201017186 九、發明說明： - 【發明所屬之技術領域】 ， 本發明涉及一種電路板及電路板檢測裝置，特別是涉 及一種高密度積體電路板及高密度積體電路板測試裝置。 【先前技術】 在電子行業中，用來檢測電路板或積體電路的傳統裝 置是利用安裝在針盤的針孔内的探針來接觸待測電路板或 積體電路的檢測點，探針的尾部再接線引至牛角連接器， ❹再接至測試機進行測試。由於針孔、探針和導線等的尺寸 受工藝的限制無法做得很細小，上述傳統治具已無法滿足 高密度、細微線路這類高端產品的檢測需要。另外上述傳 統治具需人工製作，潛在的錯誤可能性很大，維修較為複 雜。 【發明内容】 有鑒於此，有必要提供一種易於檢測的高密度積體電 路板。 另外，還有必要提供一種檢測高密度積體電路板的裝 置。 一種電路板，電路板上包含有複數待測試點，至少一 個含有複數訊號接收端的第一連接器，以及連接所述複數 待測試點與第一連接器訊號接收端的線路，所述第一連接 器用於對複數待測試點進行測試。 一種測試所述電路板的電路板測試裝置，包括轉接電 路板及測試機，所述轉接電路板包括與所述電路板的第一 201017186 .連接器插接的含有複數訊號轉接端的第二連接器、複數轉 ^ 接測試點、複數連接轉接測試點與第二連接器的訊號轉接 .端的線路，所述測試機包括與轉接電路板的複數轉接測試 點分別接觸的複數探針。 上述電路板藉由線路將測試點與第一連接器相連，然 後經電路板檢測裝置的轉接電路板的第二連接器、轉接線 路將訊號傳至轉接測試點，由於轉接測試點間距較大，便 於測試，克服了傳統治具無法滿足高密度、細微線路這類 ®鬲端產品的檢測需要的缺陷。 【實施方式】 下面結合實施例和附圖，對本發明進行詳細說明。 如圖1所示，為一較佳實施方式的電路板的結構示意 囷。電路板100包括待測電路板101及第一連接器107。 第一連接器107與待測電路板101電連接，用於對複數待 測試點103進行測試，待測電路板101上分佈有複數待測 φ 5式點103及與複數待測試點103分別相連接的線路1〇5。 第一連接器107含有複數訊號接收端109,待測電路板101 藉由線路105將測試點103的訊號傳送至第一連接器1〇7 訊號接收端109。優選地，可將測試點103分為不同的組， 設置複數第一連接器107。 如圖2所示，為圖1所示的電路板的測試結構示意圖。 測試結構300包括電路板100及電路板測試裝置200。 電路板測試裝置200包括轉接電路板202及測試機 213。轉接電路板202包括第二電路板201，第二連接器 201017186 -207,複數轉接測試點203及複數連接轉接測試點203與對 - 應的第二連接器訊號轉接端的轉接線路205。為了易於測 , 試’複數測試點203可根據需求排布，如可將複數轉接測 試點203排布成間距較大的一字形。轉接電路板202的第 二連接器207含有複數與電路板1〇〇的第一連接器ι〇7的 訊號接收端109相匹配的訊號轉接端209，藉由與其對應 的轉接線路205將第二連接器207的訊號轉接端209處的 訊號傳送至轉接電路板202的轉接測試點203。測試機213 〇包括複數供測試用的探針211。探針211與轉接電路板202 的轉接測試點203接觸’使測試機213與轉接測試點203 導通。當電路板100包含複數第一連接器時，轉接電路板 202包括複數第二連接器207。 測試時，轉接電路板202的第二連接器207與電路板 100的第一連接器107插接，測試機213的探針211與轉 接電路板202的轉接測試點203接觸導通後，測試訊號經 轉接電路板202的轉接線路205傳至第二連接器207，第 ®二連接器207將測試訊號傳至電路板1〇〇的第一連接器 107,第一連接器107再將測試訊號經待測電路板1〇1的線 路105傳至待測試點103，對待測試點1〇3進行測試，測 試資訊又經待測電路板1〇1的線路105傳至第一連接器 107，第一連接器107將測試資訊傳至第二連接器207，第 二連接器207將測試資訊經轉接電路板202的轉接線路 205傳至轉接測試點203,轉接測試點203將測試資訊經探 針211傳至測試機213進行處理，完成對電路板1〇〇的測 201017186 .試。 -以上的實施方式僅是用來說明本發明，而並非用作對 ，本發明的限定，只要在本發明的實質精神範圍之内，對以 上實施例所作的適當改變和變化都落在本發明要求保護的 範圍之内。 【圖式簡單說明】 圖1為一較佳實施例方式的電路板的結構示意圖。 圖2為測試圖1所示的電路板的測試結構示意圖。 ❹【主要元件符號說明】 電路板 100 待測電路板 101 待測試點 103 線路 105 第一連接器 107 訊號接收端 109 電路板測試裝置 200 第二電路板 201 轉接電路板 202 轉接測試點 203 轉接線路 205 第二連接器 207201017186 IX. Description of the Invention: - Technical Field of the Invention The present invention relates to a circuit board and a circuit board detecting device, and more particularly to a high-density integrated circuit board and a high-density integrated circuit board testing device. [Prior Art] In the electronics industry, a conventional device for detecting a circuit board or an integrated circuit uses a probe mounted in a pinhole of a dial to contact a detection point of a circuit board or an integrated circuit to be tested, and a probe. The tail is rewired to the horn connector and then connected to the tester for testing. Since the size of pinholes, probes, and wires cannot be made very small by the limitations of the process, the above conventional jigs cannot meet the detection requirements of high-end products such as high-density and fine lines. In addition, the above-mentioned rule has to be artificially produced, and the potential for errors is very high, and the maintenance is complicated. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a high-density integrated circuit board that is easy to detect. In addition, it is also necessary to provide a device for detecting a high-density integrated circuit board. A circuit board comprising a plurality of points to be tested, at least one first connector including a plurality of signal receiving ends, and a line connecting the plurality of points to be tested and the first connector signal receiving end, wherein the first connector is used Test the multiple points to be tested. A circuit board testing device for testing the circuit board, comprising: a transit circuit board and a testing machine, wherein the switching circuit board includes a first signal plugging end connected to the first 201017186 connector of the circuit board a second connector, a plurality of connection test points, a plurality of connection transfer test points, and a signal connection end of the second connector, the test machine includes a plurality of contacts respectively connected to the plurality of transfer test points of the transit circuit board Probe. The circuit board connects the test point to the first connector through the line, and then transmits the signal to the transfer test point via the second connector and the transfer line of the transfer circuit board of the circuit board detecting device, because the transfer test point The large spacing makes it easy to test, overcoming the shortcomings that traditional fixtures cannot meet the detection needs of high-density, fine-line products such as tantalum products. [Embodiment] Hereinafter, the present invention will be described in detail in conjunction with the embodiments and the accompanying drawings. As shown in Fig. 1, the structure of a circuit board of a preferred embodiment is shown. The circuit board 100 includes a circuit board 101 to be tested and a first connector 107. The first connector 107 is electrically connected to the circuit board 101 to be tested, and is used for testing the plurality of points to be tested 103. The circuit board 101 to be tested is distributed with a plurality of φ 5 points 103 to be tested and respectively associated with the plurality of points to be tested 103. The connected line is 1〇5. The first connector 107 includes a complex signal receiving end 109. The circuit board 101 to be tested transmits the signal of the test point 103 to the first connector 1〇7 signal receiving end 109 via the line 105. Preferably, the test points 103 can be divided into different groups, and a plurality of first connectors 107 are provided. As shown in FIG. 2, it is a schematic diagram of the test structure of the circuit board shown in FIG. The test structure 300 includes a circuit board 100 and a circuit board test device 200. The board test apparatus 200 includes a patch board 202 and a tester 213. The transit circuit board 202 includes a second circuit board 201, a second connector 201017186-207, a plurality of transfer test points 203, and a plurality of connection transfer test points 203 and a corresponding second adapter signal transfer end of the transfer line 205. For ease of testing, the test 'multiple test points 203 can be arranged according to requirements. For example, the plurality of transfer test pilots 203 can be arranged in a larger zigzag shape. The second connector 207 of the transit circuit board 202 includes a plurality of signal switching terminals 209 that match the signal receiving end 109 of the first connector ι 7 of the circuit board 1 by the corresponding switching line 205. The signal at the signal transition end 209 of the second connector 207 is transmitted to the transfer test point 203 of the transit circuit board 202. The tester 213 includes a plurality of probes 211 for testing. The probe 211 is in contact with the transfer test point 203 of the transfer circuit board 202 to turn on the test machine 213 and the transfer test point 203. When the circuit board 100 includes a plurality of first connectors, the transit circuit board 202 includes a plurality of second connectors 207. During testing, the second connector 207 of the transit circuit board 202 is plugged into the first connector 107 of the circuit board 100, and the probe 211 of the tester 213 is in contact with the transfer test point 203 of the transit circuit board 202. The test signal is transmitted to the second connector 207 via the transfer line 205 of the transit circuit board 202, and the second connector 207 transmits the test signal to the first connector 107 of the circuit board 1 , the first connector 107 Passing the test signal through the line 105 of the circuit board 1〇1 to be tested to the point 103 to be tested, and testing the test point 1〇3, and the test information is transmitted to the first connector via the line 105 of the circuit board 1〇1 to be tested. 107, the first connector 107 transmits the test information to the second connector 207, and the second connector 207 transmits the test information to the transfer test point 203 via the transfer line 205 of the transfer circuit board 202, and transfers the test point 203. The test information is transmitted to the testing machine 213 via the probe 211 for processing, and the test of the circuit board 1 is completed. The above embodiments are merely illustrative of the present invention, and are not intended to be construed as limiting the scope of the present invention. The modifications and variations of the above embodiments are intended to fall within the scope of the present invention. Within the scope of protection. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of a circuit board according to a preferred embodiment. FIG. 2 is a schematic view showing the test structure of the circuit board shown in FIG. 1. ❹[Main component symbol description] Circuit board 100 Circuit board to be tested 101 Point to be tested 103 Line 105 First connector 107 Signal receiving end 109 Circuit board testing device 200 Second circuit board 201 Adapter circuit board 202 Transfer test point 203 Transfer line 205 second connector 207