel coordinates of the adjacent camera. 7. The fixed-point position measuring method according to claim 6, wherein the obtaining the reference spacing comprises: obtaining a first distance between the photographing element and the first end pixel of the reference position mark, and the The first end halogen element is selected from the top view of the first axial direction in the field of view of the reference camera; the photographing element and the second end element are obtained by the reference position mark One of the first distances, and the second terminal element is selected from the adjacent camera field of view, at the extreme end in one of the first axial directions, the negative direction is relative to the positive direction; And adding the first distance to the second distance. 8. The fixed-point position measuring method according to claim 6, wherein the first distance is obtained by multiplying a unit pixel length ❿ of the reference camera by the photographing element marked by the reference position to the The second distance is obtained by multiplying the unit cell length of one of the adjacent cameras by the photographing element labeled by the adjacent position to the second end element. Obtaining the number of halogens, the first terminal halogen is selected from the top of the first axial direction in the field of view of the reference camera, and the second terminal element is selected from the adjacent camera field of view. The middle end is located at the extreme end in one of the negative directions of the first axial direction, and the negative direction is relative to the positive direction. 24 201027094 9. The method for measuring a fixed position according to claim 6, wherein obtaining the deviation value further comprises obtaining a second deviation value corresponding to the preset of the adjacent camera in one of the second axes. a deviation value in the direction, and the second axial direction is perpendicular to the first axial direction, and obtaining the second deviation value comprises: obtaining one of the photographing element between the photographing element and the third end element of the adjacent position mark a third distance, and the third terminal element is selected from the top end of the second axial direction in the field of view of the base camera; the film is taken by the reference position mark a fourth distance between the element and the fourth terminal element, and the fourth terminal element is selected from the pixels in the field of view of the adjacent camera, and is located in the predetermined direction of the second axis. a terminal halogen; and obtaining a difference between the third distance and the fourth distance. 10. The fixed-point position measurement method described in claim 5 of the patent application, further includes the following steps: Measuring the unit length of the reference camera and one of the adjacent cameras. 11. The method of measuring a fixed point position according to claim 10, wherein at least one length mark is formed on an area of the position indicator, and a line is formed by the camera, the length mark is relative to each of the positions. a predetermined spacing between the markers, and the unit pixel length of the reference camera is divided by the distance between the reference position marker and the length marker corresponding to the reference camera One of the length marks of the reference camera is taken by 25 201027094, and the unit length of the adjacent camera is obtained by marking the adjacent position with the corresponding phase. One of the distances between the length marks of the adjacent camera is obtained by dividing the number of pixels between the pixels from the photographing element of the adjacent position mark to the length mark of the reference camera. ❿ 26