201015279 九、發明說明： 【發明所屬之技術領域】 备择^明係有關於—種電子裝置’特別是有關於—種可傾斜一 角又擺放於平面上之電子裝置結構。 【先前技術】 思著目刖電子科技的快速發展’以及消費者對於消費性電子 Ο 響 ^白_便攜益趨重視，造就了現今電子產品，如筆記型電腦、 二腦、超，销㈨一_p*r ’ UMPQ等 、電子裝1 ’皆已逐軸向微小化發展，對於需要經常在外 的用者來说，可攜式電子產品變的更易攜帶，大幅提用上 的方便性。 為了滿足料麵”料處理速度之要求，t腦裝置内部電 =的運算輕必触逮，再加上電子元件_積微小，致使 嚴曹隨之增加，如杲鮮不騎翻的話，過高的溫度將 =衫響電腦運作上_定性及效率，亦造成電子元件的壽命縮 以目剛平板電腦或是超便攜電腦等小型可攜式電子裳置為 长’為了符合消費者選購這類小型電腦裝置必須輕薄且便攜的需 有九’㈣由空間有限之便攜式電腦裝置内，要額外裝設散敎風扇 乏性’ _導致無風扇設計之㈣式電腦裝置内部缺 運算 其散熱效率並不理想，無法滿足目前高 之便W子裝置的散熱需求。 201015279 m 鲁 為了解決便攜式電腦裝置内部的散熱問題，習用的作法係於 便攜式電職置底面開設彡錄祕，並增加電麟置之殼體夺 面^以7電子7L件所產生之熱能藉由大面積的散熱表面，而^ 電域置内部排除。因此，必須於筆記型電腦底部設置多個腳塾， 以將電腦裝置奴-高度並構成散熱_，但是目前筆記型電腦 的運作效能相當快速，其所產生的熱能亦相對增加許多，僅仰賴 腳墊所構成之_進行散熱，已从以供賴氣流於電腦裝置底 :循環流動，導致裝肋部之減無法於__逸散，並無法 /足目前高運算速度之筆記型電腦的散熱需求。 +最理想的憾方式储賴式f腦裝置#起—定的高度，以 1執便攜式1:¾裝置底部之氣流擾動。—般制便献電腦裝置 土錢構，胁賴式電職置上加設— =構設計係於便攜式電繼之背蓋板上設置一凸部冓藉: 二^板而令凸部旋轉至便攜式電腦裝置之底部，並且抵靠於 :内裝高度;或者是’於便攜式電腦 D土人' |及m裳置，藉由支樓件與調整裝置之 二伽;置往前傾斜並標起-定高度;於便攜 釋放\力別裝设—腳架’當勾扣住腳架的扣合機構被 可蝴讀献電職置轉，妙―端抵靠於桌 而撐起便攜式電腦裝置。 上述習用技術雖可將便攜式電 一 蜀之構件，並無直_連_係。當使用者欲墊高便 201015279 ^式電知裝1’必須另行調整高度調整機構，方可將便擔式電腦 裝置墊高至使用者所習慣的高度位置，於實際使用上並不方便。 ’’’τ'上所述，製造廠商必須額外加設高度調整機構於便攜式電 • 腦f置上’且1^度調整機構之組成構件祕，於组配過程須花費 、夕守門L行組裝，如此都將導致製造成本的增加，並不符合製 k產業目箾講求降低成本的要求。 【發明内容】 ❹ 魏以上的問題，本發明提供一種，藉以改良習用高度調整 機構與便攜式電腦並無直接的連動關係，使用者必須另行調整高 冓，操作步驟繁複，以及製造庭商必麵外製造並組配 南度調整機構，導致製造成本增加等問題。 —本發明之電子裝置係歡於_平面上，並藉由具有複數個電 子7L件之電路板以執行預設功能，電子裝置包括有一殼體、至少 且活動件及至少一形狀記憶合金元件。殼體面向平面之一側面 ❹/、有至y開口，活動件樞設於殼體並可相對於殼體樞轉，且活 ^件連接端及-支撐端。雜記憶合金元件分別連接於殼 =伯動件之連接端，形狀記憶合金元件接受電子元件所產生之 二此而H形狀記憶合金元件連絲動件樞轉，以令活動件之 =禮端抵綠平面上，使得殼體傾斜—肖度設置於平面上，且殼 體與平面之間形成輔助散熱的氣流空間。 / 士本發明之功效在於，當形狀記憶合金^件接收熱能而收縮變 升^^與形狀記憶合金元件相連接之活動件對應枢轉，並以支樓 端抵靠於料’贿殼翻斜設置解社，殼體解面之間產 7 201015279 ^距離’以形成輔助散熱之氣流空間。電子裝置無須另行裝設 機構’以大巾冑簡化高度調整步驟，同時降低製造成本。 =上之關於本發明内容之制及以下之實施方式之說明係用 本發並且提供本發明之專利申請範圍更 進一步之解釋。 【實施方式】 根據本發_揭露之電子裝置，包括但不侷限於筆記型電 ❹ 、’板笔月每起便攜電腦(ultra mobile personal computer， 、）個人數位助理(Personal Digital Assistant，PDA)等於運作 狀悲下會產生熱能的便攜式電職置，但並不以此為限。於以下 本表月的洋細說明中，將以超便攜電腦做為本發明之最佳實施 例。然而所附圖式僅提供參考與說明用，並非用以限制本發明。 青，閱第1圖」至「第3圖」，本發明第一實施例之電子裝 呈100具有—電路板2〇〇及電性設置於電路板上之複數個電 ❹子兀件210，以執行預設之功能，然電子裝置100藉由電路板200 ’、電子元件210執行預設功能，並非本案之技術重點，故發明 人不在此贅述。 —本七明之電子裝置i⑻係擺放於一平面3〇〇上，例如為桌面， =子裝置1G0包括有—殼體⑽、—活動件12Q、及—形狀記憶合 、--件ij〇 Λ又肢no之底面（即鄰近平面3⑽之側面）開設有一 開口 m ’並且底面突設有一固定柱112。開σ⑴之二相對側邊 分別具有—框孔113，活動件12G係為—長㈣板體，具有-i 接端121及一支撐端122，且活動件12〇於連接端⑵與支擇端 201015279 122之間具有朝向相反方向延伸之二樞軸123,二樞軸123分別插 設於樞孔113内，以使活動件120位於開口 1U之間，活動件12〇 枢設於殼體110上並可相對於殼體110之底面旋轉。 請繼續參閱「第1圖」至「第3圖」，形狀記憶合金元件13〇 係為形狀記憶合金（Shape Memory Alloy，SMA)所製成，例如為 ' 鎳-鈦（Ti-Ni)形狀記憶合金、銅-鋅-链（Cu-Zn-Al)形狀記憶人金、 或銅-鎳-鋁（Cu-Ni-Al)形狀記憶合金，其可根據溫度變化而產生 ❹形變效果。在常溫狀態下，形狀記憶合金元件13〇具有一伸展變 形狀態；在受熱狀態下，形狀記憶合金元件13〇具有一收縮復^ 狀態。 ' 开>狀纪憶合金元件130設置於殼體11〇與電路板之間， 形狀記憶合金元件130為一矩形體結構，且其二相對端分別^有 一線體131，用以分別連接殼體Π0之固定柱112與活動件 之連接端12：! ’使得形狀記憶合金元件13〇之一端係固定於固定 柱112上’形狀§己憶合金元件130之另一端可帶動活動件咖彦 馨生連動。其中，本發明第一實施例所揭露之線體131㈣質可^ 金屬材料或是形狀記憶合金，線體131之作用在於連接形狀扯 合金元件m '殼體110、及活動件120，其材質的選用並不二二 為限。 如「第2圖」及「第3圖」所示，當電子裝置⑽未運 是剛開始運作時，形狀記憶合献件13Q之溫度尚未到達轉換、: 度(transitiontemperature)，因此係呈現伸展狀態，並且形狀^情: 金元件13G連動活動件12G產生樞轉並覆蓋於殼體^開二 201015279 係水平擺放於平面删上。並且，活動件 ’以避免髒污灰塵經由開π⑴而進入殼201015279 IX. INSTRUCTIONS: [Technical field to which the invention pertains] Alternatives are related to an electronic device, particularly an electronic device structure that can be tilted and placed on a flat surface. [Prior technology] Thinking about the rapid development of electronic technology and consumers' attention to consumer electronics ^ 白 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _p*r 'UMPQ, etc., and electronic equipment 1' have been developed in an axially miniaturized manner. For users who need to be constantly outside, portable electronic products are more portable and more convenient to use. In order to meet the requirements of the processing speed of the material surface, the internal operation of the t-brain device is light and the operation is light, and the electronic components are too small, which leads to the increase of Yan Cao. If the sputum is not riding, it is too high. The temperature will be =1 qualitative and efficient, and the life of electronic components will be reduced to small portable electronic devices such as tablet PCs or ultra-portable computers. Small computer devices must be thin and portable. There must be nine '(4) in a portable computer device with limited space. It is necessary to install an extra fan for the lack of fan _ _ resulting in a fanless design (4) computer device internal operation is not efficient Ideally, it can't meet the heat dissipation requirements of the current high-powered W device. 201015279 m Lu in order to solve the problem of heat dissipation inside the portable computer device, the conventional method is to open the video on the bottom of the portable electric device, and increase the shell of the electric device. The body's heat is generated by a large area of heat-dissipating surface, and the internal area is excluded. Therefore, multiple feet must be placed at the bottom of the notebook. Hey, to make the computer device slave-height and constitute heat dissipation_, but the current notebook computer's operation efficiency is quite fast, and the heat energy generated by it is relatively increased. It relies on the pedestal of the foot pad to dissipate heat. Lai airflow at the bottom of the computer device: circulating flow, resulting in the reduction of the ribs can not be __ escaping, and can not / the current high computing speed of the notebook computer's cooling needs. + The most ideal way to save the reliance f brain The height of the device is set to 1 and the flow of the air at the bottom of the portable 1:3⁄4 device is disturbed by 1. The system is made up of the structure of the computer, and the construction of the system is based on the portable device. A convex portion is disposed on the back cover plate to: rotate the convex portion to the bottom of the portable computer device and abut against: the built-in height; or 'on the portable computer D. Set, by the two parts of the branch and the adjustment device; tilt forward and mark - set the height; in the portable release \ force to install - the tripod 'when the hook mechanism of the hook is buckled Reading the electricity position, the wonderful - end against the table and propped up the laptop Although the above-mentioned conventional technology can be used as a component of a portable electric device, there is no direct connection. When the user wants to be high, the 201015279 ^type electric device 1' must be adjusted separately to adjust the height adjustment mechanism. The height of the computer device is as high as the user is accustomed to, which is not convenient for practical use. As mentioned in '''τ', the manufacturer must additionally add a height adjustment mechanism to the portable battery.' The component of the adjustment mechanism is the secret of the assembly process, and the assembly process must be spent, and the assembly of the Guardian Gate L line, which will lead to an increase in manufacturing costs, which does not meet the requirements of the k industry to reduce costs. [Summary of the Invention] In the above problem, the present invention provides a method for improving the conventional height adjustment mechanism and the portable computer without a direct linkage relationship, and the user must separately adjust the sorghum, the operation steps are complicated, and the manufacturing manufacturer must manufacture and assemble the south. Degree adjustment mechanism, resulting in increased manufacturing costs and other issues. - The electronic device of the present invention is on the _ plane and performs a predetermined function by a circuit board having a plurality of electronic 7L members, the electronic device comprising a housing, at least a movable member and at least one shape memory alloy member. The housing faces one side of the plane ❹ /, has a y opening, the movable member is pivoted to the housing and is pivotable relative to the housing, and the movable member connection end and the - support end. The memory alloy components are respectively connected to the connection end of the shell=the primary moving member, and the shape memory alloy component receives the electronic component, and the H-shaped memory alloy component is connected with the wire moving member to pivot the movable member. On the green plane, the housing is tilted—the degree is set on the plane, and an airflow space for assisting heat dissipation is formed between the housing and the plane. / The effect of the invention is that when the shape memory alloy member receives the heat energy and shrinks and rises, the movable member connected with the shape memory alloy member pivots correspondingly, and the branch end is abutted against the material Set the solution, the shell solution between the 7 201015279 ^ distance 'to form an auxiliary cooling airflow space. The electronic device does not need to be equipped with a separate mechanism to simplify the height adjustment step while reducing the manufacturing cost. The above description of the present invention and the following description of the embodiments of the present invention are provided by the present invention and further explanation of the scope of the patent application of the present invention. [Embodiment] The electronic device according to the present invention includes, but is not limited to, a notebook type electronic device, and an ultra mobile personal computer (PDA) is equal to a personal digital assistant (PDA). Portable electrical positions that operate with sorrow and heat, but not limited to this. In the following detailed description of this month, an ultra-portable computer will be the preferred embodiment of the present invention. The drawings are to be considered as illustrative and not restrictive. The electronic device 100 of the first embodiment of the present invention has a circuit board 2 and a plurality of electrical sub-assemblers 210 electrically disposed on the circuit board. In order to perform the preset function, the electronic device 100 performs the preset function by the circuit board 200' and the electronic component 210, which is not the technical focus of the present invention, so the inventors will not repeat them here. - The electronic device i(8) of the present invention is placed on a flat surface, for example, a table top, and the sub-device 1G0 includes a casing (10), a movable member 12Q, and a shape memory assembly, and a member ij〇Λ. The bottom surface of the limb no. (i.e., the side adjacent to the plane 3 (10)) has an opening m' and a fixing post 112 is protruded from the bottom surface. The opposite side of the opening σ(1) has a frame hole 113, and the movable member 12G is a long (four) plate body having a -i terminal 121 and a supporting end 122, and the movable member 12 is connected to the connecting end (2) and the supporting end. There are two pivots 123 extending in opposite directions between the two layers, and the two pivots 123 are respectively inserted into the pivot holes 113, so that the movable member 120 is located between the openings 1U, and the movable member 12 is pivotally disposed on the housing 110. It is rotatable relative to the bottom surface of the housing 110. Please continue to refer to "1" to "3". The shape memory alloy element 13 is made of Shape Memory Alloy (SMA), for example, 'Ni-Ti (Ti-Ni) shape memory. Alloy, copper-zinc-chain (Cu-Zn-Al) shape memory human gold, or copper-nickel-aluminum (Cu-Ni-Al) shape memory alloy, which can produce ❹ deformation effect according to temperature changes. In the normal temperature state, the shape memory alloy member 13 has an expanded deformation state; in the heated state, the shape memory alloy member 13 has a contracted state. The 'opening> alloy component 130 is disposed between the casing 11 and the circuit board, the shape memory alloy component 130 is a rectangular body structure, and the opposite ends thereof respectively have a wire body 131 for respectively connecting the shell The connecting end of the fixed column 112 of the body 与0 and the movable part 12:! 'allows one end of the shape memory alloy element 13〇 to be fixed on the fixing post 112. The shape of the other end of the alloy element 130 can drive the movable piece. Students are linked. The wire body 131 (four) of the first embodiment of the present invention can be made of a metal material or a shape memory alloy, and the wire body 131 functions to connect the shape of the alloy component m 'the casing 110 and the movable member 120. The choice is not limited to two. As shown in "Figure 2" and "Figure 3", when the electronic device (10) is not operating, the temperature of the shape memory contribution 13Q has not yet reached the transition, the transition temperature, and therefore the stretch state. And the shape is: The gold element 13G interlocks the movable member 12G to pivot and covers the casing 2, 201015279, horizontally placed on the plane. And, the moving piece 'to prevent dirty dust from entering the shell via π(1)
如弟4圖」及「第5圖」所示，當電子裳置運作—段 W後’電路板之電子元件21〇產生相當高的熱能: 於殼體則與嫌之嶋狀記憶合金如3〇處於受埶 ^。當形狀記憶合金元件⑽之受熱溫度到達轉換温度後^ ，臬-鈦形壯“己憶合金為例，其轉換溫度為攝氏4〇度（贼 記憶合金元件13G開始產生職而_至輯復雜態，形壯士己 憶合金元件13Q H由缝131鱗絲驗12Q，活動件⑽^ 支樓端122朝順時針方向進行樞轉並且抵靠於平自上，以人 殼體U喻抬起，高度，_⑽以一傾斜繼放於; 面30^上，並且殼體11〇與平面之間構成—氣流空間·， 以快速散除電子裝置10Q内部之熱能。As shown in Figure 4 and Figure 5, when the electronic device is in operation - after the segment W, the electronic component 21 of the circuit board generates a relatively high thermal energy: in the case of the housing, it is similar to the memory alloy such as 3 〇 is under 埶 ^. When the heat-receiving temperature of the shape memory alloy component (10) reaches the switching temperature, the 臬-titanium-shaped alloy is taken as an example, and its switching temperature is 4 degrees Celsius (the thief memory alloy component 13G starts to work and _ to the complicated state) The shape of the strong man has recalled the alloy component 13Q H by the slit 131 scale wire inspection 12Q, the movable member (10) ^ the branch end 122 pivoted clockwise and abuts against the flat from the top, lifted by the human shell U, height _(10) is placed on the face 30^ with a tilt, and the airflow space is formed between the casing 11 and the plane to quickly dissipate the heat energy inside the electronic device 10Q.
πΐ，使得電子裝置100 120可完全遮蔽開口 m 體110内部。 /值得注意的是，活動件12〇之支稽端m係為弧面結構，且 形狀記憶合金元件的尺寸、擺放錄、線體m長度等參數， 皆係針對殼體11G之傾斜紐與電子元件所產生之熱能的對 應關係細設計。當雜記憶合金树13()依據電子裝置⑽於 執行預設功能（例如為執行文書處理工作，或是執行3D緣圖及 衫像處理等功能)所產生之功率大小㈣應產生形變，以連動活動 件120改變極轉角度，並且配合支撐端122以不同位置之外緣抵 罪於平面300，以對應調整殼體11〇之傾斜設置角度，使得殼體 11〇與平面300之間形成不同高度的氣流空間4〇〇，達到最佳的散 201015279 熱效能。 明I閱第6圖」至「第8圖」之第二實施例示意圖，於此 貝把例中纟結構與麵第—實施例大助同，以下僅對兩實施 例相異處纽X朗。本發㈣二實_之雜記憶合金元件⑽ 係為彈簧線圈型態，其二端分別連接於殼體ιι〇之固定柱出與 活動件12G之連接端121，當形狀記憶合金元件13G之受熱溫度 到達轉換服度後，形狀記憶合金元件13()開始產生形變收縮並連 ❺ ❹ 動活動件120 4區鲭，，、;人、工各μ 轉以令活動件⑽之讀端122抵靠於平面 =Γ。殼體11G傾斜擺放於平面上並構成輔助散熱之氣流 ⑦9 81、」所7F，本發明第三實闕之輯與前述第一實 v目同為了讓電子裝置丨⑻於歸—角 放於平面，遂於軏駚11Λ 会 又Τ」低固地擺 双體110二側邊位置分別裝設活動件12〇及㈣ 記憶合金元件13〇。去ρ人 殼體no二側邊之§己憶5金凡件130受熱_時，位於 、之支撐铋122可平均將殼體11〇撐起—古 不致令殼體110旬，杠立义冋度’而 平面上之電子裝==方便制者咖斜擺放於 形藉由形狀記憶合金元件受熱而產生收縮 樓起—高_㈣於㈣，轉殼體得以 起问度亚Μ-傾斜角度設置於平面上，_ _散熱的氣流空間，以有效逸散電子裝置内部βΓΙΓ 之電子裝置盔須a 乙積熱。本發明 讀設高度調整频，以大幅簡化_^& %間及步驟，同時降低製造成本。 回度之 201015279 明明之實施例揭露如上所述，然並非用β限定本發 =::Γ_藝者，在不脫離本發明之精神和範圍内，塞 之變更圍所述之形狀、構造、特徵及精神當可做些許 -利翻之專利傾範目須視本綱書顺之申請專 利範圍所界定者為準。 月f ' 【圖式簡單說明】 第/圖為本發明第―實施例之分解示意圖； =圖為本發明第_實施例之電子裝置平放於平面上之立體示意 第3圖為第2圖之側視圖； ^圖^發^—實施例之電子裝置與平面之間具有-距離之 立體不意圖； 弟5圖為第4圖之側視圖； 第6圖為本發明第二實施例之立體示意圖； Θ ^圖為本發明第二實施例之電子裝置平放於平面上之側視圖； 弟圖為本發㈣二實關之電子裝置與平面之間具有—距離之 側視圖；以及 第9圖為本發明第三實施例之立體示意圖。 【主要元件符號說明】 100 電子裝置 110 殼體 111 開口 112 固定柱 12 201015279 113 樞孔 120 活動件 121 連接端 122 支撐端 123 樞車由 130 形狀記憶合金元件 131 線體 200 電路板 210 電子元件 300 平面 400 氣流空間ΐ, so that the electronic device 100 120 can completely shield the inside of the opening m body 110. / It is worth noting that the member of the movable member 12 is a curved surface structure, and the dimensions of the shape memory alloy component, the position of the recording, the length of the wire m, and the like are all inclined to the housing 11G. The correspondence between the thermal energy generated by the electronic components is finely designed. When the memory alloy tree 13() is executed according to the electronic device (10), the power generated by the preset function (for example, performing the document processing work or performing the functions of the 3D edge image and the shirt image processing) (4) should be deformed to be linked. The movable member 120 changes the pole rotation angle, and cooperates with the support end 122 to offset the plane 300 with different outer edges to adjust the inclination angle of the housing 11〇 so that the housing 11〇 and the plane 300 form different heights. The airflow space is 4〇〇, achieving the best thermal performance of 201015279. A schematic diagram of a second embodiment of the first embodiment of the present invention is shown in Fig. 6 to Fig. 8. In this example, the structure of the crucible is the same as that of the first embodiment. The following is only the difference between the two embodiments. The hybrid memory alloy component (10) of the present invention is a spring coil type, and the two ends thereof are respectively connected to the fixed end of the housing ιι and the connecting end 121 of the movable member 12G, when the shape memory alloy component 13G is heated. After the temperature reaches the conversion service degree, the shape memory alloy member 13() starts to undergo deformation and contraction, and the movable member 120 is slid, and the person and the worker turn so that the reading end 122 of the movable member (10) abuts. In the plane = Γ. The casing 11G is placed obliquely on the plane and constitutes an auxiliary heat-dissipating airflow 79 81, 7F, and the third embodiment of the present invention is the same as the first embodiment, so that the electronic device (8) is placed at the return angle. The plane, 遂 軏駚 Λ Λ Λ Λ Τ Τ 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低When the two sides of the ρ person's shell are no longer remembered, the gold wares 130 are heated _, and the support 铋 122 located on the side can support the shell 11 平均 on average - the ancient shell does not cause the shell 110, the bar Degree' and the electronic device on the plane == Convenient makers are placed in the shape of the shape by the shape memory alloy element to generate heat to shrink the building - high _ (four) to (four), the rotating shell can be asked the degree of awkward - tilt angle Set on the plane, _ _ heat dissipation airflow space to effectively dissipate the internals of the electronic device. The present invention reads the height adjustment frequency to greatly simplify the _^&% and steps while reducing manufacturing costs. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; Features and spirits can be done a little - the patents that are subject to change are subject to the definition of the patent application scope of this book. Month f ' [Simple description of the drawings] Fig. / is a schematic exploded view of the first embodiment of the present invention; = Fig. 2 is a perspective view of the electronic device of the first embodiment of the present invention laid flat on a plane A side view of the second embodiment of the present invention; FIG. 6 is a perspective view of the second embodiment of the present invention; Figure 2 is a side view of the electronic device of the second embodiment of the present invention lying flat on a plane; the figure is a side view of the distance between the electronic device and the plane of the present invention (4) and the plane; The figure is a perspective view of a third embodiment of the invention. [Main component symbol description] 100 Electronic device 110 Housing 111 Opening 112 Fixing post 12 201015279 113 Pivot hole 120 Moving member 121 Connecting end 122 Supporting end 123 Pivoting by 130 Shape memory alloy component 131 Wire body 200 Circuit board 210 Electronic component 300 Plane 400 airflow space