201019841 九、發明說明： • 【發明所屬之技術領域】 - 本發明係涉及一種散熱裝置，特別係關於一種 用來冷卻電子元件之液冷散熱裝置。 【先前技術】 隨著電子技術不斷發展，電子元件運行頻率及 速度也在不斷提升。惟，高頻高速將使電子元件產 生之熱量越來越多’溫度也越來越南，嚴重威脅著 ❹電子元件運行時之性能及穩定性，為確保電子元件 能正常運作，需對電子元件進行有效之散熱。惟， 現有之純金屬散熱裝置越來越難以滿足高頻高速 電子元件之散熱需要，為此，液冷散熱系統逐漸被 業界採用。 現有液冷散熱系統包括一儲液槽，該儲液槽由 與發熱元件接觸之底座及上蓋兩部分合圍而成，冷 ❹卻液在該儲液槽内與該底座進行熱交換，通過冷卻 液之迴圈將該底座之熱量帶走。然而，由於該底座 換熱面大都為平面，冷卻液與底座之熱交換面積 小’熱交換不夠充分，因此大部分熱量蓄積於該底 座上，影響散熱效果。 【發明内容】 有鑒於此’有必要提供一種換熱效果良好之液 冷散熱裝置。 一種液冷散熱裝置’其包括一與電子元件導熱 6 201019841 接觸之導熱箱，該導熱箱内設有一用於儲存冷卻液 之空腔，該導熱箱頂面分別與該空腔相通之進液口 及出液口，該導熱箱頂面向上拱起形成二斜面，該 進液口及出液口分別設置在該二斜面上，該空腔底 面向空腔内延伸有複數導熱柱。 上述液冷散熱裝置通過在空腔内形成有複數 • 導熱柱’從而增大導熱箱與冷卻液之熱交換熱面 積，從而增強冷卻液進入空腔後與導熱箱之換熱效 β果，使冷卻液更好之吸收並帶走熱量。 【實施方式】 請參閱圖1至圖3’為本發明液冷散熱裝置之 一較佳實施例之示意圖’上述液冷散熱裝置用於對 電子系統之發熱電子元件（圖未示）進行散熱，其 包括一導熱箱10、位於導熱箱1 〇 —側之散熱片組 20、導熱連接導熱箱10和散熱片組20之複數熱管 30、安裝於散熱片組20靠向導熱箱10 一側之風扇 ® 40和將風扇40與散熱片組2〇連接在一起之二扣 件50。 請一併參閱圖4’上述導熱箱10包括一底座 12、安裝在底座12上之中空箱體14、封蓋箱體14 頂端之蓋體16和安裝於底座12底面並向相對兩側 延伸之二固定腳18。所述底座12包括一矩形底板 122和由底板122頂面盡直向上延伸之複數導熱柱 124。所述底板122頂面之各個角落均開設有一配 201019841 合孔1220，所述底板122之底面開設有複數容置 1222。所述容置槽1222呈半圓形’且其數量與 -熱管30之相等，以容置熱管30之一端’所述容置 槽1222並排在底板122底面之中部位置並垂直於 底板122之二長邊緣。所述導熱柱I24垂直排列於 •底板122頂面之中部位置，且導熱柱124相互間平 ’ 行間隔，呈矩形方陣排列。 所述箱體I4可一體銘擠成型’箱體14呈長方 ©體形，其包括垂直於底座12之四侧板140 ’每相 鄰二侧板14 0相互垂直。所述箱體14大小正好與 底座12之周緣接合’箱體14之上下端面均開設有 環形容置槽142，所述容置槽142用於容置防水墊 圈100，以加強箱體14分別與底座12和蓋體16 結合之密封性。所述箱體14之各個角落向内凹陷 相成開放式之圓形槽孔144，所述槽孔144分別與 ❾底板122之配合孔1220對應。所述槽孔144採用 開放式設置’可便於在箱體14鋁擠成型時，所述 槽孔144同時在各個角落由同一模具擠出形成，而 無需像常用之密封圓形孔一樣要另外鑽孔。 上述蓋體16向上呈等腰梯形拱起，蓋體16之 —相互對稱之等腰斜面上分別垂直斜面向外傾斜 延伸有一進液口 162和一出液口 164。所述蓋體16 之底端兩側外平外延伸有固定緣16 6，每一固定緣 166之兩端角落處開設有與箱體μ頂端槽孔144 201019841 對應之穿孔1660。所述進液口 162和出液口 164 ，靠向對應底座12其中之一之長侧邊，以在另一長 -側邊處為放置風扇40預留空間。 上述固定腳18包括貼設於底座12底板122之 底面並位於容置槽1222 —侧之中間段182和由中 間段182兩段向底座12外延伸之二固定段184。 所述固定段184近末端處穿設有固定件300，以將 液冷散熱裝置固定於發熱電子元件上。 ® 組裝上述導熱箱工〇時’螺桿件200自上向下 依次穿過蓋體16之穿孔1660、箱體14之開放式 槽孔144後與底座12之配合孔1220螺合，從而將 導熱箱10組裝在一起。所述導熱箱10在其内形成 一容置冷卻液之密封空腔’所述進液口 162與出液 D 164可通過導管與水泵（圖未示）連接且分別設置 在蓋體16等腰梯形之二斜面上，進液口 162與出 ❾液口 164均等角指向底座12頂面導熱柱124之中 間處，以便於冷卻液之流進流出。 上述散熱片組20包括複數相互等距間隔之散 熱片22，所述散熱片22成矩形且平行於底座12 之頂面設置。所述散熱片組20之相對兩側面中部 分別開設有垂直散熱片22之楔形卡槽24，所述卡 槽24與扣件50配合以將風扇40固定在散熱>{組 2〇面向導熱箱10之一侧。所述散熱片組22開設 有由散熱片組22底面向上延伸之複數容置孔26， 201019841 所述容置孔26垂直於4也 •之另-端。所述容置、：心片22’用於容置熱管30 -20之頂面，從而使熱管 未向上穿過散熱片組 内而未暴露出來，這樣之末端收容與容置孔26 安全性。 僳可起到提高熱管30之使用 上述熱管30之數量在 熱管30包括容置於底成本實施例中為三，每-^ ^ ^ ; _座10底面容置槽1222内之 Λ 蒸發段32 一段垂直向上延伸並穿設 ❹於散熱片組2〇容置孔 穿认 為煞an丄 a円之一冷凝段34。所述 ”，、管、'圓形導熱管彎折而成，為增加接觸面 積，所述熱管30蒸發段32之底面被壓成平面狀， 且同時收容在底座10底面容置槽1222内之蒸發段 32之底面相互連接形成一連續並平坦之接觸面， 所述接觸面直接與發熱電子元件頂面接觸。所述熱 管3〇還包括連接冷凝段34和蒸發段32之f曲 段，且位於外側之二熱管30之彎曲段分別還相向 ❹彎曲，以使三熱管30之蒸發段32緊靠在一起，而 熱管3 0之冷凝段3 4則分別相互平行間隔開。 請一併參閱圖5，上述風扇4〇通過扣件5〇固 定在散熱片組20面向導熱箱1〇之一侧，且風扇 40位於導熱箱10之上方，並佔據導熱箱1〇上方 相對進、出液口 162、164之另一侧。因此’上述 設置在二傾斜面上進、出液口 162、164不會阻擋 在風扇40之正前方，同時速接導管後，也可以使 201019841 導管從兩侧傾斜進來連 也不會正面阻擋在風扇 40之效率。 接進、出液口 162、164， 4〇之氣流通過而影響風扇 由上述介紹可知，本發 表面裉忐女、s叔.兹 發月係通過在底座10上 衣面形成有複數導熱柱12 工 A ^ .¾ -V ^ 從而增大底座10盥 冷部液之換熱面積，從而辦 ，、 in ♦介, 臂強冷部液進入該導熱箱 ^ ^ ^ 換熱效果，使冷卻液更好 ©子：Ϊ 〇之熱量。此外，上述發熱電 生之熱篁，一部分直接通過導熱箱12或 通過熱管30傳遞給導熱箱12並被冷卻液帶走戈 分則通過熱管30分佈到散熱片組2〇上，並由 散熱片組20散發屮本，_ h w 此可見，域液冷散熱 =置同時用兩種方案對發熱電子元件，能比單一散 、、、方案具有更強之散熱效率夠，同時能適合更 複雜情況。 、 综上所述，本發明符合發明專利之要件，爰依 去提出專利申請。惟以上所述者僅為本發明之較佳 實知例’舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1係本發明液冷散熱裝置一較佳實施例之 立體圖之組裝圖。 圖2係圖1中本發明液冷散熱裝置之立體分解 11 201019841 圖。 圖3係圖2之倒置視圖。 圖4係圖1中底座之立體分解圖。 圖5係圖1中液冷散熱裝置之侧視圖。 【主要元件符號說明】201019841 IX. Description of the invention: • Technical field to which the invention pertains - The present invention relates to a heat dissipating device, and more particularly to a liquid cooling device for cooling electronic components. [Prior Art] With the continuous development of electronic technology, the operating frequency and speed of electronic components are also increasing. However, high-frequency high-speed will make more and more heat generated by electronic components. 'The temperature is also getting more and more south, which seriously threatens the performance and stability of electronic components during operation. To ensure the normal operation of electronic components, electronic components must be used. Effective heat dissipation. However, existing pure metal heat sinks are increasingly difficult to meet the heat dissipation requirements of high-frequency, high-speed electronic components. For this reason, liquid-cooled heat sink systems are gradually being adopted by the industry. The existing liquid cooling heat dissipation system includes a liquid storage tank which is formed by two parts of a base and an upper cover which are in contact with the heating element, and the cold liquid is heat exchanged with the base in the liquid storage tank, and the cooling liquid is passed through the cooling liquid. The loop takes the heat away from the base. However, since the heat exchange surface of the base is mostly flat, the heat exchange area between the coolant and the base is small, and the heat exchange is insufficient, so that most of the heat is accumulated on the base, which affects the heat dissipation effect. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a liquid-cooling heat dissipating device having a good heat exchange effect. A liquid cooling heat dissipating device includes a heat conducting box in contact with an electronic component heat conduction 6 201019841, wherein the heat conducting box is provided with a cavity for storing a cooling liquid, and a top surface of the heat conducting box respectively communicates with the cavity And the liquid outlet, the top of the heat conducting box is upwardly arched to form two inclined surfaces, and the liquid inlet and the liquid outlet are respectively disposed on the two inclined surfaces, and the bottom of the cavity faces a plurality of heat conducting columns extending in the cavity. The liquid cooling heat dissipating device increases the heat exchange heat area of the heat conducting box and the cooling liquid by forming a plurality of heat conducting columns in the cavity, thereby enhancing the heat exchange effect of the coolant into the cavity and the heat exchange effect of the heat conducting box. The coolant absorbs better and removes heat. [Embodiment] Please refer to FIG. 1 to FIG. 3' is a schematic diagram of a preferred embodiment of a liquid cooling device according to the present invention. The liquid cooling device is used for dissipating heat from an electronic component (not shown) of an electronic system. The utility model comprises a heat conducting box 10, a heat sink group 20 located on the side of the heat conducting box 1 , a plurality of heat pipes 30 thermally connected to the heat conducting box 10 and the heat sink group 20 , and a fan mounted on the side of the heat sink group 20 on the side of the heat guiding box 10 . ® 40 and two fasteners 50 that connect the fan 40 to the heat sink set 2A. Referring to FIG. 4 together, the heat conducting box 10 includes a base 12, a hollow box 14 mounted on the base 12, a cover 16 at the top end of the cover box 14, and a bottom surface of the base 12 and extending to opposite sides. Two fixed feet 18. The base 12 includes a rectangular bottom plate 122 and a plurality of thermally conductive columns 124 extending straight up from the top surface of the bottom plate 122. Each of the top surfaces of the bottom surface of the bottom plate 122 is provided with a 201019841 hole 1220. The bottom surface of the bottom plate 122 is provided with a plurality of receiving portions 1222. The accommodating groove 1222 is semi-circular and has the same number as the heat pipe 30 to accommodate one end of the heat pipe 30. The accommodating groove 1222 is arranged in the middle of the bottom surface of the bottom plate 122 and perpendicular to the bottom plate 122. Long edge. The heat conducting columns I24 are vertically arranged at the middle of the top surface of the bottom plate 122, and the heat conducting columns 124 are spaced apart from each other by a rectangular square array. The case I4 can be integrally molded. The case 14 has a rectangular shape, and includes four side plates 140' perpendicular to the base 12, and each of the adjacent side plates 14 0 is perpendicular to each other. The housing 14 is sized to be engaged with the periphery of the base 12. The upper end surface of the housing 14 is provided with an annular receiving groove 142 for receiving the waterproof gasket 100 to reinforce the housing 14 and the housing 14 respectively. The base 12 and the cover 16 are combined for sealing. The corners of the casing 14 are recessed inwardly into open circular slots 144 which correspond to the mating holes 1220 of the crucible bottom plate 122, respectively. The slot 144 adopts an open arrangement ‘to facilitate the extrusion of the slot 14 144 at the same time by the same die at the same time when the case 14 is aluminum extruded, without the need to additionally drill like a conventional sealed circular hole. hole. The cover body 16 is upwardly formed in an isosceles trapezoidal shape, and the mutually equal isosceles slopes of the cover body 16 are inclined obliquely outwardly and have a liquid inlet port 162 and a liquid outlet port 164. The bottom end of the cover body 16 has a fixing edge 16 extending outwardly from the outer side of each of the fixing edges 166. A perforation 1660 corresponding to the slot μ 144 201019841 of the box μ is opened. The liquid inlet 162 and the liquid outlet 164 abut against the long side of one of the corresponding bases 12 to reserve space for the placement fan 40 at the other long side. The fixing leg 18 includes a middle portion 182 which is attached to the bottom surface of the bottom plate 122 of the base 12 and is located on the side of the receiving groove 1222, and two fixing portions 184 extending from the middle portion 182 to the outside of the base 12. A fixing member 300 is disposed at a proximal end of the fixing portion 184 to fix the liquid cooling heat dissipating device to the heat-generating electronic component. ® When assembling the above-mentioned heat conducting box process, the screw member 200 passes through the through hole 1660 of the cover body 16 and the open slot 144 of the case 14 from the top to the bottom, and then is screwed with the matching hole 1220 of the base 12 to thereby heat the heat conducting box. 10 assembled together. The heat conducting box 10 has a sealing cavity for accommodating a cooling liquid therein. The liquid inlet 162 and the liquid discharging D 164 can be connected to a water pump (not shown) through a conduit and respectively disposed on the cover body 16 isosceles. On the inclined surface of the trapezoid, the liquid inlet 162 and the liquid outlet 164 are equally pointed at the middle of the top surface of the base 12, so as to facilitate the flow of the coolant. The heat sink assembly 20 includes a plurality of mutually spaced heat sinks 22 that are rectangular and disposed parallel to the top surface of the base 12. A wedge-shaped card slot 24 of a vertical heat sink 22 is respectively disposed in a middle portion of the opposite side faces of the heat sink group 20, and the card slot 24 cooperates with the fastener 50 to fix the fan 40 in heat dissipation. One side of 10. The heat sink group 22 defines a plurality of receiving holes 26 extending upward from the bottom surface of the heat sink group 22. The receiving holes 26 of 201019841 are perpendicular to the other end of the wall. The receiving portion: the core piece 22' is for accommodating the top surface of the heat pipe 30-20 so that the heat pipe does not pass upward through the heat sink group without being exposed, so that the end receiving and receiving hole 26 are safe.僳 can improve the use of the heat pipe 30. The number of the heat pipes 30 is included in the heat pipe 30 in the bottom cost embodiment, and each section of the heat sink 30 is contained in the bottom surface of the heat sink 30. Vertically extending upwardly and through the heat sink group 2, the accommodating hole is considered to be one of the condensing sections 34 of the 煞an丄a円. The ",, tube, and the circular heat pipe are bent. In order to increase the contact area, the bottom surface of the evaporation portion 32 of the heat pipe 30 is pressed into a flat shape, and is simultaneously accommodated in the bottom receiving groove 1222 of the base 10. The bottom surfaces of the evaporation sections 32 are connected to each other to form a continuous and flat contact surface, and the contact surfaces are directly in contact with the top surface of the heat-generating electronic component. The heat pipe 3〇 further includes a f-section connecting the condensation section 34 and the evaporation section 32, and The curved sections of the two outer heat pipes 30 are also bent toward each other so that the evaporation sections 32 of the three heat pipes 30 are close together, and the condensation sections 34 of the heat pipes 30 are respectively spaced apart from each other. 5, the fan 4〇 is fixed on one side of the heat sink group 20 facing the heat dissipation box 1 through the fastener 5〇, and the fan 40 is located above the heat conduction box 10, and occupies the opposite inlet and outlet ports 162 above the heat conduction box 1〇. The other side of the 164. Therefore, the above-mentioned arrangement of the inlet and outlet ports 162, 164 on the two inclined surfaces does not block directly in front of the fan 40, and after the catheter is quickly connected, the 201019841 catheter can also be tilted in from both sides. Even the front will not block the wind The efficiency of the fan 40. The airflow of the inlet and outlet ports 162, 164, 4〇 affects the fan. As can be seen from the above description, the surface of the hairpin, the s uncle, the moon is formed by the upper surface of the base 10. The plurality of heat-conducting columns 12 work A ^ .3⁄4 -V ^ to increase the heat exchange area of the cold portion of the base 10, thereby, in, and the heat transfer effect of the arm strong cold liquid into the heat conduction box ^ ^ ^ In addition, the heat of the above-mentioned heat generating electricity is transmitted to the heat conducting box 12 directly through the heat conducting box 12 or through the heat pipe 30 and carried away by the cooling liquid through the heat pipe 30. Distributed to the heat sink group 2〇, and distributed by the heat sink group 20, _ hw This can be seen, the domain liquid cooling heat = set simultaneously with two schemes for the heating electronic components, can be more than a single dispersion,, and program The heat dissipation efficiency is sufficient, and at the same time, it can be adapted to more complicated situations. In summary, the invention complies with the requirements of the invention patent, and the patent application is filed according to the invention. However, the above description is only a preferred embodiment of the invention. Anyone who is familiar with the skills of this case is here. The equivalent modifications or variations of the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an assembled view of a perspective view of a preferred embodiment of the liquid cooling device of the present invention. Fig. 1 is an exploded perspective view of Fig. 2. Fig. 4 is an exploded perspective view of the base of Fig. 1. Fig. 5 is a side view of the liquid cooling device of Fig. 1. [Main component symbol description]
導熱箱 10 底座 12 底板 122 配合孑L 1220 容置槽 1222 導熱柱 124 箱體 14 侧板 140 容置槽 142 槽孔 144 蓋體 16 進液口 162 出液口 164 固定緣 166 穿孔 1660 固定腳 18 中間段 182 固定段 184 散熱片組 20 散熱片 22 卡槽 24 容置孔 26 熱管 30 蒸發段 32 冷凝段 34 風扇 40 扣件 50 防水塾圈 100 螺桿件 200 固定件 300 12Thermal box 10 Base 12 Base plate 122 孑L 1220 accommodating groove 1222 Thermal column 124 Box 14 Side plate 140 Socket 142 Slot 144 Cover body 16 Inlet 162 Outlet 164 Fixing edge 166 Perforation 1660 Fixing foot 18 Intermediate section 182 Fixed section 184 Heat sink set 20 Heat sink 22 Card slot 24 accommodating hole 26 Heat pipe 30 Evaporation section 32 Condensing section 34 Fan 40 Fastener 50 Waterproof 100 ring 100 Screw part 200 Fixing piece 300 12