201018538 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種具有喷氣導管之雷射加工裝置，其具有 可有效移除加工之碎屑、可有效達到加工之冷卻及可防止加工 物件表面之刮傷等優點及功效。 【先前技術】 如第一圖所示，習知加工機一 80以一雷射光84對一待測 物件70進行加工。 然而’雷射光84於加工時容易造成高溫及碎屑，且在加 ❹ 工完成後，須再進行移除碎屑之處理程序，不僅耗費時間，成 本也相對提高，且加工過程中所產生之碎屑，容易對該待測物 件70表面造成刮傷或落於該待測物件7〇表面之凹部或溝槽 内，造成其他部位之傷害。 另外，:¾'以液體配合雷射光84來達到加工，則會產生干 擾問題或功率降低。 如第二圖所示，習知加工機二8〇A係具有一出水通道幻、 一吸水通道82及一雷射氣體通道83，利用雷射光84來達到 加工，並藉由該出水通道81及該吸水通道82來進行水之流 • 動，，除所產生之碎屑及冷卻該待測物件70，且該雷射光= 與一氣壓85係利用該雷射氣體通道83導引至該待測物件％ 表面，而該氣壓85係可於該待測物件70之表面形成一氣體工 作區85A ’可將水向外推擠而不與該雷射光84產生干擾，·但 • 當用於微加工時，該雷射氣體通道83須使用較小之尺寸，貝^ 該出水通道81及該吸水通道82之設計也相對縮小，進而造成 水流量極小或黏滯而難以排出(如毛細現象，使水黏滯於通道 内而不易排出）’無法確實達到移除碎屑或冷卻之目的。 因此，有必要研發新產品，以解決上述缺點及問題。 【發明内容】 本發明之目的在於提供一種具有喷氣導管之雷射加工裝 201018538 置具有可有效移除加工之碎屬、可有效達到加工之冷卻及可 防止加工物件表面之刮傷等優點及功效，用以解決習知技術無 法峰實達到排屑及冷卻等問題。 本發明解決上述問題之技術手段係提供一種具有喷氣導 管之雷射加工裝置，其包括： 一噴氣導管，其具有一供氣部、一空心導管及一氣中雷射 ，道’該供乳部係用以供應一預定氣體並經由該空心導管内之 氣中雷射通道而朝一加工區域喷出，並形成一氣體工作區； 一雷射光產生部，用以產生一雷射光，亦經由該空心導管 ❹ 内之氣中雷射通道而朝一加工區域射出； 一橫向流體產生裝置，其具有一流體供應部、一流體喷出 口、一流體吸回部及一流體吸回口；該流體噴出口與該流體吸 回口係相對應且間隔一預定距離；且，當一預定流體由該流體 喷出口喷至該流體吸回口時，係形成一流動狀態之薄膜且繞過 該氣體工作區； 藉此，該氣中雷射通道中之雷射光係經由該氣體工作區而 抵達該加工區域，而該流動狀態之薄膜係可帶走雷射加工時產 生之屑並且可以達到冷卻之目的。 本發明之上述目的與優點’不難從下述所選用實施例之詳 參 細說明與附圖中，獲得深入瞭解。 茲以下列實施例並配合圖式詳細說明本發明於後： 【實施方式】 如第二及第四圖所示，本發明係一種具有喷氣導管之雷射 加工裝置，其包括： 〆一喷氣導管10，其具有一供氣部11、一空心導管12及一 氣中雷射通道13 ;該供氣部11係用以供應一預定氣體1U並 經由該空心導管12内之氣中雷射通道π而朝一加工區域40 喷出，並形成一氣體工作區41 ; 一雷射光產生部20 ,用以產生一雷射光21，亦經由該空 心導管12内之氣中雷射通道13而朝一加工區域4〇射出； 201018538 一橫向流體產生裝置30，其具有一流體供應部31、一流 體喷出口 32、一流體吸回部33及一流體吸回口 34 ;該流體^ 出口 32與β亥流體吸回口 34係相對應且間隔一預定距離；且， 當一預定流體30Α由該流體喷出口 32喷至該流體吸回口 34 時’係形成一流動狀態之薄膜35且繞過該氣體工作區41 ; 藉此’該氣中雷射通道13中之雷射光21係經由該氣體工 作區41而抵達該加工區域40，而該流動狀態之薄膜％係可 帶走雷射加工時產生之屑並且可以達到冷卻之目的。201018538 VI. Description of the Invention: [Technical Field] The present invention relates to a laser processing apparatus having a jet duct, which has an effective removal of processed debris, can effectively achieve processing cooling, and can prevent the surface of a processed object The advantages and effects of scratching. [Prior Art] As shown in the first figure, the conventional processing machine 80 processes a to-be-tested object 70 with a laser light 84. However, 'laser light 84 is prone to high temperature and debris during processing, and after the completion of the finishing process, the process of removing debris must be performed, which is time consuming, relatively costly, and produced during processing. Debris, it is easy to scratch the surface of the object to be tested 70 or fall into the recess or groove of the surface of the object to be tested, causing damage to other parts. In addition, :3⁄4' is processed with liquid in combination with laser light 84, which can cause interference problems or power reduction. As shown in the second figure, the conventional processing machine has a water passage channel, a water absorption channel 82 and a laser gas channel 83, and the laser light 84 is used for processing, and the water outlet channel 81 and The water absorbing passage 82 performs a flow of water to remove the generated debris and cool the object to be tested 70, and the laser light is used to guide the target gas to be tested by the laser gas channel 83. The object % surface, and the air pressure 85 can form a gas working area 85A on the surface of the object to be tested 70 to push the water outward without interfering with the laser light 84, but • when used for micromachining When the laser gas passage 83 is to be of a smaller size, the design of the water outlet passage 81 and the water suction passage 82 is also relatively narrow, thereby causing the water flow to be extremely small or viscous and difficult to discharge (such as capillary phenomenon, making water Sticking to the channel and not easy to discharge) 'There is no way to remove debris or cool. Therefore, it is necessary to develop new products to solve the above shortcomings and problems. SUMMARY OF THE INVENTION An object of the present invention is to provide a laser processing apparatus with a jet duct 201018538 which has the advantages of effectively removing the processed granules, effectively achieving processing cooling, and preventing scratches on the surface of the processed object. In order to solve the problems that the conventional technology cannot achieve the chip removal and cooling. The technical means for solving the above problems is to provide a laser processing apparatus having a jet duct, comprising: a jet duct having a gas supply portion, a hollow conduit and a gas laser, and the Providing a predetermined gas and ejecting through a gas passage in the hollow duct to a processing area, and forming a gas working area; a laser light generating portion for generating a laser light and also passing through the hollow duct a laser channel in the gas jet toward the processing area; a lateral fluid generating device having a fluid supply portion, a fluid ejection port, a fluid suction portion, and a fluid suction port; the fluid ejection port and the The fluid suction ports are correspondingly spaced apart by a predetermined distance; and when a predetermined fluid is sprayed from the fluid discharge port to the fluid suction port, a film in a flowing state is formed and bypassed by the gas working area; The laser light in the laser channel in the gas reaches the processing area through the gas working area, and the film state of the flowing state can take away the debris generated during the laser processing and You can achieve the purpose of cooling. The above objects and advantages of the present invention are readily apparent from the following detailed description of the preferred embodiments of the invention. The present invention will be described in detail below with reference to the following embodiments: [Embodiment] As shown in the second and fourth figures, the present invention is a laser processing apparatus having a jet duct, comprising: a first jet conduit 10, which has a gas supply portion 11, a hollow conduit 12 and an airborne laser passage 13; the gas supply portion 11 is for supplying a predetermined gas 1U and passing through the gas passage π in the hollow conduit 12. A processing area 40 is ejected and a gas working area 41 is formed; a laser light generating unit 20 is configured to generate a laser beam 21, and also through a gas passage 13 in the hollow duct 12 toward a processing area 4 Injection; 201018538 A lateral fluid generating device 30 having a fluid supply portion 31, a fluid ejection port 32, a fluid suction portion 33, and a fluid suction port 34; the fluid outlet 32 and the beta fluid suction port 34 is corresponding and spaced apart by a predetermined distance; and, when a predetermined fluid 30 is sprayed from the fluid discharge port 32 to the fluid suction port 34, a film 35 is formed in a flowing state and bypasses the gas working region 41; By this 'the laser in the gas In the laser beam path 13 of the 21 lines of the processing region 40 through gas arrival work area 41, and the flow state of the film can be taken away% based debris generated during the laser processing and can achieve the purpose of cooling.
更詳細的說，該預定流體30Α係可為水，由於水不會對 工件造成傷害，且兼具排屑與冷卻之功能，在流動方面，水的 流動會因該氣體工作區41而繞過該雷射光21，故，不會造成 雷射光21之干擾或功率降低等問題。 一當然，該氣中雷射通道13係為一圓形截面(如第三圖所 示）’使射出之雷射光21形成一圓點，可切割物件及於物件上 加工一預定孔等；如第五圖所示，該氣中雷射通道13亦可為 一長條狀截面，使射出之雷射光21形成一直線狀，可切割物 件及於物件上作一熱處理（如退火，^等；另外， 如第六圖所示，在一待測物件7〇上設置一預定圖形之光罩 ，利用直線狀之雷射光21通過該待測物件％(如第六圖 :，該雷射光21由一第一位置P1移動至一第二位置p2)，對 杜^該光罩7GA保護之部份進行加工之動作，可使該制物 件70上形成一預定圖形。 巧七圖所*，由於該預定流體3〇A之流動係繞過該氣 作區41，而該雷射光21係經由該氣體工作區41而抵達 區域4〇,因此，該預賴體遍係不會與雷射光21產 综上所述，本發明之優點及功效可歸納為： 可有效移除加工之碎屑。習知加工機二用於微加工 以挑Ϊ道之設計也相對縮小，進而造成水流量極小或黏滯而難 出，無法確實達到排屑之目的；而本發明係以該橫向流體 201018538In more detail, the predetermined fluid 30 can be water, since the water does not cause damage to the workpiece, and has the functions of chip removal and cooling, in terms of flow, the flow of water is bypassed by the gas working area 41. The laser light 21 does not cause problems such as interference of the laser light 21 or power reduction. Of course, the gas passage 13 in the gas is a circular section (as shown in the third figure) 'to form a dot of the projected laser light 21, to cut the object and to process a predetermined hole on the object; As shown in the fifth figure, the gas passage 13 in the gas may also be a long strip-shaped section, so that the emitted laser light 21 is formed in a straight line shape, and the workpiece can be cut and heat treated on the object (such as annealing, ^, etc.; As shown in FIG. 6 , a reticle with a predetermined pattern is disposed on an object to be tested 7 ,, and the object to be tested is passed through the linear laser beam 21 (as shown in FIG. 6 : the laser light 21 is The first position P1 is moved to a second position p2), and the processing of the portion of the mask 7GA is processed to form a predetermined pattern on the workpiece 70. The flow of the fluid 3〇A bypasses the gas-making zone 41, and the laser light 21 reaches the zone 4〇 via the gas working zone 41, so that the pre-reliant body does not pass through the laser light 21 The advantages and effects of the present invention can be summarized as follows: The processed debris can be effectively removed. 2. The design used for micro-machining is also relatively narrow, which results in a very small or viscous water flow, which is difficult to achieve the purpose of chip removal. The present invention uses the lateral fluid 201018538
產生裝置來達到流體之相對流動，可保持一定之流量，故 有效移除加工之碎屬。 JThe device is created to achieve the relative flow of the fluid, and a certain flow rate can be maintained, so that the processed genus is effectively removed. J
[2]可有效達到加工之冷卻。習知加工機二用於微加工 時，通道之β又计也相對縮小，進而造成水流量極小或難 出，無法確實達到冷卻之目的；而本發明係以 裝置來達職體之相對軸，可傭-定之流量，故， 達到加工之冷卻。 里既J有效 -ϋ止加件表面之刮傷。本發明於加工時可保持 ❹ 面不被碎屑刮傷之功能。 件表 以上僅是藉由較佳實施例詳細說 ， 所做=何解修改與魏，林脫離本發明之 由以上詳細說明，可使熟知本項技藝 達祕述目的，扣壯專槪之奴 201018538 【圖式簡單說明】 第一圖係習知加工機一之 加广機二之示意圖 一例之有魏導管之雷射加謂置之第一實施 第四圖^第三圖之具有魏導管之雷射加卫裝置之剖面示意 圖 第五圖，本=之具有錢導管之雷射加卫裝置之第二實施 例之不意圖[2] can effectively achieve the cooling of processing. When the conventional processing machine 2 is used for micro-machining, the β-meter of the channel is also relatively reduced, thereby causing the water flow to be extremely small or difficult to be obtained, and the cooling target cannot be surely achieved; and the present invention uses the device to reach the relative axis of the body. Can be commissioned - the flow rate, so, to achieve processing cooling. Both are effective - the scratch on the surface of the added piece. The invention can maintain the function of scratching the surface without being scraped during processing. The above table is only explained in detail by the preferred embodiment. What is the meaning of the modification and the modification of Wei, Lin, from the above detailed description of the invention, can make the knowledge of this skill reach the purpose of secret, and deny the slave 201018538 [Simple description of the diagram] The first picture is a schematic diagram of the conventional processing machine 1 of the widening machine II. The first example of the laser with the Wei catheter is the first implementation of the fourth figure ^ The third figure has the Wei catheter FIG. 5 is a schematic cross-sectional view of a laser-assisted device, and the second embodiment of the laser-assisted laser-assisted device is not intended
第六圖係本發明之具有喷氣導管之雷射加卫裝置之特殊加工 之示意圖 第七圖係本發明之具有喷氣導管之雷射加工裝置之流體流 的示意圖 【主要元件符號說明】 1〇喷氣導管 111預定氣體 13氣中雷射通道 21雷射光 3〇Α預定流體 32流體噴出口 34流體吸回口 40加工區域 7〇待測物件 8〇習知加工機一 81出水通道 83雷射氣體通道 85氣壓 P1第一位置 11供氣部 12空心導管 20雷射光產生部 30橫向流體產生裝置 31流體供應部 33流體吸回部 35薄膜 41氣體工作區 70A光罩 80A習知加工機二 82吸水通道 84雷射光 85A氣體工作區 P2第二位置Figure 6 is a schematic view showing the special processing of the laser-assisted laser-assisted laser-assisted device of the present invention. Figure 7 is a schematic view showing the fluid flow of the laser processing device with a jet-cavity according to the present invention. Conduit 111 predetermined gas 13 gas laser channel 21 laser light 3 〇Α predetermined fluid 32 fluid vent 34 fluid suction port 40 processing area 7 〇 object to be tested 8 〇 conventional processing machine 81 out water channel 83 laser gas channel 85 air pressure P1 first position 11 air supply portion 12 hollow duct 20 laser light generating portion 30 lateral fluid generating device 31 fluid supply portion 33 fluid sucking portion 35 film 41 gas working area 70A light mask 80A conventional processing machine two 82 water absorption channel 84 laser light 85A gas working area P2 second position